US20120031587A1

US20120031587A1 - Capillary structure of heat plate

Info

Publication number: US20120031587A1
Application number: US12/805,539
Authority: US
Inventors: Yu-Po HUANG; Tung-Jung Kuo
Original assignee: Kunshan Jue Choung Electronics Co Ltd
Current assignee: Kunshan Jue-Choung Electronics Co Ltd; Kunshan Jue Choung Electronics Co Ltd
Priority date: 2010-08-05
Filing date: 2010-08-05
Publication date: 2012-02-09

Abstract

A heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a capillary structure of at least one first capillary layer and at least one second capillary layer arranged in the accommodation chamber in such a way that the first and second capillary layers are stacked over each other. With the arrangement of the first and second capillary layers, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is enhanced, so that the efficiency of temperature reduction is improved.

Description

FIELD OF THE INVENTION

The present invention relates to a structure of heat plate, and in particular to a capillary structure of a heat plate applicable to an electronic device.

BACKGROUND OF THE INVENTION

An electronic device often generates a great amount of heat during a long term operation. A common solution for handling such a great amount of heat is installation of a heat plate that dissipates the heat. A heat plate is advantageous in respect of high heat conductivity, light weight, and simple construction and can carry out transfer of a large amount of heat without consuming electrical power.
A conventional heat plate structurally comprises a board, which has a hollow interior forming a chamber that receives and retains therein a capillary tissue and is filled with a working fluid. Connected to one side of the board is a sealing tube (or referred to an opening sealing tube, a degassing tube, or a filling and degassing tube), which has an end mounted to the board and communicating the hollow interior chamber, so that the working fluid can be filled from the outside into the interior (namely the chamber) of the board through the sealing tube and degassing and air evacuation operations can also be performed through the sealing tube in order to realize the destination function of removal of heat from an electronic device.
Thus, the present invention aims to provide a capillary structure of a heat plate that helps increasing the efficiency of reduction of temperature in order to extend the lifespan of an electronic device.

SUMMARY OF THE INVENTION

A primary objective of the present invention is to provide a capillary structure of a heat plate that improves temperature reduction efficiency of the heat plate.
To realize the above objectives, the present invention provides a heat plate comprising two boards, which mate and are coupled to each other to define therebetween an accommodation chamber, at least one first capillary layer received in the accommodation chamber, and at least one second capillary layer received in the accommodation chamber in such a way that the first and second capillary layers are stacked over each other. With the arrangement of the first and second capillary layers, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is enhanced, so that the efficiency of temperature reduction is improved to thereby offer practicability, novelty, improvement, and convenience.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments thereof with reference to the drawings, in which:

FIG. 1A is an exploded view of a heat plate according to a first embodiment of the present invention;

FIG. 1B is a perspective view illustrating two boards of the heat plate of the first embodiment coupled together according to the present invention;

FIG. 1C a perspective view of the heat plate according to the first embodiment of the present invention in an assembled form;

FIG. 1D is a cross-sectional view taken along line A-A′ of FIG. 1C;

FIG. 2A is an exploded view of a heat plate according to a second embodiment of the present invention;

FIG. 2B is a perspective view of a capillary structure comprising first and second capillary layers stacked over each other contained in the heat plate of the second embodiment of the present invention;

FIG. 2C is a perspective view of the heat plate of the second embodiment in an assembled form;

FIG. 2D is a cross-sectional view taken along line B-B′ of FIG. 2C;

FIG. 3 is an exploded view of a heat plate according to a third embodiment of the present invention; and

FIG. 4 is an exploded view of a heat plate according to a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

With reference to the drawings and in particular to FIGS. 1A-1D, which respectively show an exploded view of a heat plate according to a first embodiment of the present invention, a perspective view illustrating two boards of the heat plate coupled together, a perspective of the heat plate, and a cross-sectional view of the heat plate, the heat plate constructed in accordance with the present invention comprises two boards 100, a sealing tube 110, at least one first capillary layer 210, and at least one second capillary layer 220 and realizes functions of lowering temperature of a heat source, performing effective transfer of heat, and improving temperature reduction efficiency.
The two boards 100 are mated and coupled to each other so that the two boards 100 defined an accommodation chamber 101 therebetween. In a practical arrangement, one of the two boards 100 is structured to form a recess 102, or alternatively, both boards 100 are structured to form corresponding recesses 102, so that when the two boards 100 are coupled to each other, an accommodation chamber 101 that is in a vacuum condition and receives a working fluid therein is formed. The two boards 100 can be coupled in various ways, such as being jointed with copper paste or silver paste through blazing, diffusion bounding, or welding.
The sealing tube 110, which is a hollow tubular body, is mounted to any side or any corner of the two coupled boards 100. The sealing tube 110 has an end communicating the accommodation chamber 101 to allow the working fluid to be filled from the outside through the sealing tube 110 into the accommodation chamber 101, whereby through changes between two phases, the working fluid is circulated through the first capillary layer 210 and the second capillary layer 220, which collectively form a capillary structure, arranged between the two boards 100, and consequently, the functions of lowering temperature of heat source and performing effective transfer and dissipation of heat can be realized.
The first and second capillary layers 210, 220 are arranged in the accommodation chamber 101 in such a way that the first and second capillary layers 210, 220 are stacked over each other. The stacked first and second capillary layers 210, 220 have an overall thickness that is substantially identical to a depth of the accommodation chamber 101. The first and second capillary layers 210, 220 can be metal nets (or alternatively, the second capillary layer 220 is formed of sintered powders (such as metal powders)). The first capillary layer 210 has a thickness that is greater than a thickness of the second capillary layer 220 and the first capillary layer 210 has a mesh that is smaller than a mesh of the second capillary layers 220. (Namely, the first capillary layer 210 is a “coarse metal net”, while the second capillary layer 220 is a “fine metal net”.)
In the instant embodiment, two boards 100, a first capillary layer 210, and a second capillary layer 220 are included, wherein one of the two boards 100 forms a recess 102 so that the two boards 100, when mating and coupled to each other, form an accommodation chamber 101 therebetween, and a sealing tube 110 is mounted to a corner of the two coupled boards 100 and has an end communicating the accommodation chamber 101. The first and second capillary layers 210, 220 are received in the accommodation chamber 101 and the second capillary layer 220 is stacked under the first capillary layer 210. The shape of the first and second capillary layers 210, 220 is complementary to a shape of the recess 102 of the board(s) 100. The overall thickness of the stacked first and second capillary layers 210, 220 is substantially identical to a depth of the accommodation chamber 101 so that the capillary layers can be snugly, or even tightly, received in the accommodation chamber 101 to improve structural stability for positioning and supporting the capillary layers. Through the sealing tube 110, a working fluid (such as water) is filled into the chamber between the two boards 100, whereby through changes between two phases of the working fluid and circulation of the working fluid conducted by the capillary structure arranged between the two boards 100, the functions of lowering temperature of heat source and performing effective transfer of heat can be realized. Meanwhile, when the working fluid undergoes changes between two phases (such as liquid water and water vapor), the vapor phase of the working fluid (such as water vapor) is allowed to uniformly diffuse to the upper board 100 through the first capillary layer 210, thereby improving vapor diffusion efficiency, and, on the other hand, the liquid phase of the working fluid (such as water) is caused by the second capillary layer 220 to uniformly distribute over the lower board 100 to improve uniformity of distribution of the working fluid, thereby improving temperature reduction efficiency.
Referring to FIGS. 2A-2D, which respectively show an exploded view of a heat plate according to a second embodiment of the present invention, a perspective view of a capillary structure adopted in the heat plate of the second embodiment, a perspective view of the heat plate of the second embodiment in an assembled form, and a cross-sectional view of the heat plate of the second embodiment, the second embodiment is substantially similar to the first embodiment with a major difference residing in that the second capillary layer 220 has a shape corresponding to the recesses 102 of the board 100, but the first capillary layer 210 has a shape that is arbitrary (such as a T-shape) and an overall thickness of the first and second capillary layers 210, 220 stacked together is substantially identical to a depth of the accommodation chamber 101. The first capillary layer 210 has a periphery that forms one or more cutoffs 211, whereby when the second capillary layer 220 is stacked under the first capillary layer 210, the cutoff 210 allows the vapor phase of the working fluid (such as water vapor) to quickly pass therethrough to thereby enhance the efficiency of temperature reduction.
Referring to FIG. 3, which shows an exploded view of a heat plate according to a third embodiment of the present invention, the third embodiment is substantially similar to the first embodiment with a major difference residing in that two second capillary layers 220 are respectively stacked on and under top and bottom surfaces of the first capillary layer 210 and the second capillary layers 220 are shaped to correspond to the recess 102 of the board(s) 100, but the first capillary layer 210 has a shape that is arbitrary (such as a T-shape). The first capillary layer 210 has a periphery that forms one or more cutoffs 211.
Referring to FIG. 4, which shows an exploded view of a heat plate according to a fourth embodiment of the present invention, the fourth embodiment is substantially similar to the first embodiment with a major difference residing in that the first capillary layer 210 corresponds in shape to the second capillary layer 220 and both the first and second capillary layers 210, 200 are of an arbitrary but identical shape (such as a T-shape). The first capillary layer 210 has a periphery that forms one or more cutoffs 211 and the second capillary layer 220 also has a periphery that forms one or more cutoffs 221.
The present invention provides a heat plate of which the features are that two boards 100 mate and are coupled to each other to form an internal accommodation chamber 101 and a capillary structure of at least one first capillary layer 210 and at least one second capillary layer 220 is received in the accommodation chamber 101 in such a way that the first and second capillary layers 210, 220 are stacked over each other, whereby when a working fluid contained in the accommodation chamber 101 undergoes phase change, vapor or gaseous phase of the working fluid is allowed to quickly pass through the first capillary layer 210 to improve vapor diffusion efficiency, and, on the other hand, the liquid phase of the working fluid is allowed to uniformly diffuse and flow through the second capillary layer 220 to enhance uniformity of distribution of the working fluid, thereby improving temperature reduction efficiency.
Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.

Claims

1. A heat plate, comprising:

two boards, which are coupled to each other to form an accommodation chamber therebetween;

at least one first capillary layer, which is received in the accommodation chamber; and

at least one second capillary layer, which is received in the accommodation chamber, the first and the capillary layers being stacked over each other.

2. The heat plate as claimed in claim 1, wherein the first capillary layer has a thickness that is greater than a thickness of the second capillary layer.

3. The heat plate as claimed in claim 1 or 2, wherein the first and second capillary layers comprise metal nets, the first capillary layer having a mesh smaller than a mesh of the second capillary layer.

4. The heat plate as claimed in claim 1, wherein the second capillary layer is stacked under the first capillary layer.

5. The heat plate as claimed in claim 1, wherein two capillary layers are respectively stacked on and under top and bottom surfaces of the first capillary layer.

6. The heat plate as claimed in claim 1, wherein the first capillary layer has a periphery forming a cutoff.

7. The heat plate as claimed in claim 1 or 6, wherein the second capillary layer has a periphery forming a cutoff.

8. The heat plate as claimed in claim 1, wherein at least one of the two boards forms a recess.

9. The heat plate as claimed in claim 1, wherein the stacked first and second capillary layers has an overall thickness that is substantially identical to a depth of the accommodation chamber.

10. The heat plate as claimed in claim 1, wherein the second capillary layer is formed of sintered powders.