US20110161039A1 - Method and system of testing electronic device - Google Patents
Method and system of testing electronic device Download PDFInfo
- Publication number
- US20110161039A1 US20110161039A1 US12/715,652 US71565210A US2011161039A1 US 20110161039 A1 US20110161039 A1 US 20110161039A1 US 71565210 A US71565210 A US 71565210A US 2011161039 A1 US2011161039 A1 US 2011161039A1
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- Prior art keywords
- embedded controller
- application module
- command
- type information
- testing result
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/2268—Logging of test results
Definitions
- the present disclosure relates to a test method and system of an electronic device.
- Electronic devices such as a notebook computer have embedded controllers. Each embedded controller may store battery temperature information, fan speed information, power information, and so on. Therefore, when the electronic device is tested, the embedded controller is read to obtain the corresponding information using embedded controller commands
- different electronic devices use different embedded controller commands. When a person tests one electronic device, they must use the corresponding command. If the person tests another electronic device, they must use another command corresponding to different electronic device. It is not convenient to test different electronic devices.
- FIG. 1 is a block diagram of a system of testing an electronic device in accordance with one embodiment.
- FIG. 2 is a layer view of a system of testing an electronic device in accordance with one embodiment.
- FIG. 3 is a flowchart of a method of testing an electronic device in accordance with one embodiment.
- module refers to logic embodied in hardware or firmware, or to a collection of software instructions, written in a programming language, such as, for example, Java or C.
- One or more software instructions in the modules may be embedded in firmware, such as an EPROM.
- modules may comprised connected logic units, such as gates and flip-flops, and may comprise programmable units, such as programmable gate arrays or processors.
- the modules described herein may be implemented as either software and/or hardware modules and may be stored in any type of computer-readable medium or other computer storage device.
- a system of testing an electronic device includes a receiving module, a data module and an application module.
- the electronic device includes an embedded controller.
- a user manually enters a type information of the electronic device into the receiving module which sends the type information to the data module for storing.
- the data module stores the type information of the embedded controller and transmits the type information to the application module.
- the application module analyzes the type information to obtain a corresponding command associated with the type information.
- the application module sends the command to the embedded controller.
- the embedded controller returns a test result to the application module.
- the application module makes a test report after the application module compares the test result with a predetermined result.
- the embedded controller a single chip, is located at the hardware layer.
- the embedded controller stores, for example, battery temperature information, fan speed information, and power information of the electronic device.
- the application module sends the command to the embedded controller through a drive to read a memory in the embedded controller where test results are stored.
- the drive reads the memory via an input/output port of the embedded controller.
- the drive is located at the drive layer.
- the application module is located at the application layer.
- the application module includes some functions.
- a sending command function sendEcAcpiCmd(BYTE byCmd, BYTE byAddress, BYTE *byInputData, BYTE *byOutputData), byCmd expresses a read/write command, 0 ⁇ 80 value expresses to read, 0 ⁇ 81 value expresses to write; byAddress expresses addresses; *byInputData expresses an input parameter; *byOutputData expresses to return a testing result.
- the data module is also located on the application layer.
- AEIREAD expresses to read an expanded command of the embedded controller;
- 0 ⁇ A2 expresses the input parameter;
- 0 ⁇ 38 expresses to execute 0 ⁇ 38 command
- one embodiment of a method of testing an electronic device includes the following blocks.
- the receiving module receives and sends the type information to the data module for storing.
- the data module stores the type information of the embedded controller and transmits the type information to the application module.
- the application module analyzes the type information to obtain the command.
- the application module sends the command to the embedded controller.
- the embedded controller returns the test result to the application module.
- the application module generates a test report after the application module compares the test result with the predetermined result.
- the command comprises an expanded command capable of writing information in the embedded controller.
- the test result may include, for example, fan speed information, battery temperature information, and power information.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Test And Diagnosis Of Digital Computers (AREA)
Abstract
A method of testing an electronic device is disclosed. The electronic device includes an embedded controller. The method includes storing a type information of the embedded controller and transmitting the type information to an application module through a data module. The application module analyzes the type information to obtain a command The application module sends the command to the embedded controller. The embedded controller returns a testing result to the application module. The application module generates a testing report after the application module compares the testing result with a predetermined result.
Description
- 1. Technical Field
- The present disclosure relates to a test method and system of an electronic device.
- 2. Description of Related Art
- Electronic devices (such as a notebook computer) have embedded controllers. Each embedded controller may store battery temperature information, fan speed information, power information, and so on. Therefore, when the electronic device is tested, the embedded controller is read to obtain the corresponding information using embedded controller commands However, different electronic devices use different embedded controller commands. When a person tests one electronic device, they must use the corresponding command. If the person tests another electronic device, they must use another command corresponding to different electronic device. It is not convenient to test different electronic devices.
-
FIG. 1 is a block diagram of a system of testing an electronic device in accordance with one embodiment. -
FIG. 2 is a layer view of a system of testing an electronic device in accordance with one embodiment. -
FIG. 3 is a flowchart of a method of testing an electronic device in accordance with one embodiment. - The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- In general, the word “module,” as used herein, refers to logic embodied in hardware or firmware, or to a collection of software instructions, written in a programming language, such as, for example, Java or C. One or more software instructions in the modules may be embedded in firmware, such as an EPROM. It will be appreciated that modules may comprised connected logic units, such as gates and flip-flops, and may comprise programmable units, such as programmable gate arrays or processors. The modules described herein may be implemented as either software and/or hardware modules and may be stored in any type of computer-readable medium or other computer storage device.
- Referring to
FIG. 1 , a system of testing an electronic device includes a receiving module, a data module and an application module. The electronic device includes an embedded controller. A user manually enters a type information of the electronic device into the receiving module which sends the type information to the data module for storing. The data module stores the type information of the embedded controller and transmits the type information to the application module. The application module analyzes the type information to obtain a corresponding command associated with the type information. The application module sends the command to the embedded controller. The embedded controller returns a test result to the application module. The application module makes a test report after the application module compares the test result with a predetermined result. - Referring to
FIG. 2 , there are many layers in the electronic device. For example, there can be an application layer, a drive layer, and a hardware layer. The embedded controller, a single chip, is located at the hardware layer. The embedded controller stores, for example, battery temperature information, fan speed information, and power information of the electronic device. - The application module sends the command to the embedded controller through a drive to read a memory in the embedded controller where test results are stored. The drive reads the memory via an input/output port of the embedded controller. The drive is located at the drive layer.
- The application module is located at the application layer. The application module includes some functions. In one embodiment, a sending command function, sendEcAcpiCmd(BYTE byCmd, BYTE byAddress, BYTE *byInputData, BYTE *byOutputData), byCmd expresses a read/write command, 0×80 value expresses to read, 0×81 value expresses to write; byAddress expresses addresses; *byInputData expresses an input parameter; *byOutputData expresses to return a testing result.
- The data module is also located on the application layer. In one embodiment, in the data module, AEIREAD expresses to read an expanded command of the embedded controller; 0×A2 expresses the input parameter; 0×38 expresses to execute 0×38 command
- Referring to
FIG. 3 , one embodiment of a method of testing an electronic device includes the following blocks. - In block S1, the receiving module receives and sends the type information to the data module for storing.
- In block S2, the data module stores the type information of the embedded controller and transmits the type information to the application module.
- In block S3, the application module analyzes the type information to obtain the command. The application module sends the command to the embedded controller.
- In block S4, the embedded controller returns the test result to the application module. The application module generates a test report after the application module compares the test result with the predetermined result. The command comprises an expanded command capable of writing information in the embedded controller. The test result may include, for example, fan speed information, battery temperature information, and power information.
- While the present disclosure has been illustrated by the description of preferred embodiments thereof, and while the preferred embodiments have been described in considerable detail, it is not intended to restrict or in any way limit the scope of the appended claims to such details. Additional advantages and modifications within the spirit and scope of the present disclosure will readily appear to those skilled in the art. Therefore, the present disclosure is not limited to the specific details and illustrative examples shown and described.
- Depending on the embodiment, certain of the steps of methods described may be removed, others may be added, and the sequence of steps may be altered. It is also to be understood that the description and the claims drawn to a method may include some indication in reference to certain steps. However, the indication used is only to be viewed for identification purposes and not as a suggestion as to an order for the steps.
Claims (16)
1. A method of testing an electronic device, the electronic device comprising of an embedded controller, the method comprising:
storing a type information of the embedded controller and transmitting the type information to an application module through a data module;
analyzing the type information to obtain a command by the application module;
sending the command to the embedded controller by the application module;
returning a testing result to the application module through the embedded controller; and
generating a testing report after the application module compares the testing result with a predetermined result.
2. The method of claim 1 , wherein the command comprises an expanded command, and the expanded command writes information to the embedded controller.
3. The method of claim 1 , wherein the application module sends the command to the embedded controller to obtain power information.
4. The method of claim 1 , wherein a receiving module receives and sends the type information to the data module.
5. The method of claim 1 , wherein the testing result comprises fan rotation speed information.
6. The method of claim 1 , wherein the application module sends the command to the embedded controller through a driver to read a portion of a memory in the embedded controller, and the memory stores the testing result.
7. The method of claim 6 , wherein the driver reads the memory via an input/output port of the embedded controller.
8. The method of claim 1 , wherein the testing result comprises battery temperature information.
9. A system of testing an electronic device, the electronic device comprising of an embedded controller, the system comprising:
a data module capable of storing a type information of the embedded controller and transmitting the type information to an application module;
the application module capable of analyzing the type information to obtain a command;
the application module capable of sending the command to the embedded controller;
the embedded controller capable of receiving a testing result to the application module;
the application module capable of generating a testing report when the application module compares the testing result with a predetermined result.
10. The system of claim 9 , wherein the command comprises an expanded command capable of writing information in the embedded controller.
11. The system of claim 9 , wherein the application module is capable of sending the command to the embedded controller to obtain power information.
12. The system of claim 9 , wherein a receiving module is capable of receiving and sending the type information to the data module for storing.
13. The system of claim 9 , wherein the testing result comprises fan rotation speed information.
14. The system of claim 9 , wherein the application module is capable of sending the command to the embedded controller through a driver to read a memory in the embedded controller, and the memory is capable of storing the testing result.
15. The system of claim 14 , wherein the driver is capable of reading the memory via an input/output port of the embedded controller.
16. The system of claim 9 , wherein the testing result comprises battery temperature information.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910312544.0 | 2009-12-29 | ||
| CN2009103125440A CN102110037A (en) | 2009-12-29 | 2009-12-29 | Electronic device testing system |
| CN200910312544 | 2009-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20110161039A1 true US20110161039A1 (en) | 2011-06-30 |
| US8285509B2 US8285509B2 (en) | 2012-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/715,652 Expired - Fee Related US8285509B2 (en) | 2009-12-29 | 2010-03-02 | Method and system of testing electronic device |
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| Country | Link |
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| US (1) | US8285509B2 (en) |
| CN (1) | CN102110037A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104237660A (en) * | 2013-06-07 | 2014-12-24 | 鸿富锦精密工业（深圳）有限公司 | Automatic testing device and method |
| CN105224047B (en) * | 2014-06-09 | 2019-01-08 | 华为技术有限公司 | Fan, fan governor, electronic equipment and fan recognition methods |
| CN106649080A (en) * | 2015-11-04 | 2017-05-10 | 神讯电脑(昆山)有限公司 | Automatic synchronization system and method for testing document |
| CN107943005B (en) * | 2017-12-06 | 2020-11-20 | 广东中科瑞泰智能科技有限公司 | Detection method and detection device and unmanned aerial vehicle |
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| EP1050797A1 (en) * | 1999-05-03 | 2000-11-08 | STMicroelectronics S.A. | Execution of instructions in a computer program |
| US20030208712A1 (en) * | 2002-05-01 | 2003-11-06 | Michael Louden | Method and apparatus for making and using wireless test verbs |
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| US20100198088A1 (en) * | 2007-05-01 | 2010-08-05 | Michael Ortenberg | Method, apparatus and system for detection of arterial stiffness and artery tonus by pulse curve geometry analysis |
| US20100229058A1 (en) * | 2009-03-04 | 2010-09-09 | Suresh Goyal | Method and apparatus for system testing using scan chain decomposition |
| US7809520B2 (en) * | 2007-11-05 | 2010-10-05 | Advantest Corporation | Test equipment, method for loading test plan and program product |
| US20100268506A1 (en) * | 2009-04-17 | 2010-10-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Testing system and method for fan module |
-
2009
- 2009-12-29 CN CN2009103125440A patent/CN102110037A/en active Pending
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2010
- 2010-03-02 US US12/715,652 patent/US8285509B2/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1050797A1 (en) * | 1999-05-03 | 2000-11-08 | STMicroelectronics S.A. | Execution of instructions in a computer program |
| US20030208712A1 (en) * | 2002-05-01 | 2003-11-06 | Michael Louden | Method and apparatus for making and using wireless test verbs |
| US20060282736A1 (en) * | 2005-05-20 | 2006-12-14 | Agilent Technologies, Inc. | Test device with test parameter adaptation |
| US20090259428A1 (en) * | 2005-05-20 | 2009-10-15 | Albrecht Schroth | Method and product for testing a device under test |
| US7924043B2 (en) * | 2005-05-20 | 2011-04-12 | Verigy (Singapore) Pte. Ltd. | Method and product for testing a device under test |
| US20080256392A1 (en) * | 2007-04-16 | 2008-10-16 | Microsoft Corporation | Techniques for prioritizing test dependencies |
| US7840844B2 (en) * | 2007-04-16 | 2010-11-23 | Microsoft Corporation | Techniques for prioritizing test dependencies |
| US20100198088A1 (en) * | 2007-05-01 | 2010-08-05 | Michael Ortenberg | Method, apparatus and system for detection of arterial stiffness and artery tonus by pulse curve geometry analysis |
| US7809520B2 (en) * | 2007-11-05 | 2010-10-05 | Advantest Corporation | Test equipment, method for loading test plan and program product |
| US20100229058A1 (en) * | 2009-03-04 | 2010-09-09 | Suresh Goyal | Method and apparatus for system testing using scan chain decomposition |
| US20100268506A1 (en) * | 2009-04-17 | 2010-10-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Testing system and method for fan module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102110037A (en) | 2011-06-29 |
| US8285509B2 (en) | 2012-10-09 |
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Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, QING-HUA;REEL/FRAME:024012/0993 Effective date: 20100223 Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIU, QING-HUA;REEL/FRAME:024012/0993 Effective date: 20100223 |
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Effective date: 20161009 |