US20100051231A1 - Heat dissipation apparatus having a heat pipe inserted therein - Google Patents
Heat dissipation apparatus having a heat pipe inserted therein Download PDFInfo
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- US20100051231A1 US20100051231A1 US12/482,458 US48245809A US2010051231A1 US 20100051231 A1 US20100051231 A1 US 20100051231A1 US 48245809 A US48245809 A US 48245809A US 2010051231 A1 US2010051231 A1 US 2010051231A1
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- Prior art keywords
- heat
- fin
- fins
- receiving hole
- dissipation apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure generally relates to heat dissipation, and particularly to a heat dissipation apparatus utilizing a heat pipe for enhancing a dissipating efficiency.
- a typical heat dissipation apparatus includes a fin assembly and a heat pipe attached to the fin assembly.
- the heat pipe has an arcuate condensation section.
- the fin assembly includes a plurality of radial stacked fins. Each of the fins defines a hole for receiving the condensation section of the heat pipe therein, and extends perpendicularly out a flange around the hole.
- the flange has a uniform height. The flange increases a contacting surface between the fin assembly and the heat pipe, and compels the heat pipe to be steadily mounted in the fin assembly.
- the holes of the fins In the heat dissipation apparatus, due to the arcuate condensation section of the heat pipe, the holes of the fins must be enlarged for making the heat pipe extending easily therethrough without any block of the flanges of the fins.
- the enlarged holes will form an enlarged gap between the heat pipe and the flanges, which results that the heat pipe can't intimately contact with the fin assembly, and heat transferring efficiency of the heat dissipation apparatus is accordingly reduced.
- FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with one embodiment of the disclosure.
- FIG. 2 is an exploded, isometric view of the heat dissipation apparatus of FIG. 1 .
- FIG. 3 is an isometric view of a first fin of the heat dissipation apparatus of FIG. 1 .
- FIG. 4 is an enlarged and top plan view of a portion of the first fin of FIG. 3 .
- FIG. 5 is an isometric view of a second fin of the heat dissipation apparatus of FIG. 1 .
- FIG. 6 is an enlarged and top plan view of a portion of the second fin of FIG. 5 .
- FIG. 7 is an isometric view showing a pair of first fin assemblies assembled to a heat pipe assembly of the heat dissipation apparatus of FIG. 1 , and a pair of second fin assemblies disassembled from the heat pipe assembly.
- FIG. 8 is an isometric view showing a fan disassembled from the heat dissipation apparatus of FIG. 1 .
- the heat dissipation apparatus includes a base 10 , a heat sink 30 , a heat pipe assembly 20 thermally connecting the base 10 with the heat sink 30 , a cylindrical heat conductive core 40 received in the heat sink 30 , and a fan 50 mounted in a top of the heat sink 30 .
- the base 10 is a metal plate, and has a high heat conductivity.
- the base 10 is made of copper.
- the base 10 thermally connects with a heat generating electronic component at a bottom surface thereof, and attaches to the heat pipe assembly 20 at a top surface thereof.
- the heat pipe assembly 20 includes a pair of first heat pipes 21 and a pair of second heat pipes 23 .
- Each of the first heat pipes 21 is bent to have an evaporation section 211 , a condensation section 212 , and an adiabatic section 213 interconnecting the evaporation section 211 and the condensation section 212 .
- the evaporation section 211 of each of the first heat pipes 21 is straight and flat, and is mounted on the top surface of the base 10 .
- the adiabatic section 213 extends upwardly and slantwise from one end of the evaporation section 211 .
- the adiabatic sections 213 are located at two opposite sides of the base 10 .
- the condensation section 212 is substantially semicircular, and extends from a free end of the adiabatic section 213 along an anticlockwise direction.
- the condensation sections 212 are approximately at the same level and cooperatively form a circle.
- the second heat pipes 23 are similar to the first heat pipes 21 , and each also include an evaporation section 231 , a condensation section 232 , and an adiabatic section 233 interconnecting the evaporation section 231 and the condensation section 232 .
- the evaporation sections 231 of the second heat pipes 23 are arranged on the top surface of the base 10 , and between the evaporation sections 211 of the first heat pipes 21 .
- a free end of the adiabatic section 233 of each second heat pipe 23 is higher than that of each first heat pipe 21 .
- the condensation sections 232 of the second heat pipes 23 are at the same level, and higher than the condensation sections 212 of the first heat pipes 21 .
- the condensation sections 232 of the second heat pipes 23 cooperatively form a circle.
- a plane defined by the condensation sections 232 of the second heat pipes 23 is parallel to a plane defined by the condensation sections 212 of the first heat pipes 21 .
- the heat sink 30 is annular, and includes a pair of first fin assemblies 31 and a pair of second fin assemblies 33 .
- Each of the first fin assemblies 31 is sectorial, and includes a plurality of radial first fins 311 stacked on each other along a circumferential direction.
- An air channel 312 is defined between every two adjacent first fins 311 .
- Each of the first fins 311 includes a rectangular main body 313 and an extension arm 314 extending upwardly from an outer side of the main body 313 .
- the main body 313 defines a first receiving hole 315 and a second receiving hole 316 above the first receiving hole 315 .
- the first and second receiving holes 315 , 316 are circular. All the first receiving holes 315 of the first fins 311 of each first fin assembly 31 cooperatively form an arcuate first receiving groove 325 for receiving the condensation section 212 of one of the first heat pipes 21 therein. All the second receiving holes 316 of the first fins 311 of each first fin assembly 31 cooperatively form a second receiving groove 326 for receiving the condensation section 232 of one of the second heat pipes 23 therein.
- the first receiving hole 315 is defined in a middle of the main body 313 .
- the main body 313 extends a first flange 317 perpendicularly around the first receiving hole 315 .
- the first flange 317 is annular, and has a height varied along a circumferential direction thereof. Referring to FIG. 4 , the height of the first flange 317 gradually increases outwardly along a direction from a center of the heat sink 30 of the heat dissipation apparatus to a periphery thereof. In this embodiment, a free end surface 318 of the first flange 317 is planar, and angles from the main body 313 .
- the second receiving hole 316 is adjacent to the extension arm 314 , and located beside and above the first receiving hole 315 .
- the main body 313 extends a second flange 319 perpendicularly around the second receiving hole 316 .
- the second flange 319 has a structure similar to the first flange 317 , which has a height gradually increasing outwardly in a direction away form the center of the heat sink 30 of the heat dissipation apparatus.
- the first and second flanges 317 , 319 of the main body 313 abut the main body 313 of a neighboring first fin 311 when the first fins 311 are assembled together.
- the main body 313 extends a side edge 321 perpendicularly at an inner side thereof, a bottom edge 322 perpendicularly at a bottom side thereof just below the extension arm 314 , and a protrusion 323 adjacent to the side edge 321 .
- the side edge 321 and the bottom edge 322 of the main body 313 abut the main body 313 of the neighboring first fin 311 as the first and second flanges 317 , 319 .
- a diameter of the protrusion 323 gradually decreases along a height direction of the protrusion 323 from the main body 313 .
- the main body 313 further defines a fixing hole 324 through the protrusion 323 .
- An inner diameter of the fixing hole 324 is smaller than the outer diameter of the protrusion 323 at a bottom end connected to the main body 313 , but larger than that at a free end of the protrusion 323 which is away from the main body 313 .
- the protrusion 323 is inserted into the fixing hole 324 of the neighboring first fin 311 , for accurately aligning the side edges 321 so that they can be positioned in a line when the first fins 311 are assembled together.
- the extension arm 314 extends upwardly form a top side of the main body 313 , and has a width less than that of the main body 313 .
- a top edge 327 extends perpendicularly from a top side of the extension arm 314 , and is parallel to the bottom edge 322 .
- the first fins 311 are joined together and space from each other via the top and bottom edges 327 , 322 .
- the second fin assemblies 33 are similar to the first fin assemblies 31 , with each also being sectorial, and including a plurality of stacked second fins 331 .
- An air channel 332 is defined between every two adjacent second fins 331 .
- Each of the second fins 331 includes a main body 333 and an extension arm 334 .
- the extension arm 334 of the second fin 331 also forms a top edge 347 at a top side thereof.
- the main body 333 also includes a side edge 341 at an inner side thereof, a protrusion 343 adjacent to the side edge 341 , and a fixing hole 344 through the protrusion 343 .
- each second fin 331 is substantially triangular, and thus defines a cutout 348 at a lower side thereof.
- the main body 333 defines a first receiving hole 335 and a second receiving hole 336 therein, aligning with the first receiving hole 315 and the second receiving hole 316 , respectively.
- the first and second receiving holes 335 , 336 each are semicircular, and exposed to and in communication with the cutout 348 . All the first receiving holes 335 of the second fins 331 of each second fin assembly 33 cooperatively form an arcuate first receiving groove 345 for receiving the condensation section 212 of one of the first heat pipes 21 therein.
- All the second receiving holes 336 of the second fins 331 of each second fin assembly 33 cooperatively form a second receiving groove 346 for receiving the condensation section 232 of one of the second heat pipes 23 therein.
- All the cutouts 348 of the second fins 331 cooperatively form an opening 349 at a lower side of the second fin assembly 33 , whereby the condensation sections 212 , 232 of the first and second heat pipes 21 , 23 can be respectively conveniently inserted into the first and second receiving grooves 345 via the opening 349 .
- the main body 333 extends a first flange 337 perpendicularly around the first receiving hole 335 .
- the first flange 337 is semicircular, and has a height varied along a circumferential direction thereof. Referring to FIG. 6 , a height of the first flange 337 increases outwardly in a direction away from the center of the heat sink 30 of the heat dissipation apparatus.
- a free end surface 338 of the first flange 337 is planar, and angles from the main body 333 .
- the main body 333 extends a second flange 339 perpendicularly around the second receiving hole 336 .
- the second flange 339 has a structure similar to the first flange 337 , which has a height increasing outwardly in a direction away form the center of the heat sink 30 of the heat dissipation apparatus.
- the first and second flanges 337 , 339 of the main body 331 abut the main body 331 of a neighboring second fin 331 .
- the first fin assemblies 31 are oriented face to face, and space from each other.
- the condensation sections 212 of the pair of the first heat pipes 21 are respectively inserted into the first receiving grooves 325 of the pair of first fin assemblies 31 along the anticlockwise direction, and attached to the first flanges 317 of the first fin assemblies 31 tightly.
- the condensation sections 232 of the pair of the second heat pipes 23 are respectively inserted into the second receiving grooves 326 of the first fin assemblies 31 along the anticlockwise direction, and attached to the second flanges 319 of the first fin assemblies 31 .
- a free end of each condensation section 212 , 232 protrudes out of a corresponding first fin assembly 31 .
- the first fin assemblies 31 , and the first and second heat pipes 21 , 23 are arranged on the base 10 , with the evaporation sections 211 , 231 of the first and second heat pipes 21 , 23 soldered on the base 10 .
- the second fin assemblies 33 are inserted into spaces between the first fin assemblies 31 from top to bottom, respectively.
- the free end of the condensation section 212 of each first heat pipe 21 enters into and is received in the first receiving groove 345 through the opening 349 of a corresponding second fin assembly 33 , and is attached to the first flanges 337 of the corresponding second fin assembly 33 .
- the free end of the condensation section 232 of each second heat pipe 23 enters into and is received in the second receiving groove 346 through the opening 349 of a corresponding second fin assembly 33 , and is attached to the second flanges 339 of the corresponding second fin assembly 33 .
- the adiabatic sections 213 , 233 of the first and second heat pipe 21 , 23 are received in the openings 349 .
- the first fin assemblies 31 and the second fin assemblies 33 are alternate with each other, and cooperatively form the annular heat sink 30 .
- the heat conductive core 40 is enclosed by the main bodies 313 , 333 of the first and second fin assemblies 31 , 33 .
- the heat conductive core 40 attaches to the evaporation sections 211 , 231 of the first and second heat pipes 21 , 23 at a bottom surface thereof, and attaches to the side edges 321 , 341 of the first and second fin assemblies 31 , 33 at a side surface thereof.
- the first and second fins 311 , 331 of the first and second fin assemblies 31 , 33 extend out from the heat conductive core 40 in a radial pattern.
- the extension arms 314 , 334 of the first and second fin assemblies 31 , 33 cooperatively form a recessed space 39 over the heat conductive core 40 .
- the fan 50 is received into the space 39 , and is supported by the first and second fin assemblies 31 , 33 of the heat sink 30 .
- the base 10 absorbs heat from the heat generating electronic component, which is transferred to the heat sink 30 via the heat conductive core 40 and the heat pipe assembly 20 .
- the fan 50 produces an airflow toward the heat sink 30 , and dissipates heat from the heat sink 30 into ambient air.
- the heat sink 30 since the heat sink 30 includes a pair of first fin assemblies 31 and a pair of second fin assemblies 33 , the heat pipe assembly 20 can be assembled into the first and second fin assemblies 31 , 33 successively.
- the heat dissipation apparatus is conveniently assembled even though the first and second heat pipes 21 , 23 are bent to form a plurality of sections.
- each of the first flanges 317 , 337 of the first and second fin assemblies 31 , 33 increases outwardly in the direction away from the center of the heat sink 30 of the heat dissipation apparatus
- the height of each of the second flanges 319 , 339 of the first and second fin assemblies 31 , 33 increases outwardly in the direction away from the center of the heat sink 30 of the heat dissipation apparatus, which conform with a varied distance between neighboring fins 311 , 331 along a radial direction of the heat sink 30 .
- the condensation sections 312 , 332 of the first and second heat pipes 31 , 33 can be easily extended through the first and second receiving holes 315 , 335 , 316 , 336 , respectively, without being blocked by inner portions of the flanges 317 , 337 , 319 , 339 since the inner portions of the flanges 317 , 337 , 319 , 339 each are now designed to have a reduced height than outer portions of the flanges 317 , 337 , 319 , 339 .
- a gap between the condensation sections 312 , 332 of the first and second heat pipes 31 , 33 and the first and second flanges 317 , 337 , 319 , 339 of the first and second fins 311 , 331 is not necessary to be increased, whereby heat transferring efficiency between the first and second fins 311 , 331 and the heat pipes 31 , 33 of the heat dissipation apparatus is improved.
- the fan 50 is mounted in the space 39 of the heat sink 30 , and the impeller 52 is enclosed by the heat sink 30 , which makes most of the cool airflow produced by the fan 50 flow through the first and second fins 311 , 331 .
- the heat sink 30 enclosing the fan 50 severs as a sidewall of the typical fan, which saves material of the fan 50 and increases pressure of the airflow produced by the fan 50 .
- first and second fins 311 , 331 of the first and second fin assemblies 31 , 33 extend out from the heat conductive core 40 in a radial pattern.
- the airflow produced by the fan 50 is easily guided toward other heat generating electronic components around the heat sink 30 through the airflow channels 312 , 332 between the first and second fins 311 , 331 .
- the heat dissipation apparatus not only takes heat away from the heat sink 30 , but also dissipates heat from the heat generating electronic components around the heat sink 30 .
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure generally relates to heat dissipation, and particularly to a heat dissipation apparatus utilizing a heat pipe for enhancing a dissipating efficiency.
- 2. Description of Related Art
- It is well known that if heat generated by electronic components, such as integrated circuit chips, during operation is not efficiently dissipated, these electronic components may suffer damage. Thus, heat dissipation apparatuses are often used to cool the electronic components.
- A typical heat dissipation apparatus includes a fin assembly and a heat pipe attached to the fin assembly. The heat pipe has an arcuate condensation section. The fin assembly includes a plurality of radial stacked fins. Each of the fins defines a hole for receiving the condensation section of the heat pipe therein, and extends perpendicularly out a flange around the hole. The flange has a uniform height. The flange increases a contacting surface between the fin assembly and the heat pipe, and compels the heat pipe to be steadily mounted in the fin assembly.
- In the heat dissipation apparatus, due to the arcuate condensation section of the heat pipe, the holes of the fins must be enlarged for making the heat pipe extending easily therethrough without any block of the flanges of the fins. The enlarged holes will form an enlarged gap between the heat pipe and the flanges, which results that the heat pipe can't intimately contact with the fin assembly, and heat transferring efficiency of the heat dissipation apparatus is accordingly reduced.
- What is needed, therefore, is a heat dissipation apparatus which overcomes the above-described limitations.
- Many aspects of the present heat dissipation apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosed heat dissipation apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with one embodiment of the disclosure. -
FIG. 2 is an exploded, isometric view of the heat dissipation apparatus ofFIG. 1 . -
FIG. 3 is an isometric view of a first fin of the heat dissipation apparatus ofFIG. 1 . -
FIG. 4 is an enlarged and top plan view of a portion of the first fin ofFIG. 3 . -
FIG. 5 is an isometric view of a second fin of the heat dissipation apparatus ofFIG. 1 . -
FIG. 6 is an enlarged and top plan view of a portion of the second fin ofFIG. 5 . -
FIG. 7 is an isometric view showing a pair of first fin assemblies assembled to a heat pipe assembly of the heat dissipation apparatus ofFIG. 1 , and a pair of second fin assemblies disassembled from the heat pipe assembly. -
FIG. 8 is an isometric view showing a fan disassembled from the heat dissipation apparatus ofFIG. 1 . - Referring to
FIGS. 1 and 2 , a heat dissipation apparatus in accordance with one embodiment of the disclosure is shown. The heat dissipation apparatus includes abase 10, aheat sink 30, aheat pipe assembly 20 thermally connecting thebase 10 with theheat sink 30, a cylindrical heatconductive core 40 received in theheat sink 30, and afan 50 mounted in a top of theheat sink 30. - The
base 10 is a metal plate, and has a high heat conductivity. Preferably, thebase 10 is made of copper. Thebase 10 thermally connects with a heat generating electronic component at a bottom surface thereof, and attaches to theheat pipe assembly 20 at a top surface thereof. - The
heat pipe assembly 20 includes a pair offirst heat pipes 21 and a pair ofsecond heat pipes 23. Each of thefirst heat pipes 21 is bent to have anevaporation section 211, acondensation section 212, and anadiabatic section 213 interconnecting theevaporation section 211 and thecondensation section 212. Theevaporation section 211 of each of thefirst heat pipes 21 is straight and flat, and is mounted on the top surface of thebase 10. Theadiabatic section 213 extends upwardly and slantwise from one end of theevaporation section 211. Theadiabatic sections 213 are located at two opposite sides of thebase 10. Thecondensation section 212 is substantially semicircular, and extends from a free end of theadiabatic section 213 along an anticlockwise direction. Thecondensation sections 212 are approximately at the same level and cooperatively form a circle. - The
second heat pipes 23 are similar to thefirst heat pipes 21, and each also include anevaporation section 231, acondensation section 232, and anadiabatic section 233 interconnecting theevaporation section 231 and thecondensation section 232. Theevaporation sections 231 of thesecond heat pipes 23 are arranged on the top surface of thebase 10, and between theevaporation sections 211 of thefirst heat pipes 21. A free end of theadiabatic section 233 of eachsecond heat pipe 23 is higher than that of eachfirst heat pipe 21. Thecondensation sections 232 of thesecond heat pipes 23 are at the same level, and higher than thecondensation sections 212 of thefirst heat pipes 21. Similarly, thecondensation sections 232 of thesecond heat pipes 23 cooperatively form a circle. A plane defined by thecondensation sections 232 of thesecond heat pipes 23 is parallel to a plane defined by thecondensation sections 212 of thefirst heat pipes 21. - The
heat sink 30 is annular, and includes a pair offirst fin assemblies 31 and a pair ofsecond fin assemblies 33. - Each of the
first fin assemblies 31 is sectorial, and includes a plurality of radialfirst fins 311 stacked on each other along a circumferential direction. Anair channel 312 is defined between every two adjacentfirst fins 311. Each of thefirst fins 311 includes a rectangularmain body 313 and anextension arm 314 extending upwardly from an outer side of themain body 313. - The
main body 313 defines afirst receiving hole 315 and a second receivinghole 316 above thefirst receiving hole 315. The first andsecond receiving holes first receiving holes 315 of thefirst fins 311 of eachfirst fin assembly 31 cooperatively form an arcuate first receivinggroove 325 for receiving thecondensation section 212 of one of thefirst heat pipes 21 therein. All thesecond receiving holes 316 of thefirst fins 311 of eachfirst fin assembly 31 cooperatively form asecond receiving groove 326 for receiving thecondensation section 232 of one of thesecond heat pipes 23 therein. Thefirst receiving hole 315 is defined in a middle of themain body 313. Themain body 313 extends afirst flange 317 perpendicularly around thefirst receiving hole 315. Thefirst flange 317 is annular, and has a height varied along a circumferential direction thereof. Referring toFIG. 4 , the height of thefirst flange 317 gradually increases outwardly along a direction from a center of theheat sink 30 of the heat dissipation apparatus to a periphery thereof. In this embodiment, afree end surface 318 of thefirst flange 317 is planar, and angles from themain body 313. Thesecond receiving hole 316 is adjacent to theextension arm 314, and located beside and above thefirst receiving hole 315. Themain body 313 extends asecond flange 319 perpendicularly around thesecond receiving hole 316. Thesecond flange 319 has a structure similar to thefirst flange 317, which has a height gradually increasing outwardly in a direction away form the center of theheat sink 30 of the heat dissipation apparatus. The first andsecond flanges main body 313 abut themain body 313 of a neighboringfirst fin 311 when thefirst fins 311 are assembled together. - The
main body 313 extends aside edge 321 perpendicularly at an inner side thereof, abottom edge 322 perpendicularly at a bottom side thereof just below theextension arm 314, and aprotrusion 323 adjacent to theside edge 321. Theside edge 321 and thebottom edge 322 of themain body 313 abut themain body 313 of the neighboringfirst fin 311 as the first andsecond flanges protrusion 323 gradually decreases along a height direction of theprotrusion 323 from themain body 313. Themain body 313 further defines a fixinghole 324 through theprotrusion 323. An inner diameter of the fixinghole 324 is smaller than the outer diameter of theprotrusion 323 at a bottom end connected to themain body 313, but larger than that at a free end of theprotrusion 323 which is away from themain body 313. Theprotrusion 323 is inserted into the fixinghole 324 of the neighboringfirst fin 311, for accurately aligning the side edges 321 so that they can be positioned in a line when thefirst fins 311 are assembled together. - The
extension arm 314 extends upwardly form a top side of themain body 313, and has a width less than that of themain body 313. Atop edge 327 extends perpendicularly from a top side of theextension arm 314, and is parallel to thebottom edge 322. Thefirst fins 311 are joined together and space from each other via the top andbottom edges - Referring to
FIG. 5 , thesecond fin assemblies 33 are similar to thefirst fin assemblies 31, with each also being sectorial, and including a plurality of stackedsecond fins 331. Anair channel 332 is defined between every two adjacentsecond fins 331. - Each of the
second fins 331 includes amain body 333 and anextension arm 334. Like theextension arm 314 of thefirst fin 311, theextension arm 334 of thesecond fin 331 also forms atop edge 347 at a top side thereof. Themain body 333 also includes aside edge 341 at an inner side thereof, aprotrusion 343 adjacent to theside edge 341, and a fixinghole 344 through theprotrusion 343. - The difference between the
second fin assemblies 33 and thefirst fin assemblies 31 is that themain body 333 of eachsecond fin 331 is substantially triangular, and thus defines acutout 348 at a lower side thereof. Themain body 333 defines afirst receiving hole 335 and asecond receiving hole 336 therein, aligning with thefirst receiving hole 315 and thesecond receiving hole 316, respectively. The first and second receiving holes 335, 336 each are semicircular, and exposed to and in communication with thecutout 348. All the first receivingholes 335 of thesecond fins 331 of eachsecond fin assembly 33 cooperatively form an arcuate first receivinggroove 345 for receiving thecondensation section 212 of one of thefirst heat pipes 21 therein. All the second receiving holes 336 of thesecond fins 331 of eachsecond fin assembly 33 cooperatively form asecond receiving groove 346 for receiving thecondensation section 232 of one of thesecond heat pipes 23 therein. All thecutouts 348 of thesecond fins 331 cooperatively form anopening 349 at a lower side of thesecond fin assembly 33, whereby thecondensation sections second heat pipes grooves 345 via theopening 349. - The
main body 333 extends afirst flange 337 perpendicularly around thefirst receiving hole 335. Thefirst flange 337 is semicircular, and has a height varied along a circumferential direction thereof. Referring toFIG. 6 , a height of thefirst flange 337 increases outwardly in a direction away from the center of theheat sink 30 of the heat dissipation apparatus. In this embodiment, afree end surface 338 of thefirst flange 337 is planar, and angles from themain body 333. Themain body 333 extends asecond flange 339 perpendicularly around thesecond receiving hole 336. Thesecond flange 339 has a structure similar to thefirst flange 337, which has a height increasing outwardly in a direction away form the center of theheat sink 30 of the heat dissipation apparatus. The first andsecond flanges main body 331 abut themain body 331 of a neighboringsecond fin 331. - Referring to
FIGS. 7 and 8 , during assembly of the heat dissipation apparatus, thefirst fin assemblies 31 are oriented face to face, and space from each other. Thecondensation sections 212 of the pair of thefirst heat pipes 21 are respectively inserted into the first receivinggrooves 325 of the pair offirst fin assemblies 31 along the anticlockwise direction, and attached to thefirst flanges 317 of thefirst fin assemblies 31 tightly. Thecondensation sections 232 of the pair of thesecond heat pipes 23 are respectively inserted into the second receivinggrooves 326 of thefirst fin assemblies 31 along the anticlockwise direction, and attached to thesecond flanges 319 of thefirst fin assemblies 31. A free end of eachcondensation section first fin assembly 31. Thefirst fin assemblies 31, and the first andsecond heat pipes base 10, with theevaporation sections second heat pipes base 10. - The
second fin assemblies 33 are inserted into spaces between thefirst fin assemblies 31 from top to bottom, respectively. The free end of thecondensation section 212 of eachfirst heat pipe 21 enters into and is received in thefirst receiving groove 345 through theopening 349 of a correspondingsecond fin assembly 33, and is attached to thefirst flanges 337 of the correspondingsecond fin assembly 33. The free end of thecondensation section 232 of eachsecond heat pipe 23 enters into and is received in thesecond receiving groove 346 through theopening 349 of a correspondingsecond fin assembly 33, and is attached to thesecond flanges 339 of the correspondingsecond fin assembly 33. Theadiabatic sections second heat pipe openings 349. At this time, thefirst fin assemblies 31 and thesecond fin assemblies 33 are alternate with each other, and cooperatively form theannular heat sink 30. - The heat
conductive core 40 is enclosed by themain bodies second fin assemblies conductive core 40 attaches to theevaporation sections second heat pipes second fin assemblies second fins second fin assemblies conductive core 40 in a radial pattern. Theextension arms second fin assemblies space 39 over the heatconductive core 40. Thefan 50 is received into thespace 39, and is supported by the first andsecond fin assemblies heat sink 30. - During operation of the heat dissipation apparatus, the
base 10 absorbs heat from the heat generating electronic component, which is transferred to theheat sink 30 via the heatconductive core 40 and theheat pipe assembly 20. Thefan 50 produces an airflow toward theheat sink 30, and dissipates heat from theheat sink 30 into ambient air. - In the heat dissipation apparatus, since the
heat sink 30 includes a pair offirst fin assemblies 31 and a pair ofsecond fin assemblies 33, theheat pipe assembly 20 can be assembled into the first andsecond fin assemblies second heat pipes - In addition, the height of each of the
first flanges second fin assemblies heat sink 30 of the heat dissipation apparatus, and the height of each of thesecond flanges second fin assemblies heat sink 30 of the heat dissipation apparatus, which conform with a varied distance between neighboringfins heat sink 30. Therefore, without enlarging the first and second receiving holes 315, 335, 316, 336 in the first andsecond fins condensation sections second heat pipes flanges flanges flanges condensation sections second heat pipes second flanges second fins second fins heat pipes - Furthermore, the
fan 50 is mounted in thespace 39 of theheat sink 30, and the impeller 52 is enclosed by theheat sink 30, which makes most of the cool airflow produced by thefan 50 flow through the first andsecond fins heat sink 30 enclosing thefan 50 severs as a sidewall of the typical fan, which saves material of thefan 50 and increases pressure of the airflow produced by thefan 50. - Moreover, the first and
second fins second fin assemblies conductive core 40 in a radial pattern. The airflow produced by thefan 50 is easily guided toward other heat generating electronic components around theheat sink 30 through theairflow channels second fins heat sink 30, but also dissipates heat from the heat generating electronic components around theheat sink 30. - It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN200810304213.8 | 2008-08-26 | ||
CN2008103042138A CN101662917B (en) | 2008-08-26 | 2008-08-26 | Radiating device |
Publications (1)
Publication Number | Publication Date |
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US20100051231A1 true US20100051231A1 (en) | 2010-03-04 |
Family
ID=41723593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/482,458 Abandoned US20100051231A1 (en) | 2008-08-26 | 2009-06-11 | Heat dissipation apparatus having a heat pipe inserted therein |
Country Status (2)
Country | Link |
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US (1) | US20100051231A1 (en) |
CN (1) | CN101662917B (en) |
Cited By (2)
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US20110079368A1 (en) * | 2009-10-06 | 2011-04-07 | Asia Vital Components Co., Ltd. | Fixing mount and thermal module thereof |
US20240098931A1 (en) * | 2022-09-16 | 2024-03-21 | Dell Products L.P. | Annular-shaped heat pipe |
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CN110459513A (en) * | 2019-09-16 | 2019-11-15 | 刘康 | A kind of tower cpu heat comprising plume |
CN110778974A (en) * | 2019-10-25 | 2020-02-11 | 江门市恒达铝业有限公司 | Automobile lamp heat radiation structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110079368A1 (en) * | 2009-10-06 | 2011-04-07 | Asia Vital Components Co., Ltd. | Fixing mount and thermal module thereof |
US20240098931A1 (en) * | 2022-09-16 | 2024-03-21 | Dell Products L.P. | Annular-shaped heat pipe |
Also Published As
Publication number | Publication date |
---|---|
CN101662917B (en) | 2012-11-21 |
CN101662917A (en) | 2010-03-03 |
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