US20090061756A1 - System and method for cooling electronic equipment - Google Patents
System and method for cooling electronic equipment Download PDFInfo
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- US20090061756A1 US20090061756A1 US12/228,494 US22849408A US2009061756A1 US 20090061756 A1 US20090061756 A1 US 20090061756A1 US 22849408 A US22849408 A US 22849408A US 2009061756 A1 US2009061756 A1 US 2009061756A1
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- electronic equipment
- cool air
- fan
- equipment enclosure
- fan speed
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- 238000000034 method Methods 0.000 title claims description 21
- 238000010792 warming Methods 0.000 claims description 8
- 230000007935 neutral effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims 3
- 230000000712 assembly Effects 0.000 abstract description 125
- 238000000429 assembly Methods 0.000 abstract description 125
- 238000010586 diagram Methods 0.000 description 18
- 238000004666 chemical force microscopy Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 7
- 238000012937 correction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/2059—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- the present disclosure generally relates to the field of electronic equipment, and more particularly to a system and method for cooling electronic equipment.
- Information handling system installations such as data centers, server farms, and telecommunications switching systems (generically referred to as data centers) generate a great deal of waste heat. This waste heat may need to be dissipated in order for the systems to continue operation.
- the capacity of such data centers continues to grow at a rapid pace to meet the demands of increasingly computerized societies.
- power density increases as well. Increased size and density leads to increased cooling requirements.
- a system for cooling electronic equipment may include one or more electronic equipment enclosures and one or more cool air sources.
- the one or more electronic equipment enclosures may receive cool air provided by the one or more cool air sources and direct the cool air across one or more electronic equipment components before returning warmed air to the one or more cool air sources utilizing a plurality of fan assemblies.
- the one or more cool air sources may re-cool the warmed air and re-circulate the cool air.
- the plurality of fan assemblies may each include a fan speed controlled to anywhere between 0% and 100% of the plurality of fan assemblies' rated capacity.
- a fan speed may be based on a temperature of the one or more electronic equipment enclosures, a temperature of the one or more warm air returns, a differential temperature between the one or more electronic equipment enclosures and the one or more warm air returns, a pressure of the one or more electronic equipment enclosures, a pressure of the one or more warm air returns, and/or a differential pressure between the one or more electronic equipment enclosures and an exterior of the one or more electronic equipment enclosures.
- the fan speed of the plurality of fan assemblies may be controlled to maintain a specific temperature, maintain a negative pressure, maintain a slightly negative pressure, maintain a neutral pressure, maintain a positive pressure, and/or maintain a slightly positive pressure. Maintaining a temperature or pressure may require the fan speed to increase or decrease revolutions per minute (RPM) to accommodate changes in airflow rates.
- the plurality of fan assemblies may be communicatively coupled. Each of the plurality of fan assemblies may be capable of independent operation but may receive the fan speed of the one or more other fan assemblies and adjust the fan speed in relation to the fan speed of the one or more other fan assemblies. Further, the plurality of fan assemblies may determine that the one or more other fan assemblies have failed or are operating improperly and may compensate for the one or more failed or improperly operating fan assemblies.
- a system for cooling electronic equipment may include one or more electronic equipment enclosures that may receive cool air provided by one or more cool air sources via one or more cool air supplies and direct the cool air across one or more electronic equipment components before returning warmed air to the one or more cool air sources via one or more warm air returns utilizing one or more fan assemblies.
- the one or more cool air sources may re-cool the warmed air and re-circulate the cool air.
- the one or more fan assemblies may each include a fan speed operable between 0% and 100% of the fan assembly's rated capacity based on a detected temperature and/or pressure.
- the fan speed of each fan of the plurality of fan assemblies may be controlled to maintain a specific temperature, maintain a negative pressure, maintain a slightly negative pressure, maintain a neutral pressure, maintain a positive pressure, and/or maintain a slightly positive pressure.
- the one or more cool air sources may determine the airflow for the one or more electronics equipment enclosures based on fan speed (which may be measured utilizing one or more tachometers of the one or more fan assemblies based upon a model type of the fan assembly) communicated by the one or more fan assemblies and may adjust the amount of cool air provided based on the airflow.
- the one or more cool air sources may provide a substantially sufficient amount of cool air required by the one or more electronics equipment enclosures, resulting in more efficient utilization of the one or more cool air sources.
- FIG. 1A is a diagram illustrating a system for cooling electronic equipment, in accordance with a first embodiment of the present disclosure
- FIG. 1B is a diagram illustrating a system for cooling electronic equipment, in accordance with a second embodiment of the present disclosure
- FIG. 1C is a diagram illustrating a system for cooling electronic equipment, in accordance with a third embodiment of the present disclosure
- FIG. 2 is a block diagram of the fan assembly illustrated in FIG. 1A , in accordance with an embodiment of the present disclosure
- FIG. 3 is a block diagram illustrating an example configuration of the controller of FIG. 2 , in accordance with an embodiment of the present disclosure
- FIG. 4A is a diagram illustrating an example configuration of a display of the fan assembly illustrated in FIG. 1A , in accordance with an embodiment of the present disclosure
- FIG. 4B is a diagram illustrating an example configuration of a display of the fan assembly illustrated in FIG. 1A , in accordance with an embodiment of the present disclosure
- FIG. 4C is a diagram illustrating an example configuration of a display of the fan assembly illustrated in FIG. 1A , in accordance with an embodiment of the present disclosure
- FIG. 4D is a diagram illustrating an example configuration of a display of the fan assembly illustrated in FIG. 1A , in accordance with an embodiment of the present disclosure
- FIG. 5 is a diagram illustrating a system for cooling electronic equipment, in accordance with an alternative embodiment of the present disclosure
- FIG. 6 is a diagram illustrating a system for cooling electronic equipment, in accordance with an alternative embodiment of the present disclosure
- FIG. 7 is a block diagram of the fan assembly illustrated in FIG. 6 , in accordance with an embodiment of the present disclosure.
- FIG. 8 is a block diagram illustrating an example configuration of the controller of FIG. 7 , in accordance with an embodiment of the present disclosure
- FIG. 9 is a block diagram illustrating an example configuration of the cool air source of FIG. 7 , in accordance with an embodiment of the present disclosure.
- FIG. 10 is a flow diagram illustrating a method for cooling electronic equipment, in accordance with an embodiment of the present disclosure.
- FIG. 11 is a flow diagram illustrating a method for cooling electronic equipment, in accordance with an embodiment of the present disclosure.
- FIG. 1A illustrates a system 100 for cooling electronic equipment, in accordance with an embodiment of the present disclosure.
- System 100 may include electronic equipment enclosure 101 and cool air source 102 .
- Cool air source may refer to any type of device that generates cool air, such as an air conditioning unit, and the like.
- the electronic equipment enclosure 101 may include one or more electronic equipment components 108 .
- the electronic equipment enclosure 101 may comprise an equipment cabinet for computing components such as a server rack.
- the electronic equipment enclosure 101 may receive cool air 104 provided by the cool air source 102 via cool air supply 103 . It is contemplated that cool air supply 103 may refer to any flow of cool air between a cool air source 102 and electronic equipment enclosure 101 .
- cool air supply 103 may refer to any flow of cool air between a cool air source 102 and electronic equipment enclosure 101 .
- cool air supply 103 may be implemented through the flow of cool air via ductwork between electronic equipment enclosure 101 and cool air source 102 .
- the electronic equipment enclosure 101 may direct the cool air 104 across the one or more electronic equipment components 108 , warming the cool air 104 and dissipating heat generated by the one or more electronic equipment components 108 .
- the electronic equipment enclosure 101 may then return the warmed air 105 to the cool air source 102 via warm air return 107 . It is contemplated that warm air return 107 to any flow of warm air between an electronic equipment enclosure 101 and cool air source 102 .
- warm air return 107 may be implemented through the flow of warm air through ductwork, or a full ceiling, the full ceiling representing a plenum for flow of air.
- the cool air source 102 may re-cool the warmed air 105 and re-circulate the cool air 104 .
- Fan assemblies 106 may be coupled to the warm air return 107 and/or the electronic equipment enclosure 101 .
- the fan assemblies 106 may be utilized to direct the warmed air 105 from the electronic equipment enclosure 101 to the cool air source 102 via the warm air return 107 .
- the electronic equipment enclosure 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the fan assemblies 106 , for detecting a pressure of the interior of the electronic equipment enclosure 101 .
- Pressure sensor 109 may be baffled to shield pressure sensor 109 from a specific air stream such as that from the one or more electronic equipment components 108 , for example.
- a pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the fan assemblies 106 , for detecting a pressure at the exterior of the electronic equipment enclosure 101 .
- Pressure sensor 110 may be baffled to shield pressure sensor 110 from a specific air stream such as that from the fan assemblies 106 , for example.
- the fan speed of each fan assembly 106 may be operable between 0% and 100% of a rated capacity of the fan model (for example, a W1G200 model fan (EC10) may have a rated capacity of 2750 RPM (revolutions per minute)) based on a temperature of the electronic equipment enclosure 101 , a temperature of the warm air return 107 , a differential temperature between the electronic equipment enclosure 101 and the warm air return 107 , a pressure of the electronic equipment enclosure 101 (detected utilizing pressure sensor 109 ), a pressure of the warm air return 107 (detected utilizing pressure sensor 110 ), and/or a differential pressure between the electronic equipment enclosure 101 and an exterior of the electronic equipment enclosure (detected utilizing pressure sensor 109 and pressure sensor 110 or, in alternatively, as illustrated in system 500 of FIG.
- a rated capacity of the fan model for example, a W1G200 model fan (EC10) may have a rated capacity of 2750 RPM (revolutions per minute)
- each fan assembly 106 may be controlled to maintain a specific temperature (including, but not limited to, 65 degrees Fahrenheit or fifteen degrees Celsius), maintain a negative pressure (such as negative 30 ounces-force per square inch), maintain a slightly negative pressure (such as negative 0.5 ounces-force per square inch), maintain a neutral pressure (where the system 100 is removing the same volume of air from the electronic equipment enclosure 101 as is being forced into the electronic equipment enclosure 101 ), maintain a positive pressure (such as 25 ounces-force per square inch), and/or maintain a slightly positive pressure (such as 1 ounce-force per square inch). Maintaining a temperature or pressure may require the fan speed to increase or decrease RPM to accommodate changes in airflow rates.
- a negative pressure such as negative 30 ounces-force per square inch
- a slightly negative pressure such as negative 0.5 ounces-force per square inch
- maintain a neutral pressure where the system 100 is removing the same volume of air from the electronic equipment enclosure 101 as is being forced into the electronic equipment enclosure 101
- maintain a positive pressure such
- the fan assemblies 106 may be directly and/or indirectly communicatively coupled.
- One or more of the fan assemblies 106 may communicate fan speed, fan model type, and/or status information to one or more other fan assemblies 106 .
- the status information may include one or more error conditions.
- Each of the fan assemblies 106 may be capable of independent operation. However, although the fan speed of each fan assembly may operate independently based on various temperatures and/or pressures, the one or more of the fan assemblies 106 may receive the fan speed and/or the fan model type of the one or more other fan assemblies 106 and adjust the fan speed based on the fan speed and/or the fan model type of the one or more other fan assemblies 106 .
- the one or more of the fan assemblies 106 may adjust the fan speed such that the fan speed substantially matches the fan speed of the one or more other fan assemblies 106 , the fan speed exceeds the fan speed of the one or more other fan assemblies 106 by a percentage (including, but not limited to 50% or 75%), and/or the fan speed of the one or more other fan assemblies 106 exceeds the fan speed by a percentage (including, but not limited to 25% or 45%). Further, the one or more fan assemblies 106 may determine that the one or more other fan assemblies 106 have failed or are operating improperly.
- the one or more fan assemblies 106 may determine that the one or more other fan assemblies 106 have failed or are operating improperly based on status information received from the one or more other fan assemblies 106 and/or based on a failure to receive status information from the one or more other fan assemblies 106 . If the one or more fan assemblies 106 determines that the one or more other fan assemblies 106 have failed or are operating improperly the one or more fan assemblies 106 may compensate for the one or more failed or improperly operating fan assemblies 106 .
- the one or more fan assemblies 106 may be operating at 40% capacity and may determine that one or more other fan assemblies 106 have failed (including, but not limited to, by receiving a failed status information from the one or more other fan assemblies 106 or failing to receive status information for the one or more other fan assemblies 106 ) and may increase the fan speed to 80% capacity to compensate for the one or more failed fan assemblies 106 .
- the fan assemblies 106 may control the fan speed based on various conditions, if the one or more of the fan assemblies 106 adjusts the fan speed based on the fan speed and/or the fan model of the one or more other fan assemblies 106 and/or to compensate for one or more failed and/or improperly operating other fan assemblies 106 , the condition may change and the fan assemblies 106 may control the fan speed in response to the changed condition. However, after a period of time the fan speed of the fan assemblies 106 may balance such that a specific temperature and/or a specific pressure as well as the relationship among the fan speeds of the fan assemblies 106 is maintained.
- System 100 may include electronic equipment enclosure 101 and cool air source 102 .
- the electronic equipment enclosure 101 may include one or more electronic equipment components 108 .
- the electronic equipment enclosure 101 may comprise an equipment cabinet for computing components such as a server rack.
- the electronic equipment enclosure 101 may receive cool air 104 provided by the cool air source 102 via cool air supply 103 .
- cool air supply 103 may be represented as a flow of air through a sub-floor or a raised floor of a data center, facility and the like.
- the electronic equipment enclosure 101 may direct the cool air 104 supplied by cool air source 102 across the one or more electronic equipment components 108 , warming the cool air 104 and dissipating heat generated by the one or more electronic equipment components 108 .
- the electronic equipment enclosure 101 may then return the warmed air 105 to the cool air source 102 .
- Warm air return may be implemented through a partial ceiling 112 which directs the flow of air from electronic equipment enclosure 101 and cool air source 102 .
- the cool air source 102 may re-cool the warmed air 105 and re-circulate the cool air 104 .
- Fan assemblies 106 may be utilized to direct the warmed air 105 from the electronic equipment enclosure 101 to the cool air source 102 through the partial ceiling 112 whereby warmed air 105 with higher velocities and volume may be substantially contained and moved, without the requirement of a full ceiling, to the cool air source 102 .
- the electronic equipment enclosure 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the fan assemblies 106 , for detecting an interior pressure of the electronic equipment enclosure 101 .
- Pressure sensor 109 may be baffled to shield pressure sensor 109 from a specific air stream such as that from the one or more electronic equipment components 108 , for example.
- a pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the fan assemblies 106 , for detecting a pressure at the exterior of the electronic equipment enclosure 101 .
- Pressure sensor 110 may be baffled to shield pressure sensor 110 from a specific air stream such as that from the fan assemblies 106 , for example.
- System 100 may include at least two electronic equipment enclosures 101 and cool air source 102 .
- Electronic equipment enclosures 101 may include one or more electronic equipment components 108 .
- Electronic equipment enclosures 101 may comprise an equipment cabinet for computing components such as a server rack.
- Electronic equipment enclosures 101 may receive cool air 104 provided by the cool air source 102 via cool air supply 103 .
- cool air supply 103 may be implemented as a flow of air through a sub-floor or a raised floor of a data center and the like.
- Electronic equipment enclosures 101 may direct the cool air 104 supplied by cool air source 102 across the one or more electronic equipment components 108 , warming the cool air 104 and dissipating heat generated by the one or more electronic equipment components 108 .
- Electronic equipment enclosures 101 may then return the warmed air 105 to the cool air source 102 .
- Warm air return may be implemented with a partial ceiling 112 .
- Partial ceiling 112 may run a width of space between the cool air source 102 and a first electronic equipment enclosure 101 .
- Partial ceiling 112 may run a width of space between a first electronic equipment enclosure and a second electronic equipment enclosure.
- Cool air source 102 may re-cool the warmed air 105 and re-circulate the cool air 104 .
- Fan assemblies 106 may be utilized to direct the warmed air 105 from the electronic equipment enclosure 101 to the cool air source 102 through the partial ceiling 112 whereby warmed air 105 with higher velocities and volume may be substantially contained and moved, without the requirement of a full ceiling, to the cool air source 102 .
- Warm air 105 with lower velocities and volume will have buoyancy effects to keep the warm air 105 substantially contained and move, without the requirement of a full ceiling, to the cool air source 102 .
- Electronic equipment enclosures 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the fan assemblies 106 , for detecting an interior pressure of the electronic equipment enclosures 101 .
- Pressure sensor 109 may be baffled to shield pressure sensor 109 from a specific air stream such as that from the one or more electronic equipment components 108 , for example.
- a pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the fan assemblies 106 , for detecting a pressure at the exterior of the electronic equipment enclosures 101 .
- Pressure sensor 110 may be baffled to shield pressure sensor 110 from a specific air stream such as that from the fan assemblies 106 , for example.
- a fan assembly 106 may include a fan and a controller.
- fan assembly 106 may comprise a chassis 201 , a controller 202 coupled to the chassis 201 , a motor 203 coupled to the chassis 201 and operatively coupled to the controller 202 , and an impeller 204 (or other fan blade) operably coupled to the motor 203 .
- the controller 202 may be operable to provide varying amounts of power to the motor 203 .
- the motor 203 may be operable to provide varying amounts of motive force to rotate the impeller 204 based on the varying amount of power provided by the controller 202 .
- the motor 203 may also include a tachometer for determining a fan speed by measuring the speed at which the impeller 204 rotates and may communicate the fan speed to the controller 202 . In this way, the controller 202 may control a fan speed of the fan assembly 106 .
- FIG. 3 illustrates an example configuration of controller 202 of fan assembly 106 as shown in FIG. 2 .
- the controller 202 may comprise a control module 301 and a power module 302 .
- the control module 301 may include a communication interconnect 304 for receiving a temperature of the electronic equipment enclosure 101 , receiving a temperature of the warm air return 107 , receiving the fan speed and/or the fan model type of one or more fan assemblies 106 , communicating a fan speed and/or the fan model type to one or more fan assemblies 106 , receiving a pressure of the electronic equipment enclosure 101 , receiving a pressure exterior to the electronic equipment enclosure 101 , receiving and/or querying status information of one or more fan assemblies 106 , and/or communicating status information to one or more fan assemblies 106 .
- the communication interconnect 304 may be communicatively coupled to a backplane of the electronic equipment enclosure 101 .
- the power module 302 may include a power interconnect 303 for receiving power to provide to motor 203 based on directions from the control module 301 .
- the power interconnect 303 may be operatively coupled to a backplane of the electronic equipment enclosure 101 .
- the controller 202 may include a temperature sensor 305 for detecting a temperature of electronic equipment enclosure 101 and/or the warm air return 107 .
- the control module 301 may be communicably connected to a display of fan assembly 106 .
- FIGS. 4A-4D illustrate example configurations of the display 401 A- 401 D of the fan assembly 106 .
- the display may include one or more indicators indicating the status of the fan assembly 106 including, but not limited to an indicator indicating whether the fan assembly 106 is operating properly, an indicator indicating whether the temperature detected by the temperature sensor 305 is within an acceptable limit, an indicator whether the capacity of the fan assembly 106 is within an acceptable limit, an indicator displaying the temperature detected by the temperature sensor 305 , an indicator displaying the percentage of the capacity of fan assembly 106 that the fan assembly 106 is operating, an indicator indicating an alarm condition, an indicator indicating a heat map of the electronics equipment enclosure 101 , and/or a indicator indicating temperature and/or heat trends detected within the electronics equipment enclosure 101 .
- the one or more indicators may be implemented utilizing any technology including, but not limited to a light emitting diode (LED), a liquid crystal display (LCD), a polymer light emitting diode (PLED), plasma, a cathode ray tube (CRT), liquid crystal on silicon (LCOS), an organic light emitting diode (OLED), high temperature polysilicon (HTPS), an active matrix OLED, a surface conductive electron emitting display (SED), and/or a digital light projection display (DLP).
- the display 401 A- 401 D may be positioned within the fan assembly 106 (such as on an exterior surface of fan assembly 106 ) to facilitate reading. For example, in FIG. 4D , display 401 D is mounted to a panel 402 D at an angle A such that the display 401 D can be easily read when the fan assembly 106 is associated with the electronics equipment enclosure 101 .
- FIG. 6 illustrates a system 600 for cooling electronic equipment, in accordance with an alternative embodiment of the present disclosure.
- System 600 may include electronic equipment enclosure 101 and cool air source 102 .
- the electronic equipment enclosure 101 may include one or more electronic equipment components 108 .
- the electronic equipment enclosure 101 may comprise an equipment cabinet for computing components such as a server rack.
- the electronic equipment enclosure 101 may receive cool air 103 provided by the cool air source 102 via cool air supply 111 .
- cool air supply may be implemented through a contained space, such as a data center, facility and the like.
- the electronic equipment enclosure 101 may direct the cool air 103 across the one or more electronic equipment components 808 , warming the cool air 103 and dissipating heat generated by the one or more electronic equipment components 108 .
- the electronic equipment enclosure 101 may then return the warmed air 105 to the cool air source 102 via warm air return 107 .
- System 600 of FIG. 6 may include a warm air return 107 implemented in the form of ductwork or a full ceiling for control of the flow of warm air from an electronic equipment enclosure 101 to the cool air source 102 .
- the cool air source 102 may re-cool the warmed air 105 and re-circulate the cool air 103 .
- One or more fan assemblies 106 may be coupled to the warm air return 107 and/or the electronic equipment enclosure 101 .
- the one or more fan assemblies 106 may be utilized to direct the warmed air 105 from the electronic equipment enclosure 101 to the cool air source 102 via the warm air return 107 .
- the electronic equipment enclosure 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the one or more fan assemblies 106 , for detecting a pressure of the electronic equipment enclosure 101 .
- Pressure sensor 109 may be baffled to shield pressure sensor 109 from a specific air stream such as that from the one or more electronic equipment components 108 , for example.
- a pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device) may be communicatively coupled to the fan assemblies 106 , for detecting a pressure exterior to the electronic equipment enclosure.
- Pressure sensor 110 may be baffled to shield pressure sensor 110 from a specific air stream such as that from the fan assemblies 106 , for example.
- the one or more fan assemblies 106 may include a flow rate sensor (not shown) for detecting a differential pressure between electronics equipment enclosure 101 and a pressure exterior to the electronic equipment enclosure.
- the one or more fan assemblies 106 may each include a fan speed and/or a fan model type.
- the fan speed of the one or more fan assemblies 106 may be controlled to anywhere between 0% and 100% of a rated capacity (for example, a W1G250 model type fan (EC20) may have a rated capacity of 2750 RPM) based on a temperature of the electronic equipment enclosure 101 , a temperature of the warm air return 107 , a differential temperature between the electronic equipment enclosure 101 and the warm air return 107 , a pressure of the electronic equipment enclosure 101 , a pressure of the warm air return 107 , and/or a differential pressure between the electronic equipment enclosure 101 and a pressure exterior to the electronic equipment enclosure.
- a rated capacity for example, a W1G250 model type fan (EC20) may have a rated capacity of 2750 RPM
- the fan speed of the one or more fan assemblies 106 may be controlled to maintain a specific temperature (including, but not limited to, 65 degrees Fahrenheit or fifteen degrees Celsius), maintain a negative pressure (such as negative 30 ounces-force per square inch), maintain a slightly negative pressure (such as negative 0.5 ounces-force per square inch), maintain a neutral pressure (where the system 600 is removing the same volume of air from the electronic equipment enclosure 101 as is being forced into the electronic equipment enclosure 101 ), maintain a positive pressure (such as 25 ounces-force per square inch), and/or maintain a slightly positive pressure (such as 1 ounce-force per square inch). Maintaining a temperature or pressure may require the fan speed to increase or decrease revolutions per minute (RPM) to accommodate changes in airflow rates.
- RPM revolutions per minute
- the one or more fan assemblies 106 may be communicatively coupled to the cool air source 102 and may communicate the fan speed and/or the fan model type to the cool air source 102 . As the one or more fan assemblies 106 adjust their fan speed to maintain a specific temperature and/or pressure of the electronics equipment enclosure 101 and/or the warm air return 107 , the appropriate airflow for the electronics equipment enclosure 101 may be determined based on the fan speed and/or the fan model type.
- the cool air source 102 may determine the airflow for the electronics equipment enclosure 101 based on the fan speed and/or the fan model type. As the appropriate airflow for the electronics equipment enclosure 101 is then known, the amount of cool air 103 required by the electronics equipment enclosure 101 may then be determined.
- the cool air source 102 may adjust the amount of cool air 103 provided to the electronics equipment enclosure 101 via the cool air supply 111 based on the airflow for the electronics equipment enclosure 101 .
- the cool air source 102 provides substantially the exact amount of cool air 103 via cool air supply 111 required by the electronics equipment enclosure 101 , resulting in more efficient utilization of cool air source 102 .
- the cool air source 102 may thus not provide more cool air 103 to the electronics equipment enclosure 101 via the cool air supply 111 than is required by the electronics equipment enclosure 101 , avoiding excess utilization of the cool air source 102 .
- the cool air source 102 may thus not provide less cool air 103 to the electronics equipment enclosure 101 via the cool air supply 111 than is required by the electronics equipment enclosure 101 , avoiding excess utilization of the fan assemblies 106 .
- multiple cool air sources 102 and multiple electronic equipment enclosures 101 may be implemented. It is contemplated that multiple cool air sources 102 may cool multiple electronic equipment enclosures through a common cool air supply 103 and common warm air return 107 . Additionally, in an alternative embodiment multiple cool air supplies 103 (such as five or seven), multiple warm air returns 107 (such as two or eight), and/or other numbers of fan assemblies 106 (such as four or twenty-five) may be utilized without departing from the scope of the present disclosure.
- the one or more fan assemblies 606 may comprise a chassis 701 , a controller 702 coupled to the chassis 701 , a motor 703 coupled to the chassis 701 and operatively coupled to the controller 702 , and an impeller 704 (or other fan blade) operably coupled to the motor 703 .
- the controller 702 may be operable to provide varying amounts of power to the motor 703 .
- the motor 703 may be operable to provide varying amounts of motive force to rotate the impeller 704 based on the varying amount of power provided by the controller 702 .
- the motor 703 may also include a tachometer 705 for determining a fan speed by measuring the speed at which the impeller 704 rotates and may communicate the fan speed and/or a fan model type to the controller 702 . In this way, the controller 702 may control a fan speed of the one or more fan assemblies 606 .
- FIG. 8 illustrates an example configuration of controller 702 .
- the controller 702 may comprise a control module 801 and a power module 802 .
- the control module 801 may include a communication interconnect 804 for receiving a temperature of the electronic equipment enclosure 101 , receiving a temperature of the warm air return 107 , receiving the fan speed, potentially through a tachometer 705 , and/or fan model type of one or more fan assemblies 106 , communicating a fan speed and/or a fan model type to one or more fan assemblies 106 and/or to the cool air source 102 , receiving a pressure of the electronics equipment enclosure 101 , receiving a pressure of an exterior to the electronic equipment enclosure 101 , receiving and/or querying status information of one or more fan assemblies 106 , and/or communicating status information to one or more fan assemblies 106 .
- the communication interconnect 804 may be communicatively coupled to a backplane of the electronic equipment enclosure 101 and/or the cool air source 102 .
- the power module 802 may include a power interconnect 803 for receiving power to provide to motor 703 based on directions from the control module 801 .
- the power interconnect 803 may be operatively coupled to a backplane of the electronic equipment enclosure 101 .
- the control module 801 may be communicably connected to a display 806 of the one or more fan assemblies 106 .
- FIG. 9 illustrates an example configuration of cool air source 102 .
- cool air source 102 may include a control module 901 , a power module 902 communicatively coupled to the control module 901 , and a cooling unit 903 operatively coupled to the power module 902 .
- the control module 901 may include a communication interconnect 904 , communicatively coupled to the one or more fan assemblies, for receiving the fan speed and/or the fan model type of the one or more fan assemblies.
- the control module 901 may determine the airflow for the electronics equipment enclosure 101 based on the fan speed and/or the fan model type.
- the power module 902 may include a power interconnect 905 for receiving power to provide to cooling unit 903 based on directions from the control module 901 .
- the cooling unit 903 may provide a variable amount of cool air 103 between 0% and 100% of the capacity of the cooling unit 903 for the cool air source 102 to provide to the electronics equipment enclosure 101 utilizing the power provided by the power module 902 based on directions from the control module 901 .
- the control module 901 may adjust the amount of cool air 103 that the cool air source 102 provides to the electronics equipment enclosure 101 based on the airflow for the electronics equipment enclosure 101 .
- the one or more fan assemblies 106 may comprise two fan assemblies and the control module 901 may receive the fan speed and the fan model types of the two fan assemblies 106 via communication interconnect 904 .
- the control module 901 may receive that the fan model type of the two fan assemblies 106 is W1G200 (EC10) and that the fan speed of the two fan assemblies 106 is 2000 RPM.
- the control module 901 may determine airflows for the two fan assemblies 106 based on the fan model type and fan speed.
- the control module 901 may be operable to determine that W1G200 (EC10) model type fans are rated to move 591.5 CFM (cubic feet per minute) at 2750 RPM.
- the control module 901 may determine airflow
- the control module 901 may determine that the aggregate airflow of the fan assemblies 106 is 860.36 CFM.
- System 100 may include system impedances and turbulence that may modify the airflow for the fan assemblies 106 .
- System 100 may include system impedances and turbulence such that if the fan speed of fan assemblies were 2750 RPM, their actual airflow within system 100 may be 1100 CFM.
- the control module 901 may apply a correction to the airflow determined based on the fan model type and speed to account for the system impedances and turbulence.
- the corrected airflow at 2000 RPM may comprise 860.36 CFM*0.93 or 800.1348 CFM.
- the appropriate airflow for the electronics equipment enclosure 101 may be approximately equal to the corrected airflow of the two fan assemblies 106 .
- the control module 901 may adjust the amount of cool air 103 that the cool air source 102 provides to the electronics equipment enclosure 101 via the cool air supply to approximately equal 800.1348 CFM.
- the one or more fan assemblies 106 may comprise two fan assemblies and the control module 901 may receive the fan speed and the fan model types of the two fan assemblies 106 via communication interconnect 904 .
- the control module 901 may receive that the fan model type of the two fan assemblies 106 is W1G250 (EC20) and that the fan speed of the two fan assemblies 106 is 2500 RPM.
- the control module 901 may determine airflows for the two fan assemblies 106 based on the fan model type and fan speed.
- the control module 901 may be operable to determine that W1G250 (EC20) model type fans are rated to move 1130.1 CFM (cubic feet per minute) at 2750 RPM.
- the control module 901 may be operable to determine that W1G250 (EC20) model type fans are rated to move 1130.1 CFM (cubic feet per minute) at 2750 RPM by looking up this information in a table storing information about the CFM/RPM ratings of different fan model types.
- the control module 901 may determine airflows for the two fan assemblies 106 by consulting a table that correlates different CFMs to different RPMs for the W1G250 (EC20) model type fan.
- the table correlating different CFMs to different RPMs for the W1G250 (EC20) model type fan may have been created by testing the W1G250 (EC20) model type fan on a test bench and measuring different airflow rates at different RPMs.
- the control module 901 may determine airflows for the two fan assemblies 106 is 1027.36 CFM at 2500 RPM by consulting the table that correlates different CFMs to different RPMs for the W1G250 (EC20) model type fan.
- the control module 901 may aggregate the airflow of the two fan assemblies to determine the amount of cool air to provide. Thus, as the airflow for each fan assembly 106 is 1027.36 CFM, the control module 901 may determine that the aggregate airflow of the fan assemblies 106 is 2054.72 CFM.
- System 100 may include system impedances and turbulence that may modify the airflow for the fan assemblies 106 .
- System 100 may include system impedances and turbulence such that if the fan speed of fan assemblies were 2750 RPM, their actual airflow within system 100 may be 2000 CFM.
- the control module 901 may apply a correction to the airflow determined based on the fan model type and speed to account for the system impedances and turbulence.
- the corrected airflow at 2000 RPM may comprise 2054.72 CFM*0.884 or 1816.37 CFM.
- the appropriate airflow for the electronics equipment enclosure 101 may approximately equal the corrected airflow of the two fan assemblies 106 .
- the control module 901 may adjust the amount of cool air 103 that the cool air source 102 provides to the electronics equipment enclosure 101 via the cool air supply to approximately equal 1816.37 CFM.
- one or more cool air sources 102 may determine the aggregate airflow of one or more electronic equipment enclosures 101 and may provide the amount of cool air 103 required by one or more electronic equipment enclosures 101 based on the aggregate airflow of the one or more electronic equipment enclosures 101 without departing from the scope of the present disclosure.
- FIG. 10 illustrates a method 1001 for cooling electronic equipment, in accordance with an embodiment of the present disclosure.
- step 1001 cool an electronic equipment enclosure by receiving cool air from a cool air source, warming the cool air by directing the cool air across at least one electronic equipment component, and returning the warmed air to the cool air source via a warm air return.
- step 1002 control a fan speed of a first fan assembly and an additional fan speed of at least one additional fan assembly, the first fan assembly and the at least one additional fan assembly directing the warmed air from the electronic equipment enclosure to the warm air return.
- Controlling the fan speed of the first fan assembly and the additional fan speed of the at least one additional fan assembly may comprise controlling the fan speed and the additional fan speed based on at least one of an electronic equipment enclosure temperature, a warm air return temperature, or a detected pressure differential between an interior electronic equipment enclosure pressure and a pressure exterior to the electronic equipment enclosure.
- adjust the fan speed in relation to the additional fan speed may comprise adjusting the fan speed in relation to the additional fan speed so that the fan speed substantially matches the additional fan speed.
- FIG. 11 illustrates a method 1101 for cooling electronic equipment, in accordance with an embodiment of the present disclosure.
- step 1101 cool at least one electronic equipment enclosure by receiving cool air provided by at least one cool air source, warming the cool air by directing the cool air across at least one electronic equipment component, and returning the warmed air to the at least one cool air source via a warm air return.
- step 1102 control at least one fan speed of at least one fan assembly based on a detected pressure differential between an electronic equipment enclosure pressure and a warm air return pressure, the at least one fan assembly coupled to the at least one warm air return.
- Controlling at least one fan speed of at least one fan assembly based on a detected pressure differential between an interior electronic equipment enclosure pressure and an exterior electronic equipment enclosure pressure may comprise controlling the at least one fan speed of the at least one fan assembly to maintain at least one of a negative pressure, a positive pressure, and/or a negative pressure.
- determine an airflow of the at least one electronic equipment enclosure may comprise determining the at least one fan speed utilizing a tachometer of the at least one fan assembly and communicating the at least one fan speed and the model type of the at least one fan assembly to the at least one cool air source.
- adjust an amount of the cool air provided by the at least one cool air source may be based on the airflow of the at least one electronic equipment enclosure.
- the at least one electronic equipment enclosure may comprise a plurality of electronic equipment enclosures and adjusting the amount of the cool air provided by the at least one cool air source may be based on the airflow of the at least one electronic equipment enclosure may comprise adjusting the amount of the cool air provided by the at least one cool air source based on the airflow of the plurality of electronic equipment enclosures.
- the at least one cool air source may comprise a plurality of cool air sources and adjusting the amount of the cool air provided by the at least one cool air source based on the airflow of the at least one electronic equipment enclosure may comprise adjusting the amount of the cool air provided by the plurality of cool air sources based on the airflow of the at least one electronic equipment enclosure.
- the methods disclosed may be implemented as sets of instructions or software readable by a device. Further, it is understood that the specific order or hierarchy of steps in the methods disclosed are examples of exemplary approaches. Based upon design preferences, it is understood that the specific order or hierarchy of steps in the method can be rearranged while remaining within the disclosed subject matter.
- the accompanying method claims present elements of the various steps in a sample order, and are not necessarily meant to be limited to the specific order or hierarchy presented.
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Abstract
Description
- The present application claims priority under 35 U.S.C. §120 to U.S. patent application Ser. No. 11/897,304, filed Aug. 30, 2007, entitled “System and Method for Cooling Electronic Equipment,” which is incorporated herein by reference.
- The present disclosure generally relates to the field of electronic equipment, and more particularly to a system and method for cooling electronic equipment.
- Information handling system installations, such as data centers, server farms, and telecommunications switching systems (generically referred to as data centers) generate a great deal of waste heat. This waste heat may need to be dissipated in order for the systems to continue operation. The capacity of such data centers continues to grow at a rapid pace to meet the demands of increasingly computerized societies. In addition to the increase in these installations of computing capacity and overall volume, power density increases as well. Increased size and density leads to increased cooling requirements.
- A system for cooling electronic equipment may include one or more electronic equipment enclosures and one or more cool air sources. The one or more electronic equipment enclosures may receive cool air provided by the one or more cool air sources and direct the cool air across one or more electronic equipment components before returning warmed air to the one or more cool air sources utilizing a plurality of fan assemblies. The one or more cool air sources may re-cool the warmed air and re-circulate the cool air.
- The plurality of fan assemblies may each include a fan speed controlled to anywhere between 0% and 100% of the plurality of fan assemblies' rated capacity. A fan speed may be based on a temperature of the one or more electronic equipment enclosures, a temperature of the one or more warm air returns, a differential temperature between the one or more electronic equipment enclosures and the one or more warm air returns, a pressure of the one or more electronic equipment enclosures, a pressure of the one or more warm air returns, and/or a differential pressure between the one or more electronic equipment enclosures and an exterior of the one or more electronic equipment enclosures. The fan speed of the plurality of fan assemblies may be controlled to maintain a specific temperature, maintain a negative pressure, maintain a slightly negative pressure, maintain a neutral pressure, maintain a positive pressure, and/or maintain a slightly positive pressure. Maintaining a temperature or pressure may require the fan speed to increase or decrease revolutions per minute (RPM) to accommodate changes in airflow rates. The plurality of fan assemblies may be communicatively coupled. Each of the plurality of fan assemblies may be capable of independent operation but may receive the fan speed of the one or more other fan assemblies and adjust the fan speed in relation to the fan speed of the one or more other fan assemblies. Further, the plurality of fan assemblies may determine that the one or more other fan assemblies have failed or are operating improperly and may compensate for the one or more failed or improperly operating fan assemblies.
- In an alternative embodiment, a system for cooling electronic equipment may include one or more electronic equipment enclosures that may receive cool air provided by one or more cool air sources via one or more cool air supplies and direct the cool air across one or more electronic equipment components before returning warmed air to the one or more cool air sources via one or more warm air returns utilizing one or more fan assemblies. The one or more cool air sources may re-cool the warmed air and re-circulate the cool air. The one or more fan assemblies may each include a fan speed operable between 0% and 100% of the fan assembly's rated capacity based on a detected temperature and/or pressure. The fan speed of each fan of the plurality of fan assemblies may be controlled to maintain a specific temperature, maintain a negative pressure, maintain a slightly negative pressure, maintain a neutral pressure, maintain a positive pressure, and/or maintain a slightly positive pressure.
- The one or more cool air sources may determine the airflow for the one or more electronics equipment enclosures based on fan speed (which may be measured utilizing one or more tachometers of the one or more fan assemblies based upon a model type of the fan assembly) communicated by the one or more fan assemblies and may adjust the amount of cool air provided based on the airflow. Thus, the one or more cool air sources may provide a substantially sufficient amount of cool air required by the one or more electronics equipment enclosures, resulting in more efficient utilization of the one or more cool air sources.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not necessarily restrictive of the present disclosure. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate subject matter of the disclosure. Together, the descriptions and the drawings serve to explain the principles of the disclosure.
- The numerous advantages of the disclosure may be better understood by those skilled in the art by reference to the accompanying figures in which:
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FIG. 1A is a diagram illustrating a system for cooling electronic equipment, in accordance with a first embodiment of the present disclosure; -
FIG. 1B is a diagram illustrating a system for cooling electronic equipment, in accordance with a second embodiment of the present disclosure; -
FIG. 1C is a diagram illustrating a system for cooling electronic equipment, in accordance with a third embodiment of the present disclosure; -
FIG. 2 is a block diagram of the fan assembly illustrated inFIG. 1A , in accordance with an embodiment of the present disclosure; -
FIG. 3 is a block diagram illustrating an example configuration of the controller ofFIG. 2 , in accordance with an embodiment of the present disclosure; -
FIG. 4A is a diagram illustrating an example configuration of a display of the fan assembly illustrated inFIG. 1A , in accordance with an embodiment of the present disclosure; -
FIG. 4B is a diagram illustrating an example configuration of a display of the fan assembly illustrated inFIG. 1A , in accordance with an embodiment of the present disclosure; -
FIG. 4C is a diagram illustrating an example configuration of a display of the fan assembly illustrated inFIG. 1A , in accordance with an embodiment of the present disclosure; -
FIG. 4D is a diagram illustrating an example configuration of a display of the fan assembly illustrated inFIG. 1A , in accordance with an embodiment of the present disclosure; -
FIG. 5 is a diagram illustrating a system for cooling electronic equipment, in accordance with an alternative embodiment of the present disclosure; -
FIG. 6 is a diagram illustrating a system for cooling electronic equipment, in accordance with an alternative embodiment of the present disclosure; -
FIG. 7 is a block diagram of the fan assembly illustrated inFIG. 6 , in accordance with an embodiment of the present disclosure; -
FIG. 8 is a block diagram illustrating an example configuration of the controller ofFIG. 7 , in accordance with an embodiment of the present disclosure; -
FIG. 9 is a block diagram illustrating an example configuration of the cool air source ofFIG. 7 , in accordance with an embodiment of the present disclosure; -
FIG. 10 is a flow diagram illustrating a method for cooling electronic equipment, in accordance with an embodiment of the present disclosure; and -
FIG. 11 is a flow diagram illustrating a method for cooling electronic equipment, in accordance with an embodiment of the present disclosure. - Reference will now be made in detail to the subject matter disclosed, which is illustrated in the accompanying drawings.
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FIG. 1A illustrates a system 100 for cooling electronic equipment, in accordance with an embodiment of the present disclosure. System 100 may includeelectronic equipment enclosure 101 andcool air source 102. Cool air source may refer to any type of device that generates cool air, such as an air conditioning unit, and the like. Theelectronic equipment enclosure 101 may include one or moreelectronic equipment components 108. Theelectronic equipment enclosure 101 may comprise an equipment cabinet for computing components such as a server rack. Theelectronic equipment enclosure 101 may receivecool air 104 provided by thecool air source 102 viacool air supply 103. It is contemplated thatcool air supply 103 may refer to any flow of cool air between acool air source 102 andelectronic equipment enclosure 101. InFIG. 1A ,cool air supply 103 may be implemented through the flow of cool air via ductwork betweenelectronic equipment enclosure 101 andcool air source 102. Theelectronic equipment enclosure 101 may direct thecool air 104 across the one or moreelectronic equipment components 108, warming thecool air 104 and dissipating heat generated by the one or moreelectronic equipment components 108. Theelectronic equipment enclosure 101 may then return the warmedair 105 to thecool air source 102 viawarm air return 107. It is contemplated thatwarm air return 107 to any flow of warm air between anelectronic equipment enclosure 101 andcool air source 102. InFIG. 1A ,warm air return 107 may be implemented through the flow of warm air through ductwork, or a full ceiling, the full ceiling representing a plenum for flow of air. - The
cool air source 102 may re-cool the warmedair 105 and re-circulate thecool air 104.Fan assemblies 106 may be coupled to thewarm air return 107 and/or theelectronic equipment enclosure 101. Thefan assemblies 106 may be utilized to direct the warmedair 105 from theelectronic equipment enclosure 101 to thecool air source 102 via thewarm air return 107. Theelectronic equipment enclosure 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to thefan assemblies 106, for detecting a pressure of the interior of theelectronic equipment enclosure 101.Pressure sensor 109 may be baffled to shieldpressure sensor 109 from a specific air stream such as that from the one or moreelectronic equipment components 108, for example. A pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to thefan assemblies 106, for detecting a pressure at the exterior of theelectronic equipment enclosure 101.Pressure sensor 110 may be baffled to shieldpressure sensor 110 from a specific air stream such as that from thefan assemblies 106, for example. - The fan speed of each
fan assembly 106 may be operable between 0% and 100% of a rated capacity of the fan model (for example, a W1G200 model fan (EC10) may have a rated capacity of 2750 RPM (revolutions per minute)) based on a temperature of theelectronic equipment enclosure 101, a temperature of thewarm air return 107, a differential temperature between theelectronic equipment enclosure 101 and thewarm air return 107, a pressure of the electronic equipment enclosure 101 (detected utilizing pressure sensor 109), a pressure of the warm air return 107 (detected utilizing pressure sensor 110), and/or a differential pressure between theelectronic equipment enclosure 101 and an exterior of the electronic equipment enclosure (detected utilizingpressure sensor 109 andpressure sensor 110 or, in alternatively, as illustrated insystem 500 ofFIG. 5 , utilizingair flow sensor 109 which may be placed in proximity of fan assembly 106). The fan speed of eachfan assembly 106 may be controlled to maintain a specific temperature (including, but not limited to, 65 degrees Fahrenheit or fifteen degrees Celsius), maintain a negative pressure (such as negative 30 ounces-force per square inch), maintain a slightly negative pressure (such as negative 0.5 ounces-force per square inch), maintain a neutral pressure (where the system 100 is removing the same volume of air from theelectronic equipment enclosure 101 as is being forced into the electronic equipment enclosure 101), maintain a positive pressure (such as 25 ounces-force per square inch), and/or maintain a slightly positive pressure (such as 1 ounce-force per square inch). Maintaining a temperature or pressure may require the fan speed to increase or decrease RPM to accommodate changes in airflow rates. - The
fan assemblies 106 may be directly and/or indirectly communicatively coupled. One or more of thefan assemblies 106 may communicate fan speed, fan model type, and/or status information to one or moreother fan assemblies 106. The status information may include one or more error conditions. Each of thefan assemblies 106 may be capable of independent operation. However, although the fan speed of each fan assembly may operate independently based on various temperatures and/or pressures, the one or more of thefan assemblies 106 may receive the fan speed and/or the fan model type of the one or moreother fan assemblies 106 and adjust the fan speed based on the fan speed and/or the fan model type of the one or moreother fan assemblies 106. The one or more of thefan assemblies 106 may adjust the fan speed such that the fan speed substantially matches the fan speed of the one or moreother fan assemblies 106, the fan speed exceeds the fan speed of the one or moreother fan assemblies 106 by a percentage (including, but not limited to 50% or 75%), and/or the fan speed of the one or moreother fan assemblies 106 exceeds the fan speed by a percentage (including, but not limited to 25% or 45%). Further, the one ormore fan assemblies 106 may determine that the one or moreother fan assemblies 106 have failed or are operating improperly. The one ormore fan assemblies 106 may determine that the one or moreother fan assemblies 106 have failed or are operating improperly based on status information received from the one or moreother fan assemblies 106 and/or based on a failure to receive status information from the one or moreother fan assemblies 106. If the one ormore fan assemblies 106 determines that the one or moreother fan assemblies 106 have failed or are operating improperly the one ormore fan assemblies 106 may compensate for the one or more failed or improperly operatingfan assemblies 106. For example, the one ormore fan assemblies 106 may be operating at 40% capacity and may determine that one or moreother fan assemblies 106 have failed (including, but not limited to, by receiving a failed status information from the one or moreother fan assemblies 106 or failing to receive status information for the one or more other fan assemblies 106) and may increase the fan speed to 80% capacity to compensate for the one or more failedfan assemblies 106. As thefan assemblies 106 may control the fan speed based on various conditions, if the one or more of thefan assemblies 106 adjusts the fan speed based on the fan speed and/or the fan model of the one or moreother fan assemblies 106 and/or to compensate for one or more failed and/or improperly operatingother fan assemblies 106, the condition may change and thefan assemblies 106 may control the fan speed in response to the changed condition. However, after a period of time the fan speed of thefan assemblies 106 may balance such that a specific temperature and/or a specific pressure as well as the relationship among the fan speeds of thefan assemblies 106 is maintained. - Referring to
FIG. 1B , a diagram illustrating a system for cooling electronic equipment in accordance with an embodiment of the present disclosure is shown. System 100 may includeelectronic equipment enclosure 101 andcool air source 102. Theelectronic equipment enclosure 101 may include one or moreelectronic equipment components 108. Theelectronic equipment enclosure 101 may comprise an equipment cabinet for computing components such as a server rack. Theelectronic equipment enclosure 101 may receivecool air 104 provided by thecool air source 102 viacool air supply 103. InFIG. 1B ,cool air supply 103 may be represented as a flow of air through a sub-floor or a raised floor of a data center, facility and the like. Theelectronic equipment enclosure 101 may direct thecool air 104 supplied bycool air source 102 across the one or moreelectronic equipment components 108, warming thecool air 104 and dissipating heat generated by the one or moreelectronic equipment components 108. - The
electronic equipment enclosure 101 may then return the warmedair 105 to thecool air source 102. Warm air return may be implemented through apartial ceiling 112 which directs the flow of air fromelectronic equipment enclosure 101 andcool air source 102. Thecool air source 102 may re-cool the warmedair 105 and re-circulate thecool air 104.Fan assemblies 106 may be utilized to direct the warmedair 105 from theelectronic equipment enclosure 101 to thecool air source 102 through thepartial ceiling 112 whereby warmedair 105 with higher velocities and volume may be substantially contained and moved, without the requirement of a full ceiling, to thecool air source 102.Warm air 105 with lower velocities and volume will have buoyancy effects to keep thewarm air 105 substantially contained and move, without the requirement of a full ceiling, to thecool air source 102. Theelectronic equipment enclosure 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to thefan assemblies 106, for detecting an interior pressure of theelectronic equipment enclosure 101.Pressure sensor 109 may be baffled to shieldpressure sensor 109 from a specific air stream such as that from the one or moreelectronic equipment components 108, for example. A pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to thefan assemblies 106, for detecting a pressure at the exterior of theelectronic equipment enclosure 101.Pressure sensor 110 may be baffled to shieldpressure sensor 110 from a specific air stream such as that from thefan assemblies 106, for example. - Referring to
FIG. 1C , a diagram illustrating a system 100 for cooling electronic equipment, in accordance with a third embodiment of the present disclosure is shown. System 100 may include at least twoelectronic equipment enclosures 101 andcool air source 102.Electronic equipment enclosures 101 may include one or moreelectronic equipment components 108.Electronic equipment enclosures 101 may comprise an equipment cabinet for computing components such as a server rack.Electronic equipment enclosures 101 may receivecool air 104 provided by thecool air source 102 viacool air supply 103. InFIG. 1C ,cool air supply 103 may be implemented as a flow of air through a sub-floor or a raised floor of a data center and the like.Electronic equipment enclosures 101 may direct thecool air 104 supplied bycool air source 102 across the one or moreelectronic equipment components 108, warming thecool air 104 and dissipating heat generated by the one or moreelectronic equipment components 108. -
Electronic equipment enclosures 101 may then return the warmedair 105 to thecool air source 102. Warm air return may be implemented with apartial ceiling 112.Partial ceiling 112 may run a width of space between thecool air source 102 and a firstelectronic equipment enclosure 101.Partial ceiling 112 may run a width of space between a first electronic equipment enclosure and a second electronic equipment enclosure.Cool air source 102 may re-cool the warmedair 105 and re-circulate thecool air 104.Fan assemblies 106 may be utilized to direct the warmedair 105 from theelectronic equipment enclosure 101 to thecool air source 102 through thepartial ceiling 112 whereby warmedair 105 with higher velocities and volume may be substantially contained and moved, without the requirement of a full ceiling, to thecool air source 102.Warm air 105 with lower velocities and volume will have buoyancy effects to keep thewarm air 105 substantially contained and move, without the requirement of a full ceiling, to thecool air source 102.Electronic equipment enclosures 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to thefan assemblies 106, for detecting an interior pressure of theelectronic equipment enclosures 101.Pressure sensor 109 may be baffled to shieldpressure sensor 109 from a specific air stream such as that from the one or moreelectronic equipment components 108, for example. A pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to thefan assemblies 106, for detecting a pressure at the exterior of theelectronic equipment enclosures 101.Pressure sensor 110 may be baffled to shieldpressure sensor 110 from a specific air stream such as that from thefan assemblies 106, for example. - As illustrated in
FIG. 2 , afan assembly 106 may include a fan and a controller. For example,fan assembly 106 may comprise achassis 201, acontroller 202 coupled to thechassis 201, amotor 203 coupled to thechassis 201 and operatively coupled to thecontroller 202, and an impeller 204 (or other fan blade) operably coupled to themotor 203. Thecontroller 202 may be operable to provide varying amounts of power to themotor 203. Themotor 203 may be operable to provide varying amounts of motive force to rotate theimpeller 204 based on the varying amount of power provided by thecontroller 202. Themotor 203 may also include a tachometer for determining a fan speed by measuring the speed at which theimpeller 204 rotates and may communicate the fan speed to thecontroller 202. In this way, thecontroller 202 may control a fan speed of thefan assembly 106. -
FIG. 3 illustrates an example configuration ofcontroller 202 offan assembly 106 as shown inFIG. 2 . Thecontroller 202 may comprise acontrol module 301 and apower module 302. Thecontrol module 301 may include acommunication interconnect 304 for receiving a temperature of theelectronic equipment enclosure 101, receiving a temperature of thewarm air return 107, receiving the fan speed and/or the fan model type of one ormore fan assemblies 106, communicating a fan speed and/or the fan model type to one ormore fan assemblies 106, receiving a pressure of theelectronic equipment enclosure 101, receiving a pressure exterior to theelectronic equipment enclosure 101, receiving and/or querying status information of one ormore fan assemblies 106, and/or communicating status information to one ormore fan assemblies 106. Thecommunication interconnect 304 may be communicatively coupled to a backplane of theelectronic equipment enclosure 101. Thepower module 302 may include apower interconnect 303 for receiving power to provide tomotor 203 based on directions from thecontrol module 301. Thepower interconnect 303 may be operatively coupled to a backplane of theelectronic equipment enclosure 101. Thecontroller 202 may include atemperature sensor 305 for detecting a temperature ofelectronic equipment enclosure 101 and/or thewarm air return 107. - The
control module 301 may be communicably connected to a display offan assembly 106.FIGS. 4A-4D illustrate example configurations of thedisplay 401A-401D of thefan assembly 106. The display may include one or more indicators indicating the status of thefan assembly 106 including, but not limited to an indicator indicating whether thefan assembly 106 is operating properly, an indicator indicating whether the temperature detected by thetemperature sensor 305 is within an acceptable limit, an indicator whether the capacity of thefan assembly 106 is within an acceptable limit, an indicator displaying the temperature detected by thetemperature sensor 305, an indicator displaying the percentage of the capacity offan assembly 106 that thefan assembly 106 is operating, an indicator indicating an alarm condition, an indicator indicating a heat map of theelectronics equipment enclosure 101, and/or a indicator indicating temperature and/or heat trends detected within theelectronics equipment enclosure 101. The one or more indicators may be implemented utilizing any technology including, but not limited to a light emitting diode (LED), a liquid crystal display (LCD), a polymer light emitting diode (PLED), plasma, a cathode ray tube (CRT), liquid crystal on silicon (LCOS), an organic light emitting diode (OLED), high temperature polysilicon (HTPS), an active matrix OLED, a surface conductive electron emitting display (SED), and/or a digital light projection display (DLP). Thedisplay 401A-401D may be positioned within the fan assembly 106 (such as on an exterior surface of fan assembly 106) to facilitate reading. For example, inFIG. 4D ,display 401D is mounted to apanel 402D at an angle A such that thedisplay 401D can be easily read when thefan assembly 106 is associated with theelectronics equipment enclosure 101. -
FIG. 6 illustrates a system 600 for cooling electronic equipment, in accordance with an alternative embodiment of the present disclosure. System 600 may includeelectronic equipment enclosure 101 andcool air source 102. Theelectronic equipment enclosure 101 may include one or moreelectronic equipment components 108. Theelectronic equipment enclosure 101 may comprise an equipment cabinet for computing components such as a server rack. Theelectronic equipment enclosure 101 may receivecool air 103 provided by thecool air source 102 viacool air supply 111. InFIG. 6 , cool air supply may be implemented through a contained space, such as a data center, facility and the like. Theelectronic equipment enclosure 101 may direct thecool air 103 across the one or more electronic equipment components 808, warming thecool air 103 and dissipating heat generated by the one or moreelectronic equipment components 108. Theelectronic equipment enclosure 101 may then return the warmedair 105 to thecool air source 102 viawarm air return 107. System 600 ofFIG. 6 may include awarm air return 107 implemented in the form of ductwork or a full ceiling for control of the flow of warm air from anelectronic equipment enclosure 101 to thecool air source 102. Thecool air source 102 may re-cool the warmedair 105 and re-circulate thecool air 103. One ormore fan assemblies 106 may be coupled to thewarm air return 107 and/or theelectronic equipment enclosure 101. The one ormore fan assemblies 106 may be utilized to direct the warmedair 105 from theelectronic equipment enclosure 101 to thecool air source 102 via thewarm air return 107. - The
electronic equipment enclosure 101 may include a pressure sensor 109 (which may comprise a rheostat and/or other pressure sensing device), communicatively coupled to the one ormore fan assemblies 106, for detecting a pressure of theelectronic equipment enclosure 101.Pressure sensor 109 may be baffled to shieldpressure sensor 109 from a specific air stream such as that from the one or moreelectronic equipment components 108, for example. A pressure sensor 110 (which may comprise a rheostat and/or other pressure sensing device) may be communicatively coupled to thefan assemblies 106, for detecting a pressure exterior to the electronic equipment enclosure.Pressure sensor 110 may be baffled to shieldpressure sensor 110 from a specific air stream such as that from thefan assemblies 106, for example. Alternatively, the one ormore fan assemblies 106 may include a flow rate sensor (not shown) for detecting a differential pressure betweenelectronics equipment enclosure 101 and a pressure exterior to the electronic equipment enclosure. - The one or
more fan assemblies 106 may each include a fan speed and/or a fan model type. The fan speed of the one ormore fan assemblies 106 may be controlled to anywhere between 0% and 100% of a rated capacity (for example, a W1G250 model type fan (EC20) may have a rated capacity of 2750 RPM) based on a temperature of theelectronic equipment enclosure 101, a temperature of thewarm air return 107, a differential temperature between theelectronic equipment enclosure 101 and thewarm air return 107, a pressure of theelectronic equipment enclosure 101, a pressure of thewarm air return 107, and/or a differential pressure between theelectronic equipment enclosure 101 and a pressure exterior to the electronic equipment enclosure. The fan speed of the one ormore fan assemblies 106 may be controlled to maintain a specific temperature (including, but not limited to, 65 degrees Fahrenheit or fifteen degrees Celsius), maintain a negative pressure (such as negative 30 ounces-force per square inch), maintain a slightly negative pressure (such as negative 0.5 ounces-force per square inch), maintain a neutral pressure (where the system 600 is removing the same volume of air from theelectronic equipment enclosure 101 as is being forced into the electronic equipment enclosure 101), maintain a positive pressure (such as 25 ounces-force per square inch), and/or maintain a slightly positive pressure (such as 1 ounce-force per square inch). Maintaining a temperature or pressure may require the fan speed to increase or decrease revolutions per minute (RPM) to accommodate changes in airflow rates. - The one or
more fan assemblies 106 may be communicatively coupled to thecool air source 102 and may communicate the fan speed and/or the fan model type to thecool air source 102. As the one ormore fan assemblies 106 adjust their fan speed to maintain a specific temperature and/or pressure of theelectronics equipment enclosure 101 and/or thewarm air return 107, the appropriate airflow for theelectronics equipment enclosure 101 may be determined based on the fan speed and/or the fan model type. Thecool air source 102 may determine the airflow for theelectronics equipment enclosure 101 based on the fan speed and/or the fan model type. As the appropriate airflow for theelectronics equipment enclosure 101 is then known, the amount ofcool air 103 required by theelectronics equipment enclosure 101 may then be determined. Thecool air source 102 may adjust the amount ofcool air 103 provided to theelectronics equipment enclosure 101 via thecool air supply 111 based on the airflow for theelectronics equipment enclosure 101. Thus, thecool air source 102 provides substantially the exact amount ofcool air 103 viacool air supply 111 required by theelectronics equipment enclosure 101, resulting in more efficient utilization ofcool air source 102. Thecool air source 102 may thus not provide morecool air 103 to theelectronics equipment enclosure 101 via thecool air supply 111 than is required by theelectronics equipment enclosure 101, avoiding excess utilization of thecool air source 102. Thecool air source 102 may thus not provide lesscool air 103 to theelectronics equipment enclosure 101 via thecool air supply 111 than is required by theelectronics equipment enclosure 101, avoiding excess utilization of thefan assemblies 106. - Although the present disclosure has been illustrated and described utilizing one
cool air source 102, oneelectronic equipment enclosure 101, onecool air supply 103, onewarm air return 107, and twofan assemblies 106, it should be understood that multiplecool air sources 102 and multipleelectronic equipment enclosures 101 may be implemented. It is contemplated that multiplecool air sources 102 may cool multiple electronic equipment enclosures through a commoncool air supply 103 and commonwarm air return 107. Additionally, in an alternative embodiment multiple cool air supplies 103 (such as five or seven), multiple warm air returns 107 (such as two or eight), and/or other numbers of fan assemblies 106 (such as four or twenty-five) may be utilized without departing from the scope of the present disclosure. Further, although the present disclosure has been illustrated and described utilizing twopressure sensors 109 and 110 (and/or flow sensor 507), it should be understood that other numbers ofpressure sensors 109 and 110 (and/or flow sensors 507) may be utilized without departing from the scope of the present disclosure. - As illustrated in
FIG. 7 , the one or more fan assemblies 606 may comprise achassis 701, acontroller 702 coupled to thechassis 701, amotor 703 coupled to thechassis 701 and operatively coupled to thecontroller 702, and an impeller 704 (or other fan blade) operably coupled to themotor 703. Thecontroller 702 may be operable to provide varying amounts of power to themotor 703. Themotor 703 may be operable to provide varying amounts of motive force to rotate theimpeller 704 based on the varying amount of power provided by thecontroller 702. Themotor 703 may also include atachometer 705 for determining a fan speed by measuring the speed at which theimpeller 704 rotates and may communicate the fan speed and/or a fan model type to thecontroller 702. In this way, thecontroller 702 may control a fan speed of the one or more fan assemblies 606. -
FIG. 8 illustrates an example configuration ofcontroller 702. Thecontroller 702 may comprise acontrol module 801 and apower module 802. Thecontrol module 801 may include acommunication interconnect 804 for receiving a temperature of theelectronic equipment enclosure 101, receiving a temperature of thewarm air return 107, receiving the fan speed, potentially through atachometer 705, and/or fan model type of one ormore fan assemblies 106, communicating a fan speed and/or a fan model type to one ormore fan assemblies 106 and/or to thecool air source 102, receiving a pressure of theelectronics equipment enclosure 101, receiving a pressure of an exterior to theelectronic equipment enclosure 101, receiving and/or querying status information of one ormore fan assemblies 106, and/or communicating status information to one ormore fan assemblies 106. Thecommunication interconnect 804 may be communicatively coupled to a backplane of theelectronic equipment enclosure 101 and/or thecool air source 102. Thepower module 802 may include apower interconnect 803 for receiving power to provide tomotor 703 based on directions from thecontrol module 801. Thepower interconnect 803 may be operatively coupled to a backplane of theelectronic equipment enclosure 101. Thecontrol module 801 may be communicably connected to adisplay 806 of the one ormore fan assemblies 106. -
FIG. 9 illustrates an example configuration ofcool air source 102. As illustrated,cool air source 102 may include acontrol module 901, apower module 902 communicatively coupled to thecontrol module 901, and acooling unit 903 operatively coupled to thepower module 902. Thecontrol module 901 may include acommunication interconnect 904, communicatively coupled to the one or more fan assemblies, for receiving the fan speed and/or the fan model type of the one or more fan assemblies. Thecontrol module 901 may determine the airflow for theelectronics equipment enclosure 101 based on the fan speed and/or the fan model type. Thepower module 902 may include apower interconnect 905 for receiving power to provide tocooling unit 903 based on directions from thecontrol module 901. Thecooling unit 903 may provide a variable amount ofcool air 103 between 0% and 100% of the capacity of thecooling unit 903 for thecool air source 102 to provide to theelectronics equipment enclosure 101 utilizing the power provided by thepower module 902 based on directions from thecontrol module 901. Thecontrol module 901 may adjust the amount ofcool air 103 that thecool air source 102 provides to theelectronics equipment enclosure 101 based on the airflow for theelectronics equipment enclosure 101. - By way of an example, the one or
more fan assemblies 106 may comprise two fan assemblies and thecontrol module 901 may receive the fan speed and the fan model types of the twofan assemblies 106 viacommunication interconnect 904. Thecontrol module 901 may receive that the fan model type of the twofan assemblies 106 is W1G200 (EC10) and that the fan speed of the twofan assemblies 106 is 2000 RPM. Thecontrol module 901 may determine airflows for the twofan assemblies 106 based on the fan model type and fan speed. Thecontrol module 901 may be operable to determine that W1G200 (EC10) model type fans are rated to move 591.5 CFM (cubic feet per minute) at 2750 RPM. Thecontrol module 901 may be operable to determine that W1G200 (EC10) model type fans are rated to move 591.5 CFM (cubic feet per minute) at 2750 RPM by looking up this information in a table storing information about the CFM/RPM ratings of different fan model types. CFM may vary in direct proportion to RPM. Thus, thecontrol module 901 may determine airflows for the twofan assemblies 106 by solving the equation CFM2/CFM1=RPM2/RMP1 or CFM2/591.5=2000/2750 CFM or CFM2=430.182 CFM. Thecontrol module 901 may aggregate the airflow of the two fan assemblies to determine the amount of cool air to provide. Thus, as the airflow for eachfan assembly 106 is 430.182 CFM, thecontrol module 901 may determine that the aggregate airflow of thefan assemblies 106 is 860.36 CFM. System 100 may include system impedances and turbulence that may modify the airflow for thefan assemblies 106. System 100 may include system impedances and turbulence such that if the fan speed of fan assemblies were 2750 RPM, their actual airflow within system 100 may be 1100 CFM. As such, thecontrol module 901 may apply a correction to the airflow determined based on the fan model type and speed to account for the system impedances and turbulence. For system 100, thecontrol module 901 may apply the correction by multiplying the airflow by a corrective factor (corrected airflow=airflow*corrective factor) of approximately 0.93 to account for the system impedances and turbulence such that the airflow offan assemblies 106 would be 1100 CFM at 2750 RPM rather than 1183 CFM. Thus, the corrected airflow at 2000 RPM may comprise 860.36 CFM*0.93 or 800.1348 CFM. As the twofan assemblies 106 adjust their fan speed to maintain a specific temperature and/or pressure of theelectronics equipment enclosure 101, the appropriate airflow for theelectronics equipment enclosure 101 may be approximately equal to the corrected airflow of the twofan assemblies 106. Based on this corrected airflow of the twofan assemblies 106, thecontrol module 901 may adjust the amount ofcool air 103 that thecool air source 102 provides to theelectronics equipment enclosure 101 via the cool air supply to approximately equal 800.1348 CFM. - By way of an additional example, the one or
more fan assemblies 106 may comprise two fan assemblies and thecontrol module 901 may receive the fan speed and the fan model types of the twofan assemblies 106 viacommunication interconnect 904. Thecontrol module 901 may receive that the fan model type of the twofan assemblies 106 is W1G250 (EC20) and that the fan speed of the twofan assemblies 106 is 2500 RPM. Thecontrol module 901 may determine airflows for the twofan assemblies 106 based on the fan model type and fan speed. Thecontrol module 901 may be operable to determine that W1G250 (EC20) model type fans are rated to move 1130.1 CFM (cubic feet per minute) at 2750 RPM. Thecontrol module 901 may be operable to determine that W1G250 (EC20) model type fans are rated to move 1130.1 CFM (cubic feet per minute) at 2750 RPM by looking up this information in a table storing information about the CFM/RPM ratings of different fan model types. Thecontrol module 901 may determine airflows for the twofan assemblies 106 by consulting a table that correlates different CFMs to different RPMs for the W1G250 (EC20) model type fan. The table correlating different CFMs to different RPMs for the W1G250 (EC20) model type fan may have been created by testing the W1G250 (EC20) model type fan on a test bench and measuring different airflow rates at different RPMs. Thecontrol module 901 may determine airflows for the twofan assemblies 106 is 1027.36 CFM at 2500 RPM by consulting the table that correlates different CFMs to different RPMs for the W1G250 (EC20) model type fan. Thecontrol module 901 may aggregate the airflow of the two fan assemblies to determine the amount of cool air to provide. Thus, as the airflow for eachfan assembly 106 is 1027.36 CFM, thecontrol module 901 may determine that the aggregate airflow of thefan assemblies 106 is 2054.72 CFM. System 100 may include system impedances and turbulence that may modify the airflow for thefan assemblies 106. System 100 may include system impedances and turbulence such that if the fan speed of fan assemblies were 2750 RPM, their actual airflow within system 100 may be 2000 CFM. As such, thecontrol module 901 may apply a correction to the airflow determined based on the fan model type and speed to account for the system impedances and turbulence. For system 100, thecontrol module 901 may apply the correction by multiplying the airflow by a corrective factor (corrected airflow=airflow*corrective factor) of approximately 0.884 to account for the system impedances and turbulence such that the airflow offan assemblies 106 would be 2000 CFM at 2750 RPM rather than CFM. Thus, the corrected airflow at 2000 RPM may comprise 2054.72 CFM*0.884 or 1816.37 CFM. As the twofan assemblies 106 adjust their fan speed to maintain a specific temperature and/or pressure of theelectronics equipment enclosure 101 and/or thewarm air return 107, the appropriate airflow for theelectronics equipment enclosure 101 may approximately equal the corrected airflow of the twofan assemblies 106. Based on this corrected airflow of the twofan assemblies 106, thecontrol module 901 may adjust the amount ofcool air 103 that thecool air source 102 provides to theelectronics equipment enclosure 101 via the cool air supply to approximately equal 1816.37 CFM. - Although the present disclosure has been illustrated and described utilizing one
cool air source 102 and oneelectronic equipment enclosure 101, it should be understood that one or morecool air sources 102 may determine the aggregate airflow of one or moreelectronic equipment enclosures 101 and may provide the amount ofcool air 103 required by one or moreelectronic equipment enclosures 101 based on the aggregate airflow of the one or moreelectronic equipment enclosures 101 without departing from the scope of the present disclosure. -
FIG. 10 illustrates amethod 1001 for cooling electronic equipment, in accordance with an embodiment of the present disclosure. Instep 1001, cool an electronic equipment enclosure by receiving cool air from a cool air source, warming the cool air by directing the cool air across at least one electronic equipment component, and returning the warmed air to the cool air source via a warm air return. Instep 1002, control a fan speed of a first fan assembly and an additional fan speed of at least one additional fan assembly, the first fan assembly and the at least one additional fan assembly directing the warmed air from the electronic equipment enclosure to the warm air return. Controlling the fan speed of the first fan assembly and the additional fan speed of the at least one additional fan assembly may comprise controlling the fan speed and the additional fan speed based on at least one of an electronic equipment enclosure temperature, a warm air return temperature, or a detected pressure differential between an interior electronic equipment enclosure pressure and a pressure exterior to the electronic equipment enclosure. Instep 1003, adjust the fan speed in relation to the additional fan speed. Adjusting the fan speed in relation to the additional fan speed may comprise adjusting the fan speed in relation to the additional fan speed so that the fan speed substantially matches the additional fan speed. Adjusting the fan speed in relation to the additional fan speed may comprise determining that the at least one additional fan assembly has failed and increasing the fan speed to compensate for the failed at least one additional fan assembly. Adjusting the fan speed in relation to the additional fan speed may comprise determining that the at least one additional fan assembly is operating improperly and increasing the fan speed to compensate for the improperly operating at least one additional fan assembly. -
FIG. 11 illustrates amethod 1101 for cooling electronic equipment, in accordance with an embodiment of the present disclosure. Instep 1101, cool at least one electronic equipment enclosure by receiving cool air provided by at least one cool air source, warming the cool air by directing the cool air across at least one electronic equipment component, and returning the warmed air to the at least one cool air source via a warm air return. Instep 1102, control at least one fan speed of at least one fan assembly based on a detected pressure differential between an electronic equipment enclosure pressure and a warm air return pressure, the at least one fan assembly coupled to the at least one warm air return. Controlling at least one fan speed of at least one fan assembly based on a detected pressure differential between an interior electronic equipment enclosure pressure and an exterior electronic equipment enclosure pressure may comprise controlling the at least one fan speed of the at least one fan assembly to maintain at least one of a negative pressure, a positive pressure, and/or a negative pressure. Instep 1103, determine an airflow of the at least one electronic equipment enclosure. Determining an airflow of the at least one electronic equipment enclosure based on the at least one fan speed and a model type of the at least one fan assembly may comprise determining the at least one fan speed utilizing a tachometer of the at least one fan assembly and communicating the at least one fan speed and the model type of the at least one fan assembly to the at least one cool air source. Instep 1104, adjust an amount of the cool air provided by the at least one cool air source may be based on the airflow of the at least one electronic equipment enclosure. The at least one electronic equipment enclosure may comprise a plurality of electronic equipment enclosures and adjusting the amount of the cool air provided by the at least one cool air source may be based on the airflow of the at least one electronic equipment enclosure may comprise adjusting the amount of the cool air provided by the at least one cool air source based on the airflow of the plurality of electronic equipment enclosures. The at least one cool air source may comprise a plurality of cool air sources and adjusting the amount of the cool air provided by the at least one cool air source based on the airflow of the at least one electronic equipment enclosure may comprise adjusting the amount of the cool air provided by the plurality of cool air sources based on the airflow of the at least one electronic equipment enclosure. - In the present disclosure, the methods disclosed may be implemented as sets of instructions or software readable by a device. Further, it is understood that the specific order or hierarchy of steps in the methods disclosed are examples of exemplary approaches. Based upon design preferences, it is understood that the specific order or hierarchy of steps in the method can be rearranged while remaining within the disclosed subject matter. The accompanying method claims present elements of the various steps in a sample order, and are not necessarily meant to be limited to the specific order or hierarchy presented.
- It is believed that the present disclosure and many of its attendant advantages will be understood by the foregoing description, and it will be apparent that various changes may be made in the form, construction and arrangement of the components without departing from the disclosed subject matter or without sacrificing all of its material advantages. The form described is merely explanatory, and it is the intention of the following claims to encompass and include such changes.
Claims (21)
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Also Published As
Publication number | Publication date |
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US20090056359A1 (en) | 2009-03-05 |
AU2008296962B2 (en) | 2014-03-13 |
CA2698028C (en) | 2019-08-06 |
GB2465509B (en) | 2012-08-22 |
GB201003054D0 (en) | 2010-04-07 |
CA2698028A1 (en) | 2009-03-12 |
GB2465509A (en) | 2010-05-26 |
WO2009032237A1 (en) | 2009-03-12 |
US9681587B2 (en) | 2017-06-13 |
AU2008296962A1 (en) | 2009-03-12 |
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