US20080173426A1 - Clip module and heat-dissipation apparatus having the same - Google Patents
Clip module and heat-dissipation apparatus having the same Download PDFInfo
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- US20080173426A1 US20080173426A1 US12/016,212 US1621208A US2008173426A1 US 20080173426 A1 US20080173426 A1 US 20080173426A1 US 1621208 A US1621208 A US 1621208A US 2008173426 A1 US2008173426 A1 US 2008173426A1
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- heat
- connecting part
- heat sink
- clip module
- fastening part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a clip module and, more particularly, to a clip module and a heat-dissipation apparatus having the same.
- FIG. 1A is a three-dimensional schematic diagram showing a conventional heat-dissipation apparatus provided on a heat source
- FIG. 1B is an exploded diagram showing the heat-dissipation apparatus and the heat source shown in FIG. 1A
- a conventional heat-dissipation apparatus 100 is provided in a computer to dissipate the heat generated by a heat source 10 such as a central process unit (CPU).
- the above heat-dissipation apparatus 100 includes a retention module (RM) 110 provided around the heat source 10 , a heat sink 120 and a clip module 130 .
- RM retention module
- the heat sink 120 is suitable to be provided on the heat source 10 and dissipate the heat generated by the heat source 10
- the clip module 130 is suitable to be provided across the heat sink 120 and press on the heat sink 120 so that the heat sink 120 can closely contact with the heat source 10 . In this way, the heat inside the heat source 10 can be effectively transmitted to the heat sink 120 and then be transmitted to the outside by the heat sink 120 .
- the clip module 130 includes a body 132 provided across the heat sink 120 , a fastener 134 , and a cam pressing structure 136 .
- the body 132 is suitable to press on the heat sink 120 to make the heat sink 120 closely contact with the heat source 10 .
- One end of the body 132 is fastened on one tenon 112 of the RM 110 , and the other end of the body 132 is assembled on the fastener 134 .
- the fastener 134 is suitable to be fastened on the other tenon 114 of the RM 110 .
- the cam pressing structure 136 is pivotally connected to the fastener 134 via the pin 138 .
- the cam pressing structure 136 can rotate along the pivot direction L (X axis) of the pin 138 to press on the body 132 .
- the material of the cam pressing structure 136 is plastic which is expensive. Therefore, the conventional clip module 130 has a high product cost. Moreover, since the cam pressing structure 136 rotates along the pivot direction L (X axis) of the pin 138 to press on the body 132 , when the heat sink 120 is assembled to the heat source 10 , sufficient space around the heat sink 120 should be given for the cam pressing structure 136 to rotate so that the heat sink 120 can be assembled to the heat source 10 successfully. However, in the computer, the space around the heat sink 120 is limited.
- One objective of the invention is to provide a clip module and heat-dissipation apparatus having the same to provide a clip module with a low cost.
- Another objective of the invention is to provide a clip module and heat-dissipation apparatus having the same.
- the clip module can assemble the heat sink to the heat source successfully and will not interfere with electronic elements around the heat sink easily.
- the invention provides a clip module suitable to cooperate with a retention module (RM) to assemble the heat sink to the heat source, wherein the RM has a first fastening part and a second fastening part.
- the clip module of the invention includes a body, a fastener, and a pressing structure.
- the body has a first retaining part, a third fastening part and a first connecting part.
- the first retaining part is suitable to press the heat sink on the heat source, and the third fastening part at one end of the first retaining part is suitable to be fastened on the first fastening part, while the first connecting part is at the other end of the first retaining part.
- the fastener has a second connecting part, a pivot, a fixing part and a fourth fastening part.
- the first connecting part is assembled with the second connecting part; the pivot and the fixing part are provided on the two sides of the second connecting part, respectively; the fourth fastening part is suitable to be fastened on the second fastening part.
- the pressing structure is pivotally connected to the pivot along a rotating axis and suitable to rotate along the rotating axis to be fastened on the fixing part to press on the body.
- the pressing structure includes a third connecting part pivotally connected to the pivot along the rotating axis and a pressing part suitable to rotate along the rotating axis to fasten on the fixing part.
- the pressing structure further includes a second retaining part provided between the third connecting part and the pressing part and suitable to press on the body.
- the body, fastener and pressing structure are sheet metal parts.
- the second connecting part has a limiting structure to limit the operation range of the first connecting part.
- the invention further provides a heat-dissipation apparatus which is suitable to dissipate the heat for a heat source on a circuit board.
- the heat-dissipation apparatus of the invention includes a RM, a heat sink and the above clip module, wherein the RM is provided on the circuit board and around the heat source, and the RM has a first fastening part and a second fastening part.
- the heat sink is provided on the heat source, while the clip module is provided across the heat sink and fastened on the RM.
- the components (the body, fastener and pressing structure) of clip module of the invention are, for example, sheet metal parts with simple structure. Therefore, the clip module of the invention has a low product cost. Moreover, since the components (the body, fastener and pressing structure) of the clip module are sheet metal parts with simple structure, the clip module has an advantage of being assembled easily.
- the pivot direction of the pressing structure of the invention is parallel to the direction of the axis of symmetry of body. Therefore, the pressing structure pivotally connected to the fastener will not interfere with the electronic elements around the heat sink because of the space limitation. In other words, the clip module of the invention can fix the heat sink on the heat source successfully.
- FIG. 1A is a three-dimensional schematic diagram showing a conventional heat-dissipation apparatus provided on a heat source.
- FIG. 1B is an exploded diagram showing the heat-dissipation apparatus and heat source shown in FIG. 1A .
- FIG. 2A is a three-dimensional schematic diagram showing a heat-dissipation apparatus provided on a heat source according to a preferred embodiment of the invention.
- FIG. 2B is an exploded diagram showing the heat-dissipation apparatus and heat source shown in FIG. 2A .
- FIG. 3 is an exploded diagram showing the clip module shown in FIG. 2B .
- FIG. 4A is a front view showing the heat-dissipation apparatus provided on the heat source shown in FIG. 2A .
- FIG. 4B is a side view showing the heat-dissipation apparatus shown in FIG. 4A .
- FIG. 5A is a front view showing clip module shown in FIG. 4A fastened on the retention module (RM).
- FIG. 5B is a side view showing the heat-dissipation apparatus shown in FIG. 5A .
- FIG. 2A is a three-dimensional schematic diagram showing a heat-dissipation apparatus provided on a heat source in a preferred embodiment of the invention
- FIG. 2B is an exploded diagram showing the heat-dissipation apparatus and the heat source shown in FIG. 2A .
- a heat-dissipation structure 200 in the embodiment is suitable to dissipate the heat generated by the source 22 on a circuit board 20 .
- the heat-dissipation structure 200 includes a retention module (RM) 210 , a heat sink 220 provided on a heat source 22 , and a clip module 230 .
- RM retention module
- the clip module 230 can fasten the heat sink 220 on the heat source 22 steadily.
- the detail process concerning how to fasten the heat sink 220 on the heat source 22 by the clip module 230 in the embodiment will be described hereinbelow.
- the RM 210 is provided on the circuit board 20 and around the heat source 22 , and the RM 210 has a first fastening part 212 and a second fastening part 214 .
- the heat sink 220 is, for example, an extrusion heat sink or other proper types of heat sink, while the clip module 230 is provided across the heat sink 220 and fastened on the first fastening part 212 and the second fastening part 214 of the RM 210 .
- the structure of the clip module 230 will be described in detail hereinbelow.
- FIG. 3 is an exploded diagram showing the clip module shown in FIG. 2B .
- the clip module 230 in the embodiment includes a body 232 , a fastener 234 and a pressing structure 236 .
- the body 232 , the fastener 234 and the pressing structure 236 can be sheet metal parts with simple structure.
- the above body 232 has a first retaining part 232 a , a third fastening part 232 b on one end of the first retaining part 232 a , and a first connecting part 232 c on the other end of the first retaining part 232 a .
- the heat sink 220 has, for example, a groove 220 a , and the first retaining part 232 a of the body 232 is suitable to pass through the groove 220 a of the heat sink 220 and press on the heat sink 220 , while the third fastening part 232 b is suitable to be fastened on the first fastening part 212 of the RM 210 .
- the fastener 234 has a second connecting part 234 a , a pivot 234 b , a fixing part 234 c and a fourth fastening part 234 d , and the fastener 234 connects to the first connecting part 232 c via the second connecting part 234 a to be actively assembled on the body 232 .
- a limiting structure 234 a ′ can be provided on the second connecting part 234 a .
- the limiting structure 234 a ′ can limit the operation range of the first connecting part 232 c so that the first connecting part can be connected to the second connecting part 234 a steadily.
- the pivot 234 b and the fixing part 234 c are provided on the two sides of second connecting part 234 a , respectively, and the fourth fastening part 234 d is suitable to be fastened on the second fastening part 214 .
- the first fastening part 212 and second fastening part 214 have a hook, respectively, while the third fastening part 232 b and the fourth fastening part 234 d have a hole, respectively. Therefore, the third fastening part 232 b can be fastened on the first fastening part 212 , and the fourth fastening part 234 d can be fastened on the second fastening part 214 .
- first fastening part 212 and the second fastening part 214 may have a hole, respectively, while the third fastening part 232 b and the fourth fastening part 234 d may have a hook, respectively.
- the third fastening part 232 b and the fourth fastening part 234 d may have a hook, respectively.
- the pressing structure 236 is, for example, pivotally connected to the pivot 234 b along the rotating axis R parallel to the direction of the groove 220 a of the heat sink 220 , and the pressing structure 236 is suitable to rotate along the rotating axis R to be fastened on the fixing part 234 c of the fastener 234 , and then press on the body 232 .
- the pressing structure 236 includes, for example, a third connecting part 236 a and a pressing part 236 b .
- the third connecting part 236 a for example, rivets to the pivot 234 b along the rotating axis R.
- FIG. 4A is a front view diagram showing the heat-dissipation apparatus provided in the heat source in FIG. 2A
- FIG. 4B is side view diagram showing the heat-dissipation apparatus shown in FIG. 4A
- FIG. 5A is a front view diagram showing the clip module shown in FIG. 4A fastened on the RM
- FIG. 5B is a side view diagram showing the heat-dissipation apparatus shown in FIG. 5A .
- Users can rotate the pressing part 236 b by using the pivot 234 b as the rotating center, and make the second retaining part 236 c between the third connecting part 236 a and the pressing part 236 b press on the first connecting part 232 c of the body 232 .
- the first retaining part 232 a of the body 232 presses on the heat sink 220
- the fourth fastening part 234 d of the fastener 234 is fastened on the second fastening part 214 of the RM 210
- the second retaining part 236 c presses on the first connecting part 232 c of the body 232 the first connecting part 232 c of the body 232 will be pressed down so that the first retaining part 232 a will press the heat sink 220 , and then heat sink 220 can be assembled in the heat source 22 steadily.
- the pressing part 236 b of the pressing structure 236 can be fastened on the fixing part 234 c of the fastener 234 , wherein the fixing part 234 c can effectively overcome the reacting force given by the heat sink 220 to the body 232 so that the pressing part 236 b can be fastened in a predetermined location.
- the second retaining part 236 c of the pressing structure 236 can continuously press on the body 232 so that the heat sink 220 can be assembled on the heat source 22 steadily.
- the heat sink 220 can be provided on the heat source 22 steadily.
- the clip module is provided across the heat sink and fastened on the RM, so that the heat sink can be provided in the heat source steadily to dissipate the heat for the heat source.
- the components (body, fastener and the pressing structure) of the clip module are, for example, sheet metal parts with simple structure. Therefore, the clip module of the invention has a low product cost.
- the components (body, fastener and the pressing structure) of the clip module are, for example, sheet metal parts with simple structure, the clip module of the invention has an advantage of being assembled easily. That is, the clip module is suitable to be produced in mass with a preferred assembling efficiency.
- the pivot direction of the pressing structure is parallel to the direction of the axis of symmetry of the body in the invention.
- the pressing structure pivotally connected to the fastener will not interfere with the electronic elements around the heat sink because of the room limitation when rotating.
- the clip module in the invention can be fastened on the heat sink successfully.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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Abstract
A heat-dissipation apparatus is disclosed. The heat-dissipation apparatus is suitable to dissipate heat generated by a heat source and includes a retention module (RM) around the heat source, a heat sink provided at the heat source, and a clip module. The clip module includes a body, a fastener, and a pressing structure. One end of the body is fastened on the RM, and the heat-sink is pressed on the heat source by the body. The fastener is provided at the other end of the body. One end of the fastener is fastened on the RM, and the pressing structure is pivotally connected to the other end of the fastener along a rotating axis. The pressing structure is suitable to rotate to be fastened at a fixing part of the fastener, so that the body is pressed by the pressing structure.
Description
- This application claims the priority benefit of Taiwan application serial no. 96102036, filed on Jan. 19, 2007. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- 1. Field of the Invention
- The invention relates to a clip module and, more particularly, to a clip module and a heat-dissipation apparatus having the same.
- 2. Description of the Related Art
- In recent years, with the rapid development of the science and technology, various electronic components such as chipsets have more and more transistors. Therefore, working temperature of electronic components becomes higher and higher. The heat dissipation of a central process unit (CPU) of a computer, for example, is always worth studying. To prevent a CPU from overheating which will make the computer break down temporarily or permanently, the computer need sufficient heat-dissipation capability to make the CPU work normally. To remove the heat generated during high-speed operation and maintain the CPU at a normal status, in the conventional technology, a heat-dissipation apparatus is directly provided on the CPU or the chip generating heat. Thus, the heat generated by the CPU can be dissipated to the environment quickly by the heat-dissipation apparatus.
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FIG. 1A is a three-dimensional schematic diagram showing a conventional heat-dissipation apparatus provided on a heat source, whileFIG. 1B is an exploded diagram showing the heat-dissipation apparatus and the heat source shown inFIG. 1A . Refer toFIG. 1A andFIG. 1B simultaneously. A conventional heat-dissipation apparatus 100 is provided in a computer to dissipate the heat generated by aheat source 10 such as a central process unit (CPU). The above heat-dissipation apparatus 100 includes a retention module (RM) 110 provided around theheat source 10, aheat sink 120 and aclip module 130. Theheat sink 120 is suitable to be provided on theheat source 10 and dissipate the heat generated by theheat source 10, while theclip module 130 is suitable to be provided across theheat sink 120 and press on theheat sink 120 so that theheat sink 120 can closely contact with theheat source 10. In this way, the heat inside theheat source 10 can be effectively transmitted to theheat sink 120 and then be transmitted to the outside by theheat sink 120. - In the conventional technology, the
clip module 130 includes abody 132 provided across theheat sink 120, afastener 134, and a campressing structure 136. Thebody 132 is suitable to press on theheat sink 120 to make theheat sink 120 closely contact with theheat source 10. One end of thebody 132 is fastened on onetenon 112 of the RM 110, and the other end of thebody 132 is assembled on thefastener 134. Thefastener 134 is suitable to be fastened on theother tenon 114 of the RM 110. Moreover, thecam pressing structure 136 is pivotally connected to thefastener 134 via thepin 138. The campressing structure 136 can rotate along the pivot direction L (X axis) of thepin 138 to press on thebody 132. - The material of the
cam pressing structure 136 is plastic which is expensive. Therefore, theconventional clip module 130 has a high product cost. Moreover, since the campressing structure 136 rotates along the pivot direction L (X axis) of thepin 138 to press on thebody 132, when theheat sink 120 is assembled to theheat source 10, sufficient space around theheat sink 120 should be given for the campressing structure 136 to rotate so that theheat sink 120 can be assembled to theheat source 10 successfully. However, in the computer, the space around theheat sink 120 is limited. (Electronic elements such as memory modules, various cards may be provided around theheat sink 120.) Therefore, when theheat sink 120 is assembled to theheat source 10, the campressing structure 136 pivotally connected to thefastener 134 interferes with the electronic elements around theheat sink 120 easily because of the room limitation. Thus, the heat sink cannot be assembled to theheat source 10 easily. - One objective of the invention is to provide a clip module and heat-dissipation apparatus having the same to provide a clip module with a low cost.
- Another objective of the invention is to provide a clip module and heat-dissipation apparatus having the same. The clip module can assemble the heat sink to the heat source successfully and will not interfere with electronic elements around the heat sink easily.
- To obtain the above or other objectives, the invention provides a clip module suitable to cooperate with a retention module (RM) to assemble the heat sink to the heat source, wherein the RM has a first fastening part and a second fastening part. The clip module of the invention includes a body, a fastener, and a pressing structure. The body has a first retaining part, a third fastening part and a first connecting part. The first retaining part is suitable to press the heat sink on the heat source, and the third fastening part at one end of the first retaining part is suitable to be fastened on the first fastening part, while the first connecting part is at the other end of the first retaining part. Moreover, the fastener has a second connecting part, a pivot, a fixing part and a fourth fastening part. The first connecting part is assembled with the second connecting part; the pivot and the fixing part are provided on the two sides of the second connecting part, respectively; the fourth fastening part is suitable to be fastened on the second fastening part. The pressing structure is pivotally connected to the pivot along a rotating axis and suitable to rotate along the rotating axis to be fastened on the fixing part to press on the body.
- In one embodiment of the invention, the pressing structure includes a third connecting part pivotally connected to the pivot along the rotating axis and a pressing part suitable to rotate along the rotating axis to fasten on the fixing part.
- In one embodiment of the invention, the pressing structure further includes a second retaining part provided between the third connecting part and the pressing part and suitable to press on the body.
- In one embodiment of the invention, the body, fastener and pressing structure are sheet metal parts.
- In one embodiment of the invention, the second connecting part has a limiting structure to limit the operation range of the first connecting part.
- The invention further provides a heat-dissipation apparatus which is suitable to dissipate the heat for a heat source on a circuit board. The heat-dissipation apparatus of the invention includes a RM, a heat sink and the above clip module, wherein the RM is provided on the circuit board and around the heat source, and the RM has a first fastening part and a second fastening part. Moreover, the heat sink is provided on the heat source, while the clip module is provided across the heat sink and fastened on the RM.
- In the heat-dissipation apparatus of the invention, the components (the body, fastener and pressing structure) of clip module of the invention are, for example, sheet metal parts with simple structure. Therefore, the clip module of the invention has a low product cost. Moreover, since the components (the body, fastener and pressing structure) of the clip module are sheet metal parts with simple structure, the clip module has an advantage of being assembled easily. On the other hand, in order to assemble the heat sink on the heat source successfully, the pivot direction of the pressing structure of the invention is parallel to the direction of the axis of symmetry of body. Therefore, the pressing structure pivotally connected to the fastener will not interfere with the electronic elements around the heat sink because of the space limitation. In other words, the clip module of the invention can fix the heat sink on the heat source successfully.
- These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.
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FIG. 1A is a three-dimensional schematic diagram showing a conventional heat-dissipation apparatus provided on a heat source. -
FIG. 1B is an exploded diagram showing the heat-dissipation apparatus and heat source shown inFIG. 1A . -
FIG. 2A is a three-dimensional schematic diagram showing a heat-dissipation apparatus provided on a heat source according to a preferred embodiment of the invention. -
FIG. 2B is an exploded diagram showing the heat-dissipation apparatus and heat source shown inFIG. 2A . -
FIG. 3 is an exploded diagram showing the clip module shown inFIG. 2B . -
FIG. 4A is a front view showing the heat-dissipation apparatus provided on the heat source shown inFIG. 2A . -
FIG. 4B is a side view showing the heat-dissipation apparatus shown inFIG. 4A . -
FIG. 5A is a front view showing clip module shown inFIG. 4A fastened on the retention module (RM). -
FIG. 5B is a side view showing the heat-dissipation apparatus shown inFIG. 5A . -
FIG. 2A is a three-dimensional schematic diagram showing a heat-dissipation apparatus provided on a heat source in a preferred embodiment of the invention, andFIG. 2B is an exploded diagram showing the heat-dissipation apparatus and the heat source shown inFIG. 2A . Refer toFIG. 2A andFIG. 2B simultaneously. A heat-dissipation structure 200 in the embodiment is suitable to dissipate the heat generated by thesource 22 on acircuit board 20. The heat-dissipation structure 200 includes a retention module (RM) 210, aheat sink 220 provided on aheat source 22, and aclip module 230. In the embodiment, utilizing the lever principle, theclip module 230 can fasten theheat sink 220 on theheat source 22 steadily. The detail process concerning how to fasten theheat sink 220 on theheat source 22 by theclip module 230 in the embodiment will be described hereinbelow. - In the embodiment, the
RM 210 is provided on thecircuit board 20 and around theheat source 22, and theRM 210 has afirst fastening part 212 and asecond fastening part 214. Moreover, theheat sink 220 is, for example, an extrusion heat sink or other proper types of heat sink, while theclip module 230 is provided across theheat sink 220 and fastened on thefirst fastening part 212 and thesecond fastening part 214 of theRM 210. The structure of theclip module 230 will be described in detail hereinbelow. -
FIG. 3 is an exploded diagram showing the clip module shown inFIG. 2B . Refer toFIG. 2B andFIG. 3 simultaneously. Theclip module 230 in the embodiment includes abody 232, afastener 234 and apressing structure 236. In the embodiment, thebody 232, thefastener 234 and thepressing structure 236 can be sheet metal parts with simple structure. Theabove body 232 has afirst retaining part 232 a, athird fastening part 232 b on one end of the first retainingpart 232 a, and a first connectingpart 232 c on the other end of the first retainingpart 232 a. In the embodiment, theheat sink 220 has, for example, agroove 220 a, and the first retainingpart 232 a of thebody 232 is suitable to pass through thegroove 220 a of theheat sink 220 and press on theheat sink 220, while thethird fastening part 232 b is suitable to be fastened on thefirst fastening part 212 of theRM 210. - Follow the above. The
fastener 234 according to the embodiment has a second connectingpart 234 a, apivot 234 b, a fixingpart 234 c and afourth fastening part 234 d, and thefastener 234 connects to the first connectingpart 232 c via the second connectingpart 234 a to be actively assembled on thebody 232. In the embodiment, a limitingstructure 234 a′ can be provided on the second connectingpart 234 a. The limitingstructure 234 a′ can limit the operation range of the first connectingpart 232 c so that the first connecting part can be connected to the second connectingpart 234 a steadily. Moreover, thepivot 234 b and the fixingpart 234 c are provided on the two sides of second connectingpart 234 a, respectively, and thefourth fastening part 234 d is suitable to be fastened on thesecond fastening part 214. In the embodiment, thefirst fastening part 212 andsecond fastening part 214 have a hook, respectively, while thethird fastening part 232 b and thefourth fastening part 234 d have a hole, respectively. Therefore, thethird fastening part 232 b can be fastened on thefirst fastening part 212, and thefourth fastening part 234 d can be fastened on thesecond fastening part 214. Certainly, in other embodiments, thefirst fastening part 212 and thesecond fastening part 214 may have a hole, respectively, while thethird fastening part 232 b and thefourth fastening part 234 d may have a hook, respectively. There is no limitation herein. - Moreover, in the embodiment, the
pressing structure 236 is, for example, pivotally connected to thepivot 234 b along the rotating axis R parallel to the direction of thegroove 220 a of theheat sink 220, and thepressing structure 236 is suitable to rotate along the rotating axis R to be fastened on the fixingpart 234 c of thefastener 234, and then press on thebody 232. - In detail, in the embodiment, the
pressing structure 236 includes, for example, a third connectingpart 236 a and apressing part 236 b. The third connectingpart 236 a, for example, rivets to thepivot 234 b along the rotating axis R. When users want to assemble theheat sink 220 on theheat source 22, they can rotate thepressing part 236 b by using thepivot 234 b on one side of the second connectingpart 234 a as the rotating center, and fasten the pressing part on the fixingpart 234 c on another side of the second connectingpart 234 a, so that thesecond retaining part 236 c between the third connectingpart 236 a and thepressing part 236 b can press on thebody 232 assembled in the second connectingpart 234 a. Consequently, theheat sink 220 will be pressed by thebody 232 and then assembled on theheat source 22 steadily. - The above describes the connecting relationship between the components of the
clip module 230,RM 210 andheat sink 220. How to fasten theclip module 230 on theRM 210 to fix theheat sink 220 on theheat source 22 will be described hereinbelow. -
FIG. 4A is a front view diagram showing the heat-dissipation apparatus provided in the heat source inFIG. 2A , whileFIG. 4B is side view diagram showing the heat-dissipation apparatus shown inFIG. 4A .FIG. 5A is a front view diagram showing the clip module shown inFIG. 4A fastened on the RM, whileFIG. 5B is a side view diagram showing the heat-dissipation apparatus shown inFIG. 5A . Refer toFIG. 4A andFIG. 4B first, when users want to fix theheat sink 220 on theheat source 22 on thecircuit board 20, they can fasten thethird fastening part 232 b of thebody 232 on thefirst fastening part 212 of theRM 210, and then fasten thefourth fastening part 234 d of thefastener 234 on thesecond fastening part 214 of theRM 210. In this way, the first retainingpart 232 a of thebody 232 can preliminary press on theheat sink 220. - Next, refer to
FIG. 5A andFIG. 5B . Users can rotate thepressing part 236 b by using thepivot 234 b as the rotating center, and make thesecond retaining part 236 c between the third connectingpart 236 a and thepressing part 236 b press on the first connectingpart 232 c of thebody 232. In detail, since the first retainingpart 232 a of thebody 232 presses on theheat sink 220, and thefourth fastening part 234 d of thefastener 234 is fastened on thesecond fastening part 214 of theRM 210, when thesecond retaining part 236 c presses on the first connectingpart 232 c of thebody 232, the first connectingpart 232 c of thebody 232 will be pressed down so that the first retainingpart 232 a will press theheat sink 220, and thenheat sink 220 can be assembled in theheat source 22 steadily. - After users press the
pressing structure 236 to press down thebody 232, in the embodiment, thepressing part 236 b of thepressing structure 236 can be fastened on the fixingpart 234 c of thefastener 234, wherein the fixingpart 234 c can effectively overcome the reacting force given by theheat sink 220 to thebody 232 so that thepressing part 236 b can be fastened in a predetermined location. In this way, thesecond retaining part 236 c of thepressing structure 236 can continuously press on thebody 232 so that theheat sink 220 can be assembled on theheat source 22 steadily. - In the embodiment, since the
third fastening part 232 b and thefourth fastening part 234 d are fastened on thefirst fastening part 212 and thesecond fastening part 214 of theRM 210, respectively, and thebody 232 of theclip module 230 can press on theheat sink 220, theheat sink 220 can be provided on theheat source 22 steadily. - To sum up, in the heat-dissipation apparatus in the embodiment of the invention, the clip module is provided across the heat sink and fastened on the RM, so that the heat sink can be provided in the heat source steadily to dissipate the heat for the heat source. The components (body, fastener and the pressing structure) of the clip module are, for example, sheet metal parts with simple structure. Therefore, the clip module of the invention has a low product cost. On the other hand, since the components (body, fastener and the pressing structure) of the clip module are, for example, sheet metal parts with simple structure, the clip module of the invention has an advantage of being assembled easily. That is, the clip module is suitable to be produced in mass with a preferred assembling efficiency.
- Moreover, in order to make the heat sink provided on the heat source successfully, the pivot direction of the pressing structure is parallel to the direction of the axis of symmetry of the body in the invention. In this way, the pressing structure pivotally connected to the fastener will not interfere with the electronic elements around the heat sink because of the room limitation when rotating. In other words, the clip module in the invention can be fastened on the heat sink successfully.
- Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope and spirit of the invention. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.
Claims (12)
1. A clip module suitable to cooperate with a retention module to fasten a heat sink on a heat source, wherein the retention module has a first fastening part and a second fastening part, the clip module comprising:
a body comprising a first retaining part, a third fastening part and a first connecting part, wherein the first retaining part is suitable to press the heat sink on the heat source, the third fastening part providing at one end of the first retaining part and is suitable to fasten the first fastening part, and the first connecting part providing at the other end of the first retaining part;
a fastener comprising a second connecting part, a pivot, a fixing part and a fourth fastening part, wherein the first connecting part assembling at the second connecting part, the pivot and the fixing part are providing at two sides of the second connecting part, respectively, and the fourth fastening part is suitable to fasten the second fastening part; and
a pressing structure pivotally connecting the pivot along a rotating axis and is suitable to rotate along the rotating axis to fasten at the fixing part, thus to press the body.
2. The clip module according to claim 1 , wherein the pressing structure comprises a third connecting part pivotally connected to the pivot along the rotating axis and a pressing part being suitable to rotate along the rotating axis to be fastened on the fixing part.
3. The clip module according to claim 2 , wherein the pressing structure further comprises a second retaining part provided between the third connecting part and the pressing part and being suitable to press the body.
4. The clip module according to claim 1 , wherein the body, the fastener and the pressing structure are sheet metal parts.
5. The clip module according to claim 1 , wherein the second connecting part has a limiting structure to limit the operation range of the first connecting part.
6. The clip module according to claim 1 , wherein the rotating axis is parallel to the direction of a groove of the heat sink.
7. A heat-dissipation apparatus suitable to dissipate heat generated by a heat source on a circuit board, the heat-dissipation apparatus comprising:
a retention module provided on the circuit board and around the heat source, wherein the retention module has a first fastening part and a second fastening part;
a heat sink provided on the heat source; and
a clip module provided across the heat sink and fastened on the retention module, the clip module comprising:
a body comprising a first retaining part, a third fastening part and a first connecting part, wherein the first retaining part is suitable to press the heat sink on the heat source, the third fastening part is provided at one end of the first retaining part and suitable to be fastened at the first fastening part, and the first connecting part is provided at the other end of the first retaining part;
a fastener comprising a second connecting part, a pivot, a fixing part and a fourth fastening part, wherein the first connecting part is assembled at the second connecting part, the pivot and the fixing part are provided at the two sides of the second connecting part, respectively, and the fourth fastening part is suitable to be fastened at the second fastening part; and
a pressing structure pivotally connected to the pivot along a rotating axis and suitable to rotate along the rotating axis to be fastened at the fixing part and then press the body.
8. The heat-dissipation apparatus according to claim 7 , wherein the pressing structure comprises a third connecting part pivotally connected to the pivot along the rotating axis and a pressing part being suitable to rotate along the rotating axis to be fastened at the fixing part.
9. The heat-dissipation apparatus according to claim 8 , wherein the pressing structure further comprises a second retaining part provided between the third connecting part and the pressing part and being suitable to press on the body.
10. The heat-dissipation apparatus according to claim 7 , wherein the body, the fastener and the pressing structure are sheet metal parts.
11. The heat-dissipation apparatus according to claim 7 , wherein the second connecting part has a limiting structure to limit the operation range of the first connecting part.
12. The heat-dissipation apparatus according to claim 7 , wherein the rotating axis is parallel to the direction of a groove of the heat sink.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96102036 | 2007-01-19 | ||
TW096102036A TW200832116A (en) | 2007-01-19 | 2007-01-19 | Clip-module and heat-dissipation apparatus having the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080173426A1 true US20080173426A1 (en) | 2008-07-24 |
Family
ID=39640131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/016,212 Abandoned US20080173426A1 (en) | 2007-01-19 | 2008-01-18 | Clip module and heat-dissipation apparatus having the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080173426A1 (en) |
TW (1) | TW200832116A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070030652A1 (en) * | 2005-08-02 | 2007-02-08 | Inventec Corporation | Heat sink mount |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
US20140345844A1 (en) * | 2013-05-22 | 2014-11-27 | Tai-Sol Electronics Co., Ltd. | Heat sink |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4170708A1 (en) * | 2019-03-15 | 2023-04-26 | Infineon Technologies Austria AG | An electronic module comprising a semiconductor package with integrated clip and fastening element |
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US5638258A (en) * | 1995-10-24 | 1997-06-10 | Lin; Jen-Cheng | CPU heat sink fastener |
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US7061764B2 (en) * | 2003-03-28 | 2006-06-13 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip with rotating CAM |
US20070115638A1 (en) * | 2005-11-18 | 2007-05-24 | Foxconn Technology Co., Ltd. | Heat sink clip and assembly |
US7391615B2 (en) * | 2006-10-10 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Clip for heat sink |
US7604041B2 (en) * | 2005-12-15 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink clip |
US7656668B2 (en) * | 2007-05-01 | 2010-02-02 | Asia Vital Components Co., Ltd. | Secure device for a heat sink and CPU |
-
2007
- 2007-01-19 TW TW096102036A patent/TW200832116A/en unknown
-
2008
- 2008-01-18 US US12/016,212 patent/US20080173426A1/en not_active Abandoned
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US5600540A (en) * | 1995-05-15 | 1997-02-04 | Blomquist; Michael L. | Heat sink and retainer for electronic integrated circuits |
US5638258A (en) * | 1995-10-24 | 1997-06-10 | Lin; Jen-Cheng | CPU heat sink fastener |
US6181559B1 (en) * | 1998-07-21 | 2001-01-30 | Samsung Electronics Co., Ltd. | Device for attaching a heat sink |
US6731504B1 (en) * | 2003-01-17 | 2004-05-04 | A-Sheng Liu | Heat sink fastener |
US7061764B2 (en) * | 2003-03-28 | 2006-06-13 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip with rotating CAM |
US20060034057A1 (en) * | 2004-08-11 | 2006-02-16 | Mitac Precision Technology | Clamper for mounting a heatsink |
US20070115638A1 (en) * | 2005-11-18 | 2007-05-24 | Foxconn Technology Co., Ltd. | Heat sink clip and assembly |
US7604041B2 (en) * | 2005-12-15 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink clip |
US7391615B2 (en) * | 2006-10-10 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Clip for heat sink |
US7656668B2 (en) * | 2007-05-01 | 2010-02-02 | Asia Vital Components Co., Ltd. | Secure device for a heat sink and CPU |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070030652A1 (en) * | 2005-08-02 | 2007-02-08 | Inventec Corporation | Heat sink mount |
US7505271B2 (en) * | 2005-08-03 | 2009-03-17 | Inventec Corporation | Heat sink mount |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
US20140345844A1 (en) * | 2013-05-22 | 2014-11-27 | Tai-Sol Electronics Co., Ltd. | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TW200832116A (en) | 2008-08-01 |
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Legal Events
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AS | Assignment |
Owner name: AMA PRECISION INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YAN, KUNG-JEN;REEL/FRAME:020412/0708 Effective date: 20080111 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |