US20060245856A1 - Substrate edge grip apparatus - Google Patents
Substrate edge grip apparatus Download PDFInfo
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- US20060245856A1 US20060245856A1 US11/423,970 US42397006A US2006245856A1 US 20060245856 A1 US20060245856 A1 US 20060245856A1 US 42397006 A US42397006 A US 42397006A US 2006245856 A1 US2006245856 A1 US 2006245856A1
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- robot
- jaw
- base portion
- substrate
- shaft
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Definitions
- the present invention relates generally to the processing of semiconductor substrates, and relates more particularly to apparatuses for gripping an edge of a semiconductor substrate on a robot blade.
- Semiconductor substrate processing is typically performed by subjecting a substrate to a plurality of sequential processes to create devices, conductors and insulators on the substrate. Each of these processes is generally performed in a process chamber configured to perform a single step of the production process. In order to efficiently complete the entire sequence of processing steps, a number of process chambers are typically coupled to a central transfer chamber that houses a robot to facilitate transfer of the substrate between the process chambers.
- a semiconductor processing platform having this configuration is generally known as a cluster tool, examples of which are the families of AKT PECVD, PRODUCER®, CENTURA® and ENDURA® processing platforms available from Applied Materials, Inc., of Santa Clara, Calif.
- a cluster tool comprises a central transfer chamber generally surrounded by one or more process chambers.
- the process chambers are generally utilized to process the substrate, for example, performing various processing steps such as etching, physical vapor deposition, ion implantation, lithography and the like.
- the transfer chamber is typically coupled to a factory interface that houses a plurality of removable substrate storage cassettes, each of which houses a plurality of substrates.
- a load lock chamber is disposed between the transfer chamber and the factory interface.
- a substrate transfer robot is disposed in the cluster tool and used to transfer substrates between the process and load lock chambers. Proper positioning of the substrate on the blade of the transfer robot is critical to ensure that the substrate does not become damaged or misaligned during transfer to process chambers and to achieve repeatable processing results. Thus, the manner in which the transfer robot contacts and positions the substrate on the robot blade may affect the final processing results.
- a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot.
- a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effectors, such as a substrate support blade. The jaws are adapted to be mechanically actuated by a feature remote from the robot, e.g., the edges of a slit valve, chamber wall and the like, to release the substrate for delivery.
- FIG. 1 is a plan view a semiconductor processing system having a transfer robot adapted to include one embodiment of a substrate edge gripper assembly according to the present invention
- FIG. 2 is a top view of a substrate transfer robot adapted to include one embodiment of a substrate edge gripper assembly according to the present invention
- FIG. 3A is a bottom view of one embodiment of a jaw assembly
- FIG. 3B is a sectional view of one embodiment of a gripper of the jaw assembly of FIG. 3A ;
- FIG. 6 is an isometric view of another embodiment of a substrate edge gripper assembly according to the present invention.
- the invention is a substrate edge grip apparatus for positioning a semiconductor substrate upon a transfer robot.
- the apparatus comprises spring loaded, modular jaws that are mounted on either side of a conventional transfer robot.
- the jaws are adapted to be actuated by a feature remote from the robot, e.g., the edges of a slit valve, chamber wall and the like.
- the apparatus is adapted to be incorporated in a conventional transfer robot with little or no modifications necessary to the robot itself.
- One example of a processing system which may be adapted to benefit from the invention is an CENTURA® processing system available from Applied Materials, Inc., located in Santa Clara, Calif.
- CENTURA® processing system available from Applied Materials, Inc., located in Santa Clara, Calif.
- the edge grip apparatus 150 is coupled to a transfer robot is described herein with reference to the exemplary processing system 100 , it is contemplated that the invention may be adapted and practiced in other processing systems having different configurations.
- the transfer chamber 102 is fabricated from a structural material suitable for use under vacuum conditions, for example, an aluminum or steel alloy. In one embodiment, the transfer chamber 102 is fabricated from a single piece of aluminum alloy. The transfer chamber 102 defines an evacuable interior volume 128 through which substrates are transferred between the processing chambers 104 coupled to the exterior of the transfer chamber 102 .
- a pumping system (not shown) is coupled to the transfer chamber 102 through a port 126 disposed on the chamber floor to maintain vacuum within the transfer chamber 102 . In one embodiment, the pumping system includes a roughing pump coupled in tandem to a turbomolecular or a cryogenic pump.
- the load lock chambers 106 are generally coupled between the factory interface 110 and the transfer chamber 102 .
- the load lock chambers 106 are generally used to facilitate transfer of the substrates 112 between the vacuum environment of the transfer chamber 102 and the substantially ambient environment of the factory interface 110 without loss of vacuum within the transfer chamber 102 .
- Each side of the load lock chambers 106 includes a substrate transfer passage that is selectively sealed by one of the slit valves 146 (shown only on the transfer chamber side of the load lock chambers 106 ) to selectively isolate the interiors of the load lock chambers 106 from the transfer chamber 102 and the factory interface 110 .
- the edge gripper assembly 150 generally comprises two jaw assemblies 206 a and 206 b (hereinafter collectively referred to as “jaw assemblies 206 ”) adapted to be mounted to the wrist 204 of the transfer robot 108 , in positions substantially lateral from a radial extension direction the blade 202 defined between the center axis of the robot 108 to the center of a substrate support disposed in one of the process or load lock chambers.
- each jaw assembly 206 comprises a jaw 208 , a mounting bracket 210 , and a biasing element 212 .
- the mounting bracket 210 is adapted for mounting the jaw assembly 206 to the wrist 204 of the robot blade 202 .
- the mounting bracket 210 is formed from a substantially rigid material such as aluminum or stainless steel.
- the mounting bracket 210 is mounted to the wrist 204 by a bolt 375 that is threaded into a hole 275 formed in the robot blade 202 .
- the jaw assembly 206 is configured not to substantially increase the height or width of the blade 202 . In this way, the jaw assembly 206 may be retrofitted to existing robots, and fit through existing slit valves, with little or no modification.
- the jaw 208 comprises a base 214 , an arm 216 , a striker 218 and a gripper 220 .
- the base 214 is adapted for mounting to the mounting bracket 210 and comprises a substantially polygonal plate having a first end 222 and a second end 224 .
- the base 214 includes a pivot hole 260 sized to accept a pin 226 for mounting the base 214 to the mounting bracket 210 .
- the base 214 is rotatable relative to the mounting bracket 210 about the pin 226 .
- the pin 226 and pivot hole 260 are formed from materials advantageously suitable for contact during relative rotation and minimizes particle generation.
- the arm 216 has a first end 228 that is coupled to the first end 222 of the base 214 , and a second end 230 that extends outwardly from the base 214 , ie., as a cantilever.
- the base 214 and the arm 216 form a substantially L-shaped structure.
- the gripper 220 is coupled to the second end 230 of the arm 216 .
- the grippers 220 are adapted for clamping the substrate 112 by its edge against a lip 280 extending upward from a distal end of the robot blade 202 .
- the gripper 220 includes a rotatable disk 300 adapted to capture an edge of the substrate 112 .
- the rotation of the disk 300 enables the gripper 220 to roll along the edge of the substrate 112 and maintain accurate positioning of the substrate 112 while substantially reducing damage to the substrate edges.
- the disk 300 is rotatably supported upon a shaft 302 that is press fit or otherwise coupled to the second end 230 of the arm 216 .
- the shaft 302 extends upward from the second end 230 of the arm 216 at an angle substantially normal to the arm 216 .
- a bearing 304 such as a ball, roller, or sleeve bearing, supports the disk 300 for rotation upon the shaft 302 .
- the disk 300 is formed from a substantially rigid material, such as of anodized aluminum.
- the gripper 220 may be fabricated from stainless steel, polymeric, ceramic or other material suitable for clamping a substrate disposed a processing chamber.
- the striker 218 is coupled to the second end 224 of the base 214 and in one embodiment projects upward therefrom, at an angle substantially normal to the base 214 and the arm 216 and substantially parallel to the pin 260 that couples the arm 216 to the mounting bracket 210 .
- the striker 218 comprises a shaft 232 and a roller 234 that is adapted to rotate about an axis substantially normal the base 214 and substantially parallel to the axis of the gripper assembly rotation.
- the roller 234 is formed from a substantially inert polymer such as polyimide or polyetheretherketone, among other materials.
- the striker 218 may project downward from the second end 224 of the base 214 .
- the biasing member 212 is coupled between the base 214 of the jaw 208 and the mounting bracket 210 .
- the biasing member 212 is generally adapted to bias the arm 216 and gripper 220 toward the center of the substrate 112 .
- the biasing member 212 is a flat spring having a first end coupled to the base 214 of the jaw 208 and a free end disposed against an interior surface of the mounting bracket 210 .
- the biasing member 212 may be a compression spring, a torsion spring, a gas spring, a magnet, a resilient material, a spring form, a linear actuator, a solenoid, or other device suitable for moving the arm 216 toward the center of the substrate 112 .
- the jaw 208 is biased to rotate about the pin 226 (as shown in phantom in FIG. 4 ).
- the mounting bracket 210 further includes a set of pins 236 a and 236 b (or other suitable mechanism) for restricting rotation of the arm 216 .
- the pins 236 a and 236 b are spaced apart from each other by a distance d that is large enough to accommodate the width of the arm 216 positioned therebetween, plus a pre-defined range of arm displacement.
- the inner pin 236 a is positioned to prevent the jaw 208 from moving radially inward to a position that would displace the substrate 112 off center.
- the outer pin 236 b is positioned to limit the size of the opening between the jaws 208 .
- at least one of the pins 236 a and 236 b is moveable to adjust the distance d that separates the pins 236 a and 236 b, and ultimately, the position of the grippers 220 of the arms 216 .
- the jaw assemblies 206 are mounted to the wrist 204 of the transfer robot 202 so that the arms 216 are orientated substantially parallel to each other and to the robot blade 202 when in an un-actuated or “closed” position (e.g., before the transfer robot 108 fully enters a processing chamber).
- the grippers 220 contact the edges of the substrate 112 to maintain the substrate 112 in a substantially centered position upon the robot blade 202 .
- the forward motion of the transfer robot 108 causes the strikers 218 to contact a lateral surface of the chamber (e.g., a chamber wall or an edge 402 of the slit valve 404 ).
- the jaw assemblies 206 are actuated mechanically by a structure remote from (e.g., not a part of) the robot 108 .
- This convention of using a feature of the system 100 remote from the robot 108 allows the gripper assembly 150 to be advantageously retro-fitted on existing systems with minimal cost and complexity.
- the strikers 218 contact an edge 402 of the slit valve 404 between the transfer chamber 502 and the processing chamber 504 .
- striker pads 406 may be mounted to the edges 402 of the slit valve 404 to absorb contact between the strikers 418 and the slit valve perimeter.
- the striker pads 406 are formed from a substantially rigid material such as aluminum or stainless steel.
- contact between the strikers 218 and the edges 402 of the slit valve 404 and/or striker pads 406 occurs as the blade 202 is extended out of the transfer chamber through the slit valve and into the process (or load lock) chamber as shown by arrow 420 .
- the jaws 208 are forced to rotate about the pin 226 .
- the arms 216 rotate outward relative to the robot blade 202 to an “open” position (shown in phantom in FIG. 4 ), thereby releasing the edges of the substrate 112 so that the substrate 112 may be transferred to a support assembly (not shown) within the processing chamber.
- the grippers 220 rotate to clamp the substrate against the lip 280 as the strikers 218 are moved away from the pads 406 as the blade 202 is removed from the chamber in a direction opposite the arrow 420 .
- the length of engagement between the stud 606 and hole 608 may be adjusted to set the pad 602 at a predefined length for the wall of the transfer chamber 102 , thereby setting the actuation point (i.e., where the striker 218 first contacts pad 602 ) as the gripper assembly 150 attached to the blade 202 enters a processing or load lock chamber through the slit valve.
- the adjustability of the actuation point advantageously ensures that the gripper assembly 150 is adequately clear from the substrate to allow transfer between the blade 202 and substrate support.
- a locking mechanism may be employed to fix the position of the pad 602 .
- the locking mechanism is a set screw 610 disposed in a cross hole formed in the bracket 604 .
- the set screw 610 may be tightened to engage the stud 606 , thereby preventing the stud 606 from turning.
- other types of locking mechanisms may be employed, such as lock nuts, thread lockers, locking inserts and the like.
- the substrate edge gripper assembly 150 thus enables accurate positioning of a semiconductor substrate 112 on the blade 202 of the robot 108 , reducing the probability of substrate or device damage due to misalignment. Moreover, the clamping of the substrate 112 to the blade 202 allows faster robot motion without movement of the substrate on the blade 202 , thereby reducing the time required for substrate transfers, which, in some processing sequences, increases substrate throughput.
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.
Description
- This application is a divisional application of co-pending U.S. patent application Ser. No. 10/758,753, filed Nov. 15, 2004 (APPM/8279), which is incorporated by reference herein.
- 1. Field of the Invention
- The present invention relates generally to the processing of semiconductor substrates, and relates more particularly to apparatuses for gripping an edge of a semiconductor substrate on a robot blade.
- 2. Background of the Related Art
- Semiconductor substrate processing is typically performed by subjecting a substrate to a plurality of sequential processes to create devices, conductors and insulators on the substrate. Each of these processes is generally performed in a process chamber configured to perform a single step of the production process. In order to efficiently complete the entire sequence of processing steps, a number of process chambers are typically coupled to a central transfer chamber that houses a robot to facilitate transfer of the substrate between the process chambers. A semiconductor processing platform having this configuration is generally known as a cluster tool, examples of which are the families of AKT PECVD, PRODUCER®, CENTURA® and ENDURA® processing platforms available from Applied Materials, Inc., of Santa Clara, Calif.
- Generally, a cluster tool comprises a central transfer chamber generally surrounded by one or more process chambers. The process chambers are generally utilized to process the substrate, for example, performing various processing steps such as etching, physical vapor deposition, ion implantation, lithography and the like. The transfer chamber is typically coupled to a factory interface that houses a plurality of removable substrate storage cassettes, each of which houses a plurality of substrates. To facilitate transfer of a substrate between a vacuum environment of the transfer chamber and a generally ambient environment of the factory interface, a load lock chamber is disposed between the transfer chamber and the factory interface.
- A substrate transfer robot is disposed in the cluster tool and used to transfer substrates between the process and load lock chambers. Proper positioning of the substrate on the blade of the transfer robot is critical to ensure that the substrate does not become damaged or misaligned during transfer to process chambers and to achieve repeatable processing results. Thus, the manner in which the transfer robot contacts and positions the substrate on the robot blade may affect the final processing results.
- Existing methods for centering a substrate on the robot blade are typically passive in nature (e.g., in some embodiments, the substrate sits in a pocket in the blade or compensate for misalignment by altering the motion of the motor). While these methods have generally proven to be reliable and repeatable, processes directed at reducing dimensions during device fabrication are increasingly demanding finer, more accurate and repeatable substrate placement on the blade to ensure robust processing results. As such, it is desirable that more active positioning mechanisms be developed that are capable of accurately centering a substrate on a blade without damaging the substrate itself.
- Therefore, there is a need for an improved apparatus for positioning a substrate on a robot blade.
- In one embodiment, a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot is provided. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effectors, such as a substrate support blade. The jaws are adapted to be mechanically actuated by a feature remote from the robot, e.g., the edges of a slit valve, chamber wall and the like, to release the substrate for delivery.
- So that the manner in which the above recited features of the present invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings.
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FIG. 1 is a plan view a semiconductor processing system having a transfer robot adapted to include one embodiment of a substrate edge gripper assembly according to the present invention; -
FIG. 2 is a top view of a substrate transfer robot adapted to include one embodiment of a substrate edge gripper assembly according to the present invention; -
FIG. 3A is a bottom view of one embodiment of a jaw assembly; -
FIG. 3B is a sectional view of one embodiment of a gripper of the jaw assembly ofFIG. 3A ; -
FIG. 4 is a bottom view of the transfer robot and substrate edge gripper assembly illustrated inFIG. 2 ; -
FIG. 5 is an isometric view showing the substrate edge gripper assembly ofFIG. 2 being actuated by contact with a slit valve; and -
FIG. 6 is an isometric view of another embodiment of a substrate edge gripper assembly according to the present invention. - It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
- In one embodiment, the invention is a substrate edge grip apparatus for positioning a semiconductor substrate upon a transfer robot. In one embodiment, the apparatus comprises spring loaded, modular jaws that are mounted on either side of a conventional transfer robot. The jaws are adapted to be actuated by a feature remote from the robot, e.g., the edges of a slit valve, chamber wall and the like. The apparatus is adapted to be incorporated in a conventional transfer robot with little or no modifications necessary to the robot itself.
-
FIG. 1 depicts one embodiment of asemiconductor processing system 100 that has been adapted to incorporate the substrateedge grip apparatus 150 of the present invention. Theexemplary processing system 100 generally includes atransfer chamber 102 circumscribed by one ormore processing chambers 104, afactory interface 110 and one or moreload lock chambers 106. In the embodiment depicted inFIG. 1 , twoload lock chambers 106 are disposed between thetransfer chamber 102 and thefactory interface 110 to facilitate substrate transfer between a vacuum environment maintained in thetransfer chamber 102 and a substantially ambient environment maintained in thefactory interface 110. Atransfer robot 108 having theedge grip apparatus 150 is centrally disposed in thetransfer chamber 102 to move substrates between thechambers edge grip apparatus 150 is coupled to a transfer robot is described herein with reference to theexemplary processing system 100, it is contemplated that the invention may be adapted and practiced in other processing systems having different configurations. - The
factory interface FI 110 generally houses one or moresubstrate storage cassettes 114 and aFI robot 116. Eachcassette 114 is configured to store a plurality ofsubstrates 112 therein. TheFI robot 116 is generally adapted to transfer substrates between theload lock chambers 106 and thesubstrate storage cassettes 114. Thefactory interface 110 is generally maintained at or near atmospheric pressure. In one embodiment, filtered air is supplied to thefactory interface 110 to minimize the concentration of particles within thefactory interface 110 and correspondingly enhance substrate cleanliness. - The
transfer chamber 102 is fabricated from a structural material suitable for use under vacuum conditions, for example, an aluminum or steel alloy. In one embodiment, thetransfer chamber 102 is fabricated from a single piece of aluminum alloy. Thetransfer chamber 102 defines an evacuableinterior volume 128 through which substrates are transferred between theprocessing chambers 104 coupled to the exterior of thetransfer chamber 102. A pumping system (not shown) is coupled to thetransfer chamber 102 through aport 126 disposed on the chamber floor to maintain vacuum within thetransfer chamber 102. In one embodiment, the pumping system includes a roughing pump coupled in tandem to a turbomolecular or a cryogenic pump. - The
transfer chamber 102 includes a plurality of facets (shown byreference numerals 142A-G, and collectively referred to as “facets 142”) for mounting the various processing andload lock chambers passage 144 is formed through each facet 142 coupling therespective chambers interior volume 128 of thetransfer chamber 102. Eachpassage 144 is selectively sealed by aslit valve 146 that is movable between a closed position that isolates the chamber environments and an open position that facilitates substrate transfer between thechambers - Each
processing chamber 104 is typically bolted to one of the facets 142 on the exterior of thetransfer chamber 102. Examples of processingchambers 104 that may be utilized include etch chambers, physical vapor deposition chambers, heat treatment chambers, chemical vapor deposition chambers, ion implantation chambers, orientation chambers, lithography chambers and the like.Different processing chambers 104 may be coupled to thetransfer chamber 102 to provide a processing sequence necessary to form a predefined structure or feature upon the substrate surface. - The
load lock chambers 106 are generally coupled between thefactory interface 110 and thetransfer chamber 102. Theload lock chambers 106 are generally used to facilitate transfer of thesubstrates 112 between the vacuum environment of thetransfer chamber 102 and the substantially ambient environment of thefactory interface 110 without loss of vacuum within thetransfer chamber 102. Each side of theload lock chambers 106 includes a substrate transfer passage that is selectively sealed by one of the slit valves 146 (shown only on the transfer chamber side of the load lock chambers 106) to selectively isolate the interiors of theload lock chambers 106 from thetransfer chamber 102 and thefactory interface 110. - The
substrate transfer robot 108 is generally disposed in theinterior volume 128 of thetransfer chamber 102 to facilitate transfer of thesubstrates 112 between the various chambers circumscribing thetransfer chamber 102. Thetransfer robot 108 may include one or more end effectors (blades 202 are shown in phantom inFIG. 1 ) utilized to support thesubstrate 112 during transfer. Thetransfer robot 108 may have two blades, each coupled to an independently controllable motor (known as a dual blade robot) or have two blades coupled to thetransfer robot 108 through a common linkage. The axis of rotation of thetransfer robot 108 is typically coaxial with a centerline of thetransfer chamber 102 that extends perpendicular to the plane ofFIG. 1 from which the robot motion is referenced. An example of a suitable substrate transfer robot is a VHP® transfer robot, commercially available from Applied Materials, Inc. of Santa Clara, Calif. It is contemplated that robots having other configurations suitable for use in vacuum environments may be utilized. - The substrate
edge grip assembly 150 is mounted to theblade 202 of thetransfer robot 108 for selectively gripping the edges of thesubstrate 112. The term blade used herein may be any type of robot end effector suitable for supporting a substrate during transfer. Although not shown for brevity inFIG. 1 , the substrateedge grip assembly 150 may also be coupled to theFI robot 116, or other robot. -
FIG. 2 is a top view of thetransfer robot 108 that has one embodiment of the substrateedge grip assembly 150 of the present invention mounted thereto. In the embodiment illustrated inFIG. 2 , thetransfer robot 108 includes a single blade orend effector 202 coupled to awrist 204, for supporting a substrate 112 (shown in phantom). - The
edge gripper assembly 150 generally comprises twojaw assemblies wrist 204 of thetransfer robot 108, in positions substantially lateral from a radial extension direction theblade 202 defined between the center axis of therobot 108 to the center of a substrate support disposed in one of the process or load lock chambers. Referring simultaneously toFIG. 2 andFIG. 3A , which is an isometric view of onejaw assembly 206 b (jaw assembly 206 a being substantially configured in a mirror image ofjaw assembly 206 b), each jaw assembly 206 comprises ajaw 208, a mountingbracket 210, and abiasing element 212. - The mounting
bracket 210 is adapted for mounting the jaw assembly 206 to thewrist 204 of therobot blade 202. In one embodiment, the mountingbracket 210 is formed from a substantially rigid material such as aluminum or stainless steel. In one embodiment, the mountingbracket 210 is mounted to thewrist 204 by abolt 375 that is threaded into ahole 275 formed in therobot blade 202. The jaw assembly 206 is configured not to substantially increase the height or width of theblade 202. In this way, the jaw assembly 206 may be retrofitted to existing robots, and fit through existing slit valves, with little or no modification. - The
jaw 208 comprises abase 214, anarm 216, astriker 218 and agripper 220. Thebase 214 is adapted for mounting to the mountingbracket 210 and comprises a substantially polygonal plate having afirst end 222 and asecond end 224. Thebase 214 includes apivot hole 260 sized to accept apin 226 for mounting the base 214 to the mountingbracket 210. Thebase 214 is rotatable relative to the mountingbracket 210 about thepin 226. In one embodiment, thepin 226 andpivot hole 260 are formed from materials advantageously suitable for contact during relative rotation and minimizes particle generation. In another embodiment, thepin 226 andpivot hole 260 are separated by a bearing surface, such as a ball, roller or sleeve bearing, to facilitate relative rotation. In another embodiment, depicted inFIG. 3A , thepin 226 is retained within thepivot hole 260 by a retainingring 270. - The
arm 216 has afirst end 228 that is coupled to thefirst end 222 of thebase 214, and asecond end 230 that extends outwardly from thebase 214, ie., as a cantilever. In one embodiment, thebase 214 and thearm 216 form a substantially L-shaped structure. Thegripper 220 is coupled to thesecond end 230 of thearm 216. Thegrippers 220 are adapted for clamping thesubstrate 112 by its edge against alip 280 extending upward from a distal end of therobot blade 202. - In one embodiment illustrated in
FIG. 3B , thegripper 220 includes arotatable disk 300 adapted to capture an edge of thesubstrate 112. The rotation of thedisk 300 enables thegripper 220 to roll along the edge of thesubstrate 112 and maintain accurate positioning of thesubstrate 112 while substantially reducing damage to the substrate edges. Thedisk 300 is rotatably supported upon ashaft 302 that is press fit or otherwise coupled to thesecond end 230 of thearm 216. Theshaft 302 extends upward from thesecond end 230 of thearm 216 at an angle substantially normal to thearm 216. In one embodiment, abearing 304, such as a ball, roller, or sleeve bearing, supports thedisk 300 for rotation upon theshaft 302. In one embodiment, thedisk 300 is formed from a substantially rigid material, such as of anodized aluminum. Alternatively, thegripper 220 may be fabricated from stainless steel, polymeric, ceramic or other material suitable for clamping a substrate disposed a processing chamber. - Returning to
FIGS. 2 and 3 A, thestriker 218 is coupled to thesecond end 224 of thebase 214 and in one embodiment projects upward therefrom, at an angle substantially normal to thebase 214 and thearm 216 and substantially parallel to thepin 260 that couples thearm 216 to the mountingbracket 210. In one embodiment, thestriker 218 comprises ashaft 232 and aroller 234 that is adapted to rotate about an axis substantially normal thebase 214 and substantially parallel to the axis of the gripper assembly rotation. In one embodiment, theroller 234 is formed from a substantially inert polymer such as polyimide or polyetheretherketone, among other materials. Alternatively, thestriker 218 may project downward from thesecond end 224 of thebase 214. - The biasing
member 212 is coupled between the base 214 of thejaw 208 and the mountingbracket 210. The biasingmember 212 is generally adapted to bias thearm 216 andgripper 220 toward the center of thesubstrate 112. In one embodiment, the biasingmember 212 is a flat spring having a first end coupled to thebase 214 of thejaw 208 and a free end disposed against an interior surface of the mountingbracket 210. Alternatively, the biasingmember 212 may be a compression spring, a torsion spring, a gas spring, a magnet, a resilient material, a spring form, a linear actuator, a solenoid, or other device suitable for moving thearm 216 toward the center of thesubstrate 112. - Referring simultaneously to
FIG. 3A and toFIG. 4 , which is a bottom view of the substrateedge grip assembly 150 illustrated inFIG. 2 , thejaw 208 is biased to rotate about the pin 226 (as shown in phantom inFIG. 4 ). In another embodiment, the mountingbracket 210 further includes a set ofpins arm 216. In one embodiment, thepins arm 216 positioned therebetween, plus a pre-defined range of arm displacement. Theinner pin 236 a is positioned to prevent thejaw 208 from moving radially inward to a position that would displace thesubstrate 112 off center. Theouter pin 236 b is positioned to limit the size of the opening between thejaws 208. In one embodiment, at least one of thepins pins grippers 220 of thearms 216. - As illustrated in
FIGS. 2 and 4 , the jaw assemblies 206 are mounted to thewrist 204 of thetransfer robot 202 so that thearms 216 are orientated substantially parallel to each other and to therobot blade 202 when in an un-actuated or “closed” position (e.g., before thetransfer robot 108 fully enters a processing chamber). Thegrippers 220 contact the edges of thesubstrate 112 to maintain thesubstrate 112 in a substantially centered position upon therobot blade 202. As thetransfer robot 108 enters a processing chamber to deliver thesubstrate 112, the forward motion of thetransfer robot 108 causes thestrikers 218 to contact a lateral surface of the chamber (e.g., a chamber wall or anedge 402 of the slit valve 404). Thus, the jaw assemblies 206 are actuated mechanically by a structure remote from (e.g., not a part of) therobot 108. This convention of using a feature of thesystem 100 remote from therobot 108 allows thegripper assembly 150 to be advantageously retro-fitted on existing systems with minimal cost and complexity. - In one embodiment illustrated in isometric view in
FIG. 5 , thestrikers 218 contact anedge 402 of theslit valve 404 between thetransfer chamber 502 and theprocessing chamber 504. In one embodiment,striker pads 406 may be mounted to theedges 402 of theslit valve 404 to absorb contact between the strikers 418 and the slit valve perimeter. In one embodiment, thestriker pads 406 are formed from a substantially rigid material such as aluminum or stainless steel. - Referring back to
FIG. 4 , contact between thestrikers 218 and theedges 402 of theslit valve 404 and/orstriker pads 406 occurs as theblade 202 is extended out of the transfer chamber through the slit valve and into the process (or load lock) chamber as shown byarrow 420. As thestrikers 218 contact thepads 406, thejaws 208 are forced to rotate about thepin 226. Thearms 216 rotate outward relative to therobot blade 202 to an “open” position (shown in phantom inFIG. 4 ), thereby releasing the edges of thesubstrate 112 so that thesubstrate 112 may be transferred to a support assembly (not shown) within the processing chamber. Conversely, when entering a chamber to retrieve a substrate disposed therein, thegrippers 220 rotate to clamp the substrate against thelip 280 as thestrikers 218 are moved away from thepads 406 as theblade 202 is removed from the chamber in a direction opposite thearrow 420. -
FIG. 6 is another embodiment of a ofstriker pad 602 that may be adjusted to set the actuation point of thestriker 218 of theedge gripper assembly 150. Thestriker pad 602 is coupled to a threadedstud 606 that engages ahole 608 formed in a strikepad mounting bracket 604. The mountingbracket 604 is coupled to the slit valve or a wall of thetransfer chamber 102. Thehole 608 may be alternatively be formed in the slit valve or a wall of thetransfer chamber 102. - The length of engagement between the
stud 606 andhole 608 may be adjusted to set thepad 602 at a predefined length for the wall of thetransfer chamber 102, thereby setting the actuation point (i.e., where thestriker 218 first contacts pad 602) as thegripper assembly 150 attached to theblade 202 enters a processing or load lock chamber through the slit valve. The adjustability of the actuation point advantageously ensures that thegripper assembly 150 is adequately clear from the substrate to allow transfer between theblade 202 and substrate support. - A locking mechanism may be employed to fix the position of the
pad 602. In one embodiment, the locking mechanism is aset screw 610 disposed in a cross hole formed in thebracket 604. Theset screw 610 may be tightened to engage thestud 606, thereby preventing thestud 606 from turning. It is contemplated that other types of locking mechanisms may be employed, such as lock nuts, thread lockers, locking inserts and the like. - In the embodiment depicted in
FIG. 6 , thestriker 218 may optionally include asleeve 622 coupled to ashaft 624 extending from thebase 214. Abearing 620 is disposed between thesleeve 622 and theshaft 624 to allow thesleeve 622 to rotate when in contact with thepad 602 as theblade 202 moves through the slit valve. Thebearing 620 may be a ball bearing, roller bearing, sleeve bearing or the like. Therotating sleeve 622 advantageously reduces particle generation and extends the service life of both thepad 602 andsleeve 624. - The substrate
edge gripper assembly 150 thus enables accurate positioning of asemiconductor substrate 112 on theblade 202 of therobot 108, reducing the probability of substrate or device damage due to misalignment. Moreover, the clamping of thesubstrate 112 to theblade 202 allows faster robot motion without movement of the substrate on theblade 202, thereby reducing the time required for substrate transfers, which, in some processing sequences, increases substrate throughput. - Additionally, as the height of the
edge gripper assembly 150 is not substantially higher than the height of thewrist 204, theedge gripper assembly 150 does not impeded the ability of therobot blade 202 to pass through theslit valve 404, thereby making theedge gripper assembly 150 easily retro-fittable to existing robots with little cost or complexity. Thus, the present invention represents a significant advancement in the field of semiconductor substrate processing. - While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (22)
1. An apparatus for positioning a substrate on a transfer robot comprising:
a rotatable jaw comprising:
a base portion having a first end and a second end; and
an arm extending from the first end of the base portion to a gripper adapted to contact an edge of the substrate;
a mounting bracket pivotably coupled to the base portion between the first and second ends, the mounting bracket adapted for mounting to a portion of the transfer robot; and
a biasing member disposed between the jaw and the mounting bracket, the biasing member urging the jaw to rotate about an axis substantially normal to the jaw.
2. The apparatus of claim 1 , further comprising:
a striker coupled to the second end of the base portion and extending therefrom at an angle substantially normal to the base portion;
3. The apparatus of claim 2 , wherein the jaw is adapted to rotate upon contact of the striker with a feature remote from the transfer robot.
4. The apparatus of claim 1 , wherein the jaw further comprises:
a pivot hole disposed through the first end of the base portion; and
a pin disposed through the pivot hole and coupling the jaw to the mounting bracket, the jaw.
5. The apparatus of claim 2 , wherein the gripper comprises:
a shaft having a first end coupled to the arm; and
a disk supported for rotation upon a second end of the shaft.
6. The apparatus of claim 5 , wherein a bearing is disposed between the shaft and the disk.
7. The apparatus of claim 2 , wherein the striker comprises:
a shaft projecting from the base portion at an angle substantially normal to the base portion; and
a sleeve coupled to the shaft and adapted to rotate about a longitudinal axis of the shaft.
8. The apparatus of claim 7 , wherein a bearing is disposed between the shaft and the sleeve.
9. The apparatus of claim 1 , wherein the angular displacement of the jaw is adjustable.
10. The apparatus of claim 9 , wherein the mounting bracket further comprises:
a first pin extending outwardly from the mounting bracket; and
a second pin extending outwardly from the mounting bracket, the jaw separating the first and second pins, wherein a position of at least on of the pins is adjustable to limit the displacement of the jaw.
11. The apparatus of claim 1 , wherein the biasing member is at least one of a flat spring, a compression spring, a torsion spring, a gas spring, a magnet, a resilient material, a spring form, a linear actuator, a solenoid.
12. A robot adapted for transferring a substrate from a first location to a second location within a semiconductor substrate processing system, comprising:
a robot having a linkage for moving at least one end effector adapted for supporting the substrate thereon; and
at least two rotatable jaws coupled to opposite sides of the end effector, wherein each jaw is mechanically actuatable by a structure remote from the robot and end effector.
13. The robot of claim 12 , wherein each jaw comprises:
a base portion adapted for rotation about an axis substantially normal to a direction of extension of the end effector, the base portion having a first end and a second end; and
an arm extending from the first end of the base portion to a gripper adapted to contact an edge of the substrate.
14. The robot of claim 12 , further comprising:
a mounting bracket adapted for mounting at least a first jaw of the jaws to the robot; and
a biasing member disposed between the first jaw and the mounting bracket, and urging the jaw to rotate about an axis substantially normal to a direction of extension of the end effector.
15. The robot of claim 13 , wherein each jaw further comprises:
a striker coupled to the second end of the base portion and extending therefrom at an angle substantially normal to the base portion.
16. The robot of claim 15 , wherein each jaw is adapted to rotate outward relative to the robot end effector upon contact of the striker with the structure remote from the robot and end effector.
17. The robot of claim 13 , wherein the each jaw further comprises:
a pivot hole disposed through the first end of the base portion; and
a pin disposed through the pivot hole and coupling the jaw to the mounting bracket.
18. The robot of claim 12 , wherein each gripper further comprises:
a shaft having a first end coupled to the arm; and
a disk supported for rotation upon a second end of the shaft.
19. The robot of claim 18 , wherein a bearing is disposed between the shaft and the disk.
20. The robot of claim 15 , wherein the striker comprises:
a shaft projecting from the base portion at an angle substantially normal to the base portion; and
a sleeve coupled to the shaft and adapted to rotate about a longitudinal axis of the shaft.
21. The robot of claim 12 , wherein the angular displacement of the jaws are adjustable.
22. The robot of claim 21 further comprising:
a biasing member adapted to rotationally urge at least one of the jaws, wherein the biasing member is at least one of a flat spring, a compression spring, a torsion spring, a gas spring, a magnet, a resilient material, a spring form, a linear actuator, a solenoid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/423,970 US20060245856A1 (en) | 2004-01-15 | 2006-06-14 | Substrate edge grip apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/758,753 US7226269B2 (en) | 2004-01-15 | 2004-01-15 | Substrate edge grip apparatus |
US11/423,970 US20060245856A1 (en) | 2004-01-15 | 2006-06-14 | Substrate edge grip apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/758,753 Division US7226269B2 (en) | 2004-01-15 | 2004-01-15 | Substrate edge grip apparatus |
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US20060245856A1 true US20060245856A1 (en) | 2006-11-02 |
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US10/758,753 Active 2025-02-17 US7226269B2 (en) | 2004-01-15 | 2004-01-15 | Substrate edge grip apparatus |
US11/423,970 Abandoned US20060245856A1 (en) | 2004-01-15 | 2006-06-14 | Substrate edge grip apparatus |
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US10/758,753 Active 2025-02-17 US7226269B2 (en) | 2004-01-15 | 2004-01-15 | Substrate edge grip apparatus |
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US20130294877A1 (en) * | 2011-11-29 | 2013-11-07 | Persimmon Technologies Corporation | Vacuum Robot Adapted to Grip and Transport a Substrate and Method Thereof |
US10002781B2 (en) | 2014-11-10 | 2018-06-19 | Brooks Automation, Inc. | Tool auto-teach method and apparatus |
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US7374391B2 (en) * | 2005-12-22 | 2008-05-20 | Applied Materials, Inc. | Substrate gripper for a substrate handling robot |
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Also Published As
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US7226269B2 (en) | 2007-06-05 |
US20050158153A1 (en) | 2005-07-21 |
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