US20050199369A1 - Dual centrifugal fan structure and heat dissipation device having the fan structure - Google Patents
Dual centrifugal fan structure and heat dissipation device having the fan structure Download PDFInfo
- Publication number
- US20050199369A1 US20050199369A1 US10/799,664 US79966404A US2005199369A1 US 20050199369 A1 US20050199369 A1 US 20050199369A1 US 79966404 A US79966404 A US 79966404A US 2005199369 A1 US2005199369 A1 US 2005199369A1
- Authority
- US
- United States
- Prior art keywords
- housing
- centrifugal
- centrifugal fan
- chamber
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000009977 dual effect Effects 0.000 title claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000003570 air Substances 0.000 description 11
- 239000012080 ambient air Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/02—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps having non-centrifugal stages, e.g. centripetal
- F04D17/04—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps having non-centrifugal stages, e.g. centripetal of transverse-flow type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/16—Combinations of two or more pumps ; Producing two or more separate gas flows
- F04D25/166—Combinations of two or more pumps ; Producing two or more separate gas flows using fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates in general to dual centrifugal fan structure and a heat dissipation device for the fan structure, and more particularly, to a fan structure having two centrifugal fans and a heat dissipation device having the fan structure.
- FIG. 1 shows a conventional heat dissipation device 1 a applied to a central processing unit (CPU) 2 a .
- the heat dissipation device 1 a comprises a heat sink 10 a and an axial-flow fan 11 a .
- the heat sink 10 a includes a substrate 100 a attached to the top surface of the central processing unit 2 a and a plurality of vertical fins 101 a integrally formed on the substrate 100 a .
- the axial-flow fan 11 a is mounted on the fins 101 a . Therefore, when the central processing unit 2 a is operating, the heat generated thereby is conducted towards the fins 101 through the substrate 100 a and circulated by the fan 11 a to be absorbed by ambient air.
- the upgraded technology provides more powerful functions and faster operation speed of the central processing unit 2 a .
- the heat generated thereby is increased.
- the overall heat dissipation efficiency of the conventional heat dissipation device does not comply with the increased heat.
- the air generated by the axial-flow fan 11 a is circulated downwardly, the heat cannot be dissipated to the ambient.
- the present invention provides a dual centrifugal fan structure and a heat dissipation device having the fan structure.
- the fan structure has two fans arranged in parallel with each other for heat dissipation, such that the overall heat dissipation efficiency of the heat dissipation device is enhanced.
- the centrifugal fan structure provided by the present invention includes a first centrifugal fan, a second centrifugal fan, and a housing.
- the housing is a hollow enclosure divided into a first chamber and a second chamber for installing the first and second centrifugal fans, respectively.
- the first and second chambers have first and second air inlets, respectively.
- the housing further comprises an air outlet.
- the present invention further provides a heat dissipation device which comprises a heat sink, a wind mask mounted on the heat sink, and a first and second centrifugal fans are arranged in parallel on top of the wind mask.
- FIG. 1 shows the operation status of a conventional heat dissipation device
- FIG. 2 is an exploded view of a heat dissipation device in a first embodiment of the present invention
- FIG. 3 is a perspective view of the heat dissipation device as shown in FIG. 2 ;
- FIG. 4 is a cross sectional view of the heat dissipation device as shown in FIG. 2 ;
- FIG. 5 is a cross sectional view of a heat dissipation device in a second embodiment of the present invention.
- FIG. 6 is a cross sectional view of a heat dissipation device in a third embodiment of the present invention.
- FIG. 7 is a cross sectional view of a heat dissipation device in a fourth embodiment of the present invention.
- FIG. 8 shows a perspective view of a heat dissipation device in a fifth embodiment of the present invention.
- the heat dissipation device includes a dual centrifugal fan structure.
- the dual centrifugal fan structure includes a housing 10 , which is divided into a first chamber 101 and a second chamber 102 arranged in left-hand side and right-hand side, respectively, as shown in FIG. 4 .
- the fan structure further comprises a first centrifugal fan 11 and a second centrifugal fan 12 disposed in the first and second chambers 101 and 102 , respectively.
- the first and second chambers 101 and 102 include a first air inlet 103 and a second air inlet 104 formed at the top of the housing 10 .
- An air outlet 105 is formed at the bottom of the housing 10 . The air outlet 105 extends to both first and second chambers 101 and 102 .
- the first and second centrifugal fans 11 and 12 include centrifugal blades 110 and 120 and motors 111 and 121 for driving the centrifugal blades 110 and 120 , respectively.
- the blades 110 and 120 are oriented towards opposite directions, such that rotation directions of the first and second centrifugal fans 11 and 12 are opposite to each other as shown in FIG. 4 .
- the first and second centrifugal fans 11 and 12 are mounted inside of the first and second chambers 101 and 102 by a pair of support arms 106 formed in the first and second chambers 101 and 102 .
- the support arms 106 are also operative to support and interlink the motors 111 and 121 within the first and second chambers 11 and 12 .
- the fan structure includes a wind mask 2 and a heat sink 3 .
- the heat sink 3 includes an aluminum extrusion type heat sink or other types of heat sinks.
- the heat sink 3 comprises a thermal conductive substrate 30 , a plurality of fins 31 extending from the thermal conductive substrate 30 , and a plurality of channels 32 formed between the fins 31 .
- the wind mask 2 is disposed over the heat sink 3 under the dual centrifugal fan structure 1 .
- the wind mask 2 has a top panel and a sidewall extending from a periphery of the top panel.
- the wind mask 2 has an n-shape cross section.
- the top panel is open with two through holes 20 and 21 aligned with the air outlet 105 of the housing 10 .
- a protruding rim 100 is formed along a bottom periphery of the housing 10 .
- a protruding rim 100 is formed to extend outwardly from a bottom periphery of the housing 10 .
- a plurality of holes 107 is formed through the protruding rim 100 , and a plurality of threaded holes 22 are formed through the top panel of the wind mask 2 , such that the housing 10 can be fitted on top of the wind mask 2 using fastening devices such as screws extending through the holes 107 and the holes 22 aligned therewith.
- the sidewall of the wind mask 2 can also be engaged with the thermal conductive substrate 30 of the heat sink 3 in the same manner.
- the fan structure 1 facilitates heat dissipation by activate opposite rotation of the fans 11 and 12 , which then circulate and dissipate heat generated by the central process unit 4 towards two lateral sides of the channel 32 between the fins 33 . Thereby, a good heat dissipation effect is resulted.
- FIG. 5 shows an operation status of the heat dissipation device.
- the heat sink 3 includes a thermal conductive substrate 30 .
- the thermal conductive substrate 30 has a central spike 33 formed by a pair of curves descending towards two elongate sides of the substrate 30 . Therefore, wind or air generated by the fans 11 and 12 can be circulated towards the channels between the fins 33 , such that direct impact of air can be suppressed.
- FIGS. 6 and 7 cross sectional views of the third and fourth embodiments are shown.
- the first and second air inlets 103 and 104 of the housing 10 are formed at two lateral sides of the housing 10 (as shown in FIG. 6 ) or at the front and rear ends of the housing (as shown in FIG. 7 ).
- FIG. 8 shows the fifth embodiment of the present invention.
- the housing 10 includes separate first housing 10 ′ and second housing 10 ′′, and the fans 11 and 12 disposed in the first and second housings 10 ′ and 10 ′′ are aligned with the vent holes 20 and 21 at the top of the wind mask 2 .
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- The present invention relates in general to dual centrifugal fan structure and a heat dissipation device for the fan structure, and more particularly, to a fan structure having two centrifugal fans and a heat dissipation device having the fan structure.
-
FIG. 1 shows a conventional heat dissipation device 1 a applied to a central processing unit (CPU) 2 a. The heat dissipation device 1 a comprises aheat sink 10 a and an axial-flow fan 11 a. Theheat sink 10 a includes asubstrate 100 a attached to the top surface of the central processing unit 2 a and a plurality ofvertical fins 101 a integrally formed on thesubstrate 100 a. The axial-flow fan 11 a is mounted on thefins 101 a. Therefore, when the central processing unit 2 a is operating, the heat generated thereby is conducted towards thefins 101 through thesubstrate 100 a and circulated by thefan 11 a to be absorbed by ambient air. - The upgraded technology provides more powerful functions and faster operation speed of the central processing unit 2 a. As a consequence, the heat generated thereby is increased. However, the overall heat dissipation efficiency of the conventional heat dissipation device does not comply with the increased heat. Further, as the air generated by the axial-
flow fan 11 a is circulated downwardly, the heat cannot be dissipated to the ambient. - Therefore, there exist deficiency for practically application of the above-mentioned conventional heat dissipation device. There is thus a substantial need to provide a dual centrifugal fan structure and a heat dissipation device having the fan structure that resolves the above drawbacks and can be used more conveniently and practically.
- The present invention provides a dual centrifugal fan structure and a heat dissipation device having the fan structure. The fan structure has two fans arranged in parallel with each other for heat dissipation, such that the overall heat dissipation efficiency of the heat dissipation device is enhanced.
- The centrifugal fan structure provided by the present invention includes a first centrifugal fan, a second centrifugal fan, and a housing. The housing is a hollow enclosure divided into a first chamber and a second chamber for installing the first and second centrifugal fans, respectively. The first and second chambers have first and second air inlets, respectively. The housing further comprises an air outlet.
- The present invention further provides a heat dissipation device which comprises a heat sink, a wind mask mounted on the heat sink, and a first and second centrifugal fans are arranged in parallel on top of the wind mask.
- These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
- The above objects and advantages of the present invention will be become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
-
FIG. 1 shows the operation status of a conventional heat dissipation device; -
FIG. 2 is an exploded view of a heat dissipation device in a first embodiment of the present invention; -
FIG. 3 is a perspective view of the heat dissipation device as shown inFIG. 2 ; -
FIG. 4 is a cross sectional view of the heat dissipation device as shown inFIG. 2 ; -
FIG. 5 is a cross sectional view of a heat dissipation device in a second embodiment of the present invention; -
FIG. 6 is a cross sectional view of a heat dissipation device in a third embodiment of the present invention; -
FIG. 7 is a cross sectional view of a heat dissipation device in a fourth embodiment of the present invention; and -
FIG. 8 shows a perspective view of a heat dissipation device in a fifth embodiment of the present invention. - Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
- As shown in
FIGS. 2 and 3 , exploded view and perspective view of a heat dissipation device of the present invention. The heat dissipation device includes a dual centrifugal fan structure. In this embodiment, the dual centrifugal fan structure includes ahousing 10, which is divided into afirst chamber 101 and asecond chamber 102 arranged in left-hand side and right-hand side, respectively, as shown inFIG. 4 . The fan structure further comprises a firstcentrifugal fan 11 and a secondcentrifugal fan 12 disposed in the first andsecond chambers - The first and
second chambers first air inlet 103 and asecond air inlet 104 formed at the top of thehousing 10. Anair outlet 105 is formed at the bottom of thehousing 10. Theair outlet 105 extends to both first andsecond chambers - The first and second
centrifugal fans centrifugal blades motors centrifugal blades blades centrifugal fans FIG. 4 . The first and secondcentrifugal fans second chambers support arms 106 formed in the first andsecond chambers support arms 106 are also operative to support and interlink themotors second chambers - As shown in
FIG. 4 , the fan structure includes awind mask 2 and aheat sink 3. Theheat sink 3 includes an aluminum extrusion type heat sink or other types of heat sinks. As shown, theheat sink 3 comprises a thermalconductive substrate 30, a plurality offins 31 extending from the thermalconductive substrate 30, and a plurality ofchannels 32 formed between thefins 31. - The
wind mask 2 is disposed over theheat sink 3 under the dualcentrifugal fan structure 1. Thewind mask 2 has a top panel and a sidewall extending from a periphery of the top panel. Preferably, thewind mask 2 has an n-shape cross section. The top panel is open with two throughholes air outlet 105 of thehousing 10. Aprotruding rim 100 is formed along a bottom periphery of thehousing 10. Aprotruding rim 100 is formed to extend outwardly from a bottom periphery of thehousing 10. A plurality ofholes 107 is formed through theprotruding rim 100, and a plurality of threadedholes 22 are formed through the top panel of thewind mask 2, such that thehousing 10 can be fitted on top of thewind mask 2 using fastening devices such as screws extending through theholes 107 and theholes 22 aligned therewith. The sidewall of thewind mask 2 can also be engaged with the thermalconductive substrate 30 of theheat sink 3 in the same manner. - As shown in
FIG. 4 , when the heat dissipation device is applied to a central processing unit (CPU) 4, thefan structure 1 facilitates heat dissipation by activate opposite rotation of thefans central process unit 4 towards two lateral sides of thechannel 32 between the fins 33. Thereby, a good heat dissipation effect is resulted. -
FIG. 5 shows an operation status of the heat dissipation device. In this embodiment, theheat sink 3 includes a thermalconductive substrate 30. The thermalconductive substrate 30 has a central spike 33 formed by a pair of curves descending towards two elongate sides of thesubstrate 30. Therefore, wind or air generated by thefans - As shown in
FIGS. 6 and 7 , cross sectional views of the third and fourth embodiments are shown. The first andsecond air inlets housing 10 are formed at two lateral sides of the housing 10 (as shown inFIG. 6 ) or at the front and rear ends of the housing (as shown inFIG. 7 ). -
FIG. 8 shows the fifth embodiment of the present invention. In this embodiment, thehousing 10 includes separatefirst housing 10′ andsecond housing 10″, and thefans second housings 10′ and 10″ are aligned with the vent holes 20 and 21 at the top of thewind mask 2. - While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those of ordinary skill in the art the various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/799,664 US20050199369A1 (en) | 2004-03-15 | 2004-03-15 | Dual centrifugal fan structure and heat dissipation device having the fan structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/799,664 US20050199369A1 (en) | 2004-03-15 | 2004-03-15 | Dual centrifugal fan structure and heat dissipation device having the fan structure |
Publications (1)
Publication Number | Publication Date |
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US20050199369A1 true US20050199369A1 (en) | 2005-09-15 |
Family
ID=34920555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/799,664 Abandoned US20050199369A1 (en) | 2004-03-15 | 2004-03-15 | Dual centrifugal fan structure and heat dissipation device having the fan structure |
Country Status (1)
Country | Link |
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US (1) | US20050199369A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7120019B2 (en) * | 2004-08-18 | 2006-10-10 | International Business Machines Corporation | Coaxial air ducts and fans for cooling and electronic component |
US20060254292A1 (en) * | 2005-05-10 | 2006-11-16 | Emp Advanced Development, Llc | Cooling system and method for cooling a heat producing system |
US20070284955A1 (en) * | 2006-06-08 | 2007-12-13 | Delta Electronics, Inc. | Heat dissipating fan |
US20080035315A1 (en) * | 2004-12-23 | 2008-02-14 | Evga Corporation | Cooling system with miniature fans for circuit board devices |
DE102014001423A1 (en) * | 2014-02-03 | 2015-08-06 | Unify Gmbh & Co. Kg | aerator |
Citations (13)
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US3277275A (en) * | 1964-12-02 | 1966-10-04 | Amos O Brusven | Self-contained hot water space heater |
US3874191A (en) * | 1974-06-12 | 1975-04-01 | Molded Products Company | Blower housing |
US4672819A (en) * | 1985-08-29 | 1987-06-16 | Diesel Kiki Co., Ltd. | Cooling unit |
US5494098A (en) * | 1994-06-17 | 1996-02-27 | Wakefield Engineering, Inc. | Fan driven heat sink |
US5638895A (en) * | 1996-03-25 | 1997-06-17 | Dodson; Douglas A. | Twin fan cooling device |
US6343014B1 (en) * | 2000-08-11 | 2002-01-29 | Ming-Chuan Yu | CPU cooling arrangement |
US6459580B1 (en) * | 2001-02-07 | 2002-10-01 | Compaq Information Technologies Group, Lp | Cooling system for removing heat from an object |
US6496368B2 (en) * | 2001-05-14 | 2002-12-17 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US20040114328A1 (en) * | 2002-12-13 | 2004-06-17 | Ing-Jer Chiou | Heat dissipation device for electronic component |
US7059388B2 (en) * | 2003-12-19 | 2006-06-13 | Kuo Ta Chang | Heat dissipating device |
US7071587B2 (en) * | 2001-09-07 | 2006-07-04 | Rotys Inc. | Integrated cooler for electronic devices |
US7128135B2 (en) * | 2004-11-12 | 2006-10-31 | International Business Machines Corporation | Cooling device using multiple fans and heat sinks |
US7167364B2 (en) * | 2003-03-27 | 2007-01-23 | Rotys Inc. | Cooler with blower between two heatsinks |
-
2004
- 2004-03-15 US US10/799,664 patent/US20050199369A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3277275A (en) * | 1964-12-02 | 1966-10-04 | Amos O Brusven | Self-contained hot water space heater |
US3874191A (en) * | 1974-06-12 | 1975-04-01 | Molded Products Company | Blower housing |
US4672819A (en) * | 1985-08-29 | 1987-06-16 | Diesel Kiki Co., Ltd. | Cooling unit |
US5494098A (en) * | 1994-06-17 | 1996-02-27 | Wakefield Engineering, Inc. | Fan driven heat sink |
US5638895A (en) * | 1996-03-25 | 1997-06-17 | Dodson; Douglas A. | Twin fan cooling device |
US6343014B1 (en) * | 2000-08-11 | 2002-01-29 | Ming-Chuan Yu | CPU cooling arrangement |
US6459580B1 (en) * | 2001-02-07 | 2002-10-01 | Compaq Information Technologies Group, Lp | Cooling system for removing heat from an object |
US6496368B2 (en) * | 2001-05-14 | 2002-12-17 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US7071587B2 (en) * | 2001-09-07 | 2006-07-04 | Rotys Inc. | Integrated cooler for electronic devices |
US20040114328A1 (en) * | 2002-12-13 | 2004-06-17 | Ing-Jer Chiou | Heat dissipation device for electronic component |
US7167364B2 (en) * | 2003-03-27 | 2007-01-23 | Rotys Inc. | Cooler with blower between two heatsinks |
US7059388B2 (en) * | 2003-12-19 | 2006-06-13 | Kuo Ta Chang | Heat dissipating device |
US7128135B2 (en) * | 2004-11-12 | 2006-10-31 | International Business Machines Corporation | Cooling device using multiple fans and heat sinks |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7120019B2 (en) * | 2004-08-18 | 2006-10-10 | International Business Machines Corporation | Coaxial air ducts and fans for cooling and electronic component |
US20080035315A1 (en) * | 2004-12-23 | 2008-02-14 | Evga Corporation | Cooling system with miniature fans for circuit board devices |
US20060254292A1 (en) * | 2005-05-10 | 2006-11-16 | Emp Advanced Development, Llc | Cooling system and method for cooling a heat producing system |
US7484378B2 (en) * | 2005-05-10 | 2009-02-03 | Emp Advanced Development, Llc | Cooling system and method for cooling a heat producing system |
US20070284955A1 (en) * | 2006-06-08 | 2007-12-13 | Delta Electronics, Inc. | Heat dissipating fan |
DE102014001423A1 (en) * | 2014-02-03 | 2015-08-06 | Unify Gmbh & Co. Kg | aerator |
DE102014001423A8 (en) * | 2014-02-03 | 2015-10-15 | Unify Gmbh & Co. Kg | aeration device |
US10019045B2 (en) | 2014-02-03 | 2018-07-10 | Unify Gmbh & Co. Kg | Ventilation device |
US10860069B2 (en) | 2014-02-03 | 2020-12-08 | Unify Gmbh & Co. Kg | Ventilation device |
US11630493B2 (en) | 2014-02-03 | 2023-04-18 | Unify Gmbh & Co. Kg | Ventilation device |
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