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US20050072557A1 - Heat-conductive structure - Google Patents

Heat-conductive structure Download PDF

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Publication number
US20050072557A1
US20050072557A1 US10/717,588 US71758803A US2005072557A1 US 20050072557 A1 US20050072557 A1 US 20050072557A1 US 71758803 A US71758803 A US 71758803A US 2005072557 A1 US2005072557 A1 US 2005072557A1
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US
United States
Prior art keywords
heat
base plate
support members
conductive
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/717,588
Inventor
Yaw-Huey Lai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Assigned to TAI-SOL ELECTRONICS CO., LTD. reassignment TAI-SOL ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAI, YAW-HUEY
Publication of US20050072557A1 publication Critical patent/US20050072557A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to heat-dissipative technology, and more particularly, to a heat-conductive structure.
  • a conventional heat-conductive plate is made of metal and includes a plurality of fins mounted thereon for enlarging the heat-dissipative area to attain preferable heat-dissipative effect.
  • heat pipes 61 are inserted inside fins 63 to enhance the heat conduction among the fins to further attain preferable heat-dissipative effect.
  • the above-mentioned structure merely rapidly transmits the heat between the fins but fails to effectively transmit the heat out of a heat-conductive plate 60 .
  • the heat pipes are closely mounted on a top side of the heat-conductive plate and inserted through bottom sides of the fins.
  • the heat-conductive plate further includes a channel for receiving the heat pipes; meanwhile, thickness of the heat-conductive plate has to be increased, and the heat pipes have to be received in the channel with their cross-sections being oblate.
  • the part corresponding to the inner bottom periphery of such heat-conductive plate cannot be too thin, and otherwise, the bottom side of the heat-conductive plate will be deformed to be uneven.
  • the heat-conductive plate will have ineffective heat conduction.
  • the primary objective of the present invention is to provide an improved heat-conductive structure in which a heat-conductive plate is preferably strengthened and is preferably thin to attain preferable heat-conductive effect.
  • the secondary objective of the present invention is to provide an improved heat-conductive structure that has better heat-dissipative effect than prior art.
  • the foregoing objectives of the present invention are attained by the improved heat-conductive structure that includes a heat-conductive plate.
  • the heat-conductive plate has a base plate, two support members extending upwards respectively from bilateral sides of the base plate for a predetermined breadth and height, a channel formed between the base plate and the two support members, two wing portions horizontally extending outwards respectively from the two support members, and a recession formed at a midsection of a bottom side of the base plate.
  • the base plate is relatively thin and of low thermal resistance at the midsection thereof corresponding to the recession to cause effective and rapid heat conduction.
  • FIG. 1 is a perspective view of a first preferred embodiment of the present invention
  • FIG. 2 is a sectional view taken from a line 2 - 2 indicated in FIG. 1 ;
  • FIG. 3 is a perspective view of a second preferred embodiment of the present invention.
  • FIG. 4 is a perspective view of a third preferred embodiment of the present invention.
  • FIG. 5 is a perspective view of a fourth preferred embodiment of the present invention.
  • FIG. 6 shows a prior art.
  • a heat-conductive structure 10 constructed according to a first preferred embodiment of the present invention includes a heat-conductive plate 11 .
  • the heat-conductive plate 11 is composed of a base plate 12 , two support members 14 , a channel 16 , two wing portions 18 , and a recession 19 .
  • the two support members 14 respectively extend upwards from bilateral sides of the base plate 12 for a predetermined breadth and height.
  • the channel 16 is formed between the base plate 12 and the two support members 14 .
  • the two wing portions 18 horizontally extend outwards respectively from the two support members 14 and each are positioned higher than the base plate 12 .
  • the recession 19 is formed at a midsection of a bottom side of the base plate 12 for contacting heating elements (not shown).
  • the recession 19 enables the midsection of the base plate 12 to be relatively thin, such that the base plate 12 has preferably low thermal resistance to cause effective and rapid heat conduction.
  • the bilateral sides of the base plate 12 in proximity of the recession 19 i.e. the thicker sections than the midsection of the base plate 12
  • together with the two wing portions 18 positioned at another bilateral sides of the recession 19 form a frame-like structure around the recession 19 to further support the midsection of the base plate 12 , such that the midsection of the base plate 12 can be preferably thin to cause no deformation itself, even in the thickness of less than 1 mm, to have lower thermal resistance to further cause preferable heat-conductive effect.
  • the two support members 14 can transmit the heat from the base plate 12 to the two wing portions 18 to be helpful to the heat-dissipation.
  • a heat-dissipative structure 30 constructed according to a second embodiment of the present invention includes the heat-conductive structure 10 of the first preferred embodiment, at least one heat pipe 31 , embodied as three heat pipes, and a plurality of fins 33 .
  • the three heat pipes 31 are disposed in the channel 16 of the heat-conductive plate 11 and mounted closely on a top side of the base plate 12 .
  • the fins 33 are mounted upright on the heat-conductive structure 10 and the heat pipes 31 and over the channel 16 and fixedly mounted on surfaces of the heat pipes 31 and top sides of the wing portions 18 at bottom sides thereof.
  • the heat-conductive structure 10 is relatively thin at the midsection of the base plate 12 corresponding to the recession (not shown) to have preferably low thermal resistance to further rapidly transmit the heat generated by the heating elements (not shown) from the bottom side up to the top side of the base plate 12 and then to rapidly transmit the heat through the heat pipes 31 to the fins 33 , thereby causing better heat-dissipative effect than the prior art.
  • the heat-dissipative structure 40 constructed according to a third embodiment of the present invention is different from the second embodiment; the difference lies in that each of the heat pipes 41 further has an end extending outwards and upwards and through the fins 43 .
  • the heat-dissipative structure 50 constructed according to a fourth embodiment of the present invention is different from the aforementioned preferred embodiments and further includes a top plate 55 disposed on the fins 53 . Further, each of the heat pipes 51 extends outwards and upwards and through the top plate 55 . The heat can be transmitted from the heat-conductive structure 10 through the heat pipes 51 up to the top plate 55 ; meanwhile, the temperatures of the top plate 55 and the heat-conductive structure 10 are the same; and further can be dissipated outside through the fins 53 .
  • the relatively thick parts of the base plate 12 , around the recession 19 , together with the wing portions 18 form the frame-like support structure to allow the midsection of the base plate 12 , above the recession 19 , to be thin without deformation, thereby reducing the thermal resistance and incurring preferably effective heat conduction.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An improved heat-conductive structure includes a heat-conductive plate. The heat-conductive plate has a base plate, two support members extending upwards respectively from bilateral sides of the base plate for a predetermined breadth and height, a channel formed between the base plate and the two support members, two wing portions horizontally extending outwards respectively from the two support members, and a recession formed at a midsection of a bottom side of the base plate. The base plate is relatively thin and of low thermal resistance at the midsection thereof corresponding to the recession to attain effective and rapid heat conduction.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to heat-dissipative technology, and more particularly, to a heat-conductive structure.
  • 2. Description of the Related Art
  • A conventional heat-conductive plate is made of metal and includes a plurality of fins mounted thereon for enlarging the heat-dissipative area to attain preferable heat-dissipative effect.
  • Referring to FIG. 6, heat pipes 61 are inserted inside fins 63 to enhance the heat conduction among the fins to further attain preferable heat-dissipative effect. However, the above-mentioned structure merely rapidly transmits the heat between the fins but fails to effectively transmit the heat out of a heat-conductive plate 60.
  • There are two conventional solutions, as depicted below, to improve the drawbacks of the aforementioned conventional structure by mounting the heat pipes closely on the heat-conductive plate and under the fins.
  • 1. The heat pipes are closely mounted on a top side of the heat-conductive plate and inserted through bottom sides of the fins.
  • 2. The heat-conductive plate further includes a channel for receiving the heat pipes; meanwhile, thickness of the heat-conductive plate has to be increased, and the heat pipes have to be received in the channel with their cross-sections being oblate. However, the part corresponding to the inner bottom periphery of such heat-conductive plate cannot be too thin, and otherwise, the bottom side of the heat-conductive plate will be deformed to be uneven. However, if that part of the plate is too thick, the heat-conductive plate will have ineffective heat conduction.
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide an improved heat-conductive structure in which a heat-conductive plate is preferably strengthened and is preferably thin to attain preferable heat-conductive effect.
  • The secondary objective of the present invention is to provide an improved heat-conductive structure that has better heat-dissipative effect than prior art.
  • The foregoing objectives of the present invention are attained by the improved heat-conductive structure that includes a heat-conductive plate. The heat-conductive plate has a base plate, two support members extending upwards respectively from bilateral sides of the base plate for a predetermined breadth and height, a channel formed between the base plate and the two support members, two wing portions horizontally extending outwards respectively from the two support members, and a recession formed at a midsection of a bottom side of the base plate. The base plate is relatively thin and of low thermal resistance at the midsection thereof corresponding to the recession to cause effective and rapid heat conduction.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a first preferred embodiment of the present invention;
  • FIG. 2 is a sectional view taken from a line 2-2 indicated in FIG. 1;
  • FIG. 3 is a perspective view of a second preferred embodiment of the present invention;
  • FIG. 4 is a perspective view of a third preferred embodiment of the present invention;
  • FIG. 5 is a perspective view of a fourth preferred embodiment of the present invention; and
  • FIG. 6 shows a prior art.
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1 and 2, a heat-conductive structure 10 constructed according to a first preferred embodiment of the present invention includes a heat-conductive plate 11.
  • The heat-conductive plate 11 is composed of a base plate 12, two support members 14, a channel 16, two wing portions 18, and a recession 19. The two support members 14 respectively extend upwards from bilateral sides of the base plate 12 for a predetermined breadth and height. The channel 16 is formed between the base plate 12 and the two support members 14. The two wing portions 18 horizontally extend outwards respectively from the two support members 14 and each are positioned higher than the base plate 12. The recession 19 is formed at a midsection of a bottom side of the base plate 12 for contacting heating elements (not shown).
  • Hence, the recession 19 enables the midsection of the base plate 12 to be relatively thin, such that the base plate 12 has preferably low thermal resistance to cause effective and rapid heat conduction.
  • Further, the bilateral sides of the base plate 12 in proximity of the recession 19, i.e. the thicker sections than the midsection of the base plate 12, together with the two wing portions 18 positioned at another bilateral sides of the recession 19 form a frame-like structure around the recession 19 to further support the midsection of the base plate 12, such that the midsection of the base plate 12 can be preferably thin to cause no deformation itself, even in the thickness of less than 1 mm, to have lower thermal resistance to further cause preferable heat-conductive effect.
  • Moreover, the two support members 14 can transmit the heat from the base plate 12 to the two wing portions 18 to be helpful to the heat-dissipation.
  • Referring to FIG. 3, a heat-dissipative structure 30 constructed according to a second embodiment of the present invention includes the heat-conductive structure 10 of the first preferred embodiment, at least one heat pipe 31, embodied as three heat pipes, and a plurality of fins 33.
  • The three heat pipes 31 are disposed in the channel 16 of the heat-conductive plate 11 and mounted closely on a top side of the base plate 12.
  • The fins 33 are mounted upright on the heat-conductive structure 10 and the heat pipes 31 and over the channel 16 and fixedly mounted on surfaces of the heat pipes 31 and top sides of the wing portions 18 at bottom sides thereof.
  • When the heat-conductive structure 30 is in use, the heat-conductive structure 10 is relatively thin at the midsection of the base plate 12 corresponding to the recession (not shown) to have preferably low thermal resistance to further rapidly transmit the heat generated by the heating elements (not shown) from the bottom side up to the top side of the base plate 12 and then to rapidly transmit the heat through the heat pipes 31 to the fins 33, thereby causing better heat-dissipative effect than the prior art.
  • Referring to FIG. 4, the heat-dissipative structure 40 constructed according to a third embodiment of the present invention is different from the second embodiment; the difference lies in that each of the heat pipes 41 further has an end extending outwards and upwards and through the fins 43.
  • Referring to FIG. 5, the heat-dissipative structure 50 constructed according to a fourth embodiment of the present invention is different from the aforementioned preferred embodiments and further includes a top plate 55 disposed on the fins 53. Further, each of the heat pipes 51 extends outwards and upwards and through the top plate 55. The heat can be transmitted from the heat-conductive structure 10 through the heat pipes 51 up to the top plate 55; meanwhile, the temperatures of the top plate 55 and the heat-conductive structure 10 are the same; and further can be dissipated outside through the fins 53.
  • In conclusion, the relatively thick parts of the base plate 12, around the recession 19, together with the wing portions 18 form the frame-like support structure to allow the midsection of the base plate 12, above the recession 19, to be thin without deformation, thereby reducing the thermal resistance and incurring preferably effective heat conduction.

Claims (5)

1. A heat-conductive structure comprising a heat-conductive plate, said heat-conductive plate having a base plate, two support members respectively extending upwards from bilateral sides of said base plate for a predetermined breadth and height, a channel formed between said base plate and said two support members, two wing portions extending parallel outwards respectively from said two support members, and a recession formed at a midsection of a bottom side of said base plate; wherein, the midsection of the bottom side of said base plate is relatively thin to have a relatively low thermal resistance, thereby causing rapid heat conduction.
2. The heat-conductive structure as defined in claim 1, wherein said wing portions are positioned higher than said base plate.
3. A heat-dissipative structure having the heat-conductive structure as defined in claim 1, said heat-dissipative structure comprising:
a heat-conductive plate having a base plate, two support members extending upwards respectively from bilateral sides of said base plate for a predetermined breadth and height, a channel formed between said base plate and said two support members, two wing portions extending parallel outwards respectively from said two support members, and a recession formed at a midsection of a bottom side of said base plate;
at least one heat pipe disposed in said channel; and
a plurality of fins mounted upright on said heat-conductive plate and said at least one heat pipe, positioned over said channel at bottom sides thereof, and connected to a surface of said heat pipe and top sides of said wing portions.
4. The heat-dissipative structure as defined in claim 3, wherein said heat pipe has at least one end extending outwards and upwards and through said fins.
5. The heat-dissipative structure as defined in claim 3 further comprising a top plate mounted on said fins; said heat pipe has at least one end extending outwards and upwards and through said fins.
US10/717,588 2003-10-03 2003-11-21 Heat-conductive structure Abandoned US20050072557A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW092217849U TWM243918U (en) 2003-10-03 2003-10-03 Structure of heat conduction plate
TW92217849 2003-10-03

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219171A (en) * 2017-06-30 2019-01-15 杭州三花研究院有限公司 electric heater
CN109210766A (en) * 2017-06-30 2019-01-15 杭州三花研究院有限公司 electric heater
CN109210767A (en) * 2017-06-30 2019-01-15 杭州三花研究院有限公司 electric heater
US11712945B2 (en) 2017-06-30 2023-08-01 Hangzhou Sanhua Research Institute Co., Ltd. Electric heater

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400032B (en) * 2008-02-05 2013-06-21 Delta Electronics Inc Heat dissipation module and supporting element thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
US6097601A (en) * 1999-05-15 2000-08-01 Foxconn Precision Components Co., Ltd. Retention mechanism for heat sink
US6318451B1 (en) * 2000-03-15 2001-11-20 Foxconn Precision Components Co., Ltd. Heat sink for integrated circuit
US20030141041A1 (en) * 2002-01-30 2003-07-31 Chen Kuo Jui Tube-style radiator structure for computer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
US6097601A (en) * 1999-05-15 2000-08-01 Foxconn Precision Components Co., Ltd. Retention mechanism for heat sink
US6318451B1 (en) * 2000-03-15 2001-11-20 Foxconn Precision Components Co., Ltd. Heat sink for integrated circuit
US20030141041A1 (en) * 2002-01-30 2003-07-31 Chen Kuo Jui Tube-style radiator structure for computer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219171A (en) * 2017-06-30 2019-01-15 杭州三花研究院有限公司 electric heater
CN109210766A (en) * 2017-06-30 2019-01-15 杭州三花研究院有限公司 electric heater
CN109210767A (en) * 2017-06-30 2019-01-15 杭州三花研究院有限公司 electric heater
US11712945B2 (en) 2017-06-30 2023-08-01 Hangzhou Sanhua Research Institute Co., Ltd. Electric heater

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Date Code Title Description
AS Assignment

Owner name: TAI-SOL ELECTRONICS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LAI, YAW-HUEY;REEL/FRAME:014736/0765

Effective date: 20031110

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION