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US20040217486A1 - Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly - Google Patents

Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly Download PDF

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US20040217486A1
US20040217486A1 US10/779,118 US77911804A US2004217486A1 US 20040217486 A1 US20040217486 A1 US 20040217486A1 US 77911804 A US77911804 A US 77911804A US 2004217486 A1 US2004217486 A1 US 2004217486A1
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metal substrate
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metal
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David Walter
Masood Murtuza
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/341—Surface mounted components
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
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    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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    • H05K2201/09—Shape and layout
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    • H05K2201/09718—Clearance holes
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention is generally related to the field of semiconductor assembly and packaging, and more particularly, to the field of packaged semiconductor devices in a flip chip format or wire-bonded format.
  • the present invention achieves technical advantages as a low cost apparatus and method of providing a layer-to-layer electrical interconnect between two metal layers used in the assembly of flip-chip and wire-bonded packages.
  • the present invention provides for an electrical connection between the two metal layers to be made without using conventional methods of forming the interconnect, such as, by electrolessly depositing the interconnect, for example.
  • the invention also advantageously allows for a layer-to-layer connection to be achieved between the two metal layers without using a sputtered interconnect.
  • the present invention is a two metal layered ball grid array having generally planar first and second metal layers.
  • the second metal layer includes a plurality of openings at spaced intervals across the surface thereof.
  • the invention also includes an organic tape layer coupled between the first and second metal layers.
  • the organic tape layer is preferably comprised of a dielectric material, such as a copper-coated polyimide tape.
  • the organic tape layer also has a plurality of vias at spaced intervals and which are aligned with the openings of the second metal layer. Preferably, these vias function as receiving channels for receiving a conductive material, such as solder paste, for example.
  • the invention includes a plurality of solder balls aligned with the openings of the second metal layer such that the solder balls are adapted to attach to the solder paste to form a series of electrical interconnects.
  • the solder balls run substantially in parallel between the first and second metal layers.
  • a method of forming one or more interconnects between the first and second metal layers includes forming a plurality of vias spaced apart along an organic tape layer such that the vias provide an interconnect between the two metal layers.
  • the method of the present invention also includes the step of forming a plurality of corresponding openings across the surface of one of the metal layers and generally near the vias of the organic tape layer. Solder paste is deposited in the respective vias and a plurality of solder balls are attached across the respective openings of the second metal layer such that the solder balls are heat wetted to the solder paste to form a plurality of substantially parallel electrical interconnects between the first and second metal layers.
  • FIG. 1 shows two metal substrates having a flip-chip semiconductor chip coupled to the top surface thereof in accordance with an exemplary embodiment of the present invention
  • FIG. 2 shows two metal substrates having a wire-bonded semiconductor chip coupled thereto in accordance with the present invention.
  • FIG. 3 shows a flow diagram of the method of the present invention.
  • the present invention includes a first metal substrate layer 12 , a second metal substrate layer 14 , and an organic tape layer 16 coupled therebetween.
  • the organic tape layer 16 is comprised of an adhesive material, preferably, a laminated dielectric material, such as copper-coated polyimide material on both sides thereof.
  • the organic tape layer 16 also includes a plurality of vias 15 at spaced apart intervals which are proximate a plurality of openings 40 , 42 , and 44 defined through and spaced along the surface of the second metal layer substrate 14 . These vias 15 terminate at selected portions of the first metal layer 12 and are aligned substantially in parallel to each other and function as receiving channels for receiving an electrically conductive material, such as, solder paste 13 , for example.
  • solder balls 17 , 18 , and 19 are disposed over and within the respective openings 40 , 42 , and 44 of the second metal layer 14 and aligned with the vias 15 .
  • each respective solder ball 17 , 18 , and 19 attaches to the solder paste 13 to form the series of fixed electrical interconnects through the organic tape layer 16 to the selected portions first metal layer 12 .
  • these newly formed interconnects may be adapted to provide basic information signals to the semiconductor chip 11 via electrical traces defined on the first metal substrate layer 12 and solder bumps 50 , such as, input/output (I/O) signals via balls 17 and 18 being electrically isolated from the second metal substrate layer 14 .
  • these interconnects may be adapted to provide power and ground functionality to the semiconductor chip 11 , whereby solder ball 19 is coupled to the second metal substrate layer 14 and a surface of the first metal layer 12 by the respective paste filled via 15 .
  • the present invention advantageously provides a series of parallel electrical interconnects between the two metal substrate layers of the package supporting the semiconductor chip 11 formed as a BGA without having to form the interconnects therebetween using a traditional sputtering technique or without having to form the interconnect electrolessly.
  • FIG. 2 there is shown at 20 a two metal substrate layer configuration of the present invention having a semiconductor chip 22 attached thereto in a wire-bonded format.
  • the semiconductor chip 22 is supported upon a dielectric material 24 and interconnected to an upper surface of a first metal layer 28 via connecting wires 26 .
  • the local interconnects are similarly formed between first metal substrate layer 28 and a second metal substrate layer 30 when the solder paste 13 deposited within the respective vias 15 of the organic tape layer 16 attaches to each solder ball 17 , 18 , and 19 .
  • FIG. 3 there is shown at 30 a methodology of the present invention wherein a plurality of side-to-side electrical interconnects are formed along a dielectric organic tape substrate 16 which is coupled between metal substrate layers 12 and 14 .
  • the plurality of vias 15 are formed within and across the organic tape layer substrate 16 at spaced apart intervals. These vias 15 are arranged to run substantially in parallel with each other between metal layers 12 and 14 .
  • respective openings 40 , 42 , and 44 are formed along a surface of the second metal substrate layer 14 which are proximate the vias 15 .
  • solder paste is then deposited into each respective via 15 . Thereafter, an array of solder balls 17 , 18 , and 19 are aligned across respective openings 40 , 42 , and 44 of the second metal layer.
  • an attaching step 38 follows whereby the respective solder balls 17 , 18 , and 19 attach to the solder paste 13 deposited within the vias 15 to form a series of electrical interconnects running substantially in parallel between metal layers 12 and 14 .
  • the present invention advantageously allows for an electrical interconnect to be formed between the two metal substrate layers without using either the conventional electroless method or the sputtered method of forming the interconnect the two metal layers.
  • the present invention also provides for an improved performance, low-cost semiconductor chip package configured as a BGA or a wire-bonded assembly.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The present invention comprises a low cost device (10, 20) and a method (30) of forming an electrical interconnect between two metal substrate layers configured in a flip-chip format or a wire bonded format. The invention includes a first metal substrate layer (12), a second metal substrate layer (14), and an organic tape layer (16) attached therebetween as a dielectric. The organic tape layer (16) includes a series of spaced apart vias (15) adapted to receive solder paste (13). The second metal layer (14) includes a plurality of openings (40,42,44) spaced along the surface thereof and coaxially aligned with the spaced vias (15). Further, the invention includes a plurality of solder balls (17, 18, 19) placed across the respective openings (40,42,44) of the second metal layer (14) such that each solder ball (17-19) attaches to the solder paste (13) forming an electrical interconnect running substantially in parallel between the metal layers (12, 14). The solder balls are adapted to communicate I/O signals or power to/from an IC supported on the first layer.

Description

    FIELD OF THE INVENTION
  • The present invention is generally related to the field of semiconductor assembly and packaging, and more particularly, to the field of packaged semiconductor devices in a flip chip format or wire-bonded format. [0001]
    • BACKGROUND OF THE INVENTION
  • Many semiconductor devices are typically packaged on a single layer substrate of medium or low electrical performance characteristics. Generally, the costs of packaging a semiconductor chip on a multi-layer, high performance substrate can be high depending on the design format of the device as well as on the number of devices that are produced. Semiconductor manufacturers have attempted to lower the cost of multi-layer substrate packaged devices by standardizing design rules and manufacturing techniques, but have not yet achieved customer cost expectations. One of the primary reasons for the increased cost of the multilayer substrate design is the processing required to electrically connect the various metal layers in the substrate. Presently this is done by the substrate suppliers themselves and then provided to the assembly operations. The conventional methods of providing electrical interconnections between the different associated layers of the multi-layer substrate are electrolessly deposited and/or sputtered metals providing the interconnect between the multiple layers. These two process techniques are generally expensive and time-consuming. [0002]
  • Thus, there is desired a technique in semiconductor chip assembly and packaging of cost-effectively providing a local electrical interconnect between two or more metal substrate layers without having to use the conventional methods. Such a technique would greatly improve the performance of a semiconductor chip packaged in either a flip-chip or a wire-bonded format while not reducing electrical performance. Moreover, such a technique would greatly shorten the time in which a semiconductor chip is packaged and, in turn, will lower its production costs. [0003]
    • SUMMARY OF THE INVENTION
  • The present invention achieves technical advantages as a low cost apparatus and method of providing a layer-to-layer electrical interconnect between two metal layers used in the assembly of flip-chip and wire-bonded packages. Advantageously, the present invention provides for an electrical connection between the two metal layers to be made without using conventional methods of forming the interconnect, such as, by electrolessly depositing the interconnect, for example. The invention also advantageously allows for a layer-to-layer connection to be achieved between the two metal layers without using a sputtered interconnect. [0004]
  • In one embodiment, the present invention is a two metal layered ball grid array having generally planar first and second metal layers. The second metal layer includes a plurality of openings at spaced intervals across the surface thereof. The invention also includes an organic tape layer coupled between the first and second metal layers. In a selected embodiment, the organic tape layer is preferably comprised of a dielectric material, such as a copper-coated polyimide tape. The organic tape layer also has a plurality of vias at spaced intervals and which are aligned with the openings of the second metal layer. Preferably, these vias function as receiving channels for receiving a conductive material, such as solder paste, for example. Further, the invention includes a plurality of solder balls aligned with the openings of the second metal layer such that the solder balls are adapted to attach to the solder paste to form a series of electrical interconnects. The solder balls run substantially in parallel between the first and second metal layers. [0005]
  • In another embodiment, a method of forming one or more interconnects between the first and second metal layers is presented. The method includes forming a plurality of vias spaced apart along an organic tape layer such that the vias provide an interconnect between the two metal layers. The method of the present invention also includes the step of forming a plurality of corresponding openings across the surface of one of the metal layers and generally near the vias of the organic tape layer. Solder paste is deposited in the respective vias and a plurality of solder balls are attached across the respective openings of the second metal layer such that the solder balls are heat wetted to the solder paste to form a plurality of substantially parallel electrical interconnects between the first and second metal layers. [0006]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Advantages of the invention and the specific embodiments will be understood by those of ordinary skill in the art by reference to the following detailed description of preferred embodiments taken in conjunction with the drawings, in which: [0007]
  • FIG. 1 shows two metal substrates having a flip-chip semiconductor chip coupled to the top surface thereof in accordance with an exemplary embodiment of the present invention; [0008]
  • FIG. 2 shows two metal substrates having a wire-bonded semiconductor chip coupled thereto in accordance with the present invention; and [0009]
  • FIG. 3 shows a flow diagram of the method of the present invention. [0010]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • The numerous innovative teachings of the present invention will be described with particular reference to the presently preferred exemplary embodiments. However, it should be understood that this class of embodiments provides only a few examples of the many advantageous uses and innovative teachings herein. In general, statements made in the specification of the present application do not necessarily delimit any of the various claimed inventions. Moreover, some statements may apply to some inventive features, but not to others. [0011]
  • Referring now to FIG. 1, there is generally shown at [0012] 10 a two metal layer ball grid array (BGA) configured in a flip-chip format. The present invention includes a first metal substrate layer 12, a second metal substrate layer 14, and an organic tape layer 16 coupled therebetween. In a preferred embodiment, the organic tape layer 16 is comprised of an adhesive material, preferably, a laminated dielectric material, such as copper-coated polyimide material on both sides thereof. The organic tape layer 16 also includes a plurality of vias 15 at spaced apart intervals which are proximate a plurality of openings 40, 42, and 44 defined through and spaced along the surface of the second metal layer substrate 14. These vias 15 terminate at selected portions of the first metal layer 12 and are aligned substantially in parallel to each other and function as receiving channels for receiving an electrically conductive material, such as, solder paste 13, for example.
  • Preferably, [0013] solder balls 17, 18, and 19 are disposed over and within the respective openings 40, 42, and 44 of the second metal layer 14 and aligned with the vias 15. Advantageously, each respective solder ball 17, 18, and 19 attaches to the solder paste 13 to form the series of fixed electrical interconnects through the organic tape layer 16 to the selected portions first metal layer 12. In a selected embodiment, these newly formed interconnects may be adapted to provide basic information signals to the semiconductor chip 11 via electrical traces defined on the first metal substrate layer 12 and solder bumps 50, such as, input/output (I/O) signals via balls 17 and 18 being electrically isolated from the second metal substrate layer 14. Further, these interconnects may be adapted to provide power and ground functionality to the semiconductor chip 11, whereby solder ball 19 is coupled to the second metal substrate layer 14 and a surface of the first metal layer 12 by the respective paste filled via 15.
  • Hence, the present invention advantageously provides a series of parallel electrical interconnects between the two metal substrate layers of the package supporting the [0014] semiconductor chip 11 formed as a BGA without having to form the interconnects therebetween using a traditional sputtering technique or without having to form the interconnect electrolessly.
  • Referring now to FIG. 2, there is shown at [0015] 20 a two metal substrate layer configuration of the present invention having a semiconductor chip 22 attached thereto in a wire-bonded format. Unlike FIG. 1, the semiconductor chip 22 is supported upon a dielectric material 24 and interconnected to an upper surface of a first metal layer 28 via connecting wires 26. Here, the local interconnects are similarly formed between first metal substrate layer 28 and a second metal substrate layer 30 when the solder paste 13 deposited within the respective vias 15 of the organic tape layer 16 attaches to each solder ball 17, 18, and 19.
  • Turning now to FIG. 3, there is shown at [0016] 30 a methodology of the present invention wherein a plurality of side-to-side electrical interconnects are formed along a dielectric organic tape substrate 16 which is coupled between metal substrate layers 12 and 14.
  • At [0017] step 32, the plurality of vias 15 are formed within and across the organic tape layer substrate 16 at spaced apart intervals. These vias 15 are arranged to run substantially in parallel with each other between metal layers 12 and 14.
  • At [0018] step 34, respective openings 40, 42, and 44 are formed along a surface of the second metal substrate layer 14 which are proximate the vias 15.
  • At [0019] step 36, solder paste is then deposited into each respective via 15. Thereafter, an array of solder balls 17, 18, and 19 are aligned across respective openings 40, 42, and 44 of the second metal layer.
  • Next, an attaching [0020] step 38 follows whereby the respective solder balls 17, 18, and 19 attach to the solder paste 13 deposited within the vias 15 to form a series of electrical interconnects running substantially in parallel between metal layers 12 and 14.
  • The present invention advantageously allows for an electrical interconnect to be formed between the two metal substrate layers without using either the conventional electroless method or the sputtered method of forming the interconnect the two metal layers. Advantageously, the present invention also provides for an improved performance, low-cost semiconductor chip package configured as a BGA or a wire-bonded assembly. [0021]
  • Though the invention has been described with respect to specific preferred embodiments, many variations and modifications will become apparent to those skilled in the art upon reading the present application. It is therefore the intention that the appended claims be interpreted as broadly as possible in view of the prior art to include all such variations and modifications. [0022]

Claims (11)

1-10. (Cancel)
11. A method of forming an electrical connection between first and second metal substrate layers of a semiconductor device package, comprising the steps of:
positioning a dielectric material between said first and second metal substrate layer;
forming a plurality of vias spaced apart at predetermined intervals within said dielectric material;
forming a plurality of openings at predetermined intervals along the surface of said second metal substrate layer such that said openings are aligned with said vias;
depositing solder paste within said vias; and
attaching a plurality of solder balls across said openings of said second metal layer, wherein said solder balls and said solder paste are solder-wetted to form an electrical interconnect.
12. The method as specified in claim 11 further comprising the step of attaching an integrated circuit to said first metal substrate layer in a flip-chip format.
13. The method as specified in claim 12 wherein one of said electrical interconnect balls are adapted to provide an input/output (I/O) signal function to said integrated circuit.
14. The method as specified in claim 12 wherein one of said electrical interconnect solder balls is adapted to provide a power function to said integrated circuit.
15. The method as specified in claim 12 wherein one of said electrical interconnect balls are adapted to provide a ground function to said integrated circuit.
16. The method as specified in claim 11 further comprising the step of attaching an integrated circuit to said first metal substrate layer and wire bonding said integrated circuit to said first metal substrate layer proximate said vias.
17. The method as specified in claim 11 wherein said dielectric material comprises an organic material.
18. The method as specified in claim 17 wherein said organic material comprises a polyimide tape, said polyimide tape having copper applied to both sides.
19. The method as specified in claim 11 wherein said first metal substrate layer is adapted to rate signals from said vias to said integrated circuit.
20. The method as specified in claim 11 wherein said solder balls and said solder paste are heat wetted to form an electrical interconnect substantially in parallel between said first and second layers.
US10/779,118 2002-09-10 2004-02-12 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly Abandoned US20040217486A1 (en)

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