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US20040113240A1 - An electronic component with a leadframe - Google Patents

An electronic component with a leadframe Download PDF

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Publication number
US20040113240A1
US20040113240A1 US10/685,308 US68530803A US2004113240A1 US 20040113240 A1 US20040113240 A1 US 20040113240A1 US 68530803 A US68530803 A US 68530803A US 2004113240 A1 US2004113240 A1 US 2004113240A1
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US
United States
Prior art keywords
platform
electronic component
housing
leadframe
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/685,308
Inventor
Wolfgang Hauser
Viktor Heitzler
Christian Joos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
TDK Micronas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10247610A external-priority patent/DE10247610A1/en
Application filed by TDK Micronas GmbH filed Critical TDK Micronas GmbH
Priority to US10/685,308 priority Critical patent/US20040113240A1/en
Assigned to MICRONAS GMBH reassignment MICRONAS GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAUSER, WOLFGANG, HEITZLER,VIKTOR, JOOS, CHRISTIAN
Publication of US20040113240A1 publication Critical patent/US20040113240A1/en
Priority to US14/880,072 priority patent/US9620391B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the present invention relates to the field of semiconductors, and in particular to semiconductor packaging.
  • an electronic component includes a leadframe composed of at least one platform and possibly at least one electronic connector, at least one electronic member, and a housing.
  • the at least one electronic member here is located on the platform.
  • the electronic member and platform are generally completely enclosed by the housing.
  • the housing of the electronic component is generally fabricated by a molding process, the so-called molding procedure.
  • the part of the leadframe to be molded specifically, the platform, together with the electronic member disposed on the platform, projects unprotected into the cavity of the mold, the so-called molding die.
  • the molding compound is introduced under high injection pressures into the cavity of the mold.
  • a nonuniform distribution of pressure exerted by the molding compound is present in the cavity during the molding procedure.
  • the result is that the section of the leadframe projecting into the cavity may be bent during molding.
  • the electrical and magnetic properties of the electronic member may be altered in an undesirable manner.
  • the sensitivity of a Hall sensor may be degraded by the tilting of the platform on which the sensor element is located.
  • An electronic component includes a leadframe, composed of a platform and preferably at least one electrical connecting piece.
  • the electronic component has at least one electronic member which is located on the platform.
  • the electronic component also includes a housing that encloses the electronic member and the platform.
  • the region of the leadframe i.e., the platform projecting exposed into the cavity of the molding die during the molding procedure
  • a molding die As a result, molding compound is not accumulated during the molding procedure in the section of the support region supported by the molding die—with the result that at least a section of the support region projects from the housing.
  • At least one support region is designed as a lobe element molded onto the platform.
  • the at least one lobe element is molded onto the platform forming a single piece, allowing the platform and lobe element to be inexpensively fabricated as a stamped piece.
  • the at least one connecting piece is molded onto the platform forming a single piece, thereby forming the connecting piece and platform as one integrated unit.
  • at least a section of the connecting piece is guided outside the housing.
  • the electronic component may include three or more connecting pieces that run parallel and on one side of the housing.
  • a embodiment of this design is, for example, a Hall sensor.
  • a thin anticorrosive film may extend over at least a section of the lobe element.
  • the support region may be covered by a thin film of the housing plastic.
  • the thin film may, for example, be created during fabrication of the housing by generating a small cavity between the support region and the mold, the cavity being filled by the plastic when the plastic is injected.
  • the leadframe may be fabricated by a metal or metal alloy. At least a section of the surface of the leadframe may be coated, and in particular, coated with an alloy containing tin or tin-lead.
  • the support region of the leadframe projecting into the cavity of the mold that is, at least one region of the platform, is supported by the mold.
  • At least one pin-like element be provided in the upper and lower shell of the mold, with the result that the support region is jammed between the pin elements of the upper and lower shells of the mold during the molding procedure.
  • the pin elements may be configured as integral components of the sidewall of the mold shells, of the molding die, or mold.
  • FIG. 1 is a schematic drawing of a top view an electronic component
  • FIG. 2 is a side view of the electronic component
  • FIG. 3 is a perspective view of the electronic component
  • FIG. 4 shows the electronic component during fabrication of the housing in a sectional view along A-A in FIG. 1.
  • FIG. 1 is a top view of an electronic component 1 that includes a leadframe 2 , an electronic member 3 and a housing 4 .
  • the electronic component 1 includes a leadframe made of a metal alloy.
  • the housing 4 is made of a plastic such as epoxy resin.
  • the electronic member 3 of electronic component 1 is configured as a Hall sensor.
  • the leadframe 2 includes a platform 5 and three parallel connecting pieces 6 ′, 6 ′′.
  • the connecting piece 6 ′ is molded onto the platform 5 as one piece.
  • Connecting pieces 6 ′′ project into the housing 4 of the electronic component 1 , without directly contacting platform 5 .
  • the electronic member 3 is located on the platform 5 .
  • Electronic contact between the electronic member 3 and the connecting pieces 6 ′ and 6 ′′ is provided by bonds 21 within the housing 4 .
  • the electrical connection of the electronic member 3 to the region outside the housing 4 is provided by the connecting pieces 6 ′ and 6 ′′.
  • two opposing lobe elements 7 are molded onto the platform 5 , forming one piece.
  • the housing 4 has holes 8 in the region of each lobe element 7 , the holes being identified as support holes.
  • the section 9 shown dark in FIG. 1 represents the overlap zone between each lobe element 7 and each support hole 9 , that is, each lobe element 7 in overlap zone 9 projects beyond housing 4 .
  • Also provided in the transitional zone between the platform 5 and the lobe element 7 is one notch-shaped depression 10 , which prevent ambient moisture in the region of support holes 8 from penetrating into the housing 4 .
  • FIG. 2 is a side view of the electronic component 1 described in FIG. 1, where within the housing 4 only the platform 5 and lobe element 7 are shown.
  • the support hole 11 located on the bottom side of housing 4 .
  • the support hole 11 is located opposite support hole 8 .
  • the effect of the support hole 11 is that a section of the bottom side of the lobe element 7 projects from the housing 4 .
  • the effect of the support hole 8 is that, as already described in FIG. 1, the top side of the lobe element 7 projects from the housing 4 .
  • the platform 5 is supported by the lobe element 7 on both sides against mold 12 (shown in FIG. 4) in the region of support holes 8 and 11 , thereby preventing tipping of the platform 5 during the molding procedure.
  • FIG. 3 is a perspective view the providing a clearer understanding of electronic component 1 .
  • FIG. 4 shows electronic component 1 during fabrication of housing 4 in a sectional view along axis A-A in FIG. 1.
  • Molding die 12 is clearly recognizable, composed of an upper mold shell 13 and a lower mold shell 14 .
  • mold shells 13 and 14 are brought into contact along parting plane 18 such that a closed cavity is formed by molding die 12 , composed of cavity halves 15 and 16 .
  • a channel 17 to fill cavity halves 15 and 16 with the molding compound is shown, simply as an example, in lower mold shell 14 .
  • opposing lobe elements 7 molded on forming a single piece with platform 5 are supported in the region of parting plane 18 by upper mold shell 13 and lower mold shell 14 .
  • Recesses 19 are provided in upper mold shell 13
  • recesses 20 are provided in lower mold shell 14 to accommodate each lobe element 7 , with recesses 19 and 20 forming a matching space for each accommodated lobe element 7 in the state in which mold shells 13 and 14 are pressed together.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention relates to an electronic component (1) including a leadframe (2), composed of a platform (5), and possibly at least one electrical connecting piece (6′, 6″), wherein at least one electronic member (3) is located on the platform (5), and including a housing (4) that encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided to support the platform (5) during the fabrication process for the housing (4), and wherein at least a section of the at least one support region (7) projects from the housing (4).

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to the field of semiconductors, and in particular to semiconductor packaging. [0001]
  • In general, an electronic component includes a leadframe composed of at least one platform and possibly at least one electronic connector, at least one electronic member, and a housing. The at least one electronic member here is located on the platform. In addition, the electronic member and platform are generally completely enclosed by the housing. [0002]
  • The housing of the electronic component is generally fabricated by a molding process, the so-called molding procedure. In the molding procedure, the part of the leadframe to be molded, specifically, the platform, together with the electronic member disposed on the platform, projects unprotected into the cavity of the mold, the so-called molding die. During molding, the molding compound is introduced under high injection pressures into the cavity of the mold. In addition, a nonuniform distribution of pressure exerted by the molding compound is present in the cavity during the molding procedure. The result is that the section of the leadframe projecting into the cavity may be bent during molding. The consequence of this is that the electrical and magnetic properties of the electronic member may be altered in an undesirable manner. For example, the sensitivity of a Hall sensor may be degraded by the tilting of the platform on which the sensor element is located. [0003]
  • Therefore, there is a need for an electronic component, or a method for fabricating an electronic component, in which the above-described tilting risk for the leadframe is prevented. [0004]
    • SUMMARY OF THE INVENTION
  • An electronic component includes a leadframe, composed of a platform and preferably at least one electrical connecting piece. The electronic component has at least one electronic member which is located on the platform. The electronic component also includes a housing that encloses the electronic member and the platform. In the electronic component, there is at least one support region on the platform to support the platform during the fabrication process creating the housing, and at least a section of the at least one support region projecting from the housing of the electronic component. [0005]
  • The region of the leadframe (i.e., the platform projecting exposed into the cavity of the molding die during the molding procedure) is supported by a molding die. As a result, molding compound is not accumulated during the molding procedure in the section of the support region supported by the molding die—with the result that at least a section of the support region projects from the housing. [0006]
  • In one embodiment, at least one support region is designed as a lobe element molded onto the platform. In another embodiment, the at least one lobe element is molded onto the platform forming a single piece, allowing the platform and lobe element to be inexpensively fabricated as a stamped piece. [0007]
  • Since at least a section of the lobe element or support region projects from the housing, at least a section of the lobe element or support region is directly exposed to ambient moisture. In order to prevent any penetration of ambient moisture into the housing in the transition zone between the platform and the lobe element or support region, and thus into the housing, a notch-like depression is provided along the transition zone. [0008]
  • In another preferred embodiment, the at least one connecting piece is molded onto the platform forming a single piece, thereby forming the connecting piece and platform as one integrated unit. Here at least a section of the connecting piece is guided outside the housing. As a result, during the molding procedure the leadframe may receive additional support by the connecting piece. [0009]
  • The electronic component may include three or more connecting pieces that run parallel and on one side of the housing. A embodiment of this design is, for example, a Hall sensor. [0010]
  • A thin anticorrosive film may extend over at least a section of the lobe element. For example, the support region may be covered by a thin film of the housing plastic. The thin film may, for example, be created during fabrication of the housing by generating a small cavity between the support region and the mold, the cavity being filled by the plastic when the plastic is injected. [0011]
  • The leadframe may be fabricated by a metal or metal alloy. At least a section of the surface of the leadframe may be coated, and in particular, coated with an alloy containing tin or tin-lead. [0012]
  • During molding the support region of the leadframe projecting into the cavity of the mold, that is, at least one region of the platform, is supported by the mold. At least one pin-like element be provided in the upper and lower shell of the mold, with the result that the support region is jammed between the pin elements of the upper and lower shells of the mold during the molding procedure. The pin elements may be configured as integral components of the sidewall of the mold shells, of the molding die, or mold. [0013]
  • These and other objects, features and advantages of the present invention will become more apparent in light of the following detailed description of preferred embodiments thereof, as illustrated in the accompanying drawings.[0014]
    • BRIEF DESCRIPTION OF THE DRAWING
  • FIG. 1 is a schematic drawing of a top view an electronic component; [0015]
  • FIG. 2 is a side view of the electronic component; [0016]
  • FIG. 3 is a perspective view of the electronic component; and [0017]
  • FIG. 4 shows the electronic component during fabrication of the housing in a sectional view along A-A in FIG. 1.[0018]
    • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 is a top view of an [0019] electronic component 1 that includes a leadframe 2, an electronic member 3 and a housing 4. The electronic component 1 includes a leadframe made of a metal alloy. The housing 4 is made of a plastic such as epoxy resin. In this example, the electronic member 3 of electronic component 1 is configured as a Hall sensor.
  • The [0020] leadframe 2 includes a platform 5 and three parallel connecting pieces 6′, 6″. In this example, the connecting piece 6′ is molded onto the platform 5 as one piece. Connecting pieces 6″ project into the housing 4 of the electronic component 1, without directly contacting platform 5. The electronic member 3 is located on the platform 5. Electronic contact between the electronic member 3 and the connecting pieces 6′ and 6″ is provided by bonds 21 within the housing 4. The electrical connection of the electronic member 3 to the region outside the housing 4 is provided by the connecting pieces 6′ and 6″. Additionally, two opposing lobe elements 7 are molded onto the platform 5, forming one piece. The housing 4 has holes 8 in the region of each lobe element 7, the holes being identified as support holes. The section 9 shown dark in FIG. 1 represents the overlap zone between each lobe element 7 and each support hole 9, that is, each lobe element 7 in overlap zone 9 projects beyond housing 4. Also provided in the transitional zone between the platform 5 and the lobe element 7 is one notch-shaped depression 10, which prevent ambient moisture in the region of support holes 8 from penetrating into the housing 4.
  • FIG. 2 is a side view of the [0021] electronic component 1 described in FIG. 1, where within the housing 4 only the platform 5 and lobe element 7 are shown. The support hole 11 located on the bottom side of housing 4. The support hole 11 is located opposite support hole 8. The effect of the support hole 11 is that a section of the bottom side of the lobe element 7 projects from the housing 4. The effect of the support hole 8 is that, as already described in FIG. 1, the top side of the lobe element 7 projects from the housing 4. The platform 5 is supported by the lobe element 7 on both sides against mold 12 (shown in FIG. 4) in the region of support holes 8 and 11, thereby preventing tipping of the platform 5 during the molding procedure.
  • FIG. 3 is a perspective view the providing a clearer understanding of [0022] electronic component 1. FIG. 4 shows electronic component 1 during fabrication of housing 4 in a sectional view along axis A-A in FIG. 1. Molding die 12 is clearly recognizable, composed of an upper mold shell 13 and a lower mold shell 14. During the molding procedure, mold shells 13 and 14 are brought into contact along parting plane 18 such that a closed cavity is formed by molding die 12, composed of cavity halves 15 and 16. A channel 17 to fill cavity halves 15 and 16 with the molding compound is shown, simply as an example, in lower mold shell 14. It is also evident that opposing lobe elements 7 molded on forming a single piece with platform 5 are supported in the region of parting plane 18 by upper mold shell 13 and lower mold shell 14. Recesses 19 are provided in upper mold shell 13, and recesses 20 are provided in lower mold shell 14 to accommodate each lobe element 7, with recesses 19 and 20 forming a matching space for each accommodated lobe element 7 in the state in which mold shells 13 and 14 are pressed together.
  • Although the present invention has been shown and described with respect to several preferred embodiments thereof, various changes, omissions and additions to the form and detail thereof, may be made therein, without departing from the spirit and scope of the invention.[0023]

Claims (12)

What is claimed is:
1. Electronic component (1) including a leadframe (2), a platform (5) on which a electronic member (3) is located, and including a housing (4) which encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided on the platform (5) to support the platform during the fabrication process for the housing, and that a section of the at least one support region (7) projects from the housing (4).
2. Electronic component according to claim 1, wherein the at least one support region (7) is in the form of a lobe element (7) molded onto the platform (5).
3. Electronic component according to claim 2 wherein a plurality of lobe elements (7) are molded onto the platform (5).
4. The electronic component of claim 3, wherein at least one lobe element (7) is molded onto the platform (5), forming a single piece.
5. The electronic component of claim 4, wherein at least one notch-shaped depression (10) is provided along the transition zone between the support region or lobe element (7) and the platform (5).
6. The electronic component of claim 5, wherein that a connecting piece (6′) is molded onto the platform (5).
7. The electronic component of claim 6, that at least one connecting piece (6′) is molded onto the platform (5) forming a single piece.
8. The electronic component of claim 7, wherein at least three connecting pieces (6′, 6″) are provided which run in parallel and are guided on one side of the housing (4) out of said housing.
9. The electronic component of claim 8, wherein the leadframe (2) is fabricated out of a metal or a metal alloy.
10. The electronic component of claim 9, wherein a thin anticorrosive film extends along at least a section of the lobe element (7).
11. The electronic component of claim 10, wherein at least a section of the surface of the leadframe (2) is coated, and in particular, coated with an alloy which contains Zn or Zn—Pb.
12. A method of fabricating an electronic component (1) including a leadframe (2) on which at least one electronic member (3) is located, and including a housing (4) which may be fabricated by a molding process using a mold (12),
characterized in
that at least one support surface (7) is provided on the leadframe (2) which rests against the mold (12) during the molding process.
US10/685,308 2002-10-11 2003-10-14 An electronic component with a leadframe Abandoned US20040113240A1 (en)

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US41851202P 2002-10-15 2002-10-15
US10/685,308 US20040113240A1 (en) 2002-10-11 2003-10-14 An electronic component with a leadframe

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017108364A1 (en) 2016-06-13 2017-12-14 Denso Corporation magnetic sensor
EP3544395A1 (en) * 2018-03-24 2019-09-25 Melexis Technologies SA Magnetic sensor component and assembly
CN114252820A (en) * 2020-09-24 2022-03-29 迈来芯电子科技有限公司 Magnetic sensor components and assemblies
US11543466B2 (en) 2018-03-24 2023-01-03 Melexis Technologies Sa Magnetic sensor component and assembly

Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
US4113474A (en) * 1974-09-12 1978-09-12 Toyo Valve Company, Ltd. Copper alloys of excellent corrosion resistance, moldability and workability
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS6195536A (en) * 1984-10-16 1986-05-14 Sanken Electric Co Ltd Manufacture of resin-sealed type semiconductor device
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US4855807A (en) * 1986-12-26 1989-08-08 Kabushiki Kaisha Toshiba Semiconductor device
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package
US5113240A (en) * 1990-02-22 1992-05-12 Sgs-Thomson Microelectronics S.R.L. Leadframe with heat dissipator connected to s-shaped fingers
US5208467A (en) * 1988-07-28 1993-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a film-covered packaged component
US5247202A (en) * 1991-10-09 1993-09-21 Landis & Gyr Betriebs Ag Plurality of arrangements each including an ic magnetic field sensor and two ferromagnetic field concentrators, and a procedure for incorporating each arrangement into a package
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5294829A (en) * 1990-01-26 1994-03-15 Sgs-Thomson Microelectronics, Inc. IC package having direct attach backup battery
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
US5427938A (en) * 1993-01-25 1995-06-27 Sharp Kabushiki Kaisha Method of manufacturing a resin-sealed semiconductor device
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
US5498902A (en) * 1993-08-25 1996-03-12 Seiko Epson Corporation Semiconductor device and its manufacturing method
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5578871A (en) * 1994-10-18 1996-11-26 Fierkens; Richard H. J. Integrated circuit package and method of making the same
US5610800A (en) * 1994-08-31 1997-03-11 Sgs-Thomson Microelectronics, Inc. Substrate mounting of circuit components with a low profile
US5623162A (en) * 1994-10-27 1997-04-22 Nec Corporation Lead frame having cut-out wing leads
US5841187A (en) * 1994-06-22 1998-11-24 Omron Corporation Molded electronic component
US6043111A (en) * 1996-07-30 2000-03-28 Nec Corporation Small size semiconductor package
US6049120A (en) * 1997-01-14 2000-04-11 Mitsubishi Denki Kabushiki Kaisha Thermal-stress-resistant semiconductor sensor
US6150715A (en) * 1997-08-05 2000-11-21 Nec Corporation Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
US6197615B1 (en) * 1997-04-04 2001-03-06 Samsung Electronics Co., Ltd. Method of producing lead frame having uneven surfaces
US6203931B1 (en) * 1999-02-05 2001-03-20 Industrial Technology Research Institute Lead frame material and process for manufacturing the same
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6258624B1 (en) * 2000-01-10 2001-07-10 Micron Technology, Inc. Semiconductor package having downset leadframe for reducing package bow
US6262480B1 (en) * 1996-06-28 2001-07-17 Sgs-Thomson Microelectronics S.R.L. Package for electronic device having a fully insulated dissipator
US20010010949A1 (en) * 1996-12-26 2001-08-02 Yoshinori Miyaki Plastic molded type semiconductor device and fabrication process thereof
US20010033011A1 (en) * 1998-07-30 2001-10-25 Chien-Ping Huang Semiconductor package having a die pad with downward-extended tabs
US20020033523A1 (en) * 2000-07-27 2002-03-21 Stmicroelectronics S.R.L. Lead-frame for semiconductor devices
US20020041911A1 (en) * 2000-10-06 2002-04-11 Nec Corporation Resin encapsulation mold
US20020048846A1 (en) * 1998-12-11 2002-04-25 Corisis David J. Die paddle clamping method for wire bond enhancement
US20020121680A1 (en) * 2001-03-05 2002-09-05 Samsung Electronics Co., Ltd. Ultra-thin semiconductor package device and method for manufacturing the same
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US6498394B1 (en) * 1995-07-10 2002-12-24 Ose Usa IC packages with diamond substrate thermal conductor
US6521358B1 (en) * 1997-03-04 2003-02-18 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device and method of producing same
US20030127711A1 (en) * 2002-01-09 2003-07-10 Matsushita Electric Industrial Co., Ltd. Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
US6664647B2 (en) * 2000-08-18 2003-12-16 Hitachi Ltd Semiconductor device and a method of manufacturing the same
US6684496B2 (en) * 1998-06-24 2004-02-03 Amkor Technology, Inc. Method of making an integrated circuit package
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
US7049685B2 (en) * 2000-08-24 2006-05-23 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567146A (en) 1978-11-14 1980-05-21 Mitsubishi Electric Corp Method for manufacturing semiconductor device
JPS58154252A (en) 1982-03-10 1983-09-13 Hitachi Ltd Lead frame
JPS60128646A (en) 1983-12-16 1985-07-09 Hitachi Ltd Semiconductor device and lead frame used for manufacturing the same device
JPS6132434A (en) 1984-07-24 1986-02-15 Sanken Electric Co Ltd Manufacture of resin molded semiconductor device
JPS61140157A (en) 1984-12-12 1986-06-27 Nec Corp Resin-sealed semiconductor device
JPS61144852A (en) 1984-12-19 1986-07-02 Hitachi Ltd Semiconductor device
JPS63187656A (en) 1987-01-30 1988-08-03 Furukawa Electric Co Ltd:The Semiconductor device
JPH0199245A (en) 1987-10-12 1989-04-18 Mitsubishi Electric Corp Ic package
JPH01158756A (en) 1987-12-16 1989-06-21 Sanken Electric Co Ltd Manufacture of resin sealed semiconductor device
JPH01196153A (en) 1988-02-01 1989-08-07 Oki Electric Ind Co Ltd Resin-sealed semiconductor device
JPH0233957A (en) 1988-07-22 1990-02-05 Nec Kyushu Ltd Lead frame for semiconductor device
JPH02177710A (en) 1988-12-28 1990-07-10 Matsushima Kogyo Co Ltd Piezoelectric oscillator
JPH0358452A (en) 1989-07-26 1991-03-13 Nec Kyushu Ltd Resin-sealed semiconductor device
JP2759523B2 (en) 1989-10-18 1998-05-28 株式会社三井ハイテック Method for manufacturing semiconductor device
JP2890662B2 (en) 1990-04-25 1999-05-17 ソニー株式会社 Method for manufacturing resin-encapsulated semiconductor device and lead frame used therefor
DK0508615T3 (en) 1991-04-10 1998-02-02 Caddock Electronics Inc Resistance of the foil type
JPH0547979A (en) 1991-08-21 1993-02-26 Nec Corp Resin-sealed semiconductor device
JPH0595056A (en) 1991-10-01 1993-04-16 Seiko Epson Corp Semiconductor device
IT1252575B (en) 1991-12-20 1995-06-19 Sgs Thomson Microelectronics MOLD AND PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR PLASTIC DEVICES, WITH VISIBLE METALLIC DISSIPATOR FOR WELDING CONTROL
JPH05183082A (en) 1992-01-07 1993-07-23 Hitachi Cable Ltd Lead frame for minitransistor
US5703356A (en) 1992-10-05 1997-12-30 Logitech, Inc. Pointing device utilizing a photodetector array
JP4025958B2 (en) 2000-05-17 2007-12-26 サンケン電気株式会社 CURRENT DETECTOR HAVING HALL ELEMENT

Patent Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US4113474A (en) * 1974-09-12 1978-09-12 Toyo Valve Company, Ltd. Copper alloys of excellent corrosion resistance, moldability and workability
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
JPS6195536A (en) * 1984-10-16 1986-05-14 Sanken Electric Co Ltd Manufacture of resin-sealed type semiconductor device
US4855807A (en) * 1986-12-26 1989-08-08 Kabushiki Kaisha Toshiba Semiconductor device
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
US5208467A (en) * 1988-07-28 1993-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a film-covered packaged component
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package
US5294829A (en) * 1990-01-26 1994-03-15 Sgs-Thomson Microelectronics, Inc. IC package having direct attach backup battery
US5113240A (en) * 1990-02-22 1992-05-12 Sgs-Thomson Microelectronics S.R.L. Leadframe with heat dissipator connected to s-shaped fingers
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5247202A (en) * 1991-10-09 1993-09-21 Landis & Gyr Betriebs Ag Plurality of arrangements each including an ic magnetic field sensor and two ferromagnetic field concentrators, and a procedure for incorporating each arrangement into a package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
US5427938A (en) * 1993-01-25 1995-06-27 Sharp Kabushiki Kaisha Method of manufacturing a resin-sealed semiconductor device
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
US5498902A (en) * 1993-08-25 1996-03-12 Seiko Epson Corporation Semiconductor device and its manufacturing method
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5841187A (en) * 1994-06-22 1998-11-24 Omron Corporation Molded electronic component
US5610800A (en) * 1994-08-31 1997-03-11 Sgs-Thomson Microelectronics, Inc. Substrate mounting of circuit components with a low profile
US5578871A (en) * 1994-10-18 1996-11-26 Fierkens; Richard H. J. Integrated circuit package and method of making the same
US5623162A (en) * 1994-10-27 1997-04-22 Nec Corporation Lead frame having cut-out wing leads
US6498394B1 (en) * 1995-07-10 2002-12-24 Ose Usa IC packages with diamond substrate thermal conductor
US6262480B1 (en) * 1996-06-28 2001-07-17 Sgs-Thomson Microelectronics S.R.L. Package for electronic device having a fully insulated dissipator
US6043111A (en) * 1996-07-30 2000-03-28 Nec Corporation Small size semiconductor package
US20010010949A1 (en) * 1996-12-26 2001-08-02 Yoshinori Miyaki Plastic molded type semiconductor device and fabrication process thereof
US6049120A (en) * 1997-01-14 2000-04-11 Mitsubishi Denki Kabushiki Kaisha Thermal-stress-resistant semiconductor sensor
US6521358B1 (en) * 1997-03-04 2003-02-18 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device and method of producing same
US6197615B1 (en) * 1997-04-04 2001-03-06 Samsung Electronics Co., Ltd. Method of producing lead frame having uneven surfaces
US6150715A (en) * 1997-08-05 2000-11-21 Nec Corporation Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6684496B2 (en) * 1998-06-24 2004-02-03 Amkor Technology, Inc. Method of making an integrated circuit package
US20010033011A1 (en) * 1998-07-30 2001-10-25 Chien-Ping Huang Semiconductor package having a die pad with downward-extended tabs
US6639306B2 (en) * 1998-07-30 2003-10-28 Siliconware Precision Industries, Co., Ltd. Semiconductor package having a die pad with downward-extended tabs
US20020048846A1 (en) * 1998-12-11 2002-04-25 Corisis David J. Die paddle clamping method for wire bond enhancement
US6203931B1 (en) * 1999-02-05 2001-03-20 Industrial Technology Research Institute Lead frame material and process for manufacturing the same
US6258624B1 (en) * 2000-01-10 2001-07-10 Micron Technology, Inc. Semiconductor package having downset leadframe for reducing package bow
US20020033523A1 (en) * 2000-07-27 2002-03-21 Stmicroelectronics S.R.L. Lead-frame for semiconductor devices
US6664647B2 (en) * 2000-08-18 2003-12-16 Hitachi Ltd Semiconductor device and a method of manufacturing the same
US7049685B2 (en) * 2000-08-24 2006-05-23 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20020041911A1 (en) * 2000-10-06 2002-04-11 Nec Corporation Resin encapsulation mold
US20020121680A1 (en) * 2001-03-05 2002-09-05 Samsung Electronics Co., Ltd. Ultra-thin semiconductor package device and method for manufacturing the same
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030127711A1 (en) * 2002-01-09 2003-07-10 Matsushita Electric Industrial Co., Ltd. Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017108364A1 (en) 2016-06-13 2017-12-14 Denso Corporation magnetic sensor
US9929077B2 (en) 2016-06-13 2018-03-27 Denso Corporation Magnetic sensor
EP3544395A1 (en) * 2018-03-24 2019-09-25 Melexis Technologies SA Magnetic sensor component and assembly
US20190293728A1 (en) * 2018-03-24 2019-09-26 Melexis Technologies Sa Magnetic sensor component and assembly
US11067645B2 (en) * 2018-03-24 2021-07-20 Melexis Technologies Sa Magnetic sensor component and assembly
EP3972396A1 (en) * 2018-03-24 2022-03-23 Melexis Technologies SA Magnetic sensor component and assembly
US11474165B2 (en) 2018-03-24 2022-10-18 Melexis Technologies Sa Magnetic sensor component and assembly
US11543466B2 (en) 2018-03-24 2023-01-03 Melexis Technologies Sa Magnetic sensor component and assembly
CN114252820A (en) * 2020-09-24 2022-03-29 迈来芯电子科技有限公司 Magnetic sensor components and assemblies

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