US20040108104A1 - Axial heat-dissipating device - Google Patents
Axial heat-dissipating device Download PDFInfo
- Publication number
- US20040108104A1 US20040108104A1 US10/395,933 US39593303A US2004108104A1 US 20040108104 A1 US20040108104 A1 US 20040108104A1 US 39593303 A US39593303 A US 39593303A US 2004108104 A1 US2004108104 A1 US 2004108104A1
- Authority
- US
- United States
- Prior art keywords
- heat
- dissipating
- axial
- dissipating device
- shell body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a heat-dissipating device, more particularly to an axial heat-dissipating device capable of quick heat dissipation.
- FIG. 1 shows a conventional heat-dissipating device adapted to be mounted on top of a heat-generating component 12 that is disposed on a circuit board 11 of an electronic device.
- the heat-generating component 12 can be a central processing unit, an integrated circuit, or the like.
- the heat-dissipating device includes an aluminum heat-dissipating fin unit 13 disposed in thermal contact with the heat-generating component 12 , and a fan 14 oriented toward the fin unit 13 .
- the fin unit 13 has a bottom portion provided with a heat-conducting plate 15 that is formed from copper and that facilitates the transfer of heat generated by the heat-generating component 12 to the fin unit 13 .
- such a conventional heat-dissipating device has the following setbacks:
- the object of the present invention is to provide an axial heat-dissipating device that is capable of quick heat dissipation.
- an axial heat-dissipating device of the present invention includes:
- a heat-dissipating unit including an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on the heat-transfer member, and a hollow shell body that is disposed to surround the heat-dissipating fins, the shell body having a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into the shell body; and
- a fan unit mounted on the top end portion of the shell body and operable so as to draw hot air out of the shell body.
- FIG. 1 is a schematic plan view of a conventional heat-dissipating device
- FIG. 2 is a perspective view of the first preferred embodiment of an axial heat-dissipating device according to the present invention
- FIG. 3 is an exploded perspective view of the first preferred embodiment
- FIG. 4 is another exploded perspective view of the first preferred embodiment, which is taken from a different angle;
- FIG. 5 is a sectional view to illustrate the first preferred embodiment in part
- FIG. 6 is an exploded perspective view of the second preferred embodiment of an axial heat-dissipating device according to the present invention.
- FIG. 7 is a sectional view to illustrate the third preferred embodiment of an axial heat-dissipating device according to the present invention in part;
- FIG. 8 is an exploded sectional view of the third preferred embodiment in part, illustrating that a base member, a heat-guiding post and heat-dissipating fins are connected integrally;
- FIG. 9 is a sectional view to illustrate the fourth preferred embodiment of an axial heat-dissipating device according to the present invention in part, showing integral connection among a base member, a heat-guiding post, and heat-dissipating fins;
- FIG. 10 is a cross-sectional view to illustrate the fourth preferred embodiment in part.
- FIG. 11 is a sectional view to illustrate the fifth preferred embodiment of an axial heat-dissipating device according to the present invention in part, showing integral connection among a base member, a heat-guiding post, heat-dissipating fins, and a shell body.
- the first preferred embodiment of an axial heat-dissipating device 2 is shown to be adapted for mounting on a heat-generating source 3 (see FIG. 5), which can be a central processing unit, an integrated circuit, or the like.
- the heat-generating source 3 is a central processing unit.
- the axial heat-dissipating device 2 includes a heat-dissipating unit 4 and a fan unit 6 .
- the heat-dissipating unit 4 includes a heat-transfer member 40 having a lower end adapted to be disposed on the heat-generating source 3 , a plurality of angularly spaced apart heat-dissipating fins 400 provided on the heat-transfer member 40 , and a hollow shell body 100 that is disposed to surround the heat-dissipating fins 400 .
- the heat-transfer member 40 includes a base member 8 adapted to be disposed on the heat-generating source 3 , and a heat-guiding post 91 that extends uprightly from the base member 8 .
- the base member 8 is circular, but may have any other suitable geometric shape.
- the base member 8 has a bottom surface 81 adapted to be disposed on the heat-generating source 3 , and an upwardly converging top surface 82 .
- the top surface 82 is formed with at least one lower cavity 83 in a central portion thereof. In this embodiment, four lower cavities 83 are provided.
- the heat-guiding post 91 is formed with an upper cavity 911 that is registered with the lower cavity 83 and that cooperates with the lower cavity 83 to form a heat-dissipating cavity 110 .
- four upper cavities 911 are provided to be respectively registered with the four lower cavities 83 so as to form four heat-dissipating cavities 110 (see FIG. 5), respectively.
- the heat-dissipating fins 400 extend from the heat-guiding post 91 in radial outward directions. Each adjacent pair of the heat-dissipating fins 400 define a channel 400 ′ therebetween. Each of the heat-dissipating fins 400 has a curved lower edge 401 that complements and that is in contact with the converging top surface 82 of the base member 8 .
- the shell body 100 has a lower end portion formed with a bottom opening 101 and a plurality of radial air inlets 103 that are in fluid communication with the channels 400 ′ so as to permit flow of ambient air into the shell body 100 and through the channels 400 ′, and a top end portion formed with a top opening 102 and a plurality of radial retaining holes 104 .
- the air inlets 103 are also adapted to receive fasteners (not shown) for positioning the axial heat-dissipating device 2 .
- the fan unit 6 is mounted removably on the top end portion of the shell body 100 and is operable so as to draw hot air out of the shell body 100 through the top opening 102 .
- the fan unit 6 includes an annular frame 62 , an impeller member 61 connected to the annular frame 62 , and a plurality of snap fasteners 63 extending downwardly from a bottom end of the annular frame 62 so as to engage the retaining holes 104 , thereby positioning the fan unit 6 on the shell body 100 .
- the fan unit 6 is an exhaust fan.
- the heat-dissipating unit 4 further includes a thermal conductor 5 received in the heat-dissipating cavity 110 .
- the thermal conductor 5 may be one of a heat-conducting rod and a heat-conducting pipe.
- four thermal conductors 5 are received respectively in the four heat-dissipating cavities 110 , and each of the thermal conductors 5 preferably has an outer surface coated with a heat-conducting paste 7 . It is noted that a superconducting heat-conducting rod can achieve quick conduction of heat from the heat-generating source 3 .
- each of the heat-dissipating cavities 110 may be filled with a thermally conductive material or may have an inner wall surface coated with a thermally conductive material.
- the heat-dissipating cavities 110 are vacuumed to form sealed vacuum chambers which are filled with a thermally conductive material, such as water, methanol, acetone, ammonia, nitrogen, sodium, lithium, or mixtures thereof, or with a superconductor material.
- a thermally conductive material such as water, methanol, acetone, ammonia, nitrogen, sodium, lithium, or mixtures thereof, or with a superconductor material.
- each of the heat-dissipating fins 400 is preferably coated with a thermally conductive material 10 .
- the heat-dissipating cavities 110 having the thermal conductors 5 or the thermally conductive material therein transfer the heat quickly from the heat-generating source 3 upwardly and across the heat-dissipating fins 400 that provide an extensive heat-dissipating area.
- the fan unit 6 draws relatively cold ambient air through the air inlets 103 into the shell body 100 . Due to the configuration of the upwardly converging top surface 82 of the base member 8 , the air is drawn quickly upward through the channels 400 ′ to carry away the air around the heat-dissipating unit 4 . The hot air is then discharged to the ambient through the fan unit 6 .
- the preferred embodiment provides an excellent heat-dissipating effect.
- the heat-dissipating fins 400 can be configured to be spiral in shape for faster air currents.
- the second preferred embodiment of an axial heat-dissipating device 2 further comprises a thermoelectric generator 120 mounted on a top end of the heat-transfer member 40 , and a heat-dissipating fin member 130 mounted on the top end of the heat-transfer member 40 . Furthermore, the top end portion of the shell body 100 confines a recess 100 ′.
- the heat-dissipating fin member 130 includes a plurality of radial fins that define channels 400 ′′, and is disposed in the recess 100 ′ such that the channels 400 ′′ are in fluid communication with the channels 400 ′ and such that the shell body 100 surrounds the heat-dissipating fins 400 and the heat-dissipating fin member 130 .
- the fan unit 6 is mounted on top of the heat-dissipating fin member 130 .
- the thermoelectric generator 120 in this embodiment is a thermocouple that has a hot side 121 in contact with an upper end of the heat-guiding post 91 and a cold side in contact with a bottom central portion 132 of the heat-dissipating fin member 130 .
- thermoelectric generator 120 is coupled electrically to the fan unit 6 by an electric cable 140 for supplying electric power thereto.
- thermoelectric generator 120 When the temperature difference exceeds 50 degrees Celsius, the electric current thus produced is sufficient to actuate the fan unit 6 to draw ambient air into the shell body 100 through the air inlets 103 and out of the shell body 100 so as to help carry away the heat around the heat-dissipating unit 4 .
- Two or more thermoelectric generators 120 can be connected in series to increase the output current, if desired. As such, the thermoelectric generator 120 not only provides a power source to help dissipate heat, it can also reduce power consumption of the electronic system, such as a computer system, incorporating the second preferred embodiment of this invention.
- the third preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the first preferred embodiment.
- the major differences therebetween reside in that the base member 8 ′, the heat-guiding post 91 ′ and the heat-dissipating fins 400 are connected integrally such that the heat-dissipating cavity 110 ′ that is constituted by the upper cavity 911 ′ of the heat-guiding post 91 ′ and the lower cavity 83 ′ of the base member 8 ′ extends continuously through the heat-guiding post 91 ′ and the base member 8 ′.
- the heat-dissipating cavity 110 ′ preferably has an inner wall surface coated with a thermally conductive material 10 .
- the fourth preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the third preferred embodiment.
- the difference therebetween resides mainly in that each of the heat-dissipating fins 400 confines a receiving space 402 that is communicated with the upper cavity 911 ′ and the lower cavity 83 ′ so as to cooperatively constitute the heat-dissipating cavity 110 ′.
- the heat-dissipating cavity 110 ′ preferably has an inner wall surface coated with a thermally conductive material 10 .
- the fifth preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the fourth preferred embodiment.
- the difference therebetween resides mainly in that the base member 8 ′, the heat-guiding post 91 ′, the heat-dissipating fins 400 , and the shell body 100 are connected integrally.
- the heat-dissipating cavity 110 ′ is preferably filled with a thermally conductive material 10 .
- the present invention is capable of overcoming the aforesaid drawbacks associated with the prior art, and can provide an enhanced heat-dissipating effect.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An axial heat-dissipating device includes a heat-dissipating unit and a fan unit. The heat-dissipating unit includes an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on the heat-transfer member, and a hollow shell body that is disposed to surround the heat-dissipating fins. The shell body has a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into the shell body. The fan unit is mounted on the top end portion of the shell body, and is operable so as to draw hot air out of the shell body.
Description
- This application claims priority of Taiwanese Application No. 091132959, filed on Nov. 8, 2002.
- 1. Field of the Invention
- The invention relates to a heat-dissipating device, more particularly to an axial heat-dissipating device capable of quick heat dissipation.
- 2. Description of the Related Art
- FIG. 1 shows a conventional heat-dissipating device adapted to be mounted on top of a heat-
generating component 12 that is disposed on acircuit board 11 of an electronic device. The heat-generating component 12 can be a central processing unit, an integrated circuit, or the like. The heat-dissipating device includes an aluminum heat-dissipatingfin unit 13 disposed in thermal contact with the heat-generating component 12, and afan 14 oriented toward thefin unit 13. Thefin unit 13 has a bottom portion provided with a heat-conductingplate 15 that is formed from copper and that facilitates the transfer of heat generated by the heat-generatingcomponent 12 to thefin unit 13. However, such a conventional heat-dissipating device has the following setbacks: - 1. Although aluminum and copper have quite high temperature coefficients of conductivity, their combined heat-dissipating effect is not very satisfactory, resulting in that the surface temperature of the heat-generating
component 12 remains higher than that of thefin unit 13. That is, currents of air blown by thefan 14 can only disperse the heat around thefin unit 13, and cannot reach the surface of the heat-generatingcomponent 12 to dissipate the heat of the heat-generating component 12. - 2. In view of the aforesaid, when heat gradually accumulates on the surface of the heat-
generating component 12, since the conventional heat-dissipating device cannot effectively dissipate the high heat, the operation of the heat-generating component 12 will be affected, which may result in shutdown of or even damage to the electronic device. - Therefore, the object of the present invention is to provide an axial heat-dissipating device that is capable of quick heat dissipation.
- Accordingly, an axial heat-dissipating device of the present invention includes:
- a heat-dissipating unit including an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on the heat-transfer member, and a hollow shell body that is disposed to surround the heat-dissipating fins, the shell body having a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into the shell body; and
- a fan unit mounted on the top end portion of the shell body and operable so as to draw hot air out of the shell body.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
- FIG. 1 is a schematic plan view of a conventional heat-dissipating device;
- FIG. 2 is a perspective view of the first preferred embodiment of an axial heat-dissipating device according to the present invention;
- FIG. 3 is an exploded perspective view of the first preferred embodiment;
- FIG. 4 is another exploded perspective view of the first preferred embodiment, which is taken from a different angle;
- FIG. 5 is a sectional view to illustrate the first preferred embodiment in part;
- FIG. 6 is an exploded perspective view of the second preferred embodiment of an axial heat-dissipating device according to the present invention;
- FIG. 7 is a sectional view to illustrate the third preferred embodiment of an axial heat-dissipating device according to the present invention in part;
- FIG. 8 is an exploded sectional view of the third preferred embodiment in part, illustrating that a base member, a heat-guiding post and heat-dissipating fins are connected integrally;
- FIG. 9 is a sectional view to illustrate the fourth preferred embodiment of an axial heat-dissipating device according to the present invention in part, showing integral connection among a base member, a heat-guiding post, and heat-dissipating fins;
- FIG. 10 is a cross-sectional view to illustrate the fourth preferred embodiment in part; and
- FIG. 11 is a sectional view to illustrate the fifth preferred embodiment of an axial heat-dissipating device according to the present invention in part, showing integral connection among a base member, a heat-guiding post, heat-dissipating fins, and a shell body.
- Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.
- Referring to FIGS.2 to 5, the first preferred embodiment of an axial heat-
dissipating device 2 according to the present invention is shown to be adapted for mounting on a heat-generating source 3 (see FIG. 5), which can be a central processing unit, an integrated circuit, or the like. In this embodiment, the heat-generatingsource 3 is a central processing unit. As shown, the axial heat-dissipating device 2 includes a heat-dissipating unit 4 and afan unit 6. The heat-dissipating unit 4 includes a heat-transfer member 40 having a lower end adapted to be disposed on the heat-generatingsource 3, a plurality of angularly spaced apart heat-dissipating fins 400 provided on the heat-transfer member 40, and ahollow shell body 100 that is disposed to surround the heat-dissipating fins 400. The heat-transfer member 40 includes abase member 8 adapted to be disposed on the heat-generatingsource 3, and a heat-guidingpost 91 that extends uprightly from thebase member 8. In this embodiment, thebase member 8 is circular, but may have any other suitable geometric shape. Thebase member 8 has abottom surface 81 adapted to be disposed on the heat-generatingsource 3, and an upwardly convergingtop surface 82. Thetop surface 82 is formed with at least onelower cavity 83 in a central portion thereof. In this embodiment, fourlower cavities 83 are provided. - The heat-guiding
post 91 is formed with anupper cavity 911 that is registered with thelower cavity 83 and that cooperates with thelower cavity 83 to form a heat-dissipating cavity 110. In this embodiment, fourupper cavities 911 are provided to be respectively registered with the fourlower cavities 83 so as to form four heat-dissipating cavities 110 (see FIG. 5), respectively. - The heat-dissipating
fins 400 extend from the heat-guidingpost 91 in radial outward directions. Each adjacent pair of the heat-dissipating fins 400 define achannel 400′ therebetween. Each of the heat-dissipating fins 400 has a curvedlower edge 401 that complements and that is in contact with the convergingtop surface 82 of thebase member 8. - The
shell body 100 has a lower end portion formed with a bottom opening 101 and a plurality ofradial air inlets 103 that are in fluid communication with thechannels 400′ so as to permit flow of ambient air into theshell body 100 and through thechannels 400′, and a top end portion formed with atop opening 102 and a plurality ofradial retaining holes 104. Theair inlets 103 are also adapted to receive fasteners (not shown) for positioning the axial heat-dissipating device 2. - The
fan unit 6 is mounted removably on the top end portion of theshell body 100 and is operable so as to draw hot air out of theshell body 100 through the top opening 102. Thefan unit 6 includes anannular frame 62, animpeller member 61 connected to theannular frame 62, and a plurality ofsnap fasteners 63 extending downwardly from a bottom end of theannular frame 62 so as to engage theretaining holes 104, thereby positioning thefan unit 6 on theshell body 100. Preferably, thefan unit 6 is an exhaust fan. - The heat-dissipating
unit 4 further includes athermal conductor 5 received in the heat-dissipatingcavity 110. Thethermal conductor 5 may be one of a heat-conducting rod and a heat-conducting pipe. In this embodiment, fourthermal conductors 5 are received respectively in the four heat-dissipating cavities 110, and each of thethermal conductors 5 preferably has an outer surface coated with a heat-conductingpaste 7. It is noted that a superconducting heat-conducting rod can achieve quick conduction of heat from the heat-generatingsource 3. - Alternatively, each of the heat-dissipating
cavities 110 may be filled with a thermally conductive material or may have an inner wall surface coated with a thermally conductive material. In another alternative, the heat-dissipating cavities 110 are vacuumed to form sealed vacuum chambers which are filled with a thermally conductive material, such as water, methanol, acetone, ammonia, nitrogen, sodium, lithium, or mixtures thereof, or with a superconductor material. It is noted that the term “filled” as used herein can be construed to mean “completely filled” or “partially filled.” - It is further noted that each of the heat-
dissipating fins 400 is preferably coated with a thermallyconductive material 10. - In use, when the working temperature of the heat-generating
source 3 rises, the heat-dissipatingcavities 110 having thethermal conductors 5 or the thermally conductive material therein transfer the heat quickly from the heat-generatingsource 3 upwardly and across the heat-dissipatingfins 400 that provide an extensive heat-dissipating area. In addition, thefan unit 6 draws relatively cold ambient air through theair inlets 103 into theshell body 100. Due to the configuration of the upwardly convergingtop surface 82 of thebase member 8, the air is drawn quickly upward through thechannels 400′ to carry away the air around the heat-dissipatingunit 4. The hot air is then discharged to the ambient through thefan unit 6. Thus, the preferred embodiment provides an excellent heat-dissipating effect. It is noted that the heat-dissipatingfins 400 can be configured to be spiral in shape for faster air currents. - With reference to FIG. 6, the second preferred embodiment of an axial heat-dissipating
device 2 according to the present invention further comprises athermoelectric generator 120 mounted on a top end of the heat-transfer member 40, and a heat-dissipatingfin member 130 mounted on the top end of the heat-transfer member 40. Furthermore, the top end portion of theshell body 100 confines arecess 100′. The heat-dissipatingfin member 130 includes a plurality of radial fins that definechannels 400″, and is disposed in therecess 100′ such that thechannels 400″ are in fluid communication with thechannels 400′ and such that theshell body 100 surrounds the heat-dissipatingfins 400 and the heat-dissipatingfin member 130. Thefan unit 6 is mounted on top of the heat-dissipatingfin member 130. Thethermoelectric generator 120 in this embodiment is a thermocouple that has ahot side 121 in contact with an upper end of the heat-guidingpost 91 and a cold side in contact with a bottomcentral portion 132 of the heat-dissipatingfin member 130. A heat-conducting paste can be disposed between thehot side 121 and the upper end of the heat-guidingpost 91 and between thecold side 122 and the bottomcentral portion 132. In addition, thethermoelectric generator 120 is coupled electrically to thefan unit 6 by anelectric cable 140 for supplying electric power thereto. When heat is conducted from the heat-generatingsource 3 through the heat-guidingpost 91, a temperature difference is created between the hot andcold sides thermoelectric generator 120, thereby resulting in production of an electric current (direct current). When the temperature difference exceeds 50 degrees Celsius, the electric current thus produced is sufficient to actuate thefan unit 6 to draw ambient air into theshell body 100 through theair inlets 103 and out of theshell body 100 so as to help carry away the heat around the heat-dissipatingunit 4. Two or morethermoelectric generators 120 can be connected in series to increase the output current, if desired. As such, thethermoelectric generator 120 not only provides a power source to help dissipate heat, it can also reduce power consumption of the electronic system, such as a computer system, incorporating the second preferred embodiment of this invention. - With reference to FIGS. 7 and 8, the third preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the first preferred embodiment. The major differences therebetween reside in that the
base member 8′, the heat-guidingpost 91′ and the heat-dissipatingfins 400 are connected integrally such that the heat-dissipatingcavity 110′ that is constituted by theupper cavity 911′ of the heat-guidingpost 91′ and thelower cavity 83′ of thebase member 8′ extends continuously through the heat-guidingpost 91′ and thebase member 8′. The heat-dissipatingcavity 110′ preferably has an inner wall surface coated with a thermallyconductive material 10. - With reference to FIGS. 9 and 10, the fourth preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the third preferred embodiment. The difference therebetween resides mainly in that each of the heat-dissipating
fins 400 confines a receivingspace 402 that is communicated with theupper cavity 911′ and thelower cavity 83′ so as to cooperatively constitute the heat-dissipatingcavity 110′. As in the previous embodiments, the heat-dissipatingcavity 110′ preferably has an inner wall surface coated with a thermallyconductive material 10. - With reference to FIG. 11, the fifth preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the fourth preferred embodiment. The difference therebetween resides mainly in that the
base member 8′, the heat-guidingpost 91′, the heat-dissipatingfins 400, and theshell body 100 are connected integrally. As in the previous embodiments, the heat-dissipatingcavity 110′ is preferably filled with a thermallyconductive material 10. - In view of the foregoing, it is apparent that the present invention is capable of overcoming the aforesaid drawbacks associated with the prior art, and can provide an enhanced heat-dissipating effect.
- While the present invention has been described in connection with what is considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (21)
1. An axial heat-dissipating device comprising:
a heat-dissipating unit including an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on said heat-transfer member, and a hollow shell body that is disposed to surround said heat-dissipating fins, said shell body having a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into said shell body; and
a fan unit mounted on said top end portion of said shell body and operable so as to draw hot air out of said shell body.
2. The axial heat-dissipating device as claimed in claim 1 , wherein said heat-transfer member includes a base member adapted to be disposed on the heat-generating source, and a heat-guiding post that extends uprightly from said base member.
3. The axial heat-dissipating device as claimed in claim 2 , wherein said heat-dissipating fins radiate from said heat-guiding post in radial outward directions.
4. The axial heat-dissipating device as claimed in claim 2 , wherein said base member and said heat-guiding post cooperate to form a heat-dissipating cavity.
5. The axial heat-dissipating device as claimed in claim 4, wherein said base member has a top side formed with a lower cavity, and said heat-guiding post is formed with an upper cavity that is registered with said lower cavity, said upper and lower cavities cooperatively constituting said heat-dissipating cavity.
6. The axial heat-dissipating device as claimed in claim 4 , wherein said heat-dissipating unit further includes a thermal conductor received in said heat-dissipating cavity.
7. The axial heat-dissipating device as claimed in claim 6 , wherein said thermal conductor is a heat-conducting rod.
8. The axial heat-dissipating device as claimed in claim 6 , wherein said thermal conductor is a heat-conducting pipe.
9. The axial heat-dissipating device as claimed in claim 6 , wherein said thermal conductor has an outer wall surface coated with a heat-conducting paste.
10. The axial heat-dissipating device as claimed in claim 4 , wherein said heat-dissipating cavity is filled with a thermally conductive material.
11. The axial heat-dissipating device as claimed in claim 4 , wherein said heat-dissipating cavity has an inner wall surface coated with a thermally conductive material.
12. The axial heat-dissipating device as claimed in claim 4 , wherein said heat-dissipating cavity is a sealed vacuum chamber.
13. The axial heat-dissipating device as claimed in claim 12 , wherein said heat-dissipating cavity is filled with a thermally conductive material.
14. The axial heat-dissipating device as claimed in claim 2 , wherein said base member, said heat-guiding post, said heat-dissipating fins, and said shell body are connected integrally.
15. The axial heat-dissipating device as claimed in claim 2 , wherein said base member, said heat-guiding post and said heat-dissipating fins are connected integrally.
16. The axial heat-dissipating device as claimed in claim 2 , wherein said base member and said heat-guiding post are connected integrally.
17. The axial heat-dissipating device as claimed in claim 3 , wherein said heat-guiding post and said heat-dissipating fins are connected integrally.
18. The axial heat-dissipating device as claimed in claim 2 , wherein said base member has an upwardly converging top surface, each of said heat-dissipating fins having a lower edge that complements and that is in contact with said top surface of said base member.
19. The axial heat-dissipating device as claimed in claim 1 , further comprising a thermoelectric generator mounted on a top end of said heat-transfer member and coupled electrically to said fan unit for supplying electric power thereto.
20. The axial heat-dissipating device as claimed in claim 1 , wherein said fan unit is an exhaust fan.
21. The axial heat-dissipating device as claimed in claim 1 , wherein each of said heat-dissipating fins is coated with a thermally conductive material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW091132959A TW595307B (en) | 2002-11-08 | 2002-11-08 | Centralized diversion and heat dissipating device |
TW091132959 | 2002-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20040108104A1 true US20040108104A1 (en) | 2004-06-10 |
Family
ID=32466567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/395,933 Abandoned US20040108104A1 (en) | 2002-11-08 | 2003-03-24 | Axial heat-dissipating device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20040108104A1 (en) |
TW (1) | TW595307B (en) |
Cited By (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050178527A1 (en) * | 2004-02-12 | 2005-08-18 | Yaxiong Wang | Heat dissipation device for electronic device |
US20050269060A1 (en) * | 2004-03-06 | 2005-12-08 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device assembly with fan cover |
US20060082972A1 (en) * | 2004-10-20 | 2006-04-20 | Kyoung-Ho Kim | Heat radiating apparatus |
US20060196636A1 (en) * | 2005-03-02 | 2006-09-07 | Wen-Hao Liu | Cooling mechanism |
US20060213642A1 (en) * | 2005-03-25 | 2006-09-28 | Tai-Sol Electroncs Co., Ltd. | Method of combining heat sink and heat conductor and combination assembly of the same |
US20070079954A1 (en) * | 2005-10-11 | 2007-04-12 | Chin-Wen Wang | Heat-Dissipating Model |
US20070103869A1 (en) * | 2005-11-08 | 2007-05-10 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system |
US20070159798A1 (en) * | 2006-01-09 | 2007-07-12 | Chun-Chi Chen | Heat dissipation device having phase-changeable medium therein |
US20070251674A1 (en) * | 2006-04-27 | 2007-11-01 | Bhatti Mohinder S | Capillary-assisted compact thermosiphon |
US20070279862A1 (en) * | 2006-06-06 | 2007-12-06 | Jia-Hao Li | Heat-Dissipating Structure For Lamp |
US20070297139A1 (en) * | 2006-06-22 | 2007-12-27 | Scott Brian A | Heat sink with themoelectric module |
US20080078527A1 (en) * | 2006-09-29 | 2008-04-03 | Steven John Lofland | Fan attachment method and apparatus for fan component assemblies |
US20080110599A1 (en) * | 2006-11-15 | 2008-05-15 | Ilya Reyzin | Orientation insensitive multi chamber thermosiphon |
US20080173432A1 (en) * | 2006-03-31 | 2008-07-24 | Geoffrey Wen-Tai Shuy | Heat Exchange Enhancement |
US20090084530A1 (en) * | 2006-03-31 | 2009-04-02 | Geoffrey Wen-Tai Shuy | Heat Exchange Enhancement |
US20090129102A1 (en) * | 2007-11-21 | 2009-05-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with a heat sink |
US20090135562A1 (en) * | 2007-11-28 | 2009-05-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090255658A1 (en) * | 2008-04-10 | 2009-10-15 | Asia Vital Components Co., Ltd. | Heat dissipation module |
US20100051232A1 (en) * | 2008-08-27 | 2010-03-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus incorporating a fan |
US20100116466A1 (en) * | 2008-11-07 | 2010-05-13 | Jerzy Hawranek | Axial Heat Exchanger for Regulating the Temperature and Air Comfort in an Indoor Space |
US20110103006A1 (en) * | 2009-11-05 | 2011-05-05 | Alcatel-Lucent Usa Inc. | Infrared energy powered cooling apparatus and computer chassis comprising same |
US20110122579A1 (en) * | 2008-07-25 | 2011-05-26 | Koninklijke Phiips Electronics N.V. | Cooling device for cooling a semiconductor die |
US20120080176A1 (en) * | 2010-09-30 | 2012-04-05 | Zhongshan Weiqiang Technology Co., Ltd | High-power finned heat dissipation module |
US20120113641A1 (en) * | 2010-11-10 | 2012-05-10 | Bridgelux, Inc. | Light modules connectable using heat pipes |
US20120168602A1 (en) * | 2010-12-31 | 2012-07-05 | Hon Hai Precision Industry Co., Ltd. | Mounting apparatus for fans |
US20130170231A1 (en) * | 2012-01-03 | 2013-07-04 | Davinci Industrial Inc. | Spherical light bulb and heat dissipating device thereof |
US20130250516A1 (en) * | 2012-03-20 | 2013-09-26 | Hamilton Sundstrand Corporation | Air cooled motor controllers |
US20140103947A1 (en) * | 2012-04-05 | 2014-04-17 | Huy N. PHAN | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
US20140137570A1 (en) * | 2012-11-19 | 2014-05-22 | Perpetua Power Source Technologies, Inc. | Variable thermal resistance mounting system |
US20140319239A1 (en) * | 2013-02-22 | 2014-10-30 | Nuventix, Inc. | Thermal Management System Comprising A Heat Pipe, Heat Fins And A Synthetic Jet Ejector |
US20170020030A1 (en) * | 2015-07-16 | 2017-01-19 | Compal Broadband Networks Inc. | Electronic Apparatus |
US9850907B2 (en) * | 2014-09-16 | 2017-12-26 | Philips Lighting Holding B.V. | Cooling fan |
CN110401295A (en) * | 2019-08-20 | 2019-11-01 | 江苏圣彼德机电股份有限公司 | A kind of electric machine casing increased by air quantity |
CN112438003A (en) * | 2018-07-13 | 2021-03-02 | Abb瑞士股份有限公司 | Heat sink for high-voltage switchgear |
CN112865819A (en) * | 2021-02-02 | 2021-05-28 | 深圳市福瑞仕科技有限公司 | Portable 5G signal transmitter |
US11026343B1 (en) | 2013-06-20 | 2021-06-01 | Flextronics Ap, Llc | Thermodynamic heat exchanger |
CN113782503A (en) * | 2021-09-07 | 2021-12-10 | 纳芯半导体科技(浙江)有限公司 | Silicon carbide power device packaging structure and packaging method |
US11441850B2 (en) * | 2020-01-24 | 2022-09-13 | Hamilton Sundstrand Corporation | Integral mounting arm for heat exchanger |
CN115076208A (en) * | 2022-06-07 | 2022-09-20 | 山东润金重工科技有限公司 | Durable type roller shaft forging of engineering machine tool |
US11453160B2 (en) | 2020-01-24 | 2022-09-27 | Hamilton Sundstrand Corporation | Method of building a heat exchanger |
US11460252B2 (en) | 2020-01-24 | 2022-10-04 | Hamilton Sundstrand Corporation | Header arrangement for additively manufactured heat exchanger |
WO2022213791A1 (en) * | 2021-04-06 | 2022-10-13 | 杭州宇树科技有限公司 | Tensioner drive unit having good heat dissipation effect, and electronic tensioner applying same |
US11703283B2 (en) | 2020-01-24 | 2023-07-18 | Hamilton Sundstrand Corporation | Radial configuration for heat exchanger core |
US20240060634A1 (en) * | 2021-01-08 | 2024-02-22 | Thermal Channel Technologies Oy | Heat sink as well as associated devices and methods |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2727964Y (en) | 2004-09-17 | 2005-09-21 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
TWI407895B (en) * | 2008-09-05 | 2013-09-01 | Foxconn Tech Co Ltd | Heat dissipation device |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5494098A (en) * | 1994-06-17 | 1996-02-27 | Wakefield Engineering, Inc. | Fan driven heat sink |
US5815921A (en) * | 1994-01-26 | 1998-10-06 | Sun Microsystems, Inc. | Electronic package cooling system and heat sink with heat transfer assembly |
US6085830A (en) * | 1997-03-24 | 2000-07-11 | Fujikura Ltd. | Heat sink, and process and apparatus for manufacturing the same |
US6143977A (en) * | 1992-08-06 | 2000-11-07 | Pfu Limited | Heat-generating element cooling device |
US6143975A (en) * | 1999-01-25 | 2000-11-07 | Dell Usa, L.P. | Thermoelectric regenerator |
US20020003690A1 (en) * | 2000-07-06 | 2002-01-10 | Bo-Yao Lin | Heat sink capable of having a fan mounted aslant to the lateral side thereof |
US20020006027A1 (en) * | 2000-06-06 | 2002-01-17 | Rodriguez Edward T. | Thermal distribution system |
US20020024797A1 (en) * | 2000-08-29 | 2002-02-28 | Chen Yun Long | Heat dissipation device |
US20020029868A1 (en) * | 1997-02-24 | 2002-03-14 | Fujitsu Limited | Heat sink and information processor using heat sink |
US20020075649A1 (en) * | 2000-12-18 | 2002-06-20 | Fargo Chou | Structure of computer cpu heat dissipation module |
US6411510B2 (en) * | 2000-02-08 | 2002-06-25 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US20020080582A1 (en) * | 2000-12-27 | 2002-06-27 | Kai-Cheng Chang | Heat pipe heat dissipating device |
US20020121358A1 (en) * | 2001-03-03 | 2002-09-05 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US20020126453A1 (en) * | 2001-03-08 | 2002-09-12 | Hiroshi Ubukata | Apparatus for cooling an electronic component and electronic device comprising the apparatus |
US20020186532A1 (en) * | 2001-06-08 | 2002-12-12 | Kentaro Tomioka | Electronic apparatus having cooling unit for cooling heat-generating component |
US6501652B2 (en) * | 1997-02-24 | 2002-12-31 | Fujitsu Limited | Heat sink and information processor using it |
US6515862B1 (en) * | 2000-03-31 | 2003-02-04 | Intel Corporation | Heat sink assembly for an integrated circuit |
US6538888B1 (en) * | 2001-09-28 | 2003-03-25 | Intel Corporation | Radial base heatsink |
US20030147213A1 (en) * | 2002-02-04 | 2003-08-07 | Acer Inc. | Device for cooling CPU chip |
-
2002
- 2002-11-08 TW TW091132959A patent/TW595307B/en not_active IP Right Cessation
-
2003
- 2003-03-24 US US10/395,933 patent/US20040108104A1/en not_active Abandoned
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6143977A (en) * | 1992-08-06 | 2000-11-07 | Pfu Limited | Heat-generating element cooling device |
US5815921A (en) * | 1994-01-26 | 1998-10-06 | Sun Microsystems, Inc. | Electronic package cooling system and heat sink with heat transfer assembly |
US5494098A (en) * | 1994-06-17 | 1996-02-27 | Wakefield Engineering, Inc. | Fan driven heat sink |
US20020029868A1 (en) * | 1997-02-24 | 2002-03-14 | Fujitsu Limited | Heat sink and information processor using heat sink |
US6501652B2 (en) * | 1997-02-24 | 2002-12-31 | Fujitsu Limited | Heat sink and information processor using it |
US6085830A (en) * | 1997-03-24 | 2000-07-11 | Fujikura Ltd. | Heat sink, and process and apparatus for manufacturing the same |
US6143975A (en) * | 1999-01-25 | 2000-11-07 | Dell Usa, L.P. | Thermoelectric regenerator |
US6411510B2 (en) * | 2000-02-08 | 2002-06-25 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US6515862B1 (en) * | 2000-03-31 | 2003-02-04 | Intel Corporation | Heat sink assembly for an integrated circuit |
US20020006027A1 (en) * | 2000-06-06 | 2002-01-17 | Rodriguez Edward T. | Thermal distribution system |
US20020003690A1 (en) * | 2000-07-06 | 2002-01-10 | Bo-Yao Lin | Heat sink capable of having a fan mounted aslant to the lateral side thereof |
US20020024797A1 (en) * | 2000-08-29 | 2002-02-28 | Chen Yun Long | Heat dissipation device |
US20020075649A1 (en) * | 2000-12-18 | 2002-06-20 | Fargo Chou | Structure of computer cpu heat dissipation module |
US20020080582A1 (en) * | 2000-12-27 | 2002-06-27 | Kai-Cheng Chang | Heat pipe heat dissipating device |
US20020121358A1 (en) * | 2001-03-03 | 2002-09-05 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
US20020126453A1 (en) * | 2001-03-08 | 2002-09-12 | Hiroshi Ubukata | Apparatus for cooling an electronic component and electronic device comprising the apparatus |
US20020186532A1 (en) * | 2001-06-08 | 2002-12-12 | Kentaro Tomioka | Electronic apparatus having cooling unit for cooling heat-generating component |
US6538888B1 (en) * | 2001-09-28 | 2003-03-25 | Intel Corporation | Radial base heatsink |
US20030063439A1 (en) * | 2001-09-28 | 2003-04-03 | Wen Wei | Radial base heatsink |
US20030147213A1 (en) * | 2002-02-04 | 2003-08-07 | Acer Inc. | Device for cooling CPU chip |
Cited By (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7055577B2 (en) * | 2004-02-12 | 2006-06-06 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device for electronic device |
US20050178527A1 (en) * | 2004-02-12 | 2005-08-18 | Yaxiong Wang | Heat dissipation device for electronic device |
US20050269060A1 (en) * | 2004-03-06 | 2005-12-08 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device assembly with fan cover |
US7055578B2 (en) * | 2004-03-06 | 2006-06-06 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device assembly with fan cover |
US7333336B2 (en) * | 2004-10-20 | 2008-02-19 | Lg Electronics Inc. | Heat radiating apparatus |
US20060082972A1 (en) * | 2004-10-20 | 2006-04-20 | Kyoung-Ho Kim | Heat radiating apparatus |
US20060196636A1 (en) * | 2005-03-02 | 2006-09-07 | Wen-Hao Liu | Cooling mechanism |
US7156157B2 (en) * | 2005-03-02 | 2007-01-02 | Asia Vital Component Co., Ltd. | Cooling mechanism |
US20060213642A1 (en) * | 2005-03-25 | 2006-09-28 | Tai-Sol Electroncs Co., Ltd. | Method of combining heat sink and heat conductor and combination assembly of the same |
US20070079954A1 (en) * | 2005-10-11 | 2007-04-12 | Chin-Wen Wang | Heat-Dissipating Model |
US7610947B2 (en) * | 2005-10-11 | 2009-11-03 | Pyroswift Holding Co., Limited | Heat-dissipating model |
US7379301B2 (en) * | 2005-11-08 | 2008-05-27 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system |
US20070103869A1 (en) * | 2005-11-08 | 2007-05-10 | Foxconn Technology Co., Ltd. | Integrated liquid cooling system |
US7269013B2 (en) * | 2006-01-09 | 2007-09-11 | Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. | Heat dissipation device having phase-changeable medium therein |
US20070159798A1 (en) * | 2006-01-09 | 2007-07-12 | Chun-Chi Chen | Heat dissipation device having phase-changeable medium therein |
US7826214B2 (en) * | 2006-03-31 | 2010-11-02 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Heat exchange enhancement |
US20080173432A1 (en) * | 2006-03-31 | 2008-07-24 | Geoffrey Wen-Tai Shuy | Heat Exchange Enhancement |
US7800898B2 (en) * | 2006-03-31 | 2010-09-21 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Heat exchange enhancement |
US20090084530A1 (en) * | 2006-03-31 | 2009-04-02 | Geoffrey Wen-Tai Shuy | Heat Exchange Enhancement |
US20070251674A1 (en) * | 2006-04-27 | 2007-11-01 | Bhatti Mohinder S | Capillary-assisted compact thermosiphon |
US7406999B2 (en) * | 2006-04-27 | 2008-08-05 | Delphi Technologies, Inc. | Capillary-assisted compact thermosiphon |
US20070279862A1 (en) * | 2006-06-06 | 2007-12-06 | Jia-Hao Li | Heat-Dissipating Structure For Lamp |
US20070297139A1 (en) * | 2006-06-22 | 2007-12-27 | Scott Brian A | Heat sink with themoelectric module |
US7554808B2 (en) * | 2006-06-22 | 2009-06-30 | Intel Corporation | Heat sink with thermoelectric module |
US20080078527A1 (en) * | 2006-09-29 | 2008-04-03 | Steven John Lofland | Fan attachment method and apparatus for fan component assemblies |
US8225850B2 (en) | 2006-09-29 | 2012-07-24 | Intel Corporation | Attachment method for fan component assemblies |
US7789126B2 (en) * | 2006-09-29 | 2010-09-07 | Intel Corporation | Fan attachment apparatus for fan component assemblies |
US20100242281A1 (en) * | 2006-09-29 | 2010-09-30 | Steven John Lofland | Attachment method for fan component assemblies |
US20080110599A1 (en) * | 2006-11-15 | 2008-05-15 | Ilya Reyzin | Orientation insensitive multi chamber thermosiphon |
US7475718B2 (en) * | 2006-11-15 | 2009-01-13 | Delphi Technologies, Inc. | Orientation insensitive multi chamber thermosiphon |
US20090129102A1 (en) * | 2007-11-21 | 2009-05-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with a heat sink |
US7637635B2 (en) * | 2007-11-21 | 2009-12-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp with a heat sink |
US20090135562A1 (en) * | 2007-11-28 | 2009-05-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7729119B2 (en) * | 2007-11-28 | 2010-06-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090255658A1 (en) * | 2008-04-10 | 2009-10-15 | Asia Vital Components Co., Ltd. | Heat dissipation module |
US20110122579A1 (en) * | 2008-07-25 | 2011-05-26 | Koninklijke Phiips Electronics N.V. | Cooling device for cooling a semiconductor die |
US8559175B2 (en) * | 2008-07-25 | 2013-10-15 | Koninlijke Philips N.V. | Cooling device for cooling a semiconductor die |
EP2304791B1 (en) * | 2008-07-25 | 2019-04-17 | Signify Holding B.V. | A cooling device for cooling a semiconductor die |
US20100051232A1 (en) * | 2008-08-27 | 2010-03-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus incorporating a fan |
US20100116466A1 (en) * | 2008-11-07 | 2010-05-13 | Jerzy Hawranek | Axial Heat Exchanger for Regulating the Temperature and Air Comfort in an Indoor Space |
US20110103006A1 (en) * | 2009-11-05 | 2011-05-05 | Alcatel-Lucent Usa Inc. | Infrared energy powered cooling apparatus and computer chassis comprising same |
US8208252B2 (en) * | 2009-11-05 | 2012-06-26 | Alcatel-Lucent Usa Inc. | Infrared energy powered cooling apparatus and computer chassis comprising same |
US9255743B2 (en) * | 2010-09-30 | 2016-02-09 | Zhongshan Weiqiang Technology Co., Ltd. | Finned heat dissipation module |
US20120080176A1 (en) * | 2010-09-30 | 2012-04-05 | Zhongshan Weiqiang Technology Co., Ltd | High-power finned heat dissipation module |
US20120113641A1 (en) * | 2010-11-10 | 2012-05-10 | Bridgelux, Inc. | Light modules connectable using heat pipes |
US8405989B2 (en) * | 2010-12-31 | 2013-03-26 | Hon Hai Precision Industry Co., Ltd. | Mounting apparatus for fans |
US20120168602A1 (en) * | 2010-12-31 | 2012-07-05 | Hon Hai Precision Industry Co., Ltd. | Mounting apparatus for fans |
US20130170231A1 (en) * | 2012-01-03 | 2013-07-04 | Davinci Industrial Inc. | Spherical light bulb and heat dissipating device thereof |
US20130250516A1 (en) * | 2012-03-20 | 2013-09-26 | Hamilton Sundstrand Corporation | Air cooled motor controllers |
US9175694B2 (en) * | 2012-03-20 | 2015-11-03 | Hamilton Sundstrand Corporation | Air cooled motor controllers |
US20140103947A1 (en) * | 2012-04-05 | 2014-04-17 | Huy N. PHAN | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
US9360514B2 (en) * | 2012-04-05 | 2016-06-07 | Board Of Regents, The University Of Texas System | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
US20140137570A1 (en) * | 2012-11-19 | 2014-05-22 | Perpetua Power Source Technologies, Inc. | Variable thermal resistance mounting system |
US20140319239A1 (en) * | 2013-02-22 | 2014-10-30 | Nuventix, Inc. | Thermal Management System Comprising A Heat Pipe, Heat Fins And A Synthetic Jet Ejector |
US11026343B1 (en) | 2013-06-20 | 2021-06-01 | Flextronics Ap, Llc | Thermodynamic heat exchanger |
US9850907B2 (en) * | 2014-09-16 | 2017-12-26 | Philips Lighting Holding B.V. | Cooling fan |
US20170020030A1 (en) * | 2015-07-16 | 2017-01-19 | Compal Broadband Networks Inc. | Electronic Apparatus |
CN112438003A (en) * | 2018-07-13 | 2021-03-02 | Abb瑞士股份有限公司 | Heat sink for high-voltage switchgear |
CN110401295A (en) * | 2019-08-20 | 2019-11-01 | 江苏圣彼德机电股份有限公司 | A kind of electric machine casing increased by air quantity |
US11460252B2 (en) | 2020-01-24 | 2022-10-04 | Hamilton Sundstrand Corporation | Header arrangement for additively manufactured heat exchanger |
US11441850B2 (en) * | 2020-01-24 | 2022-09-13 | Hamilton Sundstrand Corporation | Integral mounting arm for heat exchanger |
US11453160B2 (en) | 2020-01-24 | 2022-09-27 | Hamilton Sundstrand Corporation | Method of building a heat exchanger |
US11703283B2 (en) | 2020-01-24 | 2023-07-18 | Hamilton Sundstrand Corporation | Radial configuration for heat exchanger core |
US11752691B2 (en) | 2020-01-24 | 2023-09-12 | Hamilton Sundstrand Corporation | Method of building a heat exchanger |
US20240060634A1 (en) * | 2021-01-08 | 2024-02-22 | Thermal Channel Technologies Oy | Heat sink as well as associated devices and methods |
CN112865819A (en) * | 2021-02-02 | 2021-05-28 | 深圳市福瑞仕科技有限公司 | Portable 5G signal transmitter |
WO2022213791A1 (en) * | 2021-04-06 | 2022-10-13 | 杭州宇树科技有限公司 | Tensioner drive unit having good heat dissipation effect, and electronic tensioner applying same |
CN113782503A (en) * | 2021-09-07 | 2021-12-10 | 纳芯半导体科技(浙江)有限公司 | Silicon carbide power device packaging structure and packaging method |
CN115076208A (en) * | 2022-06-07 | 2022-09-20 | 山东润金重工科技有限公司 | Durable type roller shaft forging of engineering machine tool |
Also Published As
Publication number | Publication date |
---|---|
TW200408340A (en) | 2004-05-16 |
TW595307B (en) | 2004-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20040108104A1 (en) | Axial heat-dissipating device | |
US7907407B2 (en) | Heat dissipating device | |
US20090109620A1 (en) | Heat-dissipating device of portable electronic apparatus | |
CN219614727U (en) | Portable skin care device and beauty instrument | |
JP4039316B2 (en) | Electronic equipment cooling structure | |
JP2002366259A (en) | Portable information processor | |
US6867974B2 (en) | Heat-dissipating device | |
US6666261B2 (en) | Liquid circulation cooler | |
CN114025578A (en) | Heat dissipation assembly and electronic equipment | |
JP2003249612A (en) | Cooling device and cooling method | |
TW201213760A (en) | Heat dissipation device with multiple heat pipes | |
JP2000165077A (en) | Heat dissipation unit for electronic apparatus | |
JP3569451B2 (en) | Electronic equipment with heat dissipation device | |
JP2845833B2 (en) | heatsink | |
US20040000394A1 (en) | Heat-dissipating device | |
JPH1051170A (en) | Cooling device | |
TWI558971B (en) | Liquid-cooled-type heat-dissipating structure and method of manufacturing the same | |
KR20030044771A (en) | Heat-dissipating module | |
CN213754110U (en) | Wireless charger with cooling device | |
CN214278869U (en) | Notebook computer cooling system | |
TWM503599U (en) | Liquid cooling type heat dissipation structure | |
JPH1168367A (en) | Cooling structure of heat releasing element | |
TWI300894B (en) | Thermal module | |
CN218735700U (en) | Heat radiation structure and power | |
TWM623065U (en) | Fan module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |