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US20040074946A1 - Solder ball holding terminal in a bga arrangement - Google Patents

Solder ball holding terminal in a bga arrangement Download PDF

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Publication number
US20040074946A1
US20040074946A1 US10/277,195 US27719502A US2004074946A1 US 20040074946 A1 US20040074946 A1 US 20040074946A1 US 27719502 A US27719502 A US 27719502A US 2004074946 A1 US2004074946 A1 US 2004074946A1
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US
United States
Prior art keywords
distal end
solder ball
plate
holding terminal
ball holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10/277,195
Other versions
US6732904B1 (en
Inventor
Feng-Chien Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suyin Corp
Original Assignee
Suyin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suyin Corp filed Critical Suyin Corp
Priority to US10/277,195 priority Critical patent/US6732904B1/en
Assigned to SUYIN CORPORATION, HSU,FENG-CHIEN reassignment SUYIN CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, FENG-CHIEN
Publication of US20040074946A1 publication Critical patent/US20040074946A1/en
Application granted granted Critical
Publication of US6732904B1 publication Critical patent/US6732904B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a solder ball holding terminal, and more particularly to a solder ball holding terminal in a ball grid array (BGA) arrangement to securely hold the solder ball inside the holding terminal.
  • BGA ball grid array
  • a conventional solder ball holding terminal ( 80 ) is integrally made and has a first leg ( 81 ), a second leg ( 82 ) and a stop ( 83 ) sandwiched between the first leg ( 81 ) and the second leg ( 82 ).
  • the present invention tends to provide an improved solder ball holding terminal to mitigate and obviate the aforementioned problems.
  • the primary objective of the present invention is to provide an improved solder ball holding terminal having a first distal end, a second distal end, a third distal end and a fourth distal end, wherein a distance between the third and the fourth distal ends is much smaller than that between the first distal end and the second distal end.
  • Another objective of the present invention is that the distance between the third distal end and the fourth distal end is able to allow the solder ball to deform so that the solder ball is firmly clamped inside the solder ball holding terminal.
  • Still another objective of the present invention is that a stop is respectively formed between the first distal end and the third distal end and the second distal end and the fourth distal end so that after the solder ball is inserted into a space among the first distal end, the second distal end, the third distal end and the fourth distal end, further advancement of the solder ball into the space is limited.
  • FIG. 1 is a perspective view of the solder ball holding terminal of the present invention
  • FIG. 2 is a front plan view of the solder ball holding terminal in FIG. 1;
  • FIG. 3 is a top plan view of the solder ball holding terminal of the present invention.
  • FIG. 4 is a perspective view of a conventional solder ball holding terminal
  • FIG. 5 is a schematic view showing that the conventional solder ball holding terminal is clamping the solder ball.
  • the solder ball holding terminal ( 10 ) in accordance with the present invention has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate.
  • the first plate has a first distal end ( 11 ).
  • the second plate has a second distal end ( 12 ).
  • the third plate has a third distal end ( 13 ) and a fourth distal end ( 14 ).
  • a distance ‘A’ between the third distal end ( 13 ) and the fourth distal end ( 14 ) is much smaller than that between the first distal end ( 11 ) and the second distal end ( 12 ).
  • solder ball ( 90 ) When a solder ball ( 90 ) is inserted into a space ( 15 ) defined among the first distal end ( 11 ), the second distal end ( 12 ), the third distal end ( 13 ) and the fourth distal end ( 14 ), a substantially three-point support is provided to the solder ball ( 90 ) so that the solder ball ( 90 ) is securely clamped by the solder ball holding terminal ( 10 ).
  • the distance ‘A’ between the third distal end ( 13 ) and the fourth distal end ( 14 ) is able to allow the solder ball ( 90 ) to have a deformation ( 91 ) when the solder ball ( 90 ) is inserted into the space ( 15 ).
  • the solder ball ( 90 ) is securely clamped by the solder ball holding terminal ( 10 ) of the present invention.
  • two stops ( 16 , 17 ) are respectively formed between the first distal end ( 11 ) and the third distal end ( 13 ) and the second distal end ( 12 ) and the fourth distal end ( 14 ) so that after the solder ball ( 90 ) is inserted into the space ( 15 ), further advancement of the solder ball ( 90 ) into the space ( 15 ) is limited.
  • solder ball holding terminal of the present invention not only provides a three-point support to securely clamp the solder ball ( 90 ), but also limits undesirable advancement of the solder ball ( 90 ) beyond the space ( 15 ).

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A solder ball holding terminal has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first distal end, the second plate has a second distal end and the third plate has a third distal end and a fourth distal end. A distance between the third distal end and the fourth distal end is much smaller than that between the first distal end and the second distal end such that when a solder ball is inserted into a space defined among the first distal end, the second distal end, the third distal end and the fourth distal end, a substantially three-point support is provided to the solder ball so that the solder ball is securely clamped.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a solder ball holding terminal, and more particularly to a solder ball holding terminal in a ball grid array (BGA) arrangement to securely hold the solder ball inside the holding terminal. [0002]
  • 2. Description of Related Art [0003]
  • With reference to FIGS. 4 and 5, a conventional solder ball holding terminal ([0004] 80) is integrally made and has a first leg (81), a second leg (82) and a stop (83) sandwiched between the first leg (81) and the second leg (82).
  • When a solder ball ([0005] 90) is inserted into a space between the first leg (81) and the second leg (82), the first leg (81) and the second leg (82) are able to clamp an outer periphery of the solder ball (90) and the stop (83) limits further advancement of the solder ball (90) between the first leg (81) and the second leg (82).
  • It is well known in the art that when an object is clamped by two individual ends of the terminal, the object is not stably positioned. Therefore, the solder ball ([0006] 90) very easily falls out from the terminal (80).
  • To overcome the shortcomings, the present invention tends to provide an improved solder ball holding terminal to mitigate and obviate the aforementioned problems. [0007]
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide an improved solder ball holding terminal having a first distal end, a second distal end, a third distal end and a fourth distal end, wherein a distance between the third and the fourth distal ends is much smaller than that between the first distal end and the second distal end. When a solder ball is inserted into a space defined among the first, the second, the third and the fourth distal ends, a three-point support is provided to the solder ball so that the solder ball is securely clamped by the solder ball holding terminal. [0008]
  • Another objective of the present invention is that the distance between the third distal end and the fourth distal end is able to allow the solder ball to deform so that the solder ball is firmly clamped inside the solder ball holding terminal. [0009]
  • Still another objective of the present invention is that a stop is respectively formed between the first distal end and the third distal end and the second distal end and the fourth distal end so that after the solder ball is inserted into a space among the first distal end, the second distal end, the third distal end and the fourth distal end, further advancement of the solder ball into the space is limited.[0010]
  • Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings. [0011]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of the solder ball holding terminal of the present invention; [0012]
  • FIG. 2 is a front plan view of the solder ball holding terminal in FIG. 1; [0013]
  • FIG. 3 is a top plan view of the solder ball holding terminal of the present invention; [0014]
  • FIG. 4 is a perspective view of a conventional solder ball holding terminal; and [0015]
  • FIG. 5 is a schematic view showing that the conventional solder ball holding terminal is clamping the solder ball. [0016]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • With reference to FIGS. 1 and 2, the solder ball holding terminal ([0017] 10) in accordance with the present invention has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first distal end (11). The second plate has a second distal end (12). The third plate has a third distal end (13) and a fourth distal end (14). A distance ‘A’ between the third distal end (13) and the fourth distal end (14) is much smaller than that between the first distal end (11) and the second distal end (12). When a solder ball (90) is inserted into a space (15) defined among the first distal end (11), the second distal end (12), the third distal end (13) and the fourth distal end (14), a substantially three-point support is provided to the solder ball (90) so that the solder ball (90) is securely clamped by the solder ball holding terminal (10).
  • Furthermore, the distance ‘A’ between the third distal end ([0018] 13) and the fourth distal end (14) is able to allow the solder ball (90) to have a deformation (91) when the solder ball (90) is inserted into the space (15). Thus, the solder ball (90) is securely clamped by the solder ball holding terminal (10) of the present invention.
  • Still further, two stops ([0019] 16,17) are respectively formed between the first distal end (11) and the third distal end (13) and the second distal end (12) and the fourth distal end (14) so that after the solder ball (90) is inserted into the space (15), further advancement of the solder ball (90) into the space (15) is limited.
  • From the foregoing description, it is noted that the solder ball holding terminal of the present invention not only provides a three-point support to securely clamp the solder ball ([0020] 90), but also limits undesirable advancement of the solder ball (90) beyond the space (15).
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. [0021]

Claims (3)

What is claimed is:
1. A solder ball holding terminal in a ball grid array arrangement, the solder ball holding terminal having a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate, wherein the improvements comprise:
the first plate has a first distal end, the second plate has a second distal end, the third plate has a third distal end and a fourth distal end, a distance between the third distal end and the fourth distal end is much smaller than that between the first distal end and the second distal end such that when a solder ball is inserted into a space defined among the first distal end, the second distal end, the third distal end and the fourth distal end, a substantially three-point support is provided to the solder ball so that the solder ball is securely clamped.
2. The solder ball holding terminal as claimed in claim 1, wherein the distance between the third distal end and the fourth distal end is so small that a deformation is formed on the solder ball after the solder ball is inserted into the space.
3. The solder ball holding terminal as claimed in claim 2, wherein two stops are respectively formed between the first distal end and the third distal end and the second distal end and the fourth distal end so that after the solder ball is inserted into the space, further advancement of the solder ball into the space is limited.
US10/277,195 2002-10-21 2002-10-21 Solder ball holding terminal in a BGA arrangement Expired - Fee Related US6732904B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/277,195 US6732904B1 (en) 2002-10-21 2002-10-21 Solder ball holding terminal in a BGA arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/277,195 US6732904B1 (en) 2002-10-21 2002-10-21 Solder ball holding terminal in a BGA arrangement

Publications (2)

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US20040074946A1 true US20040074946A1 (en) 2004-04-22
US6732904B1 US6732904B1 (en) 2004-05-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005007355B4 (en) * 2004-05-06 2010-08-05 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical snap-fit element for optical coupling between a light source and a target element using surface mount technology

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5887344A (en) * 1996-04-02 1999-03-30 Aries Electronics, Inc. Method of mounting a plurality of ball leads onto a BGA socket
US5932891A (en) * 1997-08-28 1999-08-03 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with test terminal and IC socket
US6454157B2 (en) * 1996-11-14 2002-09-24 Berg Technology, Inc. High density connector having a ball type of contact surface
US6460755B1 (en) * 1996-03-08 2002-10-08 Hitachi, Ltd. Bump forming method and apparatus therefor
US20030016873A1 (en) * 2001-07-19 2003-01-23 Motorola, Inc Text input method for personal digital assistants and the like

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6460755B1 (en) * 1996-03-08 2002-10-08 Hitachi, Ltd. Bump forming method and apparatus therefor
US5887344A (en) * 1996-04-02 1999-03-30 Aries Electronics, Inc. Method of mounting a plurality of ball leads onto a BGA socket
US6454157B2 (en) * 1996-11-14 2002-09-24 Berg Technology, Inc. High density connector having a ball type of contact surface
US5932891A (en) * 1997-08-28 1999-08-03 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with test terminal and IC socket
US20030016873A1 (en) * 2001-07-19 2003-01-23 Motorola, Inc Text input method for personal digital assistants and the like

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005007355B4 (en) * 2004-05-06 2010-08-05 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical snap-fit element for optical coupling between a light source and a target element using surface mount technology

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Legal Events

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AS Assignment

Owner name: HSU,FENG-CHIEN, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HSU, FENG-CHIEN;REEL/FRAME:014439/0008

Effective date: 20040301

Owner name: SUYIN CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HSU, FENG-CHIEN;REEL/FRAME:014439/0008

Effective date: 20040301

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Year of fee payment: 4

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LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20160511