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US20030106670A1 - Clip for heat sink - Google Patents

Clip for heat sink Download PDF

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Publication number
US20030106670A1
US20030106670A1 US10/042,562 US4256201A US2003106670A1 US 20030106670 A1 US20030106670 A1 US 20030106670A1 US 4256201 A US4256201 A US 4256201A US 2003106670 A1 US2003106670 A1 US 2003106670A1
Authority
US
United States
Prior art keywords
clip
heat sink
wings
main body
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/042,562
Inventor
Hsieh Lee
Donyun Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US10/042,562 priority Critical patent/US20030106670A1/en
Assigned to FOXCONN PRECISION COMPONENTS CO., LTD. reassignment FOXCONN PRECISION COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, DONYUN, LEE, HSIEH KUN
Priority to US10/427,816 priority patent/US7055589B2/en
Publication of US20030106670A1 publication Critical patent/US20030106670A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to clips for heat sinks, and more particularly to a clip which firmly secures a heat sink to an integrated circuit (IC) chip.
  • IC integrated circuit
  • a typical heat sink assembly used for a heat-generating device comprises a heat sink and an elongated clip separable from the heat sink.
  • the heat-generating device may be an IC chip or a central processing unit (CPU).
  • the clip is generally formed from a metal rod. The clip is placed in a groove of the heat sink, and is engaged with catches of a socket on which the heat-generating device is mounted. Thus the heat sink is secured to a top surface of the heat-generating device.
  • a conventional clip is shown in Taiwan Patent Application No. 86209116.
  • the clip is secured to a heat sink by positioning a central portion of an elongated body of the clip in an attachment clamp.
  • the clamp comprises a hollow semi-cylindrical seat for receiving the central portion, and ears extending from opposite sides of the seat. The ears are compressed and positioned in a groove of the heat sink.
  • the clamp is thereby securely attached between fins of the heat sink.
  • the clip has a pair of arms extending perpendicularly from opposite ends of the elongated body, in generally opposite directions. The ends of the arms engage in receiving portions of a socket on which a CPU is mounted.
  • the heat sink is thereby secured to the CPU.
  • the clip remains in a fixed position relative to the heat sink. The clip and the heat sink resist vibration and shock encountered during normal operation.
  • the main shortcoming of the abovementioned clip is that it is formed from a rod. Therefore manual operation of the clip is inconvenient. Furthermore, the clip cannot be used without the clamp, because this results in unstable positioning of the heat sink on the CPU. Thus installation of the clip is unduly complicated.
  • an object of the present invention is to provide a clip which firmly secures a heat sink to an IC chip.
  • Another object of the present invention is to provide a clip allowing easy manual operation thereof.
  • a clip of the present invention for securing a heat sink comprises a pair of spaced V-shaped main bodies respectively received in grooves of the heat sink.
  • a pair of spaced wings extends outwardly from opposite ends of each main body. The wings are slanted slightly upwardly.
  • a hook is formed at a free end of each wing. Each hook has a V-shaped profile. The wings are wider than the hooks, for facilitating manual operation of the clip.
  • FIG. 1 is an exploded view of a clip in accordance with a preferred embodiment of the present invention, and a heat sink;
  • FIG. 2 is an assembled view of FIG. 1;
  • FIG. 3 is a perspective view of the clip attaching the heat sink to an IC chip supported on a printed circuit board
  • FIG. 4 is a perspective view of a clip in accordance with an alternative embodiment of the present invention.
  • FIG. 1 shows a clip 30 in accordance with a preferred embodiment of the present invention, for securing a heat sink 10 .
  • the heat sink 10 is mounted on an IC chip 50 that is supported on a printed circuit board (PCB) 70 .
  • the PCB 70 defines four through holes 72 therein. The through holes 72 surround the chip 50 .
  • the heat sink 10 comprises a base 12 for mounting on the chip 50 , and a plurality of fins 14 extending from a top surface of the base 12 .
  • the fins 14 are arrayed in parallel rows.
  • a plurality of parallel grooves 16 is defined in the heat sink 10 , each groove 16 being disposed between corresponding rows of the fins 14 .
  • Each groove 16 has a substantially V-shaped profile.
  • a centermost groove 16 is disposed between two adjacent inmost rows of the fins 14 .
  • Each fin 14 in the two adjacent inmost rows of the fins 14 outwardly forms a protrusion 18 on a side of the fin 14 that is opposite to a side of the fin 14 that is adjacent the centermost groove 16 . All the protrusions 18 are disposed at a same height. Thus the protrusions 18 are arrayed in two parallel rows.
  • the clip 30 comprises a pair of separate generally V-shaped main bodies 32 , for being respectively received in corresponding grooves 16 of the heat sink 10 .
  • a pair of wings 38 extends outwardly in a same direction from opposite ends respectively of each main body 32 .
  • the wings 38 are slanted slightly upwardly.
  • a hook 42 is formed at a distal end of each wing 38 .
  • Each hook 42 has a generally V-shaped profile.
  • a width of each wing 38 is greater than a width of each hook 42 , for facilitating manual operation of the clip 30 .
  • the main bodies 32 of the clip 30 are deflectably pressed into two grooves 16 of the heat sink 10 that are respectively adjacent the two rows of protrusions 18 .
  • the main bodies 32 are blocked by the protrusions 18 from moving out from the grooves 16 .
  • the clip 30 is secured to the heat sink 10 .
  • the combined clip 30 and heat sink 10 is placed on the chip 50 .
  • the wings 38 are depressed, to cause the hooks 42 to resiliently engage in the through holes 72 of the PCB 70 .
  • the heat sink 10 is thereby secured to the chip 50 supported on the PCB 70 , for removing heat from the chip 50 .
  • FIG. 4 shows a clip 30 ′ in accordance with an alternative embodiment of the present invention.
  • the clip 30 ′ has a pair of main bodies 32 ′ each having a structure the same as that of the main body 32 of the clip 30 of the preferred embodiment.
  • a pair of spaced horizontal connecting portions 44 ′ is integrally formed between the main bodies 32 ′.
  • a detailed description of the clip 30 ′ is omitted herefrom. Reference is made to the detailed description of the clip 30 , with due alteration of details.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A clip (30) securing a heat sink (10) includes a pair of spaced V-shaped main bodies (32) respectively received in grooves (16) of the heat sink. A pair of spaced wings (38) extends outwardly from opposite ends of each main body. The wings are slanted slightly upwardly. A hook (42) is formed at a free end of each wing. Each hook has a V-shaped profile. The wings are wider than the hooks, for facilitating manual operation of the clip.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to clips for heat sinks, and more particularly to a clip which firmly secures a heat sink to an integrated circuit (IC) chip. [0002]
  • 2. Description of Related Art [0003]
  • A typical heat sink assembly used for a heat-generating device comprises a heat sink and an elongated clip separable from the heat sink. The heat-generating device may be an IC chip or a central processing unit (CPU). The clip is generally formed from a metal rod. The clip is placed in a groove of the heat sink, and is engaged with catches of a socket on which the heat-generating device is mounted. Thus the heat sink is secured to a top surface of the heat-generating device. [0004]
  • A conventional clip is shown in Taiwan Patent Application No. 86209116. The clip is secured to a heat sink by positioning a central portion of an elongated body of the clip in an attachment clamp. The clamp comprises a hollow semi-cylindrical seat for receiving the central portion, and ears extending from opposite sides of the seat. The ears are compressed and positioned in a groove of the heat sink. The clamp is thereby securely attached between fins of the heat sink. The clip has a pair of arms extending perpendicularly from opposite ends of the elongated body, in generally opposite directions. The ends of the arms engage in receiving portions of a socket on which a CPU is mounted. The heat sink is thereby secured to the CPU. The clip remains in a fixed position relative to the heat sink. The clip and the heat sink resist vibration and shock encountered during normal operation. [0005]
  • The main shortcoming of the abovementioned clip is that it is formed from a rod. Therefore manual operation of the clip is inconvenient. Furthermore, the clip cannot be used without the clamp, because this results in unstable positioning of the heat sink on the CPU. Thus installation of the clip is unduly complicated. [0006]
  • An improved clip which overcomes the above-mentioned problems is strongly desired. [0007]
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a clip which firmly secures a heat sink to an IC chip. [0008]
  • Another object of the present invention is to provide a clip allowing easy manual operation thereof. [0009]
  • In order to achieve the objects set out above, a clip of the present invention for securing a heat sink comprises a pair of spaced V-shaped main bodies respectively received in grooves of the heat sink. A pair of spaced wings extends outwardly from opposite ends of each main body. The wings are slanted slightly upwardly. A hook is formed at a free end of each wing. Each hook has a V-shaped profile. The wings are wider than the hooks, for facilitating manual operation of the clip. [0010]
  • Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.[0011]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a clip in accordance with a preferred embodiment of the present invention, and a heat sink; [0012]
  • FIG. 2 is an assembled view of FIG. 1; [0013]
  • FIG. 3 is a perspective view of the clip attaching the heat sink to an IC chip supported on a printed circuit board; and [0014]
  • FIG. 4 is a perspective view of a clip in accordance with an alternative embodiment of the present invention.[0015]
    • DETAILED DESCRIPTION OF THE INVENTION
  • Reference will now be made to the drawing figures to describe embodiments of the present invention in detail. [0016]
  • FIG. 1 shows a [0017] clip 30 in accordance with a preferred embodiment of the present invention, for securing a heat sink 10. Referring also to FIGS. 2-3, the heat sink 10 is mounted on an IC chip 50 that is supported on a printed circuit board (PCB) 70. The PCB 70 defines four through holes 72 therein. The through holes 72 surround the chip 50.
  • The [0018] heat sink 10 comprises a base 12 for mounting on the chip 50, and a plurality of fins 14 extending from a top surface of the base 12. The fins 14 are arrayed in parallel rows. Thus, a plurality of parallel grooves 16 is defined in the heat sink 10, each groove 16 being disposed between corresponding rows of the fins 14. Each groove 16 has a substantially V-shaped profile. A centermost groove 16 is disposed between two adjacent inmost rows of the fins 14. Each fin 14 in the two adjacent inmost rows of the fins 14 outwardly forms a protrusion 18 on a side of the fin 14 that is opposite to a side of the fin 14 that is adjacent the centermost groove 16. All the protrusions 18 are disposed at a same height. Thus the protrusions 18 are arrayed in two parallel rows.
  • Referring particularly to FIG. 1, the [0019] clip 30 comprises a pair of separate generally V-shaped main bodies 32, for being respectively received in corresponding grooves 16 of the heat sink 10. A pair of wings 38 extends outwardly in a same direction from opposite ends respectively of each main body 32. The wings 38 are slanted slightly upwardly. A hook 42 is formed at a distal end of each wing 38. Each hook 42 has a generally V-shaped profile. A width of each wing 38 is greater than a width of each hook 42, for facilitating manual operation of the clip 30.
  • In use of the [0020] clip 30, the main bodies 32 of the clip 30 are deflectably pressed into two grooves 16 of the heat sink 10 that are respectively adjacent the two rows of protrusions 18. The main bodies 32 are blocked by the protrusions 18 from moving out from the grooves 16. Thus, the clip 30 is secured to the heat sink 10. The combined clip 30 and heat sink 10 is placed on the chip 50. The wings 38 are depressed, to cause the hooks 42 to resiliently engage in the through holes 72 of the PCB 70. The heat sink 10 is thereby secured to the chip 50 supported on the PCB 70, for removing heat from the chip 50.
  • FIG. 4 shows a [0021] clip 30′ in accordance with an alternative embodiment of the present invention. The clip 30′ has a pair of main bodies 32′ each having a structure the same as that of the main body 32 of the clip 30 of the preferred embodiment. A pair of spaced horizontal connecting portions 44′ is integrally formed between the main bodies 32′. For brevity, a detailed description of the clip 30′ is omitted herefrom. Reference is made to the detailed description of the clip 30, with due alteration of details.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. [0022]

Claims (13)

What is claimed is:
1. A clip adapted for securing a heat sink to a heat-generating device for removing heat therefrom, comprising:
a first main body adapted to be received in a groove of the heat sink, a pair of first wings extending outwardly from the main body, a first hook being formed at a free end of each of the first wings; and
a second main body adapted to be received in another groove of the heat sink, a pair of second wings extending outwardly from the main body, a second hook being formed at a free end of each of the second wings.
2. The clip as described in claim 1, wherein the first and second main bodies both are substantially V-shaped.
3. The clip as described in claim 1, wherein each of the first and second wings is slanted slightly upwardly.
4. The clip as described in claim 1, wherein each of the first and second hooks is substantially V-shaped.
5. The clip as described in claim 4, wherein the first wings are spaced from each other.
6. The clip as described in claim 5, wherein the first wings are formed at opposite ends of the first main body.
7. The clip as described in claim 4, wherein the second wings are spaced from each other.
8. The clip as described in claim 7, wherein the second wings are formed at opposite ends of the second main body.
9. The clip as described in claim 1, the clip further comprising at least one connecting portion between the first and second main bodies.
10. The clip as described in claim 1, wherein the first wings are wider than the first hooks, and the second wings are wider than the second hooks, for facilitating manual operation of the clip.
11. A heat sink assembly comprising:
a substrate supporting a heat-generating device thereon, the substrate defining a plurality of through holes therein;
a heat sink mounted on the heat-generating device, the heat sink comprising a base and a plurality of fins, the fins defining a plurality of grooves therebetween, a row of protrusions being formed on an inner row of the plurality of fins adjacent an inner groove of the plurality of grooves; and
a clip comprising a main body and a plurality of wings extending from the main body, the main body being deflectably received in said inner groove of the heat sink and pressing the heat sink against the heat-generating device, the wings being disposed at opposite sides of the heat sink, V-shaped hooks being formed on the wings and being engaged in the through holes of the substrate.
12. A clip for use in a heat sink for securing the heat sink to a heat-generating electronic device, the clip comprising:
a pair of generally V-shaped main bodies adapted for fitting in two grooves defined in the heat sink, respectively;
a wing upwardly and outwardly extending from each of the main bodies; and
a generally V-shaped hook which is smaller than the wing extending downwardly from a distal end of the wing.
13. The clip as described in claim 12, further comprising at least one connecting portion connecting the main bodies together.
US10/042,562 2001-12-10 2001-12-10 Clip for heat sink Abandoned US20030106670A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/042,562 US20030106670A1 (en) 2001-12-10 2001-12-10 Clip for heat sink
US10/427,816 US7055589B2 (en) 2001-12-10 2003-04-30 Clip for heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/042,562 US20030106670A1 (en) 2001-12-10 2001-12-10 Clip for heat sink

Related Child Applications (1)

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US10/427,816 Division US7055589B2 (en) 2001-12-10 2003-04-30 Clip for heat sink

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US20030106670A1 true US20030106670A1 (en) 2003-06-12

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US10/427,816 Expired - Fee Related US7055589B2 (en) 2001-12-10 2003-04-30 Clip for heat sink

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050094377A1 (en) * 2003-10-31 2005-05-05 Lee Hsieh K. Heat sink assembly incorporating spring clip
US20050111196A1 (en) * 2003-11-21 2005-05-26 Jack Wang Fastening structure of heat sink
US6947283B2 (en) * 2002-10-01 2005-09-20 Intel Corporation Heat sink and retaining clip assembly
US20070242437A1 (en) * 2006-04-14 2007-10-18 Compal Electronics, Inc. Heat dissipating module
US20080253093A1 (en) * 2007-04-11 2008-10-16 Dell Products, Lp Printed circuit board employing heat sink retaining apparatus and method of use
US20090034199A1 (en) * 2007-07-31 2009-02-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
US20090244851A1 (en) * 2008-03-26 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Mounting device for mounting heat sink onto electronic component
US20100314073A1 (en) * 2009-06-16 2010-12-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and clip assembly thereof
US20130070419A1 (en) * 2011-09-21 2013-03-21 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipating module
US20130087311A1 (en) * 2011-10-11 2013-04-11 Foxconn Technology Co., Ltd. Thermal module
US20130120932A1 (en) * 2011-11-16 2013-05-16 Hon Hai Precision Industry Co., Ltd. Motherboard with heat sink
US20140146481A1 (en) * 2012-11-29 2014-05-29 Bradford Kyle Subat Circuit Cooling
USD912626S1 (en) * 2019-01-15 2021-03-09 Delta Electronics (Shanghai) Co., Ltd Magnetic core
US11581119B2 (en) 2019-01-15 2023-02-14 Delta Electronics (Shanghai) Co., Ltd Magnetic device and method of manufacturing the same

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CN100461386C (en) * 2005-03-14 2009-02-11 奇鋐科技股份有限公司 Fixture mechanism of radiator
US7347249B2 (en) * 2005-07-18 2008-03-25 Asia Vital Components Co., Ltd. Fixing device for a radiator
TWI266599B (en) * 2005-11-22 2006-11-11 Ama Precision Inc Clip adapted to heat sink
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US20070284084A1 (en) * 2006-06-12 2007-12-13 Asia Vital Components Co., Ltd. Radiator with buckle
US20080310119A1 (en) * 2007-06-13 2008-12-18 Tellabs Bedford, Inc. Clip on heat sink
TW200903225A (en) * 2007-07-02 2009-01-16 Ama Precision Inc Heat dissipation module
KR101424136B1 (en) * 2007-09-06 2014-08-04 삼성전자주식회사 Heat sink for electronic component having fin
US8063485B1 (en) 2008-06-27 2011-11-22 Advanced Thermal Solutions, Inc. Electronics package with integrated lugs for cooling attachment
CN101742819B (en) * 2008-11-21 2013-03-20 鸿富锦精密工业（深圳）有限公司 Circuit board compobination
TW201021669A (en) * 2008-11-26 2010-06-01 Delta Electronics Inc Heat sink latching structure
TW201220030A (en) * 2010-11-11 2012-05-16 Hon Hai Prec Ind Co Ltd Heat dissipation apparatus assembly
CN102802378A (en) * 2011-05-27 2012-11-28 鸿富锦精密工业（深圳）有限公司 Radiating device and electronic device using radiating device
US9169856B2 (en) * 2012-02-02 2015-10-27 Asia Vital Components Co., Ltd. Fastening structure for thermal module
US20140036451A1 (en) * 2012-07-31 2014-02-06 Glenn C. Simon Heat sink assembly

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6947283B2 (en) * 2002-10-01 2005-09-20 Intel Corporation Heat sink and retaining clip assembly
US20050094377A1 (en) * 2003-10-31 2005-05-05 Lee Hsieh K. Heat sink assembly incorporating spring clip
US7203066B2 (en) * 2003-10-31 2007-04-10 Fu Zhun Precision Ind. (Shenzhen) Co., Ltd. Heat sink assembly incorporating spring clip
US20050111196A1 (en) * 2003-11-21 2005-05-26 Jack Wang Fastening structure of heat sink
US20070242437A1 (en) * 2006-04-14 2007-10-18 Compal Electronics, Inc. Heat dissipating module
US7426112B2 (en) * 2006-04-14 2008-09-16 Compal Electronics, Inc Heat dissipating module
US20080253093A1 (en) * 2007-04-11 2008-10-16 Dell Products, Lp Printed circuit board employing heat sink retaining apparatus and method of use
US7787251B2 (en) * 2007-04-11 2010-08-31 Dell Products, Lp Printed circuit board employing heat sink retaining apparatus and method of use
US7746651B2 (en) * 2007-07-31 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
US20090034199A1 (en) * 2007-07-31 2009-02-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
US7639504B2 (en) * 2008-03-26 2009-12-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Mounting device for mounting heat sink onto electronic component
US20090244851A1 (en) * 2008-03-26 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Mounting device for mounting heat sink onto electronic component
US20100314073A1 (en) * 2009-06-16 2010-12-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and clip assembly thereof
US20130070419A1 (en) * 2011-09-21 2013-03-21 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipating module
US20130087311A1 (en) * 2011-10-11 2013-04-11 Foxconn Technology Co., Ltd. Thermal module
US20130120932A1 (en) * 2011-11-16 2013-05-16 Hon Hai Precision Industry Co., Ltd. Motherboard with heat sink
US20140146481A1 (en) * 2012-11-29 2014-05-29 Bradford Kyle Subat Circuit Cooling
US9049811B2 (en) * 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
USD912626S1 (en) * 2019-01-15 2021-03-09 Delta Electronics (Shanghai) Co., Ltd Magnetic core
US11581119B2 (en) 2019-01-15 2023-02-14 Delta Electronics (Shanghai) Co., Ltd Magnetic device and method of manufacturing the same

Also Published As

Publication number Publication date
US20030192672A1 (en) 2003-10-16
US7055589B2 (en) 2006-06-06

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN PRECISION COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, HSIEH KUN;LEE, DONYUN;REEL/FRAME:012482/0344

Effective date: 20011120

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION