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US20020173876A1 - Board align image acquisition device with improved interface - Google Patents

Board align image acquisition device with improved interface Download PDF

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Publication number
US20020173876A1
US20020173876A1 US10/017,501 US1750101A US2002173876A1 US 20020173876 A1 US20020173876 A1 US 20020173876A1 US 1750101 A US1750101 A US 1750101A US 2002173876 A1 US2002173876 A1 US 2002173876A1
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United States
Prior art keywords
inq
feature
read
value
mode
Prior art date
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Abandoned
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US10/017,501
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English (en)
Inventor
Lance Fisher
John Gaida
Todd Liberty
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Cyberoptics Corp
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US10/017,501 priority Critical patent/US20020173876A1/en
Assigned to CYBEROPTICS CORPORATION reassignment CYBEROPTICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FISHER, LANCE K., GAIDA, JOHN D., LIBERTY, TODD D.
Publication of US20020173876A1 publication Critical patent/US20020173876A1/en
Priority to US10/745,860 priority patent/US6954681B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the electronics assembly industry uses machines such as pick and place machines to automatically pick components from component feeders and place the components upon circuit boards during board assembly. Subsequently, the components themselves are permanently attached to the circuit board at locations where the pick and place machine has deposited them. Due the relatively high speed required for such operations as well as the extremely small-scale of the components themselves, component placement and alignment are extremely important. In order to facilitate advances in component placement and alignment, optical systems and associated processors have advanced accordingly.
  • One common element of a pick and place system is known as the board align image acquisition device.
  • this image acquisition device resides upon a placement head and is used to essentially image a reference position (also known as a fiducial) on the board.
  • the position of the component to be placed on the placement head is calculated in a similar manner but with a generally upward-looking component align (CA) image acquisition device.
  • the component align image acquisition device generally acquires an image of the component to be placed after it has been picked up by the placement head.
  • the host processor determines the position of the component on the placement head and knowing the position of the placement head with respect to the board, so manipulates the component to be placed that it is oriented correctly and placed properly upon the board.
  • a typical pick and place system includes a pair of image acquisition device (board align and component align).
  • a pick and place system that could accommodate the relatively high data transfer burdens while simultaneously simplifying wiring and reducing costs would be a significant increase in the art. Moreover, if such system could provide data transfer rate head room beyond that which is currently needed and accommodate future scalability, system implementation would be facilitated.
  • An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface.
  • the coupling facilitates advanced monitoring and control of the image acquisition system.
  • Multiple image acquisition devices can be coupled to the controller over the same interface.
  • FIG. 1 is a diagrammatic view of a pick and place machine in which embodiments of the present invention are particularly useful.
  • FIG. 2 is a perspective view of a placement head including a board align image acquisition device in accordance with an embodiment of the present invention.
  • FIG. 3 is a diagrammatic view of a portion of a pick and place machine in accordance with an embodiment of the present invention.
  • FIG. 4 is a system block diagram of an image acquisition system in accordance with an embodiment of the present invention.
  • FIG. 1 is a diagrammatic view of a pick and place machine 100 in accordance with the prior art.
  • Machine 100 includes placement head 102 upon which are mounted component align (CA) image acquisition device 104 , nozzles 106 and board align (BA) image acquisition device 108 .
  • Controller 110 is coupled to devices 104 and 108 as well as encoders operably coupled to placement head 102 which encoders indicate position of placement head 102 along X and Y axes.
  • CA component align
  • BA board align
  • FIG. 2 is a perspective view of placement head 102 .
  • placement head 102 includes a pair of pick and place units 112 each of pick and place units 112 include a nozzle 106 that is adapted to releasably couple a component to be placed such as components 114 .
  • Pick and place units 112 are adapted to displace components 114 along the Z axis to place components 114 upon a circuit board (not shown). While components 114 are releasably held by nozzles 106 , relative motion between the nozzles 106 and the component align image acquisition device 104 is translated beneath components 114 while imaging components 114 with device 104 allows for determination of the relative orientations of components 114 with respect to the nozzles 106 .
  • FIG. 2 also illustrates board align (BA) image acquisition device 108 disposed proximate an edge of placement head 102 and facing downward.
  • Device 108 acquires an image of a reference position marker (fiducial) on the circuit board in order to allow calculation of the placement head 102 position with respect to the circuit board.
  • BA board align
  • FIG. 3 is a diagrammatic view of a portion of a pick and place machine in accordance with an embodiment of the present invention.
  • Host 110 is coupled to X and Y encoders (illustrated diagrammatically at reference numerals 116 and 118 , respectively). Additionally, host 110 is coupled to board align image acquisition device 108 via interface 120 .
  • Device 108 is also physically coupled to robot 122 which is used to actuate nozzle 106 to pick up components 114 and place them upon printed circuit board (PCB) 124 .
  • PCB printed circuit board
  • board 124 includes a reference position mark, or fiducial, 126 .
  • board align image acquisition device 108 acquires an image of fiducial 126 , and/or additional fiducials, and computes a position of placement head 102 with respect to board 124 . While not shown in FIG. 3, a component align image acquisition device is also used to acquire images of the components themselves to calculate component orientation and position such that the components can be accurately placed upon board 124 . Further, board align image acquisition device 108 and component align image acquisition device 104 typically have associated lighting. Thus, a significant amount of data overhead is created wherein image data from device 108 and/or device 104 must be transmitted to host controller 110 .
  • One aspect of embodiments of the present invention is placing one or more of the image acquisition devices (board align, component align, or other suitable devices) upon a bus that accommodates such co-existence without significantly increasing complexity or cost.
  • One example of such a bus is known as the IEEE 1394-based Digital Camera Specification, Version 1.3, dated Jul. 25, 2000 (Specification) which describes the type of information to be sent between a digital camera and a host over an IEEE 1394 bus.
  • “Specification” shall include any specification compatible, either presently or backwardly, with the IEEE 1394-based Digital Camera Specification.
  • the 1394 Specification provides for data transmission speeds at 100, 200, and up to 400 megabits per second. While the Specification listed above does not provide features which facilitate the use in pick and place machines, there is an ability provided in the Specification to add additional features. This is done via advanced control and status registers (CSR). A portion of this patent document will make reference to the Specification.
  • CSR advanced control and status registers
  • the Specification does not set forth an ability to control four or more illumination channels. In additional to the control of illumination, there are currently no characterization registers available to determine the capabilities of each image acquisition device. Another feature that is not provided by the Specification is the ability to set illumination counters to help determine lifetime of the illuminators themselves. Further, there is currently no storage provided by the Specification for mechanical and optical parameters that could be characterized during calibration.
  • FIG. 4 is a diagrammatic view of BA image acquisition device 108 in accordance with an embodiment of the present invention.
  • Device 108 couples to host 110 through port 130 along Specification bus 132 .
  • Bus 132 is coupled to link and physical layer controller 134 .
  • link and physical layer controllers are preferably commercially available devices sold by Texas Instruments under the trade designations TSB42AB4PDT, and TSB41AB1PHP, respectively.
  • Controller 134 is coupled to microcontroller 136 and programmable logic device 138 through bus 140 .
  • bus 140 is a 16-bit 68000 bus.
  • Microcontroller 136 is preferably a microcontroller sold under the trade designation ATmega103L available from Atmel of San Jose, Calif.
  • Microcontroller 136 is also coupled to analog temperature sensor 142 , four-channel digital-to-analog converter 144 and CCD and support chip set 146 .
  • microcontroller 136 is coupled to converter 144 and chip set 146 through a serial peripheral interface bus 148 .
  • CCD and support chip set 146 can acquire and provide an image to microcontroller 136 .
  • illuminators 150 are engaged in response to control signals from microcontroller 136 and/or programmable logic device 138 .
  • Illuminators 150 can include a darkfield illuminator, and/or a brightfield illuminator.
  • One of the primary features of adapting device 108 for operation with Specification bus 132 is that additional image acquisition devices and 1394 bus-compatible devices can be coupled to the same bus. This reduces system wiring and complexity while also facilitating standardization and implementation.
  • Trigger Inquiry Offset Name Field Bit Val Description 530 TRIGGER — Presence — 0 1 Presence (Read INQ Inq of this only) feature (1 . . . 3) 0 Reserved Read/ 4 1 Capability Out_Inq of reading the value of this feature On/Off — 5 1 Capability Inq of switch- ing this feature ON and OFF Polarity — 6 0 Capability Inq of chang- ing the polarity of the trigger input (7 . . .
  • Trigger — 16 1 Presence Mode0 of _Inq Trigger mode 0
  • Trigger — 17 0 Presence Mode1 of _Inq Trigger mode 1
  • Trigger — 18 0 Presence Mode2 of _Inq Trigger mode 2
  • Trigger — 19 1 Presence Mode3 of _Inq Trigger mode 3 (20 . . . 31) 0 Reserved
  • Embodiments of the present invention use an additional CSR to provide registers for illumination control, calibration data and other unique functions. These functions are not part of the standard 1394-based Digital Camera Specification and were implemented using an advanced feature CSR that was created for this custom application.
  • the Base Address of the advanced feature CSR is: Bus_ID,Node_ID,0 ⁇ FFFF FFF0 0000.
  • FFFF MAX value for this feature control 308 Theta — Presence — 0 1 Presence of this (Read) offest — Inq feature Inq [1-3] 0 Reserved Read/Out — 4 1 Capability of Inq reading the value of this feature On/Off_Inq 5 1 Capability of switching this feature ON and OFF Auto_Inq 6 0 Auto mode Manual_Inq 7 1 Manual mode (controlled by the user) [8-15] 0 Reserved MAX_Value [16-31] FFFF MAX value for this feature control 310 Auxillary Presence 0 1 Presence of this _4_Inq _Inq feature 314 Auxillary (1 . . .
  • This status control provides a way to allocate an isochronous channel. After this control is activated, the One Shot command does not have to build-up a channel after the command. this will provide a short and predictable image intake time.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Image Processing (AREA)
  • Image Input (AREA)
US10/017,501 2000-12-15 2001-12-14 Board align image acquisition device with improved interface Abandoned US20020173876A1 (en)

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US10/017,501 US20020173876A1 (en) 2000-12-15 2001-12-14 Board align image acquisition device with improved interface
US10/745,860 US6954681B2 (en) 2000-12-15 2003-12-24 Board align image acquisition device with improved interface

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US25592500P 2000-12-15 2000-12-15
US10/017,501 US20020173876A1 (en) 2000-12-15 2001-12-14 Board align image acquisition device with improved interface

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JP (1) JP2004531048A (de)
DE (1) DE10197041T1 (de)
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EP2134149A1 (de) * 2007-03-30 2009-12-16 Yamaha Motor Co., Ltd. Anbringvorrichtung und anbringverfahren und in der anbringvorrichtung verwendetes substratbildgebungsmitteltransferverfahren

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
US20040254681A1 (en) * 2000-12-15 2004-12-16 Fisher Lance K. Board align image acquisition device with improved interface
US6954681B2 (en) * 2000-12-15 2005-10-11 Cyberoptics Corporation Board align image acquisition device with improved interface
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Also Published As

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DE10197041T1 (de) 2003-12-11
US20040254681A1 (en) 2004-12-16
WO2002049410A3 (en) 2003-01-23
WO2002049410A2 (en) 2002-06-20
JP2004531048A (ja) 2004-10-07
US6954681B2 (en) 2005-10-11

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