TWM629671U - Immersion-cooled heat-dissipation structure - Google Patents

Abstract

An immersion-cooled heat-dissipation structure includes a porous metal heat dissipation material having a porosity that is greater than 8%, an integrated heat spreader, and a thermal interface material. The thermal interface material is located between the porous metal heat dissipation material and the integrated heat spreader to form a thermal connection there-between. A super-wetting layer is formed on a connecting surface between the porous metal heat dissipation material and the thermal interface material, and the water wetting angle of the super-wetting layer is less than 10°, or a super-hydrophobic layer is formed on a connecting surface between the porous metal heat dissipation material and the thermal interface material, and the water wetting angle of the super-hydrophobic layer is greater than 120°.

Description

Immersion cooling structure

The new model relates to a heat dissipation structure, in particular to a submerged heat dissipation structure.

Immersion cooling technology is to directly immerse heating elements (such as servers, disk arrays, etc.) in a non-conductive cooling liquid, so as to take away the heat energy generated by the operation of the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the creator of this new model has been engaged in the development and design of related products for many years, and feels that the above deficiencies can be improved. He has devoted himself to research and cooperated with the application of academic principles, and finally proposed a new model with a reasonable design and effectively improving the above deficiencies. .

The technical problem to be solved by the present invention is to provide an immersed heat dissipation structure in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, the present invention provides an immersed heat dissipation structure, comprising: a porous metal heat dissipation material, the porosity of which is greater than 8%, an integrated heat sink, and a thermal interface material; wherein, the thermal interface material is located in the porous metal heat dissipation material. A thermal connection is formed between the metal heat dissipation material and the integrated heat sink, and a super-wetting layer is formed on the connecting surface of the porous metal heat-dissipating material and the thermal interface material. Wet angle <10°.

In a preferred embodiment, the porous metal heat dissipation material is a porous copper heat dissipation material formed by sintering copper powder.

In a preferred embodiment, the thermal interface material is a hydrophilic thermally conductive adhesive.

In a preferred embodiment, the super-wetting layer is a thin film layer with a thickness <10um.

In order to solve the above technical problems, the present invention further provides an immersion heat dissipation structure, comprising: a porous metal heat dissipation material with a porosity of >8%, an integrated heat sink, and a thermal interface material; wherein, the thermal interface material is located in the A thermal connection is formed between the porous metal heat dissipation material and the integrated heat sink, and a superhydrophobic layer is formed on the connecting surface of the porous metal heat dissipation material and the thermal interface material, and the superhydrophobic layer is wettable to water. Angle > 120°.

In a preferred embodiment, the porous metal heat dissipation material is a porous copper heat dissipation material formed by sintering copper powder.

In a preferred embodiment, the thermal interface material is a non-hydrophilic thermally conductive adhesive.

In a preferred embodiment, the superhydrophobic layer is a thin film layer with a thickness of <10um.

The beneficial effect of the present invention is at least as follows: the immersion heat dissipation structure provided by the present invention can pass through "porous metal heat dissipation material, the porosity of which is greater than 8%", "the thermal interface material is located between the porous metal heat dissipation material and the A super-wetting layer is formed on the connecting surface of the porous metal heat-dissipating material and the thermal interface material, and the wetting angle of the super-wetting layer to water is <10° ", or "a super-hydrophobic layer is formed on the connecting surface of the porous metal heat-dissipating material and the thermal interface material, and the wetting angle of the super-hydrophobic layer to water is >120°", which makes the The amount of bubbles generated in the area of the porous metal heat dissipation material of the immersion heat dissipation structure can be effectively increased, and the thermal interface material can increase the connectivity with the porous metal heat dissipation material through the super-wetting layer or the super-hydrophobic layer, thereby further improving the heat transfer efficiency.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the related embodiments disclosed by the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Please refer to FIG. 1 , which is a first embodiment of the present invention, which provides an immersion heat dissipation structure. As shown in FIG. 1 , the immersion heat dissipation structure provided according to the novel embodiment can basically be a porous metal heat dissipation material 10 , a thermal interface material (TIM) 20 , and an integrated heat dissipation material in sequence from top to bottom. Integrated Heat Spreader (IHS) 30.

The porous metal heat-dissipating material 10 of this embodiment may be a porous copper heat-dissipating material formed by sintering copper powder, and may be immersed in a two-phase cooling liquid (such as an electronic fluoride liquid), so that the two-phase cooling liquid is vaporized in the endothermic process. The number of bubbles formed can be greatly increased, thereby greatly enhancing the heat dissipation effect. Further, the porosity of the porous metal heat dissipation material 10 in this embodiment is >8%, so that the number of bubbles formed by the two-phase cooling liquid during the endothermic gasification can indeed be greatly increased.

The integrated heat sink 30 of this embodiment can be used to contact the heating element, and the thermal interface material 20 of this embodiment is located between the porous metal heat sink 10 and the integrated heat sink 30 , and is used to lift the integrated heat sink 30 and the porous metal heat sink 10 The thermal connection between them further improves the heat transfer efficiency from the integrated heat sink 30 to the porous metal heat sink 10 .

In this embodiment, the thermal interface material 20 is a thermally conductive adhesive, which is a hydrophilic thermally conductive adhesive, such as a thermally conductive adhesive based on a hydrophilic epoxy resin. Therefore, in order to increase the thermal connection between the integrated heat sink 30 and the porous metal heat-dissipating material 10, a super-wetting layer 15 is formed on the connecting surface of the porous metal heat-dissipating material 10 and the thermal interface material 20 in this embodiment, which can be through The surface wettability of the material can be changed by the material itself or the surface microstructure, and the wetting angle θ 1 <10° of the super-wetting layer 15 in this embodiment to water (such as shown in FIG. 2 ) makes this embodiment The hydrophilic thermal interface material 20 in the example can increase the connectivity with the porous metal heat dissipation material 10 through the ultra-high wettability super-wetting layer 15, thereby further improving the heat transfer efficiency.

Further, in order to allow the hydrophilic thermal interface material 20 to pass through the ultra-high wettability super-wetting layer 15 to more effectively increase the connectivity with the porous metal heat-dissipating material 10 and improve the heat transfer efficiency, the super-wetting of the present embodiment The wet layer 15 is a thin film layer with a thickness <10um.

[Second Embodiment]

Please refer to FIG. 3 , which is a second embodiment of the new type. The immersion heat dissipation structure of this embodiment is substantially the same as that of the first embodiment, and the differences are explained as follows.

In this embodiment, the thermal interface material 20 is a thermally conductive adhesive, which is a non-hydrophilic thermally conductive adhesive, such as a thermally conductive adhesive based on non-hydrophilic silicone oil. Therefore, in order to increase the thermal connection between the integrated heat sink 30 and the porous metal heat dissipation material 10, a superhydrophobic layer 17 is formed on the connecting surface of the porous metal heat dissipation material 10 and the thermal interface material 20 in this embodiment, which may be a permeable material. itself or the surface microstructure to change the surface hydrophobicity of the material, and the superhydrophobic layer 17 of this embodiment has a wetting angle θ 2 >120° to water (such as shown in FIG. 4 ), so that the The non-hydrophilic thermal interface material 20 can increase the connectivity with the porous metal heat dissipation material 10 through the super-hydrophobic super-hydrophobic layer 17 , thereby further improving the heat transfer efficiency.

Furthermore, in order to allow the non-hydrophilic thermal interface material 20 to pass through the super-hydrophobic super-hydrophobic layer 17 to more effectively increase the connectivity with the porous metal heat-dissipating material 10 and improve the heat transfer efficiency, the super-hydrophobic layer of the present embodiment 17 is a thin film layer with a thickness <10um.

Based on the above, the immersion heat dissipation structure provided by the new embodiment can pass through "the porous metal heat dissipation material 10, the porosity of which is greater than 8%", "the thermal interface material 20 is located between the porous metal heat dissipation material 10 and the porous metal heat dissipation material 10." A super-wetting layer 15 is formed on the connecting surface of the porous metal heat-dissipating material 10 and the thermal interface material 20, and the super-wetting layer 15 is resistant to water The wetting angle is <10°”, or “a super-hydrophobic layer 17 is formed on the connecting surface of the porous metal heat dissipation material 10 and the thermal interface material 20, and the wetting angle of the super-hydrophobic layer 17 to water is greater than 120° °” technical solution, so that the amount of bubbles generated in the area of the porous metal heat dissipation material 10 of the immersion heat dissipation structure provided by the new embodiment can be effectively increased, and the thermal interface material 20 can be increased through the super-wetting layer 15 or the super-hydrophobic layer 17. The connection with the porous metal heat dissipation material 10 further improves the heat transfer efficiency.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Porous metal heat sink 15: Super wetting layer 17: Super hydrophobic layer 20: Thermal interface material 30: Integrated heat sink θ 1: Wetting angle θ 2: Wetting angle

FIG. 1 is a schematic side view of the immersion heat dissipation structure according to the first embodiment of the novel.

FIG. 2 is a schematic diagram of the wetting angle measurement of the super-wetting layer of the first embodiment of the novel.

FIG. 3 is a schematic side view of the immersion heat dissipation structure according to the second embodiment of the novel.

FIG. 4 is a schematic diagram of the wetting angle measurement of the superhydrophobic layer of the second embodiment of the novel.

10: Porous metal heat sink

15: Super wetting layer

20: Thermal interface material

30: Integrated radiator

Claims (8)

An immersed heat dissipation structure, comprising: a porous metal heat dissipation material with a porosity of >8%, an integrated heat sink, and a thermal interface material; wherein the thermal interface material is located between the porous metal heat dissipation material and the integrated heat sink A super-wetting layer is formed on the connecting surface of the porous metal heat dissipation material and the thermal interface material, and the wetting angle of the super-wetting layer to water is less than 10°. The immersion heat dissipation structure of claim 1, wherein the porous metal heat dissipation material is a porous copper heat dissipation material formed by sintering copper powder. The immersion heat dissipation structure according to claim 1, wherein the thermal interface material is a hydrophilic thermally conductive adhesive. The immersion heat dissipation structure according to claim 1, wherein the super-wetting layer is a thin film layer with a thickness <10um. An immersed heat dissipation structure, comprising: a porous metal heat dissipation material with a porosity of >8%, an integrated heat sink, and a thermal interface material; wherein the thermal interface material is located between the porous metal heat dissipation material and the integrated heat sink A super-hydrophobic layer is formed on the connecting surface of the porous metal heat dissipation material and the thermal interface material, and the wetting angle of the super-hydrophobic layer to water is >120°. The immersion heat dissipation structure of claim 5, wherein the porous metal heat dissipation material is a porous copper heat dissipation material formed by sintering copper powder. The immersion heat dissipation structure of claim 5, wherein the thermal interface material is a non-hydrophilic thermally conductive adhesive. The immersion heat dissipation structure according to claim 5, wherein the super-hydrophobic layer is a thin film layer with a thickness <10um.

Images