TWM621387U - Server system - Google Patents

Abstract

An Server system, comprising a deck; a top cover disposed over the deck; a pair of side walls, a pair of side doors, and a front panel disposed between the deck and the top cover, wherein the pair of side doors being arranged perpendicular to the front panel, each of the pair of side doors being arranged at substantially straight angle with one of the pair of side walls, the Server system having a rear section defined by an area between the pair of side walls and a front section defined by an area between the pair of side doors; a pair of component housings arranged in the front section, wherein each of the component housing having a front end facing one of the side doors and a back end facing another one of the side doors; and a pair of circuit boards respectively arranged to cover the back ends of the component housings, wherein each of the circuit boards are perforated to form a plurality of slits, a central corridor is defined by a distance between the pair of circuit boards, the plurality of slits are configured to allow air exhausted from the front end of the component housing to flow towards the central corridor; the slits are arranged to expose back ends of the storage component.

Description

server system

The present disclosure generally relates to server systems and modules and components therein. More particularly, the present disclosure relates to novel cooling arrangements for server systems that allow for better cooling of side-entry storage drives in server systems.

In conventional arrangements, the server system is usually mounted like a drawer from the front of the server system rack, so it is intuitive to place most of the server system's storage drives in a location close to the user for easy access. In other words, storage drives (eg, hard disk drives) are typically placed at the front of a server system, so storage drives are typically inserted or unplugged from the front or top of the server system. However, due to industry-specified widths and heights, the number of storage drives inserted from the front of the server system is naturally limited by the size of the front area; while storage drives inserted from the top of the server system require the user to insert from the top of the server system It is inconvenient to insert or unplug. On the other hand, insertion from the side of the server system (eg, the flank of the server system body) increases the number of storage drives while making each storage drive easy to access. However, more storage drives means more heat is generated within the server system. Additionally, having more storage drives at industry-specified widths and heights also means less available cooling space. As a result, side-entry storage drives often have heat dissipation issues, which are not ideal for server systems.

The present disclosure provides new arrangements of side-entry servo systems incorporating enhanced thermal management capabilities.

An aspect of the present disclosure provides a server system, comprising a pair of component housings, wherein each of the component housings has a front end and a rear end opposite to the front end; a pair of circuit boards respectively cover the rear ends of the component housings and a deck disposed under said pair of module housings, wherein a distance defined between said pair of circuit boards at said decks forms a central gallery, wherein said front end of said module housings and a periphery of said decks The distance forms the outer corridor.

100: Server System

11: Deck

111: Deck Through Holes

112: surface bulge

12: upper cover

121: upper cover of storage area

1211: Upper cover through hole

122: Fan area upper cover

123: Mainboard area upper cover

13: Front panel

131: Outer frame

132: inner frame

133: Air intake

133a: Main air intake

133b: Secondary air intake

134: Air outlet

14: Rear panel

15: Sidewall

16: Side Door

16U: Upper door

16L: Lower door

161: Airtight

162: Door hinge

163: Ladder Structure

17: Component housing

171: Storage Box

1711: Straight partitions

1712: Lateral Track

172: Drive bracket

1721: Support air hole

18: circuit board

181: Hole

1811: Main Hole

1812: Secondary Holes

19: Fan module

191: Fan Frame

1911: Recess

1912: Acceptance Structure

192: Fan unit

20: Fan bracket

201: Bootstrap Structure

21: Motherboard insulation parts

22: Power Module

23: User Interface Modules

24: Stress distribution components

241: Skeleton

242: Dividers

243: Opening

25: Spine

251: Web

252: Wings

26: olive line

27: Supports

500: Server Rack

600: Rack Rails

D: storage drive

FC: Peripheral Corridor

SC: Central Corridor

CS: Gather Space

P: channel

CC: Cable Channel

601: Outer rail

602: Inner rail

603a, 603b, 603c, 603d: Support frame

For a detailed understanding of the above-described features of the present case, a more specific description of the present case, briefly described above, may be provided with reference to embodiments, some of which are illustrated in the accompanying drawings. It is to be noted, however, that the appended drawings illustrate only typical implementations of this case and are therefore not to be considered limiting of its scope, as this case may admit other equivalent implementations.

1 is a perspective view of a rack-mounted server system according to one embodiment of the present disclosure.

2 is an exploded view of a rackless server system according to one embodiment of the present disclosure.

3 is a perspective view of a server system according to one embodiment of the present disclosure.

FIG. 4 is a plan view of FIG. 3 .

FIG. 5 is a simplified schematic diagram of the partial (PL dashed area) layout of FIG. 4 .

6 is an exploded view of a front panel according to one embodiment of the present disclosure.

7 is another perspective view of a server system according to one embodiment of the present disclosure.

8 is another exploded view of a server system according to one embodiment of the present disclosure.

9 is a side view of a server system according to one embodiment of the present disclosure.

10 is a front view of a component housing according to one embodiment of the present disclosure.

FIG. 10-1 is a cross-sectional view taken along line A-A of FIG. 10 .

11 is a schematic front view of a storage case according to one embodiment of the present disclosure.

12 is a front view of a storage case and circuit board according to one embodiment of the present disclosure.

FIG. 13 is an enlarged view of a part (PE dotted line area) of FIG. 8 .

14 is a front view of a front panel according to one embodiment of the present disclosure.

FIG. 15 is a simplified schematic diagram of section B-B as shown in FIG. 14 .

16 is another perspective view of a server system according to one embodiment of the present disclosure.

FIG. 17 is an enlarged view of a part (PE dotted line area) of FIG. 16 .

18 is another perspective view of a server system according to one embodiment of the present disclosure.

FIG. 19 is an enlarged view of a part (PE dotted line area) of FIG. 18 .

20 is a front view of a fan module according to one embodiment of the present disclosure.

21 is a bottom view of a fan module according to one embodiment of the present disclosure.

FIG. 22 is a simplified schematic diagram of the C-C section of FIG. 4 .

FIG. 23 is an enlarged view of a part (PE dotted line area) of FIG. 9 .

24 is a cooling test result of a server system according to one embodiment of the present disclosure.

25 is another perspective view of a server system according to one embodiment of the present disclosure.

26A-26E are perspective views of bone structures according to one embodiment of the present disclosure.

27A-27B are perspective views of side door structures according to one embodiment of the present disclosure.

28 is a perspective view of an assembly housing according to one embodiment of the present disclosure.

29 is a cross-sectional view of a side door structure according to one embodiment of the present disclosure.

30A-30J are perspective views of a rack-mounted server system according to one embodiment of the present disclosure.

It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.

It should be noted that these drawings are intended to illustrate the general characteristics of the methods, structures and/or materials used in certain example embodiments and to supplement the written description provided below. These drawings, however, are not to scale and may not accurately reflect the precise structural or performance characteristics of any given embodiment, and should not be construed to define or limit the range of values or characteristics encompassed by example embodiments . For example, the relative thicknesses and positions of layers, regions and/or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numbers throughout the various figures is intended to indicate the presence of similar or identical elements or features.

The following description will refer to the accompanying drawings to more fully describe the present disclosure. Exemplary embodiments of the present disclosure are shown in the accompanying drawings. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Like reference numbers refer to the same or similar elements.

The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the present disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. Furthermore, when used herein, "include" and/or "include" or "include" and/or "include" or "have" and/or "have", integers, steps, operations, elements and/or components , but does not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Furthermore, unless explicitly defined in context, terms such as those defined in general dictionaries are to be said and construed as having meanings consistent with their meanings in the related art and this disclosure, and are not to be construed as idealized or overly formal meaning.

FIG. 1 shows a server system 100 mounted to a server rack 500 according to one embodiment of the present disclosure; FIG. 2 shows an exploded view of the server system 100 without the server rack 500; FIG. 3 shows The arrangement in the server system 100 is shown. 2 and 3, the server system 100 includes a deck 11, an upper cover 12, a front panel 13, a rear panel 14 parallel to the front panel 13, a pair of side walls 15 parallel to each other, two doors 16 parallel to each other, two component housings 17 (eg, a storage module), two circuit boards 18 , a fan module 19 , a pair of fan brackets 20 , motherboard insulators 21 , a motherboard (not shown), and a power module 22 . The pair of side walls 15 are arranged perpendicular to the back plate 14 and the stress distribution member 24 . Further, the pair of side walls 15 are arranged perpendicular to the front panel 13 . In some embodiments, the server system 100 also includes two side doors 16 that are parallel to each other. The pair of side doors 16 are arranged perpendicular to the front panel 13 and the stress distribution member 24 . Furthermore, the pair of side doors 16 are arranged perpendicular to the rear panel 14 . Each side door of the pair of side doors 16 is arranged in alignment with the corresponding side wall 15 . In one embodiment, deck 11 is a rectangular plate with two long sides and two short sides. The front panel 13 and the rear panel 14 are respectively arranged on one of the short sides of the deck 11 . A pair of side walls 15 and two doors 16 are arranged at the long sides of the deck 11 , and each long side of the deck 11 has one side wall 15 near the rear panel 14 and one door 16 near the front panel 13 . In some embodiments, the side door 16 is mechanically attached to the server system 100 . In some embodiments, the portion of the housing that forms the mechanical attachment acts as the door frame jamb of the side door 16 . In the exemplary embodiment, the side door is hinged to the upper cover 12 and is configured to be angled away from the server system 100 . Each side wall 15 and the door 16 on the same side of the deck 11 are aligned with each other. The side wall 15 and the side door 16 are arranged between the upper cover 12 and the deck 11 . The component casing 17 , the circuit board 18 , the fan module 19 , the main board insulation 21 , the main board and the power module 22 are arranged on the deck 11 . The assembly housing 17 contains a housing frame structure 171 (storage case) and a plurality of device bases 172 (drive brackets). The device base 172 is configured to carry a plurality of electronic devices D (eg, storage drives, storage components), and the electronic devices D can be inserted horizontally with the device base 172 into the receiving frame structure 171 from the front of the component housing 17 . In one embodiment, the device base 172 can be integrated into the accommodating frame structure 171 , so the accommodating frame structure 171 can directly accommodate the electronic device D. As shown in FIG. Accordingly, the equipment bases 172 may also be arranged in a stacked array. In some embodiments, the assembly housing 17 has top and bottom surfaces secured to the upper cover 12 and deck 11, respectively. In some other embodiments, the assembly housing 17 has a front end and a rear end opposite the front end. In some other embodiments, the assembly housing 17 has a front end and a rear end opposite the front end. In some embodiments, the assembly housing 17 includes a body, wherein an opening between the front and rear ends of the body allows access between the front and rear ends of the assembly housing 17 . The module housings 17 are arranged between the two doors 16 in a back-to-back manner, and each module housing 17 faces one of the doors 16 . In other words, the module housing 17 faces the long sides of the deck 11 . The module housing 17 is at a distance from the periphery of the long side of the corresponding deck 11 . Since the assembly housing 17 faces the door 16, the device base 172 and the electronic device D cannot be removed from the receiving frame structure 171 when the door 16 is closed. In some embodiments, the front end of the assembly housing 17 is a distance from the side door 16 .

In some embodiments, the pair of circuit boards 18 are disposed between the pair of component housings 17 . The pair of circuit boards 18 are spaced apart from each other. Each circuit board 18 is arranged vertically with respect to the deck 11 on the back of one of the component housings 17 , so that the circuit board 18 stands behind each of the two component housings 17 . In some embodiments, the circuit board covers the rear end of the component housing 17 by having the surface of the circuit board 18 (eg, the surface of the circuit board with the largest surface area) projected within the rear perimeter of the component housing 17 . In some embodiments, the circuit board 18 may be arranged to extend from the rear periphery of the component housing 17 . In an exemplary embodiment, the flat surface of the circuit board 18 may be provided at the opening at the rear end of the main body of the component housing 17 . In some embodiments, each circuit board 18 may be arranged at an angle to the deck 11 . In the exemplary embodiment, circuit board 18 is arranged substantially perpendicular to deck 11 . Additionally, the circuit board 18 may abut the rear end of the component housing 17 . In some embodiments, circuit board 18 is mechanically secured to the rear end of component housing 17 . Therefore, the circuit board 18 can be electrically connected to the electronic device D in the component housing 17 without the need for a cable between the two. Thus, in some embodiments, the storage drive D and the circuit board are coupled to each other using a board-to-board connector. In one embodiment, circuit board 18 is a printed circuit board configured to couple electronic device D to a motherboard.

The fan module 19 is disposed between the side walls 15 and is configured to cool the assembly housing 17 and the circuit board 18 . Pairs of fan brackets 20 are respectively arranged near different side walls 15 , and the fan module 19 can be mounted to the server system 100 by being coupled with the fan brackets 20 . In this way, the fan modules 19 are placed across the deck 11 from side to side in the server system 100 . The motherboard is disposed on the motherboard insulator 21 between the fan module 19 and the rear panel 14 , and the motherboard is electrically coupled to the circuit board 18 , the fan module 19 and the power module 22 . The power module 22 is arranged between the side walls 15 and closer to the rear panel 14 than the fan module 19 is. The back of the power module 22 is aligned with the rear panel 14 , so the rear panel 14 itself does not cover the back of the power module 22 . Therefore, the power module 22 can be independently removed from the server system 100 . The upper cover 12 is disposed above the component casing 17 , the circuit board 18 , the fan module 19 , the main board and the power module 22 on the deck 11 . Therefore, the deck 11 , the upper cover 12 , the front panel 13 , the rear panel 14 , the side walls 15 , the door 16 and the power module 22 together form an enclosure 17 that can accommodate the components, the circuit board 18 , the fan module 19 , the fan bracket 20 , the mainboard Space for insulation 21 and motherboard.

In one embodiment of the present disclosure, the upper cover 12 includes a cover covering the component housing 17 and the electrical The storage area upper cover 121 above the circuit board 18 , the fan area upper cover 122 covering the fan module 19 , and the motherboard area upper cover 123 covering the motherboard area. Therefore, by removing the corresponding portion of the upper cover 12 , the component housing 17 together with the circuit board 18 , the fan module 19 and the motherboard can be individually accessed from the top of the server system 100 for maintenance.

FIG. 4 is a top view of FIG. 3 , and FIG. 5 is a simplified schematic diagram of the partial (PL dashed area) layout of FIG. 4 , according to one embodiment of the present disclosure. 4 and 5, the cooling arrangement of the server system 100 (eg, for the component housing 17 and its circuit board 18) according to an embodiment of the present disclosure will be described below.

To cool the server system 100 , the fan module 19 is configured to draw air into the server system 100 at the front panel 13 and blow air out of the server system 100 at the rear panel 14 . In server system 100 , air driven by fan module 19 flows through and cools component housing 17 and circuit board 18 . More specifically, as shown in FIG. 5 , the air flows into the collection space CS in the front panel 13 . The air passes through the plurality of air inlets 133 of the front panel 13, and then the air leaves the front panel 13 through the plurality of air outlets 134 at the sides of the collection space CS. Then, the air flows into the two peripheral corridors FC (first corridors) that communicate between the front panel 13 and the module housing 17 . In some embodiments, the peripheral corridor FC is defined by the lateral spacing between the front end of the assembly housing 17 , one of the side doors 16 , and a portion of the stress distribution member 24 . The peripheral corridor is further defined by the vertical separation between the deck 11 and the upper cover 12 . In other words, the flow path is defined by an enclosed space formed using the front end of the assembly housing 17 , the side door 16 , a portion of the stress distribution member 24 , the deck 11 and the upper cover 12 . As shown in FIG. 5 , a portion of the stress distribution member 24 arranged between the side door 16 and the module housing 17 forms a seal for the outer corridor FC. Furthermore, the stress distribution members 24 form a barrier between the front and rear of the deck 11 . The front is further defined by the space between a pair of side doors 16 . The rear is further defined by the space between a pair of side walls 15 . A pair of peripheral corridors FC refers to the space located inside the door 16 and in front of the module housing 17 . As shown in FIG. 5 , each peripheral corridor FC is therefore defined between one of the doors 16 and the assembly housing 17 facing that side door 16 . The server system 100 also includes a stress distribution member 24 (eg, a first support) disposed at the end of the peripheral corridor FC on the side of the component housing 17 closer to the rear panel 14, the stress distribution member 24 serving as an air barrier is configured as Stop the air in the outer corridor FC from It flows to the fan module 19 without passing through the component casing 17 and the circuit board 18 . In some embodiments, air flowing through peripheral corridor FC is exhausted by fan module 19 , enters component housing 17 through the front end, and exits component housing 17 through a plurality of holes 181 in circuit board 18 . The stress distribution members 24 span the entire width of the deck 11 . In some embodiments, the stress distribution members 24 are secured to the deck 11 and the upper cover 12 . The stress distribution member 24 and the assembly housing 17 are arranged adjacent to each other. In one embodiment, the server system 100 may include other types of air barriers disposed at the ends of the two peripheral corridors FC in place of or in addition to the stress distribution members 24, eg, hermetic seals agent, airtight foam, airtight tape, etc. As a result, air flows into the two peripheral corridors FC through the plurality of bracket air holes 1721 of the module housing 17 , and then the air exits the module housing 17 from the plurality of holes 181 on the circuit board 18 . In this way, the air enters the central corridor SC (second corridor), which is the space defined between the two circuit boards 18 . As the fan module 19 continues to draw air, air from the central gallery is driven through the opening 243 of the stress distribution member 24 between the central gallery and the fan module 19 . The openings 243 may be perforations formed in the stress distribution member 24 aligned with the central corridor SC. Finally, the air passes through the fan module 19 and exits the server system 100 from the rear panel 14 . The two peripheral corridors FC are parallel to the central corridor, while the collection space CS is perpendicular to the central corridor. It should be noted that the collection space CS in the front panel 13 should not communicate directly with the central corridor between the module housings 17 .

26A-26E are perspective views of bone structures according to one embodiment of the present disclosure. In some embodiments, the server system 100 is divided into a front and a rear. The bony structure of the server system 100 is configured to provide structural support for the server system 100 when subjected to loading forces. In some embodiments, the bony structure includes a stress distribution member 24 , sidewalls 15 secured to ends of the stress distribution member 24 , and a spine 25 disposed between the deck 11 and the stress distribution member 24 . The spine 25 may be disposed substantially equidistant from the pair of side walls 15 . In some embodiments, the stress distribution member 24 also includes a fixation bracket 246 configured to compress the spine 25 when subjected to a loading force. The fixed bracket 246 forms an arch at the bottom of the stress distribution member 24 .

In addition to being arranged to define the rear and front of the server system 100, the stress distribution members 24 may function as structural beams capable of bearing loads. In some embodiments, the service The server rack is configured to receive multiple server systems 100 . When the user needs to access the server system 100, the user can pull part of the server system 100 away from the server rack. In this way, a portion of the server system 100 is not supported by the rack. In use, the server system 100 may be partially suspended from the server rack, and the front may not be supported. The stress distribution members are configured to form a cantilever of the servo system 100 when a portion (eg, the front) of the servo system 100 is suspended. In some embodiments, the component housing 17 is disposed in the front of the server system 100 . In some embodiments, the component housing 17 is disposed at the front of the server system 100 . In this way, the center of gravity of the server system 100 is located at the front. In some embodiments, the stress distribution member 24 extends beyond the assembly housing 17 . In some embodiments, the end of the stress distribution member 24 extending beyond the front end of the component server system 100 acts as an air barrier in the peripheral corridor FC.

In some embodiments, the spine 25 may form a channel with a web 251 and wings 252 projecting from the sides of the web 251 . In some embodiments, the web 251 traverses the entire length of the anterior portion and extends partially into the posterior portion. Furthermore, the web 251 is fastened to the deck 11 . In some other embodiments, the web 251 may extend partially anteriorly and posteriorly, depending on the material of the spine. In some embodiments, the wings 252 extend in the direction of the upper cover 12 . In some embodiments, the wings 252 are mechanically fastened to the stress distribution member 24 . Furthermore, the ends of the wings form L-shaped bends 253 . In some embodiments, the L-shaped bend may be a pair of planar structures arranged in an L-shaped cross-section. In some embodiments, the angles between the planar structures may be perpendicular to each other. In some other embodiments, the angle between the planar structures may be less than 180 degrees. In the exemplary embodiment, the wings 252 are mechanically fastened to the forward-facing side of the stress distribution member 24 . In particular, a portion of the L-shaped channel 253 disposed parallel to the surface of the stress distribution member 24 is fastened to the stress distribution member 24 using fasteners 254 . Additionally, in some embodiments, the wings 251 are mechanically fastened to the front panel 13 . In the exemplary embodiment, the wings are mechanically fastened to the inner frame 132 of the front panel 13 . In particular, a portion of the L-shaped channel 253 disposed parallel to the inner frame 132 is fastened to the stress distribution member 24 using fasteners 254 .

Referring to the width across the stress distribution member 24 , when a weight load of the storage device is applied to the front of the server system 100 , the spine 25 may apply a load force to the stress distribution member 24 and the sidewalls 15 may each apply a load to the ends of the stress distribution member 24 . Apply support reaction force. Refer to the entire server system 100 The length of the stress distribution member 24 and the spine 25 may form a cantilevered structure when the weight load of the storage device D is applied to the front of the server system 100 . In an exemplary embodiment, when the storage device D is equally divided between a pair of component housings 17, the storage device D may apply a substantially constant load across the length of the spine disposed at the front.

Furthermore, the side wall 15 is arranged at the rear of the server system 100 . The side wall 15 of the server system 100 abuts the end of the stress distribution member. In some embodiments, the side walls 15 , the deck 11 and the upper cover 12 are fastened to the stress distribution member 24 . In this manner, the structural integrity of the server system 100 is supported by the stress distribution members 24 and further by the spine 25 . When a force is applied to any of the side wall 15 , the deck 11 and the upper cover 12 , the stress distribution member 24 may absorb at least a portion of the stress on the server system 100 caused by the applied force.

27A-27E are perspective views of side door structures according to one embodiment of the present disclosure. In a further embodiment, the weather strip 30 is disposed between the side door 16 and the jamb of the side door 16 on the server system 100 . The weather strip 30 is configured to prevent the entry of air from the side door 16 . In some embodiments, the weather strip 30 may act as a barrier to the space between the door frame of the side door 16 and the side door 16 . In the exemplary embodiment, the jamb of the side door 16 is part of the upper cover 12 . The weather strip 30 is provided between the deck 11 and the top cover 12 . A weather strip 30 is provided between the side door 16 and the upper cover 12 , wherein the weather strip 30 is attached to the inner surface of the upper cover 12 . The weather strip 30 is configured to prevent air from entering through the space between the side door and the top cover.

29 is a cross-sectional view of a side door structure according to one embodiment of the present disclosure. In some embodiments, the side door 16 includes a door panel 165 and a sealing wing 164 formed at an angle with the door panel 165 . In some embodiments, the sealing wings 164 are perpendicular to the door panel 65. In some other embodiments, the angle between the sealing wings 164 and the door panel 165 may be greater or less than 90 degrees. When the angle between the sealing wing 164 and the door panel 165 is greater than 90 degrees, the sealing wing 164 may form a barrier to the gap between the door panel 165 and the upper cover 12 .

The door panels 165 are configured to form an angle when moved away from the corresponding side wall 15 . In other words, when the side door 16 is opened and/or removed from the server system 100, the angle between the side wall 15 and the side door 16 increases. The sealing wings 164 are configured to form an angle when moved away from the corresponding upper cover 12 . Change In other words, when the side door 16 is opened or moved away from the server system 100, the angle between the sealing wings 164 and the inner surface of the upper cover 12 increases. In addition, when the side door 16 is opened, the front end of the component housing 17 may be exposed, and the user can access electronic components provided in the component housing 17 .

In some embodiments, the sealing wings 164 form a barrier between the external environment and the peripheral corridor when the side door 16 is closed. Although the sealing wings 164 may not directly contact the top cover 12 or the sealing strip 30 , it may still prevent airflow from the outside environment from entering the perimeter aisle, and may prevent airflow within the perimeter aisle from leaking out of the server system 100 . Furthermore, when the side door 16 is closed, depending on the mechanism used, the side door may be stationary. In other words, the side door 16 may cover the front end of the assembly housing 17 when no force (eg, pulling force) is applied to the side door 16 .

In some embodiments, when the sealing strip 30 is attached to the inner surface of the upper cover 12 and disposed adjacent to the side door 16 , the thickness of the sealing strip 30 is not less than the distance between the upper cover 12 and the sealing wing 164 when the side door 16 is closed. In other embodiments, the sealing wings 164 and the sealing strip 30 may substantially abut each other when the door is closed.

In some other embodiments, the periphery of the upper cover 12 disposed above the side door 16 may be folded. Therefore, the thickness of the sealing strip 30 can further increase the thickness of the upper cover 12, and the thickness is not smaller than the distance between the upper cover 12 and the sealing wing 164 when the side door 16 is closed.

In some other embodiments, the thickness of the weather strip 30 is less than the distance between the inner surface of the top cover 12 and the top row of the device base 172 . In this way, the weather strip 30 does not obstruct the path of the equipment base 172 when the top row of the equipment base 172 is removed from the server system 100 . In some other embodiments, the thickness of the sealing strip 30 is less than the distance between the inner surface of the upper cover 12 and the top row of storage drives D. As shown in FIG. In this way, when the top row of storage drives D is removed from the server system 100, the sealing strip 30 will not obstruct the path of the storage drives D.

In some embodiments, the stress distribution member 24 may include a pair of door stops 245 that protrude from an area of the stress distribution member 24 disposed between the side door 16 and the assembly housing 17 . The door stop 245 is configured to seal the gap between the side door 16 and the side wall 15 .

FIG. 6 shows the front panel 13 disassembled according to one embodiment of the present disclosure. forward The panel 13 includes an outer frame 131 and an inner frame 132 opposite to the outer frame 131 . A plurality of air inlets 133 are formed on the outer frame 131 through perforations. A plurality of air outlets 134 are formed on the inner frame 132 through perforations. The front panel 13 may be mounted to the server system 100 by coupling the inner frame 132 between the side of the assembly housing 17 and the deck 11 . In other words, the module housing 17 abuts against the inner frame. In some other embodiments, the component housing 17 is also arranged to be fastened to the front panel 13 . And the outer frame 131 is coupled to the inner frame 132 to form the collection space CS. In some embodiments, the collection space CS is formed between the outer frame 131 and the inner frame 132 . In some embodiments, the collection space CS is arranged to collect particles from the external environment. However, the use of the collection space CS is not limited to this. A plurality of air intake ports 133 are arranged on the outer frame 131 . In addition, the plurality of air intake ports 133 include a main air intake port 133a arranged at the front of the front panel 13 and a secondary air intake port 133b arranged at the top and/or lower portion. That is, the main air inlet 133 a and the secondary air inlet 133 b are arranged on different faces of the front panel 13 . A plurality of air outlets 134 are arranged on the side of the inner frame 132 of the front panel 13, and thus correspond in position to the two peripheral corridors FC. In some embodiments, the perforations (ie, the plurality of air outlets 134 ) on the inner frame 132 are formed in an area of the inner frame 132 that projects toward the extension of the stress distribution member 24 . Specifically, a plurality of air outlets 134 are formed in an area of the inner frame 132 , that is, an area disposed between the front end of the component housing 17 and the side door. In some embodiments, the perforated area of the outer frame is larger than the perforated area of the inner frame. In contrast, the total area of the plurality of air inlets 133 is larger than the total area of the plurality of air outlets 134 because this compresses the air and increases the flow around the plurality of air outlets 134 .

In one embodiment of the present disclosure, FIG. 7 shows that if the secondary air inlet 133b is arranged at the top of the front panel 13, the storage area upper cover 121 includes an upper cover through hole 1211, and the upper cover through hole 1211 is in position with the secondary inlet The air port 133b corresponds. Therefore, air can be drawn into the collection space CS of the front panel 13 through the upper cover through holes 1211 of the storage area upper cover 121 . In another embodiment of the present disclosure, FIG. 8 shows that if the secondary air intake 133b is arranged at the bottom of the front panel 13, the deck 11 includes a deck through hole 111, and the deck through hole 111 is in position with the secondary air intake Port 133b corresponds. Therefore, air can be drawn into the collection space CS of the front panel 13 through the deck through holes 111 of the deck 11 . Returning to FIG. 7 , in one embodiment of the present disclosure, each door 16 includes a ladder-like structure 163 that divides the door 16 into an upper door 16U and a lower door 16L, and the lower door 16L is recessed into the servo relative to the upper door 16U in system 100. Therefore, as shown in Figure 1 As shown, when the server system 100 is fully seated in the server rack 500, the door 16 is configured to receive the rack rails 600 under the ladder structure 163 so that the total weight of the server system 100 can be kept within the When the rack rails 600 are fixed to the door 16 , they are evenly distributed between the front panel 13 and the rear panel 14 .

9 is a side view of the door 16 of the server system 100 being opened, according to one embodiment of the present disclosure. The server system 100 shown in FIG. 9 is a 2U rack-mounted server unit, and each receiving frame structure 171 of the two component housings 17 is configured to carry twelve equipment bases 172 , thus twelve as shown. an electronic device D. Thus, the server system 100 with two component housings 17 is configured to load twelve electronic devices D on each side, for a total of twenty-four electronic devices D, each weighing approximately 630 grams. In some embodiments, the server system 100 is capable of supporting approximately 15 kilograms of electronic equipment weight inserted into the server system 100 . In particular, the skeleton of the server system 100 allows the server system 100 to support a load of 15 kilograms while being suspended from a server rack. Additionally, in some other embodiments, the skeleton of the server system 100 allows the server system 100 to support loads in excess of 15 kilograms in the front when the server system 100 is suspended from a server rack. Among them, other load sources other than storage devices may be included. In some other embodiments, the server system 100 can support a suspended load greater than 15 kg (ie, a front with a load weight of approximately 21 kg). However, embodiments are not limited thereto. In some embodiments, the load limit of the server system 100 may vary depending on the size and material of the server system 100 . A plurality of bracket air holes 1721 are arranged in the front of the device base 172 in the assembly housing 17 . Since both the air outlet 134 and the bracket air hole 1721 communicate with the peripheral corridor FC, the air sucked by the fan module 19 is allowed to flow into the equipment base 172 from the collection space CS. The length Ld of the door 16 is equal to or greater than the length Ls of the module housing 17, which not only protects the module housing 17 from dust, but also ensures that when the door 16 is closed, the peripheral corridor FC defined in the door 16 communicates with all the trays. The component air holes 1721 are provided so that all of the air from the plurality of air outlets 134 can flow into the component housing 17 . Since the door 16 should be longer than the module housing 17 , the side wall 15 does not overlap the module housing 17 . Although in the present embodiment, the length Ls of the component housing 17 is equal to the length of the accommodating frame structure 171 . In another embodiment where the accommodating frame structure 171 is not provided, the length Ls may represent the total length of the plurality of electronic devices D installed on one side of the server system 100 .

FIG. 10 shows a circuit board 18 behind it, according to one embodiment of the present disclosure. Figure 10-1 is a cross-sectional view of Figure 10 A-A; Figure 11 shows one of the accommodating frame structures 171. As shown in FIG. 10 , the twelve electronic devices D in the housing frame structure 171 are arranged horizontally in three (columns) by four (rows). Note that, in this disclosure, rows are vertical and columns are horizontal. 11 , the accommodating frame structure 171 includes three vertical partitions 1711 and a plurality of transverse rails 1712, and each of the vertical partitions 1711 has a double-layer structure on which a plurality of transverse rails 1712 are integrated. 10-1, when the air drawn from the peripheral corridor FC enters the component housing 17 through the bracket air holes 1721 on the device base 172, the air passes through the channel P around the electronic device D. In one embodiment, the channel P is defined by the space above the electronic device D. When the air flows through the channel P, the air is in direct contact with the electronic device D, thus taking most of the heat away from the top of the electronic device D. After flowing through the channel P, the air leaves the component housing 17 and enters the central gallery via holes 181 in the circuit board 18 located behind the component housing 17 .

28 is a perspective view of an assembly housing according to one embodiment of the present disclosure. The memory module may be formed from the component housing 17 and the circuit board 18 . In some embodiments, the circuit board 18 is perforated to form a plurality of holes 181 . A plurality of holes 181A may be formed on the planar outline of the circuit board 18 . In some embodiments, the plurality of holes 181A are in an array. When the circuit board 18 covers the rear end of the component housing 17, a plurality of holes 181 may be arranged to expose the rear end of the storage components. In some embodiments, the plurality of holes 181B are further formed by the circuit board 18 in conjunction with the component housing 17 . In the exemplary embodiment, a portion of hole 181B is formed by a notch 185 on the periphery of circuit board 18 and a corresponding peripheral side 175 on the rear end of component housing 17 . In an exemplary embodiment, the number of the plurality of holes 181 of the circuit board 18 is the same as the number of storage components that the component housing 17 can carry. Further, a plurality of holes may be formed in the bottom area of the circuit board and the component housing 17 . However, the number of the plurality of holes is not limited thereto. In some embodiments, the number of the plurality of holes may be greater or less than the number of storage components that the component housing 17 can carry, depending on the arrangement of the holes in the circuit board.

In some other embodiments, the assembly housing 17 also includes wings 176 extending from the sides of the assembly housing 17 . In some embodiments, the wings 176 may overlap the front panel 13 and the stress distribution member 24, respectively. Further, the wings 176 may correspond to the top surface of the fastening front panel 13 and the stress distribution structure 24's top surface.

FIG. 12 illustrates FIG. 10 without device base 172 and electronic device D shown, according to one embodiment of the present disclosure. As shown in FIG. 12 , when all the device bases 172 and the electronic device D are removed from the accommodating frame structure 171 of the component housing 17 , the circuit board 18 arranged behind can be seen from the front of the component housing 17 . In other words, the accommodating frame structure 171 is a box whose front is empty and the back is the circuit board 18 . In one embodiment, a circuit board 18 includes a plurality of rows of holes 181 , and the number of rows of the holes 181 corresponds to the number of rows of the electronic device D . In other words, each row of device bases 172 with electronic device D may have a row of holes 181 behind it. Therefore, the air passing through the passage P of the module housing 17 can efficiently flow into the central gallery without being pooled horizontally. In one embodiment of the present disclosure, the hole 181 includes at least a main hole 1811 and a secondary hole 1812 . As shown in FIG. 12 , the main holes 1811 are arranged at the non-edge portion of the circuit board 18 , and the secondary holes 1812 are arranged at the edge portion of the circuit board 18 . In other words, the primary hole 1811 is a hole in the circuit board 18 , and the secondary hole 1811 is a cutout at the edge of the circuit board 18 . In an embodiment of the present disclosure, the circuit board 18 includes at least one secondary hole 1812 at its top edge. In another embodiment, the circuit board 18 includes secondary holes 1812 at both its top and bottom edges. In yet another embodiment, the circuit board 18 also includes a plurality of driver connectors 182 that are configured to couple to the electronic device D. Since the driver connectors 182 are one of the main components that accumulate heat, each driver connector 182 is arranged in the vicinity of any one of the holes 181 to effectively cool them. Although the holes 181 are shown as being long and narrow, it should be understood that the shape of the holes 181 is practically not limited as long as they allow the passage of air from the channel P. For example, each hole 181 may be replaced by a plurality of equivalent circular holes.

13 is an enlarged view of a portion (PE dashed area) of FIG. 8 according to one embodiment of the present disclosure. The stress distribution members 24 are disposed across the base 11 between the side walls 15 in a side-to-side direction of the server system 100 and are configured to increase the structural strength of the deck 11 of the server system 100 . The stress distribution member 24 includes a skeleton 241 and a plurality of spacers 242 . The stress distribution member 24 is perforated to form a plurality of openings 243 . A plurality of openings 243 are defined between the plurality of spacers 242 within the skeleton 241 . In some embodiments, the plurality of openings 243 are aligned with the lateral spacing between the circuit boards. in other words, Areas of stress distribution members aligned with the central gallery are perforated. The plurality of openings 243 not only allow air drawn in by the fan module 19 from the central aisle to pass through the stress distribution member 24, but also allow cables (not shown) coupled to the circuit board 18 to pass through so that the cables can be coupled to the motherboard. The server system 100 also includes a spine 25 disposed between the component housings 17 and perpendicular to the stress distribution member 24 and the front panel 13 . Additionally, the spine 25 includes a web 251 and a plurality of wings 252 . The web 251 disposed between the front panel 13 and the stress distribution member 24 has two ends; one end of the web 251 extends towards the front panel 13 and the other end of the web 251 extends towards the stress distribution member 24 . A plurality of wings 252 extend vertically at both ends of the web 251 and are configured to couple the spine 25 to the stress distribution member 24 and the inner frame 132 , so that the servo system 100 adds the stress distribution member 24 through the spine 25 and the structural strength between the front panel 13. It should be noted that the spine 25 need not be in direct contact with the deck 11 . However, spine 25 may be connected directly to deck 11 and/or component housing 17 to further enhance the structure of server system 100 . In one embodiment of the present disclosure, spine 25 includes two wings 252 at each end. At one end proximate the stress distribution member 24, two wings 252 are each coupled to one of the dividers 242 of the stress distribution member 24, allowing air and cables (not shown) from the circuit board 18 to pass therethrough. At the end near the front panel 13 , cables (not shown) from the UI module 23 pass between the wings 252 . In summary, the cables from both the circuit board 18 and the UI module 23 can be neatly routed between the wings 252 of the second support 25 .

FIG. 14 shows a front view of front panel 13; FIG. 15 is a simplified schematic diagram of section B-B of FIG. 14, according to one embodiment of the present disclosure. The server system 100 also includes a UI module 23 installed in the middle between the outer frame 131 and the inner frame 132 of the front panel 13 to at least partially divide the collection space CS into two equal parts. Furthermore, the UI module 23 is configured to separate the collection space CS from the central corridor.

FIG. 16 shows the server system 100, and FIG. 17 shows an enlarged view of a portion (PE dotted line area) of FIG. 16 . In one embodiment of the present disclosure, in the perimeter corridor FC, the deck 11 also includes a surface bump 112 between the module housing 17 and the door 16 corresponding to this module housing 17 . That is, the surface bump 112 is protruded from the plane of the deck 11 and is provided between the front end of the module housing 17 and the outer periphery of the deck 11 . When the device base 172 and the electronic device D in the bottom row of the component housing 17 are inserted Or when the receiving frame structure 171 is pulled out, the surface bumps 112 are configured to support the device base 172 and the electronics D in the bottom row, thereby preventing the drive bays 172 in the bottom row from rubbing against the base 11 due to the weight of the electronics D. .

As shown in FIG. 8 , in one embodiment of the present disclosure, the fan module 19 includes a fan frame 191 and a plurality of fan units 192 arranged therein. FIG. 18 shows the server system 100 with the fan bracket 20, FIG. 19 shows an enlarged view of the part (PE dotted line area) of FIG. 18; FIG. 20 is a front view of the fan module 19, and FIG. 21 is the fan module 19; FIG. 22 is a simplified schematic view of the CC section of FIG. 4. FIG. In one embodiment of the present disclosure, a pair of fan brackets 20 are affixed to the side walls 15 without being directly connected to the deck 11 . In other words, the pair of fan brackets 20 are floating relative to the deck 11 . Each fan bracket 20 includes a guide structure 201 configured to couple to the fan module 19 . As shown in FIG. 20 , the fan frame 191 of the fan module 19 includes two inner recesses 1911 arranged on both sides of the fan frame 191 respectively, and each inner recess 1911 looks like a gap at each lower corner. In FIG. 21 , the fan frame 191 also includes two receiving structures 1912 integrated into the inner recess 1911 , the receiving structures 1912 being configured to receive the guiding structures 201 of the fan bracket 20 . As shown in FIG. 19, the guide structure 201 may be an upward protrusion standing vertically relative to the deck 11; as shown in FIG. Therefore, the fan frame 191 of the fan module 19 can be guided for mounting to the server system 100 by the alignment between the receiving structure 1912 and the corresponding guide structure 201 . It should be noted that the inner recess 1911 of the fan frame 191 is not only configured to guide the installation of the fan bracket 20 through the receiving structure 1912 formed thereon, but also to allow the cables 26 from the circuit board 18 and UI module 23 to be routed from the fan. The corners between the module 19 , the side walls 15 and the deck 11 bypass the fan module 19 . As shown in FIG. 22 , the cable channel CC defined between the side wall 15 , the deck 11 and the inner recess 1911 of the fan frame 191 is configured to accommodate cables extending from the circuit board 18 and UI module 23 to the rear of the fan module 19 . Cable 26 for the motherboard. Therefore, the bypass of the fan module 19 is realized through the cable channel CC under the inner recess 1911 . In another embodiment, multiple fan units 192 may be mounted to the server system 100 without the fan frame 191 , wherein the multiple fan units 192 are arranged in a door-to-door orientation of the server system 100 .

FIG. 23 is an enlarged view of a part (PE dotted line area) of FIG. 9 . In one embodiment of the present disclosure, the door 16 may include at least one seal 161 . As shown in FIG. 9 , the door 16 includes two seals 161 on its inner surface, and also includes a hinge 162 coupled to the upper cover 12 . In this way, the door 16 can be opened by lifting the end close to the base 11 . However, in another embodiment, the door pivot 162 may also be coupled to the base 11 so that it can be opened by lowering the end of the door 16 close to the upper cover 12 . When the door 16 is closed, one seal 161 is disposed on the proximal side of the door 16 relative to the base 11 , and the other seal 161 is disposed on the proximal side of the door 16 relative to the upper cover 12 . In other words, one seal 161 is installed near the door pivot 162 while the other seal 161 is installed away from the door pivot 162 .

In one embodiment of the present disclosure, the size of the plurality of electronic devices D is 3.5 inches. 3.5-inch storage drives generally outperform 2.5-inch storage drives in cache size, RPM (revolutions per minute), maximum storage capacity, data transfer speed, and price. However, 3.5-inch storage drives have higher power consumption and therefore higher operating temperatures than 2.5-inch storage drives. Combined with the high operating temperature and the tightly packed component housing 17 of the 3.5 inch electronics D, cooling of the server system 100 becomes a very serious problem. According to the cooling test results shown in FIG. 24 , the cooling arrangement in FIG. 5 cooled the electronic device D in operation, wherein the maximum temperature difference between the electronic devices D was 2.9 degrees Celsius and the maximum temperature was 45.7 degrees Celsius. The lower maximum temperature difference indicates that the cooling of the electronic device D is uniform and balanced, while the maximum temperature below 50 degrees Celsius can meet general industry standards for safety and stability. It should be noted that the air between the fan module 19 and the front panel 13 in the server system 100 is a laminar flow, and the air between the fan module 19 and the rear panel 14 is a turbulent flow, and the same cooling arrangement can also be used. For the 2.5-inch electronic device D, as long as the physical volume of the accommodating frame structure 171 occupied by the device base 172 and the electronic device D is greater than 70%.

Additionally, a 3.5-inch storage drive weighs about four times as much as a 2.5-inch storage drive. Therefore, as shown in FIG. 3 , carrying twenty-four 3.5-inch electronic devices D on the front FP of the server system 100 puts a lot of pressure on the deck 11 . FIG. 25 illustrates a server system 100 with supports 27, according to one embodiment of the present disclosure. To further enhance the structural strength of deck 11, in addition to stress distribution members 24 and spine 25, supports 27 may be included in the central gallery and Coupled between the stress distribution member 24 and the inner frame 132 . According to one embodiment of the present disclosure, the server system 100 may include at least any one or any combination of the stress distribution member 24 , the spine 25 and the support 27 .

It should be noted that although all exemplary illustrations are based on a 2U rackmount server, any embodiments of the present disclosure may be applied to other rackmount servers of any different size, such as 4U, 6U, and 8U, etc. Rack server.

30A-30J are perspective views of a rack-mounted server system according to one embodiment of the present disclosure. In some embodiments, rack rails 600 (shown in FIG. 1 ) include outer rails 601, inner rails 602 mechanically attached to outer rails 601, and support brackets 603a, 603b, 603c, and 603d mechanically attached to the outer rails 601. on the inner slide rail 602. In some embodiments, the inner slide rail 602 is configured to move mechanically along the outer slide rail 601 . In some embodiments, the support frame 603a (as shown in FIG. 30A ) may be a flat bracket with one end fixed on the inner slide rail 602 and the other end fixed on the server system 100 . In the exemplary embodiment, the support bracket 603a is fastened to the side wall of the server system 100 . The board support may be an L-shaped board support. In some embodiments, the support frame 603b (as shown in FIG. 30E ) may be a triangular support frame with one side fixed on the inner slide rail 602 and the other side fixed on the server system 100 . Further, gussets are fixed on both ends of the support frame 603b. In the exemplary embodiment, the support bracket 603b is fastened to the back panel of the server system 100 . In some embodiments, the support frame 603c (as shown in FIG. 30G ) may be a triangular support frame, one side of which is fixed on the inner slide rail 602 and the other side is fixed on the server system 100 . In the exemplary embodiment, the support bracket 603c is fastened to the back panel of the server system 100 . In addition, the support frame 603c has two gussets. The first gussets are fixed to the ends on both sides. A second gusset is secured between the first gusset and the side of the inner rail 602 secured. In some embodiments, the support frame 603d (as shown in FIG. 301 ) may be a triangular support frame with one side fixed on the inner slide rail 602 and the other side fixed on the server system 100 . Further, gussets are fixed on both ends of the support frame 603d. Also, the support bracket 603d has a flange extending from the side to which the inner rail 602 is fastened. One end of the flange is fixed on the side wall of the server system 100 .

However, the above are only examples of the present invention, and should not limit the scope of the present invention. Effective changes and modifications are still within the scope of this new patent.

100: Server System

16: Side Door

500: Server Rack

600: Rack Rails

Claims (21)

A server system includes: a deck; a pair of component shells are arranged on the deck, wherein each of the component shells has a front end and a rear end relative to the front end; a pair of circuit boards respectively cover the component shells the rear end, wherein the distance defined between the pair of circuit boards at the deck forms a central corridor, wherein the distance between the front end of the assembly housing and the periphery of the deck forms a peripheral corridor; stress a distribution member traverses the entire width of the deck, wherein an end of the stress distribution member extends beyond the front end of the module housing; and a front panel is provided on the deck, wherein the front panel is associated with the stress A front portion is defined between the distribution members, wherein the pair of assembly housings are disposed at the front portion, wherein the pair of assembly housings fasten the front panel and the stress distribution member. The server system of claim 1, wherein each of the circuit board perforations forms a plurality of holes configured to allow air exhausted from the front end of the component housing to flow to the central gallery The plurality of holes are used to expose the rear end of the storage component received by the assembly housing. The server system of claim 1, wherein the pair of circuit boards is substantially perpendicular to the deck. The server system of claim 1, further comprising: a spine disposed between the stress distribution member and the deck and mechanically attached to the deck, wherein the spine is arranged perpendicular to the deck the stress distribution member. The server system of claim 4, wherein the spine secures the front panel and the stress distribution member. The server system of claim 4, wherein the stress distribution member comprises a fixed bracket that forms an arch at the bottom of the stress distribution member, the spine passing through the fixed bracket and the The space formed between the decks. The server system of claim 1, wherein the front panel comprises: an outer frame; and an inner frame opposite to the outer frame; wherein a collection space is formed between the outer frame and the inner frame, wherein the The component housing abuts the inner frame, the outer frame having a perforated area greater than that of the inner frame, wherein the inner frame is perforated in an area extending beyond the front end of the component housing. The server system according to claim 1, further comprising: an upper cover is arranged on the deck; a pair of side walls and a pair of side doors are arranged between the deck and the upper cover, wherein the pair of side walls and the pair of side doors are arranged between the deck and the upper cover. A side door is arranged perpendicular to the stress distribution member, wherein the pair of side walls fasten the end of the stress distribution member. The server system of claim 8, wherein the stress distribution member comprises: A pair of door stops protrude from the area of the stress distribution member and are disposed between the side door and the assembly housing, the door stops being configured to seal the gap between the side door and the side wall. The server system of claim 8, wherein each of the side doors comprises: a door panel configured to be angled away from the server system; and a sealing wing configured to be angled away from the upper cover. The server system of claim 10, further comprising: a sealing strip disposed between the side door and the upper cover, the sealing strip being configured to prevent air from entering through the space between the side door and the upper cover. The server system of claim 11, wherein the thickness of the sealing strip is not less than the distance between the upper cover and the sealing wing when the side door is stationary. The server system of claim 8, wherein each of the component housings has top and bottom surfaces secured to the upper cover and the deck, respectively. The server system of claim 8, wherein each of the component housings is configured to receive electronic devices in a stacked array. The server system of claim 8, wherein regions of the stress distribution member aligned with the central corridor are perforated. The server system of claim 8, wherein the stress distribution member and the set of component housings are arranged adjacent to each other. The servo system of claim 8, wherein the stress distribution member is configured as a cantilever for the servo system when a portion of the servo system is suspended. The server system of claim 8, wherein the center of gravity of the server system is located at the front. The server system of claim 8, wherein the opposing door is mechanically connected to the upper cover and is configured to form an angle when away from the server system. The server system of claim 1, wherein the circuit board abuts the rear end of the component housing. The server system of claim 1, wherein each of the component housings includes a pair of wings extending from sides of the component housing, wherein one of the pair of wings secures an upper surface of the front panel The upper surface of the stress distribution member is fastened with the other of the pair of wings.

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