TWM615481U - Portable electronic device - Google Patents
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- TWM615481U TWM615481U TW110202827U TW110202827U TWM615481U TW M615481 U TWM615481 U TW M615481U TW 110202827 U TW110202827 U TW 110202827U TW 110202827 U TW110202827 U TW 110202827U TW M615481 U TWM615481 U TW M615481U
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Abstract
Description
本新型創作是有關於一種可攜式電子裝置。 This new creation relates to a portable electronic device.
近年來行動通訊技術的高度發展,創造出許多新穎的應用。同時,各種可攜式電子裝置不斷推陳出新,並經過不斷的改良,使得當前可攜式電子裝置中央處理器已具有相當大的運算能力,並且能在具備優異的使用便利性之下,支援多種軟體的操作。然而,一般而言為了使用者攜帶與使用的便利性,可攜式電子裝置如智慧型手機、平板電腦或是穿戴式裝置上,由於風扇體積較大,且運轉時會產生一定的噪音,因此以往較少見到將風扇整合到可攜式電子裝置內的設計。因此,為了維持可攜式裝置中央處理器能夠以較高的功率及效能運作,須對於可攜式裝置提供額外的散熱能力。 In recent years, the rapid development of mobile communication technology has created many novel applications. At the same time, various portable electronic devices are constantly being introduced and improved, so that the central processing unit of the current portable electronic device has considerable computing power, and can support a variety of software with excellent ease of use. Operation. However, generally speaking, for the convenience of users to carry and use, portable electronic devices such as smart phones, tablet computers or wearable devices have large fans and generate certain noise during operation. In the past, the design of integrating the fan into a portable electronic device was rarely seen. Therefore, in order to maintain the portable device's central processing unit to operate with higher power and performance, the portable device must be provided with additional heat dissipation capability.
本新型創作提供一種可攜式電子裝置,其可在有散熱需求時暴露殼體內的散熱元件,以促進散熱效率。 The present invention provides a portable electronic device, which can expose the heat dissipation element in the casing when heat dissipation is required, so as to promote the heat dissipation efficiency.
本新型創作的一種可攜式電子裝置包括殼體、發熱元件、散熱元件、支架以及門蓋結構。殼體具有散熱開口。發熱元件設置於殼體內。散熱元件設置於發熱元件上並與發熱元件熱耦接,其中散熱元件具有對應於散熱開口的暴露部。支架設置於殼體內並框圍暴露部。門蓋結構設置於支架上並對應散熱開口,配置以覆蓋及暴露至少部分的所述暴露部。 A portable electronic device created by the new model includes a housing, a heating element, a heat dissipation element, a bracket and a door cover structure. The housing has a heat dissipation opening. The heating element is arranged in the housing. The heat dissipating element is arranged on the heat generating element and is thermally coupled to the heat generating element, wherein the heat dissipating element has an exposed portion corresponding to the heat dissipating opening. The bracket is arranged in the shell and surrounds the exposed part. The door cover structure is arranged on the bracket and corresponds to the heat dissipation opening, and is configured to cover and expose at least a part of the exposed portion.
基於上述,本新型創作實施例的一種可攜式電子裝置的殼體可具有散熱開口,其用以暴露殼體內的至少部分散熱元件,並且,可攜式電子裝置更包括門蓋結構,其可過支架模組化組裝於可攜式電子裝置內,如此配置,當可攜式電子裝置有較高的散熱需求時,可透過手動或自動的方式開啟門蓋結構,以促進散熱。因此,可攜式電子裝置可具有更好的散熱效率,且模組化的設計也可簡化繁瑣的組裝步驟。 Based on the above, the casing of a portable electronic device according to the creative embodiment of the present invention may have a heat dissipation opening for exposing at least part of the heat dissipation element in the casing, and the portable electronic device further includes a door cover structure, which can It is assembled into a portable electronic device in a modular manner through the bracket. With this configuration, when the portable electronic device has a high heat dissipation requirement, the door structure can be opened manually or automatically to promote heat dissipation. Therefore, the portable electronic device can have better heat dissipation efficiency, and the modular design can also simplify the cumbersome assembly steps.
100:可攜式電子裝置 100: Portable electronic device
110:殼體 110: shell
112:散熱開口 112: heat dissipation opening
114:通氣孔 114: Vent
120:發熱元件 120: heating element
130:散熱元件 130: heat dissipation element
132:暴露部 132: Exposure
134:導熱膏 134: Thermal paste
140:支架 140: bracket
142:框圍部 142: Frame
143:滑槽 143: Chute
144:固定部 144: Fixed part
145:驅動開口 145: drive opening
146:鎖固件 146: lock firmware
147:延伸部 147: Extension
1471:通氣孔 1471: Vent
148:支架開口 148: Bracket opening
149:連接部 149: Connection
150:門蓋結構 150: door cover structure
151:端 151: End
152:樞轉檔板 152: Pivot baffle
152’:升檔板 152’: Upshift board
153:驅動齒條 153: Drive rack
154:樞轉軸 154: pivot axis
1541:齒 1541: tooth
155:傳動滾輪 155: drive roller
156:驅動凸塊 156: drive bump
157:連動桿、帶動桿 157: Linkage rod, drive rod
1571:導流彈性體 1571: diversion elastomer
1572:樞紐 1572: hub
158:彈性復位件 158: Elastic reset piece
159:連動桿、驅動桿 159: Linkage rod, drive rod
160:電路板 160: circuit board
170:馬達 170: Motor
172:導螺桿 172: Lead screw
174:鎖固件 174: lock firmware
176:驅動齒輪 176: drive gear
200:風扇模組 200: Fan module
210:基座 210: Pedestal
212:固定槽 212: fixed slot
214:導流槽 214: diversion groove
216:基座開口 216: Base opening
220:風扇組件 220: fan assembly
222、223:風扇 222, 223: Fan
224:導流蓋板 224: deflector cover
2241、2242:風口 2241, 2242: tuyere
2243:隔板 2243: Partition
2244:驅動部 2244: Drive
AW:導流凹槽 AW: diversion groove
D1:移動方向 D1: Moving direction
S1、S2:腔室 S1, S2: Chamber
圖1是依照本新型創作的一實施例的一種可攜式電子裝置的示意圖。 FIG. 1 is a schematic diagram of a portable electronic device according to an embodiment of the invention.
圖2A及圖2B分別是依照本新型創作的一實施例的一種可攜式電子裝置的局部放大示意圖及局部剖面圖。 2A and 2B are respectively a partial enlarged schematic diagram and a partial cross-sectional view of a portable electronic device according to an embodiment of the present invention.
圖3是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。 3 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention.
圖4是圖3所示的可攜式電子裝置的門蓋結構於開啟位置的示意圖。 4 is a schematic diagram of the door cover structure of the portable electronic device shown in FIG. 3 in an open position.
圖5是依照本新型創作的一實施例的一種可攜式電子裝置的示意圖。 FIG. 5 is a schematic diagram of a portable electronic device according to an embodiment of the invention.
圖6是圖5所示的可攜式電子裝置的風扇模組的示意圖。 FIG. 6 is a schematic diagram of the fan module of the portable electronic device shown in FIG. 5.
圖7是圖5所示的可攜式電子裝置的剖面的示意圖。 FIG. 7 is a schematic diagram of a cross-section of the portable electronic device shown in FIG. 5.
圖8是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。 FIG. 8 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention.
圖9是圖8所示的可攜式電子裝置的門蓋結構於開啟位置的局部剖面示意圖。 FIG. 9 is a partial cross-sectional schematic diagram of the door cover structure of the portable electronic device shown in FIG. 8 in an open position.
圖10是圖8所示的可攜式電子裝置的門蓋結構於開啟位置的示意圖。 FIG. 10 is a schematic diagram of the door cover structure of the portable electronic device shown in FIG. 8 in an open position.
圖11是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。 FIG. 11 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention.
圖12是圖11所示的可攜式電子裝置的門蓋結構於開啟位置的局部剖面示意圖。 12 is a partial cross-sectional schematic diagram of the door cover structure of the portable electronic device shown in FIG. 11 in an open position.
圖13是圖12所示的可攜式電子裝置的風扇模組的隔板的示意圖。 FIG. 13 is a schematic diagram of the partition of the fan module of the portable electronic device shown in FIG. 12.
圖14是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於開啟位置的局部剖面示意圖。 14 is a partial cross-sectional schematic diagram of the door structure of a portable electronic device in an open position according to an embodiment of the invention.
圖15是圖14所示的可攜式電子裝置的上視示意圖。 FIG. 15 is a schematic top view of the portable electronic device shown in FIG. 14.
圖16是依照本新型創作的一實施例的一種可攜式電子裝置 的門蓋結構於閉闔位置的示意圖。 Figure 16 is a portable electronic device according to an embodiment of the invention Schematic diagram of the door cover structure in the closed position.
圖17是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。 FIG. 17 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention.
圖18是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於開啟位置的示意圖。 FIG. 18 is a schematic diagram of the door cover structure of a portable electronic device in an open position according to an embodiment of the invention.
圖19是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。 FIG. 19 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention.
圖20是圖19所示的可攜式電子裝置的門蓋結構於開啟位置的示意圖。 20 is a schematic diagram of the door cover structure of the portable electronic device shown in FIG. 19 in an open position.
圖21是圖19所示的可攜式電子裝置的局部剖面示意圖。 FIG. 21 is a schematic partial cross-sectional view of the portable electronic device shown in FIG. 19.
圖22是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於開啟位置的示意圖。 FIG. 22 is a schematic diagram of a door cover structure of a portable electronic device in an open position according to an embodiment of the invention.
圖23是圖22所示的可攜式電子裝置的局部剖面示意圖。 FIG. 23 is a schematic partial cross-sectional view of the portable electronic device shown in FIG. 22.
圖24是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。 FIG. 24 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention.
圖1是依照本新型創作的一實施例的一種可攜式電子裝置的示意圖。圖2A及圖2B分別是依照本新型創作的一實施例的一種可攜式電子裝置的局部放大示意圖及局部剖面圖。以下將藉由不同圖示詳細說明本新型創作的內容。須注意的是,以下雖均以智慧型手機為例來說明本新型創作的內容,但所屬領域具有通
常知識者應了解,智慧型手機也可替代為其他類型的可攜式電子裝置,例如平板電腦,穿戴式裝置等。請同時參照圖1、圖2A及圖2B,在某些實施例中,可攜式電子裝置100包括殼體110、發熱元件120、散熱元件130、支架140以及門蓋結構150。殼體110可用以定義出一容置空間,並於其表面包括散熱開口112。在本實施例中,散熱開口112可例如位於可攜式電子裝置100的背面。發熱元件120設置於殼體110所定義出的容置空間內。在某些實施例中,發熱元件120例如為可攜式電子裝置100的中央處理器(Central Processing Unit,CPU)或其他類型的發熱元件,並可配置於殼體110內的電路板160上,散熱元件130可包括散熱鰭片組,其可配置於發熱元件120上並與發熱元件120熱耦接。在其他實施例中,散熱元件130也可配置於發熱元件120的周圍並利用熱管連結散熱元件130與發熱元件120,以利用散熱元件130對發熱元件120進行散熱。在某些實施例中,散熱元件130與發熱元件120的接觸面可塗佈導熱膏134以加強熱傳導效率,但本新型創作不以此為限。
FIG. 1 is a schematic diagram of a portable electronic device according to an embodiment of the invention. 2A and 2B are respectively a partial enlarged schematic diagram and a partial cross-sectional view of a portable electronic device according to an embodiment of the present invention. In the following, the content of the new creation will be explained in detail with different illustrations. It should be noted that although the following uses smart phones as examples to illustrate the content of the creation of this new
Those of ordinary knowledge should understand that smart phones can also be replaced by other types of portable electronic devices, such as tablet computers, wearable devices, and so on. Please refer to FIGS. 1, 2A and 2B at the same time. In some embodiments, the portable
在某些實施例中,散熱元件130更包括對應於散熱開口112的暴露部132。換句話說,殼體110的散熱開口112可暴露散熱元件130的至少一部分(即,暴露部132),以促進散熱元件130的散熱效率。在本實施例中,暴露部132可為至少一部分的散熱鰭片。在本新型創作的一實施例中,散熱元件130為被動式散熱元件,但本新型創作不以此為限。
In some embodiments, the
在某些實施例中,支架140設置於殼體110內,並框圍暴露部132。舉例而言,支架140可透過鎖固件146鎖固於殼體110內的例如底板上,但本新型創作並不侷限於此。在本實施例中,支架140可包括框圍部142以及固定部144。框圍部142可例如位於發熱元件120所設置的電路板160上,散熱元件130的暴露部132可穿過電路板160而突出於電路板160的表面,框圍部142框圍暴露部132並定義出支架開口148。支架開口148對應殼體110的散熱開口112,以共同暴露散熱元件130的暴露部132。固定部144設置於框圍部142的周圍並可包括鎖固孔,以供鎖固件146進行鎖固。
In some embodiments, the
在某些實施例中,門蓋結構150設置於支架140上並對應散熱開口112。在本實施例中,門蓋結構150設置於支架140的支架開口148並適於相對支架140移動,以覆蓋及/或暴露至少部分的暴露部132。在本實施例中,支架140可包括滑槽143,門蓋結構150滑動配置於滑槽143上,以沿著滑槽143移動於暴露所述暴露部132的開啟位置(如圖1所示的開啟位置)以及覆蓋所述暴露部132的閉闔位置(如圖2A及圖2B所示的閉闔位置)之間。
In some embodiments, the
在本實施例中,可攜式電子裝置100可具有溫度感測器,其設置於發熱元件120上以感測發熱元件120的溫度,當溫度感測器感測到發熱元件120的溫度大於警戒溫度時,可攜式電子裝置100可例如於其顯示器上跳出提醒,讓使用者可手動將門蓋結
構150打開(例如由閉闔位置滑動至開啟位置),以暴露散熱元件130的暴露部,幫助散熱元件130進行散熱。在其他實施例中,當溫度感測器感測到發熱元件120的溫度大於警戒溫度時,可攜式電子裝置100也可自動控制門蓋結構150由閉闔位置轉變成開啟位置,以促進散熱。本新型創作並不以此為限。
In this embodiment, the portable
圖3是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。圖4是圖3所示的可攜式電子裝置的門蓋結構於開啟位置的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖3以及圖4,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 3 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention. 4 is a schematic diagram of the door cover structure of the portable electronic device shown in FIG. 3 in an open position. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIG. 3 and FIG. 4, the following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the previous embodiment.
在本實施例中,可攜式電子裝置100更可包括馬達170,設置於支架140上並耦接門蓋結構150,以驅動門蓋結構150移動於如圖3所示的閉闔位置以及如圖4所示的開啟位置之間。舉例而言,馬達170可包括導螺桿172,門蓋結構150的一端151可耦接導螺桿172,並且,門蓋結構150可與導螺桿172螺紋配合。如此配置,馬達170則可透過轉動導螺桿172而線性地驅動門蓋結構150移動於如圖3所示的閉闔位置以及如圖4所示的開啟位置之間。在這樣的配置下,當可攜式電子裝置100的溫度感測器感
測到發熱元件120的溫度大於警戒溫度時,可傳送一散熱訊號至控制器,控制器便可據此啟動馬達170,以驅動門蓋結構150自動由閉闔位置轉變成開啟位置,以促進散熱。在本實施例中,馬達170可透過鎖固件174鎖固於支架140上,再將支架140連同馬達一起透過鎖固件146鎖固於殼體110內(例如殼體110內的底板上),以實現模組化組裝。
In this embodiment, the portable
圖5是依照本新型創作的一實施例的一種可攜式電子裝置的示意圖。圖6是圖5所示的可攜式電子裝置的風扇模組的示意圖。圖7是圖5所示的可攜式電子裝置的剖面的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖5至圖7,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 FIG. 5 is a schematic diagram of a portable electronic device according to an embodiment of the invention. FIG. 6 is a schematic diagram of the fan module of the portable electronic device shown in FIG. 5. FIG. 7 is a schematic diagram of a cross-section of the portable electronic device shown in FIG. 5. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIG. 5 to FIG. 7. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
在某些實施例中,可攜式電子裝置100更與其他散熱套件配合,以進一步幫助發熱元件120及散熱元件130進行散熱。舉例而言,在本實施例中,可攜式電子裝置100可包括套設於殼體110上的風扇模組200,如此,在有較大的散熱需求時將風扇模組200套設於殼體110上,以與可攜式電子裝置100結合並幫助可攜式電子裝置100進行散熱。風扇模組200可包括基座210以
及風扇組件220。基座210可包括彼此相通的固定槽212以及導流槽214,其中,固定槽212與至少部分的殼體110形狀配合,以經由固定槽212將基座210套設於可攜式電子裝置100的殼體110上。並且,基座210可具有對應殼體110的散熱開口112的基座開口216,其連通固定槽212以及導流槽214。風扇組件220可包括至少一風扇(繪示為兩個風扇222、223,但不以此為限)以及導流蓋板224,其中,導流蓋板224覆蓋導流槽214,風扇222、223則設置於導流蓋板224上並位於導流槽214內。在這樣的配置下,風扇模組200可套設於殼體110上,並透過風扇222、223提供冷卻氣流,並經由導流槽214的導引至散熱元件130的暴露部132,以幫助散熱元件130進行散熱。
In some embodiments, the portable
在某些實施例中,風扇的數量可為多個,舉例而言,在本實施例中,風扇組件220包括兩個風扇222、223,其分別設置於導流蓋板224上,對應地,導流蓋板224更可包括對應多個風扇222、223的多個風口2241、2242以及隔板2243,其中,隔板2243位於多個風扇222、223之間,並對應於基座開口216。如此,隔板2243將導流槽214分隔成彼此連通的多個腔室S1、S2。在這樣的配置下,風扇222、223可分別為送風風扇以及抽風風扇,舉例而言,風扇222可為送風風扇,其出風口朝向導流槽214,以將冷卻氣流送入導流槽214的腔室S1內。風扇223則可為抽風風扇,其入風口朝向導流槽214,以將導流槽214的腔室S2內的熱氣抽出至導流槽214外(如圖7的箭頭方向所示)。如此,風扇
222所提供的冷卻氣流經由導流槽214與隔板2243的導引而流至被暴露的散熱元件130的暴露部132,以與暴露部132進行熱交換,而進行熱交換後的熱風則可經由風扇223抽至風扇模組200外,因而可大幅提升散熱效率。
In some embodiments, the number of fans may be more than one. For example, in this embodiment, the
圖8是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。圖9是圖8所示的可攜式電子裝置的門蓋結構於開啟位置的局部剖面示意圖。圖10是圖8所示的可攜式電子裝置的門蓋結構於開啟位置的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖8至圖10,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 FIG. 8 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention. FIG. 9 is a partial cross-sectional schematic diagram of the door cover structure of the portable electronic device shown in FIG. 8 in an open position. FIG. 10 is a schematic diagram of the door cover structure of the portable electronic device shown in FIG. 8 in an open position. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIG. 8 to FIG. 10. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
在本實施例中,門蓋結構150可包括樞轉檔板152,其樞設於支架140上以相對支架140旋轉於例如圖9所示的開啟位置以及例如圖8所示的閉闔位置之間。進一步而言,門蓋結構150更可包括樞轉軸154以及驅動凸塊156。樞轉檔板152連接樞轉軸154以透過樞轉軸154樞設於支架140上,驅動凸塊156與樞轉檔板152可分別設置於樞轉軸154的相對兩側,因而適於以槓桿原理的方式透過按壓驅動凸塊156驅動樞轉檔板152樞轉。相應地,
支架140可包括對應於驅動凸塊156的驅動開口145,據此,當樞轉檔板152如圖8所示位於閉闔位置時,驅動凸塊156位於驅動開口145內,在某些實施例中,驅動凸塊156可穿過驅動開口145而突出於支架140的表面,如此配置,驅動凸塊156可經由驅動開口145受按壓而驅動樞轉檔板152旋轉至如圖9所示的開啟位置。
In this embodiment, the
在某些實施例中,可攜式電子裝置100可透過裝配風扇模組200於殼體110上的同時將門蓋結構150旋轉至開啟位置。請參照圖9,在某些實施例中,風扇模組200的隔板2243更可包括驅動部2244,其突出於隔板2243並對應於支架140的驅動開口145。如此,當風扇模組200裝設於殼體110時,驅動部2244便可經由驅動開口145對門蓋結構150的驅動凸塊156往下按壓,進而驅動樞轉檔板152旋轉至開啟位置,因而可達到裝配風扇模組200於殼體110的同時開啟門蓋結構150以進行散熱的目的。此外,透過旋轉的方式開啟的樞轉檔板152也可同時具有導流的功效,讓經熱交換後的熱氣可順著樞轉檔板152的方向流出殼體110之外。
In some embodiments, the portable
請參照圖8及圖10,在某些實施例中,門蓋結構150更可包括至少一彈性復位件158(繪示為兩個,但不限於此),連接於樞轉軸154與支架140之間,以在按壓驅動凸塊156的外力消失後可透過彈性復位件的彈性復位力而將樞轉檔板152拉回到如圖8所示的閉闔位置。在某些實施例中,支架140更包括延伸部
147,其可延伸至殼體的散熱開口所暴露且未被樞轉檔板152所覆蓋的範圍內,且延伸部147具有至少一通氣孔1471,以進一步幫助散熱。在此實施例中,通氣孔1471下方可設置防塵網,以防止灰塵進入殼體110內。
8 and 10, in some embodiments, the
圖11是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。圖12是圖11所示的可攜式電子裝置的門蓋結構於開啟位置的局部剖面示意圖。圖13是圖12所示的可攜式電子裝置的風扇模組的隔板的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖11至圖13,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 FIG. 11 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention. 12 is a partial cross-sectional schematic diagram of the door cover structure of the portable electronic device shown in FIG. 11 in an open position. FIG. 13 is a schematic diagram of the partition of the fan module of the portable electronic device shown in FIG. 12. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIG. 11 to FIG. 13. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
請參照圖11至圖13,在某些實施例中,門蓋結構150可包括多個樞轉檔板152,其中,樞轉檔板152的樞轉軸154可具有多個齒1541,因而樞轉檔板152可彼此連動地分別往相反方向旋轉於如圖12所示的開啟位置以及如圖11所示的閉闔位置,以共同暴露及共同覆蓋暴露部132。在某些實施例中,可攜式電子裝置100可透過裝配風扇模組200於殼體110上的同時將門蓋結構150旋轉至開啟位置。
11-13, in some embodiments, the
舉例而言,請參照圖12,在某些實施例中,風扇模組200的隔板2243更可包括驅動部2244,其突出於隔板2243並對應具有多個齒,以分別與樞轉軸154的多個齒1541嚙合。換句話說,驅動部2244可例如為驅動齒條。如此,當風扇模組200裝設於殼體110時,驅動部2244便可由上往下插入兩個樞轉檔板152的樞轉軸154之間,以分別與兩個樞轉檔板152的齒1541嚙合,進而同時帶動兩個樞轉檔板152分別往相反方向旋轉至如圖12所示的開啟位置,因而可達到裝配風扇模組200於殼體110的同時開啟門蓋結構150以進行散熱的目的。此外,驅動部2244更可包括如圖13所示的導流凹槽AW,以在驅動部2244插入兩個樞轉軸154之間時仍能維持兩個腔室S1、S2之間的氣體對流通道。此外,透過旋轉的方式開啟的兩個樞轉檔板152也可同時具有導流的功效,讓冷卻氣流及經熱交換後的熱氣可分別順著兩個樞轉檔板152的方向流入及流出殼體110。
For example, referring to FIG. 12, in some embodiments, the
圖14是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於開啟位置的局部剖面示意圖。圖15是圖14所示的可攜式電子裝置的上視示意圖。圖16是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述 實施例,本實施例不再重複贅述。請參照圖14至圖16,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 14 is a partial cross-sectional schematic diagram of the door structure of a portable electronic device in an open position according to an embodiment of the invention. FIG. 15 is a schematic top view of the portable electronic device shown in FIG. 14. FIG. 16 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted part, please refer to the aforementioned Embodiments, this embodiment will not be repeated in detail. Please refer to FIGS. 14 to 16. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
請參照圖14至圖16,在某些實施例中,多個樞轉檔板152的樞轉軸154的齒1541可彼此嚙合,以彼此帶動而往相反方向旋轉。在此實施例中,可攜式電子裝置100更可包括可移動地設置於門蓋結構150下方的驅動齒條153以及傳動滾輪155,其中,傳動滾輪155連動耦接於多個樞轉檔板152的其中之一(例如圖14中右邊的樞轉檔板152,但不以此為限)與驅動齒條153之間,如此,驅動齒條153經配置以沿移動方向D1受推移而帶動傳動滾輪155旋轉,進而帶動與之嚙合的樞轉檔板152(例如圖14中右邊的樞轉檔板152,但不以此為限)旋轉,並連動另一樞轉檔板152往相反方向旋轉,進而使兩個樞轉檔板152同時往相反方向旋轉至如圖14所示的開啟位置。在某些實施例中,可攜式電子裝置100可透過裝配風扇模組200於殼體110上的同時將門蓋結構150旋轉至開啟位置。舉例而言,風扇模組200可在對應於殼體開口OP的位置設置對應的突出部,便可在套設風扇模組200於殼體110上的同時將驅動齒條153往內推移,進而帶動兩個樞轉檔板152旋轉至開啟位置。此外,透過旋轉的方式開啟的兩個樞轉檔板152也可同時具有導流的功效,讓冷卻氣流及經熱交換後的熱氣可分別順著兩個樞轉檔板152的方向流入及流出殼體110。
Please refer to FIGS. 14 to 16. In some embodiments, the
在某些實施例中,門蓋結構150更可包括彈性復位件158,
其一端可連接驅動齒條153,另一端可連接至殼體內的任一不動件,以使樞轉檔板152在推移驅動齒條153的外力消除後能透過彈性復位件158的復位力將樞轉檔板152拉回原始的閉闔位置。在如圖15所示的實施例中,彈性復位件158可例如連接於驅動齒條153與電路板160之間。在如圖16所示的實施例中,彈性復位件158的一端可連接驅動齒條153,其另一端則可連接(鎖固)至支架140的連接部149上,以實現模組化組裝。
In some embodiments, the
圖17是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。圖18是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於開啟位置的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖17至圖18,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 FIG. 17 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention. FIG. 18 is a schematic diagram of the door cover structure of a portable electronic device in an open position according to an embodiment of the invention. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIG. 17 to FIG. 18. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
在某些實施例中,多個樞轉檔板152的樞轉軸154的齒1541可彼此嚙合,以彼此帶動而往相反方向旋轉。在這樣的配置下,可攜式電子裝置100更可包括馬達170,其設置於支架140上並耦接所述多個樞轉檔板152的其中之一(例如圖18中左邊的樞轉檔板152,但不以此為限)。在本實施例中,馬達170可包括
驅動齒輪176,其可與多個樞轉檔板152的其中之一(例如圖18中左邊的樞轉檔板152,但不以此為限)嚙合,如此,馬達170可驅動所述驅動齒輪176旋轉,以帶動與之嚙合的樞轉檔板152(例如圖18中左邊的樞轉檔板152,但不以此為限)旋轉,並連動另一樞轉檔板152往相反方向旋轉,進而使兩個樞轉檔板152同時往相反方向旋轉至如圖18所示的開啟位置。並且,馬達170可驅動所述驅動齒輪176往相反方向旋轉,即可使兩個樞轉檔板152同時往相反方向旋轉至如圖17所示的閉闔位置。此外,透過旋轉的方式開啟的兩個樞轉檔板152也可同時具有導流的功效,讓冷卻氣流及經熱交換後的熱氣可分別順著兩個樞轉檔板152的方向流入及流出殼體110。
In some embodiments, the
圖19是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。圖20是圖19所示的可攜式電子裝置的門蓋結構於開啟位置的示意圖。圖21是圖19所示的可攜式電子裝置的局部剖面示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖19至圖21,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 FIG. 19 is a schematic diagram of a door cover structure of a portable electronic device in a closed position according to an embodiment of the invention. 20 is a schematic diagram of the door cover structure of the portable electronic device shown in FIG. 19 in an open position. FIG. 21 is a schematic partial cross-sectional view of the portable electronic device shown in FIG. 19. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIG. 19 to FIG. 21. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
在某些實施例中,門蓋結構150更包括抬升檔板152’以
及連動桿157、159,其中,連動桿157、159可移動地耦接於抬升檔板152’與支架140之間。具體而言,連動桿157、159可例如為一對剪刀腳結構,其包括驅動桿159以及帶動桿157,兩者透過樞紐1572於中心處絞接,以彼此連動。相應地,馬達170可包括導螺桿172,其耦接驅動桿159。如此,馬達170可透過轉動導螺桿172而線性地驅動(推移)所述驅動桿159由圖19的位置往移動方向D1移動至如圖20的位置,進而透過驅動桿159與帶動桿157的連動作用而帶動抬升檔板152’由圖19的閉闔位置抬升至如圖20的開啟位置。並且,馬達170也可透過反向驅動導螺桿172而線性地驅動(推移)所述驅動桿159由圖20的位置移動至如圖19的位置,進而透過驅動桿159與帶動桿157的連動作用而帶動抬升檔板152’由圖20的開啟位置下降至如圖19的閉闔位置。
In some embodiments, the
此外,請同時參照圖20及圖21,在某些實施例中,門蓋結構150更可包括導流彈性體1571,其可繞過連動桿157、159的樞紐1572而連接於抬升檔板152’的下表面,如此配置,當抬升檔板152’抬升至如圖20所示的開啟位置時,導流彈性體1571受樞紐1572的牽制而下拉形成V形的導流結構,因而可導引氣流流向散熱元件的暴露部132,並流通於腔室S1與S2之間。在本實施例中,導流彈性體1571可例如為適合的彈性布料。
In addition, please refer to FIGS. 20 and 21 at the same time. In some embodiments, the
圖22是依照本新型創作的一實施例的一種可攜式電子裝置的門蓋結構於開啟位置的示意圖。圖23是圖22所示的可攜式電子裝置的局部剖面示意圖。圖24是依照本新型創作的一實施例 的一種可攜式電子裝置的門蓋結構於閉闔位置的示意圖。在此必須說明的是,本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置相似,因此,本實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,本實施例不再重複贅述。請參照圖22至圖24,以下將針對本實施例的可攜式電子裝置與前述實施例的可攜式電子裝置的差異做說明。 FIG. 22 is a schematic diagram of a door cover structure of a portable electronic device in an open position according to an embodiment of the invention. FIG. 23 is a schematic partial cross-sectional view of the portable electronic device shown in FIG. 22. Figure 24 is an embodiment of creation according to the present invention A schematic diagram of a door cover structure of a portable electronic device in a closed position. It must be noted here that the portable electronic device of this embodiment is similar to the portable electronic device of the previous embodiment. Therefore, this embodiment uses the component numbers and part of the content of the previous embodiment, in which the same reference numbers are used. Denotes the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiment, and this embodiment will not be repeated. Please refer to FIGS. 22 to 24. The following will describe the differences between the portable electronic device of this embodiment and the portable electronic device of the foregoing embodiment.
在某些實施例中,門蓋結構150可包括一個樞轉檔板152。樞轉檔板152包括樞轉軸154,其上具有多個齒1541。在本實施例中,可攜式電子裝置100可包括馬達170,其設置於支架140上並耦接樞轉檔板152的樞轉軸154。具體而言,馬達170更包括驅動齒輪176,其可與樞轉軸154的齒1541嚙合,如此,馬達170可驅動所述驅動齒輪176旋轉,以帶動樞轉檔板152旋轉於開啟位置以及閉闔位置之間。在如圖22所示的實施例中,支架140可包括延伸部147,其可延伸至殼體的散熱開口所暴露且未被樞轉檔板152所覆蓋的範圍內,且延伸部147具有至少一通氣孔1471(繪示為多個,但不以此為限),以進一步幫助散熱。在此實施例中,通氣孔1471下方可設置防塵網,以防止灰塵進入殼體110內。並且,殼體的散熱開口可暴露門蓋結構150的樞轉檔板152以及支架140的延伸部147。在如圖22所示的實施例中,殼體110可覆蓋支架140的延伸部147,也就是說,殼體110的散熱開口112
僅暴露門蓋結構150的樞轉檔板152,以供樞轉檔板152進行開闔,而殼體110覆蓋延伸部147的部分可對應具有多個通氣孔114,以與下方支架140的通氣孔1471連通。在此實施例中,支架140的通氣孔1471的尺寸可大於殼體110的通氣孔114尺寸,例如支架140可具有一個通氣孔1471,其尺寸足以涵蓋殼體110的所有通氣孔114,如此,防塵網可設置於支架140的通氣孔1471上,以防止灰塵進入殼體110內。
In some embodiments, the
綜上所述,本新型創作實施例的一種可攜式電子裝置的殼體可具有散熱開口,其用以暴露殼體內的至少部分散熱元件,並且,可攜式電子裝置更包括門蓋結構,其可過支架模組化組裝於可攜式電子裝置內,如此配置,當可攜式電子裝置有較高的散熱需求時,可透過手動或自動的方式開啟門蓋結構,以促進散熱。因此,可攜式電子裝置可具有更好的散熱效率,且模組化的設計也可簡化繁瑣的組裝步驟。 In summary, the housing of a portable electronic device according to the creative embodiment of the present invention may have a heat dissipation opening for exposing at least part of the heat dissipation elements in the housing, and the portable electronic device further includes a door cover structure, It can be assembled into a portable electronic device in a modular manner through a bracket. With this configuration, when the portable electronic device has a high heat dissipation requirement, the door cover structure can be opened manually or automatically to promote heat dissipation. Therefore, the portable electronic device can have better heat dissipation efficiency, and the modular design can also simplify the cumbersome assembly steps.
此外,可攜式電子裝置更可包括套設於殼體上的風扇模組,如此,在有較大的散熱需求時將風扇模組套設於殼體上,以與可攜式電子裝置結合並幫助可攜式電子裝置進行散熱。在這樣的配置下,風扇模組套設於殼體上,並可透過風扇提供冷卻氣流,並經由風扇模組的導流槽將氣流的導引至散熱元件的暴露部,以幫助散熱元件進行散熱。並且,在某些實施例中,可攜式電子裝置可透過裝配風扇模組於殼體上的同時驅動門蓋結構旋轉至開啟位置,提升裝置的操作便利性。 In addition, the portable electronic device may further include a fan module sleeved on the casing, so that when there is a greater need for heat dissipation, the fan module can be sleeved on the casing to be combined with the portable electronic device And help portable electronic devices to dissipate heat. In this configuration, the fan module is sleeved on the housing and can provide cooling air flow through the fan, and guide the air flow to the exposed part of the heat dissipation element through the guide groove of the fan module to help the heat dissipation element perform Heat dissipation. Moreover, in some embodiments, the portable electronic device can drive the door cover structure to rotate to the open position while assembling the fan module on the housing, which improves the operating convenience of the device.
100:可攜式電子裝置 100: Portable electronic device
110:殼體 110: shell
112:散熱開口 112: heat dissipation opening
130:散熱元件 130: heat dissipation element
132:暴露部 132: Exposure
150:門蓋結構 150: door cover structure
Claims (16)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI776730B (en) * | 2021-11-09 | 2022-09-01 | 華碩電腦股份有限公司 | Portable electronic device |
TWI776724B (en) * | 2021-11-03 | 2022-09-01 | 華碩電腦股份有限公司 | Portable electronic device |
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2021
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI776724B (en) * | 2021-11-03 | 2022-09-01 | 華碩電腦股份有限公司 | Portable electronic device |
TWI776730B (en) * | 2021-11-09 | 2022-09-01 | 華碩電腦股份有限公司 | Portable electronic device |
US11903169B2 (en) | 2021-11-09 | 2024-02-13 | Asustek Computer Inc. | Portable electronic device |
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