TWM510856U - Heat insulation film - Google Patents

Description

Thermal insulation film 【0001】

The present invention relates to a heat insulating film and a heat insulating material, and more particularly to a heat insulating film and a heat insulating material which have excellent infrared ray blocking ratio and visible light transmittance.

【0002】

In recent years, how to save energy and reduce carbon has become a topic of worldwide efforts. The glass adhesive film of buildings or automobiles can effectively shield sunlight and reduce the temperature rise in the room or the car, thereby reducing the use of air conditioners. And load.

[0003]

Generally, the heat insulating layer included in the heat insulating film can be prepared by the following methods: (1) sputtering a metal (such as silver or nickel chrome alloy) or plating a metal (such as aluminum) on the vapor deposition method. The surface of the substrate; (2) will contain a metal halide (such as lanthanum hexaboride (LaB ₆ ); or (3) will contain a metal oxide (such as antimony tin oxide (ATO), indium tin oxide (ITO), A heat-insulating coating such as tungsten oxide (WO _3-x ) or composite tungsten oxide is uniformly coated on the surface of the substrate.

[0004]

The above-mentioned separator heat prepared by vapor deposition and sputtering of a pure metal such as aluminum or silver or an alloy thereof exhibits its disadvantages due to oxidation and sputtering of a metal or its alloy which are unstable in the air and are likely to be oxidized. Silver or nickel-chromium alloy sputtered thermal insulation films increase the cost of manufacturing the thermal barrier film because of the need to use expensive sputtering equipment. In addition, the heat-insulating film made by using the metal plating layer described above is liable to cause an electromagnetic wave barrier effect, and the communication article in the building and the automobile is not well received.

[0005]

At present, the commercially available heat-insulating film needs to take into consideration the requirements of high transparency and high heat-insulating properties, and often uses tungsten oxide or composite tungsten oxide, etc. Although it has sufficient ability to shield infrared rays, it can be used as a barrier infrared material. However, a two-stage heat treatment is required in the process, which has the disadvantages of complicated process and high cost. In addition, the thermal barrier film obtained by the above method has a refractive index of 5-12% after a 1000-hour QUV aging test, and also exhibits the disadvantage of reliability.

[0006]

The purpose of the present invention is to provide a thermal insulation film having excellent infrared ray rejection and visible light transmittance, and having long-term quality stability to improve the reliability of the conventional thermal insulation film.

【0007】

In order to achieve the above object, a preferred embodiment of the present invention provides a heat insulating film comprising a substrate and a heat insulating layer. The heat insulating layer is formed on the substrate, and is mainly composed of a heat insulating material, wherein the heat insulating material comprises a composite tungsten oxycarbide or a composite tungsten oxychloride, the composite tungsten oxycarbide or the composite The composite tungsten oxycarbonate has carbon doping and a carbon doping content of 1 atomic percent or less.

[0008]

In one embodiment, the carbon doping content is between 0.5 and 1 atomic percent.

【0009】

In one embodiment, the chemical formula of the composite tungsten oxycarbide is WO _3-y -x(at%)C, wherein C is doped carbon, W is tungsten, O is oxygen, and x and y are both positive numbers, and The following conditions are met: 0<x≦1 and 0<y≦0.6.

[0010]

In one embodiment, the chemical formula of the composite tungsten oxychloride is Cs _a WO _3-y Cl _b -x(at%)C, wherein C is doped carbon, Cs is 铯, W is tungsten, and O is oxygen. Cl is chlorine, and x, y, a, and b are all positive numbers, and the following conditions are met: 0<x≦1;0<y≦0.5;0<a≦1 and 0<b≦0.5.

[0011]

In one embodiment, the thermal insulation film further comprises an adhesive layer formed on the bottom layer of the substrate, and the adhesive layer is composed of pressure sensitive adhesive.

[0012]

In one embodiment, the insulating layer is integrated into the same structural layer as the adhesive layer.

[0013]

In one embodiment, the thermal barrier film further comprises a release film formed on the bottommost layer of the substrate.

[0014]

In one embodiment, the thermal barrier film further comprises a hardened layer formed on the topmost layer of the substrate and composed of photosensitive acrylic resin.

[0015]

In one embodiment, the insulating layer is integrated with the hardened layer into the same structural layer.

[0016]

In one embodiment, the thermal insulation film comprises a two-layer substrate, the thermal insulation layer is formed between the two-layer substrate, and the thermal insulation layer further comprises a pressure sensitive adhesive or a glue.

[0017]

In one embodiment, the thermal insulation film comprises a two-layer substrate formed on the bottom layer of the two-layer substrate, and the thermal insulation layer further comprises a pressure sensitive adhesive.

[0018]

In one embodiment, the thermal insulation film comprises a two-layer substrate formed on a top layer of the two-layer substrate, and the thermal insulation layer further comprises a photosensitive acrylic resin.

[0019]

In order to achieve the above object, another preferred embodiment of the present invention provides a heat insulating material which is a carbon-doped composite tungsten oxycarbide, wherein the composite tungsten oxycarbide has a carbon doping content of 1 or less. Atomic percentage.

[0020]

In one embodiment, the chemical formula of the composite tungsten oxycarbide is WO _3-y -x(at%)C, wherein C is doped carbon, W is tungsten, O is oxygen, and x and y are both positive numbers, and The following conditions are met: 0<x≦1 and 0<y≦0.6.

[0021]

In order to achieve the above object, another preferred embodiment of the present invention provides a heat insulating material which is a carbon doped composite tungsten oxychloride, wherein the composite tungsten oxychloride has a carbon doping content of less than Equal to 1 atomic percent.

[0022]

In one embodiment, the chemical formula of the composite tungsten oxychloride is Cs _a WO _3-y Cl _b -x(at%)C, wherein C is doped carbon, Cs is 铯, W is tungsten, and O is oxygen. Cl is chlorine, and x, y, a, and b are all positive numbers, and the following conditions are met: 0<x≦1;0<y≦0.5;0<a≦1 and 0<b≦0.5.

[0091]

10‧‧‧Insulation film

11‧‧‧Substrate

12, 12’‧‧‧Insulation

13‧‧‧ release film

14‧‧‧ hardened layer

15‧‧‧Adhesive layer

16‧‧‧Connection layer

S21‧‧‧Step 21

S22‧‧‧Step 22

S23‧‧‧Step 23

S24‧‧‧Step 24

S25‧‧‧Step 25

S31‧‧‧Step 31

S32‧‧‧Step 32

S33‧‧‧Step 33

S34‧‧‧Step 34

S35‧‧‧Step 35

S41‧‧‧Step 41

S42‧‧‧Step 42

S43‧‧‧Step 43

S44‧‧‧Step 44

[0023]

Fig. 1 is a schematic view showing a heat insulating film of the first preferred embodiment of the present invention.

Figure 2 is a schematic view of the thermal insulation film of the second preferred embodiment of the present invention.

Fig. 3 is a schematic view showing the heat insulating film of the third preferred embodiment of the present invention.

Figure 4 is a schematic view of a thermal insulation film of a fourth preferred embodiment of the present invention.

Fig. 5 is a schematic view showing the heat insulating film of the fifth preferred embodiment of the present invention.

Figure 6 is a schematic view of the heat insulating film of the sixth preferred embodiment of the present invention.

Figure 7 is a schematic view of the thermal insulation film of the seventh preferred embodiment of the present invention.

Figure 8 is a flow chart of the manufacturing method of the composite tungsten oxycarbide of the present invention.

Figure 9 is a flow chart of the manufacturing method of the composite tungsten oxychloride.

Figure 10 is the penetration rate spectrum of the insulation material of this case.

Figure 11 is a flow chart of the manufacturing method of the heat insulating film of the present invention.

[0024]

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It should be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and drawings are intended to be illustrative and not limiting.

[0025]

In order to solve the problem of the reliability of the thermal insulation film prepared by the thermal insulation coatings such as tungsten oxide or composite tungsten oxide used in the prior art, the main purpose of the present invention is to provide a A high-transparent and high-infrared barrier that enhances stability and reliability. Please refer to FIG. 1 , which is a schematic view of a thermal insulation film according to a first preferred embodiment of the present invention. As shown in the figure, the thermal insulation film 10 of the present invention comprises a substrate 11 and a thermal insulation layer 12 , and the thermal insulation layer 12 . Formed on the first surface of the substrate 11, mainly composed of a heat insulating material, wherein the heat insulating material comprises a composite tungsten oxycarbide or a composite tungsten oxychloride, the composite tungsten oxycarbide Or the composite tungsten oxychloride has carbon doping and has a carbon doping content of 1 atomic percent or less, and preferably 0.5 to 1 atomic percent.

[0026]

The chemical formula of the composite tungsten oxycarbide is WO _3-y -x(at%)C, wherein C is doped carbon, W is tungsten, O is oxygen, and x and y are both positive numbers, and the following conditions are met: 0< X≦1 and 0<y≦0.6; the chemical formula of the composite tungsten oxycarbonate is Cs _a WO _3-y Cl _b -x(at%)C, wherein C is doped carbon, Cs is 铯, and W is tungsten O is oxygen, Cl is chlorine, and x, y, a, and b are all positive numbers, and the following conditions are met: 0<x≦1;0<y≦0.5;0<a≦1 and 0<b≦0.5.

[0027]

The thermal insulation film of this case has the dual effects of high transparency and high heat insulation, and is suitable for use as a barrier infrared material, and the infrared ray rejection rate of the infrared ray rejection rate after 1000 hours is less than 5%, that is, the thermal insulation film of the present case has a long-term effect. The quality stability and the reliability of use are greatly improved, so it can be used in the industry. Furthermore, the process of this case only requires a single step heat treatment, so it has the characteristics of simple process and low cost.

[0028]

The principle of high-transparency and high-insulation double-effect and increased reliability of the composite tungsten-oxygen carbide or composite tungsten-oxygen oxychloride used in the thermal insulation film of the present invention is as follows: the doping of metal ions can improve the composite tungsten oxychloride. The infrared blocking effect of the compound, but the doping metal also becomes the center of recombination of electrons and holes, so it is not conducive to the transfer of photoelectrons, so the blocking effect of infrared rays is greatly reduced after a period of use. Through X-ray photoelectron spectroscopy (XPS) analysis, carbon doped WO ₃ may be reduced thereby increasing the energy gap of the light response of the current WO _3, WO ₃ and further formed on the surface of the electrochemical reaction, so that the surface lattice oxygen content decreases At the same time, the hexavalent tungsten ion W ^{6+ is} also lowered, so the carbon-doped WO ₃ can convert the hexavalent tungsten ion W ⁶⁺ to form a pentavalent tungsten ion W ⁵⁺ , thereby increasing the pentavalent tungsten ion W ⁵⁺ and oxygen. The amount of adsorption, while the pentavalent tungsten ion W ⁵⁺ can increase the efficiency of electron-hole separation. Through UV-visible diffuse reflectance absorption spectroscopy (DRS) analysis, it is known that carbon-doped WO ₃ can increase the near-infrared ray barrier. The effect of doping carbon does not significantly change the morphology and particle size of WO ₃ by field emission scanning electron microscopy (FESEM). Analysis by XRD, diffuse into the carbon-doped WO ₃ crystal lattice, resulting in distortion of WO ₃ lattice (lattice distortion), thereby enabling the carbon-doped WO ₃ having a high infrared ray cutting effect, but too many lattice distortion Will reduce the mobility of electrons, so the carbon content of the doping needs to be controlled. Through UV-visible diffuse reflectance (DRUVS) analysis, carbon-doped WO ₃ has a lower reflectance in the wavelength range of 380-780 nm, and thus can increase the transmittance in the visible light region. Through the above analysis, the carbon-doped WO ₃ has high visible light transmittance and infrared blocking effect, and also because the pentavalent tungsten ion W ⁵⁺ can reduce the decline of the infrared blocking rate, and greatly improve the reliability of use.

[0029]

In one embodiment, the substrate is a transparent substrate, such as but not limited to glass, polyethylene terephthalate film (PET), polyethylene naphthalate (PEN), polycarbonate. (PC), polyvinyl chloride (PVC), polypropylene (PP), polyethylene (PE), Acrylic Resin, Polyarylate (PAr), Aromatic Polyester (Cyclo Olefin Polymer) ; COP), polymethacrylate (PMMA), polypropylene (PP), low density polyethylene (LDPE), polyethylene naphthalate (PEN), polysulfones, polyether oxime (PES) ), polyurethane (PU), polyamidamine (PI), polyvinylidene fluoride (PVDF), fluorinated ethylene propylene copolymer (FEP), polyethylene fluorene (PVS), and thermosetting films such as fiber interconversions ( Cellulose derivatives), or polymer films such as polyamidamine (PI) or polyimide benzoxazoles.

[0030]

In order to adhere the thermal insulation film to the glass of a building or automobile, the thermal insulation film further comprises an adhesive layer mainly composed of a pressure sensitive adhesive (PSA). In one embodiment, the pressure sensitive adhesive can be mixed with the heat insulating material and then applied to the substrate, that is, the heat insulating layer and the adhesive layer are integrated into the same structural layer. Please refer to FIG. 2 , which is a schematic view of a thermal insulation film according to a second preferred embodiment of the present invention. As shown in the figure, the thermal insulation film 10 of the present invention comprises a substrate 11 , a thermal insulation layer 12 ′ integrated with the adhesive layer, and Release film 13. One side of the heat insulating layer 12' integrated with the adhesive layer is attached to the first surface of the substrate 11, and the other side is directly adhered to the glass of the building or the automobile, and the release film 13 is provided. When the heat insulating film 10 is to be adhered to the glass of a building or a car, the user can tear the release film 13 apart.

[0031]

In an embodiment, the pressure sensitive adhesive may be an acrylic pressure sensitive adhesive or an organic tantalum pressure sensitive adhesive.

[0032]

Please refer to FIG. 3, which is a schematic view of a thermal insulation film according to a third preferred embodiment of the present invention. Compared with FIG. 2, the thermal insulation film 10 of the present embodiment further includes a hard coat 14 which is formed on the second surface of the substrate 11, that is, on the topmost layer of the thermal insulation film 10. To increase the overall strength of the thermal insulation film 10, to avoid scratches on the thermal insulation film 10.

[0033]

In one embodiment, the hardened layer 14 is primarily comprised of a photosensitive acrylic resin such as, but not limited to, a polyfunctional (meth) acrylate, alone or in combination with other polyfunctional or monofunctional (meth) acrylates ( (meth)acrylates), such as phenylthioethyl acrylate, hexanediol diacrylate, ethoxyethyl acrylate, phenoxyethyl acrylate , cyanoethyl (mono) acrylate, isobornyl acrylate, octadecyl acrylate, isodecyl acrylate, lauryl acrylate Acrylate), beta-carboxyethyl acrylate, tetrahydrofurfuryl acrylate, dinitrile acrylate, pentafluorophenyl acrylate, nitrobenzene Nitrophenyl acrylate, 2-phenoxyethyl acrylate, 2-phenoxyethyl methacrylate Eth), 2,2,2-trifluoromethyl (meth)acrylate, diethylene glycol diacrylate, triethylene glycol Triethylene glycol diacrylate, triethylene glycol dimethacrylate, tripropylene glycol diacrylate, tetraethylene glycol diacrylate, neopentyl glycol Neopentyl glycol diacrylate, propoxylated neopentyl glycol diacrylate, polyethylene glycol diacrylate, tetraethylene glycol diacrylate , bisphenol A epoxy diacrylate, 1,6-hexanediol dimethacrylate, trimethylol propane triacrylate Ethoxylated trimethylol propane triacrylate, propylated trimethylolpropane triacrylate (propyla) Ted trimethylol propane triacrylate), tris(2-hydroxyethyl)-isocyanurate triacrylate, pentaerythritol triacrylate, phenylthioethyl ester Phenylthioethyl acrylate), naphthloxyethyl acrylate, EBECRYL 130 cyclic diacrylate (available from Cytec Surface Specialties, West Paterson, NJ), epoxy acrylate RDX80095 (optional) From Rad-Cure Corporation, Fairfield, NJ), CN120E50 (available from Sartomer, Exton, Pa.), or mixtures thereof.

[0034]

Please refer to FIG. 4, which is a schematic view of a thermal insulation film according to a fourth preferred embodiment of the present invention. In this embodiment, the heat insulating layer and the hardened layer are integrated into the same structural layer. Therefore, as shown in FIG. 4, the heat insulating film 10 of the present embodiment includes the substrate 11, the adhesive layer 15, and the release film 13, And an insulating layer 12' integrated with the hardened layer, wherein the adhesive layer 15 and the release film 13 are sequentially disposed on the bottom layer of the substrate 11, so that the heat insulating film 10 has a function of facilitating user adhesion, and The hardened layer integrated insulating layer 12' is disposed on the top layer of the substrate 11 to provide an insulating effect while increasing the overall strength of the insulating film 10.

[0035]

The heat insulating material of the present invention can be applied to the heat insulating film of the double substrate as well as the single substrate heat insulating film. Please refer to FIG. 5, which is a schematic view of a thermal insulation film according to a fifth preferred embodiment of the present invention. In the present embodiment, the heat insulating film 10 includes a two-layer base material 11, and the two-layer base material 11 is bonded to each other by the joint layer 16 between the two-layer base materials 11. By the arrangement of the two-layer substrate 11, the structural strength of the overall heat-insulating film can be further enhanced.

[0036]

For example, the bonding layer 16 may be composed of a pressure sensitive adhesive or a bonding glue, wherein the bonding glue may be a single liquid polyurethane (PU) adhesive, a two liquid polyurethane (PU) adhesive, and ethylene vinyl acetate. (EVA) adhesive, or a mixture thereof, but not limited thereto.

[0037]

In this embodiment, the heat insulating layer and the adhesive layer are integrated into the same structural layer. Therefore, as shown in FIG. 5, the heat insulating film 10 of the present embodiment includes a double-layer substrate 11 and is disposed on the double-layer substrate 11. The intervening layer 16 , the heat insulating layer 12 ′ and the release film 13 which are disposed on the bottom layer of the double-layer substrate 11 and the adhesive layer, and the hardened layer 14 disposed on the top layer of the substrate 11 .

[0038]

Please refer to FIG. 6 , which is a schematic diagram of a thermal insulation film according to a sixth preferred embodiment of the present invention. In this embodiment, the heat insulating layer and the hardened layer are integrated into the same structural layer. Therefore, as shown in FIG. 6, the heat insulating film 10 of the present embodiment includes a double-layer substrate 11 and is disposed on the double-layer substrate 11. The bonding layer 16 between the two layers, the adhesive layer 15 disposed on the bottom layer of the two-layer substrate 11, and the release film 13 and the heat insulating layer 12' disposed on the top layer of the substrate 11 and integrated with the hardened layer.

[0039]

Please refer to FIG. 7 , which is a schematic diagram of a thermal insulation film according to a seventh preferred embodiment of the present invention. In this embodiment, the heat insulating layer and the bonding layer are integrated into the same structural layer. Therefore, as shown in FIG. 7, the heat insulating film 10 of the present embodiment includes a double-layer substrate 11 and is disposed on the double-layer substrate 11. The heat insulating layer 12' integrated with the bonding layer, the adhesive layer 15 and the release film 13 disposed on the bottom layer of the double-layer substrate 11, and the hardened layer 14 disposed on the top layer of the substrate 11. By setting the double substrate, it can protect the thermal insulation between the two substrates, and the effect of increasing the service life of the thermal insulation film can be achieved.

[0040]

Hereinafter, the heat insulating material and the method for producing the heat insulating film of the present invention will be further described.

[0041]

Figure 8 is a flow chart showing the manufacturing method of the composite tungsten oxycarbide (WO _3-y -x (at%) C). First, tungstic acid and hydrogen peroxide are uniformly mixed to form a melt (Sol), and then hydrogen peroxide is decomposed and removed by a metal catalyst network to obtain a solution A (step S21). In one embodiment, this step is to uniformly mix the appropriate amount of tungstic acid and hydrogen peroxide at a suitable temperature, for example, 30-50 ° C, into a melt, and then use a metal catalyst network, such as a platinum mesh, to leave the residue. Hydrogen peroxide is removed by catalysis and decomposition into oxygen and water. Next, tetrabutylammonium hydroxide ([CH ₃ (CH ₂ ) ₃ ] ₄ NOH) is mixed with ethanol to form a solution B (step S22), for example, to prepare a 20-30% tetramethylammonium hydroxide-ethanol solution. Among them, tetrabutylammonium hydroxide is a cationic surfactant. Thereafter, the solution A and the solution B are formed into a precipitate by a co-deposition method (step S23).

[0042]

Next, after the precipitate is aged, it is heated and dried to obtain a carbon-doped WO ₃ precursor (step S24). In one embodiment, in step S24, the precipitate is subjected to an aging reaction for 10-18 hours, and then dried by heating at 50-80 ° C to obtain a carbon-doped WO ₃ precursor. Finally, sintering is carried out under a high temperature vacuum or a hydrogen reducing atmosphere to obtain a composite tungsten oxycarbide powder (step S25). In one embodiment, the step S25 is sintered in a vacuum or hydrogen reducing atmosphere at a high temperature of 400-800 ° C for a period of time, for example, 1-3 hours, to obtain a monoclinic crystal structure of the composite tungsten oxycarbide powder, the chemical formula thereof. Is WO _3-y -x(at%)C, where C is doped carbon, W is tungsten, O is oxygen, and x and y are both positive numbers, and the following conditions are met: 0<x≦1 and 0<y≦ 0.6. The composite tungsten oxycarbide has carbon doping, and carbon diffuses into the crystal lattice of WO ₃ with a carbon doping content of 1 atomic percent or less, and preferably 0.5-1 atomic percent.

[0043]

In the foregoing sintering process, the powder is placed in a tubular furnace or a square furnace (hereinafter referred to as a high-temperature furnace) for high-temperature sintering, and the sintering condition is at a heating rate of 2 to 10 ° C/min, and hydrogen (H ₂ ) or vacuum is simultaneously introduced. In the environment, the sintering temperature of the high temperature furnace is raised from room temperature to 400-800 ° C, and the single sintering heat treatment is continued for 1 to 2 hours. After cooling down, the chemical formula is WO _3-y -x ( At%) C composite tungsten oxycarbide sintered powder. The purpose of introducing hydrogen or vacuum into the heat treatment is to avoid partial reduction of the composite tungsten oxycarbide to tungsten oxide (WO ₃ ), and to weaken the near-infrared barrier property, and at the same time, the hydrogen gas can extend the composite tungsten oxycarbide. Weather resistance, thus extending the timeliness of use.

[0044]

When performing a single sintering heat treatment step, the heating rate of the high temperature furnace is controlled to 2 to 10 ° C per minute, and the composite tungsten oxycarbide is maintained at a fixed temperature for a predetermined time of sintering heat treatment, and the composite tungsten oxycarbide is dried and The purpose of annealing. The composite tungsten oxycarbide powder subjected to the above heat treatment has a chemical composition stability and a reduced variability, and does not form a composite tungsten oxycarbide having a ratio of an inappropriate element, and has a good near-infrared region absorption property.

[0045]

In the case of the composite tungsten oxycarbide method, the physical properties of the composite tungsten oxycarbide material prepared by adjusting the carbon content and the heat treatment condition of the appropriate high temperature furnace will exhibit different infrared ray barriers as the carbon content changes. rate.

[0046]

Figure 9 is _a flow chart showing the manufacturing method of the composite tungsten oxychloride (Cs _a WO _3-y Cl _b -x (at%) C). First, tungsten hexachloride (WCl ₆ ) is mixed with ethanol to form a solution A (step S31). In one embodiment, in step S31, tungsten hexachloride is dissolved in ethanol under a protective atmosphere of argon to prepare a 0.01-0.05 M tungsten hexachloride-ethanol solution. Next, cesium chloride (CsCl) is mixed with ethanol to form a solution B (step S32), for example, to prepare a 0.02-0.08 M ruthenium chloride-ethanol solution. Thereafter, the solution A and the solution B are mixed to form a C solution (step S33). In one embodiment, solution A and solution B are mixed at a weight percent WA/WB of about 0.2%.

[0047]

Next, pulse irradiation is applied to the C solution using an excimer laser to obtain a composite tungsten oxychloride precursor (step S34). In one embodiment, this step uses a 248 nm KrF excimer laser to pulse the C solution at a fixed frequency (8-15 Hz) and energy (6-15 mJ). Finally, sintering is carried out under a high-temperature vacuum or a hydrogen reducing atmosphere to obtain a composite tungsten oxychloride powder (step S35). In one embodiment, the step S35 is sintered in a vacuum or hydrogen reducing atmosphere at a high temperature of 400-800 ° C for a period of time, for example, 1-3 hours, to obtain a monoclinic crystal structure of the composite tungsten oxychloride, the chemical formula of which is Cs _a WO _3-y Cl _b -x(at%)C, wherein C is doped carbon, Cs is 铯, W is tungsten, O is oxygen, Cl is chlorine, and x, y, a, b are positive numbers, And the following conditions are met: 0 < x ≦ 1; 0 < y ≦ 0.5; 0 < a ≦ 1 and 0 < b ≦ 0.5. The composite tungsten oxycarbonate has carbon doping, carbon diffuses into the crystal lattice of the composite tungsten oxychloride, and the carbon doping content is less than or equal to 1 atomic percentage (at %), and preferably between 0.5 and 1 atomic percentage.

[0048]

In the foregoing sintering process, the powder is placed in a tubular furnace or a square furnace (hereinafter referred to as a high-temperature furnace) for high-temperature sintering, and the sintering condition is at a heating rate of 2 to 10 ° C/min, and hydrogen (H ₂ ) or vacuum is simultaneously introduced. In the environment, the sintering temperature of the high temperature furnace is raised from room temperature to 400-800 ° C, and the single sintering heat treatment is continued for 1 to 2 hours. After cooling down, the chemical formula is Cs _a WO _3-y Cl. Composite tungsten-oxygen oxychloride sintered powder of _b- x(at%)C. The purpose of introducing hydrogen or vacuum into the heat treatment is to avoid partial reduction of the composite tungsten oxychloride to tungsten oxide (WO ₃ ), which weakens the near-infrared barrier property, and at the same time, the hydrogen gas can extend the composite tungsten oxychloride. The weatherability of the compound further prolongs the use time.

[0049]

When performing a single sintering heat treatment step, the heating rate of the high temperature furnace is controlled to 2 to 10 ° C per minute, and the sintering temperature of the composite tungsten oxychloride for a predetermined time is maintained at a fixed temperature, which is achieved for the composite tungsten oxycarbonate. Drying and annealing purposes. The composite tungsten oxychloride powder subjected to the above heat treatment has a chemical composition stability, and the variability is reduced, and a composite tungsten oxychloride which does not form an inappropriate element ratio is obtained, and has a good near-infrared region absorption property.

[0050]

In the case of the composite tungsten-oxygen carbon chloride method, the physical properties of the composite tungsten-oxygen oxychloride material prepared according to the co-doping ratio are adjusted as long as the amount of the lanthanum metal element and the carbon content are adjusted. The change shows a different infrared blocking rate.

[0051]

The composite tungsten-oxygen carbon chloride in this case is co-doped with chlorine element and bismuth metal element, and its transparent heat insulation effect is obviously superior to that of other common elements or a combination thereof, and is more suitable for high production. Transparent insulation film. For example, the composite tungsten oxychloride of the present invention has a better heat insulating effect than a composite tungsten oxycarbon halide using other halogen group F, Br, I or At elements.

[0052]

Figure 10 is a transmittance spectrum of the insulating material of the present case, wherein the horizontal axis is the wavelength (nm) and the vertical axis is the transmittance (%). It can be seen from Fig. 10 that the composite tungsten oxycarbide and composite tungsten oxychloride in this case have better infrared absorption band characteristics, and have superior absorption capacity for the infrared band with a wavelength of 800 to 2500 nm. It has better visible light transmittance, that is, it has the advantages of high transparency and high heat insulation. Therefore, it is suitable for high transparent and high heat insulation material that blocks infrared rays. It can be further used to make transparent heat insulation film, which can be attached to buildings and The effect of heat insulation and energy saving is achieved on the glass of the car.

[0053]

Figure 11 is a flow chart of the manufacturing method of the heat insulating film of the present invention. First, the composite tungsten oxycarbide or composite tungsten oxychloride powder obtained as described above is subjected to fine powder ball milling (step S41), and then an auxiliary agent is added, and the slurry is processed by stirring and ball milling (step S42). Then, the slurry is mixed with a photosensitive acrylic resin or a pressure sensitive adhesive to form a transparent heat insulating adhesive (step S43), and the transparent heat insulating adhesive is coated on the transparent substrate to form a transparent heat insulating film (step S44). ).

[0054]

In one embodiment, when the slurry is produced in step S42, an adhesive may be added in addition to the auxiliary agent. The subsequent agent may be, but not limited to, an acrylic resin, polyvinyl alcohol, a phenol resin containing a polyvinyl alcohol curing agent, or a mixture thereof. The purpose of adding the adhesive is to increase the dispersion effect of the composite tungsten oxycarbide or the composite tungsten oxychloride fine powder.

[0055]

In one embodiment, the auxiliary agent may be, but not limited to, a coupling agent, a surfactant, a dispersing agent, a high molecular polymer modifier, a UV absorber, or a mixture thereof, for example, may be dispersed using BYK-111 of BYK Chemical agent, BYK-085 dispersant, or sodium metaphosphate (NaPO _{3) 6} and the like. The purpose of adding auxiliaries is to help the composite tungsten oxycarbide or composite tungsten oxychloride fine powder to achieve uniform dispersion.

[0056]

In one embodiment, the transparent substrate used to coat the transparent heat insulating adhesive may be, but not limited to, glass, polyethylene terephthalate film (PET), polyethylene naphthalate (PEN), poly. Carbonate (PC), Polyvinyl Chloride (PVC), Polypropylene (PP), Polyethylene (PE), Acrylic Resin, Polyarylate (PAr), Aromatic Polyester (Cyclo Olefin Polymer; COP), polymethacrylate (PMMA), polypropylene (PP), low density polyethylene (LDPE), polyethylene naphthalate (PEN), polysulfones, polyether oxime (PES), polyurethane (PU), polyamidamine (PI), polyvinylidene fluoride (PVDF), fluorinated ethylene propylene copolymer (FEP), polyethylene fluorene (PVS) and thermosetting film such as fiber intercalation Polymer film, polyimide (PI) or polyimide benzoxazoles.

[0057]

Specific embodiments for producing a heat insulating film are further provided below. First, the composite tungsten oxycarbide or composite tungsten oxychloride fine powder obtained by finely pulverizing the ball mill is added to a solvent (for example, methyl ethyl ketone, toluene, isopropanol) to prepare a composite tungsten oxycarbide or composite tungsten. The oxycarbon chloride fine powder accounts for 5-30 wt%, preferably 27 wt% of the solution, and 5-15 wt%, preferably 10 wt% of the polymer type dispersant is used, and the 100 μm yttria yttria beads are used. The ball mill was dispersed to obtain a dispersed slurry having a particle diameter of less than 80 nm. Next, the dispersion slurry is mixed with a photosensitive acrylic resin to prepare a transparent heat-insulating adhesive in which the dispersion slurry accounts for 5 to 60% by weight, preferably 42% by weight. The transparent heat-insulating adhesive is applied to a transparent substrate, such as a polyethylene terephthalate film (PET film), and dried at 120 ° C for 2 minutes, and then subjected to UV exposure. A transparent heat-insulating film is obtained.

[0058]

The heat insulating film of the foregoing embodiment is described by taking the heat insulating layer and the hardened layer into the same structural layer as an example, so that the dispersed slurry is mixed with the photosensitive acrylic resin, and finally the adhesive layer and the release form can be formed. The membrane completes the thermal insulation film that can be adhered by the user. Of course, the heat insulating layer may be integrated into the same structural layer as the adhesive layer (that is, the dispersion slurry is mixed with the pressure sensitive adhesive), and may also be applied to the structure of the double-layered substrate, which will not be described herein.

[0059]

In one embodiment, the substrate has a thickness of about 50 μm, the thickness of the insulating layer integrated into the same structural layer with the hardened layer is about 3 μm, the thickness of the adhesive layer is about 8 μm, and the thickness of the release film is about 23 μm. Of course, the thickness of each structural layer can be adjusted according to requirements without limitation.

[0060]

The transparent heat-insulating film obtained according to the above steps has excellent infrared high barrier properties and high visible light transmittance. The evaluation of the physical properties of the transparent insulating film in this case is based on the following test methods.

[0061]

Visible Light Transmittance (VLT%) Test: The visible light transmittance of a transparent heat-insulating film was tested using a transmittance spectrometer (HITACHI/U-4100) according to the JIS R3106 test standard. The higher the visible light transmittance, the better the transparency of the transparent heat-insulating film.

[0062]

Infrared rejection rate (IR rejection%) test: The infrared ray rejection rate of the transparent heat-insulating film was tested using a transmittance spectrometer (HITACHI/U-4100) according to the JIS R3106 test standard. The test result is that the higher the infrared blocking rate, the better the heat insulation effect of the transparent heat insulating film.

[0063]

Visible light transmittance and total infrared ray rejection index (VLT%+IR rejection%): the sum of the above two measured data, the higher the value, the better the transparency and heat insulation effect.

[0064]

The following examples are given to further illustrate the method for producing a thermal barrier film and its physical property measurement.

[0065]

Example 1:

[0066]

The appropriate amount of tungstic acid and hydrogen peroxide are uniformly mixed into a melt at a suitable temperature of 30-50 ° C, and then the residual hydrogen peroxide is catalyzed and decomposed into oxygen and water by a platinum catalyst network to obtain a solution. A. Next, tetrabutylammonium hydroxide was added to an ethanol solution to prepare a 25% tetramethylammonium hydroxide-ethanol solution B. The solution A and the solution B were precipitated by a coprecipitation method, and then the precipitate was aged for 12 hours, and then dried by heating at 60 ° C to obtain a carbon-doped WO ₃ precursor. Then, it is sintered at a heating rate of 2 ° C per minute for 1 hour under a hydrogen atmosphere of 500 ° C. After the heat treatment is completed, a monoclinic composite tungsten oxycarbide powder is obtained, wherein the carbon doping amount is 0.82 atom. percentage.

[0067]

After that, the composite tungsten oxycarbide powder is ground into a fine powder, and then a solution of 27% by weight is added to a butanone solvent, and a polymer type dispersant having a weight ratio of 10% is added, and 100 μm of cerium oxide cerium oxide is used. The bead ball mill obtained a composite tungsten oxycarbide dispersion slurry containing a particle diameter of less than 65 nm. The dispersing slurry was combined with photosensitive acrylic resin to form a transparent insulating rubber with a weight ratio of 42%, and the transparent insulating rubber was applied by wet coating to a 50 μm PET film at 120 μm. After drying at ° C for 2 minutes, a transparent heat-insulating film was obtained after the UV exposure was applied.

[0068]

Further, the transparent heat insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared blocking rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and the IR blocking rate%=88. %, 1000 hr QUV test IR rejection rate% = 85%, so the IR rejection rate is about 3%.

[0069]

Example 2:

[0070]

5.3 g of tungsten hexachloride was dissolved in 500 ml of ethanol to prepare a solution A, and 0.5 g of cerium chloride was mixed with 100 ml of ethanol to prepare a solution B, and then the solution A and the solution B were mixed to form a solution C. Using a 248 nm KrF excimer laser for solution C at a fixed frequency of 8 HZ and an energy of 10 mJ, pulsed irradiation for 30 minutes was performed to obtain a composite tungsten-oxygen chloride precursor, and then the precursor was placed under a hydrogen atmosphere of 500 ° C. The heating rate was sintered at a rate of 2 ° C per minute for 1 hour, and after the heat treatment was completed, a composite tungsten oxychloride powder was obtained in which the carbon doping amount was 0.63 atomic percent.

[0071]

After that, the composite tungsten oxychloride powder is ground into a fine powder, and then added to a solution of 27% by weight in a butanone solvent, and a polymer dispersant having a weight ratio of 10% is added, and 100 μm of cerium oxide is used. The zirconium bead mill obtained a composite tungsten oxychloride dispersion slurry having a particle diameter of less than 65 nm. The dispersing slurry was combined with photosensitive acrylic resin to form a transparent insulating rubber with a weight ratio of 42%, and the transparent insulating rubber was applied by wet coating to a 50 μm PET film at 120 μm. After drying at ° C for 2 minutes, a transparent heat-insulating film was obtained after UV exposure.

[0072]

Further, the transparent heat insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared blocking rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and the IR blocking rate%=89. %, 1000 hr QUV test IR rejection rate% = 87%, so the IR rejection rate declines by about 2%.

[0073]

Example 3:

[0074]

This example is substantially the same as Example 1, except that solution B is a tetramethylammonium hydroxide-ethanol solution prepared by adding tetrabutylammonium hydroxide to an ethanol solution. The composite tungsten oxycarbide powder obtained in the present example was examined, and it was found that the carbon doping amount was 0.91 atomic percent. Further, the transparent heat-insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared rejection rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and IR rejection rate%=83. %, 1000 hr QUV test IR rejection rate% = 80%, so the IR rejection rate declines by about 3%.

[0075]

Example 4:

[0076]

This example is substantially the same as Example 1, except that the solution B is a solution of tetrabutylammonium hydroxide added to an ethanol solution and mixed into a 20% tetramethylammonium hydroxide-ethanol solution. The composite tungsten oxycarbide powder obtained in the present example was examined, and it was found that the carbon doping amount was 0.72 atomic percent. Further, the transparent heat-insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared blocking rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and the IR blocking rate%=90. %, 1000 hr QUV test IR rejection rate% = 88%, so the IR rejection rate declines by about 2%.

[0077]

Example 5:

[0078]

This example is substantially the same as Example 1, except that the powder sintering temperature is 600 °C. The composite tungsten oxycarbide powder obtained in the present example was examined, and it was found that the carbon doping amount was 0.82 atomic percent. Further, the transparent heat-insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared blocking rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and the IR blocking rate%=90. %, 1000 hr QUV test IR rejection rate% = 88%, so the IR rejection rate declines by about 2%.

[0079]

Example 6

[0080]

This example is substantially the same as Example 1, except that the powder sintering temperature is 400 °C. The composite tungsten oxycarbide powder obtained in the present example was examined, and it was found that the carbon doping amount was 0.84 atomic percent. Further, the transparent heat-insulating film obtained in the present example was measured for visible light transmittance (VLT%) and infrared blocking rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and IR rejection rate=82. %, 1000 hr QUV test IR rejection rate% = 79%, so the IR rejection rate is about 3%.

[0081]

Example 7

[0082]

This example is substantially the same as Example 2 except that the solution B is prepared by mixing 0.4 g of cerium chloride with 100 ml of ethanol. The composite tungsten oxychloride powder prepared in the present example was examined, and it was found that the carbon doping amount was 0.65 atomic percent. Further, the transparent heat-insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared rejection rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and IR rejection rate%=83. %, 1000 hr QUV test IR rejection rate% = 81%, so the IR rejection rate declines by about 2%.

[0083]

Example 8

[0084]

This example is substantially the same as Example 2 except that the solution B is prepared by mixing 0.6 g of cerium chloride with 100 ml of ethanol. The composite tungsten oxychloride powder prepared in the present example was examined, and it was found that the carbon doping amount was 0.61 atomic percent. Further, the transparent heat-insulating film prepared in the present example was measured for visible light transmittance (VLT%) and infrared blocking rate (IR rejection %) at a wavelength of 300 to 2500 nm, and the measurement result showed that VLT%=70%, and the IR blocking rate%=90. %, 1000 hr QUV test IR rejection rate% = 87%, so the IR rejection rate is about 3%.

[0085]

It can be seen from the above embodiments that the transparent heat insulating film prepared by using the composite tungsten oxycarbide or the composite tungsten oxychloride as the heat insulating material has a visible light transmittance of 70% at a wavelength of 300 to 2500 nm. The infrared blocking rate is 80-90%, that is, the visible light transmittance and the total infrared ray rejection index (VLT%+IR rejection%) are between 150 and 160, which confirms the composite tungsten oxycarbide or composite in this case. Tungsten Oxychloride is suitable as a heat-insulating material for blocking infrared rays, and is suitable for making transparent heat-insulating film. It has excellent barrier properties for infrared wavelengths of 1000~2500 nm, and for visible wavelengths of 400-780 nm. The display has better visible light transmittance.

[0086]

Furthermore, the transparent heat-insulating films of Examples 1 to 8 deteriorated by less than 5% or even only 2% after a 1000-hour QUV aging test, demonstrating that the transparent heat-insulating film of the present invention has long-term quality stability and greatly improved transparency. Reliability of the use of thermal insulation film.

[0087]

On the other hand, from the measurement results of the first embodiment, the third embodiment, and the fourth embodiment, it is understood that the composite tungsten oxycarbide preparation method of the present invention is prepared by adjusting the amount of carbon added and the heat treatment under a suitable high temperature furnace. The physical properties of the tungsten oxycarbide material will exhibit different infrared ray rejections as the carbon content changes. Among them, the thermal barrier film (that is, the carbon doping amount of 0.72 atomic percent) prepared by using a 20% tetramethylammonium hydroxide-ethanol solution has the highest infrared blocking ratio.

[0088]

Further, from the measurement results of Example 2 and Examples 7 to 8, it can be seen that the composite tungsten-oxygen chloride method of the present invention can be prepared by adjusting the amount of the base metal element in a suitable high-temperature furnace heat treatment condition. The physical properties of the carbon chloride material will exhibit different infrared ray rejection rates as the co-doping ratio changes, and a suitable concentration of cerium content can produce a transparent heat-insulating film with better infrared ray rejection.

[0089]

In summary, the composite tungsten oxycarbide or composite tungsten oxychloride provided in the present invention has excellent infrared ray blocking properties and good visible light transmittance, so it is suitable for making a transparent transparent thermal insulation film. The visible film has a visible light transmittance of 70% and an infrared blocking rate of more than 80%. It can be applied to the glass of buildings and automobiles to achieve thermal insulation and energy saving. The method of the present invention can produce composite tungsten oxide carbide or composite tungsten oxide carbon chloride thermal insulation film with different heat insulation and visible light transmittance according to different uses and needs in the market. The transparent heat-insulating film prepared by using the composite tungsten oxycarbide or the composite tungsten oxycarbon chloride has the following characteristics: 1. Only one-time sintering heat treatment is required in the preparation method, the process is simple and the cost can be saved; 2. The thermal insulation film has excellent infrared blocking rate and visible light transmittance; 3. The obtained thermal insulation film has long-term quality stability, and the reliability of use is greatly improved, so it can be utilized in the industry. Therefore, this case is of great industrial value and is submitted in accordance with the law.

[0090]

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

10‧‧‧Insulation film

11‧‧‧Substrate

12‧‧‧Insulation

Claims (10)

[Item 1] A thermal insulation film comprising:
a substrate; and a heat insulating layer formed on the substrate, mainly composed of a heat insulating material, wherein the heat insulating material comprises a composite tungsten oxycarbide or a composite tungsten oxychloride, the composite The tungsten oxycarbide or the composite tungsten oxychloride has carbon doping and a carbon doping content of 1 atomic percent or less. [Item 2] The thermal insulation film of claim 1, wherein the carbon doping content is between 0.5 and 1 atomic percent. [Item 3] The thermal insulation film according to claim 1, wherein the composite tungsten oxycarbide has a chemical formula of WO _3-y -x(at%)C, wherein C is doped carbon, W is tungsten, and O is oxygen. , x, y are both positive numbers, and meet the following conditions: 0 < x ≦ 1 and 0 < y ≦ 0.6. [Item 4] The thermal insulation film according to claim 1, wherein the chemical formula of the composite tungsten oxychloride is Cs _a WO _3-y Cl _b -x(at%)C, wherein C is doped carbon and Cs is铯, W is tungsten, O is oxygen, Cl is chlorine, and x, y, a, and b are all positive numbers, and the following conditions are met: 0<x≦1;0<y≦0.5;0<a≦1 and 0< b≦0.5. [Item 5] The heat-insulating film of claim 1, wherein the heat-insulating film further comprises an adhesive layer formed on the bottom layer of the substrate and composed of pressure sensitive adhesive. [Item 6] The thermal insulation film of claim 5, wherein the thermal insulation layer is integrated with the adhesive layer into the same structural layer. [Item 7] The thermal insulation film of claim 1, wherein the thermal insulation film further comprises a release film formed on the bottommost layer of the substrate. [Item 8] The heat insulating film according to claim 1, wherein the heat insulating film further comprises a hardened layer formed on the topmost layer of the substrate and composed of a photosensitive acrylic resin. [Item 9] The heat insulation film of claim 8, wherein the heat insulation layer is integrated with the hardened layer into the same structural layer. [Item 10] The thermal insulation film of claim 1, wherein the thermal insulation film comprises a two-layer substrate, the thermal insulation layer is formed between the two-layer substrate, and the thermal insulation layer further comprises a pressure sensitive adhesive. Or glue the glue.