TWM594175U - Computer host - Google Patents

Abstract

A computer host includes a casing, a circuit unit and a heat dissipation unit. The cabinet includes a bottom wall, two side walls, a front wall, a rear wall, and an upper cover. The upper cover and the rear wall together form an air outlet, and the rear wall is provided with a plurality of air inlet holes. The circuit unit includes a first circuit board perpendicular to the bottom wall and leaning against the rear wall, and a second circuit board parallel to the bottom wall and close to the upper cover and the rear wall. The first circuit board is provided with a plurality of card connectors, and the second circuit board With a processor. The heat dissipation unit includes a heat dissipation module and a fan module. The heat dissipation module is disposed on the second circuit board and corresponds to the air outlet. The fan module is located on the side of the heat dissipation module near the front wall and includes a plurality of fans. The wall is inclined to absorb air obliquely toward the front wall and the bottom wall and blow air toward the upper cover and the heat dissipation module. In this way, a single air duct that can pass through different heat source areas is formed.

Description

Computer host

The present invention relates to a computer host, especially a computer host with a heat dissipation system.

In recent years, the computing speed of computer mainframes for processing information has been continuously improved, which also makes the electronic components in the system more likely to heat up. How to quickly dissipate heat to avoid overheating and damage of electronic components is also a subject that needs continuous improvement as the computing speed of the computer mainframe continues to increase.

The heat source of a general computer host is mainly a processor (CPU) and an expansion card, such as a display card, a network card, an image capture card, etc. The current common heat dissipation system is to provide a heat dissipation device for the processor and the expansion card, respectively, to Heat energy is discharged from the casing. Among them, the heat dissipation method for the processor is conducted through a large aluminum heat sink or a dedicated cooler, and then dissipated by the fan, and for the expansion card is dissipated by the fan or the heat sink fin.

However, if fans are set separately for the processor and expansion card, the number of fans required for the entire computer host is not only increased cost and noise interference, but also the chassis design needs to reserve more space to install fans and establish air ducts, different heat sources The air duct in the chassis is likely to cause wind turbulence.

Therefore, one of the purposes of the present invention is to provide a computer host that can solve the aforementioned problems.

Therefore, in some implementations, the new computer host includes a casing, a circuit unit, and a heat dissipation unit. The cabinet includes a bottom wall, two side walls, a front wall, a rear wall and an upper cover, the two side walls are connected to the left and right sides of the bottom wall relative to each other, the front wall and the rear wall are connected to each other opposite to each other On the front and rear sides of the bottom wall, the upper cover connects the two side walls and the front wall opposite to the bottom wall, and forms an air outlet with the rear wall, and the rear wall is provided with a plurality of air inlet holes. The circuit unit is disposed in the casing, and includes a first circuit board perpendicular to the bottom wall and leaning to the rear wall, and a second circuit board parallel to the bottom wall and close to the upper cover and the rear wall, the The first circuit board is provided with a plurality of card connectors, the second circuit board is electrically connected to the first circuit board, and a processor facing the upper cover is provided. The heat dissipation unit includes a heat dissipation module and a fan module. The heat dissipation module is disposed on the second circuit board and is located between the second circuit board and the upper cover and corresponds to the air outlet. The fan module is located on the heat dissipation The module is close to one side of the front wall and includes a plurality of side-by-side fans that are inclined relative to the bottom wall to obliquely draw air toward the front wall and the bottom wall and blow air toward the upper cover and the heat dissipation module .

In some embodiments, the upper cover has a top wall opposite to the bottom wall and two extension walls bent from two sides of the top wall and connected to the two side walls, the fan module further includes a fixing A frame and a fan frame. The fixing frame has two connecting walls facing each other and respectively connected to the two extension walls. The fans are fixed to the fan frame, and the two sides of the fan frame are respectively connected to the connecting walls.

In some embodiments, the fixing frame further has an inclined wall connecting the two connecting walls and close to the heat dissipation module for the fan frame to bear against.

In some embodiments, the heat dissipation module has a base and a plurality of fins disposed on the base and parallel to the side walls. The base and the upper cover together form an air duct that communicates with the air outlet.

In some embodiments, the fins are located in the air duct and expose the air vent.

The present invention has the following effects: through the arrangement relationship between the circuit unit and the heat dissipation unit, a single air duct that can pass through different heat source areas is formed, which not only reduces the number and area of fan settings, effectively improves fan performance and reduces overall power consumption and noise Interference can also reduce the cost of building fans and increase the space utilization inside the cabinet.

Referring to FIGS. 1 to 3, an embodiment of the new computer host 100 includes a casing 1, a circuit unit 2 and a heat dissipation unit 3.

The cabinet 1 includes a bottom wall 11, two side walls 12, a front wall 13, a rear wall 14 and an upper cover 15. The rear wall 14 is provided with a plurality of air inlet holes 141. In this embodiment, the air inlet holes 141 are arranged in multiple rows. The two side walls 12 are connected to the left and right sides of the bottom wall 11 opposite to each other, the front wall 13 and the rear wall 14 are connected to the front and rear sides of the bottom wall 11 opposite to each other, and the upper cover 15 is connected to the bottom wall 11 oppositely The two side walls 12 and the front wall 13 together with the rear wall 14 form an air outlet 16. In this embodiment, the upper cover 15 has a top wall 151 opposite to the bottom wall 11 and two extension walls 152 respectively extending from two sides of the top wall 151 bent and connected to the two side walls 12.

The circuit unit 2 is disposed in the casing 1 and includes a first circuit board 21 perpendicular to the bottom wall 11 and leaning against the rear wall 14, and a parallel to the bottom wall 11 and close to the upper cover 15 and the rear wall 14的second circuit board 22. The first circuit board 21 is provided with a plurality of card connectors 211, the second circuit board 22 is electrically connected to the first circuit board 21 and is provided with a processor 221 facing the upper cover 15. In this embodiment, the first circuit board 21 is fixed to one of the side walls 12, and the second circuit board 22 is located on the top side of the first circuit board 21 and is perpendicular to the first circuit board 21. The card connectors 211 are used to insert expansion cards (not shown), such as display cards, network cards, and image capture cards.

The heat dissipation unit 3 includes a heat dissipation module 31 and a fan module 32. The heat dissipation module 31 is disposed on the second circuit board 22 and is located between the second circuit board 22 and the upper cover 15 and corresponds to the air outlet 16. In this embodiment, the heat dissipation module 31 has a base 311 and a plurality of fins 312 disposed on the base 311 parallel to the side walls 12. The base 311 and the upper cover 15 together form an air outlet 16 In the communicating gas channel, the fins 312 are located in the gas channel and expose the air outlet 16. The fan module 32 is located on a side of the heat dissipation module 31 close to the front wall 13 and includes a fixing frame 33, a fan frame 34 and a plurality of fans 35. The fixing frame 33 has two connecting walls 331 opposite to each other, an inclined wall 332 connecting the two connecting walls 331 close to the heat dissipation module 31, and a connecting wall connecting the two connecting walls 331 and located on opposite sides of the inclined wall 332横接壁333. The fans 35 are fixed to the fan frame 34 and arranged side by side. One side of the fan frame 34 abuts against the inclined wall 332 and the two sides of the fan frame 34 are respectively connected to the connecting walls 331 to thereby connect with the fixing frame 33 combined fixed. The two connecting walls 331 of the fixing frame 33 are respectively connected to the two extending walls 152 of the upper cover 15, so that the fan module 32 is combined with the upper cover 15 to facilitate assembly. That is, the fan module 32 and the upper cover 15 are assembled together first, and then the upper cover 15 and the two side walls 12 are assembled to fix the fan module 32 in the cabinet 1. When the fan module 32 is fixed in the cabinet 1, the fans 35 are inclined relative to the bottom wall 11 to obliquely draw air toward the front wall 13 and the bottom wall 11 and toward the upper cover 15 and the heat dissipation Module 31 blows. In this embodiment, the inclination angle of the rotation axis of the fans 35 relative to the bottom wall 11 is 45 degrees. In the changed embodiment, the angles of the rotating shafts of the fans 35 relative to the bottom wall 11 may be other angles between 25 degrees and 75 degrees, which is not limited to this embodiment.

As shown by the arrows representing the airflow in FIG. 4, when the fans 35 operate, external air can be sucked in through the air inlet 141 located on the rear wall 14 to form an airflow, and the incoming airflow is first set through the first circuit board 21 The area of the card connector 211, that is, the area where the expansion card is provided, some expansion cards generate heat energy during operation, and the heat energy generated by the expansion card can be taken away by the airflow, and by the inclined arrangement of the fans 35 The airflow passing through the expansion card area is sucked in and blown toward the upper cover 15 and the fins 312, and is guided into the gas channel by the upper cover 15 and discharged from the air outlet 16. In this way, only a single airflow is formed in the chassis 1 that can pass through the expansion card area and the processor 221 area, that is, the air ducts that pass through different heat source areas are integrated into one, which not only reduces the number and area of the fans 35, but also effectively Improving the efficiency of the fan 35 and reducing the overall power consumption and noise interference can also reduce the cost of installing the fan 35 and increase the space utilization rate inside the cabinet 1.

In summary, through the arrangement relationship between the circuit unit 2 and the heat dissipation unit 3, a single air duct that can pass through different heat source areas is formed, which not only reduces the number and area of the fans 35, but also effectively improves the performance of the fan 35 and reduces the overall power. Consumption and noise interference can also reduce the cost of installing the fan 35 and increase the space utilization rate inside the cabinet 1.

However, the above are only examples of the new model. When the scope of the new model cannot be limited by this, any simple equivalent changes and modifications made according to the patent application scope and patent specification content of the new model are still regarded as Within the scope of this new patent.

100: computer host 1: chassis 11: bottom wall 12: Side wall 13: front wall 14: Rear wall 141: Air inlet 15: upper cover 151: top wall 152: Extension wall 16: exhaust vent 2: Circuit unit 21: The first circuit board 211: Card connector 22: Second circuit board 221: processor 3: cooling unit 31: Cooling module 311: Base 312: Fin 32: Fan module 33: fixed frame 331: Link wall 332: Inclined wall 333: Cross wall 34: Fan bracket 35: Fan

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: 1 is a perspective view of an embodiment of the new computer host; 2 is an exploded perspective view of the embodiment, in which some elements are not shown; Figure 3 is a further exploded view of Figure 2; and Fig. 4 is a cross-sectional view of one of the embodiments.

100: computer host

1: chassis

11: bottom wall

12: Side wall

13: front wall

14: Rear wall

141: Air inlet

15: upper cover

16: exhaust vent

2: Circuit unit

21: The first circuit board

211: Card connector

22: Second circuit board

221: processor

3: cooling unit

31: Cooling module

32: Fan module

33: fixed frame

35: Fan

Claims (5)

A computer host, including: A cabinet including a bottom wall, two side walls, a front wall, a rear wall and an upper cover, the two side walls are connected to the left and right sides of the bottom wall relative to each other, the front wall and the rear wall are connected to each other relative to each other On the front and rear sides of the bottom wall, the upper cover connects the two side walls and the front wall opposite to the bottom wall, and forms an air outlet with the rear wall, and the rear wall is provided with a plurality of air inlet holes; A circuit unit, disposed in the casing, and including a first circuit board perpendicular to the bottom wall and leaning to the rear wall, and a second circuit board parallel to the bottom wall and close to the upper cover and the rear wall, The first circuit board is provided with a plurality of card connectors, the second circuit board is electrically connected to the first circuit board and is provided with a processor facing the upper cover; and A heat dissipation unit includes a heat dissipation module and a fan module. The heat dissipation module is disposed on the second circuit board and is located between the second circuit board and the upper cover and corresponds to the air exhaust port. The fan module is located on the The heat dissipation module is close to one side of the front wall and includes a plurality of side-by-side fans that are inclined relative to the bottom wall to obliquely draw air toward the front wall and the bottom wall and toward the upper cover and the heat dissipation module Hair dryer. The computer main body according to claim 1, wherein the upper cover has a top wall opposite to the bottom wall and two extension walls respectively bent from two sides of the top wall and connected to the two side walls, and the fan module It also includes a fixing frame and a fan frame, the fixing frame has two connecting walls opposite to each other and connected to the two extension walls respectively, the fans are fixed to the fan frame, and the two sides of the fan frame are respectively connected to the fan frames壁连接。 Wall connection. The computer host according to claim 2, wherein the fixing frame further has an inclined wall connecting the two connecting walls and close to the heat dissipation module for the fan frame to bear against. The computer main body according to claim 1, wherein the heat dissipation module has a base and a plurality of fins disposed on the base and parallel to the side walls, the base and the upper cover together form a communication with the air outlet Wind tunnel. The computer main body according to claim 4, wherein the fins are located in the air duct and expose the air vent.

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