TWM543457U - Multi-grain Pressing machine - Google Patents

Description

Multi-die press

The present invention is a technical field of a multi-grain press, in particular, a design in which a large number of micro-grains are sucked and subjected to a pressure welding operation under a micro-pitch condition.

LED components are currently the most widely used light-emitting components. If RGB three different wavelengths of LEDs are placed together, the intensity of each LED can be controlled by light intensity to emit light of various colors. At present, outdoor or indoor large LED kanban, it is composed of RGB three colors to form a light source (size about 2~4mm), and multiple light sources are distributed in an array of spacing (about 5~15mm), which can be produced. Large screen for long distance viewing. The more the number of light sources distributed in the cell area, the higher the resolution.

Similarly, if micro-sized (about 0.01~0.1mm) RGB micro LED dies are assembled together to form an illuminating source of about 0.05~0.25mm, the complex illuminating sources are distributed in an array of pitches (about 0.05~0.5mm). Put it on, you can form a high-resolution LED screen. For example, the resolution of the 50-inch TV 4k scan line is 1000mm/4000=0.25mm, so the resolution of the pitch of 0.1mm will be higher than that of the 4k*2k TV. It can be used in a variety of special display applications such as wearable device displays, VR displays, etc.

However, how to put a small size of 0.01mm~0.1mm LED micro-die on RGB three-color to the screen substrate and solder the positive and negative poles of each LED micro-die is a technical bottleneck encountered by the LED industry. . For example, 4K TV, a 50-inch screen with a 0.05mm-size illumination source, requires more than 100 million RGB LED micro-die. If one-piece welding is used, the efficiency is poor and there is no commercial advantage. Therefore, manufacturers are constantly developing various types of equipment, in the hope that the equipment can perform 100~10000 micro-die suction and welding operations at one time.

The main purpose of this creation is to provide a multi-die press machine, which mainly provides a micro-die which can absorb 100-10000 LEDs at a time and is transferred to a receiving substrate having positive and negative wirings and lines, and the receiving substrate can be For the display substrate or the illumination substrate, etc., the micro-grains are then accurately positioned and pressed and the die is soldered to the receiving substrate at a high temperature.

For the above purposes, the creation includes: a substrate, a horizontal moving stage and a gantry bracket, the horizontal moving stage is mounted on the base, and can be precisely moved in a horizontal direction, and the horizontal moving stage is additionally mounted separately a rotating three-grain rotating table and a substrate rotating table; the gantry bracket is erected on the base and does not interfere with the movement of the horizontal moving stage, the gantry bracket is mounted with a lifting mechanism, and the lifting mechanism can control a suction Lifting the head, the suction head includes at least one suction unit and a rotating unit from bottom to top; and the horizontal moving stage accurately moves the die rotating table or the substrate rotating table below the suction head at different times, The lifting mechanism timely controls the lowering of the suction head, so that the suction head absorbs the plurality of micro-grains on the crystal rotating table at a time, or presses the plurality of micro-grains on the receiving substrate of the substrate rotating table. .

Since the present invention mounts the microchips on the receiving substrate at a micron pitch, in order to overcome the limitation of the positioning accuracy of the conventional packaging device alignment components by 10 μm, the accuracy of the horizontal position of the creation is performed by the horizontal moving stage, and the horizontal movement is currently performed. The accuracy of the stage is up to the nanometer level, and the lifting mechanism is only responsible for the rise of the suction head, so that the operation of mounting the microchips on the receiving substrate at a micron pitch can be satisfied.

Furthermore, the suction head of the present invention further comprises a suction unit, a heating unit, a heat insulation unit and a rotation unit which are sequentially combined from bottom to top, by which the plurality of micro-grains can be sucked at one time and decreased in another. At the timing, the heating unit can be heated in time, so that thermal energy is conducted to the micro-die through the suction unit to complete the welding to the receiving substrate, and is an innovative and practical special suction head design.

The implementation of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement the present specification after studying the present specification.

The present written embodiment describes a multi-die press machine, which in various embodiments is described in a simple, schematic reference pattern in which the components present their positions and their spatial patterns in a simple square, and The detailed mechanism, machine and structure of each component are not specifically drawn. Such components can be realized by using the actual machine, but they are not limited. As used herein, the term "micro" dies is a descriptive size of certain elements or structures according to the presently-created embodiments, with reference dimensions ranging from 5 μm to 200 μm. The receiving substrate is for mounting on the micro-array array, and the receiving substrate refers to a substrate for a display screen.

As shown in FIG. 1 and FIG. 2 , the schematic diagram of the side structure of the creation and the schematic view of the base are shown. The multi-grain press machine of the present invention comprises: a base 1, a horizontal moving stage 2 and a gantry support 3. The horizontal moving stage 2 is mounted on the base 1 and carries three die rotating stages 21, 22, 22 and a substrate rotating table 24 which are independently rotatable. The gantry bracket 3 is mounted above the base 1 and is mounted with a lifting mechanism 31 capable of controlling the lifting and lowering of a suction head 4. Thereby, the horizontal moving stage 2 is accurately moved and adjusted to adjust the position of each of the rotating stages, and the picking head 4 is appropriately raised and lowered, so that the micro-grains are sequentially sucked up, waited, lowered, pressurized and heated to be welded and fixed. Since the architecture of the creation can accurately control the position of each component, the welding operation of 100 to 1000 crystal grains is completed at one time, and under the condition of micrometer pitch, it is satisfied that the micro-grain is completed on the receiving substrate. Welding fixed work.

Then explain the operation mode and structure of each component:

The pedestal 1 is a granite rock platform to ensure that the precision of the machine is not affected by microseisms.

The horizontal moving stage 2 is mounted on the base 1 so as to be accurately moved in the horizontal (X-Y axis) direction. The horizontal moving stage 2 is additionally provided with three crystal rotating stages 21, 22, 23 and a substrate rotating table 24 which are independently rotatable. The crystal rotating tables 21, 22, 23 can precisely control the rotation angle thereof, respectively for carrying three crystal carrier plates (not shown), and the three crystal carrier plates are respectively placed with red light micro Grain, green micro-grain, and blue micro-grain. The creation is to further correct the orientation of the grain rotating table 21, 22, 23 by means of precise rotation. The substrate rotating table 24 can also accurately control the rotation angle thereof for carrying the receiving substrate (not shown) for receiving micro-crystals of different colors. In this embodiment, the moving stage and the rotating table are all high-precision machines, which are commonly used in the industry, and therefore will not be described in detail. In addition, the horizontal moving stage 2 is further mounted with a first alignment lens group 25, and the first alignment lens group 25 is photographed upwards for capturing the image of the suction head 4, and analyzing the operation through the internal software. The suction head 4 is then driven to rotate to correct its position.

The gantry bracket 3 has a U-shaped shape and is mounted across the base 1 without interfering with the movement of the horizontal moving stage 2. The lifting mechanism 31 is mounted at a central position of the gantry bracket 3, and the lifting mechanism 31 is configured to control the lifting and lowering of the suction head 4 at the bottom thereof. The suction head 4 has two functions: one is to accurately suck 100 to 1000 micro-grains at a time, and the second, during the lowering process, the pressing and heating welding operations are performed. In addition, the gantry bracket 3 is further mounted with a second alignment lens group 33, and the second alignment lens group 33 is photographed downward, when the crystal rotary table 21, 22, 23 or the substrate rotary table 24 is horizontally When the moving stage 2 is moved to the lower position, the image is captured by the second alignment lens group 33, and the operation and analysis of the internal software is driven to drive the die rotating table 21, 22, 23 or the substrate rotating table 24 to rotate. To correct its position, then perform the origin alignment and record the origin of the computer.

As shown in FIG. 3, it is a schematic side view of the suction head of the first embodiment of the present invention. The suction head 4 includes a rotating unit 41, a heat insulating unit 42, a heating unit 43, and a suction unit 44 which are sequentially combined from top to bottom. The rotating unit 41 is a high-precision rotating shaft, thereby controlling the orientation of the suction unit 44. The thermal insulation unit 42 includes a cooling plate 421 connected from top to bottom and a thermal insulation layer 422. The thermal insulation layer 422 is made of a material having a poor thermal conductivity to prevent heat from being transmitted upward. The cooling plate 421 is additionally connected to a cooling pipe (not shown), so that the cooling plate 421 has a cooling effect to avoid affecting the operation of the rotating unit 41. The heating unit 43 is used to quickly raise the temperature of the suction unit 44 to facilitate the micro-die welding operation. The heating mode of the heating unit 43 includes contact heating and non-contact heating. The contact heating system is provided with an electric heating device (not shown) inside the heating unit 43, and the rest of the interior is made of a metal having good heat transfer property, thereby rapidly heating up. The non-contact heating further includes a laser emitting unit 45 (shown in FIG. 4) having a blind hole 431 corresponding to the position of the laser emitting unit 45, the bottom of which is located at the bottom of the blind hole 431. The central position of the heating unit 43 transmits a light source of a specific wavelength to the blind hole 431 through the laser emitting unit 45, so that the heating unit 43 is rapidly heated, and the temperature rising efficiency in this manner is faster. Since the suction unit 44 and the heating unit 43 are combined, when the temperature of the heating unit 43 rises rapidly, the suction unit 4 also rises synchronously.

As shown in FIGS. 3 and 4, the suction unit 44 includes a porous suction cup 441 and a metal indenter 442 connected from bottom to top. As shown in FIGS. 5 and 6, the porous suction cup 441 has a plurality of longitudinal air passages 4411 therein and a plurality of contact pads 4412 on the bottom surface. Each of the outlets of the air passages 4411 corresponds to a contact pad 4412. The porous suction cup 441 and the bottom The metal indenter 442 meets with a plurality of transverse air passages 4413 at the top end of the longitudinal air passage 4411, thereby communicating the longitudinal air passages 4411. The inside of the metal indenter 442 has a vacuuming device (not shown) which can be connected to the outside of the pipe 4421. The plurality of longitudinal air passages 4411 are connected to the pipe 4421, thereby generating a vacuum in time to suck the crystal grains. The contact pad 4412 can be made of pure gold with the same pitch size as the micro die.

Then make a brief description of how this creation works:

This embodiment is a display screen for forming an LED, which is a micro-sized (about 0.01-0.1 mm) R, G, B micro LED die assembled to form a light source of about 0.05 to 0.25 mm. The light sources are distributed in an array of pitches (about 0.05 to 0.5 mm) to form a high-resolution LED screen.

Three die carriers carrying red micro micro crystals, green micro micro crystals, and blue micro crystal grains are respectively placed on the corresponding crystal rotating stages 21, 22, and 23, and the receiving substrate to be mounted is It is placed on the substrate rotating table 24.

First, the correcting operation is performed. The horizontal moving stage 2 sequentially moves the die rotating tables 21, 22, 23 and the substrate rotating table 24 directly below the second alignment lens group 33 to confirm the loaded die load. Whether the position of the disc and the receiving substrate is correct, if not, and start the rotating table to rotate an angle to correct to the correct orientation. Similarly, the first alignment lens group 25 is moved from the horizontal movement stage 2 directly below the suction head 4, and it is confirmed whether the position of the suction unit 44 is correct. If not, the rotation unit 41 is rotated by an angle to correct The suction unit 44 is in the correct orientation. Each of the above axes will perform the origin alignment and the computer will record the origin position. .

Then, the die transfer operation is performed: firstly, the die rotating table 21 carrying the red light micro die is moved directly below the suction unit 4, and the lifting mechanism 31 controls the suction head 4 to descend, and the suction unit 44 is used once. Draw 100~1000 red micro-grains, and then rise to standby after sucking.

Then, the substrate rotating table 24 is moved to directly below the suction head 4 by the horizontal moving stage 2.

The lifting mechanism 31 is again actuated to lower the suction head 4, so that the red micro-die can be mounted on the receiving substrate having positive and negative wirings and lines. The receiving substrate is also provided with a paste or solder at a relative position. Then, the heating unit 43 is heated up, and the suction unit 44 is simultaneously heated to fuse the red crystal grain onto the receiving substrate. After the vacuum suction state of the suction unit 44 is released, the suction head 4 is again raised.

Similarly, the crystal rotating table 22 carrying the green micro-grain is moved from the horizontal moving stage 4 to the bottom of the suction unit 4, sequentially sucking the micro-grain rises, waiting for the lower-fabrication welding to the On the receiving substrate, the welding operation of the green micro-die is completed. Similarly, the blue micro-die also performs the soldering operation in the same manner. Of course, it is also possible to solder all the micro-dies of a specific color to the receiving substrate, and then perform the welding operation of the other color micro-grains. With this creation, the micro-die welding can be performed in large quantities at a time, and after many operations, commercialization is performed to process a large number of light-emitting diodes on a display screen, and finally reach a high-resolution light-emitting diode screen. Production purpose.

As shown in FIG. 7 , a schematic view of the side structure of the suction head according to the third embodiment of the present invention. In the present embodiment, the suction head 4 includes a rotating unit 41 , an insulating unit 42 , which are sequentially combined from top to bottom, and A suction unit 44 does not have the structure of the heating unit in this embodiment. Therefore, in the embodiment, the suction head 4 is mainly responsible for placing the die and mounting it on the receiving substrate, and then performing heating on the die and the receiving substrate. The welding hardening operation is performed, so the heat insulating unit 42 can also be omitted.

The above description is only for the purpose of explaining the preferred embodiment of the present invention, and is not intended to impose any form of limitation on the creation, so that any modification or alteration of the creation made in the same creative spirit is provided. , should still be included in the scope of protection of this creative intent.

1‧‧‧Base
2‧‧‧Horizontal mobile stage
21, 22, 22‧‧‧ die rotating table
24‧‧‧Substrate rotary table
25‧‧‧First alignment lens group
3‧‧‧ gantry bracket
31‧‧‧ Lifting mechanism
33‧‧‧Secondary lens group
4‧‧‧Sucking head
41‧‧‧Rotating unit
42‧‧‧Insulation unit
421‧‧‧Cooling plate
422‧‧‧Insulation
43‧‧‧heating unit
431‧‧‧Blind hole
44‧‧‧ suction unit
441‧‧‧ Porous suction cup
4411‧‧‧緃向气道
4412‧‧‧Contact pads
4413‧‧‧ transverse airway
4412‧‧‧Contact pads
442‧‧‧Metal indenter
45‧‧‧Laser launching unit

1 is a schematic side view of the creation; FIG. 2 is a schematic plan view of the pedestal and the horizontal moving stage of the present invention, and the gantry bracket position is represented by an imaginary line; FIG. 3 is a suction head of the first embodiment of the present invention. 4 is a schematic side view of the suction head of the second embodiment of the present invention; FIG. 5 is a bottom view of the suction unit of the present invention; FIG. 6 is a partial cross-sectional view of the porous suction cup of the present invention; A schematic view of the side structure of the suction head of the third embodiment.

1‧‧‧Base

2‧‧‧Horizontal mobile stage

21, 22, 23‧‧‧ grain rotating table

25‧‧‧First alignment lens group

3‧‧‧ gantry bracket

31‧‧‧ Lifting mechanism

33‧‧‧Secondary lens group

4‧‧‧Sucking head

Claims (10)

A multi-die press machine comprises: a base; a horizontal moving stage mounted on the base for precise movement in a horizontal direction, and the horizontal moving stage is additionally provided with three crystals capable of independently rotating a rotating table and a substrate rotating table; a gantry bracket fixed to the base and not interfering with movement of the horizontal moving stage, the gantry bracket is mounted with a lifting mechanism, the lifting mechanism capable of controlling a suction head Lifting and lowering, the suction head includes at least one suction unit and a rotating unit from bottom to top; and the horizontal moving stage accurately moves the die rotating table or the substrate rotating table under the suction head at different times, The lifting mechanism timely controls the lowering of the suction head, allowing the suction head to suck the plurality of micro-grains of the die rotating table at a time, or press-pressing the plurality of micro-grains on the receiving substrate on the substrate rotating table. The multi-die press machine of claim 1, wherein the horizontal moving stage is further provided with a first alignment lens group, wherein the first alignment lens group is photographed upwards for Correct the position of the suction head. The multi-die press machine according to claim 1, wherein the gantry bracket is further provided with a second alignment lens group, and the second alignment lens group is photographed downward to correct the crystal below. The position of the pellet rotating table and the substrate rotating table. The multi-grain press as described in claim 1, wherein the suction unit comprises a porous suction cup and a metal indenter connected from bottom to top, the porous suction cup having a plurality of longitudinal air passages inside and a bottom surface having a plurality of contact pads, each of which is located at a corresponding one of the contact pads, the plurality of longitudinal air passages being in communication with a conduit located in the metal indenter, the conduit being connected to an external vacuuming device for timely use A vacuum is created. The multi-die press machine of claim 4, wherein the contact pad is made of pure gold. The multi-grain press as described in claim 1, wherein the suction head further comprises an insulation unit, so that the structure of the suction head is sequentially from bottom to top by the suction unit, the insulation unit And the rotating unit is configured to include a heat insulating layer and a cooling plate connected from the bottom to the top, and the cooling plate is additionally connected to a cooling pipe. The multi-grain press as described in claim 1, wherein the suction head further comprises an insulation unit and a heating unit, so that the structure of the suction head is sequentially from bottom to top by the suction unit, The heating unit, the heat insulating unit, and the rotating unit are configured. The multi-die press machine of claim 7, wherein the heating unit is internally provided with an electric heating device. The multi-die press machine of claim 7, wherein the suction head further comprises a laser emitting unit, the heating unit is made of a metal material, and the laser emitting unit emits a light source of a specific wavelength at the heating. The unit can cause the heating unit to heat up quickly. The multi-die press machine of claim 7, wherein the heating unit has a blind hole corresponding to the position of the laser emitting unit, and the bottom of the blind hole is located at a center of the heating unit, The laser emitting unit has to emit a light source of a specific wavelength in the blind hole.