TWM493087U - Closed circulation heat dissipation module - Google Patents

Description

Closed loop cooling module

The present invention relates to a closed-loop heat dissipation module capable of efficiently performing heat dissipation on a semiconductor wafer such as a processor in a portable electronic device such as a tablet computer.

In the operation of a portable electronic device such as a notebook computer or a tablet, a high-energy central processing unit or a display chip generates a large amount of waste heat. For such a high-power semiconductor wafer, a heat pipe type must be mounted thereon. The heat sink prevents the semiconductor wafer from overheating and causing malfunction.

Taiwan Patent Publication No. 201209364 discloses a heat dissipating device. As disclosed in the specification and FIG. 2, the heat dissipating device is mainly provided with a centrifugal fan and a heat sink on a heat pipe. A heat dissipating fin group is respectively disposed at two air outlets of the centrifugal fan, and the heat dissipating fins can contact the wafer, and the waste heat of the wafer is transferred to the heat dissipating fin group by the capillary action in the heat pipe to match the internal liquid, and the centrifugal fan pair The heat sink fin group actively removes heat. The heat pipe is a conventional long non-closed loop heat pipe structure. When operating, the end of the heat pipe contacting the wafer is a heating end, and the liquid inside the heating end is heated to a vapor and then arrives along a hollow passage in the heat pipe. The other end of the condensation end is cooled, and after cooling, it condenses into a liquid and flows back to the original end through the capillary structure in the heat pipe. Therefore, the moving direction of the liquid and the steam in the conventional elongated heat pipe is opposite, so the shearing force generated at the liquid-vapor interface causes the fluidity in the heat pipe to decrease, and the heat pipe performance is lowered.

In addition, when the above-mentioned conventional heat pipe is applied to a notebook computer, it is in a flat state, and the heating end is at the same height as the condensation end, and there is no case where liquid has to flow against the gravity. However, if the elongated heat pipe is higher than the condensing end at the heating end, the liquid will flow under the environment of anti-gravity, which causes the heat conduction to drop drastically, and the capillary capacity of the capillary structure inside the heat pipe must be increased to overcome the heat transfer amount. Loss, but the ability to increase the capillary capacity must reduce the pore size of the capillary structure and cause a decrease in permeability, which in turn increases the flow resistance in the capillary structure, which also causes a decrease in heat transfer efficiency.

Therefore, although the conventional long-shaped heat pipe described above can be applied to a notebook computer, it cannot be effectively applied to a portable electronic device such as a tablet computer that is laid flat, standing, yawed, or swayed according to the use requirements.

The new patent of Taiwan Publication No. M357650 also discloses a heat dissipation module having two heat pipes, two heat dissipation fin sets respectively disposed on the two heat pipes, and a fan disposed on the heat dissipation fin group. One end of the two heat pipes are in contact with each other. However, each heat pipe is still a conventional long strip-shaped non-closed loop type heat pipe, and the problem of the heat transfer efficiency falling in the reverse gravity environment and the opposite direction of the liquid vapor flow cannot be overcome. Therefore, the heat dissipation module is also difficult to effectively use in portable electronic devices of the tablet type.

In view of the problems of the heat transfer efficiency of the traditional heat pipe type heat dissipating module applied to the electronic devices of the tablet type, the creator has improved the shortage and lack of the heat pipe type heat dissipation module, thereby creating a closed loop heat dissipation module.

The present invention mainly provides a closed-loop heat dissipation module capable of efficiently performing heat dissipation on a semiconductor wafer such as a processor in a portable electronic device such as a tablet computer.

To achieve the above objectives, the closed loop heat dissipation module includes:

a centrifugal fan can provide airflow, and the centrifugal fan has a first air outlet and a second air outlet for the airflow to be discharged from the first air outlet and the second air outlet;

a closed loop heat pipe, which is connected in a loop shape end to end, is connected to a centrifugal fan, and is provided with a liquid in the closed loop heat pipe, and a closed heat pipe is disposed on the closed loop heat pipe for contacting a heat source;

a first heat dissipation fin set disposed at the first air outlet of the centrifugal fan and in contact with the closed circulation heat pipe;

a second heat dissipation fin set is disposed at the second air outlet of the centrifugal fan and is in contact with the closed circulation heat pipe;

The heat received by the heat sink is transmitted to the first heat dissipation fin group and the second heat dissipation fin group via the closed circulation heat pipe, and the airflow generated by the centrifugal fan is applied to the first heat dissipation fin group and the second heat dissipation fin group. Exhaust heat.

According to the above technical means, the liquid in the closed-loop heat pipe of the closed-loop heat-dissipating module is heated at the heat sink and becomes steam to flow to the first heat-dissipating fin group and the second heat-dissipating fin group, via the first heat-dissipating fin The heat transfer of the chip set and the second heat sink fin group is cooled to return to a liquid, and then returned to the heat sink, thus forming a one-way circulation heat dissipation system, and the steam generated by the heat is the power for pushing the fluid to circulate, without The problem of liquid-vapor flow in the opposite direction. In addition, the capillary structure of the closed loop heat pipe exists only at the corresponding heat sink, and can overcome the problem of inefficient heat transfer under reverse gravity. Therefore, when the closed-loop heat-dissipating module is applied to a tablet computer, the closed-loop heat-dissipating module can effectively dissipate the semiconductor wafer regardless of how the tablet is placed.

The centrifugal fan has a casing and a blade, and the casing is hollow. An air inlet is formed through the top and the bottom of the casing, and the first air outlet and the second air outlet are formed on the side of the outer casing.

The outer casing of the centrifugal fan is plastic or metal.

The closed loop heat pipe further has an evaporator, a steam section, a condensation section, and a liquid section, the evaporator corresponding to the fin position, and has a capillary structure, a compensation groove and a plurality of steam passages, and the plurality of steam passages are located in the capillary The outside of the structure is in communication with the compensation tank, and the plurality of steam passages are disposed adjacent to the evaporator surface, and the steam section is connected to the evaporator and communicates with the steam passage.

The condensation section corresponds to the position of the centrifugal fan, and is connected to and connected to the steam section. The liquid section is connected to and connected to the condensation section, and the liquid section is connected to the evaporator to communicate with the compensation tank, and the liquid is filled in the compensation tank. Wherein, the liquid can pass through the capillary structure to reach the steam passage, and is heated to evaporate into a vapor body, and the vapor body passes through the steam passage and the steam segment to reach the condensation section, and the vapor body releases heat and cools to a liquid, and then flows back through the liquid section. Go to the compensation slot.

The technical means adopted by the present invention for achieving a predetermined new purpose are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.

Referring to FIG. 1 and FIG. 2 , the closed loop heat dissipation module includes a centrifugal fan 10 , a closed circulation heat pipe 20 , a first heat dissipation fin set 30 , and a second heat dissipation fin set 40 .

Referring further to FIG. 3, the centrifugal fan 10 can provide airflow and has a housing 11 and a blade 12. The outer casing 11 is hollow and may be made of metal to increase heat transfer efficiency, or the outer casing 11 may be made of plastic for mass production. Two air inlets 110, 110a are formed through the top and bottom of the outer casing 11, and a first air outlet 111 and a second air outlet 112 are formed on the side of the outer casing 11 for airflow from the first air outlet 111 and the second air outlet. 112 discharged. The blade 12 is disposed in the outer casing 11.

The closed circulation type heat pipe 20 has a ring shape which is connected end to end. In other words, the closed circulation type heat pipe 20 has a structure in which the ring has no both ends. It may be a ring rectangle, a circle, an ellipse, or an irregular ring shape as needed, and the centrifugal fan 10 is connected, a liquid is provided in the closed circulation heat pipe 20, and a heat sink 23 is disposed on the closed circulation heat pipe 20. Used to contact a heat source.

With further reference to FIGS. 6-7, the closed loop heat pipe 20 can further have an evaporator 25, a vapor section 26, a condensation section 27, a liquid section 28, and a liquid. In FIG. 6, the evaporator 25 is intentionally enlarged to show that the evaporator 25 is only located in a partial section of the closed circulation heat pipe 20.

The evaporator 25 corresponds to the position of the fins 23 and has a capillary structure 250, a compensation groove 251 and a plurality of steam passages 252. The plurality of steam passages 252 are located outside the capillary structure 250, communicate with the compensation grooves 251, and adjacent to the evaporator 25. surface.

The steam section 26 is connected to the evaporator 25 and is in communication with the steam passage 252.

The condensing section 27 corresponds to the position of the centrifugal fan 30 and is connected to and in communication with the steam section 26.

The liquid section 28 is connected to and in communication with the condensing section 27, and the liquid section 28 is connected to the evaporator 25 to communicate with the compensation tank 251, and the liquid is filled in the compensation tank 251.

Referring to FIG. 8 again, when the novel closed-loop heat dissipation module dissipates heat for a wafer, the heat sink 23 contacts the wafer, and the liquid inside the closed circulation heat pipe 20 can pass through the capillary structure 250 to reach the evaporator 25. The steam passage 252 is vaporized into a vapor by the high temperature and high heat of the fins 23 located at the evaporator 25, and the vapor passes through the steam passage 252 and the steam section 26 to reach the condensation section 27, and is received by the centrifugal fan 10 located in the condensation section 27. It is cooled to a liquid and then returned to the compensation tank 251 of the evaporator 25 through the liquid section 28. In Fig. 8, the evaporator 25 is intentionally enlarged to show that the evaporator 25 is only located in a partial section of the closed circulation heat pipe 20.

The first fin group 30 is disposed at the first air outlet 111 of the centrifugal fan 10 and is in contact with the condensation section 27 of the closed circulation heat pipe 20.

The second fin group 40 is disposed at the second air outlet 112 of the centrifugal fan 10 and is in contact with the condensation section 27 of the closed circulation heat pipe 20. In addition, the first heat dissipation fin and the second heat dissipation fin may be the same or different metal materials, for example, aluminum or copper.

The heat received by the heat sink 23 is transmitted to the first heat dissipation fin group 30 and the second heat dissipation fin group 40 via the closed circulation heat pipe 20, and the airflow generated by the centrifugal fan 10 is applied to the first heat dissipation fin group 30 and The second heat sink fin set 40 is exhausted.

Referring to FIG. 4, the closed-loop heat dissipation module of the present invention can be installed in a space 91 of the tablet 90, and contacts a semiconductor wafer through the heat sink 23 to eliminate waste heat generated during operation of the semiconductor wafer.

Referring to FIG. 5, another embodiment of the novel closed-loop heat dissipation module can change the size and shape of the closed-loop heat pipe 20 according to the position of the semiconductor wafer inside the tablet 90.

According to the above technical means, the liquid in the closed circulation type heat pipe 20 of the closed circulation type heat dissipation module is heated at the heat sink 23 and becomes steam to flow to the first heat radiation fin group 30 and the second heat radiation fin group 40, via The heat dissipation of the first heat dissipation fin group 30 and the second heat dissipation fin group 40 is cooled to return to a liquid, and then returned to the heat sink 23, thus forming a one-way circulation heat dissipation system, and the steam generated by the heat is used to circulate the fluid. Power. Since the liquid forms steam at the vapor passage 252 of the evaporator 25, it cannot be returned to the liquid compensation groove 251, and is necessarily moved in a single direction away from the compensation groove 251, and the evaporator 25 has steam at a relatively high pressure to drive the condensation. The liquid of the section 27 moves in the same direction in which the steam moves without countercurrent, so there is no problem that the liquid-vapor flow direction is opposite.

In addition, the capillary structure 250 of the closed circulation heat pipe 20 exists only at the corresponding fins 23, and can overcome the problem of inefficient heat transfer under reverse gravity. Therefore, when the closed-loop heat-dissipating module is applied to a tablet computer, the closed-loop heat-dissipating module can effectively dissipate the semiconductor wafer regardless of how the tablet is placed.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention, and any technology that is familiar with the present technology. A person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the technical content disclosed above without departing from the spirit and scope of the present invention. Technical simplifications Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the present invention.

10‧‧‧ Centrifugal fan
11‧‧‧Shell
110, 110a‧‧‧ air inlet
111‧‧‧First air outlet
112‧‧‧second air outlet
12‧‧‧ fan leaves
20‧‧‧Closed circulating heat pipe
23‧‧‧ Heat sink
25‧‧‧Evaporator
250‧‧‧Capillary structure
251‧‧‧Compensation tank
252‧‧‧Steam channel
26‧‧‧Steam section
27‧‧‧Condensation section
28‧‧‧Liquid section
30‧‧‧First heat sink fin set
40‧‧‧Second heat sink fin set

Figure 1 is a perspective view of the present invention.

Figure 2 is another perspective view of the present invention.

Figure 3 is a perspective exploded view of the present invention.

Fig. 4 is a view showing the state of implementation of a novel application in a tablet computer.

Fig. 5 is a view showing an implementation state of another embodiment of the present invention applied to a tablet computer.

Fig. 6 is a schematic enlarged side elevational view showing the evaporator of the novel closed circulation heat pipe.

Figure 7 is a cross-sectional view of the evaporator of the novel closed loop heat pipe.

Fig. 8 is a schematic enlarged plan view showing the closed circulating heat pipe of the present invention.

10‧‧‧ Centrifugal fan

11‧‧‧Shell

12‧‧‧ fan leaves

20‧‧‧Closed circulating heat pipe

23‧‧‧ Heat sink

30‧‧‧First heat sink fin set

40‧‧‧Second heat sink fin set

Claims (5)

A closed circulation type heat dissipation module includes: a centrifugal fan that can provide airflow, and the centrifugal fan has a first air outlet and a second air outlet for discharging airflow from the first air outlet and the second air outlet; a circulating heat pipe, which is connected in a loop shape connected end to end, is connected to a centrifugal fan, and is provided with a liquid in the closed circulation heat pipe, and a closed heat pipe is disposed on the closed circulation heat pipe for contacting a heat source; a first heat sink fin group a first air outlet of the centrifugal fan is disposed in contact with the closed circulation heat pipe; and a second heat dissipation fin set is disposed at the second air outlet of the centrifugal fan and is in contact with the closed circulation heat pipe; wherein the heat sink is subjected to The heat is transferred to the first heat-dissipating fin group and the second heat-dissipating fin group via the closed-loop heat pipe, and the first heat-dissipating fin group and the second heat-dissipating fin group are exhausted by the airflow generated by the centrifugal fan. The closed loop heat dissipation module of claim 1, wherein the centrifugal fan has a casing and a blade, the casing is hollow, and an air inlet is formed through the top and the bottom of the casing, respectively, the first air outlet and the second air outlet The air outlet is formed on the side of the outer casing. The closed loop heat dissipation module of claim 1, wherein the outer casing of the centrifugal fan is plastic or metal. The closed circulation type heat dissipation module according to claim 1, wherein the closed circulation type heat pipe further has an evaporator, a steam section, a condensation section, and a liquid section, the evaporator corresponds to the fin position, and has a capillary structure a compensation channel and a plurality of steam passages, the plurality of steam passages being located outside the capillary structure and communicating with the compensation grooves, the plurality of steam passages being disposed adjacent to the evaporator surface, the steam segments being connected to the evaporator and communicating with the steam passages. The closed circulation type heat dissipation module according to claim 4, wherein the condensation section corresponds to the position of the centrifugal fan, and is connected to and connected to the steam section, the liquid section is connected and connected to the condensation section, and the liquid section is connected to the evaporation. The liquid is connected to the compensation tank, and the liquid is filled in the compensation tank; wherein the liquid can pass through the capillary structure to reach the steam passage, and is heated to evaporate into a vapor body, and the vapor body passes through the steam passage and the steam section to reach the condensation section, and the vapor body The heat is then released and cooled to a liquid which is then returned to the compensation tank through the liquid section.