M334277 八、新型說明： 【新型所屬之技術領域】 本創作係為一種模組化LED燈具結構，尤指一種利用 LED(Light Emitting Diodes)發光二極體所固接之燈架外緣搭 配複數個散熱鰭片以及熱導管，可模組化因應不同LED數量 及瓦數所產生之熱量配合不同散熱程度之組件，將其所產生 之熱量迅速排出。 【先前技術】 每一種光源均有其自身的特點，現階段所使用之燈具無 論是白熾燈、螢光燈、金鹵燈、無極螢光燈、無汞螢光燈、 以及照明用LED(Light Emitting Diodes ;發光二極體），都具有 自身特有的光電性能，安全性能、及環保性能。然而，LED 燈在照明的應用中具有很強的潛在優勢，應用場合及市場比 例會迅速擴大，將來可能會完全取代傳統光源。隨著照明科 技的發展，對未来照明光源的評價不僅僅是著眼於光效範 疇，還應強調照明效果、光的舒適性、光的生物效應、光的 安全性評償，以及環保性能、資源消耗的評價。 LED燈與傳統的白熾鎢絲燈泡以及日光燈相互比較， LED發光二極管的體積小，可以依據應用對象，允許多顆組 合、發熱量其低無比、耗電量又小，壽命又長，而且從環保 的面向來觀察的話，可以时不會變成環境污染的廢棄物 等’用來承接傳統照㈣具作為下—個世代的關器材。其 t ,發熱量低、耗電量小，都是來自於它「低電壓」、「低電 M334277 流」動作的特點。 於市面上所販售之各式各涵LED_t，雜據不同 的使用場所以及照度之絲，分別以不同數量以及功率之 LED發光二極體所構成，因不同之LED燈具皆針對其LED 發光-極體之數量與功率設計並碰其合適的散熱的模式， 故無法增減該LED發光二極體之數量或瓦數將其投射之光照 度做靈活之調整。 然而’該LED發光二極體設置之數量多時，其所產生之 大量熱能通常無法有效而快速的傳遞至外界，故容易導致 LED發光二極體過熱而損毀，其所散發之高熱亦容易造成電 線走火等危險意外，導致不可預期的災禍產生，且由於一般 LED燈具所產生之高溫使發光效率大打折扣，而如何解決散 熱問題即成為重要關鍵。 【新型内容】 本創作的主要目的係在於提供一種模組化^ led燈具結 構，其中，藉由一燈架搭配散熱模組與熱導管相互結合，可 依照LED發光模組數量多寡以及瓦數大小，達到可配合該 LED發光模組照度大小做適合之散熱結構搭配之目的。 本創作之另一目的，在於提供一種模組化LED燈具結 構，其係利用一燈罩可容納至少一組之模組化LED燈具結 構，且於該燈罩上方設有複數個通孔以利散熱，更於該燈罩 内分隔有一額外散熱區，以提供該額外的散熱區域供應來自 於該熱導管所導入之熱能進行加速散熱者。 6 M334277 本創作之又一目的，在於提供一種模組化led燈具結 構，其係利用一蓋體可將該LED單元所產生之光源呈均勻之 光束加以投射出，同時配合一防水墊圈將該LED發光模组封 閉於該燈架上，達到防潮防水且同時防塵之目的者。 本創作之再一目的，在於提供一種模組化LED燈具結 構，其係藉由一聚光罩可將該LED發光模組所產生之光源加 以集中聚光，並同時達到防止該LED發光模組產生漏光之目 的者。 為達上述之目的，本創作在於提供一種模組化LED燈具 結構，其係主要包括有：至少一 led發光模組、一燈架、一 基板、一蓋體、至少兩護蓋、一散熱模組、一熱導管、以及 一防水墊圈所組合而成。該led發光模組更包括有：一 LED 早元、以及一聚光罩。 該燈架係為以鋁擠出成型或是壓鑄成型之一條狀架體， 且包括有一頂端、以及一底端，並於該頂端呈圓弧狀並設有 複數條狀溝槽，以提供該散熱模組結合於其内，且於該底端 設有呈凹槽狀之一容置空間，係結合有該LED發光模組之該 基板組合於該容置空間内。 該蓋邀係為-透明蓋體，其(U接於該燈架之該底端上， 並將該防水墊圈夾合於該縣之該底端與該蓋體之間，配合 該兩護蓋於該燈架之端職紐删於該燈架之該容置空 間内。該散熱模組係由複數個散熱則並間隔—預設距離連 續相互嵌附疊合，於各歡該散細片上所設之—貫穿孔係 提供該熱導管貫穿於其中，利用該熱導管將該燈架上所固接 之該散熱模組之熱能得以快速傳遞熱能。 M334277 該模組化LED燈具結構係可設置於一燈罩之内，且於該 燈罩内另分隔有一額外散熱區，並該燈罩上方設有複數個通 巩^。利用該熱導管將該燈架上所固接之各別該散熱鰭片一併 串接，且由該燈架延伸入該燈罩内之該額外散熱區中，並於 該額外散熱區内之部分熱導管上設置有複數個該散熱鰭片， 利用該熱導管將該燈架上固接之該散熱鰭片所傳遞的熱能快 逸傳導入該額外散熱區中，透過該通孔排出於該燈罩之外， 以大幅提高該燈架之散熱面積，同時增加其散熱效率者。 【實施方式】 為了能更清楚地描述本創作所提出之模組化LED燈具結 構，以下將配合圖示詳細說明之。 請參閱圖一、圖二所示，圖一、圖二分別為本創作模組 >ί匕LED燈具結構之立體分解圖以及立體組合圖。如圓一所 禾，其中，該模組化LED燈具結構1係包括有：至少一 l；^d 發光模組11、一燈架12、一基板13 —蓋體14、至少兩護蓋 15、一散熱模組16、一熱導管17、以及一防水墊圈π所組 合而成。 該LED發光模組11更包括有：一 LED單元111、以及 一聚光罩112。該聚光罩112係分別將該LED單元111加以 圈圍，並與該LED單元111 一併結合於該基板13之上，令 該LED單元111所投射出之光束加以集中折射。該燈架12 係為以銘擠出成型或是壓鎊成型之一條狀架體，其包括有： 一頂端121、以及一底端122。該頂端121呈圓弧狀並設有複 8 M334277 數條狀溝槽1211，且於該底端122設有呈凹槽狀之一容置空 間 1221 。 該基板13其係提供該LED發光模組11結合於其上，透 過一固定螺絲2設置於該燈架12之該容置空間1221内，令 該LED發光模組11對應於該容置空間1221之閉口處。該基 板13之材質係為一金屬基板（例如鋁基板或鋼基板等），透 過該燈架12上之該容置空間1221内所設之一抵頂塊1222， 得以將該基板13嵌附於該抵頂塊1222之上，並運用一導熱 膠3(另示於圖四)將該基板13貼附於該容置空間1221之一内 壁1223上，且藉由該導熱膠3將該基板13上所設置之該LED 發光模組11產生之熱能均勻且迅速傳導至該燈架12上，並 透過該燈架12將熱能快速排出。 該蓋體14係為一透明蓋體，係分別透過該固定螺絲2結 合於該燈架12之該底端122上，其具有防止異物及灰塵侵 入，亦同時可遮蔽内部所設之電路元件使其具有美化的作 用。該蓋體14可以是凸透鏡、凹透鏡、平面鏡、以及擴散板 其中之一。該護蓋15係分別透過該固定螺絲2結合於該燈架 12之兩端，並配合該蓋體14將該LED發光模纽11所結合之 該基板13封閉於該燈架12之該容置空間1221内。 該散熱模組16係由複數個散熱鰭片161並間隔一預設距 離逹績相互嵌附疊合，且該散熱鰭片161係為冲壓的方式加 以成形’並於該各別之該散熱縛片161下方具有與該燈架ο 之該頂端121所設之複數條溝槽1211外形相對應之複數個凸 出部1611，更分別於該凸出部1611之鄰邊彎折有一接合面 1612,使各別該散熱鰭片161藉由該凸出部1611之該接合 9 M334277 1612面固定於該溝槽1211内緣之壁面上。該散熱鰭片i6l係 可藉由銲錫或該導熱膠3的方式，將該凸出部1611之該接合 面1612結合於該溝槽1211之内壁上。 於該各別之該散熱鰭片161之兩侧邊相對彎折有一搭接 端1613 ’該搭接端1613係大致垂直於該散熱鰭片IQ，且拜 由該搭接端1613分別與其他散熱鰭片161呈同方向相互喪^ 疊合。該散熱模組16之該散熱鰭片161可以是以導熱性較佳 之鐵、銅、鋁、銀、以及金等金屬或合金所製成者。 該熱導管17係為一中空之金屬導管，並於該熱導管17 内充填有一導熱物質171 (另示於圖四），該導熱物質171可 以是選購自市售之習用導熱材料。且該熱導管17分別固定於 該散熱鰭片161上所設之一貫穿孔1616内，且將複數個該散 熱鰭片161分別藉由所屬之該貫穿孔1616 —併_接者。該防 水塾圈18係炎合於該燈架12之該底端122與該蓋體14之 間，且位於該底端122之一凹槽1224 (另示於圖四）内，達 到今該容置空間1221不易滲入水氣者。該防水塾圈π之材 質可以是橡膠、以及矽膠其中之一。 請參閱圖三A、圖三B所示，圖三a、圖三b分別為本 創作模組化LED燈具結構之散熱鰭片之第一、第二較佳實施 例圖。如圖三A所示，其中，該散熱鰭片161之該搭接端1613 係呈釘耙狀，且於該搭接端1613之尾端處大致驚折呈叉狀之 一^^合部1614，藉由該卡合部1614分別將該散熱鰭片161 呈同方向相互嵌附疊合，也由於該搭接端1613之連接使其各 別之兩散熱鰭片161間形成一預設之間距，提供更良好之散 熱對流空間。 M334277 獅丨2 其中，本創作之散熱鰭片之第二較佳實 較佳實施例不同處在於，該散_片腿之又狀 兩卡合部刪a中央f折有與該兩卡合部⑹％大致平行且 &隔之-修令雜_ _與祕散熱鰭片 a相互嵌附疊合時，該夾合部與該兩卡合部 1614a 之間隔處可嵌附入該散熱鰭片161之厚度者。 請參閱圖四所示’圖四為本創作模組化LED燈具結構之 • A_A舰圖。如圖四所示，於本創作實較佳施例中，該燈架 12之該頂部121上係設有三條溝槽mia、i施⑵^，令 贿架12之該頂部121上大致形成韓片狀使該燈架i2散 熱面積大幅增加，以提健基板13上之該LED發光模組η 予以散熱。 該燈架12位於該頂部211中央之該溝槽12Ub之槽底恰 對應於該基板13上所設置之該LED發光模組u之位置，該 溝稽1211b之深度大致比位於兩侧之該溝槽12na、mic之 鲁 冰度相對較心。也就疋說，該溝槽1211b之槽底距離該内壁 1223之厚度D，係分別大於另兩侧邊之該溝槽12Ua、1211c 之槽底距離該内壁1223之厚度d，故可利於該LED發光模組 11透過該燈架12之該溝槽1211b厚度D部位，使其具有更 快更佳之熱傳導性。 以下所述之本創作其他較佳實施例中，因大部份的元件 係相同或類似於前述實施例，故相同之元件與結構以下將不 再贅述’且相同之元件將直接給予相同之名稱及編號，並對 於類似之元件則給予相同名稱但在原編號後另增加一英文字 母以資區別且不予贅述，合先敘明。 M334277 請參閱圖五a所示，圖五a為本創作模組化led燈具 結構之第一較佳實施例圖。於本創作模組化LED燈具結構之 第一較佳實施例中，該模組化LED燈具結構la之該基板13 係將該LED發光模組11所產生之熱能傳遞至該燈架12之 上，透過該燈架12上之複數個溝槽1211增加其散熱面積， 將其熱能迅速導出於該燈架12之外者。本創作第一較佳實施 例由於基板12上所結合之該LED單元111數量多寡以及功 率之因素，其照度與瓦數負載所產生之熱量係屬於低量級， 故僅以該燈架12即足以提供所需之散熱。 請參閱圖五B所示，圖五B為本創作模組化LED燈具結 構之第一較佳實施例圖。由於圖五B之本創作模組化LED燈 具結構之第二較佳實施例與圖五A所示之第一較佳實施例之 不同點在於，該模組化LED燈具結構lb之該基板12係將該 LED發光模組u所產生之熱能傳遞至該燈架12之上，透過 該燈架12上之複數個溝槽1211與該散熱模組16相連接，並 藉由各別該散熱鰭片161其下方之該凸出部1611所彎折之該 接合面1612作為擴大該燈架12與該散熱鰭片161之熱傳遞 接觸面’進而將其熱能迅速的由該散熱鰭片161導出於該燈 架12之外者。 本創作第二較佳實施例由於基板12上所結合之該LED 單元111數量多寡以及功率之因素，其照度與瓦數負載所產 生之熱量係屬於中量級，除原有之該燈架12提供散熱之外， 更分別以該散熱模組16結合於該燈架12之上，以大幅提高 該燈架12之散熱面積者。 請參閱圖五C所示，圖五C為本創作模組化LED燈具結 12 M334277 構之第二較佳實施姻。*於圖五c之本翁模組化led燈 具結構之第三較佳實補與圖五B所示之第二較佳實施例之 不同點在於，該模組化LED燈具結構儿利用該熱導管17將 該燈架I2上所固接之各別該散熱鰭片101分別藉由所屬之該 貫穿孔祕-併串接，且可將該熱導管1?加以延伸一預設 長度，並於延伸之部分熱導管17上更設置有複數個散熱鰭片 161b ,以提高該燈架12之散熱面積，加速其散熱效率者。 本創作第二較佳實施例由於基板12上所結合之該LED 單το 111數量多寡以及功率之因素，其照度與瓦數負載所產 生之熱量係屬於重量級，除原有之該燈架12以及該雜模組 16提供其散熱之外，更以該熱導管17之延伸部份將該燈架 12上之該餘模組16之熱驗賴遞至另—雜個散熱錄 片161b上，提供更快速之散熱效果者。 请參閱圖六所示，圖六為本創作模組化LED燈具結構第 四較佳實施例之立體分解圖。如圖六所示，該模組化LED燈 具結構Id更包括有一燈罩19，係可容納至少一組該燈架12 於其中。該燈罩19更包括有：一複數個通孔19卜以及一額 外散熱區192。如圖五a、圖五b、以及圖五c之第一、第二、 以及第三較佳實_ la、lb、le皆可依據制喊或瓦數之 不同以及M LED單元in之數量之多寡設置於該燈罩19之 内’且利用該燈罩19上方所設之該通孔191配合該額外散熱 區192 ’令該燈罩19内所固接之該模組化LED燈具結構la、 lb、lc將其熱量透過該通孔191迅速排出於該燈罩19之外， 更因模組化之目素得以能變換其照明亮度，且兼具方便更換 維修’提高使用壽命者。 M334277 請參閱圖七所示，圖七為本創作模組化LED燈具結構第 四較佳實施例之組合仰視圖。如圖七所示，該模組化led燈 具結構Μ之該燈罩19内係裝設有兩組如圖五㈣示之賴 組化LED燈具結構lc，且於該燈罩19内另分隔有該額外散 熱區192 ’係提供該模組化LED燈具結構lc中之該燈架 上所延伸出之該熱導管17伸入該額外散熱區192内，並於伸 入該額外散熱區192内之部分熱導管17上設置有複數個該散 熱錯片161b，利用該熱導管17將該燈架12上所固接之該散 熱模組16產生之熱能得以快速傳遞至該額外散酿192令， 以额外的該散熱籍片祕加以延伸並擴充該燈架12之散熱 面積，同時增加其散熱速度。 凊參閱圖八卿，圖八為本辦模組化LED燈具結構之 燈架與電源控制模組結合立體圖。如圖八所示，該模組化 燈具結構1更包括有··_電源控制模組2〇，係設置於紐架 2上所預設之-_座123 ~，其具有變壓以及整流之功 月b，且分別與該led發光模組11做電性連接並提供運作時 所需之電倉^3者。該固定座123可透過銑床加工的方式於該燈 架12之該頂端⑵銳切出適合容置該電源控麵組之空 間’以達到節省體積之目的。 姓印 > 閱圖九A所示，圖九A為本創作模組化led燈具 結構之第五錄實酬®。雜目九A本創作之模組化LED /、…構第五較佳實施例其大體上與圖一、圖二之模組化 L肋燈具結構相類似，故相同之元件與結構以下將不再資 述。如圖九A所示，於該燈架12兩端分別所結合之該兩護蓋 这^、外形大致與該散熱鰭片161相對應，且於其中之一護蓋 M334277 15a上設有一防水接頭i5la，以提供一電源線21進入該燈架 12内，並與該燈架12之該固定座123内所設置之該電源控制 模組20相連接，係提供外界電源予以該模組化LED燈具結 才秦1進行工作者。 凊參閱圖九B所示，圖九B為本創作模組化LED燈具結 構之第六較佳實施例圖。由於圖九B本創作之模組化LED燈 具結構第六較佳實施例其大體上與圖一、圖二之模組化led 燈具結構相類似，故相同之元件與結構以下將不再贅述。如 圖九B所不，該散熱鰭片161e係大致為圓形，更於該燈架12 兩端分別所結合之該兩護蓋15b其外形大致與該散熱鰭片 161c相對應，並設致有一對金屬導腳15冼，於其一端伸入該 燈架12内與該電源控制模組2〇相連接，且藉由該金屬導腳 152b可結合於一般市面上所販售之日光燈座内，進行電性連 接者。 綜上所述，本創作一種模組化LED燈具結構1 ,其係主 要包括有：至少一 LED發光模組11、一燈架12、一基板13 一蓋體14、至少兩護蓋15、一散熱模組π、一熱導管17、 以及一防水墊圈18所組合而成。 該燈架12係為以鋁擠出成型或是壓鑄成型之一條狀架 體，且包括有一頂端121、以及一底端122，並於該頂端呈圓 弧狀並設有複數條狀溝槽12ιι，以提供該散熱模組16結合於 其内’且於該底端122設有呈凹槽狀之一容置空間1221，係 結洽有該LED發光模組η之該基板13組合於該容置空間 1221 内。 該蓋體14係為一透明蓋體，其固接於該燈架12之該底 15 M334277 端122上，並將該防水墊圈18夾合於該燈架12之該底端122 與該蓋體14之間，配合該兩護蓋15於該燈架12之兩端將該 基板13封閉於該燈架12之該容置空間1221内。該散熱模組 16係由複數個散熱鰭片丨61並間隔一預設距離連續相互嵌附 疊合，於各別之該散熱鰭片161上所設之一貫穿孔1616係提 供該熱導管17貫穿於其中，利用該熱導管17將該燈架12上 所固接之該散熱模組16之熱能得以快速傳遞熱能。 該模組化LED燈具結構1係可設置於一燈罩19之内， 且於該燈罩19内另分隔有一額外散熱區192,並該燈罩19 上方設有複數個通孔191。利用該熱導管π將該燈架12上所 固接之各別該散熱鰭片161 —併串接，且由該燈架12延伸入 該燈罩19内之該額外散熱區192中，並於該額外散熱區192 内之部分熱導管17上設置有複數個該散熱鰭片i61a，利用該 熱導管17將該燈架π上固接之該散熱鰭片161所傳遞的熱 月夬速傳導入該額外散熱區192令，透過該通孔191排出於 叆燈罩19之外，以大幅提高該燈架12之散熱面積，同時增 加其散熱效率者。 唯以上所述之實施例不應用於限制本創作之可應用範 圍’本創作之保護範圍應以本創作之申請專利範圍内容所界 定技術精神及其均等變化所含括之範圍為主者。即大凡依本 創作申請專利範圍所做之均等變化及修飾，仍將不失本創作 之要義所在，亦不脫離本創作之精神和範圍，故都應視為本 創作的進一步實施狀況。 16 M334277 【圖式簡單說明】 圖一係為本創作模組化led燈具結構之立體八 圖二係為本創作模組化led燈具結構之立體圖 之第 圖三a係為本創作模組化led燈具結椹夕私也〇圖 一較佳實施例圖。 “、、鱗片 之第 圖三；B係為本創作模組化LED燈具結構之散埶 二較佳實施例圖。 .、、、瑪片M334277 VIII. New Description: [New Technology Field] This creation is a modular LED lamp structure, especially a light frame with LED (Light Emitting Diodes) LEDs attached to the outer edge of the lamp holder. The heat sink fins and the heat pipes can modularize the heat generated by the different amounts of LEDs and the wattage to match the heat dissipation components, and quickly dissipate the heat generated by the heat sink fins. [Prior Art] Each light source has its own characteristics. The lamps used at this stage are incandescent lamps, fluorescent lamps, metal halide lamps, electrodeless fluorescent lamps, mercury-free fluorescent lamps, and LEDs for lighting. Emitting Diodes; light-emitting diodes, all have their own unique optoelectronic properties, safety performance, and environmental performance. However, LED lamps have strong potential advantages in lighting applications, and applications and market ratios will expand rapidly, and may replace traditional light sources in the future. With the development of lighting technology, the evaluation of future lighting sources is not only focused on the scope of light effects, but also emphasizes lighting effects, light comfort, biological effects of light, safety assessment of light, and environmental performance and resources. Evaluation of consumption. Compared with traditional incandescent tungsten light bulbs and fluorescent lamps, LED light-emitting diodes are small in size and can be used according to the application object, allowing multiple combinations, low heat generation, low power consumption, long life, and environmental protection. If you look at it, you can not turn it into environmentally polluted waste, etc., which is used to take traditional photographs (4) as the next generation. Its t, low heat generation and low power consumption are all characterized by its "low voltage" and "low power M334277 flow" actions. All kinds of LED_t sold in the market, the different use places and the illuminance of the wires, are composed of LED light-emitting diodes of different quantity and power, respectively, because different LED lamps are illuminated for their LEDs - The number and power of the polar body are designed and touched by the appropriate heat dissipation mode, so the number or wattage of the LED light-emitting diode cannot be increased or decreased to flexibly adjust the illumination of the projected light. However, when the number of LED light-emitting diodes is large, the large amount of thermal energy generated is usually not effectively and quickly transmitted to the outside world, so that the LED light-emitting diodes are easily overheated and damaged, and the high heat generated by them is also likely to be caused. Dangerous accidents such as wire fires lead to unpredictable disasters, and because of the high temperature generated by general LED lamps, the luminous efficiency is greatly reduced, and how to solve the heat dissipation problem becomes an important key. [New content] The main purpose of this creation is to provide a modularized LED lamp structure, in which a light fixture is combined with a heat dissipation module and a heat pipe, according to the number of LED lighting modules and the wattage size. , to achieve the purpose of matching the illuminance of the LED lighting module to suit the heat dissipation structure. Another object of the present invention is to provide a modular LED lamp structure, which can accommodate at least one set of modular LED lamp structures by using a lamp cover, and a plurality of through holes are arranged above the lamp cover for heat dissipation. An additional heat dissipating zone is further disposed within the lampshade to provide the additional heat dissipating region for supplying heat energy introduced from the heat pipe for accelerated heat dissipation. 6 M334277 Another object of the present invention is to provide a modular LED lamp structure, which utilizes a cover body to project a uniform light beam of the light source generated by the LED unit, and the LED is matched with a waterproof gasket. The light-emitting module is enclosed on the light frame to achieve the purpose of moisture-proof and waterproof, and at the same time dustproof. A further object of the present invention is to provide a modular LED lamp structure in which a light source generated by the LED light-emitting module can be concentrated and concentrated by a concentrating hood, and at the same time, the LED light-emitting module can be prevented. The person who produces the light leakage. In order to achieve the above purpose, the present invention provides a modular LED lamp structure, which mainly includes: at least one LED lighting module, a lamp holder, a substrate, a cover body, at least two covers, and a heat dissipation mold. A combination of a set, a heat pipe, and a waterproof gasket. The LED lighting module further includes: an LED early element, and a concentrating cover. The lamp holder is a strip frame formed by extrusion or die casting of aluminum, and includes a top end and a bottom end, and is arcuate at the top end and is provided with a plurality of strip grooves to provide the The heat dissipating module is integrated in the accommodating space, and the substrate is combined with the illuminating module. The cover is inscribed as a transparent cover, and the U is attached to the bottom end of the lamp holder, and the waterproof gasket is clamped between the bottom end of the county and the cover body, and the cover is matched The end of the lamp holder is deleted in the accommodating space of the lamp holder. The heat dissipating module is composed of a plurality of heat dissipating spaces, and is spaced apart from each other by a preset distance, and is superposed on each other. The through hole system provides a heat pipe through which the heat energy of the heat dissipation module fixed on the lamp frame can be quickly transferred. M334277 The modular LED lamp structure can be set Inside the lampshade, an additional heat dissipating area is further partitioned in the lampshade, and a plurality of pass-throughs are disposed above the lampshade. The heat dissipating fins fixed on the lamp post are respectively Connected in series, and the lamp holder extends into the additional heat dissipating area in the lamp cover, and a plurality of the heat dissipating fins are disposed on a part of the heat pipes in the additional heat dissipating area, and the lamp rack is used by the heat pipe The heat transferred by the heat-dissipating fins fixed on the upper side is quickly conducted into the additional heat-dissipating area The through hole is discharged outside the lamp cover to greatly increase the heat dissipation area of the lamp holder, and at the same time increase the heat dissipation efficiency. [Embodiment] In order to more clearly describe the modular LED lamp proposed by the present invention The structure will be described in detail below with reference to the drawings. Please refer to Figure 1 and Figure 2, respectively. Figure 1 and Figure 2 are the exploded view and the three-dimensional combination diagram of the LED module structure. A modular LED lamp structure 1 includes: at least one; a light emitting module 11, a light frame 12, a substrate 13 - a cover 14, at least two covers 15, a heat sink The module, a heat pipe 17, and a waterproof gasket π are combined. The LED lighting module 11 further includes: an LED unit 111 and a concentrating cover 112. The concentrating cover 112 respectively The LED unit 111 is enclosed and integrated with the LED unit 111 on the substrate 13 to condense the light beam projected by the LED unit 111. The lamp holder 12 is extruded or extruded. A strip-shaped frame formed by pressing pounds, which includes: a top 121, and a bottom end 122. The top end 121 has an arc shape and is provided with a plurality of 8 M334277 strip-shaped grooves 1211, and the bottom end 122 is provided with a recessed space 1221. The substrate 13 The LED light-emitting module 11 is disposed in the accommodating space 1221 of the lamp holder 12 through a fixing screw 2, so that the LED lighting module 11 corresponds to the closed position of the accommodating space 1221. The material of the substrate 13 is a metal substrate (for example, an aluminum substrate or a steel substrate), and the substrate 13 is embedded by the abutting block 1222 disposed in the accommodating space 1221. The substrate 13 is attached to the inner wall 1223 of the accommodating space 1221 by using a thermal conductive adhesive 3 (also shown in FIG. 4), and the substrate is coated by the thermal conductive adhesive 3. The thermal energy generated by the LED lighting module 11 disposed on the 13 is uniformly and rapidly transmitted to the lamp holder 12, and the thermal energy is quickly discharged through the lamp holder 12. The cover body 14 is a transparent cover body which is respectively coupled to the bottom end 122 of the lamp holder 12 through the fixing screw 2, and has the function of preventing foreign matter and dust from entering, and shielding the circuit components provided therein. It has a beautifying effect. The cover 14 may be one of a convex lens, a concave lens, a plane mirror, and a diffusion plate. The cover 15 is respectively coupled to the two ends of the lamp holder 12 through the fixing screw 2, and the substrate 13 combined with the LED light-emitting mold 11 is sealed to the receiving portion of the lamp holder 12 by the cover 14. Within the space 1221. The heat dissipation module 16 is formed by a plurality of heat dissipation fins 161 and is overlapped with each other by a predetermined distance, and the heat dissipation fins 161 are formed by stamping, and the heat dissipation is fixed in the respective heat dissipation fins 161. The 161 has a plurality of protrusions 1611 corresponding to the outer shape of the plurality of grooves 1211 of the top end 121 of the lamp holder ο, and a joint surface 1612 is bent at an adjacent side of the protrusion 1611. The heat dissipating fins 161 are fixed to the wall surface of the inner edge of the groove 1211 by the joint 9 M334277 1612 of the protruding portion 1611. The heat dissipating fins i6l can be bonded to the inner wall of the trench 1211 by solder or the thermal conductive paste 3. A pair of overlapping ends 1613 are formed on the two sides of the heat dissipating fins 161. The overlapping ends 1613 are substantially perpendicular to the heat dissipating fins IQ, and the overlapping ends are respectively cooled by the overlapping ends 1613. The fins 161 are superposed on each other in the same direction. The heat dissipation fins 161 of the heat dissipation module 16 may be made of a metal or an alloy such as iron, copper, aluminum, silver, or gold which is preferably thermally conductive. The heat pipe 17 is a hollow metal conduit, and the heat pipe 17 is filled with a heat conductive material 171 (also shown in Fig. 4). The heat conductive material 171 can be a commercially available heat conductive material. The heat pipes 17 are respectively fixed in one of the through holes 1616 of the heat dissipation fins 161, and the plurality of heat dissipation fins 161 are respectively connected by the through holes 1616. The waterproof ring 18 is integrated between the bottom end 122 of the lamp holder 12 and the cover body 14 and is located in a recess 1224 (shown in FIG. 4) of the bottom end 122. The space 1221 is not easily infiltrated into the water. The material of the waterproof ring π can be one of rubber and silicone. Please refer to FIG. 3A and FIG. 3B. FIG. 3a and FIG. 3b respectively show the first and second preferred embodiments of the heat dissipation fins of the modular LED lamp structure. As shown in FIG. 3A, the overlapping end 1613 of the heat dissipation fin 161 is in the shape of a nail, and is roughly folded at the end of the overlapping end 1613 to form a forked portion 1614. The heat-dissipating fins 161 are respectively embedded and overlapped in the same direction by the engaging portion 1614, and the connecting ends 1613 are connected to form a preset distance between the two heat-dissipating fins 161. Provide better heat dissipation convection space. M334277 Griffin 2 wherein the second preferred embodiment of the heat sink fin of the present invention is different in that the two-folded portion of the loose-legged leg has a central f-fold and the two engaging portions (6)% is substantially parallel and & the spacer-fixing _ _ and the secret fins a are embedded and overlapped, the gap between the nip and the two engaging portions 1614a can be embedded in the heat sink fin 161 thickness. Please refer to Figure 4, which shows the A_A ship map of the modular LED lamp structure. As shown in FIG. 4, in the preferred embodiment of the present invention, the top 121 of the lamp holder 12 is provided with three grooves mia and i (2), so that the top 121 of the bribe 12 is substantially formed. The sheet shape greatly increases the heat dissipation area of the lamp holder i2, and heats the LED lighting module η on the substrate 13. The bottom of the groove 12Ub of the lamp holder 12 at the center of the top portion 211 corresponds to the position of the LED lighting module u disposed on the substrate 13. The depth of the groove 1211b is substantially larger than the groove on both sides. The ice of the troughs 12na and mic is relatively centered. In other words, the groove bottom of the groove 1211b is larger than the thickness D of the inner wall 1223, respectively, which is larger than the thickness d of the groove bottom of the groove 12Ua, 1211c on the other two sides, so that the LED can be favored. The light-emitting module 11 passes through the thickness D of the groove 1211b of the lamp holder 12 to make it have faster and better thermal conductivity. In the other preferred embodiments of the present invention described below, since most of the components are the same or similar to the foregoing embodiments, the same components and structures will not be described below, and the same components will be directly given the same names. And number, and the same name is given for similar components, but an additional letter is added after the original number to distinguish and not repeat them. M334277 Please refer to FIG. 5a, which is a first preferred embodiment of the structure of the modular LED lamp. In the first preferred embodiment of the modular LED lamp structure, the substrate 13 of the modular LED lamp structure is configured to transmit thermal energy generated by the LED lighting module 11 to the lamp holder 12. The heat dissipation area is increased by a plurality of grooves 1211 on the lamp holder 12, and the heat energy is quickly led out of the lamp holder 12. In the first preferred embodiment of the present invention, the amount of heat generated by the illuminance and the wattage load is low because of the number of the LED units 111 combined with the power factor of the substrate 12, so that only the lamp holder 12 is Sufficient to provide the required heat dissipation. Referring to FIG. 5B, FIG. 5B is a first preferred embodiment of the structure of the modular LED lamp. The second preferred embodiment of the present exemplary modular LED lamp structure of FIG. 5B differs from the first preferred embodiment of FIG. 5A in that the substrate 12 of the modular LED lamp structure lb The heat generated by the LED lighting module u is transmitted to the lamp holder 12, and is connected to the heat dissipation module 16 through a plurality of grooves 1211 of the lamp holder 12, and the heat dissipation fins are respectively The bonding surface 1612 of the sheet 161 bent by the protruding portion 1611 serves as a heat transfer contact surface for enlarging the lamp holder 12 and the heat dissipation fin 161, and the thermal energy thereof is quickly derived from the heat dissipation fin 161. The lamp holder 12 is external. In the second preferred embodiment of the present invention, the amount of heat generated by the illuminance and the wattage load is medium-weight due to the number of the LED units 111 combined with the power on the substrate 12, except for the original lamp holder 12. In addition to providing heat dissipation, the heat dissipation module 16 is coupled to the light fixture 12 to greatly increase the heat dissipation area of the light fixture 12. Please refer to Figure 5C. Figure 5C shows the second preferred implementation of the modular LED lamp junction 12 M334277. The difference between the third preferred embodiment of the singularly patterned LED luminaire structure of FIG. 5c and the second preferred embodiment of FIG. 5B is that the modular LED luminaire structure utilizes the heat. The conduit 17 respectively connects the respective heat dissipation fins 101 fixed on the lamp holder I2 by the through-holes, and can extend the heat pipe 1 to a predetermined length. A plurality of heat dissipation fins 161b are further disposed on a portion of the heat pipe 17 extending to improve the heat dissipation area of the lamp holder 12 and accelerate the heat dissipation efficiency. In the second preferred embodiment of the present invention, the amount of heat generated by the illuminance and the wattage load is a heavyweight due to the number of LEDs το 111 combined with the power on the substrate 12, except for the original light fixture 12 In addition to the heat dissipation of the hybrid module 16, the heat of the remaining module 16 on the lamp holder 12 is transferred to the other heat-dissipating recording sheet 161b by the extension of the heat pipe 17. Provides faster heat dissipation. Referring to FIG. 6, FIG. 6 is an exploded perspective view of a fourth preferred embodiment of the modular LED lamp structure. As shown in FIG. 6, the modular LED lamp structure Id further includes a lamp cover 19 for accommodating at least one of the lamp holders 12 therein. The lamp cover 19 further includes: a plurality of through holes 19 and an additional heat dissipation area 192. The first, second, and third preferred real_la, lb, and le of FIG. 5a, FIG. 5b, and FIG. 5c may be based on the difference of the shouting or wattage and the number of M LED units in. The modular LED illuminator structure la, lb, lc is fixed in the lampshade 19 by the through hole 191 provided above the lampshade 19 and the additional heat dissipation zone 192 ′ The heat is quickly discharged out of the lamp cover 19 through the through hole 191, and the brightness of the illumination can be changed by the modularized object, and the replacement of the maintenance is improved. M334277 Please refer to FIG. 7 , which is a bottom view of the combination of the fourth preferred embodiment of the modular LED lamp structure. As shown in FIG. 7 , the lamp cover 19 of the modular LED lamp structure is provided with two sets of LED lamp structures lc as shown in FIG. 5 ( 4 ), and the additional cover is further separated in the lamp cover 19 . The heat dissipation zone 192 ′ is provided in the modular LED lamp structure lc. The heat pipe 17 extending from the lamp holder extends into the additional heat dissipation zone 192 and is partially heated into the additional heat dissipation zone 192 . A plurality of the heat dissipating strips 161b are disposed on the conduit 17, and the heat energy generated by the heat dissipating module 16 fixed on the lamp holder 12 is quickly transmitted to the additional 192 order by the heat pipe 17. The heat sink is extended to expand the heat dissipation area of the light fixture 12 while increasing its heat dissipation speed.凊 See Figure 8 Qing, Figure 8 is a perspective view of the lamp holder and power control module of the modular LED lamp structure. As shown in FIG. 8 , the modular luminaire structure 1 further includes a power control module 2 〇 , which is disposed on the yoke 2 and has a _ seat 123 ～ which has a transformer and a rectification. The power month b is electrically connected to the LED lighting module 11 and provides the electricity storage box required for operation. The fixing base 123 can be cut through the top end of the lamp holder 12 (2) to sharply cut the space suitable for accommodating the power control surface group to save the volume. Surname > See Figure 9A, Figure 9A is the fifth recorded remuneration of the modular LED lamp structure. The fifth preferred embodiment of the modular LED/, which is substantially similar to the modular L-rib lamp structure of FIG. 1 and FIG. 2, is the same as the following components and structures. Re-status. As shown in FIG. 9A, the two cover members respectively coupled to the two ends of the lamp holder 12 substantially correspond to the heat dissipation fins 161, and a waterproof connector is disposed on one of the covers M334277 15a. The i5la is provided with a power cord 21 to enter the lamp holder 12, and is connected to the power control module 20 disposed in the fixing base 123 of the lamp holder 12 to provide external power to the modular LED lamp. The knot is Qin 1 to carry out the workers. Referring to FIG. 9B, FIG. 9B is a sixth preferred embodiment of the structure of the modular LED lamp. Since the sixth preferred embodiment of the modular LED lamp structure of the present invention is substantially similar to the modular LED lamp structure of FIG. 1 and FIG. 2, the same components and structures will not be described below. As shown in FIG. 9B, the heat dissipating fins 161e are substantially circular, and the two caps 15b respectively coupled to the two ends of the lamp holder 12 substantially have an outer shape corresponding to the heat dissipating fins 161c, and A pair of metal guide pins 15 冼 extend into the lamp holder 12 at one end thereof and are connected to the power control module 2 ,, and the metal guide pins 152b can be combined with the fluorescent lamp holders generally sold in the market. , to make electrical connections. In summary, the present invention relates to a modular LED lamp structure 1 , which mainly comprises: at least one LED lighting module 11 , a lamp holder 12 , a substrate 13 , a cover 14 , at least two covers 15 , and a cover The heat dissipation module π, a heat pipe 17, and a waterproof gasket 18 are combined. The lamp holder 12 is a strip frame formed by extrusion or die casting of aluminum, and includes a top end 121 and a bottom end 122, and has an arc shape at the top end and is provided with a plurality of strip grooves 12 ιι. The heat dissipation module 16 is provided in the inner portion of the heat dissipation module 16 and is provided with a recessed space 1221 in the bottom end 122. The substrate 13 is coupled to the LED light emitting module η. Placed in space 1221. The cover 14 is a transparent cover that is fixed to the end 15 of the base 15 M334277 of the lamp holder 12, and the waterproof gasket 18 is clamped to the bottom end 122 of the lamp holder 12 and the cover. The two substrates 15 are enclosed in the accommodating space 1221 of the lamp holder 12 at the two ends of the lamp holder 12 . The heat dissipation module 16 is continuously embedded and overlapped by a plurality of heat dissipation fins 61 at a predetermined distance. A through hole 1616 is provided in each of the heat dissipation fins 161 to provide the heat pipe 17 through. The thermal energy of the heat dissipation module 16 fixed on the lamp holder 12 is quickly transferred to the thermal energy by the heat pipe 17. The modular LED lamp structure 1 can be disposed in a lamp cover 19, and an additional heat dissipation area 192 is further partitioned in the lamp cover 19, and a plurality of through holes 191 are disposed above the lamp cover 19. The heat dissipating fins 161 fixed to the lamp holder 12 are connected in series by the heat pipe π, and extend into the additional heat dissipating area 192 in the lamp cover 19 by the lamp holder 12, and A plurality of the heat dissipating fins i61a are disposed on a portion of the heat pipe 17 in the additional heat dissipating region 192, and the heat enthalpy transmitted by the heat dissipating fins 161 fixed to the lamp frame π is conducted into the heat pipe 17 The additional heat dissipation area 192 is discharged through the through hole 191 outside the xenon lamp cover 19 to greatly increase the heat dissipation area of the lamp holder 12 and increase the heat dissipation efficiency. The above-mentioned embodiments are not intended to limit the scope of application of the present invention. The scope of protection of the present invention should be based on the technical spirit defined by the content of the patent application scope of the present invention and the scope of its equal changes. That is to say, the equal changes and modifications made by the applicants in accordance with the scope of this patent application will remain without losing the spirit and scope of this creation, and therefore should be regarded as the further implementation of this creation. 16 M334277 [Simple description of the diagram] Figure 1 is a three-dimensional eight-fifth diagram of the modular LED lighting structure of the creation. The third diagram of the creation of the modularized LED lamp structure is the third figure of the creation of the module. The luminaires are also illustrated in a preferred embodiment. ",, Figure 3 of the scales; B is the divergence of the structure of the modular LED lamp of the creation. 2, the preferred embodiment.
例圖 例圖 圖四係為本創作模組化LED燈具結構之A_A剖視圖 圖五A係為本創作模組化LK)燈具結構之第二^佳實施 0 圏五B係為本創作模組化led燈具結構之第二較佳實施 圖五C係為本創作模組化LED燈具結構之第三較佳實施 例圖。Example diagram Figure 4 is the A_A cross-sectional view of the creative modular LED lamp structure. Figure 5A is the second part of the creation of the modular LK lamp structure. ^ 佳五B is the creative modular led The second preferred embodiment of the luminaire structure is a third preferred embodiment of the modular LED luminaire structure.
圖六係為本創作模組化LED燈具結構第四較佳實施例之 分解圖。 圖七係為本創作模組化LED燈具結構第四較佳實施例之 級合仰視圖。 圖八係為本創作模組化LED燈具結構之燈架與電源控制 模紐結合立體圖。 圖九A係為本創作模組化LED燈具結構之第五較佳實施 例圖。 圖九B係為本創作模組化LED燈具結構之第六較佳實施 例圖。 17 M334277 【主要元件符號說明】 卜la、lb、lc、Id〜模組化LED燈具結構Figure 6 is an exploded view of a fourth preferred embodiment of the modular LED luminaire structure of the present invention. Figure 7 is a bottom view of the fourth preferred embodiment of the modular LED luminaire structure. Figure 8 is a perspective view of the combination of the lamp holder and the power control module of the modular LED lamp structure. Figure 9A is a fifth preferred embodiment of the structure of the modular LED lamp of the present invention. Fig. 9B is a sixth preferred embodiment of the structure of the modular LED lamp of the present invention. 17 M334277 [Key component symbol description] Bu, lb, lc, Id ~ modular LED lamp structure
11〜LED發光模組 111〜LED單元 112〜聚光罩 12〜燈架 121〜頂端 1211〜溝槽 122〜底端 1221〜容置空間 1222〜抵頂塊 1223〜内壁 1224〜凹槽 123〜固定座 13〜基板 14〜蓋體 15、15a、15b〜護蓋 151a〜防水接頭 152b〜金屬導腳 16〜散熱模組 16卜161a、161b〜散熱鰭片 1611〜凸辻部 1612〜接合面 1613、1613a〜搭接端 1614、1614a〜卡合部 1615a〜夾合部 1616〜貫穿孔 17〜熱導管 171〜導熱物質 18〜防水墊圈 19〜燈罩 191〜通孔 192〜額外散熱區 20〜電源控制模組 2〜固定螺絲 3〜導熱膠11 to LED lighting module 111 to LED unit 112 to concentrating cover 12 to lamp holder 121 to top end 1211 to groove 122 to bottom end 1221 to accommodating space 1222 to abutting block 1223 to inner wall 1224 to recess 123 to fixed Seat 13 to substrate 14 to cover 15, 15a, 15b to cover 151a to waterproof joint 152b to metal guide 16 to heat dissipation module 16 161a, 161b to heat dissipation fin 1611 to convex portion 1612 to joint surface 1613, 1613a~lapped end 1614,1614a~engagement portion 1615a~fitting portion 1616~through hole 17~heat pipe 171~heat conductive material 18~waterproof gasket 19~light cover 191~through hole 192~external heat sink 20~power control mode Group 2 ~ fixing screw 3 ~ thermal adhesive