M320291 八、新型說明： 【新型所屬之技術領域】 本新型係有關於一種多功能導熱裝置（一），尤指於一 殼體之中空密閉腔室中，頂撐有回流導柱，且該回流導柱 貫通有通孔，藉其較大的散熱、導熱面積，使熱能可以迅 速傳遞至遠離熱源端，並將蒸發的冷卻液迅速凝結，以提 升對熱源之散熱效率者。 ° 【先前技術】 前應用於電腦中央處理器或發光元件......等等熱源 上的導熱或散熱裝置，一般是以鋁或銅等導熱材料形成' 有多數鰭片之鰭片體，藉由該鰭片體，貼靠於熱源^， 使熱源所產生的熱能，可以藉由熱傳遞作用，傳遞至各 鰭片上，以達到散熱的目的。然而這種單純以熱傳遞作 用做為導熱、散熱的裝置，由於散熱效率較差，已經無 法因應目前新一代之電子元件散熱需求^ “、、 緣此，目前應用於熱源之導熱裝置，有於一殼體中， 形成有中空的腔室，令該殼體之一面界定為接熱面，而 其相對面界定為冷凝面，並於該腔室内頂撐有導熱柱， 除了可以有效強化殼體之結構，避免在把中空腔=抽真 空之過程中，造成殼體的變形，且可藉由各導熱柱，將 殼體接熱面所接收之熱能，傳遞至殼體遠離熱源之冷凝 面上，另外，也可以使填裝在中空腔室内之冷卻液經 接熱面受熱蒸發並在殼體之冷凝面凝結呈液態之冷卻 液’可以循導熱柱流回趨近於殼體之接熱面上，形 循環系統，然而，上述之導熱柱，是呈一實心狀，除了 散熱面積小，使導熱、散熱效率不佳外，受凝結之液熊 M320291 冷卻液’只能循導熱柱之極少的表面積，回流至殼體的 接熱面上，而影響冷卻液的循環效率，使其導熱、散熱 效率較差，而顯有改進的必要。 本案創作人有鑑於此’乃予以研究創新，揭示出^ —種多功 能導熱裝置（一）。 【新型内容】 - 本新型之目的旨在提供一種多功能導熱裝置（一），係 包括：一殼體，含有一中空密閉腔室，並令該殼體之一侧 _ 面，界定為一接熱面，以貼靠於一熱源上，且於該中空密 閉腔室中，注入有冷卻液（如純水）者；網層，鋪置於該中 空密閉腔室之表面，令趨近於殼體接熱面之網層，界定為 蒸發層，而遠離該接熱面之網層，界定為冷凝層者；以及 多數回流導柱，分別呈中空狀，支撐於該殼體之中空密閉 腔室中，令其兩端抵靠於該網層之蒸發層及冷凝層間，使 在網層之冷凝層凝結成液態之冷卻液，可以沿中空狀之回 流導柱，流回網層之蒸發層者。 _ 本新型所揭示之多功能導熱裝置（一），其中各該回流 導柱，係呈一中空狀，於其外壁或内壁上，係軸向地形成 多數導溝，以增進散熱及導熱效率，並使網層於冷凝層所 凝結後的冷卻液，可以沿各導溝流向網層之蒸發層者。 本新型所揭示之多功能導熱裝置（一），其中該回流導 柱，係可於其外壁或内壁上，附著有網層，以增加回流導 柱之導熱及散熱效能，使蒸發之冷卻液，快速凝結成液體 本新型所揭示之多功能導熱裝置（一），其中各該回流 M320291 導柱，係可製自金屬材料，以機械加工一體成型，或可由 粉末冶金一體成型，使其表面呈一粗糙面，本新型並不予 自限。 本新型之可取實體，可由以下之說明及所附各圖 式，而得以明晰之。 【實施方式】 請參閱第一至五圖所示，本新型係有關於一種多功能 導熱裝置（一），係包括：一殼體（10)，含有一中空密閉腔 室（11) ’並令該殼體（10)之一侧面，界定為一接熱面 (12) ’以貼靠於一熱源（H)上，且於該中空密閉腔室（11) 中’注入有冷卻液（如純水）者；網層（20)，鋪置於該中空 德、閉腔至（11)之表面，令趨近於殼體（1〇)接熱面（12)者， 界定為蒸發層（21)，而遠離該熱接面（12)者，界定為冷凝 層（22)者；以及多數回流導柱（3〇)，分別呈一中空狀，支 撐於該殼體（10)之中空密閉腔室（11)中，令其兩端抵靠於 該網層（20)之蒸發層（21)及冷凝層（22)間，使在網層（20) 之冷凝層（22)凝結成液態的冷卻液，可以沿中空狀之回流 導柱（30)，流回網層（20)之蒸發層（21)者。 本新型所揭示之多功能導熱裝置（一），其中該熱源 (H)，係指電腦中央處理器，或如第八圖所示，該熱源（η，） 係指LED等發光元件，本新型並不自限該熱源（η)之種類。 如第一、二、三、四圖所示，本新型所揭示之殼體 (10) ，係可有第一殼體（l〇a)及第二殼體（l〇b)對合組成， 並於對合後，以一管（13)對殼體（10)中之中空密閉腔室 (11) 施予抽真空處理，該殼體（10)係可呈一圓盤狀或矩形 立方體，本新型並不自限。本新型所揭示之殼體（10)，其 M320291 接熱面（12)係可呈一平整面，以平貼於熱源（H，如中央處 理器）上，或如第八圖所示，令該殼體（10，）之接熱面 (12’）係呈一弧形面，以於該接熱面（12，）上裝置發光元 件等熱源（H’），並充當該熱源（H，，即發光元件）反光罩 者。 本新型所揭示之多功能導熱裝置（一），其中該網層 (20)，係可由單層網層或複數網層所構成；若為複數網層 (20)時，係可由不同密度之網層（2〇)堆疊組成者。該網層 • (20)係可以金屬線材編織而成或以金屬粉末冶金成型，本 新型並不予自限。 如第一、五圖所示，本新型所揭示之多功能導熱裝置 (一），其中各該回流導柱（30)，係呈一中空狀，轴向地形 成一通孔（31)，於該回流導柱（30)之外壁或通孔（31)之内 壁上’係軸向地形成多數導溝（32)，以增進其散熱及導熱 效率’並使網層（20)於冷凝層（22)所凝結後的冷卻液，可 以沿各導溝（32)迅速流向網層（20)之蒸發層（21)者。如第 _ 六圖所示，本新型所揭示之多功能導熱裝置（一），其中該 ‘ 回流導柱（30b)，係可於其外壁或通孔（31)之内壁上，附 著有金屬之格網（33)，以增加回流導柱（30b)之導熱及散 熱效能，使蒸發之冷卻液，快速凝結成液體者。 本新型所揭示之多功能導熱裝置（一），其中各該回流 導柱（30)，係可製自金屬材料，以機械加工一體成型；或 如第七圖所示，令該回流導柱（3〇c)可由粉末冶金一體成 型’使其表面呈一粗糙面（34)，本新型並不予自限。 本新型所揭示之多功能導熱裝置（一），其主要結構特 徵在於’以貫穿有通孔（31)呈中空狀之回流導柱（30、 M320291 30b、30c)，頂撐於該殼體⑽中，藉其較大的散熱、導 熱面積使熱能可以迅速傳遞至遠離熱源（H)端 ，並將蒸 發的冷卻㈣賴結’叫料_讀熱鱗，而顯其 新穎性及實用性。 本新型所揭示之結構、形狀，可於不違本新型之精神 及範疇下予以修飾應用，例如，該網層（3〇)係可免設，僅 令各該回流導柱（30)頂撐於該殼體（1〇)之中空密閉腔室 (11)中，本新型並不予自限。M320291 VIII. New description: [New technical field] The present invention relates to a multifunctional heat-conducting device (1), especially in a hollow closed chamber of a casing, with a recirculation guide column for the top support, and the reflow The guide post penetrates through the through hole, and the large heat dissipation and heat conduction area enable the heat energy to be quickly transmitted away from the heat source end, and the evaporated coolant is quickly condensed to improve the heat dissipation efficiency of the heat source. ° [Prior Art] The heat conduction or heat dissipation device used in the heat source of the computer central processing unit or the light-emitting element, etc., is generally formed of a heat-conducting material such as aluminum or copper. By means of the fin body, the heat source generated by the heat source can be transferred to the fins by heat transfer to achieve the purpose of heat dissipation. However, such a device that uses heat transfer as a heat conduction and heat dissipation has been unable to cope with the heat dissipation requirements of the current generation of electronic components due to poor heat dissipation efficiency. Therefore, the heat conduction device currently applied to a heat source has a In the housing, a hollow chamber is formed, such that one surface of the housing is defined as a heat receiving surface, and the opposite surface is defined as a condensation surface, and a heat conducting column is supported in the chamber, in addition to effectively strengthening the housing The structure avoids deformation of the casing during the process of vacuuming the cavity, and the heat energy received by the heat receiving surface of the casing can be transmitted to the condensation surface of the casing away from the heat source by the heat conducting columns. In addition, the coolant filled in the hollow chamber can be heated and evaporated by the hot surface and condensed in a liquid state on the condensation surface of the casing, which can flow back to the heat surface of the casing along the heat conducting column. The shape-circulating system, however, the above-mentioned heat-conducting column is in a solid shape, except that the heat-dissipating area is small, so that the heat conduction and heat-dissipation efficiency are not good, and the condensed liquid bear M320291 coolant can only follow the pole of the heat-conducting column. The surface area is reduced to the heat receiving surface of the casing, which affects the circulation efficiency of the coolant, making it difficult to conduct heat and dissipate heat, and it is necessary to improve. The creators of this case have researched and innovated to reveal A multi-functional heat-conducting device (1). [New content] - The purpose of the present invention is to provide a multifunctional heat-conducting device (1) comprising: a housing containing a hollow closed chamber, and One side of the casing is defined as a heat receiving surface to abut against a heat source, and in the hollow closed chamber, a coolant (such as pure water) is injected; the mesh layer is placed on the surface. The surface of the hollow closed chamber is defined as an evaporation layer which is adjacent to the heating surface of the casing, and is defined as a condensation layer away from the network layer of the heat receiving surface; and a plurality of recirculation guide columns are respectively hollow Supporting in the hollow closed chamber of the casing, so that both ends thereof abut against the evaporation layer and the condensation layer of the mesh layer, so that the condensation layer in the mesh layer is condensed into a liquid coolant, which can be hollow Recirculation of the guide column and evaporation back to the network layer The multi-functional heat conduction device (1) disclosed in the present invention, wherein each of the reflow guide columns has a hollow shape, and a plurality of guide grooves are axially formed on the outer wall or the inner wall thereof to enhance heat dissipation and heat conduction. The efficiency and the cooling liquid which is condensed by the mesh layer in the condensation layer can flow along the guide channels to the evaporation layer of the mesh layer. The multifunctional heat conduction device (1) disclosed in the present invention, wherein the reflux guide column can be A mesh layer is attached to the outer wall or the inner wall to increase the heat conduction and heat dissipation performance of the return guide column, and the evaporated coolant is quickly condensed into a liquid. The multifunctional heat transfer device disclosed in the present invention (1), wherein each of the reflows M320291 guide column, which can be made of metal material, can be integrally formed by mechanical processing, or can be integrally formed by powder metallurgy to make the surface a rough surface. The present invention is not self-limiting. The preferred entity of the present invention can be explained by the following And the accompanying drawings are clearly clarified. [Embodiment] Referring to Figures 1 to 5, the present invention relates to a multifunctional heat transfer device (1) comprising: a housing (10) containing a hollow closed chamber (11) 'and One side of the casing (10) is defined as a heat receiving surface (12)' to abut against a heat source (H), and is filled with a coolant (such as pure in the hollow closed chamber (11) The water layer (20) is laid on the surface of the hollow, closed cavity to (11), so as to approach the heating surface (12) of the casing (1〇), defined as the evaporation layer (21) And away from the hot junction (12), defined as the condensation layer (22); and a plurality of reflow guides (3〇), respectively, in a hollow shape, supported in the hollow closed cavity of the casing (10) In the chamber (11), the two ends abut against the evaporation layer (21) and the condensation layer (22) of the mesh layer (20), so that the condensation layer (22) in the mesh layer (20) is condensed into a liquid state. The coolant can flow back to the evaporation layer (21) of the mesh layer (20) along the hollow return column (30). The multifunctional heat conduction device (1) disclosed in the present invention, wherein the heat source (H) refers to a computer central processing unit, or as shown in the eighth figure, the heat source (η,) refers to a light-emitting element such as an LED. The type of the heat source (η) is not self-limiting. As shown in the first, second, third and fourth figures, the housing (10) disclosed in the present invention may have a first housing (10a) and a second housing (10b). After the merging, the hollow closed chamber (11) in the casing (10) is evacuated by a tube (13), and the casing (10) may be in the form of a disk or a rectangular cube. The new model is not self-limiting. In the housing (10) disclosed in the present invention, the M320291 heat receiving surface (12) may be a flat surface to be flatly attached to a heat source (H, such as a central processing unit), or as shown in FIG. The heat receiving surface (12') of the casing (10,) has a curved surface for mounting a heat source (H') such as a light-emitting element on the heat receiving surface (12), and serves as the heat source (H, , that is, the light-emitting element) the reflector. The multifunctional heat-transfer device (1) disclosed in the present invention, wherein the mesh layer (20) can be composed of a single-layer mesh layer or a plurality of mesh layers; if it is a complex mesh layer (20), it can be a network of different densities Layer (2〇) stacking components. The mesh layer • (20) can be woven from metal wire or metal powder metallurgy. This new model is not self-limiting. As shown in the first and fifth figures, the multi-functional heat conduction device (1) disclosed in the present invention, wherein each of the reflow guide columns (30) has a hollow shape, and a through hole (31) is axially formed. A plurality of guide grooves (32) are axially formed on the outer wall of the reflow guide post (30) or on the inner wall of the through hole (31) to enhance the heat dissipation and heat conduction efficiency thereof and to make the mesh layer (20) on the condensation layer (22) The condensed coolant can quickly flow along the guide grooves (32) to the evaporation layer (21) of the mesh layer (20). As shown in the sixth figure, the multi-functional heat conduction device (1) disclosed in the present invention, wherein the 'reflow guide post (30b) is attached to the inner wall of the outer wall or the through hole (31), and is attached with metal. The grid (33) is used to increase the heat conduction and heat dissipation performance of the reflow guide post (30b), so that the evaporated coolant quickly condenses into a liquid. The multifunctional heat conduction device (1) disclosed in the present invention, wherein each of the reflow guide columns (30) can be made of a metal material and integrally formed by machining; or as shown in the seventh figure, the reflow guide column ( 3〇c) can be integrally formed by powder metallurgy' to make the surface a rough surface (34), the present invention is not self-limiting. The multi-functional heat-conducting device (1) disclosed in the present invention is mainly characterized in that 'the reflow guide post (30, M320291 30b, 30c) which is hollow through the through hole (31) is supported by the casing (10). In the middle, by virtue of its large heat dissipation and heat conduction area, the heat energy can be quickly transferred away from the heat source (H) end, and the evaporation cooling (four) is tied to the 'heating material' to read the heat scale, which shows its novelty and practicability. The structure and shape disclosed in the present invention can be modified and applied without departing from the spirit and scope of the present invention. For example, the mesh layer (3〇) can be omitted, and only the reflow guide pillars (30) are supported. In the hollow closed chamber (11) of the casing (1〇), the present invention is not limited.
【圖式簡單說明】 第一圖：係本新型之立體分解圖。 第一圖·係本新型於組合後之立體圖。 第二圖：係第二圖3-3方向之剖面圖。 第四圖：係第三圖標示，，4”之區域放大圖。 第五圖：係本新型第一種回流導柱實施例之立體圖。 第六圖：係本新型第二種回流導柱實施例之立體圖。 第七圖：係本新型第三種回流導柱實施例之立體圖。 第八圖：係本新型之第二種殼體實施例示意圖。 【主要元件符號說明】 (10) 殼體 (10b)第二殼體 (11) 中空密閉腔室 )接熱面 (20)網層 (22)冷凝層 (10a)第一殼體 (10’）殼體 (12) 接熱面 (13) 管 (21)蒸發層 (30)(30b)(30c)回流導枉 M320291 (31)通孔 (33)格網 (Η)熱源 (32) (34) (Η， 導溝 粗链面 熱源[Simple description of the diagram] The first picture: is a three-dimensional exploded view of the new model. The first figure is a perspective view of the novel after combination. Second picture: is a sectional view in the direction of the second figure 3-3. The fourth picture is the third icon, the enlarged view of the area of 4". The fifth picture: is a perspective view of the first embodiment of the first reflow guide column. The sixth picture: the second type of reflow guide column implementation Fig. 7 is a perspective view of a third embodiment of the reflow guide post of the present invention. Fig. 8 is a schematic view showing a second embodiment of the present invention. [Description of main components] (10) Housing (10b) second casing (11) hollow closed chamber) heat receiving surface (20) mesh layer (22) condensation layer (10a) first casing (10') casing (12) heat receiving surface (13) Tube (21) evaporation layer (30) (30b) (30c) reflow guide M320291 (31) through hole (33) grid (Η) heat source (32) (34) (Η, guide groove thick chain surface heat source