M319451 八 新型說明： 【新型所屬之技術領域】 本創作係有關於一-種電源供應器之散熱 指-種設有複數個斜向排列之散熱片，且於散^疋 成有導流通道的電源供應器之散熱結構。…之間形 【先前技術】 目前電腦產品的普及，對人類而古是 使電腦内部之裝置可獲得運轉所須電源，因此二電= 機内皆設置有一電源供應器。 >電恥主 上述的電源供應器之殼體詈與 該電源供應器另於該殼散熱風扇， 熱風扇下方處且設置有複數個晶片，节電路^ 上並衣設有鋁擠型之散熱器，如第一所 路板 器1 a係包括一主柘1 n ° '、，上述之散熱 主板1 0 a及二支腳2 〇 ，兮 二，，個直立型且為間隔 教=〇 腳?0a分別向下延伸… 略)導入空氣吹拂該散風扇(圖 止電源供應㈣讀出殼體外，防 觸主：内供應器之殼體在其後 戍π ρ之一侧）內部容 無法順利排出該殼體外，導致敎量?二:=:使3 於上述的散埶Η Ί Ί y …里系檟/皿度上幵。且由 風撞擊散熱片\ 1 =係為直立式的排列，當散熱風扇的 a %，便會形成較大的風阻，同時使得 5 M319451 、 散熱風扇之氣流無法吹到電路板上的電子元件。另，在電 源供應器達到高負載時，散熱風扇必須加強轉速，才能將 更多的熱氣排出敫體外，也因而造成噪音的增加。、 、 緣是，本創作人有感上述問題之可改善，乃潛心研究 . 並配合學理之運用，而提出一種設計合理且有效改善上述 、問題之本創作。 【新型内容】 本創作之主要目的，在於提供一種電源供應器之散熱 Φ 結構，其設有複數個斜向排列的散熱片，該等散熱片之間 形成導流通道，以強制散熱風扇之氣流往指定之方向導 送，使得熱氣迴流覌象不易產生而能順利的進行散熱，同 時讓電路板上之電子元件吹到較多的風，讓散熱風扇不必 高速運轉，減低其產生之噪音。 為了達成上述之目的，本創作係提供一種電源供應器 之散熱結構，該電源供應器具有一殼體，該散熱結構包括： 一散熱風扇，其設置於該殼體頂面内側；以及一散熱器， Φ 其設置於該殼體内部且位在該散熱風扇下方，該散熱P.包 含一立板及複數散熱片，該等散熱片条斜向且間隔的設置 -於該立板，該等散熱片之間形成複數個導流通道。 本創作具有以下有益效果：本創作可導引散熱風扇之 氣流往指定之方向導送，並可降低風阻，因此不易產生熱 氣迴流現象，並可讓電路板上的電子元件受到散熱風扇之 • » 售 . 吹拂，而能幫助電子元件散熱，進而提昇電源供應器之輸 .出瓦特數，同時可使散熱風扇以低速運轉而能較為安靜。 為使能更進一步瞭解本創作之特徵及技術内容，請參 M319451 閱以下有關本創作之詳細說明與附圖，然而所附圖式僅提 供參考與說明用，並非用來對本創作加以限制者。 【實施方式】- 請參閱第二圖至第四圖所示，為本創作電源供應器之 散熱結構之第一實施例，本創作係用以裝設於一電源供應 裔之嫒體1 〇 〇内，該殼體1 〇 〇包含一基乃 覆設於該基座之蓋體102，該基座；J = 穿設複數個散熱孔1 〇 1 i，該基座i 〇 1内部裝設一電 路板10 3。上述之散熱結構包括：―散熱風〇、一 第-散熱器2 0及-第二散熱器3 〇。該散熱風扇^ 設置於該殼體HQ之蓋體1〇2頂面内側，用以將空氣 導入該殼體.1 〇 〇内進行散熱。 ” 、該第-散熱器2 0包含一第一立板2工、二第一支 2 2及複數第—散熱片2 3。該第-立板2!係以導熱之 '金屬材料製成且為一縱長形板體，該第一立板2丄設有 數個固定孔211，該等固定孔211係貫穿至該第一： Ξ ίί2 ?側面。該第一散熱器2 0係設置於該殼 肢1 0 0之基座1 01内部靠近左側處（如第三圖所示）， 且位在該散熱風扇1〇下方。 21可通過該固文孔211而以螺鎖的方 式裝π有至>-晶4 (圖略），使該第—立 晶片接觸而幫助其散熱。 H/、这 、該二第-支腳2 2係以金屬片體沖壓而成，每一 支腳2 2中央處向下延伸形成—插置部2 ，該 221係伸出該第—立板21底面，該插置部22ι = M319451 ^別彎折形成-接㈣2 2 2，職置部2 2]係插置固 電路板1 Ο 3，該接腳部2 2 2抵靠於該電路板1 表血。該二第一支腳2 2係分別固設於該第一立板2 1左、右兩侧面之底部且相隔一段適當距離。、 ^第一散熱月2 3係以導熱之金屬材料製成，該 焊接或-體;型外，該等第一散熱片2 3係以 楚一私也 方式、、&於該第一立板2 1頂端，該等 ► :片2 3係斜向且間隔的沿著該第一立板2工之縱 4 :::Γ立板21上，且該等第-】 個等第一散熱片23之間侧^^^ M319451 1右側處（如第三圖所示）。 •當該散熱風扇1()轉動時，會自殼體1Q 部下 導入·氣爽至殼體1 0 0内部，該散熱風扇1 〇產生之二動 氣體係以螺旋狀路徑往下斜向流動。因此，、靠近基座2 1左側之氣流會順著該等傾斜的第—散 苐-導流通道24,而經由該基座1〇1之散 1排出於該殼體外；靠近基座1〇1右侧之 會順著傾斜的第二散埶# q卩、S、A # +调乏虱抓則 於笛-笛-與也過弟二導流通道34，由 4:而Si片2 3、3 3係配合散熱風扇1 0之氣 向排列的設置，因而可降低風阻，減咖^ 虫羽 產生之。呆音，同時使得電路板丄〇 3上之電元 件（圖略）可以受到散敎涵戶 速的冷卻。4 1 吹拂’而能較快 請參閱第五圖及第六圖所示 作之第— 例，與第-實施例之差異處在於：巧本創作之弟一⑺ ㈣第二散熱片3 3底端係往該等散 P折延伸形成一導引部331，以使該 1 ΐ:流可經由該導引部3 31導向該等散熱 孔1 011 ’攸而將更多的熱量 面形狀未有限制，可為平㈣r j °亥¥引43 3 1表 (圖略）。 為千I狀（如弟六圖所示）或曲弧狀- 種料:麥：：七圖所示’係揭示該第-散熱器2 0之另一 熱片2 3之傾斜古!^° 2 〇卩伤散熱片2 3，係與其餘散 導引部2 v/’而°不同’該等散熱片2 3，底端亦形成有 引w31而可將散熱風扇10之氣流導向其他方 M319451 向，如此一來，可針對需要加強散熱之部位進行散熱，使 得讓散熱風扇1 0之氣流可集中的導向該部位，而能針對 、談部位進行散熱。同理，此種結構亦可應用於該第二散熱 器3 0上。 ' … 是以，本創作散熱結構係設有複數斜向排列的散熱片 2 3、3 3，該等散熱片2 3、3 3之間並形成複數個導 流通道2 4、3 4，藉由該等導流通道2 4、3 4可強制 該散熱風扇10之氣流往指定之方向導送，而不易於殼體 ^ 2 0内部產生熱氣迴流現象，並使電路板上之電子元件 ，受到散熱風扇1 〇之吹拂，提昇整體散熱效率，從而提 幵電源供應器之輸出瓦特數，且可使散 以較低 轉速運轉，減少所產生之噪音。 丄u 乂孕乂低 卩a ^為本創作之較佳可行實施例，非因此1 内料It利祀圍’故舉凡運用本創作說明書及圖5 内谷所為之荨效結構變化 内，合予陳明。 皆包含於本創作之制 籲 【圖式簡單說明】 第一圖係習知散熱器的立體圖。 創作之第一實施例的立體分解圖。 創作之第一實施例的部份立體組合圖。 圖係弟二圖的侧視圖。 :二實施例的部份立體組合圖。. 卩罘五圖的側視圖。 苐七圖係本創作 【主要元## & 一政…、器另―實施例的側視圖。 L 土罟7〇件符號說明】 口 M319451 〔習知〕 la 散熱器 10a 主板 1 1 a 散熱片 2 0a 支腳 2 1 a 插置部 〔本創作〕 10 散熱風扇 20 第一散熱器 2 1 第一立板 211 固定孔 Ά'- 22 第一支腳 221 插置部 222 接腳部 23 第一散熱片 2 3 ’第一散熱片 2 3 1 導引部 2 4 第一導流通道 3 0 第二散熱器 31>第二立板 3 11 •固定孔 3 2 第二支腳 321 插置部 11 M319451 3 2 2 接腳部 33 第二散熱片 3 3 1導引部 34 第二導流通道 10 0 殼體 1 0 1基座 散熱孔 10 11 10 2 蓋體 I 103 電路板 12M319451 Eight new descriptions: [New technical field] This creation system has a heat dissipation finger for a power supply type, which is provided with a plurality of obliquely arranged heat sinks, and is formed into a flow guiding channel. The heat dissipation structure of the power supply. Between the two forms [Prior Art] At present, the popularity of computer products is the power required for the internal devices of the computer to operate. Therefore, there is a power supply in the machine. > The housing of the power supply of the above-mentioned power supply and the power supply are separately from the heat dissipation fan of the housing, and a plurality of wafers are disposed under the heat fan, and the heat-dissipating heat is arranged on the circuit board. The first road board 1 a includes a main 柘 1 n ° ', the above-mentioned heat-dissipating main board 10 a and two legs 2 〇, 兮 two, an upright type and spacing teaching = lame ?0a respectively extends downwards... slightly) the air is blown to blow the fan (the power supply is supplied (4), the outer casing is read out, the main body of the inner supply is on the side of the rear 戍 π ρ) Exhaust from the outside of the casing, causing the amount of enthalpy? Two: =: 3 is in the above-mentioned divergence Ί y y ... in the 槚 / 度 degree. And the wind hits the heat sink \ 1 = is an upright arrangement. When the heat sink fan is a %, a large wind resistance is formed, and the air flow of the 5 M319451 and the heat dissipation fan cannot be blown to the electronic components on the circuit board. In addition, when the power supply reaches a high load, the cooling fan must increase the speed to discharge more hot air outside the crucible, which also causes an increase in noise. The reason is that the creator feels that the above problems can be improved, but is devoted to research. Together with the use of academics, he proposes a creation that is reasonable in design and effective in improving the above problems. [New content] The main purpose of the present invention is to provide a heat dissipation Φ structure of a power supply device, which is provided with a plurality of obliquely arranged heat sinks, and a flow guiding channel is formed between the heat radiating fins to force the airflow of the cooling fan. Conducting in the specified direction makes the hot air returning phenomenon difficult to generate and can smoothly dissipate heat, and at the same time, the electronic components on the circuit board blow more wind, so that the cooling fan does not have to operate at high speed, reducing the noise generated. In order to achieve the above object, the present invention provides a heat dissipation structure of a power supply, the power supply having a casing, the heat dissipation structure comprising: a heat dissipation fan disposed on the inner side of the top surface of the casing; and a heat sink Φ is disposed inside the casing and is located under the heat dissipation fan, and the heat dissipation P. comprises a vertical plate and a plurality of heat dissipation fins, and the heat dissipation strips are arranged obliquely and spaced apart from the vertical plate, the heat dissipation fins A plurality of flow guiding channels are formed between each other. This creation has the following beneficial effects: This creation can guide the airflow of the cooling fan to the specified direction, and can reduce the wind resistance, so it is not easy to generate hot air reflow phenomenon, and the electronic components on the circuit board can be subjected to the cooling fan. Selling. Blowing, can help the electronic components to dissipate heat, thereby increasing the power supply's output wattage, while allowing the cooling fan to run at a low speed and quieter. In order to further understand the features and technical contents of this creation, please refer to M319451 for the detailed description and drawings of the present invention. However, the drawings are for reference and explanation only and are not intended to limit the creation. [Embodiment] - Please refer to the second to fourth figures, which is the first embodiment of the heat dissipation structure of the authoring power supply, and the present invention is installed in a body of the power supply. The housing 1 includes a cover 102 that is disposed on the base, the base; J = a plurality of heat dissipation holes 1 〇 1 i are disposed, and a circuit board is disposed inside the base i 〇1 10 3. The heat dissipation structure described above includes: a heat dissipation air damper, a first heat sink 20 and a second heat sink 3 〇. The heat dissipating fan ^ is disposed inside the top surface of the cover body 〇2 of the casing HQ for introducing air into the casing .1 〇 进行 for heat dissipation. The first heat sink 20 includes a first vertical plate 2, a second first 2 2 and a plurality of heat sinks 23. The first vertical plate 2 is made of a thermally conductive metal material. The first vertical plate 2 is provided with a plurality of fixing holes 211, and the fixing holes 211 are penetrated to the first: 侧面 ίί2 side. The first heat sink 20 is disposed on the first vertical plate 20 The base of the shell limb 100 is close to the left side (as shown in the third figure), and is located below the cooling fan 1〇. 21 can be screwed through the fixed hole 211. Up to > - crystal 4 (not shown), the first wafer is contacted to help dissipate heat. H /, this, the second - leg 2 2 is stamped from a metal sheet, each leg 2 2 The central portion extends downwardly to form an insertion portion 2 which extends out of the bottom surface of the first vertical plate 21, and the insertion portion 22ι = M319451 (not bent to form - connect (4) 2 2 2, the position portion 2 2] The fixed circuit board 1 Ο 3 is inserted, and the pin portion 2 2 2 is pressed against the blood of the circuit board 1. The two first legs 2 2 are respectively fixed to the left and right sides of the first vertical plate 2 1 The bottom of the two sides is separated by an appropriate distance. ^The first heat-dissipating month 2 3 is made of a heat-conducting metal material, and the first heat-dissipating sheet 2 is in the form of a private heat, and the first vertical plate is 2 1 top, the ► 2: the first heat sink 23 between the sides ^^^ M319451 1 right side (as shown in the third figure). • When the cooling fan 1 () rotates, it will be introduced from the housing 1Q under the air to the inside of the housing 100, which The two moving gas system generated by the cooling fan 1 斜 flows obliquely downward in a spiral path. Therefore, the air flow near the left side of the base 2 1 follows the inclined first-diverging-flow guiding passage 24, and The scatter of the pedestal 1〇1 is discharged outside the casing; the second shovel along the right side of the pedestal 1〇1 will follow the inclined second 埶# q卩, S, A # + - and also the second diversion channel 34, by 4: and the Si piece 2 3, 3 3 is matched with the arrangement of the cooling fan 10, so that the wind resistance can be reduced, and the insects can be reduced. And at the same time make the board 丄〇3 The components (figure) can be cooled by the volcano. 4 1 Blowing 'can be faster. Please refer to the fifth and sixth figures for the first example. The difference between this and the first embodiment is: The second heat sink 3 3 bottom end of the second heat sink 3 3 extends to form a guiding portion 331 so that the flow can be guided to the heat through the guiding portion 31 Hole 1 011 '攸 and more heat surface shape is not limited, can be flat (four) r j ° Hai ¥ 43 3 1 table (figure omitted). It is a thousand I shape (as shown in the sixth figure) or curved shape - seed material: wheat:: the figure shown in the seven figure reveals that the other heat piece of the second radiator 20 is tilted by the ancients! 2 〇卩 散热 散热 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Therefore, the heat dissipation can be performed on the portion where the heat dissipation is required, so that the airflow of the cooling fan 10 can be concentratedly guided to the portion, and the heat can be dissipated for the portion to be talked about. Similarly, such a structure can also be applied to the second heat sink 30. '... Therefore, the heat dissipation structure of the present invention is provided with a plurality of fins 2 3 and 3 3 arranged obliquely, and a plurality of flow guiding channels 2 4 and 3 4 are formed between the heat sinks 2 3 and 3 3 . The flow guiding channels 24, 34 can force the airflow of the cooling fan 10 to be guided in a specified direction, and it is not easy to generate hot air recirculation inside the casing, and the electronic components on the circuit board are subjected to The cooling fan 1 is blown to improve the overall heat dissipation efficiency, thereby improving the output wattage of the power supply and allowing the dispersion to operate at a lower speed to reduce the noise generated.丄u 乂 乂 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Chen Ming. All are included in the creation of this creation. [Simplified illustration] The first picture is a perspective view of the conventional radiator. An exploded perspective view of the first embodiment of the creation. A partial perspective combination of the first embodiment of the creation. Figure side view of the second figure. : Partial perspective combination of the two embodiments. . Side view of the five figures.苐七图系本本本 [Main yuan## & one government... L 罟 〇 〇 】 】 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 319 A vertical plate 211 fixing hole Ά'- 22 first leg 221 insertion portion 222 pin portion 23 first heat sink 2 3 'first heat sink 2 3 1 guide portion 2 4 first flow channel 3 0 Two heat sink 31 > second vertical plate 3 11 • fixing hole 3 2 second leg 321 insertion portion 11 M319451 3 2 2 pin portion 33 second heat sink 3 3 1 guide portion 34 second flow guiding channel 10 0 Housing 1 0 1 Base louver 10 11 10 2 Cover I 103 Circuit board 12