TWM249306U - Socket connector - Google Patents

Description

M249306

[Technical field to which the new type belongs] This invention relates to a socket connector, in particular to a socket-connected solder ball, which can be properly attached to the terminal ^ through the structure of the soldering portion of the terminal, whereby the socket connector can be connected with The circuit board makes a good electrical connection. [Previous technology] With the advancement of integrated circuit technology, the improvement of equipment and the use of deep microsurgery, from large-scale integrated circuits (Large-Scale Integi; a ^, developed to ultra-large-scale integrated circuits (lntra Large-Scale Integration) ), The circuit density of silicon chips continues to increase, and the number of input (I / O) pins has increased sharply. In order to meet the needs of development, it is necessary to avoid the occurrence of crosstalk and crosstalk, and to cope with a large number of connections (in Blit Λ is becoming more and more stringent, such as C Ball Grid Array Package (BGA). However, even the best electronic components are packaged *; and connected to the circuit board. The 1 / 〇 terminals of the packaged electronic components are externally connected Both need to be packaged by the conductive end in the socket connector. The upper end of the conductive terminal is a solder joint with the electronic component. The soldering part is soldered to the circuit board by solder balls. First pass the f and the circuit board through the socket connector, and the good operation of all parts depends on the conductive terminals. The electronic f7 / and the circuit board have good soldering.

M249306 IV. Creation instructions (2) Socket connection No. 540851. It is soldered to a cross section of the circuit board terminal 90, which extends to contact the wafer and is connected to a soldering section 70. Welding part 9 of 0 is soldered to the sub-ball 9 Welding of gravity 0 Edge of gravity action Deflection unevenness Positioning is off, but transmission cannot be confirmed, and it is actually improved by the terminal. The reason is that this study is in line with the above-mentioned missing theory. [New content] The previous technology of the terminal of this creation is like the patent of the Republic of China. See the first figure for the prior art socket connector Side view. The socket connector 80 has a through-hole 82 to receive a terminal. The terminal 90 has a body 92, which extends upwardly and is connected to 94 by a long and narrow neck. The soldering portion 94 is provided with a solder ball 72 and a circuit board. The solder ball 72 is arranged on the plane of the terminal 94 from top to bottom, and then the overall socket connector 80 is borrowed from the circuit board. When the solder balls 7 2 were placed on the end portion 94 from top to bottom, they were originally evenly distributed to both ends. However, due to this, the dazzling solder balls 7 2 would shift toward the neck, showing a cloth phenomenon. As a result, the accuracy of welding and the quality of the solder joints on the terminals and the circuit board are reduced, which in turn affects the operation performance of the signal protection chip. . It can be seen from the above that the conventional socket connector, especially its use, obviously has the inconvenience and lack of existence. It can be improved by the creator when the above-mentioned deficiency is felt. It is a special potential application, and finally proposes a reasonable design and has = Creation. 4 The main purpose is to provide improved research when presetting the solder ball to the ground. The solder ball can be attracted to the neck and the creative instructions (3), so that the solder ball surface can be soldered to the circuit board without bias. In order to reach the above-mentioned electronic component and circuit, the socket connector package hole, the corresponding through holes in each of the through holes are convexly engaged with the body, and the body extends upwardly from the body's downward ball joint surface and part . The following figures are used to describe these descriptions. They are only for limitation. [Embodiment] Please refer to the bottom view of the second. The third socket connector 2. 2 4 'and the plural terminal connector 2 0 are used to confirm The ground is distributed at the soldering ends of the terminals to ensure accuracy without offset, thereby improving the operation of the chip. The socket is made of solder balls with connectors and circuits, and a plurality of terminal bodies. It is housed in its own end, which is connected to the soldering end, and the balance of the tin is in a slot. The edge of the conductive end of the soldering end extends outwards in contact. The details are described below. Directly away from the neck of the terminal, to improve the quality of welding, one of the works is electrically connected, and includes: an insulating housing, which has self-forming engagement grooves; inside, each terminal includes a portion to be clamped. At the engagement and electrically bending and extending with the electronic component; wherein the part of the soldering end will explain the creation of this creation better, three pictures, the second picture is part A of the second picture of the creation Share FIG enlarged. A plurality of through holes 20 are formed in the insulating case 2 2 and are inserted into the through holes 24. The socket is electrically connected to the circuit board 3 〇, M249306 circuit board 3 〇 the insulating case 2 2 is inside the plurality of terminals 22 of the terminal, and can be used for the fifth figure The fifth picture is the terminal 10. This terminal 1 is connected to terminal 16. The card is fixed to the 3 by the electronic element body 12 to 16 on the notebook and the near terminals in the connector, 1 0, and 1 8 are arranged in a flat circle in balance, such as bonding ( Please refer to the sixth m &; 2 edge material, which is 4 ^: related to fixation. This creation and self-contained in the socket with connection = 3 〇 junction. Among them, the connection ball grid array packaged electronic element fourth The picture shows that the inserted plug is conductive and includes the body 1 through hole 2 2 body 12 2 (the terminal 1 of the body 1 2 is not bent below), and the soldering end is formed by the solder ball 4 disc. In this case, the card is connected to one of the main bodies 2 with a good connection of the creative base. The extension is electrically extended, and the interval is 0. For the 16 balanced ends, the welding points for the sub-balanced parts 3, the creative instructions (4 ) Through the solder ball 4 Q and the hole 2 4 of the seat connector 2 0, the through-hole socket connector 2 which penetrates into the socket 2 4 socket connector 2 〇 connector 2 〇. See the fourth Partial perspective view, partial perspective view. The pressing and bending process is established and 1 3, and one side of the welding is convex outward. The contact 1 socket connector 2 〇connected) and 16 is caused by the uneven insertion of the neck at the welding end, which affects the balanced portion of the adjacent ball 40, which extends beyond the joint surface. In contrast, the metal strip of the terminal in the socket connector is punched 1 2. A contact engagement portion 14 is formed by the engaging groove 2 4 2 and is electrically connected to the assembly. The puppet forms an elongated shape to avoid the distribution of solder balls, and has a local edge to receive the tin. The welding 1 8 is in balance with the book 16

M249306 IV. Creative Instructions (5) Part ^ 8. When the solder ball is set upside down when the socket connector is inverted, the molten solder ball can be used by the balance part], ping and 1 b end 1 6 joint surface 1 6 0 A one-way shift to the terminal 丄 n 'towards the balance 2 along the influence of the welding gravity will not cause the situation of uneven sentence. The solder ball is a phenomenon of the directionable part, and the joint surface 160 and the balance part are set in this shape, which effectively improves the unidirectional deviation of the solder ball, so that the tin: "'can effectively improve the socket connector 20 and electricity; Quality, thereby improving the efficiency of chip operation. UJ: The role of the balance part 18 in this dry creation is too μ% HA, such as using the neck of the terminal 10 to suck this = the solder ball balance setting. 0 This balance part 丄 8 may be— ί a horizontal plate-shaped body protruding outward, and 1 is connected to this: n L Κ plane 'or it is slightly inclined like the neck, so that the balance part ... if it is provided at the welding end " 的 Local edge " :: 部 =, or horizontally, or slightly upwardly extended, lean distribution is more uniform. χ ^ ^ side welding: = the socket connection f and the circuit board are connected. It is further known that the joint surface 16 of the terminal 16 is further possible. Another convex portion 16 2 is provided. The convex portion 16 2 can increase the welding and improve the conduction of the electrical connection. Moreover, since the convex portion 16 2 also presents When the array G connector 2 is placed on the circuit board 3, it has a terminal 乂 'which is right on the circuit board 3 and the solder ball 4. Function. Or M249306 IV. Creation instructions (6) The joint surface 16 can also form a recessed recess (not shown). The recess can be set in accordance with the radian of the solder ball 40. Same as below It can increase the soldering area, and also has the function of aligning the terminal 10 with the solder ball 40 on the circuit board 30. The number of convex or concave holes is not limited to one, it becomes one of the terminals. Calibration device. Therefore, with the socket connector and its terminals created by this creation, when the socket connector is subjected to high-temperature hot-baking welding, the solder ball can be appropriately placed at the welding portion of the terminal, and a good distance from the adjacent terminal is maintained. In order to improve the quality of socket connector soldering, and thus improve the operating efficiency of the chip.

—1 ~ mouth K release weighs four depressions and structures, which can increase the soldering area and improve the conduction of the electrical connection, and the end can be aligned with the solder ball on the circuit board, t can ensure the assembly and welding process Quality. To sum up, this practice has met the requirements of the new patent. According to law, it ca n’t be used to limit the scope of the right of this creation. The car: Jiaguan is just an example. The equal changes or modifications made are still too. ⑷: In accordance with this creative application, please invite reviewers to take time and look forward to the scope covered earlier. Shang Debian. Granted a patent to encourage creativity, real sense

Brother page 10 M249306 Type 1 Simple Description Schematic Illustration] Figure Figure 3 Figure 4 Figure 4 Figure 5 Figure 6 Figure 6 is a cross-sectional view of the terminals and circuit board of the known socket connector.糸 Bottom view of the socket connector for this creation. It is an enlarged view of part A in the second figure. This is a partial perspective view of the socket connector of this creation. 1 糸 The partial perspective view of the terminals in the socket connector of this creation is the side view of the junction of the socket connector and the circuit board of this creation [Reference number in the drawing] [Knowledge] Circuit board 7 0 Solder ball 7 2 Socket connector 8 0 Through hole 8 2 Terminal 9 0 Body 9 2 [This creation] Terminal 1 0 Body 1 2 Engagement part 1 4 Joint surface 1 6 Convex part 1 6 Socket connector 2 0 Gap 8 4

Welding Department

Contact end 13 Welded end 16 Balance 1 g

M249306

Page 12

Claims (1)

M249306 5. Scope of patent application 1. One connection, and a plurality of cards formed by self-insulation including: Electrical connection in the engaging slot; The terminal has an edge extending outward 2. If the socket is connected 3, such as The soldering end is 4, if the balance part is 5, if the balance part is 6, if the balance part is 7, such as a socket connector, which provides electronic components and circuits joined by a solder ball and a circuit board, and the socket connection The device package is redundant and has a plurality of through holes, the through grooves; and the terminals are received in the corresponding through holes, and each body has an engaging portion protruding from both sides of the body. '9 is a balance application device that extends upwards from the body and undertakes the balance with the electrical contact end and the welding end. Please use it in a flat plane. Please refer to this application and the connection application by the welding application.' Department of tin balls. The profit range is connected to the profit range. The disk-shaped profit range is generally the profit range. The surface range is the range of the profit range. The joint is slightly extended. The body is bent downward to extend; its joint surface, and the first ball grid array of the weld end. The socket described in item 1 of the socket is provided oppositely to the socket described in item 1. The socket described in item 1 is on the same plane. The socket described in item 1 is tilted slightly upward. The electrical connector of the socket connector sub-component connector connector connector board described in the first item is electrically connected to the terminal package in the hole and fixed to the soldered local edge of the sub-component, where 0, among which, among which the connector, Where connector where Page 13 M249306 V. Scope of patent application A calibration device is formed on the joint surface of the terminal. 8. The socket connector according to item 7 of the scope of patent application, wherein the calibration device is at least one convex portion. 9. The socket connector according to item 7 of the scope of patent application, wherein the calibration device is at least one recessed concave hole. Page 14