TWI815506B - Modular refrigerating device - Google Patents

Abstract

A modular refrigerating device for dissipating heat producing by a heat radiation module of an electronic device is provided. The modular refrigerating device has an even temperature module and at least one external module. The even temperature module has a housing and an even temperature plate. A first end of the even temperature plate is disposed in the housing and a second end is extended outside the housing. The at least one external module is disposed on the even temperature module. The second end of the even temperature plate is adapted to be in contact with part of the heat radiation module, and the at least one external module is adapted to be overlapped with the housing of the even temperature module.

Description

Modular refrigeration device

The present invention relates to a refrigeration device, and in particular to a modular refrigeration device externally connected to an electronic device.

Today's consumer electronics products are constantly reducing their size while improving their performance. However, improving performance and reducing their size are in conflict with each other. As the size of electronic products shrinks, the space available for heat dissipation inside them also shrinks. Nowadays, external cooling equipment has been developed. In high-efficiency mode, the external cooling equipment is connected, and in normal mode, the external cooling equipment is removed.

However, existing external heat dissipation equipment has the following shortcomings: 1. The structure is complex, making it bulky and difficult to carry. 2. It adopts fixed specifications and can only be applied to specific electronic products, and cannot add or replace the heat dissipation structure to dissipate heat. The performance cannot be improved according to demand, and it cannot be applied to electronic products of other specifications.

The present invention provides a modular refrigeration device that can assemble different external modules according to needs, increasing the diversity of the refrigeration device. The modular feature can also simplify the structural complexity of the refrigeration device, thereby reducing the size. And easy to carry.

The modular refrigeration device of the present invention is used to dissipate heat from a heat dissipation module in an electronic device. The modular refrigeration device includes a temperature equalizing module and at least one external module. The temperature equalizing module has a shell and a temperature equalizing sheet. A first end of the temperature equalizing sheet is disposed in the housing, and a second end of the temperature equalizing sheet protrudes outside the housing. At least one external module is configured in the temperature equalizing module. The second end of the temperature equalizing sheet is adapted to contact a part of the heat dissipation module, and at least one external module is adapted to overlap the shell of the temperature equalizing module.

Based on the above, the modular refrigeration device of the present invention is suitable for existing electronic devices such as notebook computers, smart phones, tablet computers or game controllers. The temperature equalization module can be equipped with one or more external modules according to needs to improve its heat dissipation performance. In addition, the modular refrigeration device of the present invention has the advantages of diversity and simplified structure. The required external modules can be selected according to the electronic device to be installed, and can also be disassembled separately for portability.

FIG. 1A is a schematic three-dimensional view of a modular refrigeration device according to an embodiment of the present invention. FIG. 1B is an exploded schematic diagram of the modular refrigeration device of FIG. 1A . FIG. 2C is a perspective view of the modular refrigeration device of FIG. 1A combined with an electronic device.

Referring to FIGS. 1A and 2C , the modular refrigeration device 100 of the present invention is used to dissipate heat from a heat dissipation module 210 in an electronic device 200 . The electronic device 200 shown in FIG. 2C is a notebook computer. In other embodiments, the electronic device 200 is, for example, a desktop computer, a smart phone, a tablet computer, or a gaming controller. The present invention does not limit the combination objects of the modular refrigeration device 100 .

FIG. 1C is an exploded schematic diagram of the temperature equalizing module of FIG. 1A . FIG. 1D is an exploded schematic diagram of the temperature equalizing module of FIG. 1C from another angle.

Referring to FIGS. 1A to 1C , the modular refrigeration device 100 of the present invention includes a temperature equalizing module 110 and at least one external module 120 .

The temperature equalizing module 110 has a shell 111 and a temperature equalizing sheet 112 . The housing 111 has an internal space IS and the temperature equalizing sheet 112 is inserted through the housing 111 . A first end E1 of the temperature equalizing sheet 112 is disposed in the internal space IS of the housing 111 and a second end of the temperature equalizing sheet 112 is disposed in the internal space IS of the housing 111 . E2 protrudes outside the housing 111 . At least one external module 120 is disposed on the temperature equalizing module 110 in a superimposed manner. In this embodiment, at least one external module 120 includes a first fan module 121 and a second fan module 124. In the example of FIG. 1B , the first fan module 121 is located at the top of the housing 111 , and the second fan module 124 is located at the bottom of the housing 111 .

However, the positions of the first fan module 121 and the second fan module 124 can be reversed, that is, the first fan module 121 is located at the bottom of the casing 111, and the second fan module 124 is located at the top of the casing 111. The invention is not limited to the configuration shown in Figure 1B.

Referring to FIG. 2C , the second end E2 of the temperature vapor plate 112 is adapted to contact a part of the heat dissipation module 210 in the electronic device 200 to form a heat conduction path. Specifically, the heat H of the heat dissipation module 210 is conducted to the first end E1 of the temperature equalizing sheet 112 through the second end E2 of the temperature equalizing sheet 112, and the first fan module 121 and/or of at least one external module 120 The second fan module 124 is adapted to overlap the casing 111 of the temperature equalizing module 110, so that the heat H transferred to the first end E1 is air-cooled and dissipated through the external module 120 (provided by the second fan module 124) and/or thermoelectric cooling and heat dissipation (provided by the first fan module 121) to improve the heat dissipation performance of the electronic device 200.

Regarding the switching architecture of the temperature equalization module 110, the specific description is as follows.

First, referring to FIGS. 1B to 1D , the temperature equalizing module 110 has a first transfer structure 113 , a first engaging structure 114 and a heat dissipation layer 115 . The first adapter structure 113 is disposed on one side of the housing 111 and covers the first end E1 of the temperature equalizing sheet 112. The first adapter structure 113 is partially located in the internal space IS. The first engaging structure 114 is disposed on the other side of the housing 111 relative to the first adapter structure 113 , and the first engaging structure 114 penetrates the housing 111 and contacts the first end E1 of the temperature equalizing sheet 112 . The heat dissipation layer 115 is disposed between the first transfer structure 113 and the first end E1 of the temperature equalizing sheet 112 (see FIG. 2B ). The heat dissipation layer 115 is made of, for example, silicone, metal or other thermally conductive materials.

FIG. 1E is an exploded schematic diagram of the first switching structure of FIG. 1C. 1F and 1G are perspective views of the switching action of the first switching structure of the temperature equalizing module of FIG. 1C. FIG. 2A is a schematic cross-sectional view of the modular refrigeration device of FIG. 1A. FIG. 2B is an exploded schematic cross-sectional view of the modular refrigeration device of FIG. 1B .

Referring to FIG. 1C and FIG. 1E , the first adapter structure 113 has a positioning ring 1131 , a rotating ring 1132 and a plurality of fastening pieces 1133 . The positioning ring 1131 and the rotating ring 1132 are spaced apart from each other. The plurality of fastening pieces 1133 are slidably received between the positioning ring 1131 and the rotating ring 1132. The plurality of fastening pieces 1133 overlap each other. In detail, multiple clamping pieces 1133 need to have an inclination angle when stacked on each other. This tilt angle is proportional to the number of clamping pieces 1133 , that is, the more the number of clamping pieces 1133 , the greater the inclination angle, Figure 1E Shown are five fasteners 1133 with an inclination angle of approximately 92.5 degrees.

Referring to Figure 1D, Figure 1F and Figure 1G, the rotating ring 1132 is adapted to rotate relative to the positioning ring 1131, so that the plurality of fastening pieces 1133 are adapted to protrude on the inner diameter sides of the positioning ring 1131 and the rotating ring 1132. Referring to FIGS. 2A and 2B , the rotating ring 1132 and the plurality of fastening pieces 1133 are located in the internal space IS of the housing 111 .

Referring to FIG. 1C and FIG. 1E , the positioning ring 1131 has a plurality of slide grooves SG, and the rotating ring 1132 has a plurality of through holes TH. A sliding column 1134 of each clamping piece 1133 is disposed in the corresponding slide groove SG, and a rotating shaft 1135 of each clamping piece 1133 is pivotally connected to the corresponding through hole TH. Referring to Figure 1F and Figure 1G, when the rotating ring 1132 rotates relative to the positioning ring 1131, each rotating shaft 1135 of each clamping piece 1133 pivots in each through hole TH, so that each sliding column 1134 of each clamping piece 1133 is in each slide groove. The movement in SG causes all the fastening pieces 1133 to partially protrude on the inner diameter sides of the positioning ring 1131 and the rotating ring 1132 .

Referring to Figures 1E to 1G, the rotating ring 1132 has a lever L, which is movably inserted through a guide groove 1111 of the housing 111. The lever L has a slot FG, and the guide groove 1111 is formed with a first protrusion. Point P1 and a second bump P2. Referring to FIG. 1E , when the slot FG is engaged with the first protruding point P1 , a plurality of clamping pieces 1133 are stored between the positioning ring 1131 and the rotating ring 1132 . Referring to FIG. 1G , when the slot FG is engaged with the second protruding point P2 , a plurality of clamping pieces 1133 partially protrude from the inner diameter sides of the positioning ring 1131 and the rotating ring 1132 . Through the positioning of the first protruding point P1 and the second protruding point P2, the plurality of fastening pieces 1133 can be stable and not easily rotated.

Referring to FIG. 1C, FIG. 1D and FIG. 2A, the first engaging structure 114 has a engaging portion 1141 and a first groove G1. The clamping portion 1141 is connected to the housing 111 and contacts the first end E1 of the temperature equalizing sheet 112 . The first groove G1 is formed around a peripheral surface of the first engaging structure 114. In this embodiment, the first engaging structure 114 can also be made of a thermally conductive metal material such as copper or aluminum, thereby transmitting The heat H that reaches the temperature equalizing sheet 112 escapes out of the housing 111 along the clamping portion 1141 . Referring to FIG. 1D , an outer diameter of the first engaging structure 114 is smaller than an outer diameter of the housing 111 .

Based on the above-mentioned first switching structure 113 , the temperature equalization module 110 can be assembled with an external module 120 in a clamping manner through a plurality of clamping pieces 1133 . As for the clamping portion 1141, in addition to dissipating the heat H of the temperature equalizing sheet 112, another external module 120 can also be clamped to cooperate with the clamping portion 1141. Therefore, the present invention Through one temperature equalizing module 110, the technical effect of installing multiple external modules 120 can be achieved.

Regarding the transfer structure of the external module 120, the following description is as follows:

FIG. 1H is an exploded schematic diagram of the first fan module of FIG. 1B .

If the external module 120 uses the first fan module 121, refer to FIGS. 1A, 1B, 1H and 2A and 2B. The first fan module 121 has a housing 1211 and a fan blade 1212. The fan blade 1212 can It is rotatably arranged in the housing 1211, and the housing 1211 is formed with an air inlet. A second adapter structure 122 is disposed on one side of the housing 1211 and covers the fan blade 1212 . A second engaging structure 123 is disposed on the other side of the housing 1211 relative to the second adapter structure 122 . In the example of FIG. 2A and FIG. 2B , the first fan module 121 is assembled on the first adapter structure 113 of the temperature equalizing module 110 through the second engaging structure 123 , so that the first fan module 121 overlaps the temperature equalizing module 113 . The top of the module 110 , and the second engaging structure 123 is in contact with the heat dissipation layer 115 . Alternatively, the first fan module 121 is assembled on the first engaging structure 114 of the temperature equalizing module 110 through the second adapter structure 122 so that the first fan module 121 overlaps the bottom of the temperature equalizing module 110. It can be easily understood by those with ordinary knowledge in the art, so the illustration is omitted.

Referring to FIG. 1A , FIG. 2A and FIG. 2B , the second adapter structure 122 has a positioning ring 1221 , a rotating ring 1222 and a plurality of fastening pieces 1223 . In this embodiment, the details of the second switching structure 122 are the same as the aforementioned first switching structure 113, and therefore will not be described again. The second engaging structure 123 has a engaging portion 1231 and a second groove G2. The second groove G2 is formed around a peripheral surface of the second engaging structure 123. In this embodiment, the structural details of the second engaging structure 123 are the same as those of the first engaging structure 114 .

It also includes a cooling module 127, which is disposed between the shell 1211 and the second engaging structure 123. However, it should be noted that the function of the cooling module 127 is to exchange heat and cold with the second engaging structure 123 made of metal. Thermoelectric cooling and heat dissipation.

In addition, the first fan module 121 further has a metal heat sink that surrounds the fan blade 1212 and is used to assist in absorbing the heat H from the first end E1 to accelerate the air cooling of the heat.

Referring to Figure 1A, the first fan module 121 is overlapped on the top of the temperature equalizing module 110. During the assembly process, referring to Figure 2B, the first fan module 121 is aligned on the top of the temperature equalizing module 110, and the second The engaging structure 123 is located above the first adapter structure 113 . Referring to FIG. 2A , when the second engaging structure 123 is assembled in the first adapter structure 113 , the plurality of fastening pieces 1133 of the first adapter structure 113 are driven by the rotating ring 1132 and enter the second engaging structure 123 . There are two grooves G2, so the first adapter structure 113 is fastened to the second fastening structure 123 through the plurality of fastening pieces 1133, so that the first fan module 121 and the temperature equalizing module 110 are fastened to each other.

Referring to Figure 1F, Figure 1G and Figure 2B, in short, in order to lock the first fan module 121 and the temperature equalizing module 110, the second engaging structure 123 is inserted into the temperature equalizing module 110, and the first The lever L of the rotating ring 1132 of the transfer structure 113 drives the rotating ring 1132 to rotate through the lever L, and links the plurality of fastening pieces 1133 to move toward the center of the temperature equalization module 110, so that the plurality of fastening pieces 1133 enter the third The two grooves G2 are fastened to the second engaging structure 123 of the first fan module 121 by clamping.

Referring to FIGS. 2A and 2B , when the second adapter structure 122 is assembled on the first engaging structure 114 , the plurality of fastening pieces 1223 of the second adapter structure 122 enter the first groove of the first engaging structure 114 G1, so that the first fan module 121 and the temperature equalizing module 110 are locked with each other.

FIG. 1I is a schematic perspective view of the second fan module of FIG. 1C from another angle.

If the external module 120 uses a second fan module, refer to Figures 1A, 1B, 1I, 2A, and 2B. The second fan module 124 has a housing 1241 and a fan blade 1242. The fan blade 1242 can rotate. Ground is configured in the housing 1241. A third adapter structure 125 is disposed on one side of the housing 1241 and covers the fan blade 1242 . A third engaging structure 126 is disposed on the other side of the housing 1241 relative to the third adapter structure 125. The only difference is that the third engaging structure 126 and the housing 1241 are integrally formed, and the third engaging structure 126 is formed with a through-hole. The air outlets on its upper and lower surfaces allow the airflow of the rotating fan to convection between the air inlet and the air outlet.

Referring to FIG. 2A and FIG. 2B , the second fan module 124 is assembled on the first engaging structure 114 through the third adapter structure 125 so that the second fan module 124 overlaps the bottom of the temperature equalizing module 110 . Alternatively, the second fan module 124 is assembled on the first adapter structure 113 through the third engaging structure 126 so that the second fan module 124 overlaps the top of the temperature equalizing module 110. This is common knowledge in the art. It can be easily thought of, so the diagram is omitted.

Referring to FIG. 1A , FIG. 2A and FIG. 2B , the third adapter structure 125 has a positioning ring 1251 , a rotating ring 1252 and a plurality of fastening pieces 1253 . In this embodiment, the details of the third switching structure 125 are the same as the aforementioned first switching structure 113, and therefore will not be described again. The third engaging structure 126 has a engaging portion 1261 and a third groove G3. The third groove G3 is formed around a peripheral surface of the third engaging structure 126. In this embodiment, the structural details and materials of the third engaging structure 126 are the same as those of the aforementioned first engaging structure 114, and therefore will not be described again.

Referring to Figure 1A, the first fan module 121 overlaps the top of the temperature equalizing module 110. During the assembly process, referring to Figure 2B, the second fan module 124 is aligned at the bottom of the temperature equalizing module 110, and the third The adapter structure 125 is located below the first engaging structure 114 . Referring to FIG. 2A , when the first engaging structure 114 is assembled in the third adapter structure 125 , the plurality of fastening pieces 1253 of the third adapter structure 125 are driven by the rotating ring 1252 and enter the third portion of the first engaging structure 114 . A groove G1, so the third adapter structure 125 is locked to the first locking structure 114 through the plurality of locking pieces 1253, so that the second fan module 124 and the temperature equalizing module 110 are locked with each other.

FIG. 3A is a schematic three-dimensional view of the temperature equalizing module of FIG. 1A connected to the heat dissipation module. FIG. 3B is a schematic perspective view of the temperature equalizing module in FIG. 3A connected to the heat dissipation module from another angle.

Referring to FIG. 2C , FIG. 3A and FIG. 3B , the heat dissipation module 210 of the electronic device 200 includes at least one heat source 211 , a heat conductor 212 and at least one heat pipe 213 . The thermal conductor 212 has an engaging portion 2121 and a latching groove 2122, and the engaging portion 2121 is located in the latching groove 2122. At least one heat pipe 213 is connected between the heat conductor 212 and the heat source 211. In this embodiment, the two ends of the at least one heat pipe 213 are in surface contact with at least one heat source 211 and the heat conductor 212 respectively.

Furthermore, the second end E2 of the temperature equalizing sheet 112 forms a fitting groove 1121 . The engaging portion 2121 of the thermal conductor 212 is engaged with the fitting groove 1121 of the temperature equalizing sheet 112 . The fitting groove 1121 has a shape corresponding to the engaging portion 2121 and the engaging groove 2122 accommodates the second end E2 of the temperature equalizing sheet 112 . In other embodiments, the second end of the temperature equalizing sheet forms an engaging portion, and a fitting groove is formed in the slot of the thermal conductor. Then the temperature equalizing sheet and the thermal conductor can also achieve the purpose of engaging each other through concave and convex matching. .

Referring to FIG. 2C and FIG. 3A to FIG. 3B , the present invention conducts the heat H generated by the electronic device 200 to the heat conductor 212 through the heat pipe 213 . The heat conductor 212 transfers the received heat H from the second end E2 of the temperature equalizing sheet 112 The heat H is transferred to the first end E1 of the temperature equalizing sheet 112 , thereby discharging the heat H to the electronic device 200 , so that the thermal cycle of the electronic device 200 is extended to the modular refrigeration device 100 , and the heat H is prevented from being accumulated in the electronic device 200 .

Referring to FIGS. 2A to 2C , after the heat H is transferred to the first end E1 of the temperature equalizing sheet 112 , the heat H is then transferred to the heat dissipation layer 115 , the second engaging structure 123 and the first engaging structure 114 . A fan module 121 and a second fan module 124 perform cooling.

FIG. 3C is a schematic three-dimensional view of the temperature equalizing module of FIG. 1A connected to a heat dissipation module of another embodiment.

2C and 3C, in this embodiment, the heat dissipation module 210a of the electronic device 200 includes two heat sources 211a, two fans 212a, a plurality of heat conductors 213a, two first heat pipes 214a and a second heat pipe 215a. The two heat sources 211a are located between the two fans 212a, and the two heat conductors 213a are respectively arranged on one side of the two fans 212a. Each fan 212a has an engaging portion 2121a. The engaging portion 2121a of each fan 212a is engaged with the fitting groove 1121 of the temperature equalizing sheet 112. The shape of the fitting groove 1121 corresponds to the engaging portion 2121a, and the temperature equalizing sheet 112 has an engaging portion 2121a. The second end E2 is in surface contact with the corresponding heat conductor 213a. Each first heat pipe 214a is connected between the corresponding heat source 211a and the heat source 211, and the two ends of each first heat pipe 214a are in surface contact with the corresponding heat source 211a and the heat source 212 respectively. The second heat pipe 215a is in surface contact with the two heat sources 211a, and its two ends are respectively in surface contact with the two heat conductors 213a located on the two fans 212a.

FIG. 4 is a perspective view of another connection sequence of the modular refrigeration device in FIG. 1A . Referring to FIG. 2B and FIG. 4 , in the embodiment shown in FIG. 4 , the first fan module 121 is between the second fan module 124 and the temperature equalizing module 110 . The first fan module 121 passes through the second card. The coupling structure 123 is assembled on the first adapter structure 113, so that the first fan module 121 overlaps the top of the temperature equalizing module 110, and the second fan module 124 is assembled on the second adapter structure through the third engaging structure 126. 122, so that the second fan module 124 overlaps the top of the first fan module 121, thereby enhancing the effect of effective heat dissipation in the electronic device.

To sum up, the modular refrigeration device of the present invention is suitable for existing electronic devices such as notebook computers, smart phones, tablet computers, game controllers, etc. The temperature equalization module can be equipped with one or more external modules according to needs to improve its heat dissipation performance. In addition, the modular refrigeration device of the present invention has the advantages of diversity and simplified structure. The required external modules can be selected according to the electronic device to be installed, and can also be disassembled separately for portability.

Furthermore, when the electronic device switches to high-efficiency mode and the temperature inside the system body rises, the temperature equalization module can install a fan module and an auxiliary fan module according to the needs to superimpose the modular refrigeration device. In addition, the fan module and auxiliary fan module can be stacked on the temperature equalizing module in sequence or stacked on opposite sides of the temperature equalizing module.

100: Modular refrigeration device 110: Uniform temperature module 111: Shell 1111:Guide slot 112: Temperature equalizing film 1121: Fitting slot 113: First transfer structure 1131, 1221, 1251: Positioning ring 1132, 1222, 1252: rotating ring 1133, 1223, 1253: card fixing piece 1134:Sliding column 1135:Rotating axis 114: First engaging structure 1141: The first clamping part 115:Heat dissipation layer 120:External module 121:The first fan module 1211, 1241: Shell 1212, 1242: fan blades 122: Second transfer structure 123: Second engaging structure 124: Second fan module 125:Third transfer structure 126: The third engaging structure 127: Refrigeration module 200:Electronic devices 210: Cooling module 211, 211a: heat source 212, 213a: Thermal conductor 212a:Fan 2121, 2121a: engaging part 2122:Card slot 213:Heat pipe 214a: First heat pipe 215a: Second heat pipe H: heat L: Toggle lever E1: first end E2: Second end FG:card slot G1: First trench G2: Second trench G3: The third trench IS: internal space P1: first bump P2: The second bump SG: chute TH: perforation

FIG. 1A is a schematic three-dimensional view of a modular refrigeration device according to an embodiment of the present invention. FIG. 1B is an exploded schematic diagram of the modular refrigeration device of FIG. 1A . FIG. 1C is an exploded schematic diagram of the temperature equalizing module of FIG. 1A . FIG. 1D is an exploded schematic diagram of the temperature equalizing module of FIG. 1A from another angle. FIG. 1E is an exploded schematic diagram of the first switching structure of FIG. 1C. 1F and 1G are perspective views of the switching action of the first switching structure of the temperature equalizing module of FIG. 1C. FIG. 1H is an exploded schematic diagram of the first fan module of FIG. 1B . FIG. 1I is a schematic perspective view of the second fan module of FIG. 1C from another angle. FIG. 2A is an exploded schematic cross-sectional view of the modular refrigeration device of FIG. 1B . Figure 2B is a schematic cross-sectional view of the modular refrigeration device of Figure 1A. FIG. 2C is a perspective view of the modular refrigeration device of FIG. 1A combined with an electronic device. FIG. 3A is a schematic three-dimensional view of the temperature equalizing module of FIG. 1A connected to the heat dissipation module. FIG. 3B is a schematic perspective view of the temperature equalizing module in FIG. 3A connected to the heat dissipation module from another angle. FIG. 3C is a schematic three-dimensional view of the temperature equalizing module of FIG. 1A connected to a heat dissipation module of another embodiment. FIG. 4 is a perspective view of another connection sequence of the modular refrigeration device in FIG. 1A .

100: Modular refrigeration device

112: Temperature equalizing film

200:Electronic devices

210: Cooling module

Claims (12)

A modular refrigeration device is used to dissipate heat from a heat dissipation module in an electronic device. The modular refrigeration device includes: a temperature equalizing module with a shell and a temperature equalizing sheet. A first end of the sheet is disposed in the housing and a second end of the temperature equalizing sheet protrudes outside the housing; and at least one external module is configured in the temperature equalizing module, wherein the temperature equalizing sheet The second end is adapted to contact part of the heat dissipation module, and the at least one external module is adapted to overlap the shell of the temperature equalizing module. The modular refrigeration device of claim 1, wherein the heat dissipation module includes: at least one heat source; a heat conductor with an engaging portion; and at least one heat pipe connected between the heat conductor and the heat source. , wherein the second end of the temperature equalizing sheet forms a fitting groove, and the engaging portion of the thermal conductor is engaged with the fitting groove of the temperature equalizing sheet, wherein the shape of the fitting groove corresponds to The engaging part. The modular refrigeration device as claimed in claim 1, wherein the temperature equalizing module further has: a first transfer structure disposed on one side of the housing and covering the first end of the temperature equalizing sheet; And a first engaging structure is arranged on the other side of the housing relative to the first adapter structure, and the first engaging structure contacts the first end of the temperature equalizing sheet. The modular refrigeration device according to claim 3, wherein the at least one external module has: a first fan module having a casing and a fan blade, the fan blade is arranged in the casing, and; A second adapter structure is disposed on one side of the housing and covers the fan blade; and a second engaging structure is disposed on the other side of the housing relative to the second adapter structure, wherein through the second engaging structure The coupling structure is assembled on the first adapter structure or the second adapter structure is assembled on the first engaging structure, so that the first fan module overlaps the temperature equalizing module. The modular refrigeration device as claimed in claim 4, wherein when the second engaging structure is assembled on the first adapter structure, the plurality of fastening pieces of the first adapter structure enter the second engaging structure. A second groove is formed around a peripheral surface of the second engaging structure. The modular refrigeration device as claimed in claim 4, wherein when the second adapter structure is assembled on the first engaging structure, the plurality of fastening pieces of the second adapter structure enter the first engaging structure. A first groove of the structure, wherein the first groove is formed around a peripheral surface of the first engaging structure. The modular refrigeration device as claimed in claim 6, wherein the first adapter structure and the second adapter structure both have a positioning ring, a rotating ring and a plurality of fastening pieces, and the positioning ring and the rotating ring The rings are spaced apart from each other, the fastening pieces are slidably stored between the positioning ring and the rotating ring, the fastening pieces overlap each other, and The rotating ring is adapted to rotate relative to the positioning ring, so that the clamping piece portions are adapted to protrude on the inner diameter sides of the positioning ring and the rotating ring. The modular refrigeration device as claimed in claim 7, wherein the positioning ring has a plurality of slide grooves, the rotating ring has a plurality of through holes, and a sliding column of each fastening piece passes through the corresponding slide groove. , and a rotating shaft of each clamping piece is pivotally connected to the corresponding through hole. The modular refrigeration device as claimed in claim 8, wherein when the rotating ring rotates relative to the positioning ring, each rotating shaft of each clamping piece pivots in each through hole, so that each clamping piece Each sliding column moves in each slide groove to drive the clamping pieces to protrude on the inner diameter side. The modular refrigeration device according to claim 4 further has a refrigeration module disposed between the shell of the first fan module and the second engagement structure. The modular refrigeration device of claim 4, wherein the at least one external module has a second fan module, and the temperature equalization module is between the second fan module and the first fan module. between groups. The modular refrigeration device of claim 3, wherein the temperature equalizing module further has a heat dissipation layer disposed in the housing, and the heat dissipation layer is disposed between the first transfer structure and the first end. between.

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