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TWI802190B - A manufacturing method of a light emitting apparatus - Google Patents

A manufacturing method of a light emitting apparatus Download PDF

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Publication number
TWI802190B
TWI802190B TW110149430A TW110149430A TWI802190B TW I802190 B TWI802190 B TW I802190B TW 110149430 A TW110149430 A TW 110149430A TW 110149430 A TW110149430 A TW 110149430A TW I802190 B TWI802190 B TW I802190B
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Taiwan
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light
adhesive material
absorbing adhesive
emitting element
absorbing
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TW110149430A
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Chinese (zh)
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TW202327146A (en
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趙益聖
陳冠勳
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友達光電股份有限公司
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Priority to TW110149430A priority Critical patent/TWI802190B/en
Priority to CN202210505797.5A priority patent/CN114975695A/en
Priority to KR1020220151489A priority patent/KR20230101696A/en
Application granted granted Critical
Publication of TWI802190B publication Critical patent/TWI802190B/en
Publication of TW202327146A publication Critical patent/TW202327146A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A manufacturing method of a light emitting apparatus includes the following steps: placing a plurality of light emitting devices on a circuit board, forming a first light absorption adhesive between each of the plurality of light emitting devices, in which the plurality of light emitting devices includes a first light emitting device, and the first light absorption adhesive has a first portion surrounding the first light emitting device, performing an etch process to remove the first portion of the first light absorption adhesive, replacing the first light emitting device with a second light emitting device, pressing a second light absorption adhesive to the first light absorption adhesive such that a portion of the second light adsorption adhesive surrounds the second light emitting device and covers two sides of the light emitting devices.

Description

一種發光裝置的製造方法A method of manufacturing a light emitting device

本發明是有關於一種發光裝置的製造方法。The invention relates to a manufacturing method of a light emitting device.

發光二極體顯示裝置具有多個發光二極體(light emitting diode；LED)，發光二極體具有高解析度、省電、壽命長的優點，在目前微型發光二極體顯示裝置的製作過程中，需透過巨量轉移將大量的發光二極體轉置至另一基板上，並進行封裝。為了提高顯示裝置的良率，封裝後會進行檢測來移除失效的微型發光二極體，再進行封裝，然而，若使用點膠的方式封裝，會造成平整度差的缺點，並且，若使用的是透明膠，還會造成顯示畫面出現白點。The light emitting diode display device has a plurality of light emitting diodes (light emitting diodes; LEDs), and the light emitting diodes have the advantages of high resolution, power saving, and long life. In this process, a large number of light-emitting diodes need to be transferred to another substrate through mass transfer and packaged. In order to improve the yield rate of the display device, inspection will be carried out after packaging to remove the failed miniature light-emitting diodes before packaging. What is more is transparent glue, it will also cause white spots to appear on the display screen.

本發明提供一種發光裝置的製造方法，其具有平整度佳且可避免顯示畫面有白點。The invention provides a method for manufacturing a light-emitting device, which has good flatness and can avoid white spots on a display screen.

本發明一實施例的發光裝置的製造方法包括以下步驟。於電路基板上放置多個發光元件。形成第一吸光膠材於各發光元件之間，發光元件包括第一發光元件，第一吸光膠材具有第一部分圍繞第一發光元件。執行蝕刻製程，以移除第一吸光膠材的第一部分。以第二發光元件取代第一發光元件。將第二吸光膠材壓向第一吸光膠材，使至少部分的第二吸光膠材圍繞第二發光元件且覆蓋發光元件的兩側。A method for manufacturing a light emitting device according to an embodiment of the present invention includes the following steps. A plurality of light-emitting elements are placed on the circuit substrate. A first light-absorbing adhesive material is formed between each light-emitting element, the light-emitting element includes a first light-emitting element, and the first light-absorbing adhesive material has a first portion surrounding the first light-emitting element. An etching process is performed to remove the first portion of the first light-absorbing adhesive. The first light emitting element is replaced by the second light emitting element. The second light-absorbing adhesive material is pressed against the first light-absorbing adhesive material, so that at least part of the second light-absorbing adhesive material surrounds the second light-emitting element and covers both sides of the light-emitting element.

基於上述，利用執行蝕刻製程，以移除第一吸光膠材的第一部分，將第二吸光膠材壓向第一吸光膠材，使至少部分的第二吸光膠材圍繞第二發光元件且覆蓋發光元件的兩側，可使發光裝置的平整度佳，且由於第一吸光膠材及第二吸光膠材皆為吸光材質，可避免顯示畫面有白點。Based on the above, by performing an etching process to remove the first part of the first light-absorbing adhesive material, press the second light-absorbing adhesive material against the first light-absorbing adhesive material, so that at least part of the second light-absorbing adhesive material surrounds and covers the second light-emitting element The two sides of the light-emitting element can make the flatness of the light-emitting device better, and since the first light-absorbing adhesive material and the second light-absorbing adhesive material are both light-absorbing materials, white spots on the display screen can be avoided.

第1圖至第8圖是依照本發明一實施例的發光裝置10的製造方法。請先參照第1圖，於電路基板100上放置多個發光元件102，形成第一吸光膠材104於各發光元件102之間。電路基板100例如可具有多個接墊(未示)，發光元件102以覆晶的方式接合於電路基板100。發光元件102可顯示出不同顏色，例如可為紅色、綠色及藍色。1 to 8 are the manufacturing method of the light emitting device 10 according to an embodiment of the present invention. Referring to FIG. 1 , a plurality of light-emitting elements 102 are placed on the circuit substrate 100 , and a first light-absorbing adhesive material 104 is formed between each light-emitting element 102 . For example, the circuit substrate 100 may have a plurality of pads (not shown), and the light emitting element 102 is flip-chip bonded to the circuit substrate 100 . The light emitting element 102 can display different colors, such as red, green and blue.

於本實施例中，在單層膠(例如：第一吸光膠材104)封裝下對發光元件102進行檢測，以確認每一發光元件102具有預期的發光狀態，並對損壞的發光元件102進行修復。舉例來說，發光元件102包括第一發光元件102A，第一吸光膠材104具有第一部分104A圍繞第一發光元件102A。在一實施例中，對第一發光元件102A進行測試後，若認為其不具有預期的發光狀態，則如第2圖所示，執行蝕刻製程1000以移除第一吸光膠材104的第一部分104A。於本實施例中，蝕刻製程1000為電漿製程。舉例來說，蝕刻製程1000是大氣常壓式(Atmospheric Pressure；AP)電漿製程，並利用遮罩MK的開口露出第一發光元件102A，且遮住其餘發光元件102。In this embodiment, the light-emitting elements 102 are inspected under the packaging of a single-layer adhesive (for example: the first light-absorbing adhesive material 104) to confirm that each light-emitting element 102 has the expected light-emitting state, and the damaged light-emitting elements 102 are inspected. repair. For example, the light-emitting element 102 includes a first light-emitting element 102A, and the first light-absorbing adhesive material 104 has a first portion 104A surrounding the first light-emitting element 102A. In one embodiment, after testing the first light-emitting element 102A, if it is considered that it does not have the expected light-emitting state, as shown in FIG. 104A. In this embodiment, the etching process 1000 is a plasma process. For example, the etching process 1000 is an Atmospheric Pressure (AP) plasma process, and uses the opening of the mask MK to expose the first light-emitting element 102A and cover the rest of the light-emitting elements 102 .

於一實施例中，移除第一吸光膠材104的第一部分104A的步驟使得第一吸光膠材104具有暴露電路基板100的開口OP(如第3圖所示)，藉此，可使第一發光元件102A容易被取出。In one embodiment, the step of removing the first portion 104A of the first light-absorbing adhesive material 104 makes the first light-absorbing adhesive material 104 have an opening OP (as shown in FIG. A light emitting element 102A is easily taken out.

接著參照第4圖，以第二發光元件102B取代第一發光元件102A，第二發光元件102B顯示的顏色與第一發光元件102A顯示的顏色相同。將第二吸光膠材106壓向第一吸光膠材104，使至少部分的第二吸光膠材106圍繞第二發光元件102B且覆蓋發光元件102的兩側(如第5圖所示)。舉例而言，於一實施例中，可將電路基板100置於模具112上，以層壓1002的方式將第二吸光膠材106壓向第一吸光膠材104。如此，可使發光裝置10的平整度佳，例如頂面平整度佳，且由於第一吸光膠材104及第二吸光膠材106皆為吸光材質，可避免顯示畫面有白點。Next, referring to FIG. 4 , the first light-emitting element 102A is replaced by a second light-emitting element 102B, and the color displayed by the second light-emitting element 102B is the same as that displayed by the first light-emitting element 102A. Press the second light-absorbing adhesive material 106 against the first light-absorbing adhesive material 104 so that at least part of the second light-absorbing adhesive material 106 surrounds the second light-emitting element 102B and covers both sides of the light-emitting element 102 (as shown in FIG. 5 ). For example, in one embodiment, the circuit substrate 100 may be placed on the mold 112 , and the second light-absorbing adhesive material 106 is pressed against the first light-absorbing adhesive material 104 in a lamination 1002 manner. In this way, the flatness of the light-emitting device 10 can be improved, for example, the flatness of the top surface is good, and since the first light-absorbing adhesive material 104 and the second light-absorbing adhesive material 106 are both light-absorbing materials, white spots on the display screen can be avoided.

接著，請參照第5圖，於一實施例中，第二吸光膠材106壓向第一吸光膠材104的步驟使得第二吸光膠材106填滿開口OP。舉例來說，第二吸光膠材106更覆蓋第一吸光膠材104，為了清楚說明，第5圖中繪示了虛線L，第二吸光膠材106位於虛線L之上，第一吸光膠材104位於虛線L之下。Next, please refer to FIG. 5 , in one embodiment, the step of pressing the second light-absorbing adhesive material 106 against the first light-absorbing adhesive material 104 makes the second light-absorbing adhesive material 106 fill the opening OP. For example, the second light-absorbing adhesive material 106 covers the first light-absorbing adhesive material 104. For clarity, the dotted line L is shown in FIG. 104 is located below the dotted line L.

於一實施例中，第二吸光膠材106固化後的光學係數與第一吸光膠材104固化後的光學係數相同。此處指的光學係數例如是光密度(optical density；OD)及/或吸光率。於一實施例中，第二吸光膠材106的材料與第一吸光膠材104的材料相同。In one embodiment, the cured optical coefficient of the second light-absorbing adhesive material 106 is the same as the cured optical coefficient of the first light-absorbing adhesive material 104 . The optical coefficient referred to here is, for example, optical density (OD) and/or absorbance. In one embodiment, the material of the second light-absorbing adhesive material 106 is the same as that of the first light-absorbing adhesive material 104 .

請參照第6圖，移除第二吸光膠材106的頂部，以露出發光元件102及第二發光元件102B。於一實施例中，移除第二吸光膠材106的頂部是採用電漿製程1004。Referring to FIG. 6 , the top of the second light-absorbing adhesive material 106 is removed to expose the light-emitting element 102 and the second light-emitting element 102B. In one embodiment, plasma process 1004 is used to remove the top of the second light-absorbing adhesive material 106 .

接著請參照第7圖，在移除第二吸光膠材106的頂部後，形成第二透光膠材108於第一吸光膠材104、第二吸光膠材106、發光元件102及第二發光元件102B上。第二透光膠材108覆蓋發光元件102及第二發光元件102B。第二透光膠材108的材料例如是光阻材料、環氧樹脂（epoxy resin）、矽樹脂、聚甲基丙烯酸甲酯（polymethyl methacrylate；PMMA）或其他適宜的可透光材料，而可使發光元件102及第二發光元件102B所發出的光可以透射出去。於一實施例中，第二透光膠材108可利用層壓方式所形成。Next, please refer to FIG. 7, after removing the top of the second light-absorbing adhesive material 106, a second light-transmitting adhesive material 108 is formed on the first light-absorbing adhesive material 104, the second light-absorbing adhesive material 106, the light-emitting element 102 and the second light-emitting element. element 102B. The second transparent adhesive material 108 covers the light emitting element 102 and the second light emitting element 102B. The material of the second light-transmitting adhesive material 108 is, for example, photoresist material, epoxy resin (epoxy resin), silicone resin, polymethyl methacrylate (polymethyl methacrylate; PMMA) or other suitable light-transmitting materials, so that the The light emitted by the light emitting element 102 and the second light emitting element 102B can be transmitted out. In one embodiment, the second transparent adhesive material 108 can be formed by lamination.

第8圖至第15圖是依照本發明另一實施例的發光裝置10a的製造方法。請先參照第8圖，於一些實施例中，發光裝置10a是在多層膠封裝後進行修復。舉例來說，於電路基板100上放置多個發光元件102，形成第一吸光膠材104於各發光元件102之間，發光元件102包括第一發光元件102A，第一吸光膠材104具有第一部分104A圍繞第一發光元件102A，接著形成第一透光膠材110於第一吸光膠材104上。在本實施例中，在多層膠(例如：第一吸光膠材104、第一透光膠材110)封裝下對發光元件102進行檢測。第一透光膠材110的材料例如是光阻材料、環氧樹脂（epoxy resin）、矽樹脂、聚甲基丙烯酸甲酯（polymethyl methacrylate；PMMA）或其他適宜的可透光材料，而可使發光元件102及第一發光元件102A所發出的光可以透射出去。8 to 15 are the manufacturing method of the light emitting device 10a according to another embodiment of the present invention. Please refer to FIG. 8 first. In some embodiments, the light emitting device 10a is repaired after multi-layer adhesive packaging. For example, a plurality of light-emitting elements 102 are placed on the circuit substrate 100, and a first light-absorbing adhesive material 104 is formed between each light-emitting element 102. The light-emitting element 102 includes a first light-emitting element 102A, and the first light-absorbing adhesive material 104 has a first portion 104A surrounds the first light-emitting element 102A, and then forms a first light-transmitting adhesive material 110 on the first light-absorbing adhesive material 104 . In this embodiment, the light-emitting element 102 is inspected under the packaging of multiple layers of glue (eg, the first light-absorbing glue 104 and the first light-transmitting glue 110 ). The material of the first light-transmitting adhesive material 110 is, for example, photoresist material, epoxy resin (epoxy resin), silicone resin, polymethyl methacrylate (polymethyl methacrylate; PMMA) or other suitable light-transmitting materials, so that the The light emitted by the light emitting element 102 and the first light emitting element 102A can be transmitted out.

請參照第9圖，以雷射製程1006移除至少部分的第一透光膠材110，雷射製程1006所使用的雷射光例如是UV雷射光。接著請參照第10圖，執行蝕刻製程1008以移除第一吸光膠材104的第一部分104A。也就是說，於本實施例中，是在執行蝕刻製程1008前，形成第一透光膠材110於第一吸光膠材104上(見第8圖)，並以雷射製程1006移除至少部分的第一透光膠材110(見第9圖)。於一實施例中，在雷射製程1006之後，第一透光膠材110具有凹部110R，凹部110R位於第一發光元件102A的頂部。由於執行雷射製程1006的過程中，電路基板100仍被第一吸光膠材104所覆蓋，因此，電路基板100可受到第一吸光膠材104的保護，而免於被雷射製程1006的雷射光所損傷，可維持電路基板100的電性，使其可靠度佳。於一實施例中，蝕刻製程1008為電漿製程。於本實施例中，蝕刻製程1008還包括移除第一透光膠材110的底部。Referring to FIG. 9 , at least a portion of the first light-transmitting adhesive material 110 is removed by a laser process 1006 . The laser light used in the laser process 1006 is, for example, UV laser light. Next, referring to FIG. 10 , an etching process 1008 is performed to remove the first portion 104A of the first light-absorbing adhesive material 104 . That is to say, in this embodiment, before performing the etching process 1008, the first light-transmitting adhesive material 110 is formed on the first light-absorbing adhesive material 104 (see FIG. 8 ), and the laser process 1006 removes at least Part of the first light-transmitting adhesive material 110 (see FIG. 9 ). In one embodiment, after the laser process 1006 , the first transparent adhesive material 110 has a concave portion 110R, and the concave portion 110R is located on the top of the first light emitting element 102A. Since the circuit substrate 100 is still covered by the first light-absorbing adhesive material 104 during the laser process 1006, the circuit substrate 100 can be protected by the first light-absorbing adhesive material 104 from being lasered by the laser process 1006. The electrical properties of the circuit substrate 100 can be maintained to improve the reliability of the circuit substrate 100 if it is damaged by the irradiated light. In one embodiment, the etching process 1008 is a plasma process. In this embodiment, the etching process 1008 further includes removing the bottom of the first transparent adhesive material 110 .

於一實施例中，移除第一吸光膠材104的第一部分104A的步驟使得第一吸光膠材104具有暴露電路基板100的開口OP，藉此，可使第一發光元件102A容易被取出。In one embodiment, the step of removing the first portion 104A of the first light-absorbing adhesive material 104 makes the first light-absorbing adhesive material 104 have an opening OP exposing the circuit substrate 100 , thereby making it easy to take out the first light-emitting element 102A.

接著，請參照第11圖，以第二發光元件102B取代第一發光元件102A，第二發光元件102B顯示的顏色與第一發光元件102A顯示的顏色相同。Next, please refer to FIG. 11 , the first light-emitting element 102A is replaced by the second light-emitting element 102B, and the color displayed by the second light-emitting element 102B is the same as the color displayed by the first light-emitting element 102A.

請一併參照第12圖及第13圖，將第二吸光膠材106壓向第一吸光膠材104，使至少部分的第二吸光膠材106圍繞第二發光元件102B且覆蓋發光元件102的兩側(見第13圖) ，為了清楚說明，第13圖中繪示了虛線L，第二吸光膠材106位於虛線L之上，第一吸光膠材104位於虛線L之下。於一實施例中，可將電路基板100置於模具112上(見第12圖)，以層壓1002的方式將第二吸光膠材106壓向第一吸光膠材104。如此，可使發光裝置10a的平整度佳，例如頂面平整度佳，且由於第一吸光膠材104及第二吸光膠材106皆為吸光材質，可避免顯示畫面有白點。Please refer to FIG. 12 and FIG. 13 together, press the second light-absorbing adhesive material 106 against the first light-absorbing adhesive material 104, so that at least part of the second light-absorbing adhesive material 106 surrounds the second light-emitting element 102B and covers the light-emitting element 102 On both sides (see FIG. 13 ), for clarity, a dotted line L is drawn in FIG. 13 , the second light-absorbing adhesive material 106 is located above the dotted line L, and the first light-absorbing adhesive material 104 is located below the dotted line L. In one embodiment, the circuit substrate 100 can be placed on the mold 112 (see FIG. 12 ), and the second light-absorbing adhesive material 106 is pressed against the first light-absorbing adhesive material 104 in the manner of lamination 1002 . In this way, the flatness of the light-emitting device 10a can be improved, for example, the flatness of the top surface is good, and since the first light-absorbing adhesive material 104 and the second light-absorbing adhesive material 106 are both light-absorbing materials, white spots on the display screen can be avoided.

於一實施例中，第二吸光膠材106壓向第一吸光膠材104的步驟使得第二吸光膠材106填滿開口OP。舉例來說，第二吸光膠材106更覆蓋第一吸光膠材104。In one embodiment, the step of pressing the second light-absorbing adhesive material 106 against the first light-absorbing adhesive material 104 makes the second light-absorbing adhesive material 106 fill the opening OP. For example, the second light-absorbing adhesive material 106 further covers the first light-absorbing adhesive material 104 .

請參照第14圖，移除第二吸光膠材106的頂部，以露出發光元件102及第二發光元件102B。於一實施例中，移除第二吸光膠材106的頂部是採用電漿製程1004。Referring to FIG. 14 , the top of the second light-absorbing adhesive material 106 is removed to expose the light-emitting element 102 and the second light-emitting element 102B. In one embodiment, plasma process 1004 is used to remove the top of the second light-absorbing adhesive material 106 .

接著請參照第15圖，在移除第二吸光膠材106的頂部後，形成第二透光膠材108於第一吸光膠材104、第二吸光膠材106、發光元件102及第二發光元件102B上。第二透光膠材108覆蓋發光元件102及第二發光元件102B。於一實施例中，第二透光膠材108可利用層壓方式所形成。Next, please refer to FIG. 15, after removing the top of the second light-absorbing adhesive material 106, a second light-transmitting adhesive material 108 is formed on the first light-absorbing adhesive material 104, the second light-absorbing adhesive material 106, the light-emitting element 102 and the second light-emitting element. element 102B. The second transparent adhesive material 108 covers the light emitting element 102 and the second light emitting element 102B. In one embodiment, the second transparent adhesive material 108 can be formed by lamination.

綜上所述，本實施例的發光裝置利用執行蝕刻製程，以移除第一吸光膠材的第一部分，將第二吸光膠材壓向第一吸光膠材，使至少部分的第二吸光膠材圍繞第二發光元件且覆蓋發光元件的兩側，可使發光裝置的平整度佳，且由於第一吸光膠材及第二吸光膠材皆為吸光材質，可避免顯示畫面有白點。In summary, the light-emitting device of this embodiment utilizes an etching process to remove the first part of the first light-absorbing adhesive, and press the second light-absorbing adhesive against the first light-absorbing adhesive, so that at least part of the second light-absorbing adhesive The material surrounds the second light-emitting element and covers both sides of the light-emitting element, so that the flatness of the light-emitting device can be improved, and since the first light-absorbing adhesive material and the second light-absorbing adhesive material are both light-absorbing materials, white spots on the display screen can be avoided.

10、10a:發光裝置 100:電路基板 102:發光元件 102A:第一發光元件 102B:第二發光元件 104:第一吸光膠材 104A:第一部分 106:第二吸光膠材 108:第二透光膠材 110:第一透光膠材 110R:凹部 112:模具 1000:蝕刻製程 1002:層壓 1004:電漿製程 1006:雷射製程 1008:蝕刻製程 L:虛線 MK:遮罩 OP:開口 10, 10a: light emitting device 100: circuit substrate 102: Light emitting element 102A: the first light emitting element 102B: the second light emitting element 104: The first light-absorbing adhesive 104A: Part I 106: The second light-absorbing adhesive material 108: The second light-transmitting adhesive material 110: The first light-transmitting adhesive 110R: concave part 112: Mold 1000: etching process 1002: lamination 1004: Plasma process 1006:Laser process 1008: Etching process L: dotted line MK: mask OP: opening

閱讀以下詳細敘述並搭配對應之圖式，可了解本揭露之多個樣態。需留意的是，圖式中的多個特徵並未依照該業界領域之標準作法繪製實際比例。事實上，所述之特徵的尺寸可以任意的增加或減少以利於討論的清晰性。 第1圖至第8圖是依照本發明一實施例的發光裝置的製造方法。 第9圖至第15圖是依照本發明另一實施例的發光裝置的製造方法。 Read the following detailed description and match the corresponding diagrams to understand the multiple aspects of this disclosure. It should be noted that many features in the drawings are not drawn to scale in accordance with standard practice in this industry. In fact, the dimensions of the described features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 to FIG. 8 are a manufacturing method of a light emitting device according to an embodiment of the present invention. 9 to 15 are the manufacturing method of the light emitting device according to another embodiment of the present invention.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

10:發光裝置 10: Lighting device

100:電路基板 100: circuit substrate

102:發光元件 102: Light emitting element

102B:第二發光元件 102B: the second light emitting element

104:第一吸光膠材 104: The first light-absorbing adhesive

106:第二吸光膠材 106: The second light-absorbing adhesive material

112:模具 112: Mold

1002:層壓 1002: lamination

OP:開口 OP: opening

Claims (10)

一種發光裝置的製造方法，包括：於一電路基板上放置多個發光元件；形成一第一吸光膠材於各該發光元件之間，其中該些發光元件包括一第一發光元件與多個第二發光元件，該第一吸光膠材具有一第一部分圍繞該第一發光元件；執行一蝕刻製程，以移除該第一吸光膠材的該第一部分；以一第三發光元件取代該第一發光元件；將一第二吸光膠材壓向該第一吸光膠材，使至少部分的該第二吸光膠材圍繞該第三發光元件且覆蓋各該第二發光元件的兩側；移除該第二吸光膠材的一頂部，以露出該些第二發光元件與該第三發光元件；及形成一第一透光膠材於該第一吸光膠材、該第二吸光膠材、該些第二發光元件與該第三發光元件上。 A method for manufacturing a light-emitting device, comprising: placing a plurality of light-emitting elements on a circuit substrate; forming a first light-absorbing adhesive material between each of the light-emitting elements, wherein the light-emitting elements include a first light-emitting element and a plurality of first light-emitting elements Two light-emitting elements, the first light-absorbing adhesive material has a first portion surrounding the first light-emitting element; performing an etching process to remove the first portion of the first light-absorbing adhesive material; replacing the first light-emitting element with a third light-emitting element Light-emitting element; pressing a second light-absorbing adhesive material against the first light-absorbing adhesive material so that at least part of the second light-absorbing adhesive material surrounds the third light-emitting element and covers both sides of each second light-emitting element; removes the A top of the second light-absorbing adhesive material to expose the second light-emitting elements and the third light-emitting element; and forming a first light-transmitting adhesive material on the first light-absorbing adhesive material, the second light-absorbing adhesive material, and the The second light emitting element is connected with the third light emitting element. 如請求項1所述之方法，其中該第二吸光膠材固化後的光學係數與該第一吸光膠材固化後的光學係數相同。 The method according to claim 1, wherein the cured optical coefficient of the second light-absorbing adhesive material is the same as the cured optical coefficient of the first light-absorbing adhesive material. 如請求項1所述之方法，其中該第二吸光膠材的材料與該第一吸光膠材的材料相同。 The method according to claim 1, wherein the material of the second light-absorbing adhesive material is the same as that of the first light-absorbing adhesive material. 如請求項1所述之方法，進一步包括：在執行該蝕刻製程前，形成一第二透光膠材於該第一吸光膠材上；及以一雷射製程移除至少部分的該第二透光膠材。 The method as claimed in claim 1, further comprising: before performing the etching process, forming a second light-transmitting adhesive material on the first light-absorbing adhesive material; and removing at least part of the second light-transmitting adhesive material by a laser process. Translucent adhesive. 如請求項4所述之方法，其中在該雷射製程之後，該第二透光膠材具有一凹部，該凹部位於該第一發光元件的一頂部。 The method according to claim 4, wherein after the laser process, the second light-transmitting adhesive material has a concave portion, and the concave portion is located on a top of the first light-emitting element. 如請求項4所述之方法，其中該蝕刻製程還包括：移除該第二透光膠材的一底部。 The method according to claim 4, wherein the etching process further includes: removing a bottom of the second transparent adhesive material. 如請求項1所述之方法，其中移除該第二吸光膠材的該頂部是採用電漿製程。 The method as claimed in claim 1, wherein removing the top of the second light-absorbing adhesive is a plasma process. 如請求項1所述之方法，其中該蝕刻製程為電漿製程。 The method as claimed in claim 1, wherein the etching process is a plasma process. 如請求項1所述之方法，其中移除該第一吸光膠材的該第一部分的步驟使得該第一吸光膠材具有一暴露該電路基板的開口，且該第二吸光膠材壓向該第一吸光膠材的步驟使得該第二吸光膠材填滿該開口。 The method according to claim 1, wherein the step of removing the first portion of the first light-absorbing adhesive makes the first light-absorbing adhesive have an opening exposing the circuit substrate, and the second light-absorbing adhesive is pressed toward the The step of the first light-absorbing glue makes the second light-absorbing glue fill up the opening. 如請求項9所述之方法，其中該第二吸光膠材更覆蓋該第一吸光膠材。 The method according to claim 9, wherein the second light-absorbing adhesive material further covers the first light-absorbing adhesive material.
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