TWI726230B - Holding member, method of manufacturing holding member, holding mechanism, and product manufacturing device - Google Patents

Abstract

The present invention manufactures a holding member for holding a product without increasing the manufacturing cost. The manufacturing method of the holding member of the present invention is to manufacture a holding member that holds a BGA package, and includes the following steps: preparing a forming mold having a plurality of grooves having a first width on the main surface; The resin material is arranged; the main surface of the forming mold is pressed to the resin material; the resin material is cured to form a cured resin, thereby forming a molded product containing the cured resin; and the molded product is removed from the molding mold. The holding member includes a plurality of wall portions formed by transferring the plurality of groove portions to a cured resin; a recessed portion surrounded by the plurality of wall portions; and a through hole formed in the recessed portion. The BGA package is held in such a way that the BGA package includes a recess when viewed in the Z direction.

Description

Holding member, method of manufacturing holding member, holding mechanism, and product manufacturing device

The present invention relates to a holding member for holding a product, a manufacturing method of the holding member, a holding mechanism, and a manufacturing device of the product.

As a holding member used when holding a holding object that is a product, a tray or the like can be cited. In some cases, by sucking and holding the object through the suction hole including the through hole, the object to be held is temporarily tightly fixed (adsorbed) to the surface of the holding member. A suction jig and the like having suction holes used at this time are also included in the holding member. The holding object is sucked by using the suction hole provided in the holding member, and the holding object is sucked onto the surface of the holding member. The term "suction" refers to pressing the object to be held against the surface of the holding member under atmospheric pressure, so that the object to be held is brought into close contact with the surface of the holding member.

As a preferable example of a product, that is, an object to be held, an IC package, which is a semiconductor integrated circuit (abbreviated as IC), can be cited. The IC package is manufactured by cutting a sealed substrate using a rotary knife to singulation. The IC package is the final product, and the sealed substrate is the intermediate product. Since the sealed substrate itself before singulation is sometimes traded, the sealed substrate is also included in the product.

The sealed substrate is a composite member including a substrate, a chip containing a semiconductor wafer, and the like, and a sealing resin containing a hardening resin. The substrate includes a lead frame (lead frame), a printed wiring board (printed wiring board), a ceramic substrate (ceramics substrate), a semiconductor substrate (semiconductor wafer (semiconductor wafer)), and the like. The semiconductor substrate includes a silicon substrate (silicon wafer (silicon wafer)), a SiC substrate (SiC wafer (SiC wafer)), and the like. The substrate includes a circuit substrate on which an electrical circuit including a logic circuit, a memory circuit, an amplifier circuit, and the like are formed; and a support substrate for supporting the wafer. The supporting substrate is a carrier (carrier), and includes a silicon substrate, a glass substrate, and the like.

As a kind of holding member, a tray for IC manufactured by resin molding using an injection molding method has been proposed (refer to the upper left column of page 4 of Patent Document 1, Fig. 1). The IC trays are partitioned by grids that are perpendicular to each other in vertical and horizontal directions. A Quad Flat Package (QFP) IC tray with a semiconductor integrated circuit device mounted on each grid is manufactured by an injection molding method using a molding die. QFP type IC is equivalent to IC package. The forming mold is made by machining, electrical discharge machining, etc. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Laid-open No. 03-037258

[The problem to be solved by the invention]

In recent years, the shape and structure of products including IC packages and sealed substrates, and the number (number of pieces) of IC packages manufactured from a single sealed substrate have been diversified. As the number of pieces, 1,000 units (for example, 3,000 to 5,000) products have been manufactured from one sealed substrate. As a type of IC package, it is called a ball grid array (Ball Grid Array, BGA) package (hereinafter referred to as a "BGA package") in which solder balls are formed in a grid pattern on a singulated circuit board. Types of.

The solder balls included in the BGA are, for example, convex portions having a diameter of approximately 0.1 mm to 1.0 mm. The sealed substrate (hereinafter referred to as "sealed substrate for BGA") when manufacturing BGA has a plurality of solder balls formed on the circuit board. Each BGA manufactured by singulating a sealed substrate for BGA also has a plurality of solder balls formed on the circuit board. When the sealed substrate for BGA and the BGA are sucked, a gap is likely to occur between the top of the plurality of bumps, that is, the top of the plurality of solder balls, and the surface of the circuit board (the bottom surface of the concave portion of the plurality of bumps, which is the bump relative to the bump). Air flows through this gap, so the adsorption force of the sealed substrate for adsorbing the BGA and the BGA itself becomes weak. Therefore, in the singulation process, the transport process, etc., a problem may occur in that the sealed substrate for BGA and the BGA itself move against the will in the holding member having the suction function.

As a structure for sufficiently adsorbing the sealed substrate for BGA and the BGA to the holding member with the adsorption function, the following structure can be cited: the holding member is formed, and the holding member has the same number of pieces as the number of pieces. A recess where all solder balls are accommodated. In this case, it is necessary to form convex portions corresponding to the number of concave portions equal to the number of sheets on the surface corresponding to the placement surface of the holding object in the injection molding mold. The formation of 1,000-unit protrusions on a forming die by machining, electrical discharge machining, etc., causes a problem that the manufacturing cost of the forming die increases. Similarly, in the case of using a forming die to manufacture a holding member (for example, a tray) that does not have an adsorption function, there is also a problem of increasing the manufacturing cost of the forming die.

The present invention was completed in order to solve the above-mentioned problems. The object of the present invention is to inexpensively manufacture a holding member used when holding a holding object having unevenness. [Technical means to solve the problem]

In order to solve the above-mentioned problems, the method of manufacturing a holding member of the present invention manufactures a holding member that holds an object to be held, and includes the following process: preparing a forming mold having a plurality of parts having a first width on the main surface. Arranging the molding die facing the resin material; pressing the main surface of the molding die to the resin material; hardening the resin material to form a hardened resin, thereby forming a molded product containing the hardened resin; and removing it from the molding die The lower molded product, the molded product is a holding member provided with a plurality of walls and recesses formed by transferring a plurality of grooves to a hardened resin, and the recesses are surrounded by a plurality of walls to When the inner bottom surface of the cured resin is observed from the outer bottom surface of the cured resin, the holding target product is held so that the holding target product includes a recess.

In order to solve the above-mentioned problems, the holding member of the present invention holds an object to be held. The holding member includes: a hardened resin, formed by curing a resin material, and having a contact surface that contacts the object to be held; and a plurality of first wall portions , Included in the hardened resin, extending in the first direction; a plurality of second wall portions included in the hardened resin, extending in a second direction intersecting the first direction; and recesses, consisting of a plurality of first wall portions and a plurality of second When the inner bottom surface of the cured resin is viewed from the outer bottom surface of the cured resin, the object to be held is surrounded by the 2 walls. The object to be held includes recesses to hold the object to be held. The shapes of the multiple first walls are formed during molding. The shape of the plurality of first grooves with the first width formed on the main surface of the mold is transferred to the shape of the cured resin, and the shape of the plurality of second wall portions is formed on the main surface of the mold and has The shape of the plurality of second grooves of the first width is transferred to the shape of the cured resin.

In order to solve the problem, the holding mechanism of the present invention includes the holding member.

In order to solve the above-mentioned problem, the manufacturing apparatus of the product of the present invention includes the holding member. [Effects of the invention]

According to the present invention, the holding member can be manufactured without increasing the manufacturing cost.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In any figure in this application, for ease of understanding, the schematic depiction is appropriately omitted or exaggerated. For the same constituent components, the same symbols are attached, and the description is appropriately omitted.

[Embodiment 1] (Structure of a sealed substrate for BGA) The structure of a sealed substrate for BGA will be described with reference to FIGS. 1(a) and 1(b). By cutting the sealed substrate for BGA, the BGA package as the final product is manufactured. Therefore, the sealed substrate for BGA is equivalent to an intermediate product when manufacturing BGA packages. The BGA package corresponding to the final product is a holding object held by a holding member.

As shown in FIG. 1( b ), the substrate 2 included in the sealed substrate 1 for BGA has a plurality of regions 3. On one surface 2a of the substrate 2, the wafer 4 is mounted in each area 3, respectively. On one surface 2 a of the substrate 2, the sealing resin 5 is molded so as to cover the wafers 4 in the plurality of regions 3. Each wafer 4 is resin-sealed collectively by the sealing resin 5. The sealed substrate 1 for BGA includes a substrate 2, a wafer 4, and a sealing resin 5.

As shown in FIG. 1( a) and FIG. 1( b ), a plurality of protruding electrodes 6 are provided on the other surface 2 b of the sealed substrate 1 for BGA. The protruding electrode 6 is a convex portion protruding from the other surface 2b of the sealed substrate 1 for BGA. The length of the protruding electrode 6 from the other surface 2b, that is, the amount of protrusion is the distance La. The protruding electrode 6 functions as an external terminal that electrically connects the BGA package and the outside of the BGA package. In FIGS. 1(a) and 1(b), solder balls are shown as protruding electrodes 6. 1(a) and FIG. 1(b) show a case where the protruding electrode 6 is provided on the entire area 3 of the sealed substrate 1 for BGA. On the other surface 2b of the sealed substrate 1 for BGA, the protruding electrode 6 is a convex portion, and the portion other than the protruding electrode 6 (in other words, the portion other than the protruding electrode 6 on the other surface 2b) is a concave portion.

As shown in Figure 1(a), on the sealed substrate 1 for BGA, a plurality of first cutting lines 7 extending in the X direction and a plurality of second cutting lines extending in the Y direction are respectively set imaginarily 8. The plurality of regions 3 surrounded by the plurality of first cutting lines 7 and the plurality of second cutting lines 8 respectively correspond to a BGA package as a holding object. The planar shape of the region 3 shown in FIG. 1(a) (the shape viewed in the Z direction, the same applies hereinafter) is a square with four sides with a length a of one side.

In FIG. 1(a), three regions 3 are formed along the X direction, and four regions 3 are formed along the Y direction. Therefore, on the sealed substrate 1 for BGA, 12 regions 3 are formed in a lattice shape. The sealed substrate 1 for BGA is cut along a plurality of first cutting lines 7 and a plurality of second cutting lines 8 to manufacture 12 BGA packages corresponding to each area 3. The size of the sealed substrate 1 for BGA is arbitrarily set according to the size of the singulated BGA package or the number of pieces.

(Method of Manufacturing BGA Package) A method of manufacturing a BGA package from the sealed substrate 1 for BGA will be described with reference to FIG. 2(a). First, prepare to cut off the table 9. A cutting jig 10 is installed on the cutting platform 9. The cutting jig 10 has a metal plate 11 and a resin sheet 12 attached to the metal plate 11. A metal plate 11 is attached to the upper surface of the cutting platform 9. On the upper surface of the resin sheet 12, a plurality of first cutting lines 7 (refer to FIG. 1(a) and FIG. 1(b)) and a plurality of second cutting lines are superimposed on the sealed substrate 1 for BGA A cutting groove 13 is formed in the form of a wire 8.

The cutting jig 10 has a through hole 14 penetrating the metal plate 11 and the resin sheet 12. The through holes 14 are formed corresponding to the regions 3 of the sealed substrate 1 for BGA. Each through hole 14 is connected to a pressure reduction source (not shown) via a space 15 formed in the cutting platform 9, a pipe 16 and a valve 17 in this order. As the decompression source, for example, a decompression pump (bump), a decompression tank (tank), etc. are used.

Next, as shown in FIG. 2( a ), the sealed substrate 1 for BGA is placed on the cutting jig 10. By operating the valve 17, the sealed substrate 1 for BGA is sucked through the pipe 16, the space 15, and each through hole 14. The wide arrow shown by the line indicates the intake VT for sucking the sealed substrate 1 for BGA. The sealed substrate 1 for BGA is in close contact with the upper surface of the cutting jig 10 by being pressed by atmospheric pressure. In other words, the sealed substrate 1 for BGA is attracted to the upper surface of the cutting jig 10. Thereby, the sealed substrate 1 for BGA is temporarily fixed to the cutting jig 10 of the cutting table 9.

Next, as shown in FIG. 2(a), a disk-shaped rotating knife 18 is prepared. The rotary knife 18 is a rotary knife for cutting having a width (thickness) w1. The cross-sectional shape of the outer edge of the rotating blade 18 when the rotating blade 18 is cut in the diametrical direction is V-shaped. A high-speed rotating rotary knife 18 is used to cut the sealed substrate 1 for BGA along a plurality of first cutting lines 7 (refer to FIGS. 1(a) and 1(b)) and a plurality of second cutting lines 8. In this way, the BGA package 19 in which the sealed substrate 1 for BGA is singulated in units of each area 3 is manufactured. FIG. 2( a) shows a case where the sealed substrate 1 for BGA is cut along the second cutting line 8. Between adjacent BGA packages 19, a gap 20 having a width w1 is formed.

(Manufacturing method of holding member for BGA package) The manufacturing method of the holding member of Embodiment 1 of this invention is demonstrated with reference to FIG. 2(a)-FIG. 3(d). First, as shown in FIG. 2(b), a plate-shaped member 21 including a hard plate is prepared. The plate-shaped member 21 is a raw material of a forming mold used for manufacturing a holding member. The planar shape of the plate-shaped member 21 preferably includes the planar shape of the sealed substrate 1 for BGA. As the plate-shaped member 21, composite material plates such as glass epoxy substrates, hard resin plates such as acryl plates and fluororesin plates, metal plates such as aluminum plates, glass plates, and the like are used.

Next, as shown in FIG. 2( b ), the plate-shaped member 21 is temporarily fixed to the cutting jig 10 of the cutting table 9. FIG. 2(b) shows an example in which the plate-shaped member 21 is temporarily fixed to the upper surface of the cutting jig 10 through suction. In the subsequent processes, the cutting platform 9 used when cutting the sealed substrate 1 for BGA can be used.

Next, a disk-shaped rotating knife 22 is prepared. The rotary knife 22 is a rotary knife for groove formation having a width (thickness) w2. The width (thickness) w2 of the rotary knife 22 for groove formation is larger than the width (thickness) w1 of the rotary knife 18 for cutting. As shown in FIG. 2(c), the cross-sectional shape of the outer edge of the rotating blade 22 when the rotating blade 22 is cut in the diametrical direction is a rectangular shape.

Next, as shown in FIG. 2( c ), a high-speed rotating blade 22 is used to form a groove 23 in the plate-shaped member 21. The formed groove 23 has a width w2. Specifically, along the cutting line 24 corresponding to the plurality of first cutting lines 7 and the plurality of second cutting lines 8 (refer to FIG. 1(a)) imaginarily set on the sealed substrate 1 for BGA , A groove 23 is formed on the plate member 21. The depth of the groove 23 is the distance Lb. The distance Lb is larger than the distance La by which the protruding electrode 6 protrudes from the other surface 2b of the sealed substrate 1 for BGA. Through the processes so far, the grooved plate 25 constituting a part of the forming mold used for manufacturing the holding member is completed. In the process of forming the groove portion 23 in the plate-shaped member 21, the cutting device used when cutting the sealed substrate 1 for BGA can also be used. At this time, just replace the rotary knife of the cutting device. Therefore, it is not necessary to prepare a new processing device, so it is suitable.

Next, as shown in FIG. 3( a ), the reinforcing plate 26 is fixed on the opposite surface (the upper surface in FIG. 3( a)) of the grooved plate 25 on which the groove portion 23 is formed. The grooved plate 25 and the reinforcing plate 26 constitute a forming mold 27 used for manufacturing the holding member. The material of the reinforcing plate 26 may be selected from the materials used for the plate-shaped member 21. When fixing the reinforcing plate 26 to the grooved plate 25, an adhesive or the like can be used.

Next, as shown in FIG. 3(a), a box-shaped member 28 is prepared. The resin material 29 is supplied to the box-shaped member 28. The resin material 29 is a resin having fluidity at room temperature (hereinafter referred to as “liquid resin”) regardless of the degree of viscosity. The resin material 29 is preferably a room temperature curable resin. As the resin material 29, silicone resin, fluororesin, or the like is used. The optimal resin material can be selected according to the required hardness or shape of the holding member. Since air bubbles may be contained in the resin material 29, it is preferable to perform deaeration in advance to remove air bubbles.

Next, as shown in FIG. 3( b ), the surface side on which the groove portion 23 is formed in the grooved plate 25 of the molding die 27 is immersed in the resin material 29 supplied to the box-shaped member 28. The depth at which the grooved plate 25 is immersed in the resin material 29 is set to be greater than the depth at which the groove portion 23 of the grooved plate 25 is filled with the resin material 29.

Next, the resin material 29 is cured, and the cured resin 30 is molded. As shown in FIG. 3(c), the hardened resin 30 is removed from the mold 27. Since the resin material 29 is a room-temperature-curing resin, no shrinkage of the cured resin 30 occurs during the molding of the cured resin 30. Therefore, a cured resin 30 with good dimensional accuracy can be obtained.

Through the processes so far, the molded product 31 including the box-shaped member 28 and the cured resin 30 is completed. The molded product 31 has: a plurality of recesses 32 corresponding to the plurality of regions 3 shown in FIG. 1(a) and FIG. 1(b), respectively; and a wall portion 33, which borders the plurality of regions 3, namely, a plurality of first cuts The broken line 7 corresponds to a plurality of second cut lines 8. The recess 32 is a space surrounded by the wall 33. The wall portion 33 of the molded product 31 is formed by transcribing the shape of the groove portion 23 of the molding die 27. The concave portion 32 of the molded product 31 is formed by transferring the shape of the portion surrounded by the groove portion 23 in the mold 27 (in other words, the convex portion surrounded by the groove portion 23 ).

Next, a through hole 34 is formed in the molded product 31 (refer to FIG. 3(d)). Using a drill, a laser, or the like, a through hole 34 that penetrates the box-shaped member 28 and the cured resin 30 is formed in the center of each recess 32. The through hole 34 functions as a suction hole for sucking and holding the object. Through the process of forming the through hole 34 in the molded product 31, as shown in FIG. 3(d), the holding member 35 including the box-shaped member 28, the cured resin 30, and the through hole 34 is completed.

The width of the wall portion 33 of the holding member 35 is a width w2 equal to the width (thickness) of the groove forming rotary blade 22. The end surface 36 (lower surface in FIG. 3(d)) of the wall 33 shown in FIGS. 3(c) and 3(d) is a horizontal plane. The depth Lb of the groove portion 23 of the grooved plate 25 of the molding die 27 is equal to the height of the wall portion 33.

(The holding member is used to hold the form of the BGA package) With reference to FIG. 3(d), the form of holding the BGA package 19 using the holding member 35 will be described. The holding member 35 is used by being attached to a conveying mechanism 37 such as an unloader (unloader), for example. First, as shown in FIG. 3(d), the conveyance mechanism 37 to which the holding member 35 is attached is prepared.

Next, after the holding member 35 is moved above the BGA package 19 sucked on the cutting stage 9, the holding member 35 is lowered. In this process, it is only necessary to raise and lower the cutting platform 9 and the conveying mechanism 37 relative to each other. In this process, the center of the gap 20 between the adjacent BGA packages 19 is aligned with the center of the wall 33. When viewed in the Z direction in the aligned state (hereinafter referred to as "plan view"), the overlapping length of the wall 33 and the BGA package 19 (shown as the overlapping length in the X direction in FIG. 3(d)) is the distance L1 .

Next, as shown in FIG. 3(d), each BGA package 19 is sucked through the intake VJ via the pipe 38 and the valve (not shown) in this order. Thereby, on the end surface 36 of the wall portion 33, the outer peripheral portion of each BGA package 19 is sucked.

Next, after stopping the suction in the cutting platform 9 (refer to the intake VT shown in Figs. 2(a) to 2(c)), the conveying mechanism 37 is raised, and each BGA package 19 is conveyed to the Until the organization of the next process. As a mechanism for performing the next process, for example, an inspection mechanism, a cleaning mechanism, and the like can be cited.

Hereinafter, the characteristics of the holding member 35 will be described. First, the end surface 36 of the wall portion 33 shown in FIG. 3(d) (the lower surface in FIG. 3(d), the same below) is a horizontal plane.

Second, the wall portion 33 has a width w2. The relationship between the width w2 of the wall 33 and the width w1 of the gap 20 between the BGA packages 19 (=the width w1 of the cutting rotary blade) is width w2>width w1.

Third, press the end surface 36 of the end 39 of the wall 33 (the lower part in FIG. 3(d), the part surrounded by the dashed line, the same below) of the end surface 36 to the outer peripheral part of the adjacent BGA packages 19 facing each other ( Hereinafter, it is appropriately referred to as "opposing outer peripheral portion"). Thereby, the opposing outer peripheral portion and the end surface 36 of the wall portion 33 are in close contact. As a result, the end 39 of the wall portion 33 is compressed and deformed so as to expand in the X direction and the Y direction. Therefore, in a state where the outer peripheral portion of each BGA package 19 is sucked, the overlapping length of the wall portion 33 and the BGA package 19 is greater than the distance L1 shown in FIG. 3( d ). The hardness of the hardened resin 30 is set to a degree of hardness. That is, by pressing the end 39 of the wall 33 to the opposite outer peripheral part of the BGA package 19, the end 39 of the wall 33 is crushed. Deformed.

Through the above three features, the end surface 36 of the wall portion 33 closes the gap 20 between the BGA packages 19. In this state, when viewing the inner bottom surface of the cured resin 30 (the upper surface of the recess 32 in FIG. 3(d)) from the outer bottom surface of the cured resin 30 (the upper surface in FIG. 3(d)), in other words In a plan view, each BGA package 19 completely includes each recess 32. By using the intake air VJ to suck each BGA package 19, the outer peripheral portion of each BGA package 19 is sucked to the end surface 36 of each wall portion 33 of the holding member 35. The holding member 35 functions as a suction jig.

In addition, the depth Lb of the recess 32 of the holding member 35 is larger than the distance La that is the protrusion amount of the protruding electrode 6 from the other surface 2b of the sealed substrate 1 for BGA. The distance Lb is preferably as large as such that even when the end 39 of the wall 33 is deformed in a crushed manner, the inner bottom surface of the recess 32 of the holding member 35 does not contact the protrusion The top of the shaped electrode 6. Thus, firstly, it is possible to avoid separation of the opposing outer periphery of the BGA package 19 from the end 39 of the wall 33 due to the inner bottom surface of the recess 32 of the holding member 35 contacting the top of the protruding electrode 6. Therefore, it is possible to avoid the situation where the BGA package 19 cannot be adsorbed due to the leakage of the intake air VJ.

Second, by setting the distance Lb to an appropriate size, the protruding electrode 6 of each BGA package 19 is completely housed in the holding member 35 in a state where the opposing outer peripheral portion of the BGA package 19 is in close contact with the end surface 36 of the wall portion 33. Each of the recesses 32 has. Therefore, the outer peripheral portion of each BGA package 19 is attracted to the end surface 36 surrounding the wall portion 33 of each recessed portion 32 that the holding member 35 has.

When the inner bottom surface of each concave portion 32 of the holding member 35 is in contact with the top of the protruding electrode 6, it is only necessary to ensure that the opposing outer peripheral portion of the BGA package 19 is in close contact with the end surface 36 of the wall portion 33. At this time, on the other surface 2b of each BGA package 19, the spaces other than the protruding electrodes 6 communicate with each other. Therefore, in a state where the opposing outer peripheral portions of the BGA packages 19 are in close contact with the end surfaces 36 of the wall 33, each BGA package 19 is attracted to the end surfaces 36 surrounding the wall 33 of each recess 32 of the holding member 35.

(Function and Effect) According to the present embodiment, the wall portion 33 for suction-holding the plurality of BGA packages 19 and the plurality of recessed portions 32 surrounded by the wall portion 33 can be collectively formed in the holding member 35. Therefore, the holding member 35 having the plurality of recesses 32 can be manufactured inexpensively.

According to this embodiment, a room temperature curable resin is used as the resin material 29, and the curable resin 30 contained in the holding member 35 is molded. As a result, in the process of molding the cured resin 30, shrinkage of the cured resin 30 does not occur. Therefore, it is possible to manufacture the holding member 35 with good dimensional accuracy.

According to this embodiment, the holding member 35 including the box-shaped member 28 and the cured resin 30 can be manufactured collectively. The box-shaped member 28 functions as a reinforcing material of the holding member 35. The box-shaped member 28 also functions as a fixing plate for fixing the holding member 35 to another member (for example, a member constituting the conveying mechanism 37 (see FIG. 3(d)) included in the manufacturing apparatus) as necessary. Therefore, the holding member 35 provided with the member functioning as a reinforcement material and a fixing plate can be manufactured inexpensively.

(Modifications) The following modifications can also be adopted. These modifications can also be appropriately adopted in other embodiments.

First, after the molded product containing the cured resin 30 is molded, the cured resin 30 may be removed from the box-shaped member 28. In this case, there is an advantage that the box-shaped member 28 can be repeatedly used as a jig for molding. By appropriately setting the hardness of the hardened resin 30 to be relatively large, the hardened resin 30 alone can be used as the holding member 35. It is also possible to fix the hardened resin 30 to another member (for example, a member that constitutes the conveying mechanism 37 (see FIG. 3(d)) of the manufacturing apparatus) as necessary, so that the hardened resin 30 fixed to this member serves as a holding member Function.

Second, instead of using the box-shaped member 28, a resin material 29 having a large viscosity may be supplied to the plate-shaped member. At this time, the viscosity of the resin material 29 is preferably as large as that, in a state where the resin material 29 is supplied to the plate-shaped member, even if the plate-shaped member is inclined, the resin material 29 can remain stationary. The surface side of the grooved plate 25 of the molding die 27 on which the groove portion 23 is formed is immersed in a resin material 29 having a large viscosity. After the process of curing the resin material 29 having a large viscosity to shape the cured resin 30, the process is the same as the process described so far.

In this modification, first, a plate-shaped member having a large planar shape is used to mold the hardened resin 30. Next, the molded product containing the plate-shaped member and the cured resin 30 is set to the required range as the holding member, and the boundary between the required range and the unnecessary outer peripheral portion is cut off. In this way, the holding member 35 including the plate-shaped member and the cured resin 30 corresponding to the range required as the holding member is completed.

Thirdly, as the resin material 29, the resin material described below may be used instead of a resin having fluidity at room temperature. The resin material is a resin material having the following characteristics: that is, it can be deformed to the extent that the shape of the groove portion 23 in the grooved plate 25 of the molding die 27 is transferred; and the groove portion 23 is transferred on the surface. In the state of its shape, it can be cured at room temperature. For example, as the resin material 29, a jelly-like resin material can be used.

Fourth, the end surface 36 of the wall portion 33 may be a curved surface having a large radius of curvature (in other words, a small curvature). In this case, by pressing the end 39 of the wall 33 against the opposing outer peripheral portion of the BGA package 19, the end 39 of the wall 33 is also deformed in a squashed manner. Therefore, the end surface 36 of the wall portion 33 can close the gap 20 between the BGA packages 19.

Fifth, the hardening resin 30 may also be a two-layer structure. After the first resin material is supplied to the box-shaped member 28 shown in FIG. 3( a) to mold the first cured resin, the second resin material is supplied to the first cured resin to mold the second cured resin. The hardness of the second cured resin is smaller than the hardness of the first cured resin. According to this modified example, the soft and easily deformable second hardened resin is supported by the hard first hardened resin, and the end 39 of the wall 33 is constituted by the second hardened resin.

According to this modification, the end 39 of the penetrating wall 33 is soft and easily deformable, and the end 36 of the wall 33 can more reliably close the gap 20 between the BGA packages 19. The first hardened resin having a large hardness functions as a reinforcing plate in the holding member 35 and also functions as a fixing plate for fixing the holding member 35 to other members as necessary. Instead of curing the first resin material to mold the first cured resin, a resin plate containing a hard resin having a hardness greater than that of the second cured resin may be supplied to the inner bottom surface of the box-shaped member 28 in advance.

[Embodiment 2] (Method of Manufacturing Holding Member for BGA Package) A method of manufacturing a holding member according to Embodiment 2 of the present invention will be described with reference to Figs. 4(a) to 4(d). The description of the same content as the content in the embodiment described so far is appropriately omitted.

First, the plate-shaped member 21 is prepared (refer to FIG. 2(b)). The disk-shaped rotating knife 40 shown in FIG. 4(a) is prepared. The rotary knife 40 is a rotary knife for groove formation having a width (thickness) w3. As shown in FIG. 4(a), the cross-sectional shape of the outer edge of the rotating blade 40 when the rotating blade 40 is cut in the diametrical direction is V-shaped. The width (thickness) w3 of the rotary blade 40 for groove formation is larger than the width (thickness) w1 of the rotary blade 18 for cutting shown in FIG. 2(a). The width w3 of the rotary blade 40 is preferably smaller than the width (thickness) w2 of the rotary blade 22 for groove formation shown in FIG. 2( c ).

Next, the rotary knife 40 is used to form the groove 41 on the plate-shaped member. The formed groove 41 has a width w3. The cross-sectional shape near the bottom of the groove 41 is a V shape. The depth of the groove 41 is the distance Lb. The distance Lb is larger than the distance La by which the protruding electrode 6 shown in FIG. 2( a) protrudes from the other surface 2 b of the sealed substrate 1 for BGA. Through the processes so far, the grooved plate 42 constituting a part of the forming mold used for manufacturing the holding member is completed.

Next, as shown in FIG. 4( b ), the reinforcing plate 26 is fixed on the opposite surface (upper surface in FIG. 4( b )) of the grooved plate 42 on which the groove portion 41 is formed. The grooved plate 42 and the reinforcing plate 26 constitute a molding die 43 used for manufacturing the holding member.

Next, as shown in FIG. 4(b), a box-shaped member 28 is prepared. In the box-shaped member 28, a resin plate 44 is supplied to the inner bottom surface in advance. The resin plate 44 is a resin material containing hard resin. On the resin plate 44, a resin material 29 containing liquid resin is supplied. On the resin material 29 supplied to the box-shaped member 28, the molding die 43 is arranged with the grooved plate 42 set to the lower side.

Next, as shown in FIG. 4( c ), the surface side on which the groove portion 41 is formed in the grooved plate 42 of the molding die 43 is immersed in the resin material 29 supplied to the box-shaped member 28. The depth at which the grooved plate 42 is immersed in the resin material 29 is set to be greater than the depth at which the groove portion 41 of the grooved plate 42 is filled with the resin material 29.

Next, the resin material 29 is cured, and the cured resin 30 is molded. In this process, the resin plate 44 containing the hard resin and the hard resin 30 are bonded. The hardness of the hardened resin 30 is less than the hardness of the resin plate 44.

Next, as shown in FIG. 4( d ), the cured resin 30 is removed from the mold 43. Since the resin material 29 is a room-temperature-curing resin, no shrinkage of the cured resin 30 occurs during the molding of the cured resin 30. Therefore, a cured resin 30 with good dimensional accuracy can be obtained.

Through the processes so far, the molded product 45 including the box-shaped member 28, the resin plate 44 containing a hard resin, and the hardened resin 30 is completed. The resin plate 44 is the base and corresponds to the first layer. The hardening resin 30 is molded so as to cover the resin plate 44 and corresponds to the second layer. The molded product 45 has a plurality of recesses 46 corresponding to the plurality of regions 3 shown in FIGS. 1(a) and 1(b), respectively; and a wall 47, which is a plurality of first cuts at the boundary between the plurality of regions 3 The broken line 7 corresponds to a plurality of second cut lines 8 (see Fig. 1(a)). The recess 46 is a space surrounded by the wall 47.

Next, as shown in FIG. 5( a ), a through hole 48 is formed in the molded product 45. Using a drill, a laser, or the like, a through hole 48 that penetrates the box-shaped member 28, the resin plate 44, and the cured resin 30 is formed in the center of each recess 46. The through hole 48 functions as a suction hole for sucking and holding the object. Through the process of forming the through hole 48 in the molded product 45, the holding member 49 including the box-shaped member 28, the cured resin 30, the resin plate 44 and the through hole 48 is completed.

Hereinafter, the size and shape of the wall portion 47 of the holding member 49 will be described with reference to FIGS. 5(a) and 5(b). The width of the wall 47 is a width w3 equal to the width (thickness) of the rotary blade 40 for groove formation. The end 50 of the wall 47 (the lower part in FIGS. 5(a) and 5(b), the same below) is closer to the front end 51 (the lower end in FIGS. 5(a) and 5(b), the same below) The narrower the width. In other words, the cross-sectional shape of the end 50 of the wall 47 (the cross-sectional shape when cut along the X axis of FIGS. 5(a) and 5(b)) is shown in FIGS. 5(a) and 5(b) In the state of (with the end 50 facing down), it is V-shaped. The front end 51 of the wall 47 is a ridge line extending along the Y axis in Figs. 5(a) and 5(b). The depth of the groove 41 in the grooved plate 42, that is, the distance Lb, is equal to the height of the wall 47 in the holding member 49. The side surface of the wall 47 may be a curved surface. It is also possible to provide a curved surface with a small radius of curvature (in other words, a large curvature) at the front end 51.

(Using the holding member to hold the form of the BGA package) With reference to FIGS. 5(a) and 5(b), the process of holding the BGA package 19 using the holding member 49 will be described. First, as shown in FIG. 5( a ), the conveying mechanism 37 to which the holding member 49 is attached is prepared.

Next, as shown in FIG. 5( a ), the holding member 49 is moved to the upper side of the BGA package 19 sucked on the cutting stage 9. In this process, the center of the gap 20 between the adjacent BGA packages 19 is aligned with the center of the wall 47.

Next, starting from the state shown in FIG. 5(a), the conveying mechanism 37 is lowered. In this process, it is only necessary to raise and lower the cutting platform 9 and the conveying mechanism 37 relative to each other. As a result, the end 50 of the wall 47 is inserted into the gap 20 between the adjacent BGA packages 19. The end 50 of the wall 47 has a V-shaped cross-sectional shape in the state shown in FIGS. 5(a) and 5(b). A part of the end 50 including the front end 51 of the wall 47 enters the inside of the gap 20 (Figures 5(a) and 5(b) are the lower side than the uppermost end of the gap 20), and the part of the wall 47 The deformed two sides are in close contact with the uppermost end of the gap 20. Therefore, the gap 20 can be blocked by the wall portion 47. When viewed from above in this state, each BGA package 19 completely includes each recess 46. Preferably, the distance Lb is defined as the inner bottom surface of the recess 46 (the upper surface of the recess 46 in FIG. 5(b)) and the protrusion when a part of the wall 47 including the front end 51 enters the gap 20 The top of the shaped electrode 6 does not touch.

Next, as shown in FIG. 5(b), each BGA package 19 is sucked through the intake air VJ. Thereby, each BGA package 19 is sucked on both sides of the end 50 of the wall 47. The holding member 49 functions as a suction jig.

Next, after the suction in the cutting platform 9 is stopped, the conveying mechanism 37 is raised, and each BGA package 19 is conveyed to the mechanism for performing the next process.

(Functions and Effects) According to this embodiment, the same effects as in the first embodiment can be obtained. In addition to this, according to this embodiment, the following effects can be obtained. The end 50 of the soft and easily deformable wall 47 has a cross-sectional shape with a narrower width closer to the front end 51. The front end 51 of the wall 47 enters into the gap 20, and the deformed two sides of the wall 47 block the gap 20. On the other hand, as shown in FIG. 3( d ), according to the first embodiment, the end portion 39 of the wall portion 33 is deformed so as to be squashed to close the gap 20. Therefore, according to the present embodiment, when viewed from above, the overlapping length of the wall 47 and the BGA package 19 (shown in FIG. 5(b) as the overlapping length L2 along the X direction) is smaller than the overlapping length L1 in the first embodiment (refer to Figure 3(d)). Compared with Embodiment 1, according to this embodiment, the protruding electrode 6 can be arranged closer to the outer edges of adjacent BGA packages 19. Therefore, in this embodiment, the arrangement of the protruding electrodes 6 in the BGA package 19 can be further increased in density.

Comparing FIG. 3( d) with FIG. 5( b ), it is clear that the present embodiment can achieve a higher density of the arrangement of the protruding electrodes 6 in the BGA package 19. In FIG. 3(d) showing the first embodiment, in one BGA package 19, four protruding electrodes 6 are arranged along the X direction. On the other hand, in FIG. 5( b) showing this embodiment, in one BGA package 19, five protruding electrodes 6 are arranged along the X direction.

In addition, according to the present embodiment, even when the distance between the outer edge of the BGA package 19 and the outermost edge of the outermost solder ball is small, each BGA package 19 can be attracted to the holding member 49. In this way, first, the size of the BGA package 19 can be reduced. Second, it is possible to increase the number of BGA packages 19 manufactured from the sealed substrate 1 for BGA having the same flat area (refer to FIG. 1(a) and FIG. 1(b)), in other words, it is possible to increase the cost of the BGA package 19 slices.

(Modification) As a modification, after the first resin material is supplied to the box-shaped member 28 shown in FIG. 4(b) and the first cured resin is molded, the second resin material may be supplied to the first cured resin. The second curing resin is molded. The hardness of the second cured resin is smaller than the hardness of the first cured resin. In the wall portion 47, the vicinity of the end 50 may be formed of the second cured resin, and the portion closer to the box-shaped member 28 than the vicinity of the end 50 may be formed of the first cured resin. With these structures, the soft and deformable second hardened resin is supported by the hard first hardened resin, and the end 50 of the wall 47 is formed by the second hardened resin. Therefore, the end 50 in the penetration wall 47 is soft and easily deformable, so that the end 50 can more reliably close the gap 20 between the BGA packages 19.

The angle of the tip 51 is preferably an acute angle, and the angle of the tip 51 is more preferably 15° or more and 45° or less. The reason why the angle of the tip 51 is more preferably 15° or more and 45° or less is as follows. If the angle of the tip 51 is less than 15°, the wall 47 may penetrate deeply into the gap 20 and the inner bottom surface of the recess 46 of the holding member 49 may contact the top of the protruding electrode 6. At this time, the opposing outer peripheral portion of the BGA package 19 and the end portion 50 of the wall portion 47 may be separated and the BGA package 19 cannot be adsorbed, which is not preferable. If the angle of the tip 51 is greater than 45°, it will hinder the high density of the arrangement of the protruding electrodes 6 and the downsizing of the BGA package 19, which is not preferable.

Regarding the wall portion 47, the following modification examples can also be adopted. The cross-sectional shape of the end portion 50 may be an asymmetrical shape whose width becomes narrower as it approaches the tip 51. For example, the cross-sectional shape of the end 50 may be a shape in which the angle symbol ∠ is rotated 90° counterclockwise.

[Embodiment 3] (A form in which a holding member is used to hold an LED package) A form in which a holding member according to Embodiment 3 of the present invention holds an optical element will be described with reference to Figs. 6(a) and 6(b). In FIGS. 6(a) and 6(b), as a holding object, a light emitting diode (LED) package 52 corresponding to an optical product is shown. The LED package 52 has a substrate 53 including a printed circuit board, a lead frame, etc., an LED chip 54 and a sealing resin 55 corresponding to convex portions. The sealing resin 55 containing a light-transmitting resin functions as a convex lens. An external terminal (not shown) is formed on one of the surfaces of the substrate 53 (the lower surface in FIG. 6(a)). The other surface 56 (the upper surface in FIG. 6(a)) of the substrate 53 is a wafer mounting surface. The height of the sealing resin 55 protruding from the other surface 56 of the substrate 53 up to the top (in other words, the protrusion amount of the sealing resin 55) is the distance La. The LED package 52 is manufactured by singulating a sealed substrate for LED (not shown, corresponding to the sealed substrate 1 for BGA shown in FIGS. 1(a) and 1(b)). The sealing resin 55 of one LED package 52 is accommodated in one of the plurality of recesses 46 formed in the holding member 49.

There are two LED packages 52 shown in FIGS. 6(a) and 6(b) in the X direction and two in the Y direction, and a total of four LED chips 54 are provided. One LED chip 54 can also be provided in one LED package 52. As the optical element, a laser diode chip may be provided instead of the LED chip 54. It is also possible to provide one light-emitting element and one light-receiving element in one package. At this time, the one package functions as an optical sensor.

The holding member 49 shown in FIGS. 6(a) and 6(b) holds the LED package 52 in the same form as the holding member 49 shown in FIGS. 5(a) and 5(b). When viewed in plan in the state shown in FIG. 6( b ), each LED package 52 completely includes each recess 46. At this time, the depth of the recessed portion 46, that is, the distance Lb, is determined in consideration of the distance La, which is the protrusion amount of the sealing resin 55, and the amount of penetration into the gap 20 from a part of the wall portion 47 including the tip 51. Specifically, the distance Lb is defined as the inner bottom surface of the recess 46 (the upper surface of the recess 46 in FIG. 6(b)) and the inner bottom surface of the recess 46 in a state where a part of the wall 47 including the front end 51 enters the gap 20 The top of the sealing resin 55 does not touch.

(Effects) According to this embodiment, even if the distance between the outer edge of the substrate 53 and the outer edge of the sealing resin 55 is small on the other surface 56 of the substrate 53, each LED package 52 can be sucked于holding member 49. In this way, first, the LED package 52 can be miniaturized. Second, the number of LED packages 52 manufactured from the sealed substrate for LEDs having the same flat area can be increased, in other words, the number of LED packages 52 can be increased.

[Embodiment 4] (Structure of Cutting Device) The structure of a cutting device that cuts the sealed substrate 1 for BGA shown in Figs. 1(a) and 1(b) will be described with reference to Fig. 7. The cutting device 57 shown in FIG. 7 is one form of a product manufacturing device that uses the holding member 35 shown in FIG. 3(d) to manufacture the BGA package 19 that is a product.

As shown in FIG. 7, the cutting device 57 includes the following modules as each constituent component, namely: supply module A, supply sealed substrate 1 for BGA; cut module B, cut sealed substrate 1 for BGA; and inspection /Storage module C, inspect and store the cut BGA package 19. Each component (each module A to module C) can be detached and replaced with respect to other component components, respectively.

In the supply module A, a sealed substrate supply unit 58 that supplies the sealed substrate 1 for BGA is provided. The sealed substrate 1 for BGA uses a transport mechanism (not shown) to transfer the other surface 2b (the surface on which the protruding electrode 6 is formed) of the sealed substrate 1 for BGA by a transport mechanism (not shown). Refer to Figure 1(a) and Figure 1(b). ) Upward (in the +Z direction), transport from the supply module A to the shutoff module B.

In the cutting module B, a cutting platform 9 for mounting and cutting the sealed substrate 1 for BGA is provided (refer to FIGS. 2(a) to 2(c)). A cutting jig 10 is attached to the cutting platform 9 (refer to FIGS. 2(a) to 2(c)). The cutting platform 9 can be moved in the Y direction of the figure through the moving mechanism 59. In addition, the cutting platform 9 can be rotated in the θ direction through the rotation mechanism 60. The sealed substrate 1 for BGA is placed on the cutting jig 10 mounted on the cutting platform 9.

In the cutting module B, a spindle 61 as a cutting mechanism is provided. The main shaft 61 can independently move in the X direction and the Z direction. On the main shaft 61, a rotary knife 18 for cutting the sealed substrate 1 for BGA is mounted. As also shown in FIG. 2(a), the rotating knife 18 has a width (thickness) w1.

The main shaft 61 is provided with a nozzle for cutting water that sprays cutting water toward the rotating blade 18 rotating at a high speed, a nozzle for cooling water (both not shown) that sprays cooling water, and the like. By relatively moving the cutting table 9 and the spindle 61, the sealed substrate 1 for BGA is cut. The rotary knife 18 cuts the sealed substrate 1 for BGA by rotating in the plane of the Y-Z plane.

The cutting device 57 is a cutting device of a single-spindle structure provided with a single spindle 61. It is not limited to this, and a cutting device having a dual-spindle structure in which two spindles are provided in the cutting module B may be provided. Furthermore, it is also possible to provide a double cutting stage structure in which two cutting stages are provided, and the sealed substrate 1 for BGA is cut in each cutting stage. By adopting a dual-spindle structure and a dual-cutting platform structure, the productivity of the cutting device can be improved.

The inspection/storage module C is provided with a transport mechanism 37 (see FIG. 3(d)) that sucks and transports the plurality of BGA packages 19 that have been cut and singulated by the sealed substrate 1 for BGA. The transport mechanism 37 can move in the X direction and the Z direction. In the conveyance mechanism 37, the holding member 35 shown in FIG.3(d) is attached. The transport mechanism 37 uses the holding member 35 to collectively suck and transport the plurality of singulated BGA packages 19 to the holding member 35.

In the inspection/storage module C, an inspection platform 62 for mounting and inspecting a plurality of singulated BGA packages 19 is provided. An inspection jig 63 is installed on the inspection platform 62. The inspection platform 62 can rotate about the Y axis, and can move in the X direction and the Z direction. A plurality of BGA packages 19 are collectively placed on the inspection jig 63 through the transport mechanism 37. The plurality of BGA packages 19 pass through the inspection camera 64 to face the surface of the sealing resin 5 shown in FIG. 5(a) (the lower surface in FIG. 5(a)) and the surface on the side of the protruding electrode 6, which is the other Surface 2b is inspected separately.

In the inspection/storage module C, a storage platform 65 for temporarily storing the plurality of BGA packages 19 that have been inspected is provided. The storage platform 65 can move in the Y direction. In the storage platform 65, the holding member 35 for the BGA package shown in Embodiment 2 is mounted. The storage platform 65 is equivalent to a holding mechanism. The inspected BGA packages 19 are collectively transferred from the inspection platform 62 to the holding member 35 mounted on the storage platform 65. The BGA package 19 stored by the storage platform 65 is divided into good products and defective products. By a transfer mechanism (not shown), the good products are transferred and stored on the good product tray 66, and the defective products are transferred and stored on the defective product tray 67.

A control unit CTL is provided in the supply module A. The control unit CTL controls the operation of the cutting device 57, the transportation of the sealed substrate 1 for BGA, the cutting of the sealed substrate 1 for BGA, the transportation of the singulated BGA package 19, the inspection of the BGA package 19, and the BGA package 19 ’S storage and so on. In this embodiment, the control unit CTL is provided in the supply module A. However, it is not limited to this, and the control unit CTL may be provided in other modules. In addition, the control unit CTL may be divided into a plurality of parts, and the divided parts may be provided in at least two of the supply module A, the cutting module B, and the inspection/storage module C, respectively.

In the case of manufacturing the LED package 52 shown in FIGS. 6( a) and 6 (b ), the conveying mechanism 37 to which the holding member 49 is attached is used. In the case of manufacturing an optical product, for example, in the case of manufacturing a micro lens array, the holding object held by the holding member is a micro lens array. At this time, a holding member corresponding to the size and shape of the microlens array is prepared. The prepared holding member is attached to the conveying mechanism, and the microlens array is attracted to the holding member. Subsequently, a transport mechanism is used to transport the microlens array.

In this embodiment, the holding member 35 (refer to FIGS. 3(d) and 7) and the holding member 49 (refer to FIGS. 5(a) and 5(b), 6(a) and 6(b)) represent Sexually, it is used in the next process. In this manufacturing process, the BGA package 19 and the LED package 52 singulated by cutting are transported from the cutting platform to the inspection platform. As a process other than this, in the process of absorbing the BGA package 19 and the LED package 52 with the convex portions (protruding electrodes 6 and the sealing resin 55) of the concavities and convexities of the BGA package 19 and the LED package 52 facing upward, The holding member 35 and the holding member 49.

(Function and Effect) According to the present embodiment, in the cutting device 57, the holding member 35 for BGA packaging shown in the second embodiment is applied to the conveying mechanism 37 and the storage platform 65. The plurality of protruding electrodes 6 of one BGA package 19 are accommodated in one of the plurality of recesses 32 formed on the holding member 35. Therefore, in the plurality of BGA packages 19, the other surface 2 b that is the surface on the side of the protruding electrode 6 shown in FIG. 5( a) can be stably sucked to the conveying mechanism 37 and the storage platform 65. By applying this holding member 35 to the conveying mechanism 37 and the storage platform 65, the manufacturing cost of the cutting device 57 can be suppressed.

In the embodiment described so far, the BGA package 19 and the LED package 52 have been exemplified and described as the holding target product held by the holding member of the present invention. However, it is not limited to these, and the present invention can be applied to an object to be held having irregularities on the sucked surface. First, a sealed substrate for Land Grid Array (LGA) can be cited. The sealed substrate for LGA is formed with terminals containing copper foil and a solder resist containing insulating resin on the sucked surface. (Solder resist). Since the thickness of the terminal and the thickness of the solder resist are usually different, irregularities (in other words, a step difference) are formed on the sucked surface of the sealed substrate for LGA. Second, an optical product in which a lens is formed on the surface to be adsorbed can be cited. As an example of the convex portion, a convex lens can be cited, as an example of the concave portion, a concave lens can be cited, and as an example of a concave and convex portion, a Fresnel lens can be cited. The optical article includes a microlens array.

In the embodiment described so far, when manufacturing the holding member, the forming mold 27 shown in Figs. 3(a) to 3(c) and the forming shown in Figs. 4(b) to 4(d) are used. Mold 43. The forming mold 27 has a grooved plate 25 (refer to FIGS. 3(a) to 3(c)). The forming mold 43 has a grooved plate 42 (refer to FIGS. 4(a) to 4(d)). When manufacturing the grooved plate 25 and the grooved plate 42, a disk-shaped rotating knife 22 having a width (thickness) w2 is used to form grooves in the plate-shaped member 21 including a hard resin plate or the like. Instead of the plate-shaped member 21, the rotary knife 22 and the rotary knife 40 may be used for the intermediate product before singulation to form a groove. As an intermediate product before singulation, first, the sealed substrate 1 for BGA itself (refer to FIG. 1(a) and FIG. 1(b)) can be cited. Secondly, the sealed substrate itself (not shown) for LED packaging before being singulated into the LED package 52 (refer to FIGS. 6(a) and 6(b)) is mentioned. Third, the intermediate product that is an intermediate product before being singulated into a micro lens array or the like in the process of manufacturing an optical product such as a micro lens array.

It is also possible to use the rotary knife 22 and the rotary knife 40 to form a groove for a substitute product having the same size and shape as the sealed substrate. As a substitute, for example, a molded product that becomes a substitute for the sealed substrate 1 for BGA shown in FIGS. 1( a) and 1 (b) can be cited. To manufacture this molded product, the same substrate as the substrate 2 used for the sealed substrate 1 for BGA is used. For example, the wafer 4 is not mounted, and a dummy resin having the same size and shape as the sealing resin 5 is molded. The rotary knife 22 and the rotary knife 40 are used to form grooves in the molded product containing the dummy resin, thereby producing a molded product with grooves instead of the grooved plate 25 and the grooved plate 42. A molded product with grooves can be used as an alternative to the molding die 27 shown in FIGS. 3(a) to 3(c) and the molding die 43 shown in FIGS. 4(b) to 4(d).

In the embodiment described so far, the rotary knife 22 and the rotary knife 40 are used to form the groove portion 23 and the groove portion 41. In the process of forming the groove portion 23 and the groove portion 41, a wire saw, a band saw, or the like may be used instead of the rotary knife 22 and the rotary knife 40 for processing. Furthermore, in the process of forming the groove portion 23 and the groove portion 41, laser processing, blast processing, water jet processing, or the like may also be used. When using wire saw processing, laser processing, sandblasting processing, and water jet processing, it is possible to manufacture products with curved or broken lines in the planar shape. As an example of a product that includes a curved line or a broken line in a flat shape, a memory card can be cited.

In the embodiment described so far, the holding member 49 is used as a suction jig. As a modified example, a molded product 45 (see FIG. 4(d)) that is a member in which the through hole 48 is not formed can be used as a tray. In other words, the molded product 45 can be used as a holding member that does not require a suction hole. The form in which the molded product 45 shown in FIG. 4(d) is used as a tray is demonstrated. In the state shown in FIG. 4(d) (the state in which the opening of the recess 46 faces upward), the molded product 45 is used. The description will be made with reference to Fig. 5(b) in a state where it is reversed up and down. In this state, the BGA package 19 is housed in the recess 46 in such a manner that the outer edge of the BGA package 19 is in contact with the inner surface of the end 50 of the wall 47 surrounding the recess 46. The protruding electrode 6 of the BGA package 19 does not touch the inner bottom surface of the recess 46. As a result, it is possible to prevent dirt from adhering to the protruding electrode 6. Therefore, the electrical connection in which the protruding electrode 6 participates can be stably performed. In addition, it is possible to suppress shaking when the BGA package 19 is transported.

As another modified example, description will be made with reference to FIG. At this time, the sealing resin 55 included in the LED package 52 does not contact the inner bottom surface of the recess 46. As a result, it is possible to prevent dirt from adhering to the sealing resin 55 that functions as a convex lens. Therefore, no degradation of the optical characteristics of the LED package 52 occurs. In addition to this, it is possible to suppress shaking when the LED package 52 is transported.

As another modification, the modification of the molded product 31 shown in FIG. 3(c) can be used as a tray. In the center of the groove part 23 shown in FIG. 3(a), a shallow groove part is formed using a groove forming rotary knife having a width (thickness) w4. The width w4 of the rotary knife is smaller than the width w1 of the rotary knife 18 for cutting (refer to FIG. 2(a)). Through the processes shown in FIGS. 3(a) to 3(c), a molded product that replaces the molded product 31 shown in FIG. 3(c) is manufactured. This molded product has a level difference formed at the corners on both sides of the upper part of the wall 33 shown in FIG. 3(c). The outer edges of the objects to be held, such as the BGA package 19 and the LED package 52, are placed on a horizontal surface in this step. Also in this modification, the same effects as the two modification examples described so far can be obtained.

In the three modified examples described so far, the suction holes may be formed in the molded product as a modified example of the molded product 31 and the molded product 45. In these cases, the holding member and the holding member 49, which are modifications of the holding member 35, correspond to a tray having a function of sucking and holding a target product.

In each embodiment, the cutting device has been described as one form of the product manufacturing device. The present invention is not limited to this, and the holding member of the present invention can also be applied to a conveying device for conveying a product, a storage device for storing a product, an inspection device for inspecting a product, etc. used in a product manufacturing device.

The present invention is not limited to the respective embodiments described above, and can be combined, changed, or selected arbitrarily and appropriately as needed within the scope not departing from the gist of the present invention.

1‧‧‧Sealed substrate (intermediate product) for BGA 2,53‧‧‧Substrate 2a‧‧One side 2b, 56‧‧‧The other side (the first side) 3‧‧‧Area 4‧‧‧ Wafer 5, 55‧‧‧Sealing resin 6‧‧‧Protruding electrode 7‧‧‧First cutting line 8‧‧‧Second cutting line 9‧‧‧Cut platform 10‧‧‧Cut jig 11 ‧‧‧Metal plate 12‧‧‧Resin sheet 13‧‧‧Cutting grooves 14, 34, 48‧‧‧ Through holes 15‧‧‧Space 16, 38‧‧‧Piping 17‧‧‧Valves 18, 22, 40‧‧‧Rotary knife 19‧‧‧BGA package (product, holding object, electronic device) 20‧‧‧Gap 21‧‧‧Plate member (hard board) 23,41‧‧‧Groove 24‧‧‧ Cutting line 25, 42‧‧‧with groove plate 26‧‧‧reinforcement plate 27,43‧‧‧forming mold 28‧‧‧box-shaped member 29‧‧‧resin material 30‧‧‧curing resin 31,45‧‧ ‧Molded product 32, 46‧‧‧Concavity 33,47‧‧‧Wall 35,49‧‧‧Retaining member 36‧‧‧End surface 37‧‧‧Transport mechanism 39,50‧‧‧End 44‧‧‧Resin Board (1st layer) 51‧‧‧Front end 52‧‧‧LED package (products, holding objects, electronic devices) 54‧‧‧LED chip 57‧‧‧cutting device 58‧‧‧Sealed substrate supply part 59 ‧‧‧Moving mechanism 60‧‧‧Rotating mechanism 61‧‧‧Spindle 62‧‧‧Inspection platform 63‧‧‧Inspection jig 64‧‧‧Inspection camera 65‧‧‧Storage platform 66‧‧‧Good product tray 67 ‧‧‧Tray for defective products a‧‧‧One side length A‧‧‧Supply module B‧‧‧Cutting module C‧‧‧Inspection/storage module CTL‧‧‧Control unit L1, L2‧‧‧Coincidence length La , Lb‧‧‧Distance VJ, VT‧‧‧Inlet w1‧‧‧Width (2nd width) w2, w3‧‧‧Width (1st width) θ, X, Y, Z‧‧‧ Direction

Fig. 1(a) is a plan view of the sealed substrate for BGA viewed from the substrate side, and Fig. 1(b) is a front view of the sealed substrate for BGA. Figure 2 (a) is a schematic cross-sectional view showing the process of manufacturing a BGA package from the BGA sealed substrate shown in Figure 1 (a) and Figure 1 (b), and Figure 2 (b) and Figure 2 (c) are showing A schematic cross-sectional view of a part of the process of manufacturing the holding member for the BGA package. Figures 3(a) to 3(c) are schematic cross-sectional views of the part following Figure 2(c) in the process of manufacturing the holding member for the BGA package, and Figure 3(d) shows the use of the manufactured BGA A schematic cross-sectional view of the process of holding the package holding member to adsorb the BGA package. 4(a) to 4(d) are schematic cross-sectional views showing a part of another process for manufacturing the holding member for a BGA package. 5(a) and 5(b) are schematic cross-sectional views showing a process of sucking a BGA package using another holding member for a BGA package manufactured. 6(a) and 6(b) are schematic cross-sectional views showing a process of sucking the LED package using the manufactured light emitting diode (Light Emitting Diode, LED) package holding member. Fig. 7 is a schematic plan view showing a cutting device to which the holding member for a BGA package shown in Fig. 3(d) is applied.

4‧‧‧Chip

5‧‧‧Sealing resin

9‧‧‧Cut off the platform

19‧‧‧BGA package (products, holding objects, electronic devices)

20‧‧‧Gap

30‧‧‧hardened resin

32‧‧‧Concave

33‧‧‧Wall

34‧‧‧Through hole

35‧‧‧Retaining member

36‧‧‧End face

37‧‧‧Transportation Organization

38‧‧‧Piping

39‧‧‧End

L1‧‧‧Coincidence length

Lb‧‧‧Distance

VJ‧‧‧Air intake

w1‧‧‧Width (2nd width)

w2‧‧‧Width (1st width)

Claims (12)

A method for manufacturing a holding member, which manufactures a holding member that holds a plurality of holding objects, the holding objects are cut by a cutting knife to be singulated and have a plurality of protruding electrodes, and the holding member The manufacturing method includes: preparing a forming mold having a first width larger than the thickness of the cutting knife on a main surface and a plurality of grooves formed corresponding to a wall portion, the wall portion It is arranged to close the gap between the adjacent holding objects after being singulated; the forming mold is arranged to face the resin material; the main surface of the forming mold is pressed to the The resin material; by hardening the resin material to form a hardened resin, thereby forming a molded product containing the hardened resin; and removing the molded product from the molding die, the molded product having a plurality of recesses The holding member, the plurality of recesses are surrounded by a plurality of the wall portions formed by transferring the plurality of grooves to the hardened resin, and the recesses are configured to accommodate the holding object of the The plurality of protruding electrodes hold the object to be held in a sealed state by the wall portion surrounding the recess and the object to be held. The manufacturing method of the holding member as described in item 1 of the scope of the patent application further includes: preparing a box-shaped member; and The resin material is supplied to the box-shaped member, and in the process of pressing the resin material, the main surface of the molding die is pressed to the resin material supplied to the box-shaped member. The manufacturing method of the holding member as described in the second item of the patent application further includes: removing the box-shaped member from the hardened resin. The method of manufacturing a holding member according to claim 1, wherein the forming die includes a hard plate, and the plurality of grooves formed on the main surface of the hard plate, and the plurality of grooves The part includes a plurality of first grooves extending in a first direction, and a plurality of second grooves extending in a second direction intersecting the first direction. The manufacturing method of the holding member as described in the scope of the patent application, wherein the process of forming the molded product includes: providing a first layer as a base; and forming a second layer, the second layer covering all The first layer is formed as described above and can be brought into contact with the object to be held, and the second layer is softer than the first layer. The manufacturing method of the holding member as described in the scope of the patent application, further comprising: forming a through hole, the through hole is provided in the recess, and at least penetrates the hardened resin, and the through hole is used to absorb the Describe the suction hole for holding the object. A holding member that holds a plurality of holding objects, the holding objects being cut into pieces by a cutting knife and having a plurality of protruding electrodes, and the holding member includes: a hardened resin, which is The resin material is formed by curing, and has a contact surface that comes into contact with the object to be held; a plurality of first wall portions are included in the cured resin and extend in the first direction; and a plurality of second wall portions are included in the cured resin The resin extends in a second direction that intersects the first direction; and a concave portion surrounded by the plurality of first wall portions and the plurality of second wall portions, and the concave portion is singulated to seal The gap between the holding objects adjacent to the rear accommodates the plurality of protruding electrodes of the holding object, and the plurality of first wall portions and the plurality of The second wall portion and the holding object are in a sealed state to hold the holding object, and the shape of the plurality of first wall portions is formed on the main surface of the forming mold and has a ratio of The shape of the plurality of first grooves of the first width with the greater thickness of the cutting blade is transferred to the shape of the hardened resin, and the shape of the plurality of second wall portions is formed in the molding die The shape of a plurality of second grooves formed on the main surface of the cutting blade and having the first width larger than the thickness of the cutting blade is transferred to the shape of the hardened resin. The holding member described in claim 7 includes a box-shaped member that contacts a surface other than the contact surface in the hardened resin, and the box-shaped member functions as a container for accommodating the resin material, The box-shaped member functions as a reinforcing plate supporting the hardened resin. The holding member described in claim 7 further includes a through hole provided in the recess and at least penetrates the hardened resin, and the through hole is a suction hole for sucking the holding object. The holding member according to claim 7, wherein the holding member has: a first layer as a base; and a second layer formed so as to cover the first layer and contacting the holding In the object product, the second layer is softer than the first layer. A holding mechanism includes the holding member as described in any one of items 7 to 10 of the scope of patent application. A manufacturing device for a product, comprising the holding member as described in any one of the 7th to 10th items in the scope of the patent application.

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