TWI751547B - Manufacturing method of electronic device - Google Patents

Abstract

A manufacturing method of an electronic device including steps below is provided. First, a circuit board and a mold are provided. The mold includes a mold body, an accommodating space and an opening. The accommodating space is connected to the opening in a first direction and is located in the mold body. Then, the circuit board is put in the accommodating space of the mold. After that, a potting sealant is filled in the accommodating space of the mold. Finally, the potting sealant is separated from the mold after the potting sealant was cured.

Description

Manufacturing method of electronic device

The present invention relates to a manufacturing method of an electronic device, and more particularly, to a manufacturing method of an electronic device without a plastic casing.

Potting glue is widely used in the field of encapsulating electronic devices, and it usually includes a thermosetting resin that can be cured at room temperature or after being heated. After curing, the potting compound can be used to insulate the internal components or circuits of electronic devices from each other, and has functions such as waterproof, thermal conductivity or shockproof. In the conventional process of encapsulating electronic devices using potting glue, a plastic casing is used as a container first, and then electronic devices such as circuit boards and the potting glue are placed in sequence, and the potting glue is cured to complete the process. The packaging process, and the plastic casing used in the process is used as the casing of the electronic device to protect the electronic device.

As mentioned above, since the cured potting compound has the functions of waterproof, thermal conductivity or shock resistance and has a certain hardness, if the use of plastic casings can be omitted in the process of packaging electronic devices, the reduction of electronic devices can be reduced. manufacturing cost and size of the electronic device.

The present invention provides a manufacturing method of an electronic device, which does not need to use a plastic casing in the manufacturing process, thereby reducing the manufacturing cost of the electronic device and the size of the electronic device.

The manufacturing method of the electronic device of the present invention includes the following steps. First, provide circuit boards and molds. The mold includes a mold body, an accommodating space and an opening. The accommodating space communicates with the opening in the first direction and is located in the mold body. Next, the circuit board is placed in the accommodating space of the mold. Next, fill the potting compound into the accommodating space of the mold. Finally, after the potting compound is cured, the cured potting compound and the mold are separated.

In an embodiment of the present invention, the above-mentioned electronic device further includes a connector, wherein the connector is electrically connected to the circuit board and is exposed to the cured potting glue.

In an embodiment of the present invention, the above-mentioned electronic device further includes wires, wherein the wires are electrically connected to the circuit board and extend out of the cured potting glue along the first direction.

In an embodiment of the present invention, the above-mentioned mold body includes at least one protruding portion, and the at least one protruding portion extends into the accommodating space.

In an embodiment of the present invention, before the step of filling the potting compound into the accommodating space of the mold, the method further includes cutting one of the at least one protrusions along a direction opposite to the first direction.

In an embodiment of the present invention, after the step of cutting one of the at least one protrusions in a direction opposite to the first direction, an elastic ring body is provided on the periphery of the mold body to fix the mold.

In an embodiment of the present invention, the material of the above-mentioned mold body includes silicone.

In an embodiment of the present invention, the material of the above-mentioned potting compound includes epoxy resin.

Based on the above, the manufacturing method of the electronic device provided by the present invention does not use a plastic casing during packaging, so the finished electronic device does not have a plastic casing. In this case, in addition to reducing the manufacturing cost of the electronic device, it can also Reduce the size of electronic devices.

1A to 1D are schematic flowcharts of a manufacturing method of an electronic device according to an embodiment of the present invention.

Referring to FIG. 1A , a circuit board 100 and a mold 200 are provided. In some embodiments, a plurality of electronic components are disposed on the circuit board 100 , and the types and quantities of the plurality of electronic components may be changed according to the electronic device to be manufactured. In this embodiment, the circuit board 100 is electrically connected to the connector 110 and the plurality of wires 120 . In detail, the circuit board 100 may include a plug segment 100a and a connection segment 100b, wherein the plug segment 100a is electrically connected to the connector 110, and the connection segment 100b is electrically connected to a plurality of wires 120, but the present invention does not use this limited. The connector 110 may, for example, include an insulating body and a plurality of terminals. The insulating body has, for example, a concave portion for accommodating a plurality of terminals, the contact portions of the terminals are for example for butting with the butt connector, and the soldering portions of the terminals are soldered on the circuit board 100 to be electrically connected to the circuit board 100 . The plurality of wires 120 may include, for example, bare wire portions, wherein the bare wire portions of the plurality of wires 120 may be soldered on the circuit board 100 to be electrically connected to the circuit board 100 .

Please continue to refer to FIG. 1A , the mold 200 includes a mold body 210 , an accommodating space 220 and an opening 230 . The shape of the mold body 210 is designed according to the shape of the circuit board 100 , for example. In this embodiment, the mold body 210 has the shape of a square column, and one side of the square column has a groove, but the invention is not limited to this. In some embodiments, the mold body 210 may have at least one protruding portion 212 , and the at least one protruding portion 212 extends into the accommodating space 220 . In this embodiment, the mold body 210 includes two protruding portions 212a and 212b, and the protruding portions 212a and 212b face each other, but the invention is not limited thereto. Since the mold 200 will be used for the encapsulation process of the circuit board 100 in the future, the material included in the mold body 210 is, for example, a material that is not bonded with the potting glue. In this embodiment, the material of the mold body 210 includes silicone. For example, the accommodating space 220 communicates with the opening 230 in the first direction D1 and is located in the mold body 210 . In some embodiments, the accommodating space 220 and the opening 230 may have rectangle-like contours in the first direction D1, but the invention is not limited thereto.

Referring to FIG. 1B , the circuit board 100 is placed in the accommodating space 220 of the mold 200 . In this embodiment, the circuit board 100 is placed in the accommodating space 220 through the opening 230 . Since the encapsulation process of the circuit board 100 will be performed subsequently by filling the accommodating space 220 with the potting glue through the opening 230 , after the circuit board 100 is placed in the mold 200 , the plug-in section 100 a of the circuit board 100 needs to be It is adjacent to the opening 230 so that the connector 110 can perform its function without being sealed by the potting glue during the subsequent packaging process. In detail, when the circuit board 100 is placed in the accommodating space 220 of the mold 200 , the connection section 100 b of the circuit board 100 first passes through the opening 230 of the mold 200 in a direction opposite to the first direction D1 , and the connection section 100 b of the circuit board 100 first passes through the opening 230 of the mold 200 in a direction opposite to the first direction D1 When the connecting segment 100 b of the circuit board reaches the bottom of the accommodating space 220 , the plug-in segment 100 a of the circuit board 100 enters the interior of the accommodating space 220 and is adjacent to the opening 230 . In addition, the plurality of wires 120 welded to the connecting segment 100b may extend out of the mold 200 through the opening 230 along the first direction D1.

Referring to FIG. 1C , the potting compound 300 a is filled in the accommodating space 220 of the mold 200 . In this embodiment, the potting glue 300 a is filled in the remaining space of the accommodating space 220 to cover the plug-in section 100 a and the connection section 100 b of the circuit board 100 securely. In detail, the potting glue 300a is in the form of a fluid liquid before being cured, and can be cured after being placed for a period of time or heated. In this embodiment, the material of the potting glue 300a includes epoxy resin. Since the epoxy resin and the silicone (the material of the mold body 210 ) do not have adhesive properties, the packaged circuit board 100 can be taken out quickly after curing, and the packaged circuit board 100 can be kept 's appearance. Furthermore, the cost of epoxy resin is low, and therefore, the manufacturing cost of the electronic device can be reduced.

Please continue to refer to FIG. 1C , before filling the potting compound 300 a into the accommodating space 220 of the mold 200 , at least one protruding portion 212 of the mold body 210 may be cut along a direction opposite to the first direction D1 one of. In the present embodiment, the convex portion 212a of the mold body 210 is cut in a direction opposite to the first direction D1 to form a cutting line 210L in the convex portion 212a of the mold body 210 . Since the mold body 210 of this embodiment has a secant line 210L, after the potting glue 300a is cured, a part of the mold body 210 can be torn along the direction opposite to the first direction D1 to the secant line 210L, so as to quickly take out the mold body 210 . The packaged circuit board 100 . Based on this, the secant line 210L formed in the protruding portion 212a of the mold body 210 of the present embodiment can have the effect of rapidly separating the potting compound 300a from the mold 200 . In some embodiments, after the potting glue 300a is filled in the accommodating space 220 of the mold 200, it may flow into the cut mold body 210 through the cutting line 210L. Based on this, after the potting glue 300a is cured, it is possible The appearance of the packaged circuit board 100 is made to have a discontinuity. In this regard, since the secant line 210L is formed in the convex portion 212a of the mold body 210 in this embodiment, and the potting compound 300a has a concave portion corresponding to the convex portion 212a of the mold body 210 after curing, therefore, in the The situation that the potting glue 300a flows into the cut protruding portion 212a through the cut line 210L can be compensated by the above-mentioned depression, so that the packaged circuit board 100 has a more complete appearance.

Please continue to refer to FIG. 1C , after cutting one of the at least one protruding portion 212 of the mold body 210 along a direction opposite to the first direction D1 , an elastic ring body 400 is disposed on the periphery of the mold 200 to fix the mold 200 . In detail, the elastic ring body 400 can cover the mold 200 to give a compressive force to the inside thereof, thereby preventing the potting glue 300a from flowing out of the mold 200 through the secant line 210L. It should be noted here that although the elastic ring body 400 is used to fix the mold 200 in this embodiment, the present invention is not limited to this. The mold 200 is fixed by attaching to the outside of the mold 200 or using the magnetic force of a magnetic material.

Referring to FIG. 1D , after the potting glue 300 a is cured, the cured potting glue 300 a and the mold 200 are separated to form the electronic device 10 . The potting compound 300a can be cured into a solid potting body 300 after about 24 hours at room temperature, so as to fix the circuit board 100 and serve as a shell of the circuit board 100, and the potting body 300 includes epoxy resin due to its material. Resin has the functions of waterproof, dustproof, insulation, heat conduction, shockproof and so on. Based on this, the electronic device 10 formed in this embodiment does not need to have a conventional plastic casing, which not only reduces the manufacturing cost of the electronic device 10 but also reduces the size of the electronic device 10 . In addition, since the material of the mold body 210 is silicone and is not bonded to the potting body 300 (the cured potting glue 300 a ), the mold body 210 and the potting body 300 still retain their original shapes when they are separated. Therefore, the mold body 210 of this embodiment can be reused, thereby further reducing the manufacturing cost of the electronic device 10 .

Please continue to refer to FIG. 1D , which is a schematic diagram of the electronic device 10 according to an embodiment of the present invention. The electronic device 10 in this embodiment may be, for example, a power converter, a voltage transformer or other related electronic devices, and the invention is not limited thereto. In this embodiment, the electronic device 10 includes a circuit board 100 , a connector 110 , a plurality of wires 120 and a potting body 300 . The components of the circuit board 100 , the connector 110 , and the plurality of wires 120 and their connection relationships are described in detail in the foregoing embodiments, and will not be repeated here. For example, the potting body 300 covers the circuit board 100 and exposes a part of the connector 110 and the plurality of wires 120 . For example, the contact portion of the terminal of the connector 110 may be disposed in the concave portion of the connector 110 , and the concave portion of the connector 110 is not covered by the potting body 300 . In addition, the plurality of wires 120 extend out of the potting body 300 along the first direction D1.

To sum up, the manufacturing method of the electronic device provided by the present invention does not need to use a plastic casing when encapsulating the electronic device. Therefore, the finished electronic device does not have a plastic casing. In this case, in addition to reducing the manufacturing cost of the electronic device , it can also reduce the size of the electronic device. Furthermore, the mold provided by the present invention is not bonded with the potting glue and can be reused, so the process time of the electronic device can be accelerated and the manufacturing cost of the electronic device can be further reduced.

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

10: Electronics 100: circuit board 100a: plug-in segment 100b: Connection segment 110: Connector 120: Wire 200: Mould 210: Mold body 210L: Secant 212, 212a, 212b: bosses 220: accommodating space 230: Opening 300: Potting body 300a: Potting glue 400: elastic ring body D1: first direction

1A to 1D are schematic flowcharts of a manufacturing method of an electronic device according to an embodiment of the present invention.

10: Electronics 100: circuit board 110: Connector 120: Wire 300: Potting body D1: first direction

Claims (6)

A method for manufacturing an electronic device, comprising: providing a circuit board and a mold, wherein the mold includes a mold body, an accommodating space, and an opening, the accommodating space communicates with the opening in a first direction and is located in the mold body , wherein the mold body includes at least one protruding portion, and the at least one protruding portion extends into the accommodating space; the circuit board is placed in the accommodating space of the mold; along the cutting one of the at least one protruding portion in a direction opposite to the first direction; filling potting glue into the accommodating space of the mold; and after the potting glue is cured, The cured potting compound and the mold are separated, wherein the cured potting compound serves as the outer shell of the circuit board. The manufacturing method of an electronic device according to claim 1, wherein the electronic device further comprises a connector, the connector is electrically connected with the circuit board and is exposed to the cured potting glue. The manufacturing method of an electronic device according to claim 1, wherein the electronic device further comprises a wire, the wire is electrically connected to the circuit board and extends out of the cured potting along the first direction glue. The manufacturing method of an electronic device according to claim 1, wherein after cutting one of the at least one raised portion in a direction opposite to the first direction, an elasticity is provided on the periphery of the mold body ring to fix the mold. The manufacturing method of an electronic device according to claim 1, wherein the material of the mold body comprises silicone. The manufacturing method of an electronic device according to claim 1, wherein the material of the potting glue comprises epoxy resin.

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