TWI750800B - Coplanarity detaction apparatus for chip - Google Patents

Abstract

The present invention provides a coplanarity detection apparatus for chip. The coplanarity detection apparatus includes at least one carrying module and a detector. The carrying module includes a carrying platform and an optical glass that is fastened to the carrying platform. The optical glass has a carrying flat surface, a light incident surface opposite to the carrying flat surface, and an aligning pattern that is formed on the carrying flat surface. The carrying flat surface is provided for solder pads of at least one chip to be disposed thereon, so that some of the solder pads of the at least one chip can be abutted against the carrying flat surface by gravity. The detector is disposed corresponding to the optical glass. The detector is configured to obtain the position of the carrying flat surface by detecting the aligning pattern, so that the detector can obtain a distance between the carrying flat and each of the solder pads by detecting the position of each of the solder pads.

Description

Wafer coplanarity testing equipment

The invention relates to a coplanarity detection device, in particular to a wafer coplanarity detection device.

Although the existing coplanarity testing equipment can be used to detect the coplanarity of multiple objects to be tested (such as solder balls), the existing coplanarity testing equipment is based on the information provided by multiple objects to be tested to calculate or The coplanarity judgment base plane (base plane) is selected, so the coplanarity result detected by the existing coplanarity detection equipment will have a large error.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiment of the present invention is to provide a wafer coplanarity detection device, which can effectively improve the defects that may be generated by the existing coplanarity detection device.

The embodiment of the present invention discloses a wafer coplanarity detection device, which includes: at least one carrying module, including: a carrying table; and an optical glass, mounted on the carrying table, and the optical glass has an opposite side. a carrying plane and a light incident surface of the optical glass, the optical glass includes a pair of alignment patterns formed on the carrying plane; wherein, the carrying plane can be used for setting a plurality of bonding pads of at least one chip, so that the At least one part of the solder pads of the chip can be in contact with the bearing plane by gravity; and a detector is disposed corresponding to the optical glass, and the detector can detect the alignment by detecting the alignment The position of the carrier plane can be known from the pattern, and the detector can be used to detect each of the pads to know the distance between it and the carrier plane.

Preferably, the carrying table includes a first surface and a second surface on opposite sides, and the carrying table is formed with a through hole penetrating from the first surface to the second surface, the The optical glass is arranged on the first surface, and the positions of the bearing plane and the alignment pattern correspond to the through holes, so that the detector can detect the alignment patterns and the alignment patterns through the holes. a plurality of the solder pads disposed on the carrying plane.

Preferably, at least one of the carrying modules includes a positioning fixture that is detachably disposed on the carrying table, and the positioning fixture is formed with at least one holding groove for receiving at least one of the wafers; The optical glass is clamped between the positioning jig and the bearing platform; the positioning jig is formed with an accommodating groove that communicates with at least one of the holding grooves, and the optical glass is arranged in the accommodating groove in the slot.

To sum up, the wafer coplanarity testing device disclosed in the embodiment of the present invention uses gravity on the bearing plane of the optical glass to stably provide the judging reference plane required in the coplanarity test. In turn, the error caused by the reference plane is effectively reduced.

Further, the detector can know the position of the carrier plane by detecting the alignment pattern, and the detector can be used to detect each of the pads to know the relationship with The distance between the bearing planes is used to accurately measure the coplanarity of a plurality of the bonding pads of any one of the wafers.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

The following is a specific embodiment to illustrate the embodiments of the "wafer coplanarity detection device" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Please refer to FIG. 1 to FIG. 11 , which are an embodiment of the present invention. As shown in FIGS. 1 to 4 , the present embodiment discloses a wafer coplanarity detection apparatus 100 , which utilizes gravity to detect the coplanarity of a plurality of bonding pads 201 of at least one wafer 200 . Wherein, the wafer coplanarity detection apparatus 100 includes a U-shaped bracket 1 , two carrying modules 2 respectively mounted on the two end portions 11 of the U-shaped bracket 1 , and a U-shaped bracket 1 inside the A lateral transfer mechanism 3 and a detector 4 installed on the lateral transfer mechanism 3 and located inside the U-shaped bracket 1 .

It should be noted that although the wafer coplanarity detection apparatus 100 is described in this embodiment as including the above components, the present invention is not limited thereto. For example, as shown in FIG. 5 , the number of the carrier modules 2 included in the wafer coplanarity testing apparatus 100 may be one, and the U-shaped bracket 1 is correspondingly adjusted to be an L-shaped bracket 1 a. In addition, in other embodiments not shown in the present invention, the wafer coplanarity detection apparatus 100 may omit the lateral transfer mechanism 3 so that the detector 4 does not move; or, the The wafer coplanarity testing apparatus 100 can also omit the U-shaped bracket 1 and the lateral transfer mechanism 3, and at least one of the carrier module 2 and the detector 4 are mounted on other components.

Since the two bearing modules 2 shown in FIG. 1 to FIG. 4 have substantially the same structure, and the two bearing modules 2 are installed approximately symmetrically, for the convenience of describing this embodiment, the following will be described first. The structure of the single bearing module 2 is not limited to this. For example, in other embodiments not shown in the present invention, the wafer coplanarity testing apparatus 100 may also include a plurality of the carrier modules 2 with slightly different structures.

Please refer to FIG. 4 and FIG. 6 to FIG. 11 . In this embodiment, the carrying module 2 includes a carrying table 21 (which can also be regarded as a carrying board) in the shape of a plate, and a carrying table 21 connected to the carrying table 21 . The longitudinal transfer mechanism 22 , an optical glass 23 mounted on the bearing platform 21 , and a positioning jig 24 detachably arranged on the bearing platform 21 , but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier module 2 may be omitted or replaced with other components of the longitudinal transfer mechanism 22 and/or the positioning jig 24; or, the The carrier module 2 can also use a non-plate-shaped carrier 21 .

In this embodiment, the carrying table 21 includes a first surface 211 and a second surface 212 on opposite sides, and the carrying table 21 is formed to penetrate from the first surface 211 to the first surface 211 . A through hole 213 on the two surfaces 212 . Wherein, the through hole 213 of the bearing platform 21 is elongated and defines a length direction L in this embodiment, and the through hole 213 is preferably away from the bearing platform 21 away from the longitudinal transfer mechanism 22 . One end (eg: the right end of the bearing platform 21 in FIG. 7 ) is formed by concave.

It should be noted that, since the carrier table 21 in this embodiment is non-transparent, the carrier table 21 is formed with the through holes 213 to facilitate the co-planarity detection of the wafer together with other components. The present invention is not limited to this. For example, in other embodiments not shown in the present invention, the supporting platform 21 may also be in a light-transmitting shape without forming the through hole 213 .

Furthermore, the carrying table 21 is installed on the vertical transfer mechanism 22 , so that the vertical transfer mechanism 22 can move the carrying table 21 along a direction perpendicular to the longitudinal direction L. As shown in FIG. Wherein, the bearing platform 21 is installed on the vertical transfer mechanism 22 at the part without the through hole 213 , so that the part of the bearing platform 21 with the through hole 213 is suspended.

In this embodiment, the optical glass 23 is a transparent plate-like structure, and the optical glass 23 has a transmittance of more than 90% for visible light with wavelengths ranging from 400 nm to 700 nm. This is limited. That is to say, the glass without specific optical conditions is different from the optical glass 23 referred to in this embodiment. The optical glass 23 has a bearing plane 231 on the opposite side and a light incident plane 232 , the light incident plane 232 is also flat in this embodiment, and the light incident plane 232 has a shape equal to The shape of the bearing plane 231 is not limited to the present invention.

Wherein, the optical glass 23 is disposed on the first surface 211 of the supporting table 21 by the light incident surface 232 , and the optical glass 23 preferably completely covers one side of the through hole 213 (eg: the top side of the through hole 213 in FIG. 8 ), but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the optical glass 23 may also be the through hole 213 that only covers a part; or, the optical glass 23 may also be disposed at least partially in the inside the perforation 213.

Furthermore, the carrier plane 231 can be used for arranging a plurality of bonding pads 201 of at least one chip 200, so that part of the bonding pads 201 of at least one chip 200 can abut against the carrier plane by gravity 231. That is to say, the wafer coplanarity testing apparatus 100 uses the bearing plane 231 of the optical glass 23 to cooperate with gravity to stably provide a base plane required for the coplanarity test. In turn, the error caused by the reference plane is effectively reduced.

In this embodiment, the bearing plane 231 of the optical glass 23 is perpendicular to a plumb direction V, and the optical glass 23 is a long strip structure parallel to the length direction L, so that the The carrying plane 231 can accommodate a plurality of the wafers 200 along the length direction L. As shown in FIG.

More specifically, the optical glass 23 includes an alignment pattern 233 formed on the bearing plane 231 , and the positions of the carrier plane 231 and the alignment pattern 233 (along the plumb direction V) Corresponding to the perforation 213 . The alignment pattern 233 is illustrated by an opaque film on the carrier plane 231 in this embodiment, so that the alignment pattern 233 can be used to accurately provide the carrier plane 231 . position, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the alignment pattern 233 may also be a film with a light transmittance different (or smaller) than the optical glass 23, which can also effectively provide the The location of the bearing plane 231 .

It should be additionally noted that although the optical glass 23 is described as a flat glass in this embodiment, in other embodiments not shown in the present invention, the supporting plane 231 may only occupy the optical glass Part of the surface of the glass 23, and the optical glass 23 area outside the carrying plane 231 may be non-planar, but the alignment pattern 233 cannot be formed in the area outside the carrying plane 231, according to The position of the bearing plane 231 is provided exactly.

The positioning jig 24 is disposed on the first surface 211 of the bearing table 21 , and the optical glass 23 is sandwiched between the positioning jig 24 and the bearing table 21 . In this embodiment, the positioning jig 24 is formed with a plurality of through-shaped holding grooves 241 along the longitudinal direction L from the top surface of the positioning jig 24 for accommodating at least a plurality of the wafers 200 respectively.

Furthermore, from the bottom surface of the positioning fixture 24, an accommodating groove 242 is formed along the length direction L to communicate with a plurality of the holding grooves 241, and the shape of the accommodating groove 242 corresponds to that of the optical glass. 23, so that the optical glass 23 can be arranged in the accommodating groove 242, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the positioning jig 24 may be formed with at least one holding groove 241 for receiving at least one of the wafers 200 and a connection with the at least one holding groove 241 An accommodating groove 242 is provided, and the optical glass 23 is arranged in the accommodating groove 242 .

In more detail, the accommodating groove 242 runs through the positioning fixture 24 along the length direction L in this embodiment, and the width of the accommodating groove 242 is slightly larger than the width of the through hole 213 to facilitate the The optical glass 23 is clamped between the positioning jig 24 and the bearing table 21 . To put it another way, the through hole 213 of the bearing platform 21 faces a projection area formed by the orthographic projection of the positioning fixture 24 , which is located in the accommodating groove 242 and covers a plurality of the holding grooves 241 . .

In addition, the positioning jig 24 is non-transparent in this embodiment, and the alignment pattern 233 of the optical glass 23 along the plumb direction V corresponds to the position where the holding groove 241 is not formed. The positioning fixture 24 area. Furthermore, the thickness of the positioning jig 24 is preferably slightly smaller than the thickness of any one of the wafers 200 , so as to facilitate the removal of the wafer 200 from the holding groove 241 of the positioning jig 24 .

The detector 4 is disposed corresponding to the optical glass 23 , so that the detector 4 can know the position of the bearing plane 231 by detecting the alignment pattern 233 , and the detector 4 4 can be used to detect each of the bonding pads 201 to know the distance between it and the carrying plane 231, and then accurately measure the coplanarity of the bonding pads 201 of any one of the chip 200 Spend.

In more detail, and the detector 4 is installed on the lateral transfer mechanism 3 in this embodiment, and the lateral transfer mechanism 3 enables the detector 4 to face the through hole 213 and It moves along the length direction L, but the present invention is not limited to this. Furthermore, since the positions of the bearing plane 231 of the optical glass 23 and the alignment pattern 233 (both along the plumb direction V) correspond to the through holes 213, the detector 4 can The alignment pattern 233 and the plurality of pads 201 disposed on the carrying plane 231 are detected through the through holes 213 .

[Technical effects of the embodiments of the present invention]

To sum up, the wafer coplanarity testing device disclosed in the embodiment of the present invention uses the bearing plane 231 of the optical glass 23 to cooperate with gravity to stably provide the judgment reference required in the coplanarity test. (that is, the bearing plane 231 is used as the reference plane), thereby effectively reducing the error caused by the reference plane.

Further, the detector 4 can know the position of the carrier plane 231 by detecting the alignment pattern 233 , and the detector 4 can be used to detect each of the pads 201 In order to know the distance between it and the carrying plane 231 , the coplanarity of the plurality of the bonding pads 201 of any one of the chips 200 can be accurately measured.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Wafer coplanarity testing equipment 1: U-shaped bracket 11: end part 1a: L-shaped bracket 2: Bearing module 21: Bearing platform 211: First Surface 212: Second Surface 213: Perforation 22: Longitudinal transfer mechanism 23: Optical glass 231: Bearing plane 232: light incident surface 233: Alignment Pattern 24: Positioning fixture 241: Retaining slot 242: accommodating slot 3: Lateral transfer mechanism 4: Detector 200: Wafer 201: Solder Pad V: plumb direction L: length direction

FIG. 1 is a three-dimensional schematic diagram of a wafer coplanarity detection apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1 .

FIG. 3 is an enlarged schematic view of part III of FIG. 2 .

FIG. 4 is an enlarged schematic view of site IV of FIG. 3 .

FIG. 5 is a schematic perspective view of another form of FIG. 1 .

FIG. 6 is an enlarged schematic diagram of a carrier module of a wafer coplanarity detection apparatus according to an embodiment of the present invention.

FIG. 7 is an enlarged schematic view of FIG. 6 from another viewing angle.

FIG. 8 is a partial exploded schematic view of FIG. 6 .

FIG. 9 is an enlarged schematic view of FIG. 8 from another viewing angle.

FIG. 10 is an exploded schematic view of FIG. 8 .

FIG. 11 is an enlarged schematic view of FIG. 10 from another viewing angle.

21: Bearing platform

211: First Surface

212: Second Surface

213: Perforation

23: Optical glass

231: Bearing plane

232: light incident surface

233: Alignment Pattern

24: Positioning fixture

241: Retaining slot

242: accommodating slot

4: Detector

200: Wafer

V: plumb direction

L: length direction

Claims (6)

A wafer coplanarity detection device, comprising: at least one bearing module, including: a bearing table; and an optical glass, mounted on the bearing table, and the optical glass has a bearing plane on the opposite side and a light incident surface, the optical glass includes a pair of alignment patterns formed on the carrying plane; wherein, the carrying plane can be used for setting a plurality of bonding pads of at least one chip, so that at least one of the chip A part of the solder pads can be in contact with the bearing plane by gravity; and a detector is arranged corresponding to the optical glass, and the detector can know the alignment pattern by detecting the alignment pattern. The position of the bearing plane, and the detector can be used to detect each of the solder pads to know the distance between it and the bearing plane; wherein, the bearing platform includes two A first surface and a second surface, and the carrier is formed with a through hole penetrating from the first surface to the second surface, the optical glass is disposed on the first surface with the light incident surface surface, and the positions of the carrying plane and the alignment pattern correspond to the perforations, so that the detector can detect the alignment pattern and the a plurality of the solder pads. The wafer coplanarity testing device according to claim 1, wherein the through hole of the support table is elongated and defines a length direction, and the support plane can accommodate a plurality of the wafers along the length direction ; The wafer coplanarity detection equipment further includes a lateral transfer mechanism, the detector is mounted on the lateral transfer mechanism, and the lateral transfer mechanism can enable the detector to face the through hole and move along the length. The wafer coplanarity testing device according to claim 2, wherein at least one of the carrying modules includes a longitudinal transfer mechanism, and the carrying platform is mounted on the vertical transfer mechanism, so that the vertical transfer mechanism The mechanism enables the carriage to move in a direction perpendicular to the lengthwise direction. The wafer coplanarity detection device according to claim 2, wherein the wafer coplanarity detection device further comprises a U-shaped bracket, and the lateral transfer mechanism and the detector are located on the side of the U-shaped bracket. On the inner side, the number of at least one of the bearing modules is further limited to two, and the two bearing modules are respectively mounted on two end portions of the U-shaped bracket. The wafer coplanarity detection device according to claim 1, wherein the optical glass has a transmittance of more than 90% for visible light with wavelengths ranging from 400 nm to 700 nm. The wafer coplanarity testing device according to claim 1, wherein the bearing plane of the optical glass is perpendicular to a plumb direction.

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