TWI749695B - Cpu socket connector - Google Patents

Abstract

A CPU socket connector includes an insulating body and a set of conductive terminals arranged on the insulating body; the conductive terminals include a plurality of first terminals with a first pitch and a plurality of second terminals with a second pitch, and the first pitch is different from the second pitch. The conductive terminals are divided into at least two different type of pitch arrangements, so as to make the layout of the conductive terminals more reasonable and balanced.

Description

CPU socket connector

The invention relates to a CPU socket connector, in particular to a CPU socket connector which can be mated and matched with a CPU chip.

A conventional CPU socket connector has a plurality of conductive terminals arranged in a matrix, and the conductive terminals have contact parts mating and mating with the CPU chip, and the conductive terminals usually have the same spacing. Please refer to the first and second figures shown in the first prior art for the arrangement of the conductive terminals 1 of the CPU socket connector. The conductive terminals 1 are arranged in a regular matrix, and the conductive terminals 1 are arranged on the left and right. In the two separated regions A and B, the conductive terminals 1 in each region A and B are arranged in plural rows along the transverse direction X and arranged in plural rows along the longitudinal direction Y, and every two adjacent conductive terminals 1 The distance S between them is 0.8mm. Please refer to the second prior art CPU socket connector arrangement of conductive terminals 1'shown in the third and fourth figures. The conductive terminals 1'are arranged in two regions C and D separated from the front and rear, and The difference in the first prior art is that the conductive terminals 1'in each area C and D are arranged in an irregular matrix. Specifically, the conductive terminals 1'in each area C and D are arranged along the longitudinal direction. The direction Y is arranged in a plurality of rows, each conductive terminal 1'and the adjacent conductive terminal 1'in the adjacent row are mutually staggered along the lateral and longitudinal directions at the same time, and when viewed from the lateral direction X, each conductive terminal 1 'Located in the middle of two adjacent conductive terminals 1'in adjacent columns. And the second prior art conductive terminals 1'are arranged in a regular hexagonal matrix. Specifically, the surrounding six conductive terminals 1'adjacent to one of the conductive terminals 1'are located at the six vertices of the regular hexagon H , And the conductive terminal 1'is located at the center of the enclosed hexagon H, and in the second prior art, the distance S between all two adjacent conductive terminals 1'in each region C, D 'Is 0.9mm.

However, the conductive terminals 1, 1'in the first and second prior art can only be arranged in a single pitch manner, so that the conductive terminals and the CPU chip can only be matched and contacted in one way when they are mated and matched. In addition, the contact portions 10, 10' of the conductive terminals 1, 1'distributed in the two regions can only extend toward each other to achieve a balance of forces when the CPU chip is crimped.

Therefore, it is necessary to provide an improved CPU socket connector to solve the above problems.

The purpose of the present invention is to provide a CPU socket connector adopting a mixed-pitch arrangement.

In order to solve the above technical problems, the present invention adopts the following technical solutions: a CPU socket connector including an insulating body and a plurality of conductive terminals provided on the insulating body; the conductive terminals include a plurality of first terminals with a first pitch, and A plurality of second terminals having a second pitch, the first pitch being different from the second pitch.

Compared with the prior art, the present invention has the following beneficial effects: the present invention uses at least two different spacing arrangements for the conductive terminals, so that the layout of the conductive terminals is more reasonable and balanced.

1, 1': conductive terminal

10, 10': contact part

A, B, C, D: area

S, S': Spacing

100, 100', 100": CPU socket connector

101, 102: The first area

103, 104: second area

H, 105: Hexagon

120: Insulating body

130: terminal slot

140, 140', 140": the first terminal

142, 142', 142": the first contact part

143: The first holding part

150, 150', 150": second terminal

152, 152', 152": the second contact part

153: The second holding part

X: horizontal direction

Y: longitudinal direction

S1: First pitch

S2: second spacing

The first figure is a schematic diagram of the first conventional CPU socket connector.

The second figure is a partial enlarged schematic diagram of the dashed-dotted part in the first figure.

The third figure is a schematic diagram of the CPU socket connector of the second conventional technology.

The fourth figure is a partial enlarged schematic diagram of the dashed-dotted part in the third figure.

The fifth figure is a schematic diagram of the CPU socket connector of the first embodiment of the present invention.

The sixth figure is a partial enlarged schematic diagram of the dotted line part in the fifth figure.

The seventh figure is a schematic diagram of the CPU socket connector of the second embodiment of the present invention.

The eighth figure is a partial enlarged schematic diagram of the dashed-dotted part in the seventh figure.

The ninth figure is a schematic diagram of the CPU socket connector of the third embodiment of the present invention.

The tenth figure is a partial enlarged schematic diagram of the dashed line in the upper right corner of the ninth figure.

The eleventh figure is a partial enlarged schematic diagram of another dashed-dotted part in the ninth figure.

Please refer to Figures 5 and 6, the CPU (Central Processing Unit, central processing unit) socket connector 100 according to the first embodiment of the present invention. The CPU socket connector 100 is used for mounting on a circuit board (not shown) And it is mated with the CPU chip (not shown) to achieve electrical connection. The CPU socket connector 100 includes an insulating body 120 and a plurality of conductive terminals arranged on the insulating body 120 for mating and mating with the CPU chip module. The insulating body 120 is provided with a plurality of terminal grooves 130 penetrating up and down along the height direction to receive and install the conductive terminals.

The conductive terminals include a plurality of first terminals 140 arranged in a first matrix form and a plurality of second terminals 150 arranged in a second matrix form. The first terminals 140 are arranged in the center of the insulating body 120 in a regular first matrix form, and are arranged in two separated first regions 101, 102 spaced apart from the left and the right, the two first regions 101, 102 are all arranged in a rectangular shape, and are partially staggered along the longitudinal direction Y. The first terminals 140 in each first area 101, 102 are arranged in plural rows along the transverse direction X and in plural rows along the longitudinal direction Y, that is, every two adjacent first terminals in each first area 101, 102 are arranged in plural rows. One terminal 140 is aligned with each other along the lateral direction X and the vertical direction Y, and the first distance S1 between two adjacent first terminals 140 in each first region 101, 102 is 0.8 mm, that is, each row Or the first distance S1 between two adjacent first terminals 140 in each column is 0.8 mm, where the first distance S1 refers to the distance between the centers of two adjacent first terminals 140. The first terminal 140 is provided with a first contact portion 142 protruding upward from the insulating body 120, a first holding portion 143 fixed in the terminal groove 130 of the insulating body 120, and a first holding portion 143 extending downward from the insulating body 120 for installation To the first mounting portion (not labeled) of the circuit board, the first contact portion 142 extends obliquely. The first contact portions 142 of the first terminals 140 located in the two first regions 101 and 102 are formed to extend opposite to each other, that is, the extension directions of the first contact portions 142 in the two first regions 101 and 102 are parallel to the same straight line and mutually extend. The relative orientation is set. In this embodiment, the first area located in the first area 101 on the left A contact portion 142 extends at an angle of 45 degrees to the rear right, and the first contact portion 142 located in the first area 102 on the right extends at an angle of 45 degrees to the front left. This configuration can offset the two The reaction force of the first contact portion 142 in the first regions 101 and 102 when mating and mating with the CPU chip, so as to achieve the effect of force balance.

The second terminal 150 is arranged at the outer position of the insulating body 120 and surrounds the periphery of the first terminal 140. The second terminal 150 is arranged in two separate second regions 103, 104 spaced apart from each other. Inside, the two second regions 103 and 104 are roughly U-shaped structures with openings arranged opposite to each other, and the two second regions 103 and 104 are partially staggered along the transverse direction X. The difference between the arrangement of the first terminals 140 is that the second terminals 150 in each second area 103, 104 are arranged in an irregular second matrix. Specifically, each second area 103 The second terminals 150 in 104 are arranged in a plurality of rows along the longitudinal direction Y, and each second terminal 150 is staggered from the adjacent second terminals 150 in the adjacent row along the transverse and longitudinal directions at the same time, starting from the transverse direction X It can be seen that each of the second terminals 150 is located between two adjacent second terminals 150 in adjacent columns, and each second terminal 150 forms an equal side with two adjacent second terminals 150 in adjacent columns. triangle.

Furthermore, in this embodiment, the second terminals 150 are arranged in a hexagonal matrix. Specifically, in each of the second regions 103 and 104, the surrounding six adjacent to any one of the second terminals 150 A second terminal 150 is located at the six vertices of the regular hexagon 105, and any one of the second terminals 150 is located at the center of the enclosed hexagon 105, and in each second area 103, 104 The second distance S2 between any two adjacent second terminals 150 is 0.9 mm, so the second distance S2 between two adjacent second terminals 150 is greater than the second distance 140 between two adjacent first terminals 140 . The second terminal 150 is provided with a second contact portion 152 protruding upwardly from the insulating body 120, a second holding portion 153 fixed in the terminal groove 130 of the insulating body 120, and the insulating body 120 extending downward to be installed in a circuit. The second mounting portion (not labeled) of the board, the second contact portion 142 extends upwardly and obliquely. The second contact portions 152 of the second terminals 150 located in the two second regions 103 and 104 are also formed to extend toward each other, that is, in the two second regions 103 and 104 The extension direction of the second contact portion 152 is parallel to the same straight line and is arranged facing each other. This configuration can also offset the second contact portion 152 in the two second regions 103 and 104 when the second contact portion 152 is mated with the CPU chip. Reaction force, so as to achieve the effect of balanced force. In this embodiment, the second contact portion 152 located in the second front area 103 extends in a 45-degree angle to the left and rear, while the second contact portion 152 located in the second rear area 103 is inclined to the front right It extends at an angle of 45 degrees. Therefore, the extension direction of the second contact portion 152 and the extension direction of the first contact portion 151 are both perpendicular to each other.

In this embodiment, the first distance S1 between two adjacent first terminals 140 in each row or each column of the first terminals 140 is 0.8 mm, and any two adjacent ones of the second terminals 150 The second spacing S2 between the second terminals 150 is 0.9 mm, so all the spacings of the first terminals 140 are the first spacing S1, and all the spacings of the second terminals 150 are the second spacing S2. In other embodiments, the first spacing S1 may only refer to the spacing formed between two adjacent first terminals 140 in each column of the first terminals 140, while the second spacing S2 only refers to each column. The distance formed between two adjacent terminals 150 in the second terminal 150; or the first distance S1 may only refer to two adjacent first terminals 140 in each row. The distance formed between the terminals 140, and the second distance S2 only refers to the distance formed between two adjacent terminals 150 in each row of the second terminals 150; as long as the first distance S1 is equal to The second distance S2 may be a distance formed between two adjacent terminals at the same position in the first and second terminals 140 and 150.

In the present invention, the first terminals 140 arranged to form a first matrix are arranged in the first regions 101 and 102 at the central position, and the second terminals 150 arranged to form a second matrix are arranged to surround the first terminal 140 outside the first area. In the two regions 103 and 104, since the first spacing S1 between the terminals formed by the first terminals 140 is small, the arrangement density is relatively large, while the second spacing S2 between the terminals formed by the second terminals 150 is relatively large. The cloth density is small, so when the conductive terminals are mated and matched with the CPU chip, the bearing capacity of the central area is larger, while the bearing capacity of the peripheral area is smaller. In this embodiment, the first terminal 140 and the second terminal 150 may be terminals of different transmission types. For example, all the first terminals 140 are power terminals for power supply, and the second terminal The sub 150 are all signal terminals for transmitting signals. And the structure of the first terminal 140 and the second terminal 150 may be different, for example, the width or thickness of the first terminal 140 for transmitting power is larger than the second terminal 150 for transmitting signal.

Please refer to Figures 7 and 8 of the CPU socket connector 100' of the second embodiment of the present invention. The difference from the first embodiment is that the first terminal 140' of the CPU socket connector 100' of the second embodiment is Only continuously arranged in the same area of the central position of the insulating body 120', and the second terminal 150' is continuously arranged at the outer position of the insulating body 120' and surrounding the periphery of the first terminal 140'. The first contact portions 142' of one terminal 140' all extend in the same direction, and the second contact portions 152' of all second terminals 150' extend in the direction opposite to the first contact portion 142', that is, all the first contact portions 142' and the second contact portion 152' are opposite to each other. In this embodiment, all the first contact portions 142' extend obliquely toward the front right 45 degrees, and all the second contact portions extend 45 degrees toward the lower left. The angular direction extends obliquely. This conductive terminal structure makes the CPU socket connector 100' easy to assemble, and can reduce production and manufacturing costs.

Please refer to the ninth and tenth figures of the CPU socket connector 100" of the third embodiment of the present invention. The same as the second embodiment, the first terminal 140 in the CPU socket connector 100" of the third embodiment "It is still only continuously arranged in the same area at the center of the insulating body 120", but the difference is that the second terminal 150" is arranged at the outer position of the insulating body 120" and surrounds and surrounds the first The periphery of the terminal 140" is arranged in two separate and different peripheral areas. One of the peripheral areas is L-shaped, and the other peripheral area is C-shaped. And the second contact in the L-shaped peripheral area The portion 152" and all the first contact portions 142" extend in the same direction, and the second contact portion 152" in the C-shaped peripheral area extends in the direction opposite to the first contact portion 142". In this embodiment, The second contact portion 152" and all the first contact portions 142" in the L-shaped peripheral area extend obliquely toward the front right at an angle of 45 degrees, while the second contact portion in the C-shaped area extends toward the rear left at an angle of 45 degrees. Inclined extension. Compared with the second embodiment, this kind of conductive terminal arrangement structure enables the CPU socket connector 100" to receive a more balanced force when mating with the CPU chip.

The above are only three preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. The present invention mainly relates to the conductive terminals of the CPU socket connector using different spacing arrangements, so that the layout of the conductive terminals is more reasonable and balanced, and the contact parts of the conductive terminals adopt different or opposite extension directions in different areas to achieve The force is more balanced when mated with the CPU chip. In addition, because the conductive terminals are arranged in different areas in different areas, in the process of manufacturing and assembling the CPU socket connector, it is necessary to solve the problem of better positioning of the conductive terminals with different pitches by the mold top and prevent the mold thimble Interference between each other. The conductive terminal of the first embodiment of the present invention adopts a four-zone arrangement, the second embodiment adopts a two-zone arrangement, and the third embodiment adopts a three-zone arrangement. Arrangement method, of course, in other embodiments, the conductive terminals can be arranged in more different areas according to actual needs, and in other embodiments, it should not be limited to two different pitch arrangements of conductive terminals. , You can also set up three or more conductive terminal arrangements with different pitches according to actual needs.

It can be understood that the main feature of the present invention is that the conductive terminals are arranged in two mixed-pitch arrangements with different pitches. This mixed-pitch arrangement of conductive terminals can be applied to all existing CPU socket connectors, especially It is suitable for situations where there are a large number of conductive terminals involved, such as the US published or published patent numbers US6957987, US7429200, US7927121, US8454373, US8979565, US8998623, US9466900, US20190089098, US20190221956, etc., as well as patents published or published in mainland China No. CN107086401A, CN205863524U, CN205944491U, CN206685589U, CN207282768U and other disclosed CPU socket connector structures. In other words, it is obvious that the mixed-pitch arrangement of conductive terminals of the present invention can be applied to the CPU socket connector structure to replace the existing single-pitch arrangement of conductive terminals.

From another point of view, if the existing CPU socket connector combines the characteristics of the mixed spacing arrangement of the conductive terminals of the present invention after the patent application of the present invention, it is obviously not patentable, even if the present invention is not specifically detailed. Describes such as the load plate used to compress the CPU chip, the use of It is used for the stiffener surrounding the insulating body, the cover for dust prevention, the carrier for loading the CPU chip, the heat sink for mounting on the CPU chip, and the It is used to install peripheral architectures such as printed circuit boards (PCBs) of CPU socket connectors, but it is obvious that such architectures can be directly applied in the present invention, and therefore such architectures can be regarded as part of the application and implementation of the present invention.

Regarding the conductive terminal structure of the present invention, although the specification and drawings do not separately describe in detail or separately show the complete structure of the conductive terminal, in the present invention, the conductive terminal can adopt the LGA/BGA structure, that is, the structure of the conductive terminal. The contact part adopts the Land Grid Array (LGA) method, and the mounting part adopts the Ball Grid Array Package (BGA) method; it can also adopt the LGA/LGA structure, that is, the contact part and installation of the conductive terminal The parts are all packaged in a Grid Array (Land Grid Array, LGA) method. Regarding the LGA/BGA structure of the conductive terminal, you can refer to the conductive terminal structure disclosed in the US Patent Nos. US7563107, US7909617, US8454373, etc. The holding part of the conductive terminal of the present invention may include a pair of connectors with a certain angle. The contact portion and the mounting portion respectively extend upward and downward from the corresponding connecting body, and the mounting portion is mounted on the printed circuit board by means of solder balls. In short, all simple equivalent changes and modifications made in accordance with the claims of the present invention and the content of the description of the present invention should still fall within the scope of the patent of the present invention.

100: CPU socket connector

101, 102: The first area

103, 104: second area

105: Hexagon

120: Insulating body

140: The first terminal

150: socket terminal

X: socket terminal

Y: socket terminal

Claims (9)

A CPU socket connector includes: an insulating body; and a plurality of conductive terminals arranged on the insulating body; wherein, the conductive terminals include a plurality of first terminals with a first pitch and a plurality of second terminals with a second pitch. Terminals, the first spacing is different from the second spacing, wherein the first terminals are arranged at the center of the insulating body, and are provided with a first contact portion protruding upwards from the insulating body; The two terminals are arranged at an outer position of the insulating body and surrounding the periphery of the first terminal, and the second terminal is provided with a second contact portion protruding upward from the insulating body. The CPU socket connector according to claim 1, wherein the first terminals are arranged in a first matrix form, and the second terminals are arranged in a second matrix form different from the first matrix. The CPU socket connector according to claim 2, wherein the first terminals are arranged in a plurality of rows along the transverse direction and in a plurality of rows along the longitudinal direction, and two adjacent first terminals in each row and each column The first distance is formed between them. The CPU socket connector according to claim 2, wherein the second terminals are arranged in a plurality of columns along the longitudinal direction, and the second spacing is formed between two adjacent second terminals in each column; each The second terminal and the adjacent second terminals in the adjacent column are mutually staggered in the lateral and longitudinal directions at the same time, and an equilateral triangle is formed between each second terminal and two adjacent second terminals in the adjacent column. The CPU socket connector according to claim 1, wherein the first terminals are arranged in two separate first regions, and the first contact portions of the first terminals located in the two first regions are formed to extend toward each other . The CPU socket connector according to claim 5, wherein the second terminals are arranged in two separate second areas, and the second contact portions of the second terminals located in the two second areas are formed to extend toward each other . The CPU socket connector according to claim 6, wherein the extension of the second contact portion The direction and the extending direction of the first contact portion are both perpendicular to each other. The CPU socket connector according to claim 1, wherein the first terminals are continuously arranged in the same area, and the second terminals are continuously arranged in another area around the first terminal ; The first contact portions of all the first terminals extend in the same direction, and the second contact portions of all the second terminals extend opposite to the first contact portion. The CPU socket connector according to claim 1, wherein the first terminal is continuously arranged in the same area, and the second terminal surrounds the periphery of the first terminal and is arranged in two separate and In different peripheral areas, the second contact portion in one peripheral area extends in the same direction as all the first contact portions, and the second contact portion in the other peripheral area all faces the first contact portion Extend formation.

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