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TWI637469B - 生物感測器封裝結構及其製造方法 - Google Patents

生物感測器封裝結構及其製造方法 Download PDF

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Publication number
TWI637469B
TWI637469B TW106119427A TW106119427A TWI637469B TW I637469 B TWI637469 B TW I637469B TW 106119427 A TW106119427 A TW 106119427A TW 106119427 A TW106119427 A TW 106119427A TW I637469 B TWI637469 B TW I637469B
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Taiwan
Prior art keywords
biosensor
pads
die
carrier substrate
dielectric material
Prior art date
Application number
TW106119427A
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English (en)
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TW201903984A (zh
Inventor
許志行
Original Assignee
晶相光電股份有限公司
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Priority to TW106119427A priority Critical patent/TWI637469B/zh
Priority to CN201710507512.0A priority patent/CN109037168A/zh
Priority to US15/855,097 priority patent/US20180354781A1/en
Application granted granted Critical
Publication of TWI637469B publication Critical patent/TWI637469B/zh
Publication of TW201903984A publication Critical patent/TW201903984A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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    • G01N33/483—Physical analysis of biological material
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Abstract

本揭露提供一種生物感測器封裝結構，包括：保護層；重分佈層，設置於保護層上方，其中保護層具有複數個暴露出重分佈層的開口；至少一晶粒，設置於保護層及重分佈層上方；複數個接墊，設置於晶粒的下表面；複數個導孔，設置於接墊及重分佈層之間以提供電性連接；介電材料，設置於保護層及重分佈層上方，且與晶粒、接墊及導孔相鄰；以及至少一生物感測區，設置於晶粒的頂部，其中上述接墊的頂表面設置於低於生物檢測區的頂表面且高於晶粒的底表面之水平。

Description

生物感測器封裝結構及其製造方法
本發明是關於一種生物感測器封裝結構及其製造方法。
生物感測器由分子辨識元件及訊號轉換元件所組成，可將生化反應產生的化學訊號轉換為電子物理訊號以供分析。其中，生物晶片(biochip)係利用微機電技術將探針分子(probe)植入晶片中，再透過生物結合特性進行各種生化分析，其作用對象可包括基因、蛋白質或細胞組織等，其可應用於諸如：生物醫學研究、疾病診斷、食品病原體檢測、環境分析和鑑識等領域，並具有可攜帶、分析靈敏度及專一性高、分析速度快、僅需少量檢測樣品及試劑等優點，是生物技術產業中蓬勃發展的新領域。
現有的生物晶片封裝結構中，生物晶片的反應區及電性連接元件大多以打線接合的方式整合於基板表面。例如，生物晶片的反應區與接墊及導線相鄰設置於封裝結構的表面上。然而，在此種情形下，接墊及導線容易被使用於生物晶片的強鹼反應溶液腐蝕，進而影響生物晶片的效能，且設置於基板表面的接墊及導線等電性連接元件亦限制了晶片反應區 的作用面積。
此外，一般生物晶片封裝結構會在生物材料塗佈於晶圓之後進行切割形成晶粒，之後再進行後續的晶粒封裝製程。然而，生物晶片所使用的生物材料塗層(biocoating)容易受到後續封裝製程(如蝕刻、沉積等製程)的溫度影響。
因此，開發出結構簡單且可改善生物晶片使用效能的封裝結構為生物晶片研究的重要課題。
在一實施例中，本揭露提供一種生物感測器封裝結構，包括：保護層；重分佈層，設置於保護層上方，其中保護層具有複數個暴露出該重分佈層的開口；至少一晶粒，設置於保護層及重分佈層上方；複數個接墊，設置於晶粒的下表面；複數個導孔，設置於接墊及重分佈層之間以提供電性連接；介電材料，設置於保護層及重分佈層上方，且與晶粒、接墊及導孔相鄰；以及至少一生物感測區，設置於晶粒的頂部，其中上述接墊的頂表面設置於低於生物檢測區的頂表面且高於晶粒的底表面之水平。
在一實施例中，本揭露提供一種生物感測器封裝結構的製造方法，包括：提供第一承載基板；設置至少一晶粒於第一承載基板上，其中晶粒包括至少一生物感測區形成於其底部以及複數個接墊形成於其上表面，其中生物感測區與第一承載基板接觸，且接墊的底表面設置於高於生物檢測區的底表面且低於晶粒的頂表面之水平；形成介電材料，覆蓋第一承載基板及晶粒；實行平坦化製程，以暴露出晶粒的頂表面；圖案 化介電材料，以形成分別暴露出接墊的頂表面的複數個第一開口；填充導電材料於第一開口中，以形成延伸穿過介電材料的複數個導孔；形成重分佈層及保護層於介電材料上，其中重分佈層與導孔接觸以電性連接至接墊；以及移除第一承載基板，以暴露出該生物感測區。
為讓本揭露之特徵、和優點能更明顯易懂，下文特舉出較佳實施例，並配合所附圖式，作詳細說明如下。
10‧‧‧生物感測器封裝結構的形成方法
12~34‧‧‧生物感測器封裝結構的形成方法之步驟
100‧‧‧生物感測器封裝結構
102‧‧‧第一承載基板
104‧‧‧晶圓
104a‧‧‧晶粒
106‧‧‧生物感測區
108‧‧‧接墊
110‧‧‧圖案化製程
110a‧‧‧凹陷
112‧‧‧第二承載基板
114‧‧‧介電材料
116‧‧‧開口
118‧‧‧導孔
120‧‧‧重分佈層
122‧‧‧保護層
124‧‧‧開口
126‧‧‧上蓋
第1圖係根據本揭露一些實施例中，生物感測器封裝結構的製造方法之流程圖；第2圖係根據本揭露一些實施例中，生物感測器封裝結構在製程中間階段之剖面圖；第3圖係根據本揭露一些實施例中，生物感測器封裝結構在製程中間階段之剖面圖；第4圖係根據本揭露一些實施例中，生物感測器封裝結構在製程中間階段之剖面圖；第5圖係根據本揭露一些實施例中，生物感測器封裝結構在製程中間階段之剖面圖；第6圖係根據本揭露一些實施例中，生物感測器封裝結構在製程中間階段之剖面圖；第7圖係根據本揭露一些實施例中，生物感測器封裝結構在製程中間階段之剖面圖；第8圖係根據本揭露一些實施例中，生物感測器封裝結構在 製程中間階段之剖面圖；第9圖係根據本揭露一些實施例中，生物感測器封裝結構之剖面圖。
以下針對本揭露之生物感測器封裝結構及其製造方法作詳細說明。應了解的是，以下之敘述提供許多不同的實施例或例子，用以實施本揭露之不同樣態。以下所述特定的元件及排列方式僅為簡單清楚描述本揭露。當然，這些僅用以舉例而非本揭露之限定。此外，在不同實施例中可能使用重複的標號或標示。這些重複僅為了簡單清楚地敘述本揭露，不代表所討論之不同實施例及/或結構之間具有任何關連性。再者，當述及一第一元件位於一第二元件上或之上時，包括第一元件與第二元件直接接觸之情形。或者，亦可能間隔有一或更多其它元件之情形，在此情形中，第一元件與第二元件之間可能並未直接接觸。
應理解的是，圖式之元件或裝置可以所屬技術領域具有通常知識者所熟知的各種形式存在。此外，實施例中可能使用相對性的用語，例如「較低」或「底部」及「較高」或「頂部」，以描述圖式的一個元件對於另一元件的相對關係。可理解的是，如果將圖式的裝置翻轉使其上下顛倒，則所敘述在「較低」側的元件將會成為在「較高」側的元件。
可理解的是，雖然在此可使用用語「第一」、「第二」、「第三」等來敘述各種元件或部分，這些元件、組成或部分不應被這些用語限定，且這些用語僅是用來區別不同的元 件、組成或部分。因此，以下討論的一第一元件、組成或部分可在不偏離本揭露之教示的情況下被稱為一第二元件、組成或部分。
本揭露實施例可配合圖式一併理解，本揭露之圖式亦被視為揭露說明之一部分。應理解的是，本揭露之圖式並未按照比例繪製，事實上，可能任意的放大或縮小元件的尺寸以便清楚表現出本發明的特徵，而在說明書及圖式中，同樣或類似的元件將以類似的符號表示。
本揭露實施例提供之生物感測器封裝結構將與生物感測器耦接的電性連接元件設置於低於生物感測器的反應區表面的位置。具體而言，本揭露實施例之生物感測器封裝結構將用以提供電性連接的接墊設置於包含生物感測器的晶粒的一部分下方，且接墊實質上埋置(embed)於封裝結構的介電材料中，藉此可提升生物感測區的反應面積，且可避免打線接合的封裝結構中生物反應溶液腐蝕導線的情形。
再者，本揭露實施例提供之生物感測器封裝結構的製造方法可於晶粒封裝製程之後，進行晶圓級(wafer-level)或面板級(panel-level)的生物材料塗佈，接著進行切割便可得到封裝結構的最終產品，藉此，可避免封裝製程中的溫度對生物材料塗層(biocoating)的損害。
第1圖顯示根據本揭露一些實施例，生物感測器封裝結構的形成方法10之流程圖。應理解的是，可於生物感測器封裝結構的形成方法10進行前、進行中及/或進行後提供額外的操作。在不同的實施例中，所述的一些階段可以被取代或刪 除。可添加額外特徵於生物感測器封裝結構，在不同的實施例中，以下所述的一些特徵可以被取代或刪除。第2圖至第9圖顯示根據一些實施例，使用第1圖所示之方法10所形成之生物感測器封裝結構在不同階段之剖面圖。
首先，請參照第1及2圖，生物感測器封裝結構的形成方法10起始於步驟12，形成晶圓104於第一承載基板102上。晶圓104包含形成於其中的生物感測區106及接墊108。如第2圖所示，生物感測區106可設置於晶圓104的底部，換言之，生物感測區106位於第一承載基板102及晶圓104之間。再者，接墊108可埋置(embed)於晶圓104中，且設置於高於生物感測區106的水平。
第一承載基板102可更具有一黏著層(未繪示)形成於其上，藉此將晶圓104暫時地固定於第一承載基板102上。第一承載基板102可為矽基板、玻璃基板、高分子基板、高分子基複合基板或前述之組合，但不限於此。
晶圓104可由半導體材料或其它合適的材料形成。在一些實施例中，晶圓104由基本半導體材料所形成，例如，單晶型、多晶型或非晶型的矽(Si)或鍺(Ge)或前述之組合。在一些實施例中，晶圓104由化合物半導體所形成，例如，碳化矽(SiC)、砷化鎵(GaAs)、磷化鎵(GaP)、磷化銦(InP)、砷化銦(InAs)等。在一些實施例中，晶圓104由合金半導體所形成，例如，矽化鍺(SiGe)、砷化鎵鋁(AlGaAs)、砷化鎵銦(GaInAs)、磷化鎵銦(GaInP)、磷化鎵砷(GaAsP)等。
如第2圖所示，生物感測區106的一側與第一承載 基板102的表面接觸。生物感測區106可為生物晶片或其它用以感測生化反應之感測元件。生物晶片係用以處理或分析生物樣品，所屬技術領域具有通常知識者當可理解可依實際需求選擇任何適宜之生物晶片。例如，生物晶片可包含基因晶片(gene chip)如基因微陣列(gene microarray)、寡核苷酸微陣列(oligonucleotides microarray)、互補核苷酸微陣列(cDNA microarray)、DNA晶片(DNA chip)等、蛋白質晶片(protein chip)、醣晶片(carbohydrate chip)、組織晶片(tissue chip)、細胞微陣列晶片(cell-based microarray)、微流體晶片(microfluidic chip)或實驗室晶片(Lab-on-chip)，但不限於此。
承前述，接墊108設置於晶圓104中用以提供電性連接。在一些實施例中，接墊108可為晶圓104的內連線結構中之任一金屬層(例如，M0、M1、M2等)。接墊108的材料可包含銅(Cu)、鋁(Al)、鉬(Mo)、鎢(W)、金(Au)、鉻(Cr)、鎳(Ni)、鉑(Pt)、鈦(Ti)、銥(Ir)、銠(Rh)、前述之合金、氮化鈦(titanium nitride,TiN)、氮化鉭(tantalum nitride,TaN)、矽化鎳(nickel silicide,NiSi)、矽化鈷(cobalt silicide,CoSi)、碳化鉭(tantulum carbide,TaC)、矽氮化鉭(tantulum silicide nitride,TaSiN)、碳氮化鉭(tantalum carbide nitride,TaCN)、鋁化鈦(titanium aluminide,TiAl)、鋁氮化鈦(titanium aluminide nitride,TiAlN)、前述之組合或其它導電的金屬材料。
接著，請參照第1及3圖，於步驟14中，對晶圓104實行圖案化製程110，移除位於接墊108上方的一部分的晶圓104，以暴露出接墊108。可利用一或多個微影及蝕刻製程移除 一部分的晶圓104。在一些實施例中，蝕刻製程包含乾蝕刻製程、濕蝕刻製程、其它合適的蝕刻製程或前述之組合。乾蝕刻例如可為反應離子蝕刻(reactive ion etch，RIE)或電漿蝕刻(plasma etch)等。
請繼續參照第1及3圖，於步驟16中，實行切割製程，將晶圓104分割為多個晶粒104a。在一些實施例中，接墊108可位於晶圓104的切割道上。在一些實施例中，經切割製程形成的晶粒104a可具有至少一個生物感測區106設置於其中，以及複數個接墊108設置於其經蝕刻製程110所形成的凹陷110a(recess)中。可理解的是，雖然圖示中顯示晶粒104a具有一個生物感測區106及兩個接墊108，但所屬技術領域具有通常知識者可視需要設置適當數量的生物感測區106及接墊108。再者，切割製程可包含機械性切割、雷射切割、其它合適的切割製程或前述之組合。
接著，請參照第1及4圖，於步驟18中，將步驟16形成的晶粒104a移至第二承載基板112上，以進行後續的晶粒封裝製程。在一些實施例中，可將多個晶粒104a以適當的尺度、節距(pitch)排列於第二承載基板112上，以形成封裝階段用的晶圓或面板(panel)。然而，為了簡化圖示，圖示中僅繪示一個晶粒104a。
再者，如第4圖所示，晶粒104a設置於第二承載基板112上。晶粒104a的底部具有生物感測區106，換言之，生物感測區106位於第二承載基板112及晶粒104a之間。生物感測區106的一側與第二承載基板112接觸。再者，接墊108設置於高 於生物檢測區106的水平。具體而言，接墊108的底表面可設置於高於生物檢測區106的底表面且低於晶粒104a的頂表面之任一水平。在一些實施例中，接墊108的底表面設置於高於生物檢測區106的頂表面且低於晶粒104a的頂表面之水平。
第二承載基板112可更具有一黏著層(未繪示)形成於其上，藉此將晶粒104a暫時地固定於第二承載基板112上。第二承載基板112可為矽基板、玻璃基板、高分子基板、高分子基複合基板或前述之組合，但不限於此。第二承載基板112的材料可與第一承載基板102相同或相異。
接著，請參照第1及5圖，於步驟20中，形成介電材料114以覆蓋第二承載基板112、晶粒104a及接墊108。在一些實施例中，介電材料114可完全地覆蓋第二承載基板112、晶粒104a及接墊108，使晶粒104a及接墊108完全地嵌入於介電材料114中。介電材料114可包含環氧樹脂(epoxy)、酚醛樹脂(phenol resin)、FR-4(由織造的玻璃纖維布與阻燃環氧樹脂黏合劑組成的複合材料)、矽膠(silicone)、其它合適的介電材料或前述之組合。再者，可藉由旋轉塗佈(spin coating)、轉移成型(transfer molding)、射出成型(injection molding)、其它合適的製程或前述之組合形成介電材料114。
接著，請繼續參照第1及5圖，於步驟22中，實行平坦化製程以部分地移除介電材料114，直到暴露晶粒104a的頂表面。在一些實施例中，經平坦化的介電材料114的頂表面與晶粒104a的頂表面實質上(substantially)齊平。再者，平坦化製程可包含化學機械研磨製程、研磨製程、蝕刻製程、其它可 實施的製程或前述之組合。
接著，請參照第1及6圖，於步驟24中，圖案化介電材料114，以部分地移除位於接墊108上方的介電材料114，形成暴露接墊108之頂表面的開口116。可利用一或多個微影及蝕刻製程移除部分的介電材料114以形成開口116。在一些實施例中，蝕刻製程包含乾蝕刻製程、濕蝕刻製程、其它合適的蝕刻製程或前述之組合。乾蝕刻例如可為反應離子蝕刻(reactive ion etch，RIE)或電漿蝕刻(plasma etch)等。
接著，請參照第1及7圖，於步驟26中，以導電材料填充開口116以形成導孔(via)118。導孔118自接墊108延伸穿過介電材料114。導電材料可包含銅(Cu)、鋁(Al)、鉬(Mo)、鎢(W)、金(Au)、鉻(Cr)、鎳(Ni)、鉑(Pt)、鈦(Ti)、銥(Ir)、銠(Rh)、前述之合金、氮化鈦(titanium nitride,TiN)、氮化鉭(tantalum nitride,TaN)、矽化鎳(nickel silicide,NiSi)、矽化鈷(cobalt silicide,CoSi)、碳化鉭(tantulum carbide,TaC)、矽氮化鉭(tantulum silicide nitride,TaSiN)、碳氮化鉭(tantalum carbide nitride,TaCN)、鋁化鈦(titanium aluminide,TiAl)、鋁氮化鈦(titanium aluminide nitride,TiAlN)、前述之組合或其它導電的金屬材料。
在一些實施例中，利用濺鍍(sputtering)、蒸鍍(evaporation)、電鍍製程、無電式電鍍製程、原子層沉積製程(ALD)、物理氣相沉積(PVD)製程、化學氣相沉積(CVD)製程、其它可實施的製程或前述之組合形成導電材料於開口116中。
接著，請參照第1及7圖，於步驟28中，形成重分 佈層120於經平坦化的介電材料114上。重分佈層120與導孔118接觸以電性連接至接墊108。可理解的是，接墊108、導孔118及重分佈層120用以提供生物感測器封裝結構的導電路徑。
重分佈層120由導電材料形成，導電材料可包含銅(Cu)、鋁(Al)、鉬(Mo)、鎢(W)、金(Au)、鉻(Cr)、鎳(Ni)、鉑(Pt)、鈦(Ti)、銥(Ir)、銠(Rh)、前述之合金、氮化鈦(titanium nitride,TiN)、氮化鉭(tantalum nitride,TaN)、矽化鎳(nickel silicide,NiSi)、矽化鈷(cobalt silicide,CoSi)、碳化鉭(tantulum carbide,TaC)、矽氮化鉭(tantulum silicide nitride,TaSiN)、碳氮化鉭(tantalum carbide nitride,TaCN)、鋁化鈦(titanium aluminide,TiAl)、鋁氮化鈦(titanium aluminide nitride,TiAlN)、前述之組合或其它導電的金屬材料。在一些實施例中，可藉由濺鍍(sputtering)、蒸鍍(evaporation)、電鍍製程、無電式電鍍製程、微影製程、其它可實施的製程或前述之組合形成重分佈層120。
接著，請參照第1及8圖，於步驟30中，形成保護層122於介電材料114及晶粒104a上方，以覆蓋重分佈層120及晶粒104a。詳細而言，保護層122與部分的重分佈層120、部分的介電材料114及晶粒104a接觸。保護層122可為防焊遮罩(solder mask)或阻焊劑(solder resist)，可由習知的防焊材料形成。在一些實施例中，可藉由塗佈製程、印刷製程、其它可實施的製程或前述之組合形成保護層122。
接著，於步驟32中，對保護層122實行圖案化製程，以移除部分的保護層122，形成暴露出重分佈層120的開口124。可利用一或多個微影及蝕刻製程移除部分的保護層122。 在一些實施例中，蝕刻製程包含乾蝕刻製程、濕蝕刻製程、其它合適的蝕刻製程或前述之組合。乾蝕刻例如可為反應離子蝕刻(reactive ion etch，RIE)或電漿蝕刻(plasma etch)等。
接著，請參照第1及9圖，於步驟34中，移除第二承載基板112，以暴露出生物感測區106，並將封裝結構倒裝。在一些實施例中，可於步驟34後，進一步於生物感測區106的頂表面進行晶圓級(wafer-level)或面板級(panel-level)的生物材料塗佈，以及根據需要對步驟18形成的封裝用晶圓或面板進行切割，以取得尺寸適當的生物感測器封裝結構終產品。前述生物材料可為習知用於生物晶片反應塗層的任意材料。封裝用的晶圓或面板在切割後所形成的生物感測器封裝結構，可視需要具有適當數量的晶粒104a。在一些實施例中，一生物感測器封裝結構可具有一個晶粒104a。在一些實施例中，一生物感測器封裝結構可具有兩個以上的晶粒104a。
第9圖顯示一實施例中完成的生物感測器封裝結構100。如第9圖所示，生物感測器封裝結構100的接墊108設置於晶粒104a的一下表面並與晶粒104a接觸。接墊108設置於低於生物感測區106的水平，且藉由導孔118與重分佈層120電性連接。在一些實施例中，接墊108的頂表面設置於低於生物檢測區106的頂表面以及晶粒104a的頂表面的水平。在一些實施例中，接墊108的頂表面設置於高於晶粒104a的底表面及介電材料114的底表面水平。在一些實施例中，接墊108的頂表面設置於低於生物檢測區106的底表面的水平。
如第9圖所示，在完成的生物感測器封裝結構100 中，生物感測區106的頂表面與晶粒104a及介電材料114的頂表面可為實質上齊平的，且晶粒104a、接墊108及導孔118嵌入於介電材料114中。再者，重分佈層120可藉由開口124耦接至外部的訊號處理器(未繪示)，以處理生物感測區106反應所產生資訊。
另一方面，可進一步於介電材料114的上方設置上蓋126，以覆蓋晶粒104a及生物感測區106。上蓋126的面積可大於生物感測區106的頂表面面積，上蓋126可保護生物感測區106的反應區，且提供了生物感測區106操作時的反應空間，例如生物樣品及反應試劑的反應空間。上蓋126的材料可包含玻璃、聚甲基丙烯酸甲酯(PMMA)、聚二甲基矽氧烷(PDMS)、矽膠(silicone)、環氧樹脂(epoxy)、其它合適的材料或前述之組合。
所屬技術領域具有通常知識者當可理解，可視需要於生物感測器封裝結構100上設置入/出口(未繪示)以載入或移除欲處理或分析之生物樣品。例如，於一實施例中，生物樣品及相關的反應試劑可由入口導入生物感測區106，並在生物樣品及試劑完成各項程序(例如：處理或分析)後由出口移除之。於一些實施例中，更可於入口處設置流體儲存槽(reservoir)(未繪示)作為流體供應源。
綜上所述，本揭露提供的生物感測器封裝結構將電性連接元件設置於低於生物感測器的反應區表面的位置，採用將接墊埋置(embed)於介電材料中的封裝結構，避免被使用於生物感測器的反應試劑腐蝕。相較於一般打線接合形式的晶片封裝，本揭露提供的生物感測器封裝結構不用顧慮到電性連 接元件設置於封裝結構表面可能會佔用掉生物感測區之問題。且相較於打線接合的晶片封裝，本揭露提供的生物感測器封裝結構的表面提供完整的生物感測區，可提升生物感測區的有效反應面積，進而增加生物感測器的使用效率。
此外，本揭露提供的生物感測器封裝結構的製造方法可於晶粒封裝製程之後，進行晶圓級(wafer-level)或面板級(panel-level)的生物材料塗佈，接著進行切割便可得到封裝結構的最終產品，藉此，可避免封裝製程中的溫度變化對生物材料塗層產生損害。
雖然本揭露的實施例及其優點已揭露如上，但應該瞭解的是，任何所屬技術領域中具有通常知識者，在不脫離本揭露之精神和範圍內，當可作更動、替代與潤飾。此外，本揭露之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟，任何所屬技術領域中具有通常知識者可從本揭露揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟，只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本揭露使用。因此，本揭露之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外，每一申請專利範圍構成個別的實施例，且本揭露之保護範圍也包括各個申請專利範圍及實施例的組合。

Claims (13)

  1. 一種生物感測器封裝結構，包括：一保護層；一重分佈層，設置於該保護層上方，其中該保護層具有複數個暴露出該重分佈層的開口，該重分佈層通過該保護層的該些開口耦接至一訊號處理器；至少一晶粒，設置於該保護層及該重分佈層上方；複數個接墊，設置於該晶粒的下表面；複數個導孔，設置於該些接墊及該重分佈層之間以提供電性連接；一介電材料，設置於該保護層及該重分佈層上方，且與該晶粒、該些接墊及該些導孔相鄰；以及至少一生物感測區，設置於該晶粒的頂部，其中該些接墊的頂表面設置於低於該生物檢測區的頂表面且高於該晶粒的底表面之水平。
  2. 如申請專利範圍第1項所述之生物感測器封裝結構，其中該些接墊的頂表面設置於低於該生物檢測區的底表面之水平。
  3. 如申請專利範圍第1項所述之生物感測器封裝結構，其中該生物感測區的頂表面與該晶粒的頂表面實質上齊平。
  4. 如申請專利範圍第1項所述之生物感測器封裝結構，其中該晶粒、該些接墊及該些導孔係嵌入於該介電材料中。
  5. 如申請專利範圍第1項所述之生物感測器封裝結構，其中該介電材料的頂表面與該生物感測區及該晶粒的頂表面實質上齊平。
  6. 如申請專利範圍第1項所述之生物感測器封裝結構，更包括一上蓋，設置於該介電材料上方且覆蓋該生物感測區。
  7. 一種生物感測器封裝結構的製造方法，包括：提供一第一承載基板；設置至少一晶粒於該第一承載基板上，其中該晶粒包括至少一生物感測區形成於其底部以及複數個接墊形成於其上表面，其中該生物感測區與該第一承載基板接觸，且該些接墊的底表面設置於高於該生物檢測區的底表面且低於該晶粒的頂表面之水平；形成一介電材料，覆蓋該第一承載基板及該晶粒；實行一平坦化製程，以暴露出該晶粒的頂表面；圖案化該介電材料，以形成分別暴露出該些接墊的頂表面的複數個第一開口；填充一導電材料於該些第一開口中，以形成延伸穿過該介電材料的複數個導孔；形成一重分佈層及一保護層於該介電材料上，其中該重分佈層與該些導孔接觸以電性連接至該些接墊；以及移除該第一承載基板，以暴露出該生物感測區。
  8. 如申請專利範圍第7項所述之生物感測器封裝結構的製造方法，其中該些接墊的底表面設置於低於該生物檢測區的頂表面之水平。
  9. 如申請專利範圍第7項所述之生物感測器封裝結構的製造方法，其中在該平坦化製程後，該晶粒的頂表面與該介電材料的頂表面實質上齊平。
  10. 如申請專利範圍第7項所述之生物感測器封裝結構的製造方法，其中該晶粒的形成係在提供該第一承載基板的步驟前，包括：提供一第二承載基板；形成一晶圓於該第二承載基板上，其中該晶圓具有複數個生物感測區及複數個接墊形成於其中；圖案化該晶圓，移除位於該些接墊上方的部分晶圓，以暴露出該些接墊；以及實行一切割製程，切割該晶圓以形成複數個晶粒。
  11. 如申請專利範圍第10項所述之生物感測器封裝結構的製造方法，其中該些接墊形成於該晶圓的切割道上。
  12. 如申請專利範圍第7項所述之生物感測器封裝結構的製造方法，其中在移除該第一承載基板之前，更包括：圖案化該保護層，以形成暴露出該重分佈層的複數個第二開口。
  13. 如申請專利範圍第7項所述之生物感測器封裝結構的製造方法，其中在移除該第一承載基板之後，更包括：於該生物感測區塗佈生物材料。
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