TWI608791B - 撓性印刷電路板用電磁波遮蔽材 - Google Patents

撓性印刷電路板用電磁波遮蔽材 Download PDF

Info

Publication number: TWI608791B
Authority: TW; Taiwan
Prior art keywords: electromagnetic wave; wave shielding; fpc; resin; shielding material
Prior art date: 2013-02-28

Application number

TW106122821A

Other languages

English (en)

Chinese (zh)

Other versions

TW201735767A (zh

Inventor

野村直宏

藤井早苗

櫻木喬規

Original Assignee

藤森工業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-02-28

Filing date

2014-01-07

Publication date

2017-12-11

2014-01-07 Application filed by 藤森工業股份有限公司 filed Critical 藤森工業股份有限公司

2017-10-01 Publication of TW201735767A publication Critical patent/TW201735767A/zh

2017-12-11 Application granted granted Critical

2017-12-11 Publication of TWI608791B publication Critical patent/TWI608791B/zh

Links

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Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0029—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials intermixed with electro-conductive particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Telephone Set Structure (AREA)
Laminated Bodies (AREA)

TW106122821A 2013-02-28 2014-01-07 撓性印刷電路板用電磁波遮蔽材 TWI608791B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2013038698A JP6081819B2 (ja)	2013-02-28	2013-02-28	Ｆｐｃ用電磁波シールド材

Publications (2)

Publication Number	Publication Date
TW201735767A TW201735767A (zh)	2017-10-01
TWI608791B true TWI608791B (zh)	2017-12-11

Family

ID=51440007

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
TW103100553A TWI608788B (zh)	2013-02-28	2014-01-07	撓性印刷電路板用電磁波遮蔽材
TW106122821A TWI608791B (zh)	2013-02-28	2014-01-07	撓性印刷電路板用電磁波遮蔽材

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
TW103100553A TWI608788B (zh)	2013-02-28	2014-01-07	撓性印刷電路板用電磁波遮蔽材

Country Status (4)

Country	Link
JP (1)	JP6081819B2 (ja)
KR (3)	KR20140108103A (ja)
CN (1)	CN104023511B (ja)
TW (2)	TWI608788B (ja)

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* Cited by examiner, † Cited by third party
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JP6559520B2 (ja) *	2014-09-24	2019-08-14	積水化学工業株式会社	樹脂組成物、樹脂フィルム、積層フィルム及び多層基板
JP6520133B2 (ja) *	2015-01-16	2019-05-29	大日本印刷株式会社	積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法
JP6520143B2 (ja) *	2015-01-23	2019-05-29	大日本印刷株式会社	積層体、それを用いた導電性基材の製造方法、電子デバイスの製造方法、および転写具
JP6280518B2 (ja) *	2015-04-17	2018-02-14	藤森工業株式会社	Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
WO2016190278A1 (ja) *	2015-05-26	2016-12-01	タツタ電線株式会社	シールドフィルムおよびシールドプリント配線板
JP2018010889A (ja) *	2016-07-11	2018-01-18	藤森工業株式会社	電磁波シールド材
JP6920796B2 (ja) *	2016-08-05	2021-08-18	藤森工業株式会社	Ｆｐｃ用導電性接着シート及びｆｐｃ
CN110072961B (zh) *	2016-12-22	2022-02-08	东亚合成株式会社	粘合剂组合物以及使用其的覆盖膜、粘合片、覆铜层压板和电磁波屏蔽材料
JP2017115152A (ja) *	2017-01-18	2017-06-29	藤森工業株式会社	導電性接着剤層、及びｆｐｃ用電磁波シールド材
KR102428873B1 (ko) *	2017-10-13	2022-08-02	타츠타 전선 주식회사	차폐 패키지
KR101983706B1 (ko)	2017-10-31	2019-09-03	(주)지원산업	비프탈레이트 가소제 및 할로겐프리 난연제를 포함하는 전자파 차폐 테이프, 가스켓 및 그 제조방법
JP6731393B2 (ja) *	2017-11-21	2020-07-29	タツタ電線株式会社	電磁波シールドフィルム
JP6839669B2 (ja) *	2018-01-09	2021-03-10	タツタ電線株式会社	電磁波シールドフィルム
CN111972051A (zh)	2018-03-16	2020-11-20	华为技术有限公司	用于电磁干扰屏蔽的组件及方法
CN118612940A (zh) *	2018-12-11	2024-09-06	拓自达电线株式会社	屏蔽印制线路板的制造方法及屏蔽印制线路板
JP6699784B2 (ja) *	2019-04-26	2020-05-27	大日本印刷株式会社	積層体、それを用いた導電性基材の製造方法、電子デバイスの製造方法、および転写具
JP6699783B2 (ja) *	2019-04-26	2020-05-27	大日本印刷株式会社	積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法
KR102328434B1 (ko) *	2019-08-19	2021-11-18	박선영	전자파 차폐 의류
JP7090057B2 (ja)	2019-10-07	2022-06-23	株式会社ジェイテクトサーモシステム	ランプ加熱装置
JP6849130B2 (ja) *	2020-04-30	2021-03-24	大日本印刷株式会社	積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法
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JP6081819B2 (ja)	2017-02-15
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TW201440630A (zh)	2014-10-16
CN104023511B (zh)	2018-04-03
KR102004181B1 (ko)	2019-07-26
CN104023511A (zh)	2014-09-03
KR20190012242A (ko)	2019-02-08
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