TWI607796B - Porous substrate and oscillating assembly - Google Patents
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- TWI607796B TWI607796B TW105123005A TW105123005A TWI607796B TW I607796 B TWI607796 B TW I607796B TW 105123005 A TW105123005 A TW 105123005A TW 105123005 A TW105123005 A TW 105123005A TW I607796 B TWI607796 B TW I607796B
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- 239000000758 substrate Substances 0.000 title claims description 71
- 239000000463 material Substances 0.000 claims description 28
- 239000010935 stainless steel Substances 0.000 claims description 20
- 229910001220 stainless steel Inorganic materials 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 description 9
- 230000035939 shock Effects 0.000 description 7
- 229910000990 Ni alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- -1 and in general Substances 0.000 description 1
- 230000009514 concussion Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Description
本發明係關於一種能應用於分子級過濾器、噴霧器等相關技術領域之多孔狀基板及震盪組件。 The present invention relates to a porous substrate and an oscillating assembly which can be applied to related art fields such as molecular grade filters and sprayers.
目前應用於分子級過濾器或噴霧器中，皆具備一具有多數細小孔洞的基板，藉由該多孔狀基板作為過濾片提供過濾功能，或以該多孔狀基板作為震盪產生元件驅動之震盪片提供震盪功能。故多孔狀基板必須具備作為過濾片或震盪片所必須的耐蝕性、耐高溫度及強度佳等材質特性。 At present, it is applied to a molecular-grade filter or a sprayer, and has a substrate having a plurality of fine holes, and the porous substrate serves as a filter to provide a filtering function, or the porous substrate serves as a shock generating piece driven by the oscillating generating element to provide shock. Features. Therefore, the porous substrate must have material properties such as corrosion resistance, high temperature resistance, and high strength which are necessary for the filter or the oscillation sheet.
以多孔狀基板作為震盪片為例，早期的震盪片係選用鎳基合金來製作。雖鎳基合金材質震盪片的強度優，但因有生物適性問題而不適用。於是，有人思及改用鈀鎳合金製造多孔狀基板作為震盪片。 Taking a porous substrate as an oscillating plate as an example, the early oscillating film was made of a nickel-based alloy. Although the strength of the nickel-base alloy shock plate is excellent, it is not suitable due to the biocompatibility problem. Therefore, it has been thought to use a palladium-nickel alloy to manufacture a porous substrate as a oscillating sheet.
前述鈀鎳合金材質的震盪片雖具有優於鎳基合金材料的強度，但因鈀鎳合金材質的震盪片較適於電鑄成形，且鈀鎳合金材料有成本高的問題，故有人進一步思及選用不鏽鋼取代鈀鎳合金來製造震盪片。 Although the shock plate of the palladium-nickel alloy material has better strength than the nickel-base alloy material, the shock plate of the palladium-nickel alloy material is more suitable for electroforming, and the palladium-nickel alloy material has a high cost problem, so some people think twice. And the use of stainless steel instead of palladium nickel alloy to make the shock plate.
惟不鏽鋼材料製造的多孔狀基板雖具備良好的強度且材料成本低於鈀鎳合金，為製造多孔狀基板的合適材料。然而，不鏽鋼材料種類多，產業常用的一般不鏽鋼在製造多孔狀基板時，多孔狀基板中必須形成多數個細小孔徑的通孔，當利用蝕刻手段成形通孔時，該多孔狀基板的生產良率偏低，因此，所述通孔通常藉由鐳射穿孔加工手段成形。於鐳射穿孔加工過程中，由於不鏽鋼材質的基板的板厚遠大於通孔孔徑，通孔的孔徑細小且深度較深，不利於鐳射穿孔加工。再者，以一般不鏽鋼材料製造的多孔狀基板作為震盪片時， 因其材質堅硬，使震盪片與震盪產生元件結合後，震盪片難以在震盪產生元件的驅動下產生良好的高速震盪性能。 However, a porous substrate made of a stainless steel material has a good strength and a material cost lower than that of a palladium nickel alloy, and is a suitable material for producing a porous substrate. However, there are many types of stainless steel materials, and in general, stainless steel is commonly used in the industry. When manufacturing a porous substrate, a plurality of through holes having a small aperture must be formed in the porous substrate. When the through holes are formed by etching, the production yield of the porous substrate is good. It is low, and therefore, the through hole is usually formed by a laser perforation processing means. In the laser perforation process, since the thickness of the substrate made of stainless steel is much larger than the aperture of the through hole, the aperture of the through hole is small and deep, which is not suitable for laser perforation processing. Furthermore, when a porous substrate made of a general stainless steel material is used as the oscillation sheet, Because of its hard material, the combination of the oscillating piece and the oscillating generating element makes it difficult for the oscillating piece to generate good high-speed oscillating performance under the driving of the oscillating generating element.
基於前述各項金屬材料難以提供較佳製造多孔狀基板的材料，且多孔狀基板設置多個直孔形的貫穿孔構造不利於鐳射穿孔加工，以及前述多項金屬材料製成的多孔狀基板作為震盪片時，難以被驅動產生良好高速震盪性能等問題，必須尋求解決之技術方案。 It is difficult to provide a material for preferably manufacturing a porous substrate based on the foregoing various metal materials, and the porous substrate is provided with a plurality of through-hole-shaped through-hole structures which are disadvantageous for laser perforation processing, and the porous substrate made of the plurality of metal materials described above is oscillated In the case of film, it is difficult to be driven to produce problems such as high-speed oscillation performance, and a technical solution must be sought.
本發明之主要目的在於提供多孔狀基板與震盪組件，解決現有多孔狀基板的材料選擇不適當，多孔狀基板之多個直孔式貫穿孔構造不利於鐳射穿孔加工，以及多孔狀基板作為震盪片時，難以被驅動產生良好高速震盪性能等問題。 The main object of the present invention is to provide a porous substrate and an oscillating assembly, which solves the problem of improper material selection of the conventional porous substrate, and the plurality of straight-hole through-hole structures of the porous substrate are disadvantageous for laser perforation processing, and the porous substrate is used as the oscillating sheet. At the time, it is difficult to be driven to generate problems such as good high-speed oscillation performance.
為了達成前揭目的，本發明所提出的多孔狀基板係選用AISI-3xx系列不鏽鋼材料製成的片體，該多孔狀基板相對兩側分別為一第一表面以及一第二表面，該多孔狀基板中形成多個孔洞，每一孔洞各包含一凹穴部以及至少一通孔部，所述凹穴部係自第一表面朝第二表面方向延伸，所述通孔部係形成於該凹穴部內周壁且貫通至第二表面，所述通孔部的直徑小於所述凹穴部的直徑，所述通孔部之深度與所述通孔部之孔徑之比值為8：1~15：1。 In order to achieve the foregoing object, the porous substrate proposed by the present invention is a sheet made of AISI-3xx series stainless steel material, and the opposite sides of the porous substrate are a first surface and a second surface, respectively. Forming a plurality of holes in the substrate, each of the holes each including a recess portion and at least one through hole portion extending from the first surface toward the second surface, wherein the through hole portion is formed in the recess The inner peripheral wall of the portion penetrates to the second surface, the diameter of the through hole portion is smaller than the diameter of the recess portion, and the ratio of the depth of the through hole portion to the aperture of the through hole portion is 8:1 to 15:1 .
本發明另外提出的震盪組件係包含一如上所述之多孔狀基板以及一震盪產生元件，該震盪產生元件包含一震盪輸出部，並以該震盪輸出部設置於該多孔狀基板的第一表面或第二表面。 The oscillating component of the present invention further comprises a porous substrate as described above and an oscillating generating component, the oscillating generating component comprising an oscillating output portion, and the oscillating output portion is disposed on the first surface of the porous substrate or The second surface.
藉由前揭多孔狀基板與具有該多孔狀基板的震盪組件之發明，其至少具備以下諸多優點： By the invention of the porous substrate and the oscillating assembly having the porous substrate, at least the following advantages are obtained:
1、該多孔狀基板係選用AISI-3xx系列的不鏽鋼材料來製造，具備作分子級過濾器之過濾片或噴霧器之震盪片所必須的耐蝕性、耐高溫度及強度佳等材質特性，該AISI-3xx系列的不鏽鋼之材料成本適中，且材料易於取得。 1. The porous substrate is made of stainless steel material of AISI-3xx series, and has the characteristics of corrosion resistance, high temperature resistance and high strength required for the vibration plate of the filter or sprayer of the molecular filter. The -3xx series of stainless steel materials are moderately costly and easy to obtain.
2、該多孔狀基板中之多數個孔洞皆為包含凹穴部與形成於凹穴部內周壁的至少一通孔部之階級孔構造，使該多孔狀基板第一表面藉由凹穴部之間的間隔壁形成網絡狀構造，使其具備良好的強度，同時也能夠分散減少部分材料而具備良好的彈性，使該多孔狀基板作為震盪片時，該震盪片易被震盪產生元件驅動產生震盪，且高速震盪的性能良好。 2. The plurality of holes in the porous substrate are a class hole structure including a recess portion and at least one through hole portion formed in the inner peripheral wall of the recess portion, so that the first surface of the porous substrate is between the recess portions The partition wall has a network structure, so that it has good strength, and can also disperse and reduce part of the material and has good elasticity. When the porous substrate is used as an oscillating plate, the oscillating plate is easily driven by the oscillating generating element to generate oscillation. High-speed oscillation performance is good.
3、該多孔狀基板中之多個孔洞皆為包含凹穴部與形成於凹穴部內周壁的至少一通孔部之階級孔構造，其中較大孔徑的凹穴部可使用蝕刻手段加以成形，較小孔徑的通孔部則以鐳射穿孔手段加以形成，在鐳射穿孔加工成形通孔部的過程中，利用凹穴部適當地減縮預定鐳射加工的通孔部深度，同時利用通孔部的深度與通孔部的孔徑之比值控制在8：1~15：1，有助於鐳射穿孔加工之進行。 3. The plurality of holes in the porous substrate are a class hole structure including a recess portion and at least one through hole portion formed in the inner peripheral wall of the recess portion, wherein the recess portion of the larger aperture can be formed by using an etching method. The through hole portion of the small aperture is formed by laser perforation means. In the process of forming the through hole portion by laser perforation, the depth of the through hole portion of the predetermined laser processing is appropriately reduced by the recess portion, and the depth of the through hole portion is utilized. The ratio of the aperture of the through hole is controlled at 8:1 to 15:1, which contributes to the laser perforation processing.
10‧‧‧多孔狀基板 10‧‧‧ porous substrate
11‧‧‧第一表面 11‧‧‧ first surface
111‧‧‧平坦部 111‧‧‧ Flat section
112‧‧‧尖部 112‧‧‧ pointed
12‧‧‧第二表面 12‧‧‧ second surface
13‧‧‧孔洞 13‧‧‧ hole
131‧‧‧凹穴部 131‧‧‧ recesses
132‧‧‧通孔部 132‧‧‧through hole
20‧‧‧震盪產生元件 20‧‧‧Concussion generating components
21‧‧‧震盪輸出部 21‧‧‧ Shock output
圖1係本發明多孔狀基板之一較佳實施例的立體示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing a preferred embodiment of a porous substrate of the present invention.
圖2係圖1所示多孔狀基板較佳實施例的俯視平面示意圖。 2 is a top plan view showing a preferred embodiment of the porous substrate shown in FIG. 1.
圖3係圖1所示多孔狀基板較佳實施例的側視剖面示意圖。 Figure 3 is a side cross-sectional view showing a preferred embodiment of the porous substrate shown in Figure 1.
圖4係本發明多孔狀基板之另一較佳實施例的側視剖面示意圖。 Figure 4 is a side cross-sectional view showing another preferred embodiment of the porous substrate of the present invention.
圖5係本發明震盪組件之一較佳實施例的側視局部剖面示意圖。 Figure 5 is a side elevation, partial cross-sectional view of a preferred embodiment of the oscillating assembly of the present invention.
如圖1所示，係揭示本發明多孔狀基板10之一較佳實施例，所述多孔狀基板10係選用美國鋼鐵學會(American Iron and Steel Institute,AISI)編號 AISI-3xx系列不鏽鋼材料或與該AISI-3xx系列不鏽鋼材料相當之其他國家標準的不鏽鋼材料等製成的片體，該多孔狀基板之形狀、尺寸依產品的使用需求而設定。AISI-3xx系列不鏽鋼材料具備良好的耐蝕性、耐高溫度及強度佳等特性，且AISI-3xx系列不鏽鋼材料之材料成本適中，且材料易於取得。於本較佳實施例中，所述AISI-3xx系列不鏽鋼材料以選用AISI-304、AISI-316、AISI-316L或AISI-321為佳，其中又以AISI-316L為較佳的選擇。 As shown in Fig. 1, a preferred embodiment of the porous substrate 10 of the present invention is disclosed. The porous substrate 10 is selected from the American Iron and Steel Institute (AISI) number. The AISI-3xx series stainless steel material or a sheet made of other national standard stainless steel materials equivalent to the AISI-3xx series stainless steel material, the shape and size of the porous substrate are set according to the use requirements of the product. AISI-3xx series stainless steel materials have good corrosion resistance, high temperature resistance and good strength, and the material cost of AISI-3xx series stainless steel materials is moderate and the materials are easy to obtain. In the preferred embodiment, the AISI-3xx series stainless steel material is preferably AISI-304, AISI-316, AISI-316L or AISI-321, and AISI-316L is preferred.
如圖1至圖3所示，該多孔狀基板10相對兩側(依圖式即為上下兩側)分別為一第一表面11以及一第二表面12，該多孔狀基板10中形成多個間隔排列的孔洞13，該多孔狀基板10藉由每二相鄰孔洞13之間的間隔壁，使該多孔狀基板10第一表面11形成網絡狀構造，每一孔洞13各包含一凹穴部131以及至少一通孔部132，所述通孔部132係形成於該凹穴部131內周壁底部且貫通至第二表面12，所述通孔部132係為微小孔徑的穿孔，所述通孔部132的直徑小於所述凹穴部131的直徑，凹穴部131的直徑依據孔洞13的分布密度而調整。所述通孔部132之深度a與通孔部132之孔徑b之比值(a：b)為8：1~15：1，其中以通孔部132之深度a與通孔部132之孔徑b之比值(a：b)為10：1是較佳的選擇。 As shown in FIG. 1 to FIG. 3, the opposite sides (the upper and lower sides of the porous substrate) 10 are a first surface 11 and a second surface 12, respectively, and a plurality of the porous substrate 10 are formed. The spaced-apart holes 13 are formed in a network structure by the partition wall between each two adjacent holes 13 , and each of the holes 13 includes a recess portion. And a through hole portion 132 formed in a bottom portion of the inner peripheral wall of the recess portion 131 and penetrating to the second surface 12, wherein the through hole portion 132 is a through hole having a micro hole diameter, the through hole The diameter of the portion 132 is smaller than the diameter of the recess portion 131, and the diameter of the recess portion 131 is adjusted in accordance with the distribution density of the hole 13. The ratio (a:b) of the depth a of the through hole portion 132 to the aperture b of the through hole portion 132 is 8:1 to 15:1, wherein the depth a of the through hole portion 132 and the aperture b of the through hole portion 132 A ratio of (a:b) of 10:1 is a preferred choice.
如圖3所示，於本較佳實施例中，該多孔狀基板10之孔洞13中，較大孔徑的凹穴部131係以蝕刻手段成形，較小孔徑的通孔部132則以鐳射穿孔加工手段成形。於鐳射穿孔加工手段成形通孔部132時，藉由預先成形的凹穴部131於多孔狀基板10第一表面11產生明顯的形狀與高低差等辨識特徵，提供鐳射穿孔加工定點之輔助參考依據。 As shown in FIG. 3, in the preferred embodiment, in the hole 13 of the porous substrate 10, the cavity portion 131 having a larger aperture is formed by etching, and the through hole portion 132 having a smaller aperture is laser perforated. Processing means are formed. When the through hole portion 132 is formed by the laser perforation processing means, the pre-shaped concave portion 131 is used to form an obvious shape and height difference on the first surface 11 of the porous substrate 10, thereby providing an auxiliary reference for the laser perforation processing fixed point. .
所述通孔部132藉由鐳射穿孔加工手段成形，因此，所述通孔部132可為兩端孔徑相近的穿孔，或者，如圖3所示，所述通孔部132之孔徑係由凹穴部132朝第二表面12方向尺寸遞減，亦即所述通孔部132鄰近凹穴部132之 端部孔徑明顯大於通孔部132鄰近第二表面12的端部孔徑的穿孔，因此，所述通孔部132之孔徑b係指位於通孔部132鄰近第二表面12之端部之較小孔徑。 The through hole portion 132 is formed by a laser perforation processing means. Therefore, the through hole portion 132 may be a hole having a hole diameter close to each other, or, as shown in FIG. 3, the hole diameter of the through hole portion 132 is concave. The hole portion 132 is reduced in size toward the second surface 12, that is, the through hole portion 132 is adjacent to the recess portion 132. The end aperture is significantly larger than the through hole of the through hole portion 132 adjacent to the end aperture of the second surface 12, and therefore, the aperture b of the through hole portion 132 is referred to as being smaller at the end of the through hole portion 132 adjacent to the second surface 12. Aperture.
於本較佳實施例中，所述多孔狀基板10之第一表面11於每二相鄰之孔洞13之間的間隔壁外側面可形成平坦部111(如圖3所示者)或尖部112(如圖4所示者)。如圖4所示，當所述孔洞13於凹穴部131底部設有複數通孔部132，該複數通孔部132係間隔排列。於本較佳實施例中，所述通孔部132之深度a約為1.5μm~150μm，所述通孔部132之孔徑b約為0.1μm~10μm。 In the preferred embodiment, the first surface 11 of the porous substrate 10 may form a flat portion 111 (as shown in FIG. 3) or a tip portion on the outer side surface of the partition wall between each two adjacent holes 13. 112 (as shown in Figure 4). As shown in FIG. 4, when the hole 13 is formed in the bottom of the recess portion 131, a plurality of through holes 132 are formed, and the plurality of through holes 132 are spaced apart. In the preferred embodiment, the through hole portion 132 has a depth a of about 1.5 μm to 150 μm, and the through hole portion 132 has a hole diameter b of about 0.1 μm to 10 μm.
如圖5所示，係揭示本發明震盪組件之一較佳實施例，該震盪組件係包含一多孔狀基板10以及一震盪產生元件20。該多孔狀基板10之技術特徵係如上所述，於此不再贅述。該多孔狀基板10係作為震盪片，該震盪產生元件20係一能受控通電而輸出震盪作用力。該震盪產生元件20包含一震盪輸出部21，並以該震盪輸出部21設置於多孔狀基板10的第一表面11或第二表面12，使多孔狀基板10能為被震盪產生元件20驅動而產生相應的震動。於本較佳實施例中，該震盪產生元件20的震盪輸出部21連接多孔狀基板10的第二表面12。 As shown in FIG. 5, a preferred embodiment of the oscillating assembly of the present invention is disclosed. The oscillating assembly includes a porous substrate 10 and an oscillating generating member 20. The technical features of the porous substrate 10 are as described above, and will not be described herein. The porous substrate 10 serves as a oscillating plate, and the oscillating generating member 20 is capable of controlled energization to output an oscillating force. The oscillating generating element 20 includes an oscillating output portion 21, and the oscillating output portion 21 is disposed on the first surface 11 or the second surface 12 of the porous substrate 10, so that the porous substrate 10 can be driven by the oscillating generating member 20. Generate corresponding vibrations. In the preferred embodiment, the oscillating output portion 21 of the oscillating generating member 20 is coupled to the second surface 12 of the porous substrate 10.
綜上所述，藉由前揭多孔狀基板與具有該多孔狀基板的震盪組件之發明，其主要係利用選用AISI-3xx系列不鏽鋼材料作為多孔狀基板的製造板材，使其具備作分子級過濾器之過濾片或噴霧器之震盪片所必須的耐蝕性、耐高溫度及強度佳等材質特性，且該AISI-3xx系列不鏽鋼之材料成本適中，材料易於取得使用。其次，該多孔狀基板中之多數個孔洞皆為包含凹穴部與形成於凹穴部內周壁的至少一通孔部之階級孔構造，使該多孔狀基板第一表面藉由凹穴部之間的間隔壁形成網絡狀構造，使其具備良好的強度，同時也能夠分散減少部分材料而具備良好的彈性，使該多孔狀基板作為震盪片時，該震盪片易被震盪產生元件驅動產生震盪，且高速震盪的性能良好。 In summary, the invention of the porous substrate and the oscillating assembly having the porous substrate is mainly made of a AISI-3xx series stainless steel material as a porous substrate for molecular grade filtration. The material of the AISI-3xx series stainless steel is moderately cost-effective and the material is easy to use. Next, a plurality of holes in the porous substrate are a class hole structure including a recess portion and at least one through hole portion formed in the inner peripheral wall of the recess portion, so that the first surface of the porous substrate is between the recess portions The partition wall has a network structure, so that it has good strength, and can also disperse and reduce part of the material and has good elasticity. When the porous substrate is used as an oscillating plate, the oscillating plate is easily driven by the oscillating generating element to generate oscillation. High-speed oscillation performance is good.
另一方面，該多孔狀基板中之多個孔洞皆為包含凹穴部與形成於凹穴部內周壁的至少一通孔部之階級孔構造，其中較大孔徑的凹穴部可使用蝕刻手段加以成形，較小孔徑的通孔部則以鐳射穿孔手段加以形成，在鐳射穿孔加工成形通孔部的過程中，利用凹穴部減縮預定鐳射加工成形的通孔部深度，以及通孔部的深度與通孔部的孔徑之比值控制在8：1~15：1，有助於鐳射穿孔加工之進行。 On the other hand, the plurality of holes in the porous substrate are a class hole structure including a recess portion and at least one through hole portion formed in the inner peripheral wall of the recess portion, wherein the recess portion of the larger aperture can be formed by etching The through-hole portion of the smaller aperture is formed by laser perforation. In the process of forming the through-hole portion by laser perforation, the depth of the through-hole portion formed by the laser processing is reduced by the recess portion, and the depth of the through-hole portion is The ratio of the aperture of the through hole is controlled at 8:1 to 15:1, which contributes to the laser perforation processing.
據此，本發明確能解決現有技術中各項金屬材料難以提供較佳製造多孔狀基板的板材，多孔狀基板成形多數直孔形貫穿孔的構造不利於鐳射穿孔加工，以及多孔狀基板難以被驅動產生良好高速震盪性能等技術問題，故本發明確實提供一項具有產業利用價值的技術方案。 Accordingly, the present invention can solve the problem that the metal materials in the prior art are difficult to provide a plate material which is preferably manufactured into a porous substrate, and the porous substrate is formed into a structure of a plurality of straight hole-shaped through holes, which is disadvantageous for laser perforation processing, and the porous substrate is difficult to be The drive produces technical problems such as good high-speed oscillation performance, so the present invention does provide a technical solution with industrial utilization value.
10‧‧‧多孔狀基板 10‧‧‧ porous substrate
11‧‧‧第一表面 11‧‧‧ first surface
13‧‧‧孔洞 13‧‧‧ hole
131‧‧‧凹穴部 131‧‧‧ recesses
132‧‧‧通孔部 132‧‧‧through hole
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| CN113549870A (en) * | 2020-04-23 | 2021-10-26 | 旭晖应用材料股份有限公司 | Metal mask |
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| CN101031793A (en) * | 2005-06-07 | 2007-09-05 | 松下电器产业株式会社 | Apparatus for measuring the electrical physiology of cells and a method for manufacturing the same |
| TW201026378A (en) * | 2008-09-26 | 2010-07-16 | Asahi Kasei Chemicals Corp | Porous membrane, process for producing porous membrane, process for producing clarified liquid, and porous-membrane module |
| CN104520420A (en) * | 2013-07-24 | 2015-04-15 | 株式会社奥普特尼克斯精密 | Device for isolating peripheral circulating tumor cells or rare cells, and method for isolating peripheral circulating tumor cells or rare cells |
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| CN101031793A (en) * | 2005-06-07 | 2007-09-05 | 松下电器产业株式会社 | Apparatus for measuring the electrical physiology of cells and a method for manufacturing the same |
| TW201026378A (en) * | 2008-09-26 | 2010-07-16 | Asahi Kasei Chemicals Corp | Porous membrane, process for producing porous membrane, process for producing clarified liquid, and porous-membrane module |
| CN104520420A (en) * | 2013-07-24 | 2015-04-15 | 株式会社奥普特尼克斯精密 | Device for isolating peripheral circulating tumor cells or rare cells, and method for isolating peripheral circulating tumor cells or rare cells |
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| CN113549870A (en) * | 2020-04-23 | 2021-10-26 | 旭晖应用材料股份有限公司 | Metal mask |
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