Nothing Special   »   [go: up one dir, main page]

TWI698662B - Pattern drawing device and pattern drawing method - Google Patents

Pattern drawing device and pattern drawing method Download PDF

Info

Publication number
TWI698662B
TWI698662B TW109108755A TW109108755A TWI698662B TW I698662 B TWI698662 B TW I698662B TW 109108755 A TW109108755 A TW 109108755A TW 109108755 A TW109108755 A TW 109108755A TW I698662 B TWI698662 B TW I698662B
Authority
TW
Taiwan
Prior art keywords
light
light beam
reflecting surface
polygon mirror
substrate
Prior art date
Application number
TW109108755A
Other languages
Chinese (zh)
Other versions
TW202024716A (en
Inventor
鈴木智也
加藤正紀
小宮山弘樹
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202024716A publication Critical patent/TW202024716A/en
Application granted granted Critical
Publication of TWI698662B publication Critical patent/TWI698662B/en

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G03F7/70366Rotary scanning
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/12Scanning systems using multifaceted mirrors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/12Scanning systems using multifaceted mirrors
    • G02B26/124Details of the optical system between the light source and the polygonal mirror
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

本發明之光束掃描裝置(MD),係一邊將光束(LB)之點光(SP)投射於對象物(P)之被照射面、一邊進行該點光(SP)於該被照射面上沿掃描線(SLn)之一維掃描,其具備:射入光束(LB)之入射光學構件(M10)、將來自入射光學構件(M10)之光束(LB)為進行掃描而加以偏向的掃描用偏向構件(PM)、射入經偏向之光束(LB)後投射於被照射面的投射光學系(FT)、以及支承入射光學構件(M10)、掃描用偏向構件(PM)及投射光學系(FT)、可繞與照射中心軸(Le)在既定容許範圍内成同軸之第1旋轉中心軸(Mrp)旋轉的支承架(40),該照射中心軸係相對該被照射面垂直通過以該點光(SP)之掃描在該被照射面上形成之掃描線(SLn)之中點。The beam scanning device (MD) of the present invention projects the spot light (SP) of the beam (LB) on the illuminated surface of the object (P) while performing the spot light (SP) on the illuminated surface. Scanning line (SLn) one-dimensional scanning, which includes: incident optical member (M10) for incident light beam (LB), and scanning deflection to deflect light beam (LB) from incident optical member (M10) for scanning The component (PM), the projection optical system (FT) that enters the deflected light beam (LB) and is projected on the illuminated surface, and the supporting incident optical component (M10), the scanning deflecting component (PM), and the projection optical system (FT) ), a support frame (40) that can rotate around the first rotation center axis (Mrp) coaxial with the irradiation center axis (Le) within a predetermined allowable range, and the irradiation center axis system passes perpendicular to the illuminated surface at this point The light (SP) is scanned at the midpoint of the scan line (SLn) formed on the illuminated surface.

Description

圖案描繪裝置及圖案描繪方法Pattern drawing device and pattern drawing method

本發明係關於以照射於對象物被照射面上之光束之點光進行掃描,以描繪曝光出既定圖案的光束掃描裝置、光束掃描方法、及描繪裝置。The present invention relates to a light beam scanning device, a light beam scanning method, and a drawing device that scan a predetermined pattern by scanning the spot light of a beam irradiated on an irradiated surface of an object.

一直以來,作為事務用高速印表機,廣為人知的是一邊將雷射光束之點光投射於感光筒等之被照射體(對象物)、一邊藉由旋轉多面鏡沿主掃描線進行點光之一維方向主掃描,並使被照射體往與主掃描線方向正交之副掃描方向移動,以在被照射體上描繪出所欲之圖案及圖像(文字、圖形、照片等)。As a high-speed printer for business use, it is widely known to project the spot light of a laser beam onto an illuminated body (object) such as a photosensitive drum, and to use a rotating polygon mirror to point light along the main scanning line. One-dimensional main scanning, and moving the illuminated object in the sub-scanning direction orthogonal to the main scanning line to draw the desired pattern and image (text, graphics, photos, etc.) on the illuminated object.

於特開平8-11348號公報中,揭示一種用以調整光束之主掃描線之傾斜的光束掃描裝置。特開平8-11348號公報中記載之光束掃描裝置,具備往光束之照射方向傾斜之板片、與載置在板片上之光學單元,此板片被載置在本體上。藉由使板片相對本體往主掃描方向旋轉,據以使光學單元旋轉以調整主掃描線之傾斜。由於此調整,主掃描線之中點之兩側長度會變得不同,因此再藉由使光學單元相對板片往主掃描方向旋轉,據以將主掃描線之中點之兩側長度調整成相等。而掃描線本身之二維位置偏移或主掃描線方向之倍率誤差,則以距光學單元之感光體之距離調整或沿主掃描線描繪之寫入時機之電性控制來加以修正。又,光學單元,在內部一體的具備射出為進行描繪而經調變之光束的光源、將該光束變為平行光的準直透鏡、旋轉多面鏡、及fθ透鏡。Japanese Patent Laid-Open No. 8-11348 discloses a beam scanning device for adjusting the tilt of the main scanning line of the beam. The beam scanning device described in JP-A-8-11348 has a plate inclined in the direction of beam irradiation, and an optical unit placed on the plate, and the plate is placed on the main body. By rotating the plate relative to the main body in the main scanning direction, the optical unit is rotated to adjust the tilt of the main scanning line. Due to this adjustment, the length of the two sides of the midpoint of the main scanning line will become different, so by rotating the optical unit relative to the plate in the main scanning direction, the length of the two sides of the midpoint of the main scanning line is adjusted to equal. The two-dimensional position offset of the scanning line itself or the magnification error in the direction of the main scanning line is corrected by adjusting the distance from the photoreceptor of the optical unit or the electrical control of the writing timing drawn along the main scanning line. In addition, the optical unit integrally includes a light source that emits a light beam modulated for drawing, a collimator lens that turns the light beam into parallel light, a rotating polygon mirror, and an fθ lens.

然而,於特開平8-11348號公報,係以遠離主掃描線之位置為中心使光學單元旋轉,因此為調整主掃描線之傾斜,必須進行複數階段之調整(板片相對本體之旋轉調整、光學單元相對板片之旋轉調整、光學單元距感光體之距離調整、以及描繪之寫入時序之修正等)。尤其是,使用波長400nm以下之紫外線光束之點光,精密描繪最小線幅數μm~數十μm程度之圖案的電子元件用光束掃描裝置,由於有在圖案描繪之進行中微調掃描線傾斜(主掃描線方向相對與副掃描方向正交之方向之傾斜)的情形,因此期望能簡單的調整掃描線之傾斜。本件發明之實施形態,即能解決此課題。However, in Japanese Patent Application Laid-Open No. 8-11348, the optical unit is rotated around a position away from the main scanning line. Therefore, in order to adjust the tilt of the main scanning line, multiple stages of adjustment (rotation adjustment of the plate relative to the main body, The rotation adjustment of the optical unit relative to the plate, the adjustment of the distance between the optical unit and the photosensitive body, and the correction of the writing timing of the drawing, etc.). In particular, the beam scanning device for electronic components that uses a spot light of an ultraviolet beam with a wavelength of 400nm or less to accurately draw a pattern with a minimum line width of μm to several tens of μm, due to the fine adjustment of the scanning line tilt during the pattern drawing (main The scanning line direction is relative to the direction orthogonal to the sub-scanning direction), so it is desirable to be able to adjust the scanning line tilt easily. The embodiment of the present invention can solve this problem.

本發明第1態樣之光束掃描裝置,係一邊將來自光源裝置之光束之點光投射於對象物之被照射面、一邊使該點光於該被照射面上進行一維掃描:入射光學構件,供來自該光源裝置之該光束入射;掃描用偏向構件,使來自該入射光學構件之該光束為進行該一維掃描而偏向;投射光學系,使經偏向之該光束入射後投射於該被照射面;以及支承架,支承該入射光學構件、該掃描用偏向構件及該投射光學系,可繞與照射中心軸在既定容許範圍内成同軸之第1旋轉中心軸旋轉,該照射中心軸係相對該被照射面垂直通過以該點光之掃描在該被照射面上形成之掃描線上之特定點。The light beam scanning device of the first aspect of the present invention projects the spot light of the light beam from the light source device on the illuminated surface of the object, while causing the spot light to perform one-dimensional scanning on the illuminated surface: incident optical member , For the light beam from the light source device to enter; a scanning deflection member to deflect the light beam from the incident optical member for the one-dimensional scanning; a projection optical system to cause the deflected light beam to enter and be projected on the Irradiation surface; and a support frame that supports the incident optical member, the scanning deflection member and the projection optical system, and is rotatable about a first rotation center axis coaxial with the irradiation center axis within a predetermined allowable range, the irradiation center axis system A specific point on a scanning line formed on the illuminated surface by scanning the spot light is perpendicular to the illuminated surface.

本發明第2態樣之一種光束掃描裝置,係一邊將來自光源裝置之光束之點光照射於對象物之被照射面上、一邊進行該點光於該被照射面上之一維掃描,其具備:入射光學構件,供來自該光源裝置之該光束入射;掃描用偏向構件,使來自該入射光學構件之該光束為進行該一維掃描而偏向;投射光學系,使經偏向之該光束入射後投射於該被照射面;以及像旋轉光學系,設在該被照射面與該投射光學系之間,使因該點光之掃描而在該被照射面上形成之掃描線繞旋轉中心軸旋轉,該旋轉中心軸係與相對該被照射面垂直通過掃描線上之特定點的照射中心軸在既定容許範圍内同軸。A light beam scanning device according to the second aspect of the present invention irradiates the spot light of the light beam from the light source device on the illuminated surface of the object while performing one-dimensional scanning of the spot light on the illuminated surface. Equipped with: an incident optical member for the light beam from the light source device to enter; a scanning deflection member to deflect the light beam from the incident optical member for the one-dimensional scanning; and a projection optical system to cause the deflected light beam to enter And the image rotating optical system is arranged between the irradiated surface and the projection optical system, so that the scanning line formed on the irradiated surface due to the scanning of the spot light around the central axis of rotation For rotation, the rotation center axis is coaxial with the irradiation center axis perpendicular to the irradiated surface and passing through a specific point on the scan line within a predetermined allowable range.

本發明第3態樣之光束掃描方法,係使用光束掃描裝置一邊將來自光源裝置之光束之點光投射於對象物之被照射面、一邊進行該點光在該被照射面上之一維掃描,其包含:使來自光源裝置之該光束入射該光束掃描裝置的入射步驟;使入射之該光束為進行該一維掃描而偏向的偏向步驟;使經偏向之該光束入射後投射於該被照射面的投射步驟;以及使因該點光之掃描而在該被照射面上形成之掃描線繞旋轉中心軸旋轉的步驟,該旋轉中心軸係與相對該被照射面垂直通過掃描線上之特定點的照射中心軸在既定容許範圍内同軸。The beam scanning method of the third aspect of the present invention uses a beam scanning device to project the spot light of the beam from the light source device on the illuminated surface of the object while performing one-dimensional scanning of the spot light on the illuminated surface , Including: the incident step of making the light beam from the light source device enter the beam scanning device; the deflection step of making the incident light beam deflect for the one-dimensional scanning; making the deflected light beam incident and projected on the illuminated The step of projecting the surface; and the step of rotating the scan line formed on the illuminated surface due to the scanning of the spot light about the rotation center axis, the rotation center axis being perpendicular to the specific point on the illuminated surface passing through the scan line The central axis of the irradiation is coaxial within the established allowable range.

本發明第4態樣之描繪裝置,係一邊將來自光源裝置之光束之點光投射於對象物之被照射面、一邊進行該點光在該被照射面上之一維掃描,其具備:入射光學構件,供來自該光源裝置之該光束入射;掃描用偏向構件,使來自該入射光學構件之該光束為進行該一維掃描而偏向;投射光學系,使經偏向之該光束入射後投射於該被照射面;支承架,支承該入射光學構件、該掃描用偏向構件及該投射光學系;旋轉支承機構,將該支承架以能繞與該被照射面之法線平行之第1旋轉中心軸旋轉的狀態,支承於裝置本體;以及光導入光學系,以入射該入射光學構件之該光束之入射軸與該第1旋轉中心軸在既定容許範圍内成同軸之方式,將來自該光源裝置之該光束導向該入射光學構件。The drawing device according to the fourth aspect of the present invention projects the spot light of the light beam from the light source device on the illuminated surface of the object while performing one-dimensional scanning of the spot light on the illuminated surface, and has: An optical component for the light beam from the light source device to enter; a scanning deflection component to deflect the light beam from the incident optical component for the one-dimensional scanning; a projection optical system to cause the deflected light beam to enter and project on The irradiated surface; a support frame, which supports the incident optical member, the scanning deflection member, and the projection optical system; a rotating support mechanism, the support frame to be able to wrap around the first rotation center parallel to the normal to the irradiated surface The shaft is rotated and supported by the main body of the device; and the light introduction optical system, so that the incident axis of the light beam incident on the incident optical member is coaxial with the first rotation center axis within a predetermined allowable range, and the light source device The light beam is directed to the incident optical component.

本發明第5態樣之描繪裝置,係一邊將來自光源裝置之光束之點光投射於對象物之被照射面、一邊進行該點光在該被照射面上之一維掃描,其具備:掃描用偏向構件,使來自該光源裝置之該光束為進行該一維掃描而偏向;投射光學系,使經偏向之該光束入射後投射於該被照射面;支承架,支承該掃描用偏向構件、及該投射光學系;以及結合構件,在將通過因該點光之掃描而在該被照射面上形成之掃描線上之特定點的該被照射面之法線設為照射中心軸時,以該支承架對裝置本體之支承部分被限制在從該照射中心軸之既定半徑内區域之方式,將該支承架與該裝置本體加以結合。The drawing device according to the fifth aspect of the present invention is to perform one-dimensional scanning of the spot light on the illuminated surface while projecting the spot light of the light beam from the light source device on the illuminated surface, and it includes: scanning A deflecting member is used to deflect the light beam from the light source device for the one-dimensional scanning; a projection optical system is used to cause the deflected light beam to enter and project on the illuminated surface; a support frame to support the deflecting member for scanning, And the projection optical system; and the coupling member, when the normal line of the irradiated surface passing through a specific point on the scanning line formed on the irradiated surface due to the scanning of the spot light is set as the irradiation center axis, the The support frame is combined with the device body in such a way that the support portion of the device body by the support frame is limited to a predetermined radius from the irradiation center axis.

本發明第6態樣之光束掃描裝置,其一邊將投射於對象物被照射面之光束於該被照射面上會聚成點光、一邊進行該點光之一維掃描,其具備:偏向構件,使入射光束反射、並使反射光束在既定角度之範圍内偏向,據以進行該點光之掃描;送光光學系,使該入射光束朝向該偏向構件;以及投射光學系,使來自該送光光學系之該入射光束入射後投射向該偏向構件,並使該反射光束入射後將該反射光束之該點光投射於該被照射面。A light beam scanning device according to a sixth aspect of the present invention is configured to perform one-dimensional scanning of the spot light while converging the light beam projected on the irradiated surface of the object into a spot light on the irradiated surface, and includes: a deflection member, The incident light beam is reflected and the reflected light beam is deflected within a predetermined angle range, so as to scan the spot light; the light transmitting optical system, the incident light beam is directed to the deflecting member; and the projection optical system, the light transmitted from the The incident light beam of the optical system is incident and then projected to the deflecting member, and after the reflected light beam is incident, the spot light of the reflected light beam is projected onto the illuminated surface.

本發明第7態樣之描繪裝置,係進行投射於對象物被照射面之光束之一維掃描以描繪既定圖案,其具備:偏向構件,使該光束為進行一維掃描而偏向;送光光學系,使來自光源裝置之該光束入射、並使之朝向該偏向構件;以及投射光學系,使來自該送光光學系之該光束入射後投射於該偏向構件、並將被該偏向構件反射之該光束投射於該被照射面。The drawing device of the seventh aspect of the present invention performs one-dimensional scanning of a light beam projected on the irradiated surface of an object to draw a predetermined pattern, and includes: a deflecting member to deflect the light beam for one-dimensional scanning; and light transmitting optics System, the light beam from the light source device is incident and directed toward the deflection member; and the projection optical system, the light beam from the light sending optical system is incident on the deflection member and reflected by the deflection member The light beam is projected on the illuminated surface.

本發明第8態樣之描繪裝置,係將投射於被照射體之描繪用光束藉由旋轉多面鏡之旋轉反覆進行掃描,以在該被照射體上描繪既定圖案,其具備:原點檢測部,在偵測到該旋轉多面鏡之複數個反射面中、與反射該描繪用光束之第1反射面不同之第2反射面成為既定角度位置時,產生原點訊號;以及控制裝置,以該原點訊號產生後到該第2反射面成為該第1反射面為止之該旋轉多面鏡之旋轉速度決定之既定時間為基準,以從該原點訊號產生後既定之延遲的時序,指示以該描繪用光束進行之描繪開始。The drawing device of the eighth aspect of the present invention scans the drawing light beam projected on the illuminated object by the rotation of the rotating polygon mirror repeatedly to draw a predetermined pattern on the illuminated object, and includes: an origin detection unit , When detecting that the second reflecting surface of the plurality of reflecting surfaces of the rotating polygon mirror, which is different from the first reflecting surface reflecting the drawing beam, becomes the predetermined angle position, the origin signal is generated; and the control device uses the After the origin signal is generated, until the second reflecting surface becomes the first reflecting surface, the predetermined time determined by the rotation speed of the rotating polygon mirror is used as the reference, and the predetermined time delay after the origin signal is generated is used to indicate the The drawing with the light beam starts.

針對本發明態樣之光束掃描裝置、光束掃描方法及描繪裝置,舉較佳實施形態、並參照所附圖面詳細說明如下。又,本發明之態樣,當然不限定於此等實施形態,亦包含各種變化或施以改良者。也就是說,以下所記載之構成要素中,包含發明所屬技術領域中具有通常知識者容易思及之物、以及實質上相同之物,以下記載之構成要素亦可適當的加以組合。此外,在不脫離本發明要旨之範圍內可進行構成要素之各種省略、置換或變更。With regard to the beam scanning device, beam scanning method, and drawing device of the aspect of the present invention, preferred embodiments are described in detail below with reference to the drawings. In addition, the aspect of the present invention is of course not limited to these embodiments, and includes various changes or improvements. In other words, the constituent elements described below include things that can be easily thought of by a person having ordinary knowledge in the technical field to which the invention belongs, and things that are substantially the same, and the constituent elements described below may be combined as appropriate. In addition, various omissions, replacements, or changes of constituent elements can be made without departing from the scope of the present invention.

圖1係包含對實施形態之基板(被照射體對象物)FS施以曝光處理之曝光裝置EX之元件製造系統10的概略構成圖。又,以下之說明中,若未特別指明,係設定一以重力方向為Z方向之XYZ正交座標系,依圖中所示之箭頭,說明X方向、Y方向、及Z方向。FIG. 1 is a schematic configuration diagram of an element manufacturing system 10 including an exposure apparatus EX that applies exposure processing to a substrate (irradiated object) FS of the embodiment. In addition, in the following description, unless otherwise specified, an XYZ orthogonal coordinate system with the direction of gravity as the Z direction is set, and the X direction, Y direction, and Z direction are described according to the arrows shown in the figure.

元件製造系統10,例如,係建構有製造作為電子元件之可撓性顯示器、可撓性配線、可撓性感測器等之製造線的製造系統。以下,作為前提,係以作為電子元件之可撓性顯示器來進行說明。作為可撓性顯示器,有例如有機EL顯示器、液晶顯示器等。元件製造系統10,具有將可撓性之片狀基板(片材基板)FS捲繞成捲筒狀之未圖示的供應捲送出基板FS,在對送出之基板FS連續的施以各種處理後,將各種處理後之基板FS以未圖示之回收捲加以捲繞之所謂的捲對捲(Roll To Roll)方式的構造。基板FS,具有以基板FS之移動方向為長邊方向(長條)、寬度方向為短邊方向(短條)之帶狀形狀。經各種處理後之基板FS,成為複數個電子元件沿長邊方向連接之狀態,為可取多面用之基板。從前述供應捲送來之基板FS,依序被以處理裝置PR1、曝光裝置EX、及處理裝置PR2等施以各種處理後,以前述回收捲加以捲繞。The component manufacturing system 10 is, for example, a manufacturing system constructed with a manufacturing line for manufacturing flexible displays, flexible wirings, flexible sensors, etc. as electronic components. Hereinafter, as a premise, a flexible display as an electronic component will be explained. As the flexible display, there are, for example, an organic EL display, a liquid crystal display, and the like. The component manufacturing system 10 has a supply roll (not shown) in which a flexible sheet substrate (sheet substrate) FS is wound into a roll to send out the substrate FS, and then continuously perform various processes on the sent substrate FS , The so-called roll to roll (Roll   To   Roll) structure in which the substrate FS after various treatments is wound in a recovery roll (not shown). The substrate FS has a strip shape in which the moving direction of the substrate FS is the long side direction (long strip) and the width direction is the short side direction (short strip). After various treatments, the substrate FS becomes a state where a plurality of electronic components are connected along the longitudinal direction, and it is a multi-sided substrate. The substrate FS sent from the aforementioned supply roll is sequentially subjected to various treatments by the processing device PR1, the exposure device EX, and the processing device PR2, etc., and then wound with the aforementioned recovery roll.

又,X方向係於水平面内、從處理裝置PR1經曝光裝置EX朝向處理裝置PR2之方向(搬送方向)。Y方向係於水平面内、與X方向正交之方向,為基板FS之寬度方向(短邊方向)。Z方向係與X方向及Y方向正交之方向(上方向),與重力作用之方向平行。In addition, the X direction is a direction (conveying direction) from the processing device PR1 to the processing device PR2 via the exposure device EX in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction (short side direction) of the substrate FS. The Z direction is the direction orthogonal to the X direction and the Y direction (upward direction), and parallel to the direction of gravity.

基板FS,例如係使用由樹脂薄膜、或不鏽鋼等之金屬或合金形成之箔(foil)等。作為樹脂薄膜之材質,可使用至少包含例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物樹脂、聚氯乙烯樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、聚乙烯醇樹脂等材料中之一種以上者。此外,基板FS之厚度及剛性(楊氏係數),只要是在通過曝光裝置EX之搬送路徑時不會於基板FS產生因彎折造成之折痕及非可逆的皺褶之範圍即可。作為基板FS之母材,厚度25μm~200μm程度之PET(聚對苯二甲酸乙二酯纖維)或PEN(聚萘二甲酸乙二醇酯)等之薄膜,是非常合適之片材基板的典型。The substrate FS uses, for example, a foil made of a resin film, or a metal or alloy such as stainless steel. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, One or more of materials such as polycarbonate resin, polystyrene resin, and polyvinyl alcohol resin. In addition, the thickness and rigidity (Young's coefficient) of the substrate FS may be within a range that does not produce creases and irreversible wrinkles due to bending on the substrate FS when passing through the conveying path of the exposure device EX. As the base material of substrate FS, PET (polyethylene terephthalate fiber) or PEN (polyethylene naphthalate) film with a thickness of about 25μm~200μm is a very suitable typical sheet substrate .

基板FS,由於在以處理裝置PR1、曝光裝置EX及處理裝置PR2實施之各處理中會有受熱之情形,因此以選擇熱膨脹係數不會顯著變大材質之基板FS較佳。例如,可藉由將無機填料混合於樹脂薄膜來抑制熱膨脹係數。無機填料,可以是例如氧化鈦、氧化鋅、氧化鋁、或氧化矽等。此外,基板FS可以是以浮製法等製造之厚度100μm程度之極薄玻璃之單層體、或於此極薄玻璃貼合上述樹脂薄膜、或箔等的積層體。Since the substrate FS may be heated during each process performed by the processing device PR1, the exposure device EX, and the processing device PR2, it is better to select a substrate FS with a material whose thermal expansion coefficient does not increase significantly. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler in a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. In addition, the substrate FS may be a single layer of ultra-thin glass with a thickness of about 100 μm manufactured by a float method or the like, or a laminate of the above-mentioned resin film, foil, or the like bonded to this ultra-thin glass.

又,基板FS之可撓性(flexibility),係指對基板FS施加本身重量程度之力亦不致於產生剪斷或斷裂、而能使該基板FS撓曲的性質。而可撓性亦包含因自重程度之力而彎曲之性質。又,可撓性之程度會因基板FS之材質、大小、厚度、基板FS上成膜之層構造、溫度、濕度及環境等而改變。無論何者,只要是在將基板FS正確的捲繞於設在本實施形態之元件製造系統10内之搬送路之各種搬送用捲筒、旋轉筒等搬送方向轉換用構件時,不會彎折而產生摺痕、破損(產生破洞或裂開),能順暢的搬送基板FS的話,皆為可撓性之範圍。In addition, the flexibility of the substrate FS refers to the property that a force of its own weight is applied to the substrate FS without shearing or breaking, and the substrate FS can be flexed. Flexibility also includes the nature of bending due to the force of its own weight. In addition, the degree of flexibility varies with the material, size, thickness of the substrate FS, the layer structure of the film formed on the substrate FS, temperature, humidity, and environment. In any case, as long as the substrate FS is correctly wound on various conveying reels, rotating drums, and other conveying direction switching members provided in the conveying path in the component manufacturing system 10 of this embodiment, it will not bend and Creases and breakages (holes or cracks are generated), and the substrate FS can be transported smoothly, it is within the range of flexibility.

處理裝置PR1,係對以曝光裝置EX進行曝光處理之基板FS進行前製程之處理。處理裝置PR1將經前製程之處理的基板FS送向曝光裝置EX。藉由此前製程之處理,被送往曝光裝置EX之基板FS,即成為其表面形成有感光性功能層(感光層)之基板(感光基板)FS。The processing device PR1 is to perform pre-process processing on the substrate FS exposed by the exposure device EX. The processing device PR1 sends the substrate FS processed by the previous process to the exposure device EX. Through the processing of this previous process, the substrate FS sent to the exposure device EX becomes the substrate (photosensitive substrate) FS on which the photosensitive functional layer (photosensitive layer) is formed.

此感光性功能層,係以溶液之形式塗布於基板FS上,經由乾燥成為層(膜)。典型的感光性功能層,有光阻劑(液狀或乾薄膜狀)作為顯影處理後無需之材料,在受紫外線照射之部分之親撥液性經改質之感光性矽烷耦合劑(SAM)、或受紫外線照射之部分露出鍍敷還元基之感光性還元材等。作為感光性機能層使用感光性矽烷耦合劑時,由於基板FS上被紫外線曝光之圖案部分由撥液性被改質為親液性。因此可在成為親液性之部分上選擇性塗布導電性墨水(含有銀或銅等導電性奈米粒子之墨水)、或含有半導體材料之液體等,據以形成構成薄膜電晶體(TFT)等之電極、半導體、絕緣、或作為連接用配線或電極之圖案層。作為感光性機能層使用感光性還元材時,由於會在基板FS上被紫外線曝光之圖案部分露出鍍敷還元基。因此,曝光後,立即將基板P浸漬於含鈀離子等之鍍敷液中一定時間,以形成(析出)鈀之圖案層。此種鍍敷處理,在以作為添加劑(additive)式處理、除此之外、作為減色(subtractive)式處理之蝕刻處理為前提之情形時,被送至曝光裝置EX之基板FS,可以是以PET或PEN為母材,於其表面全面或選擇性的蒸鍍鋁(Al)或銅(Cu)等之金屬製薄膜,再於其上積層光阻劑層者。This photosensitive functional layer is coated on the substrate FS in the form of a solution, and becomes a layer (film) after drying. A typical photosensitive functional layer has a photoresist (liquid or dry film) as a material that is not needed after development, and a liquid-philic and modified photosensitive silane coupling agent (SAM) in the part irradiated by ultraviolet rays. , Or the part irradiated by ultraviolet light exposes the photosensitive reduction material of the plating reduction base, etc. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern part on the substrate FS exposed to ultraviolet rays is changed from liquid repellency to lyophilic. Therefore, conductive ink (an ink containing conductive nano particles such as silver or copper) or a liquid containing semiconductor material can be selectively coated on the lyophilic part to form thin film transistors (TFT), etc. The electrode, semiconductor, insulation, or pattern layer for connecting wiring or electrodes. When a photosensitive reducing material is used as a photosensitive functional layer, the plating reducing base will be exposed on the pattern part exposed by ultraviolet rays on the substrate FS. Therefore, immediately after exposure, the substrate P is immersed in a plating solution containing palladium ions or the like for a certain period of time to form (precipitate) a patterned layer of palladium. When this kind of plating treatment is based on the premise of an additive treatment, in addition to an etching treatment as a subtractive treatment, the substrate FS sent to the exposure device EX may be PET or PEN is a base material on which a metal film such as aluminum (Al) or copper (Cu) is completely or selectively deposited on its surface, and then a photoresist layer is laminated on it.

本實施形態中,曝光裝置EX係不使用光罩之直接描繪方式之曝光裝置、所謂的逐線掃描(raster scan)方式之曝光裝置,對從處理裝置PR1供應之基板FS之被照射面(感光面)對應用以形成顯示器用電子元件、電路或配線等之既定圖案的光圖案。曝光裝置EX,一邊將基板FS往+X方向(副掃描方向)搬送、一邊以曝光用之光束LB之點光SP在基板FS之被照射面上於既定掃描方向(Y方向)進行一維掃描(主掃描),根據圖案資料(描繪資料)高速調變(ON/OFF)點光SP之強度,詳情將於後敘。據此,於基板FS之被照射面描繪曝光出對應電子元件、電路或配線等既定圖案之光圖案。也就是說,透過基板FS之副掃描與點光SP之主掃描,點光SP在基板FS之被照射面上相對的進行二維掃描,於基板FS描繪曝光出既定圖案。又,由於電子元件係重疊複數個圖案層(形成有圖案之層)構成,因此藉由曝光裝置EX使對應各層之圖案曝光。In this embodiment, the exposure device EX is an exposure device of a direct drawing method that does not use a mask, and an exposure device of the so-called raster scan method. It responds to the irradiated surface (photosensitive) of the substrate FS supplied from the processing device PR1. Surface) corresponds to a light pattern used to form a predetermined pattern of electronic components, circuits or wiring for displays. The exposure device EX, while transporting the substrate FS in the +X direction (sub-scanning direction), uses the spot light SP of the exposure beam LB to perform one-dimensional scanning on the illuminated surface of the substrate FS in the predetermined scanning direction (Y direction) ( Main scan), according to the pattern data (drawing data) high-speed modulation (ON/OFF) of the intensity of the spot light SP, details will be described later. According to this, a light pattern corresponding to a predetermined pattern such as an electronic component, circuit, or wiring is drawn and exposed on the illuminated surface of the substrate FS. That is to say, through the sub-scanning of the substrate FS and the main scanning of the spot light SP, the spot light SP performs a two-dimensional scan on the illuminated surface of the substrate FS, and a predetermined pattern is drawn and exposed on the substrate FS. In addition, since the electronic component is composed of overlapping a plurality of pattern layers (layers with patterns), the patterns corresponding to each layer are exposed by the exposure device EX.

處理裝置PR2,係對以曝光裝置EX進行曝光處理後之基板FS進行後製程之處理(例如鍍敷處理及顯影、蝕刻處理等)。藉由此後製程之處理,於基板FS上形成電子元件之圖案層。又,由於電子元件係複數個圖案層重疊構成,因此在藉由元件製造系統10之各處理於第1層形成圖案後,再度,經元件製造系統10之各處理,於第2層形成圖案。The processing device PR2 performs post-process processing (such as plating processing, development, etching processing, etc.) on the substrate FS after exposure processing by the exposure device EX. Through the processing of the subsequent process, the pattern layer of the electronic device is formed on the substrate FS. In addition, since the electronic component is formed by overlapping multiple pattern layers, after each process of the device manufacturing system 10 is used to form a pattern on the first layer, the device manufacturing system 10 performs each process again to form a pattern on the second layer.

接著,詳細說明曝光裝置EX。曝光裝置EX被收納在調溫室ECV内。此調溫室ECV,藉由將内部保持於既定溫度,以抑制在内部搬送之基板FS因溫度而產生之形狀變化。調溫室ECV透過被動或主動式防振單元SU1、SU2配置在製造工廠之設置面E。防振單元SU1、SU2,降低來自設置面E之振動。此設置面E可以是工廠之地面本身、亦可以是為做出水平面而在地面上設置之設置底座(pedestal)上之面。曝光裝置EX,至少具備基板搬送機構12、光源裝置(脈衝光源裝置)14、曝光頭16、控制裝置18、以及複數個對準顯微鏡ALG(ALG1~ALG4)。Next, the exposure apparatus EX will be described in detail. The exposure device EX is housed in the chamber ECV. The temperature-controlled ECV keeps the inside at a predetermined temperature to suppress the change in the shape of the substrate FS conveyed inside due to temperature. The greenhouse ECV is configured on the setting surface E of the manufacturing plant through passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1 and SU2 reduce the vibration from the installation surface E. The installation surface E may be the ground of the factory itself, or it may be a surface on a pedestal installed on the ground to create a horizontal plane. The exposure device EX includes at least a substrate transport mechanism 12, a light source device (pulse light source device) 14, an exposure head 16, a control device 18, and a plurality of alignment microscopes ALG (ALG1 to ALG4).

基板搬送機構12,將從處理裝置PR1搬送來之基板FS在曝光裝置EX内以既定速度搬送後,以既定速度送出至處理裝置PR2。藉由此基板搬送機構12,規定在曝光裝置EX内搬送之基板FS之搬送路徑。基板搬送機構12,從基板FS之搬送方向上游側(-X方向側)起依序具有邊緣位置控制器EPC、驅動滾輪R1、張力調整滾輪RT1、旋轉筒(圓筒)DR、張力調整滾輪RT2、驅動滾輪R2、及驅動滾輪R3。The substrate transport mechanism 12 transports the substrate FS transported from the processing apparatus PR1 at a predetermined speed in the exposure apparatus EX, and then sends it to the processing apparatus PR2 at a predetermined speed. With this substrate transport mechanism 12, the transport path of the substrate FS transported in the exposure apparatus EX is defined. The substrate transport mechanism 12 has an edge position controller EPC, a drive roller R1, a tension adjustment roller RT1, a rotating drum (cylinder) DR, and a tension adjustment roller RT2 in order from the upstream side (-X direction side) of the substrate FS in the transport direction , Drive roller R2, and drive roller R3.

邊緣位置控制器EPC,係用以調整從處理裝置PR1搬送而來之基板FS在寬度方向(Y方向、基板FS之短邊方向)之位置。也就是說,邊緣位置控制器EPC係使基板FS往寬度方向移動來調整基板FS在寬度方向之位置,以使被以既定張力之狀態搬送而來之基板FS之寬度方向之端部(邊緣)之位置,相對目標位置能控制在±十數μm~數十μm程度之範圍(容許範圍)。邊緣位置控制器EPC,具有張掛基板FS滾輪、與檢測基板FS之寬度方向端部(邊緣)之位置之未圖示的邊緣感測器(端部檢測部),根據邊緣感測器檢測之檢測訊號,使邊緣位置控制器EPC之前述滾輪往Y方向移動,以調整基板FS在寬度方向之位置。驅動滾輪R1,一邊保持從邊緣位置控制器EPC搬送而來之基板FS之表背兩面、一邊旋轉,將基板FS搬送向旋轉筒DR。又,邊緣位置控制器EPC,可適當調整邊緣位置控制器EPC之滾輪之旋轉軸與Y軸之平行度,以修正基板FS在寬度方向之位置、與基板FS在行進方向之傾斜誤差,使捲繞於旋轉筒DR之基板FS之長邊方向相對旋轉筒DR之中心軸AXo恆成正交。The edge position controller EPC is used to adjust the position of the substrate FS transported from the processing device PR1 in the width direction (the Y direction, the short side direction of the substrate FS). In other words, the edge position controller EPC moves the substrate FS in the width direction to adjust the position of the substrate FS in the width direction so that the width direction end (edge) of the substrate FS is conveyed under a predetermined tension. The position relative to the target position can be controlled within a range of ± tens of μm to tens of μm (allowable range). The edge position controller EPC has a roll of the substrate FS and an edge sensor (end detection part) not shown to detect the position of the width direction end (edge) of the substrate FS. The detection is performed by the edge sensor The signal moves the aforementioned roller of the edge position controller EPC to the Y direction to adjust the position of the substrate FS in the width direction. The driving roller R1 rotates while holding the front and back surfaces of the substrate FS transferred from the edge position controller EPC, and transfers the substrate FS to the rotating drum DR. In addition, the edge position controller EPC can appropriately adjust the parallelism between the rotation axis of the roller of the edge position controller EPC and the Y axis to correct the position of the substrate FS in the width direction and the tilt error of the substrate FS in the travel direction, so that the roll The longitudinal direction of the substrate FS around the rotating drum DR is always orthogonal to the central axis AXo of the rotating drum DR.

旋轉筒DR,具有延伸於Y方向且延伸於與重力作用之Z方向交叉之方向的中心軸AXo、與距中心軸AXo一定半徑的圓筒狀外周面,一邊順著外周面(圓周面)將基板FS之一部分支承於長邊方向、一邊以中心軸AXo為中心旋轉將基板FS往+X方向搬送。旋轉筒DR,將來自曝光頭16之光束LB(點光SP)投射之基板FS上的曝光區域(部分)以該圓周面加以支承。於旋轉筒DR之Y方向兩側,具有以繞中心軸AXo旋轉之方式被環狀軸承支承之軸Sft。此軸Sft,被賦予來自以控制裝置18控制之未圖示的旋轉驅動源(例如,馬達或減速機構等)之旋轉力矩而繞中心軸AXo旋轉。又,為方便起見,將包含中心軸AXo、與YZ面平行之面稱為中心面PR1。The rotating drum DR has a central axis AXo extending in the Y direction and extending in the direction intersecting the Z direction of gravity, and a cylindrical outer peripheral surface with a certain radius from the central axis AXo. While moving along the outer peripheral surface (circumferential surface) A part of the substrate FS is supported in the longitudinal direction, while rotating around the center axis AXo, the substrate FS is transported in the +X direction. The rotating drum DR supports the exposure area (part) on the substrate FS on which the light beam LB (spot light SP) from the exposure head 16 is projected on the circumferential surface. On both sides of the rotating cylinder DR in the Y direction, there are shafts Sft supported by annular bearings to rotate around the central axis AXo. This shaft Sft is given a rotational torque from a rotation drive source (for example, a motor or a deceleration mechanism, etc.) not shown, which is controlled by the control device 18, to rotate around the central axis AXo. In addition, for convenience, the plane including the center axis AXo and parallel to the YZ plane is referred to as the center plane PR1.

驅動滾輪R2、R3,沿基板FS之搬送方向(+X方向)相距既定間隔配置,對曝光後之基板FS賦予既定鬆弛。驅動滾輪R2、R3與驅動滾輪R1同樣的,一邊保持基板FS之表背兩面一邊旋轉,將基板FS搬送向處理裝置PR2。驅動滾輪R2、R3,相對旋轉筒DR設置在搬送方向之下游側(+X方向側),此驅動滾輪R2相對驅動滾輪R3設置在搬送方向之上游側(-X方向側)。張力調整滾輪RT1、RT2,被彈壓向-Z方向,對捲繞支承於旋轉筒DR之基板FS於長邊方向賦予既定張力。據此,使作用於旋轉筒DR之對基板FS賦予之長邊方向之張力,在既定範圍内安定化。又,控制裝置18藉控制未圖示之旋轉驅動源(例如,馬達或減速機等),使驅動滾輪R1~R3旋轉。The driving rollers R2 and R3 are arranged at a predetermined interval along the conveying direction (+X direction) of the substrate FS to give a predetermined slack to the substrate FS after exposure. The driving rollers R2 and R3, like the driving roller R1, rotate while holding the front and back surfaces of the substrate FS, and convey the substrate FS to the processing device PR2. The drive rollers R2 and R3 are arranged on the downstream side (+X direction side) in the conveying direction relative to the rotating drum DR, and the drive roller R2 is arranged on the upstream side (−X direction side) in the conveying direction relative to the drive roller R3. The tension adjustment rollers RT1 and RT2 are squeezed in the -Z direction to apply a predetermined tension in the longitudinal direction to the substrate FS wound and supported by the rotating drum DR. Accordingly, the tension in the longitudinal direction applied to the substrate FS applied to the rotating drum DR is stabilized within a predetermined range. In addition, the control device 18 controls a rotation driving source (for example, a motor or a reducer, etc.) not shown to rotate the driving rollers R1 to R3.

光源裝置14具有光源(脈衝光源),射出脈衝狀之光束(脈衝光、雷射)LB。此光束LB係在370nm以下之波長帶具有峰值波長之紫外光,設光束LB之發光頻率為Fe。光源裝置14射出之光束LB,射入曝光頭16。光源裝置14依據控制裝置18之控制,以發光頻率Fe震盪出光束LB後射出。又,作為光源裝置14,可使用以發出紅外波長帶之脈衝光的半導體雷射元件、光纖增幅器、將經增幅之紅外波長帶之脈衝光轉換為紫外波長帶之脈衝光的波長轉換元件(高諧波產生元件)等構成之光纖增幅雷射光源。此場合,可獲得發光頻率(發振頻率)Fe為數百MHz、1脈衝光之發光時間為皮秒程度之高輝度的紫外線脈衝光。The light source device 14 has a light source (pulse light source), and emits a pulsed light beam (pulse light, laser) LB. The light beam LB is ultraviolet light with a peak wavelength in the wavelength band below 370 nm, and the emission frequency of the light beam LB is Fe. The light beam LB emitted from the light source device 14 enters the exposure head 16. According to the control of the control device 18, the light source device 14 oscillates and emits the light beam LB at the luminous frequency Fe. In addition, as the light source device 14, a semiconductor laser element that emits pulsed light in the infrared wavelength band, an optical fiber amplifier, and a wavelength conversion element that converts the amplified pulsed light in the infrared wavelength band into pulsed light in the ultraviolet wavelength band can be used ( High-harmonic generation components) and other optical fiber amplified laser light source. In this case, high-brightness ultraviolet pulse light with a luminous frequency (vibration frequency) Fe of several hundred MHz and a luminous time of one pulse of picoseconds can be obtained.

曝光頭16,具備光束LB分別入射之複數個光束掃描裝置MD(MD1~MD6)。曝光頭16,在被旋轉筒DR之圓周面支承之基板FS之一部分,藉由複數個光束掃描裝置MD1~MD6描繪既定圖案。曝光頭16,係排列相同構成之複數個光束掃描裝置MD1~MD6之所謂的多光束型曝光頭。由於曝光頭16係對基板FS重複進行電子元件用之圖案曝光,因此曝光出圖案之曝光區域W(1個電子元件之形成區域)係沿基板FS之長邊方向相距既定間隔設置複數個(參照圖3)。The exposure head 16 is provided with a plurality of beam scanning devices MD (MD1 to MD6) into which the beams LB are respectively incident. The exposure head 16 draws a predetermined pattern by a plurality of beam scanning devices MD1 to MD6 on a part of the substrate FS supported by the circumferential surface of the rotating drum DR. The exposure head 16 is a so-called multi-beam type exposure head in which a plurality of beam scanning devices MD1 to MD6 of the same configuration are arranged. Since the exposure head 16 repeatedly exposes the pattern for electronic components on the substrate FS, the exposure area W (the formation area of one electronic component) where the pattern is exposed is set at a predetermined interval along the longitudinal direction of the substrate FS (refer to image 3).

亦如圖2所示,奇數號之光束掃描裝置(光束掃描單元)MD1、MD3、MD5係相對中心面Poc配置在基板FS之搬送方向上游側(-X方向側)、且於Y方向並列配置。偶數號之光束掃描裝置(光束掃描單元)MD2、MD4、MD6係相對中心面Poc配置在基板FS之搬送方向下游側(+X方向側)、且於Y方向並列配置。奇數號之光束掃描裝置MD1、MD3、MD5與偶數號之光束掃描裝置MD2、MD4、MD6,相對中心面Poc對稱設置。As also shown in Figure 2, the odd-numbered beam scanning devices (beam scanning units) MD1, MD3, MD5 are arranged on the upstream side (-X direction side) of the substrate FS in the conveying direction relative to the center plane Poc, and are arranged side by side in the Y direction . The even-numbered beam scanning devices (beam scanning units) MD2, MD4, MD6 are arranged on the downstream side (+X direction side) of the substrate FS in the conveying direction relative to the central plane Poc, and are arranged side by side in the Y direction. The odd-numbered beam scanning devices MD1, MD3, MD5 and the even-numbered beam scanning devices MD2, MD4, MD6 are arranged symmetrically with respect to the center plane Poc.

光束掃描裝置MD,一邊將來自光源裝置14之光束LB以在基板FS之被照射面上會聚成點光SP之方式投射、一邊以該點光SP在基板FS之被照射面上沿既定直線的描繪線SLn進行一維掃描。複數個光束掃描裝置MD1~MD6之描繪線(掃描線)SLn,如圖2、圖3所示,係被設定為於Y方向(基板FS之寬度方向、掃描方向)在彼此不分離之情形下接合。以下,亦有將射入各光束掃描裝置MD(MD1~MD6)之光束LB稱為LB1~LB6之情形。射入此各光束掃描裝置MD(MD1~MD6)之光束LB(LB1~LB6),係偏光於既定方向之直線偏光(P偏光或S偏光)之光束,於本實施形態,係射入P偏光之光束。又,亦有將光束掃描裝置MD1之描繪線SLn稱為SL1、將光束掃描裝置MD2~MD6之描繪線SLn稱為SL2~SL6之情形。The light beam scanning device MD projects the light beam LB from the light source device 14 into a spot light SP on the illuminated surface of the substrate FS while projecting the spot light SP along a predetermined straight line on the illuminated surface of the substrate FS The drawing line SLn performs one-dimensional scanning. The drawing lines (scanning lines) SLn of the plurality of beam scanning devices MD1 to MD6, as shown in Figures 2 and 3, are set in the Y direction (the width direction of the substrate FS, the scanning direction) without being separated from each other Join. Hereinafter, the light beams LB that enter the respective beam scanning devices MD (MD1 to MD6) may also be referred to as LB1 to LB6. The beams LB (LB1 to LB6) that enter each beam scanning device MD (MD1 to MD6) are linearly polarized (P-polarized or S-polarized) beams that are polarized in a predetermined direction. In this embodiment, they enter P-polarized light. The beam. In addition, the drawing line SLn of the beam scanning device MD1 may be referred to as SL1, and the drawing lines SLn of the beam scanning devices MD2 to MD6 may be referred to as SL2 to SL6.

如圖3所示,以複數個光束掃描裝置MD1~MD6之全部覆蓋曝光區域W之寬度方向全部之方式,各光束掃描裝置MD(MD1~MD6)分擔掃描區域。據此,各光束掃描裝置MD(MD1~MD6),即能再被分割於基板FS之寬度方向之複數個區域之每一個描繪圖案。例如,若設1個光束掃描裝置MD之Y方向掃描寬度(描繪線SLn之長度)為30~60mm程度時,藉由將奇數號之光束掃描裝置MD1、MD3、MD5之3個、與偶數號之光束掃描裝置MD2、MD4、MD6之3個,合計6個光束掃描裝置MD配置於Y方向,將可描繪之Y方向寬度擴展至180~360mm程度。各描繪線SL1~SL6之長度,原則上相同。也就是說,沿描繪線SL1~SL6各個掃描之光束LB之點光SP之掃描距離相同。As shown in FIG. 3, each beam scanning device MD (MD1 to MD6) shares the scanning area so that all of the plurality of beam scanning devices MD1 to MD6 cover the entire width direction of the exposure area W. According to this, each beam scanning device MD (MD1 to MD6) can be further divided into a plurality of regions in the width direction of the substrate FS to draw a pattern. For example, if the Y-direction scanning width (length of the drawing line SLn) of one beam scanning device MD is set to be about 30-60 mm, the odd-numbered beam scanning devices MD1, MD3, MD5 and 3 of the even number The 3 beam scanning devices MD2, MD4, MD6, a total of 6 beam scanning devices MD are arranged in the Y direction, and the width of the Y direction that can be drawn is expanded to about 180-360mm. The length of each drawing line SL1 to SL6 is the same in principle. That is, the scanning distance of the spot light SP of the light beam LB scanned along the drawing lines SL1 to SL6 is the same.

又,實際之描繪線SLn(SL1~SL6),係設定為較點光SP在被照射面上可實際掃描之最大長度略短。例如,當設主掃描方向(Y方向)之描繪倍率在初期值(無倍率修正)時可圖案描繪之描繪線SLn之最大長為50mm時,點光SP在被照射面上之最大掃描長,係使描繪線SLn之掃描開始點側與掃描結束點側分別具有0.5mm程度之餘裕,而設定為51mm程度。藉由此種設定,在點光SP之最大掃描長51mm之範圍内,可將50mm之描繪線SLn之位置於主掃描方向微調整、或將描繪倍率予以微調整。In addition, the actual drawing line SLn (SL1 to SL6) is set to be slightly shorter than the maximum length that the spot light SP can actually scan on the illuminated surface. For example, when the drawing magnification in the main scanning direction (Y direction) is set at the initial value (without magnification correction), the maximum length of the drawing line SLn that can be patterned is 50mm, the maximum scanning length of the spot light SP on the illuminated surface, The scanning start point side and the scanning end point side of the drawing line SLn each have a margin of about 0.5 mm, and set to about 51 mm. With this setting, within the range of the maximum scanning length of the spot light SP of 51mm, the position of the 50mm drawing line SLn can be finely adjusted in the main scanning direction, or the drawing magnification can be finely adjusted.

描繪線SL1~SL6,夾著中心面Poc於旋轉筒DR之周方向配置成2行。奇數號之描繪線SL1、SL3、SL5,相對中心面Poc位在基板FS之搬送方向上游側(-X方向側)之基板FS之被照射面上。偶數號之描繪線SL2、SL4、SL6,相對中心面Poc位在基板FS之搬送方向下游側(+X方向側)之基板FS之被照射面上。描繪線SL1~SL6,於基板FS之寬度方向、也就是說、沿旋轉筒DR之中心軸AXo大致平行。The drawing lines SL1 to SL6 are arranged in two rows in the circumferential direction of the rotating drum DR, sandwiching the center plane Poc. The odd-numbered drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate FS on the upstream side (-X direction side) of the substrate FS in the conveying direction relative to the center plane Poc. The even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate FS on the downstream side (+X direction side) of the substrate FS in the conveying direction relative to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate FS, that is, along the central axis AXo of the rotating drum DR.

描繪線SL1、SL3、SL5,沿基板FS之寬度方向(掃描方向)相距既定間隔配置在直線上。描繪線SL2、SL4、SL6亦同樣的,沿基板FS之寬度方向(掃描方向)相距既定間隔配置在直線上。此時,描繪線SL2係於基板FS之寬度方向,配置在描繪線SL1與描繪線SL3之間。同樣的,描繪線SL3於基板FS之寬度方向,配置在描繪線SL2與描繪線SL4之間。描繪線SL4於基板FS之寬度方向,配置在描繪線SL3與描繪線SL5之間,描繪線SL5於基板FS之寬度方向,配置在描繪線SL4與描繪線SL6之間。The drawing lines SL1, SL3, and SL5 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. The drawing lines SL2, SL4, and SL6 are similarly arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. At this time, the drawing line SL2 is in the width direction of the substrate FS, and is arranged between the drawing line SL1 and the drawing line SL3. Similarly, the drawing line SL3 is arranged in the width direction of the substrate FS between the drawing line SL2 and the drawing line SL4. The drawing line SL4 is arranged in the width direction of the substrate FS between the drawing line SL3 and the drawing line SL5, and the drawing line SL5 is arranged in the width direction of the substrate FS between the drawing line SL4 and the drawing line SL6.

沿奇數號之描繪線SL1、SL3、SL5之各個掃描之光束LB之點光SP之掃描方向,為一維方向且為相同方向。沿偶數號之描繪線SL2、SL4、SL6之各個掃描之光束LB之點光SP之掃描方向,為一維方向且為相同方向。此沿描繪線SL1、SL3、SL5掃描之光束LB之點光SP之掃描方向、與沿描繪線SL2、SL4、SL6掃描之光束LB之點光SP之掃描方向,為彼此相反之方向。詳言之,此沿描繪線SL1、SL3、SL5掃描之光束LB之點光SP之掃描方向為-Y方向,沿描繪線SL2、SL4、SL6掃描之光束LB之點光SP之掃描方向為+Y方向。據此,描繪線SL1、SL3、SL5之描繪開始位置(描繪開始點之位置)與描繪線SL2、SL4、SL6之描繪開始位置,即於Y方向相鄰接(或部分重複)。此外,描繪線SL3、SL5之描繪結束位置(描繪結束點之位置)與描繪線SL2、SL4之描繪結束位置,於Y方向相鄰接(或部分重複)。使在Y方向相鄰之描繪線SLn之端部彼此部分重複時,例如,相對各描繪線SLn之長度,可包含描繪開始位置、或描繪結束位置在Y方向以數%以下之範圍使之重複。The scanning direction of the spot light SP of the light beam LB scanned along the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction and the same direction. The scanning direction of the spot light SP of the light beam LB scanned along the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction and the same direction. The scanning direction of the spot light SP of the light beam LB scanning along the drawing lines SL1, SL3, SL5 and the scanning direction of the spot light SP of the light beam LB scanning along the drawing lines SL2, SL4, SL6 are opposite to each other. In detail, the scanning direction of the spot light SP of the light beam LB scanning along the drawing lines SL1, SL3, SL5 is the -Y direction, and the scanning direction of the spot light SP of the light beam LB scanning along the drawing lines SL2, SL4, SL6 is +Y direction. Accordingly, the drawing start positions of the drawing lines SL1, SL3, and SL5 (the positions of the drawing start points) and the drawing start positions of the drawing lines SL2, SL4, SL6, that is, adjacent (or partially overlapping) in the Y direction. In addition, the drawing end positions of the drawing lines SL3 and SL5 (the positions of the drawing end points) and the drawing end positions of the drawing lines SL2 and SL4 are adjacent (or partially overlapped) in the Y direction. When the ends of the drawing lines SLn adjacent to each other in the Y direction partially overlap each other, for example, the length of each drawing line SLn may include the drawing start position or the drawing end position in the Y direction to be repeated within a range of several% or less .

又,此描繪線SLn之副掃描方向之寬度,係對應點光SP之尺寸(直徑)φ之粗細。例如,點光SP之尺寸φ為3μm時,各描繪線SLn之寬度亦為3μm。點光SP,亦可以僅既定長度(例如,點光SP之尺寸φ之一半)重疊之方式,沿描繪線SLn照射。此外,在使於Y方向相鄰之描繪線SLn(例如,描繪線SL1與描繪線SL2)彼此相鄰之情形(接合之情形),亦以僅既定長度(例如,點光SP之尺寸φ之一半)重疊較佳。In addition, the width of the drawing line SLn in the sub-scanning direction corresponds to the thickness of the size (diameter) φ of the spot light SP. For example, when the size φ of the spot light SP is 3 μm, the width of each drawing line SLn is also 3 μm. The spot light SP may be irradiated along the drawing line SLn by overlapping only a predetermined length (for example, half of the size φ of the spot light SP). In addition, when drawing lines SLn (for example, drawing lines SL1 and SL2) adjacent to each other in the Y direction are adjacent to each other (joining), only a predetermined length (for example, the size φ of the spot light SP) Half) overlap is better.

本實施形態之情形,由於來自光源裝置14之光束LB為脈衝光,因此在主掃描之間投射於描繪線SLn上之點光SP,會反應光束LB之震盪頻率Fe而成離散的。因此,必須使以光束LB之1脈衝光投射之點光SP與下一個以1脈衝光投射之點光SP,在主掃描方向重疊(overlap)。此重疊之量,係根據點光SP之尺寸φ、點光SP之掃描速度、光束LB之震盪振頻率Fe設定,在點光SP之強度分布為高斯分布而近似之情形時,相對於以點光SP之峰值強度之1/e 2(或1/2)決定之實效直徑尺寸φ,使之重疊φ/2程度較佳。因此,於副掃描方向(與描繪線SLn正交之方向),最好是能設定在沿描繪線SLn之點光SP之一次掃描與下一次掃描之間,基板FS移動點光SP之實效尺寸φ之大致1/2以下之距離。又,對基板FS上感光性功能層之曝光量之設定,雖能藉由光束LB(脈衝光)之峰值之調整進行,但欲在不提升光束LB強度之狀況下增大曝光量之情形時,可藉由降低點光SP之主掃描方向之掃描速度、增大光束LB之震盪頻率Fe、或降低基板FS之副掃描方向之搬送速度等中之任一方法,使點光SP於主掃描方向或副掃描方向之重疊量增加至實效尺寸φ之1/2以上即可。 In the case of this embodiment, since the light beam LB from the light source device 14 is pulsed light, the spot light SP projected on the drawing line SLn between the main scans will reflect the oscillation frequency Fe of the light beam LB and become discrete. Therefore, it is necessary to overlap the spot light SP projected with 1 pulse light of the light beam LB and the next spot light SP projected with 1 pulse light in the main scanning direction. The amount of overlap is set according to the size φ of the spot light SP, the scanning speed of the spot light SP, and the oscillation frequency Fe of the beam LB. When the intensity distribution of the spot light SP is approximated by a Gaussian distribution, it is relative to the point The effective diameter size φ determined by 1/e 2 (or 1/2) of the peak intensity of the light SP makes it better to overlap φ/2. Therefore, in the sub-scanning direction (the direction orthogonal to the drawing line SLn), it is best to set the effective size of the spot light SP along the drawing line SLn between the first scan and the next scan of the spot light SP. The distance of φ is approximately 1/2 or less. Moreover, the setting of the exposure amount of the photosensitive functional layer on the substrate FS can be done by adjusting the peak value of the light beam LB (pulsed light), but when it is desired to increase the exposure amount without increasing the intensity of the light beam LB , By reducing the scanning speed of the spot light SP in the main scanning direction, increasing the oscillation frequency Fe of the beam LB, or reducing the conveying speed of the substrate FS in the sub-scanning direction, the spot light SP can be in the main scanning The amount of overlap in the direction or sub-scanning direction can be increased to more than 1/2 of the effective size φ.

各光束掃描裝置MD(MD1~MD6),係以至少在XZ平面,光束LB(LB1~LB6)係相對基板FS之被照射面成垂直之方式,將光束LB(LB1~LB6)照射向基板FS。也就是說,各光束掃描裝置MD(MD1~MD6),係以在XZ平面,朝向旋轉筒DR之中心軸AXo行進之方式,亦即以和被照射面之法線同軸(平行)之方式,將光束LB(LB1~LB6)照射(投射)於基板FS。此外,各光束掃描裝置MD(MD1~MD6),以照射於描繪線SLn(SL1~SL6)之光束LB(LB1~LB6)在與YZ平面平行之面内係相對基板FS之被照射面成垂直之方式,將光束LB(LB1~LB6)照射向基板FS。亦即,於點光SP在被照射面之主掃描方向,投射於基板FS之光束LB(LB1~LB6)係以遠心狀態掃描。此處,將通過以各光束掃描裝置MD(MD1~MD6)規定之描繪線SLn(SL1~SL6)之中點(中心點)、與基板FS之被照射面垂直之線(亦稱光軸)稱為照射中心軸Le(Le1~Le6)。Each beam scanning device MD (MD1~MD6) irradiates the light beam LB (LB1~LB6) to the substrate FS in such a way that the light beam LB (LB1~LB6) is perpendicular to the illuminated surface of the substrate FS at least in the XZ plane . That is to say, each beam scanning device MD (MD1~MD6) travels in the XZ plane toward the central axis AXo of the rotating drum DR, that is, coaxial (parallel) with the normal of the illuminated surface. The light beam LB (LB1 to LB6) is irradiated (projected) on the substrate FS. In addition, each beam scanning device MD (MD1 to MD6) uses the beam LB (LB1 to LB6) irradiated to the drawing line SLn (SL1 to SL6) to be perpendicular to the irradiated surface of the substrate FS in a plane parallel to the YZ plane In this way, the light beam LB (LB1 to LB6) is irradiated to the substrate FS. That is, in the main scanning direction of the spot light SP on the illuminated surface, the light beam LB (LB1 to LB6) projected on the substrate FS is scanned in a telecentric state. Here, the midpoint (center point) of the drawing line SLn (SL1 to SL6) defined by each beam scanning device MD (MD1 to MD6) and the line perpendicular to the illuminated surface of the substrate FS (also called optical axis) will pass It is called the irradiation center axis Le (Le1 ~ Le6).

此各照射中心軸Le1~Le6,係於XZ平面,將描繪線SL1~SL6與中心軸AXo加以連結之線。奇數號之光束掃描裝置MD1、MD3、MD5各個之照射中心軸Le1、Le3、Le5於XZ平面為相同方向,奇數號之光束掃描裝置MD2、MD4、MD6各個之照射中心軸Le2、Le4、Le6於XZ平面為相同方向。又,於XZ平面,照射中心軸Le1、Le3、Le5與照射中心軸Le2、Le4、Le6係設定為相對中心面Poc之角度為±θ(參照圖4)。The respective irradiation central axes Le1 to Le6 are on the XZ plane, and lines connecting the drawing lines SL1 to SL6 and the central axis AXo. The irradiation center axes Le1, Le3, and Le5 of the odd-numbered beam scanning devices MD1, MD3, and MD5 are in the same direction on the XZ plane. The odd-numbered beam scanning devices MD2, MD4, and MD6 have the irradiation center axes Le2, Le4, Le6 in the XZ plane. The XZ plane is the same direction. In the XZ plane, the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set to an angle of ±θ relative to the center plane Poc (see FIG. 4).

如圖2所示,於旋轉筒DR之兩端部,設有在旋轉筒DR之外周面周方向全體具有形成為環狀之刻度的標尺部SD(SDa、SDb)。此標尺部SD(SDa、SDb)係在旋轉筒DR之外周面周方向以一定間距(例如,20μm)刻設有凹狀或凸狀格子線的繞射光柵,構成為遞增型標尺。此標尺部SD(SDa、SDb)繞中心軸AXo與旋轉筒DR一體旋轉。又,以和此標尺部SD(SDa、SDb)對向之方式,設有複數個編碼器(標尺讀取頭)EC。此編碼器EC,係以光學方式檢測旋轉筒DR之旋轉位置之物。與設在旋轉筒DR之-Y方向側端部之標尺部SDa對向設有2個編碼器EC(EC1a、EC2a),與設在旋轉筒DR之+Y方向側端部之標尺部SDb對向設有2個編碼器EC(EC1b、EC2b)。As shown in FIG. 2, at both ends of the rotating drum DR, there are provided scale parts SD (SDa, SDb) having scales formed in a ring shape on the entire outer peripheral surface of the rotating drum DR in the circumferential direction. The scale portion SD (SDa, SDb) is a diffraction grating in which concave or convex grating lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating drum DR, and is configured as an incremental scale. The scale part SD (SDa, SDb) rotates integrally with the rotating drum DR around the central axis AXo. In addition, a plurality of encoders (scale reading heads) EC are provided to face the scale unit SD (SDa, SDb). The encoder EC is an object that optically detects the rotation position of the rotating drum DR. Two encoders EC (EC1a, EC2a) are provided opposite to the scale part SDa provided at the end of the -Y direction of the rotating drum DR, and opposite to the scale part SDb provided at the end of the +Y direction side of the rotating drum DR Equipped with 2 encoders EC (EC1b, EC2b).

編碼器EC(EC1a、EC1b、EC2a、EC2b),藉由向標尺部SD(SDa、SDb)投射測量用之光束,並對其反射光束(繞射光)進行光電檢測,據以將對應標尺部SD(SDa、SDb)之周方向位置變化之檢測訊號輸出至控制裝置18。控制裝置18,可藉由將該檢測訊號以未圖示之計數電路進行内挿以進行數位處理,以次微米之解析能力測量旋轉筒DR之角度變化、亦即、其外周面之周方向位置變化。控制裝置18,亦可從旋轉筒DR之角度變化測量基板FS之搬送速度。Encoder EC (EC1a, EC1b, EC2a, EC2b), by projecting the measuring beam to the scale part SD (SDa, SDb), and the reflected beam (diffracted light) for photoelectric detection, according to the corresponding scale part SD (SDa, SDb) The detection signal of the circumferential position change is output to the control device 18. The control device 18 can perform digital processing by interpolating the detection signal with a counter circuit not shown in the figure, and measure the angular change of the rotating drum DR, that is, the circumferential position of its outer peripheral surface, with sub-micron resolution. Variety. The control device 18 can also measure the conveying speed of the substrate FS from the angle change of the rotating drum DR.

編碼器EC1a、EC1b,相對中心面Poc設在基板FS之搬送方向上游側(-X方向側),於XZ平面,配置在與照射中心軸Le1、Le3、Le5相同線上。也就是說,於XZ平面,連結從編碼器EC1a、EC1b投射之測量用光束對標尺部SDa、SDb上之投射位置(讀取位置)與中心軸AXo的線,係配置在與照射中心軸Le1、Le3、Le5相同線上。同樣的,編碼器EC2a、EC2b,相對中心面Poc設在基板FS之搬送方向下游側(+X方向側),於XZ平面,配置在與照射中心軸Le2、Le4、Le6相同線上。也就是說,於XZ平面,連結從編碼器EC2a、EC2b投射之測量用光束對標尺部SDa、SDb上之投射位置(讀取位置)與中心軸AXo的線,係配置在與照射中心軸Le2、Le4、Le6相同線上。The encoders EC1a and EC1b are arranged on the upstream side (−X direction side) of the substrate FS in the conveying direction with respect to the center plane Poc, and are arranged on the same line as the irradiation center axes Le1, Le3, and Le5 on the XZ plane. That is, on the XZ plane, the line connecting the projection position (reading position) of the measuring beam projected from the encoders EC1a and EC1b on the scale parts SDa and SDb and the central axis AXo is arranged on the irradiation central axis Le1 , Le3, Le5 are the same online. Similarly, the encoders EC2a and EC2b are arranged on the downstream side (+X direction side) of the substrate FS in the conveying direction with respect to the center plane Poc, and are arranged on the XZ plane on the same line as the irradiation center axes Le2, Le4, Le6. That is, on the XZ plane, the line connecting the projection position (reading position) of the measuring beam projected from the encoders EC2a and EC2b on the scale parts SDa and SDb and the central axis AXo is arranged on the irradiation central axis Le2 , Le4, Le6 are the same online.

又,基板FS係捲繞在較旋轉筒DR兩端之標尺部SDa、SDb之内側。標尺部SD(SDa、SDb)之外周面被設定為與捲繞在旋轉筒DR之基板FS之外周面為同一面。也就是說,標尺部SD(SDa、SDb)到外周面之中心軸AXo的半徑(距離)、與捲繞在旋轉筒DR之基板FS到外周面之中心軸AXo的半徑(距離),被設定為相同。據此,編碼器EC(EC1a、EC1b、EC2a、EC2b)能在與捲繞於旋轉筒DR之基板FS之被照射面相同徑方向之位置檢測標尺部SD(SDa、SDb),減小測量位置與處理位置(點光SP之掃描位置等)因在旋轉筒DR之徑方向相異所產生之阿貝誤差。In addition, the substrate FS is wound on the inner side of the scale portions SDa and SDb at both ends of the rotating drum DR. The outer peripheral surface of the scale portion SD (SDa, SDb) is set to be the same surface as the outer peripheral surface of the substrate FS wound around the rotating drum DR. In other words, the radius (distance) from the scale part SD (SDa, SDb) to the central axis AXo of the outer peripheral surface and the radius (distance) from the substrate FS wound on the rotating drum DR to the central axis AXo of the outer peripheral surface are set For the same. According to this, the encoder EC (EC1a, EC1b, EC2a, EC2b) can detect the scale part SD (SDa, SDb) in the same radial direction as the irradiated surface of the substrate FS wound on the rotating drum DR, reducing the measurement position Abbe error caused by the difference between the processing position (scanning position of the spot light SP, etc.) in the radial direction of the rotating drum DR.

不過,由於作為被照射體之基板FS之厚度從十數μm~數百μm有相當大的差異,因此欲使標尺部SD(SDa、SDb)之外周面之半徑與捲繞在旋轉筒DR之基板FS之外周面之半徑恆為相同是不容易的。因此,在圖2所示之標尺部SD(SDa、SDb)之情形時,其外周面(標尺面)之半徑係設定為與旋轉筒DR之外周面之半徑一致。進一步的,亦可以個別的圓盤構成標尺部SD,將該圓盤(標尺圓盤)同軸安裝於旋轉筒DR之軸Sft。此時,使標尺圓盤之外周面(標尺面)之半徑與旋轉筒DR之外周面之半徑一致,以將阿貝誤差控制在容許值内之程度較佳。However, since the thickness of the substrate FS as the irradiated body varies greatly from tens of μm to hundreds of μm, it is necessary to make the radius of the outer peripheral surface of the scale part SD (SDa, SDb) and the winding around the drum DR It is not easy for the radius of the outer peripheral surface of the substrate FS to be constant. Therefore, in the case of the scale portion SD (SDa, SDb) shown in FIG. 2, the radius of the outer peripheral surface (scale surface) is set to be consistent with the radius of the outer peripheral surface of the rotating drum DR. Furthermore, it is also possible to form the scale part SD with an individual disc, and to mount this disc (scale disc) coaxially to the shaft Sft of the rotating drum DR. At this time, it is better to keep the radius of the outer circumference of the scale disc (scale surface) consistent with the radius of the outer circumference of the rotating drum DR to control the Abbe error within the allowable value.

圖1所示之對準顯微鏡ALG(ALG1~ALG4),如圖3所示,係用以檢測形成在基板FS之對準標記MK(MK1~MK4),沿Y方向設有複數個(本實施形態中為4個)。對準標記MK(MK1~MK4),係用以進行描繪在基板FS之被照射面上之曝光區域W的既定圖案、與基板FS之相對位置對準的基準標記。對準顯微鏡ALG(ALG1~ALG4),在被旋轉筒DR之圓周面支承之基板FS上,檢測對準標記MK(MK1~MK4)。對準顯微鏡ALG(ALG1~ALG4),較來自曝光頭16之光束LB(LB1~LB6)之點光SP對基板FS上之被照射區域,設置在基板FS之搬送方向上游側(-X方向側)。The alignment microscope ALG (ALG1~ALG4) shown in Fig. 1, as shown in Fig. 3, is used to detect the alignment marks MK (MK1~MK4) formed on the substrate FS, and there are a plurality of them along the Y direction (this embodiment 4 in the form). The alignment marks MK (MK1 to MK4) are reference marks used to align the predetermined pattern of the exposure area W drawn on the illuminated surface of the substrate FS and the relative position of the substrate FS. Align the microscope ALG (ALG1~ALG4), and detect the alignment marks MK (MK1~MK4) on the substrate FS supported by the circumferential surface of the rotating drum DR. Align the microscope ALG (ALG1~ALG4), compare the spot light SP of the light beam LB (LB1~LB6) from the exposure head 16 to the irradiated area on the substrate FS, and set it on the upstream side of the substrate FS in the transport direction (-X direction side) ).

對準顯微鏡ALG(ALG1~ALG4),具有將對準用照明光投射於基板FS的光源、用以取得基板FS表面包含對準標記MK(MK1~MK4)之局部區域之放大像的觀察光學系(含物鏡)、以及將該放大像在基板FS移動於搬送方向之期間以高速快門拍攝之CCD、CMOS等的攝影元件。對準顯微鏡ALG(ALG1~ALG4)拍攝之攝影訊號被送至控制裝置18。控制裝置18根據攝影訊號之影像解析、與拍攝瞬間之旋轉筒DR之旋轉位置之資訊(以讀取圖2所示之標尺部SD之編碼器EC加以測量),檢測對準標記MK(MK1~MK4)之位置,以檢測基板FS之位置。又,對準用照明光係對基板FS上之感光性功能層幾乎不具有感度之波長帶的光、例如波長500~800nm程度之光。The alignment microscope ALG (ALG1~ALG4) has a light source that projects the illumination light for alignment on the substrate FS, and an observation optical system for obtaining a magnified image of the local area of the substrate FS including the alignment marks MK (MK1~MK4) ( (Including objective lens), and imaging elements such as CCD, CMOS, etc. that take the enlarged image with a high-speed shutter while the substrate FS is moving in the conveying direction. The photographic signals taken by the microscope ALG (ALG1~ALG4) are sent to the control device 18. The control device 18 detects the alignment mark MK (MK1~) based on the image analysis of the photography signal and the information of the rotation position of the rotating drum DR at the instant of shooting (measured by the encoder EC reading the scale part SD shown in FIG. 2) MK4) position to detect the position of the substrate FS. In addition, the illumination light for alignment is light in a wavelength band that hardly has sensitivity to the photosensitive functional layer on the substrate FS, for example, light with a wavelength of about 500 to 800 nm.

對準標記MK1~MK4設在各曝光區域W之周圍。對準標記MK1、MK4,在曝光區域W之基板FS之寬度方向兩側,沿基板FS之長邊方向以一定間隔Dh形成有複數個。對準標記MK1形成在基板FS之寬度方向之-Y方向側,對準標記MK4形成在基板FS之寬度方向之+Y方向側。此種對準標記MK1、MK4,在基板FS承受大的張力、熱處理而不變形之狀態下,於基板FS之長邊方向(X方向)配置在同一位置。再者,對準標記MK2、MK3,係在對準標記MK1與對準標記MK4之間,在曝光區域W之+X方向側與-X方向側之餘白部沿基板FS之寬度方向(短尺方向)形成。對準標記MK2形成在基板FS之寬度方向之-Y方向側,對準標記MK3形成在基板FS之+Y方向側。此外,排列在基板FS之-Y方向側端部之對準標記MK1與餘白部之對準標記MK2在Y方向之間隔、餘白部之對準標記MK2與對準標記MK3在Y方向之間隔、以及排列在基板FS之+Y方向側端部之對準標記MK4與餘白部之對準標記MK3在Y方向之間隔,皆設定為相同距離。此等對準標記MK(MK1~MK4),可在第1層之圖案層之形成時一起形成。例如,在曝光第1層之圖案時,可在圖案曝光之曝光區域W之周圍將對準標記用之圖案一起曝光。又,對準標記MK可形成在曝光區域W内。例如,可在曝光區域W内、沿曝光區域W之輪廓形成。Alignment marks MK1 to MK4 are provided around each exposure area W. A plurality of alignment marks MK1 and MK4 are formed on both sides of the width direction of the substrate FS of the exposure area W at a certain interval Dh along the longitudinal direction of the substrate FS. The alignment mark MK1 is formed on the -Y direction side of the width direction of the substrate FS, and the alignment mark MK4 is formed on the +Y direction side of the width direction of the substrate FS. Such alignment marks MK1 and MK4 are arranged at the same position in the longitudinal direction (X direction) of the substrate FS in a state where the substrate FS is subjected to large tension and heat treatment without deformation. Furthermore, the alignment marks MK2 and MK3 are located between the alignment mark MK1 and the alignment mark MK4, and the margins on the +X direction side and -X direction side of the exposure area W are along the width direction of the substrate FS (short-length direction )form. The alignment mark MK2 is formed on the -Y direction side of the width direction of the substrate FS, and the alignment mark MK3 is formed on the +Y direction side of the substrate FS. In addition, the distance between the alignment mark MK1 and the alignment mark MK2 of the margin part arranged in the Y direction of the substrate FS, the alignment mark MK2 and the alignment mark MK3 of the margin part in the Y direction The spacing and the spacing in the Y direction between the alignment mark MK4 arranged on the +Y direction side end of the substrate FS and the alignment mark MK3 of the margin portion are set to the same distance. These alignment marks MK (MK1~MK4) can be formed together when the pattern layer of the first layer is formed. For example, when exposing the pattern of the first layer, the pattern for the alignment mark can be exposed together around the exposure area W of the pattern exposure. In addition, the alignment mark MK may be formed in the exposure area W. For example, it can be formed in the exposure area W and along the outline of the exposure area W.

對準顯微鏡ALG1係配置成拍攝存在於物鏡之觀察區域(檢測區域)Vw1内之對準標記MK1。同樣的,對準顯微鏡ALG2~ALG4亦配置成拍攝存在於物鏡之觀察區域Vw2~Vw4内之對準標記MK2~MK4。因此,複數個對準顯微鏡ALG1~ALG4係對應複數個對準標記MK1~MK4之位置,從基板FS之-Y方向側起以對準顯微鏡ALG1~ALG4之順序設置。對準顯微鏡ALG(ALG1~ALG4)係設置成於X方向,曝光位置(描繪線SL1~SL6)與對準顯微鏡ALG之觀察區域Vw(Vw1~Vw4)之距離,較曝光區域W之X方向之長度短。又,設於Y方向之對準顯微鏡ALG之數量,可視形成在基板FS之寬度方向之對準標記MK之數量變更。此外,觀察區域Vw1~Vw4在基板FS之被照射面上之大小雖係反應對準標記MK1~MK4之大小及對準精度(位置測量精度)而設定,但是在100~500μm方形程度之大小。The alignment microscope ALG1 is configured to capture the alignment mark MK1 existing in the observation area (detection area) Vw1 of the objective lens. Similarly, the alignment microscopes ALG2 to ALG4 are also configured to capture the alignment marks MK2 to MK4 existing in the observation area Vw2 to Vw4 of the objective lens. Therefore, a plurality of alignment microscopes ALG1 to ALG4 correspond to the positions of the plurality of alignment marks MK1 to MK4, and are arranged in the order of the alignment microscopes ALG1 to ALG4 from the -Y direction side of the substrate FS. The alignment microscope ALG (ALG1~ALG4) is set in the X direction. The distance between the exposure position (drawing line SL1~SL6) and the observation area Vw (Vw1~Vw4) of the alignment microscope ALG is smaller than the X direction of the exposure area W The length is short. In addition, the number of alignment microscopes ALG provided in the Y direction can be changed depending on the number of alignment marks MK formed in the width direction of the substrate FS. In addition, although the size of the observation areas Vw1 to Vw4 on the illuminated surface of the substrate FS is set in response to the size of the alignment marks MK1 to MK4 and the alignment accuracy (position measurement accuracy), it is about 100 to 500 μm square.

圖4係曝光裝置EX的主要部位放大圖。曝光裝置EX進一步具備複數個光導入光學系BDU(BDU1~BDU6)、與本體架UB。光導入光學系BDU(BDU1~BDU6)將來自光源裝置14之光束LB(LB1~LB6)導向光束掃描裝置MD(MD1~MD6)。光導入光學系BDU1將光束LB1導向光束掃描裝置MD1,光導入光學系BDU2將光束LB2導向光束掃描裝置MD2。同樣的,光導入光學系BDU3~BDU6將光束LB3~LB6導向光束掃描裝置MD3~MD6。來自光源裝置14之光束LB,透過未圖示之分束器、或切換用之光偏向器等之光學構件,分歧或選擇性的射入各光導入光學系BDU1~BDU6。光導入光學系BDU(BDU1~BDU6),具有將以光束掃描裝置MD(MD1~MD6)投射至基板FS之被照射面上之點光SP之強度根據圖案資料高速地進行調變(ON/OFF)的描繪用光學元件AOM(AOM1~AOM6)。描繪用光學元件AOM係音聲光學調變器(Acousto-Optic Modulator)。此圖案資料,儲存在控制裝置18之未圖示的記憶區域。Fig. 4 is an enlarged view of the main parts of the exposure apparatus EX. The exposure device EX further includes a plurality of light introduction optical systems BDU (BDU1 to BDU6) and a main body frame UB. The light introduction optical system BDU (BDU1 to BDU6) guides the light beam LB (LB1 to LB6) from the light source device 14 to the light beam scanning device MD (MD1 to MD6). The light introduction optical system BDU1 guides the light beam LB1 to the beam scanning device MD1, and the light introduction optical system BDU2 guides the light beam LB2 to the beam scanning device MD2. Similarly, the light introduction optical systems BDU3 to BDU6 guide the light beams LB3 to LB6 to the light beam scanning devices MD3 to MD6. The light beam LB from the light source device 14 passes through an optical member such as a beam splitter (not shown) or a light deflector for switching, and is branched or selectively incident on the light introduction optical systems BDU1 to BDU6. The light-introducing optical system BDU (BDU1~BDU6) has the ability to adjust the intensity of the spot light SP projected by the beam scanning device MD (MD1~MD6) to the illuminated surface of the substrate FS at high speed according to the pattern data (ON/OFF) ) AOM (AOM1~AOM6) for drawing optical elements. The optical element for drawing is AOM-based Acousto-Optic Modulator. This pattern data is stored in a memory area not shown in the control device 18.

本體架UB,用以保持複數個光導入光學系BDU1~BDU6與複數個光束掃描裝置MD1~MD6。本體架UB,具有保持複數個光導入光學系BDU1~BDU6的第1機架部Ub1、與保持複數個光束掃描裝置MD1~MD6的第2機架部Ub2。第1機架部Ub1,在以第2機架部Ub2保持之複數個光束掃描裝置MD1~MD6之上方(+Z方向側),保持複數個光導入光學系BDU1~BDU6。奇數號之光導入光學系BDU1、BDU3、BDU5係以和奇數號之光束掃描裝置MD1、MD3、MD5之位置對應,相對中心面Poc配置在基板FS之搬送方向上游側(-X方向側)之方式,被保持於第1機架部Ub1。偶數號之光導入光學系BDU2、BDU4、BDU6,同樣的,係以和偶數號之光束掃描裝置MD2、MD4、MD6之位置對應,相對中心面Poc配置在基板FS之搬送方向下游側(+X方向側)之方式,被保持於第1機架部Ub1。關於此光導入光學系BDU之構成,於後詳細說明。The body frame UB is used to hold a plurality of light introduction optical systems BDU1 to BDU6 and a plurality of beam scanning devices MD1 to MD6. The main body frame UB has a first frame portion Ub1 that holds a plurality of light introduction optical systems BDU1 to BDU6, and a second frame portion Ub2 that holds a plurality of light beam scanning devices MD1 to MD6. The first frame portion Ub1 holds a plurality of light introduction optical systems BDU1 to BDU6 above the plurality of light beam scanning devices MD1 to MD6 (+Z direction side) held by the second frame portion Ub2. The odd-numbered light-introducing optical systems BDU1, BDU3, and BDU5 correspond to the positions of the odd-numbered beam scanning devices MD1, MD3, MD5, and are arranged on the upstream side (-X direction side) of the substrate FS in the transport direction relative to the center plane Poc. Mode, is held in the first frame Ub1. Even-numbered light-introducing optical systems BDU2, BDU4, BDU6, similarly, correspond to the positions of even-numbered beam scanning devices MD2, MD4, MD6, and are arranged on the downstream side (+X direction) of the substrate FS with respect to the center plane Poc Side) is held in the first frame Ub1. The structure of this light introducing optical system BDU will be described in detail later.

第1機架部Ub1從下方(-Z方向側)支承複數個光導入光學系BDU1~BDU6。於第1機架部Ub1,對應複數個光導入光學系BDU1~BDU6設有複數個開口部Hs(Hs1~Hs6)。藉由此複數個開口部Hs1~Hs6,從複數個光導入光學系BDU1~BDU6射出之光束LB1~LB6即在不會被第1機架部Ub1遮蔽之情形下,射入對應之光束掃描裝置MD1~MD6。也就是說,從光導入光學系BDU(BDU1~BDU6)射出之光束LB(LB1~LB6)通過開口部Hs(Hs1~Hs6)射入光束掃描裝置MD(MD1~MD6)。The first frame portion Ub1 supports a plurality of light introduction optical systems BDU1 to BDU6 from below (the −Z direction side). In the first frame portion Ub1, a plurality of openings Hs (Hs1 to Hs6) are provided corresponding to the plurality of light introduction optical systems BDU1 to BDU6. Through the plurality of openings Hs1 to Hs6, the light beams LB1 to LB6 emitted from the plurality of light introduction optical systems BDU1 to BDU6 are incident on the corresponding beam scanning device without being shielded by the first frame portion Ub1 MD1~MD6. That is, the light beam LB (LB1 to LB6) emitted from the light introduction optical system BDU (BDU1 to BDU6) enters the beam scanning device MD (MD1 to MD6) through the opening Hs (Hs1 to Hs6).

第2機架部Ub2,將光束掃描裝置MD(MD1~MD6)之各個保持成能繞照射中心軸Le(Le1~Le6)旋轉。也就是說,藉由第2機架部Ub2,各光束掃描裝置MD(MD1~MD6)可繞照射中心軸Le(Le1~Le6)旋轉。關於此第2機架部Ub2對光束掃描裝置MD之保持構造,於後詳細說明。The second frame Ub2 holds each of the beam scanning devices MD (MD1 to MD6) so as to be rotatable about the irradiation center axis Le (Le1 to Le6). That is, with the second frame portion Ub2, each beam scanning device MD (MD1 to MD6) can be rotated around the irradiation center axis Le (Le1 to Le6). The holding structure of the second frame portion Ub2 to the beam scanning device MD will be described in detail later.

圖5係顯示光導入光學系BDU之光學構成的詳圖、圖6係用以說明以描繪用光學元件AOM進行之光路切換(光束LB之ON/OFF)的概略說明圖。奇數號之光導入光學系BDU1、BDU3、BDU5與偶數號之光導入光學系BDU2、BDU4、BDU6,係相對中心面Poc對稱設置。又,由於各光導入光學系BDU(BDU1~BDU6)具有相同構成,因此僅針對光導入光學系BDU1加以說明,省略對其他光導入光學系BDU之說明。Fig. 5 is a detailed diagram showing the optical configuration of the light-introducing optical system BDU, and Fig. 6 is a schematic explanatory diagram for explaining the optical path switching (ON/OFF of the light beam LB) performed by the drawing optical element AOM. The odd-numbered light introduction optical systems BDU1, BDU3, BDU5 and the even-numbered light introduction optical systems BDU2, BDU4, BDU6 are arranged symmetrically with respect to the center plane Poc. In addition, since each light introduction optical system BDU (BDU1 to BDU6) has the same configuration, only the light introduction optical system BDU1 will be described, and description of other light introduction optical system BDUs will be omitted.

光導入光學系BDU1,除描繪用光學元件AOM1外,具有光學透鏡系G1、G2、與反射鏡M1~M5。於描繪用光學元件AOM1,光束LB1以在描繪用光學元件AOM1内成光腰之方式射入。描繪用光學元件AOM1,如圖6所示,在來自控制裝置18之驅動訊號(高頻訊號)為OFF(Low)狀態時,使入射之光束LB1穿透吸收體AB,在來自控制裝置18之驅動訊號(高頻訊號)為ON(High)狀態時,則使入射之光束LB1繞射後之1次繞射光朝向反射鏡M1。吸收體AB,係為抑制光束LB1漏至外部而吸收光束LB1之光捕捉器。控制裝置18,根據圖案資料使待施加至描繪用光學元件AOM1之驅動訊號(高頻訊號)高速地進行ON/OFF(High/Low),據以切換使光束LB1朝向反射鏡M1(描繪用光學元件AOM1為ON)、或朝向吸收體AB(描繪用光學元件AOM1為OFF)。此事,在基板FS之被照射面上看時,即代表從光束掃描裝置MD1到達被照射面(基板FS)之光束LB1之點光SP之強度,根據圖案資料高速地被調變為高位準與低位準(例如零位準)之任一者。The light introduction optical system BDU1 has optical lens systems G1, G2, and mirrors M1 to M5 in addition to the drawing optical element AOM1. In the drawing optical element AOM1, the light beam LB1 enters so as to form a light waist in the drawing optical element AOM1. The drawing optical element AOM1, as shown in FIG. 6, makes the incident light beam LB1 penetrate the absorber AB when the drive signal (high-frequency signal) from the control device 18 is in the OFF (Low) state. When the driving signal (high frequency signal) is in the ON (High) state, the primary diffracted light after the incident light beam LB1 is diffracted toward the mirror M1. The absorber AB is a light trap that absorbs the light beam LB1 in order to prevent the light beam LB1 from leaking to the outside. The control device 18 turns on/off (High/Low) the drive signal (high-frequency signal) to be applied to the drawing optical element AOM1 at high speed according to the pattern data, and switches the light beam LB1 toward the mirror M1 (drawing optical The element AOM1 is ON), or toward the absorber AB (the drawing optical element AOM1 is OFF). This matter, when viewed on the illuminated surface of the substrate FS, means that the intensity of the spot light SP of the beam LB1 from the beam scanning device MD1 to the illuminated surface (substrate FS) is adjusted to a high level at high speed according to the pattern data Either the lower level (such as the zero level).

圖案資料,係以沿點光SP之掃描方向(Y方向)之方向為列方向、沿基板FS之搬送方向(X方向)之方向為行方向、以分解為二維之複數個像素資料構成的位元圖(bit map)資料。此像素資料,係「0」或「1」之1位元資料。「0」之像素資料係代表將照射在基板FS上之點光SP之強度設定為低位準,「1」之像素資料則代表將照射於基板FS上之點光SP之強度設定為高位準之意。因此,控制裝置18,在像素資料為「0」時,將OFF之驅動訊號(高頻訊號)輸出至光導入光學系BDU1之描繪用光學元件AOM1,在像素資料為「1」時,將ON之驅動訊號(高頻訊號)輸出至描繪用光學元件AOM1。此圖案資料之1行份之像素資料之數量,係反應在被照射面上之像素尺寸與描繪線SLn之長度決定,1像素之尺寸由點光SP之尺寸φ決定。如先前之說明,在使被照射面上持續照射之點光SP僅以尺寸φ之1/2程度重疊時,1像素之尺寸係設定為點光SP之尺寸φ的程度、或高於此。例如,點光SP之實效尺寸φ為3μm(重疊量為1.5μm)之情形時,1像素之尺寸係設定為3μm方形程度、或高於此。因此,為進行更微細之圖案之描繪,需將點光SP之實效尺寸φ設定得更小、以將1像素之尺寸設定得更小。因此,在使點光SP僅重疊尺寸φ之1/2程度時,沿描繪線SL1投射之點光SP之數量(脈衝數)即為圖案資料之1行份像素資料之數的2倍。此圖案資料儲存在未圖示之記憶體中。又,亦有將1行份像素資料稱為像素資料行Dw之情形,圖案資料係複數個像素資料行Dw(Dw1、Dw2、・・・、Dwn)排列於行方向之位元圖資料。The pattern data is composed of the direction along the scanning direction (Y direction) of the spot light SP as the column direction and the direction along the conveying direction (X direction) of the substrate FS as the row direction, and is composed of a plurality of pixel data decomposed into two dimensions Bit map (bit map) data. This pixel data is 1-bit data of "0" or "1". The pixel data of "0" means that the intensity of the spot light SP irradiated on the substrate FS is set to a low level, and the pixel data of "1" means that the intensity of the spot light SP irradiated on the substrate FS is set to a high level meaning. Therefore, when the pixel data is "0", the control device 18 outputs the OFF drive signal (high-frequency signal) to the drawing optical element AOM1 of the light introduction optical system BDU1, and turns ON when the pixel data is "1" The drive signal (high frequency signal) is output to the drawing optical element AOM1. The number of pixel data in one row of the pattern data is determined by the pixel size on the illuminated surface and the length of the drawing line SLn. The size of one pixel is determined by the size φ of the spot light SP. As described above, when the spot light SP continuously irradiated on the illuminated surface overlaps only by about 1/2 of the size φ, the size of one pixel is set to the extent or higher than the size φ of the spot light SP. For example, when the effective size φ of the spot light SP is 3 μm (the overlap amount is 1.5 μm), the size of one pixel is set to be about 3 μm square or higher. Therefore, in order to draw a finer pattern, it is necessary to set the effective size φ of the spot light SP to be smaller, so that the size of 1 pixel is set to be smaller. Therefore, when the spot lights SP are overlapped by only 1/2 of the size φ, the number of spot lights SP projected along the drawing line SL1 (the number of pulses) is twice the number of pixel data for one row of the pattern data. This pattern data is stored in the memory not shown. In addition, there is also a case where one row of pixel data is called a pixel data row Dw, and the pattern data is bitmap data in which a plurality of pixel data rows Dw (Dw1, Dw2, ..., Dwn) are arranged in the row direction.

詳言之,控制裝置18讀出圖案資料之像素資料行(1行份之像素資料)Dw(例如,Dw1),與光束掃描裝置MD1進行之點光SP之掃描同步,將根據所讀出之像素資料行Dw1之像素資料的驅動訊號依序輸出至光導入光學系BDU1之描繪用光學元件AOM1。具體而言,就沿描繪線SL1每投射點光SP之2脈衝份之時序,使讀出之像素資料行Dw1中選擇之1像素份之資料沿列方向偏移,並將根據所選擇之1像素份之資料的驅動訊號依序輸出至描繪用光學元件AOM1。據此,對照射在基板FS之照射面上之點光SP之每2脈衝,將其強度根據像素資料加以調變。控制裝置18,在點光SP之掃描結束時,讀出下一行之像素資料行Dw2。並隨著光束掃描裝置MD1之點光SP之掃描開始,將根據讀出之像素資料行Dw2之像素資料的驅動訊號,依輸出至光導入光學系BDU1之描繪用光學元件AOM1。以此方式,在每次開始點光SP之掃描時,將根據下一行之像素資料行Dw之像素資料的驅動訊號依輸出至描繪用光學元件AOM1。據此,即能描繪曝光出根據圖案資料之圖案。又,圖案資料係就每一光束掃描裝置MD設置。In detail, the control device 18 reads out the pixel data row (one line of pixel data) Dw (for example, Dw1) of the pattern data, synchronized with the scanning of the spot light SP performed by the beam scanning device MD1, and will be based on the readout The driving signals of the pixel data of the pixel data row Dw1 are sequentially output to the drawing optical element AOM1 of the light introduction optical system BDU1. Specifically, with respect to the timing of each 2 pulses of the spot light SP projected along the drawing line SL1, the data of 1 pixel selected in the read-out pixel data row Dw1 is shifted in the column direction, and the selected 1 The driving signal of the pixel data is sequentially output to the drawing optical element AOM1. Accordingly, for every 2 pulses of the spot light SP irradiated on the irradiation surface of the substrate FS, its intensity is adjusted according to the pixel data. The control device 18 reads out the pixel data row Dw2 of the next row when the scanning of the spot light SP ends. And as the scanning of the spot light SP of the beam scanning device MD1 starts, the driving signal based on the pixel data of the read pixel data row Dw2 is output to the drawing optical element AOM1 of the light introduction optical system BDU1. In this way, every time the scanning of the spot light SP is started, the driving signal according to the pixel data of the pixel data row Dw of the next row is output to the drawing optical element AOM1. According to this, it is possible to draw and expose patterns based on pattern data. Moreover, the pattern data is set for each beam scanning device MD.

來自描繪用光學元件AOM1之光束LB1,透過光束成形用之光學透鏡系G1射入吸收體AB或反射鏡M1。也就是說,無論描繪用光學元件AOM1為ON、或為OFF,通過描繪用光學元件AOM1之光束LB1亦會穿透光學透鏡系G1。當描繪用光學元件AOM1被切換為ON,光束LB1射入反射鏡M1時,光束LB1即因圖5中之反射鏡M1~M5而使其光路彎折,從反射鏡M5射出向光束掃描裝置MD1。此時,反射鏡M5係使光束LB1與照射中心軸Le1成同軸之方式射出。也就是說,以光導入光學系BDU1之反射鏡M1~M5,將該光路彎折成來自光導入光學系BDU1之光束LB1之軸線成為與設定在光束掃描裝置MD1之照射中心軸Le1同軸射入光束掃描裝置MD1。又,在反射鏡M4與反射鏡M5之間設有光束成形用之光學透鏡系G2。此外,至少由複數個光束掃描裝置MD(MD1~MD6)構成之曝光頭16與光導入光學系BDU(BDU1~BDU6),構成本實施形態之描繪裝置。又,本體架UB亦可構成為描繪裝置之一部分。The light beam LB1 from the drawing optical element AOM1 passes through the optical lens system G1 for beam shaping and enters the absorber AB or the mirror M1. That is, regardless of whether the drawing optical element AOM1 is ON or OFF, the light beam LB1 passing through the drawing optical element AOM1 will also pass through the optical lens system G1. When the drawing optical element AOM1 is switched ON and the light beam LB1 enters the mirror M1, the light beam LB1 bends its optical path due to the mirrors M1 to M5 in Fig. 5, and then exits the mirror M5 to the beam scanning device MD1 . At this time, the mirror M5 emits the light beam LB1 coaxially with the irradiation center axis Le1. In other words, with the mirrors M1 to M5 of the light introducing optical system BDU1, the optical path is bent so that the axis of the light beam LB1 from the light introducing optical system BDU1 becomes incident coaxially with the irradiation center axis Le1 set on the beam scanning device MD1 Beam scanning device MD1. In addition, an optical lens system G2 for beam shaping is provided between the mirror M4 and the mirror M5. In addition, the exposure head 16 composed of at least a plurality of beam scanning devices MD (MD1 to MD6) and the light introduction optical system BDU (BDU1 to BDU6) constitute the drawing device of this embodiment. In addition, the main body frame UB may also be formed as a part of the drawing device.

其次,參照圖7(及圖5),說明光束掃描裝置MD之光學構成。由於各光束掃描裝置MD(MD1~MD6)具有相同構成,因此僅針對光束掃描裝置MD1加以說明,針對其他光束掃描裝置MD則省略說明。又,圖7(及圖5)中,係以和照射中心軸Le(Le1)平行之方向為Zt方向,以在與Zt方向正交之平面上、基板FS從處理裝置PR1經由曝光裝置EX朝向處理裝置PR2之方向為Xt方向,以在與Zt方向正交之平面上、與Xt方向正交之方向為Yt方向。也就是說,圖7(及圖5)之Xt、Yt、Zt的三維座標,係將圖1之X、Y、Z的三維座標以Y軸為中心、旋轉成Z軸方向與照射中心軸Le(Le1)平行的三維座標。Next, referring to FIG. 7 (and FIG. 5), the optical configuration of the beam scanning device MD will be described. Since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted. In addition, in FIG. 7 (and FIG. 5), the direction parallel to the irradiation center axis Le (Le1) is the Zt direction, and the substrate FS is directed from the processing device PR1 through the exposure device EX on a plane orthogonal to the Zt direction The direction of the processing device PR2 is the Xt direction, and the direction orthogonal to the Xt direction on the plane orthogonal to the Zt direction is the Yt direction. In other words, the three-dimensional coordinates of Xt, Yt, and Zt in Figure 7 (and Figure 5) are based on the three-dimensional coordinates of X, Y, and Z in Figure 1 centered on the Y axis, rotated into the Z axis direction and the irradiation center axis Le (Le1) Parallel three-dimensional coordinates.

如圖7所示,於光束掃描裝置MD1内,沿著從光束LB1之入射位置到被照射面(基板FS)之光束LB1之行進方向,設有反射鏡M10、擴束器BE、反射鏡M11、偏光分束器BS1、反射鏡M12、像偏移光學構件(平行平板)SR、偏向調整光學構件(稜鏡)DP、場孔徑FA、反射鏡M13、λ/4波長板QW、柱面透鏡CYa、反射鏡M14、多面鏡(polygon mirror)PM、fθ透鏡FT、反射鏡M15、柱面透鏡CYb。進一步的,於光束掃描裝置MD1内,設有透過偏光分束器BS1用以檢測來自被照射面(基板FS)之反射光的光學透鏡系G10及光檢測器DT1。As shown in FIG. 7, in the beam scanning device MD1, along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the irradiated surface (substrate FS), a mirror M10, a beam expander BE, and a mirror M11 are provided , Polarizing beam splitter BS1, mirror M12, image shift optical component (parallel plate) SR, deflection adjustment optical component (稜鏡) DP, field aperture FA, mirror M13, λ/4 wavelength plate QW, cylindrical lens CYa, mirror M14, polygon mirror PM, fθ lens FT, mirror M15, cylindrical lens CYb. Further, in the beam scanning device MD1, an optical lens system G10 and a photodetector DT1 are provided that transmit the polarizing beam splitter BS1 to detect the reflected light from the illuminated surface (the substrate FS).

射入光束掃描裝置MD1之光束LB1,朝-Zt方向行進,射入相對XtYt平面傾斜45°之反射鏡M10。射入此光束掃描裝置MD1之光束LB1之軸線,係以和照射中心軸Le1成同軸之方式射入反射鏡M10。反射鏡M10,其功能係作為使光束LB1射入光束掃描裝置MD1之入射光學構件 ,將入射之光束LB1沿著與Xt軸平行設定之光軸AXa,朝反射鏡M11反射向-Xt方向。因此,光軸AXa在與XtZt平面平行之面内,與照射中心軸Le1正交。被反射鏡M10反射之光束LB1,穿透過沿光軸AXa配置之擴束器BE射入反射鏡M11。擴束器BE,用以使穿透之光束LB1之直徑放大。擴束器BE,具有聚光透鏡Be1、以及使被聚光透鏡Be1會聚後放射之光束LB1成為平行光的準直透鏡Be2。The light beam LB1 that enters the beam scanning device MD1 travels in the -Zt direction and enters the mirror M10 that is inclined 45° with respect to the XtYt plane. The axis of the light beam LB1 incident on the beam scanning device MD1 is incident on the mirror M10 in a manner coaxial with the irradiation center axis Le1. The mirror M10 functions as an incident optical member that causes the light beam LB1 to enter the beam scanning device MD1, and reflects the incident light beam LB1 along the optical axis AXa set parallel to the Xt axis toward the mirror M11 in the -Xt direction. Therefore, the optical axis AXa is in a plane parallel to the XtZt plane and orthogonal to the irradiation center axis Le1. The light beam LB1 reflected by the mirror M10 passes through the beam expander BE arranged along the optical axis AXa and enters the mirror M11. The beam expander BE is used to enlarge the diameter of the penetrating beam LB1. The beam expander BE includes a condenser lens Be1 and a collimator lens Be2 that makes the beam LB1 radiated after being condensed by the condenser lens Be1 become parallel light.

反射鏡M11相對YtZt平面傾斜45°配置,將入射之光束LB1(光軸AXa)朝著偏光分束器BS1反射向-Yt方向。偏光分束器BS1之偏光分離面,相對YtZt平面傾斜45°配置,用以使P偏光之光束反射、使偏光在與P偏光正交之方向之直線偏光(S偏光)之光束穿透。射入光束掃描裝置MD1之光束LB1,由於係P偏光之光束,因此偏光分束器BS1將來自反射鏡M11之光束LB1反射向-Xt方向以導向反射鏡M12側。The mirror M11 is arranged at an angle of 45° with respect to the YtZt plane, and reflects the incident light beam LB1 (optical axis AXa) toward the polarizing beam splitter BS1 in the -Yt direction. The polarization separation surface of the polarization beam splitter BS1 is arranged at an angle of 45° with respect to the YtZt plane to reflect the beam of P-polarized light and make the beam of linearly polarized light (S-polarized light) penetrate in the direction orthogonal to the P-polarized light. Since the light beam LB1 incident to the beam scanning device MD1 is a P-polarized light beam, the polarizing beam splitter BS1 reflects the light beam LB1 from the mirror M11 to the -Xt direction to guide the mirror M12 side.

反射鏡M12相對XtYt平面傾斜45°配置,將入射之光束LB1朝從反射鏡M12於-Zt方向分離之反射鏡M13反射向-Zt方向。被反射鏡M12反射之光束LB1,沿著與Zt軸平行之光軸AXc通過像偏移光學構件SR、偏向調整光學構件DP、及場孔徑(視野光闌)FA,射入反射鏡M13。像偏移光學構件SR,係在與光束LB1之行進方向(光軸AXc)正交之平面(XtYt平面)内,進行光束LB1之剖面内之中心位置的二維調整。像偏移光學構件SR以沿著光軸AXc配置之2片石英之平行平板Sr1、Sr2構成,平行平板Sr1可繞Xt軸傾斜、平行平板Sr2則可繞Yt軸傾斜。藉由此平行平板Sr1、Sr2分別繞Xt軸、Yt軸傾斜,在與光束LB1之行進方向正交之XtYt平面,使光束LB1之中心位置二維微量偏移。此平行平板Sr1、Sr2係在控制裝置18之控制下,以未圖示之致動器(驅動部)加以驅動。The mirror M12 is arranged at an angle of 45° with respect to the XtYt plane, and reflects the incident light beam LB1 toward the mirror M13 separated from the mirror M12 in the -Zt direction to the -Zt direction. The light beam LB1 reflected by the mirror M12 passes through the image shift optical member SR, the deflection adjusting optical member DP, and the field aperture (view diaphragm) FA along the optical axis AXc parallel to the Zt axis, and enters the mirror M13. The image shifting optical member SR is in a plane (XtYt plane) orthogonal to the traveling direction (optical axis AXc) of the light beam LB1, and performs two-dimensional adjustment of the center position in the cross section of the light beam LB1. The image shifting optical member SR is composed of two quartz parallel plates Sr1 and Sr2 arranged along the optical axis AXc. The parallel plate Sr1 can be tilted around the Xt axis and the parallel plate Sr2 can be tilted around the Yt axis. The parallel plates Sr1 and Sr2 are inclined around the Xt axis and the Yt axis, respectively, and the center position of the light beam LB1 is slightly shifted in two dimensions on the XtYt plane orthogonal to the traveling direction of the light beam LB1. The parallel plates Sr1 and Sr2 are driven by an actuator (driving part) not shown under the control of the control device 18.

偏向調整光學構件DP,係用以微調整被反射鏡M12反射後通過像偏移光學構件SR而來之光束LB1相對光軸AXc之傾斜。偏向調整光學構件DP以沿著光軸AXc配置之2個楔狀稜鏡Dp1、Dp2構成,各個稜鏡Dp1、Dp2被設置成能獨立的以光軸AXc為中心360°旋轉。藉由調整2個稜鏡Dp1、Dp2之旋轉角度位置,使到達反射鏡M12之光束LB1之軸線與光軸AXc之平行、或使到達被照射面(基板FS)之光束LB1之軸線與照射中心軸Le1之平行。又,被2個稜鏡Dp1、Dp2偏向調整後之光束LB1會有在與光束LB之剖面平行之面内橫移之情形,此橫移可藉由先前之像偏移光學構件SR使其回到原來狀態。此稜鏡Dp1、Dp2係在控制裝置18之控制下,以未圖示之致動器(驅動部)加以驅動。The deflection adjusting optical member DP is used to finely adjust the tilt of the light beam LB1 from the image shifting optical member SR after being reflected by the mirror M12 with respect to the optical axis AXc. The deflection adjusting optical member DP is composed of two wedge-shaped beams Dp1 and Dp2 arranged along the optical axis AXc, and each of the beams Dp1 and Dp2 is set to independently rotate 360° around the optical axis AXc. By adjusting the rotation angle positions of the two ridges Dp1 and Dp2, the axis of the beam LB1 reaching the mirror M12 is parallel to the optical axis AXc, or the axis of the beam LB1 reaching the illuminated surface (substrate FS) is parallel to the irradiation center The axis Le1 is parallel. In addition, the beam LB1 after the deflection adjustment of the two beams Dp1 and Dp2 may traverse in a plane parallel to the cross-section of the beam LB. This traverse can be made back by the previous image shifting the optical member SR. To the original state. Under the control of the control device 18, the stubs Dp1 and Dp2 are driven by an actuator (driving part) not shown.

如前所述,通過像偏移光學構件SR與偏向調整光學構件DP之光束LB1,穿透過場孔徑(field aperture)FA之圓形開口到達反射鏡M13。場孔徑FA之圓形開口,係用以將被擴束器BE放大之光束LB1之剖面内之強度分布的和緩部分加以去除的光闌。若將場孔徑FA之圓形開口更換為可調整口徑之可變光彩光闌的話,即能調整點光SP之強度(輝度)。As mentioned above, the light beam LB1 passing through the image shift optical member SR and the deflection adjusting optical member DP penetrates the circular opening of the field aperture FA to reach the mirror M13. The circular opening of the field aperture FA is a diaphragm used to remove the gentle part of the intensity distribution in the cross-section of the beam LB1 amplified by the beam expander BE. If the circular opening of the field aperture FA is replaced with an adjustable iris diaphragm, the intensity (brightness) of the spot light SP can be adjusted.

反射鏡M13相對XtYt平面傾斜45°配置,將入射之光束LB1朝反射鏡M14反射向+Xt方向。被反射鏡M13反射之光束LB1,透過λ/4波長板QW及柱面透鏡CYa射入反射鏡M14。反射鏡M14,將入射之光束LB1反射向多面鏡(旋轉多面鏡、掃描用偏向構件)PM。多面鏡PM,將入射之光束LB1朝具有與Xt軸平行之光軸AXf的fθ透鏡FT反射向+Xt方向側。多面鏡PM,為了使光束LB1之點光SP在基板FS之被照射面上掃描,使入射之光束LB1在與XtYt平面平行之面内偏向(反射)。具體而言,多面鏡PM,具有延伸於Zt軸方向之旋轉軸AXp、與形成在旋轉軸AXp周圍之複數個反射面RP(本實施形態中,為8個反射面RP)。藉由使此多面鏡PM以旋轉軸AXp為中心往既定旋轉方向旋轉,即能使照射於反射面RP之脈衝狀之光束LB1之反射角連續變化。據此,能以1個反射面RP使光束LB1之反射方向偏向,使照射在基板FS之被照射面上之光束LB1之點光SP,沿掃描方向(基板FS之寬度方向、Yt方向)掃描。The mirror M13 is arranged at an angle of 45° with respect to the XtYt plane, and reflects the incident light beam LB1 toward the mirror M14 in the +Xt direction. The light beam LB1 reflected by the mirror M13 passes through the λ/4 wave plate QW and the cylindrical lens CYa and enters the mirror M14. The mirror M14 reflects the incident light beam LB1 to the polygon mirror (rotating polygon mirror, deflecting member for scanning) PM. The polygon mirror PM reflects the incident light beam LB1 toward the fθ lens FT having an optical axis AXf parallel to the Xt axis toward the +Xt direction side. The polygon mirror PM deflects (reflects) the incident light beam LB1 in a plane parallel to the XtYt plane in order to scan the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt axis direction, and a plurality of reflection surfaces RP (in this embodiment, eight reflection surfaces RP) formed around the rotation axis AXp. By rotating the polygon mirror PM in a predetermined rotation direction with the rotation axis AXp as the center, the reflection angle of the pulse-shaped light beam LB1 irradiated on the reflection surface RP can be continuously changed. According to this, the reflection direction of the light beam LB1 can be deflected by one reflecting surface RP, so that the spot light SP of the light beam LB1 irradiated on the illuminated surface of the substrate FS is scanned along the scanning direction (the width direction of the substrate FS, the Yt direction) .

也就是說,可藉由1個反射面RP,使光束LB1之點光SP沿描繪線SL1掃描。因此,以多面鏡PM之1旋轉,點光SP在基板FS之被照射面上掃描之描繪線SL1之數量,為與反射面RP之數量相同的8條。多面鏡PM藉由包含馬達等之多面鏡驅動部RM以一定速度旋轉。以多面鏡驅動部RM進行之多面鏡PM之旋轉,由控制裝置18加以控制。如先前之說明,描繪線SL1之實效長度(例如50mm)係設定為能以此多面鏡PM掃描點光SP之最大掃描長(例如51mm)以下之長度,初期設定(設計上)下,於最大掃描長之中央設定描繪線SL1之中心點(照射中心軸Le1通過)。In other words, the spot light SP of the light beam LB1 can be scanned along the drawing line SL1 by one reflecting surface RP. Therefore, with 1 rotation of the polygon mirror PM, the number of drawing lines SL1 scanned by the spot light SP on the illuminated surface of the substrate FS is the same as the number of the reflecting surface RP. The polygon mirror PM is rotated at a constant speed by a polygon mirror drive part RM including a motor and the like. The rotation of the polygon mirror PM by the polygon mirror drive part RM is controlled by the control device 18. As previously explained, the effective length of the drawing line SL1 (for example, 50mm) is set to a length below the maximum scanning length (for example, 51mm) of the spot light SP that can be scanned by the polygon mirror PM. The initial setting (on the design) is set at the maximum The center of the scan length sets the center point of the drawing line SL1 (the irradiation center axis Le1 passes through).

例如,設描繪線SL1之實效長度為50mm,一邊使實效尺寸φ為4μm之點光SP每2.0μm重疊、一邊使點光SP沿描繪線SL1照射在基板FS之被照射面上時,以一次掃描照射之點光SP(脈衝光)之數為25000(=50mm/2.0μm)。又,若設基板FS之副掃描方向之行進速度(搬送速度)Vt為8mm/秒,於副掃描方向點光SP之掃描亦以2.0μm之間隔進行的話,沿描繪線SL1之一次的掃描開始時點與次一掃描開始時點之時間差Tpx,即為250μ秒(=2.0μm/(8mm/秒))。此時間差Tpx,係8反射面RP之多面鏡PM旋轉1面份之角度45°(=360°/8)的時間。此時,由於多面鏡PM之1旋轉之時間係設定為2.0m秒(=8×250μ秒),因此多面鏡PM之旋轉速度Vp係設定為毎秒500旋轉(=1/2.0m秒)、亦即3萬rpm。For example, assuming that the effective length of the drawing line SL1 is 50mm, the spot light SP with the effective size φ of 4μm is overlapped every 2.0μm, and the spot light SP is irradiated on the illuminated surface of the substrate FS along the drawing line SL1. The number of spot light SP (pulsed light) for scanning irradiation is 25000 (=50mm/2.0μm). Also, if the traveling speed (conveying speed) Vt in the sub-scanning direction of the substrate FS is 8mm/sec, and the scanning of the spot light SP in the sub-scanning direction is also performed at an interval of 2.0 μm, one scan along the drawing line SL1 starts The time difference Tpx between the time point and the beginning of the next scan is 250μsec (=2.0μm/(8mm/sec)). This time difference Tpx is the time required for the polygon mirror PM of 8 reflecting surfaces RP to rotate by an angle of 45° (=360°/8) for one surface. At this time, since the time of 1 rotation of the polygon mirror PM is set to 2.0msec (=8×250μsec), the rotation speed Vp of the polygon mirror PM is set to 500 rotations per second (=1/2.0msec). That is 30,000 rpm.

另一方面,於多面鏡PM之1反射面RP反射之光束LB1有效射入fθ透鏡FT之最大入射視角(對應點光SP之最大掃描長),大致就由fθ透鏡FT之焦點距離與最大掃描長所決定。例如,若係8反射面RP之多面鏡PM時,1反射面RP份之旋轉角度45°中、有助於實掃描之旋轉角度之比率(掃描效率αp)約為1/3程度,對應fθ透鏡FT之最大入射視角(±15°之範圍、亦即30°之範圍)。因此,沿描繪線SL1之點光SP之1掃描之實效時間Tss為Tss≒Tpx/3,若係先前之數值例時,時間Tss為83.33・・・μ秒。因此,由於需在此時間Tss之期間,照射25000之點光SP(脈衝光),所以來自光源裝置14之脈衝狀之光束LB之發光頻率Fe,為Fe=25000次/83.333・・・μ秒=300MHz。On the other hand, the beam LB1 reflected on the 1 reflecting surface RP of the polygon mirror PM effectively enters the maximum incident angle of the fθ lens FT (corresponding to the maximum scanning length of the spot light SP), which is roughly determined by the focal distance of the fθ lens FT and the maximum scanning Long decides. For example, in the case of a polygon mirror PM with 8 reflecting surfaces RP, the ratio of the rotation angle (scanning efficiency αp) that contributes to the actual scanning in the rotation angle of 45° for 1 reflecting surface RP is about 1/3, corresponding to fθ The maximum incident viewing angle of the lens FT (the range of ±15°, that is, the range of 30°). Therefore, the effective time Tss of the 1 scan of the spot light SP along the drawing line SL1 is Tss≒Tpx/3. In the case of the previous numerical example, the time Tss is 83.33...μsec. Therefore, since it is necessary to irradiate 25000 point light SP (pulsed light) during this time Tss, the luminous frequency Fe of the pulsed light beam LB from the light source device 14 is Fe=25000 times/83.333···μsec =300MHz.

承上所述,除點光SP之尺寸φ(μm)、光源裝置14之發光頻率Fe(Hz)外,另設描繪線SLn之長度為LBL(μm)、點光SP之重疊率為Uo(0<Uo<1)、基板FS之搬送速度為Vt(μm/秒)、多面鏡PM之反射面RP數為Np、多面鏡PM每一反射面RP之掃描效率為αp(0<αp<1)、且φ・(1-Uo)=YP(μm)時,多面鏡PM之旋轉速度Vp(rps)即以Vp=Vt/(Np・YP)表示,發光頻率Fe(Hz)以Fe=LBL・Vt/(αp・YP 2)表示。將此2個關係式以搬送速度Vt加以整合時,即成下式。 Vt=(Vp・Np・YP)=(Fe・αp・YP 2/LBL) 因此,以滿足此關係之方式,調整基板FS之搬送速度Vt(μm/秒)、多面鏡PM之旋轉速度Vp(rps)、光源裝置14之發光頻率Fe(Hz)。 Continuing from the above, in addition to the size φ (μm) of the spot light SP and the emission frequency Fe (Hz) of the light source device 14, the length of the drawing line SLn is LBL (μm), and the overlap rate of the spot light SP is Uo ( 0<Uo<1), the conveying speed of the substrate FS is Vt (μm/sec), the number of reflection surfaces RP of the polygon mirror PM is Np, and the scanning efficiency of each reflection surface RP of the polygon mirror PM is αp (0<αp<1 ), and φ·(1-Uo)=YP(μm), the rotation speed Vp(rps) of the polygon mirror PM is expressed as Vp=Vt/(Np·YP), and the luminous frequency Fe(Hz) is expressed as Fe=LBL・Vt/(αp・YP 2 ) is expressed. When these two relational expressions are integrated with the conveying speed Vt, the following formula is obtained. Vt=(Vp・Np・YP)=(Fe・αp・YP 2 /LBL) Therefore, to meet this relationship, adjust the conveying speed Vt (μm/sec) of the substrate FS and the rotation speed Vp of the polygon mirror PM ( rps), the luminous frequency Fe (Hz) of the light source device 14.

再次回到關於圖7之說明,柱面透鏡CYa在與多面鏡PM形成之掃描方向(旋轉方向)正交之非掃描方向(Zt方向),使入射之光束LB1在多面鏡PM之反射面RP上會聚成狹縫狀。即使因母線與Yt方向平行之柱面透鏡CYa,而有使反射面RP相對Zt方向傾斜之情形(反射面RP相對XtYt平面之法線的傾斜),亦能抑制其影響,以抑制照射在基板FS之被照射面上之光束LB1之照射位置偏於Xt方向之情形。Returning to the description of FIG. 7 again, the cylindrical lens CYa is in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) formed by the polygon mirror PM, so that the incident light beam LB1 is on the reflecting surface RP of the polygon mirror PM Converges into a slit shape. Even if the reflecting surface RP is inclined with respect to the Zt direction due to the cylindrical lens CYa whose generatrix is parallel to the Yt direction (the inclination of the reflecting surface RP with respect to the normal of the XtYt plane), its influence can be suppressed to suppress the irradiation on the substrate The irradiation position of the beam LB1 on the irradiated surface of the FS is deviated from the Xt direction.

具有延伸於Xt軸方向之光軸AXf的fθ透鏡FT,係將被多面鏡PM反射之光束LB1,以在XtYt平面與光軸AXf平行之方式投射向反射鏡M15的遠心系掃描透鏡。光束LB1對fθ透鏡FT之入射角θ根據多面鏡PM之旋轉角(θ/2)而變化。fθ透鏡FT,透過反射鏡M15及柱面透鏡CYb,將光束LB1投射於與該入射角θ成正比之基板FS之被照射面上之像高位置。設焦點距離為fo、像高位置為y時,fθ透鏡FT被設計成滿足y=fo・θ之關係。因此,藉由此fθ透鏡FT,可將光束LB1正確的等速掃描於Yt方向(Y方向)。射入fθ透鏡FT之入射角θ為0度時,射入fθ透鏡FT之光束LB1沿光軸AXf上前進。The fθ lens FT with the optical axis AXf extending in the Xt axis direction projects the light beam LB1 reflected by the polygon mirror PM to the telecentric scanning lens of the mirror M15 in such a way that the XtYt plane is parallel to the optical axis AXf. The incident angle θ of the light beam LB1 to the fθ lens FT varies according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FT passes through the mirror M15 and the cylindrical lens CYb, and projects the light beam LB1 on the image height position on the illuminated surface of the substrate FS that is proportional to the incident angle θ. When the focal distance is fo and the image height position is y, the fθ lens FT is designed to satisfy the relationship of y=fo·θ. Therefore, with this fθ lens FT, the light beam LB1 can be accurately scanned in the Yt direction (Y direction) at a constant speed. When the incident angle θ entering the fθ lens FT is 0 degrees, the light beam LB1 entering the fθ lens FT travels along the optical axis AXf.

反射鏡M15,將射入之光束LB1透過柱面透鏡CYb朝基板FS反射向-Zt方向。藉由fθ透鏡FT、及母線與Yt方向平行之柱面透鏡CYb,投射至基板FS之光束LB1在基板FS之被照射面上會聚成直徑數μm程度(例如,3μm)之微小點光SP。又,投射至基板FS之被照射面上之點光SP,藉由多面鏡PM以延伸於Yt方向之描繪線SL1進行一維掃描。此外,fθ透鏡FT之光軸AXf與照射中心軸Le1在同一平面上,該平面與XtZt平面平行。因此,於光軸AXf上行進之光束LB1被反射鏡M15反射向-Zt方向,與照射中心軸Le1成同軸投射於基板FS。本實施形態中,至少fθ透鏡FT係發揮作為將被多面鏡PM偏向之光束LB1投射於基板FS之被照射面的投射光學系的功能。又,至少反射構件(反射鏡M11~M15)及偏光分束器BS1係發揮作為將從反射鏡M10至基板FS之光束LB1之光路加以彎折之光路偏向構件的功能。藉由此光路偏向構件,可使射入反射鏡M10之光束LB1之入射軸與照射中心軸Le1成為大致同軸。於XtZt平面,通過光束掃描裝置MD1内之光束LB1,在通過大致U字形或ㄈ字形之光路後,往-Zt方向前進投射於基板FS。The mirror M15 reflects the incident light beam LB1 through the cylindrical lens CYb toward the substrate FS in the -Zt direction. By the fθ lens FT and the cylindrical lens CYb whose generatrix is parallel to the Yt direction, the light beam LB1 projected on the substrate FS is condensed into a tiny spot light SP with a diameter of several μm (for example, 3 μm) on the illuminated surface of the substrate FS. In addition, the spot light SP projected on the illuminated surface of the substrate FS is scanned one-dimensionally with the drawing line SL1 extending in the Yt direction by the polygon mirror PM. In addition, the optical axis AXf of the fθ lens FT and the irradiation center axis Le1 are on the same plane, which is parallel to the XtZt plane. Therefore, the light beam LB1 traveling on the optical axis AXf is reflected by the mirror M15 in the -Zt direction, and is projected on the substrate FS coaxially with the irradiation center axis Le1. In the present embodiment, at least the fθ lens FT system functions as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate FS. In addition, at least the reflection members (mirrors M11 to M15) and the polarization beam splitter BS1 function as optical path deflection members that bend the optical path of the light beam LB1 from the mirror M10 to the substrate FS. With this optical path deflection member, the incident axis of the light beam LB1 entering the mirror M10 and the irradiation center axis Le1 can be made substantially coaxial. On the XtZt plane, the light beam LB1 in the beam scanning device MD1 passes through the roughly U-shaped or U-shaped optical path, and then proceeds in the -Zt direction and is projected onto the substrate FS.

如上所述,在基板FS被搬送於X方向之狀態下,藉由各光束掃描裝置MD(MD1~MD6)可將光束LB(LB1~LB6)之點光SP於掃描方向(Y方向)進行一維掃描,據以將點光SP於基板FS之被照射面進行相對的二維掃描。因此,可於基板FS之曝光區域W描繪曝光出既定圖案。又,雖將描繪用光學元件AOM(AOM1~AOM6)設置於光導入光學系BDU(BDU1~BDU6),但亦可設置於光束掃描裝置MD内。此場合,在反射鏡M10與反射鏡M14之間設置描繪用光學元件AOM較佳。As described above, when the substrate FS is transported in the X direction, the spot light SP of the light beam LB (LB1 to LB6) can be performed in the scanning direction (Y direction) by each beam scanning device MD (MD1 to MD6). The three-dimensional scanning is based on the relative two-dimensional scanning of the spot light SP on the illuminated surface of the substrate FS. Therefore, a predetermined pattern can be drawn and exposed on the exposure area W of the substrate FS. In addition, although the drawing optical elements AOM (AOM1 to AOM6) are provided in the light introduction optical system BDU (BDU1 to BDU6), they may also be provided in the beam scanning device MD. In this case, it is better to provide the optical element AOM for drawing between the mirror M10 and the mirror M14.

光檢測器DT1,具有對入射之光進行光電轉換的光電轉換元件。於旋轉筒DR之表面,形成有預先決定之基準圖案。形成有此基準圖案之旋轉筒DR上之部分,係以對光束LB之波長帶具低反射率(10~50%)之材料構成,未形成有基準圖案之旋轉筒DR上之其他部分,則以反射率在10%以下之材料或吸收光之材料構成。因此,在基板FS未被捲繞之狀態(或基板FS之透明部通過之狀態),將來自光束掃描裝置MD1之光束LB1之點光SP照射於旋轉筒DR之形成有基準圖案之區域時,其反射光即通過柱面透鏡CYb、反射鏡M15、fθ透鏡FT、多面鏡PM、反射鏡M14、柱面透鏡CYa、λ/4波長板QW、反射鏡M13、場孔徑FA、偏向調整光學構件DP、像偏移光學構件SR、及反射鏡M12射入偏光分束器BS1。此處,在偏光分束器BS1與基板FS之間、具體而言在反射鏡M13與柱面透鏡CYa之間設有λ/4波長板QW。如此,照射於基板FS之光束LB1即被此λ/4波長板QW從P偏光轉換成圓偏光之光束LB1,從基板FS射入偏光分束器BS1之反射光,即被此λ/4波長板QW從圓偏光轉換成S偏光。因此,來自基板FS之反射光穿透偏光分束器BS1、透過光學透鏡系G10射入光檢測器DT1。The photodetector DT1 has a photoelectric conversion element for photoelectric conversion of incident light. A predetermined reference pattern is formed on the surface of the rotating drum DR. The part on the rotating drum DR on which the reference pattern is formed is made of a material with low reflectivity (10-50%) to the wavelength band of the light beam LB, and the other parts on the rotating drum DR without the reference pattern are formed It is made of materials with reflectivity below 10% or materials that absorb light. Therefore, when the substrate FS is not wound (or the transparent part of the substrate FS passes through), when the spot light SP of the beam LB1 from the beam scanning device MD1 is irradiated on the area of the rotating drum DR where the reference pattern is formed, The reflected light passes through cylindrical lens CYb, mirror M15, fθ lens FT, polygon mirror PM, mirror M14, cylindrical lens CYa, λ/4 wavelength plate QW, mirror M13, field aperture FA, and deflection adjustment optical components The DP, the image shift optical member SR, and the mirror M12 are incident on the polarizing beam splitter BS1. Here, a λ/4 wavelength plate QW is provided between the polarization beam splitter BS1 and the substrate FS, specifically between the mirror M13 and the cylindrical lens CYa. In this way, the light beam LB1 irradiated on the substrate FS is converted from the P-polarized light to the circularly-polarized light beam LB1 by the λ/4 wavelength plate QW, and the reflected light from the substrate FS enters the polarization beam splitter BS1, which is the λ/4 wavelength The plate QW is converted from circularly polarized light to S-polarized light. Therefore, the reflected light from the substrate FS penetrates the polarizing beam splitter BS1, and enters the photodetector DT1 through the optical lens system G10.

此時,在使光導入光學系BDU1之描繪用光學元件AOM1在ON之狀態下,也就是說,在脈衝狀之光束LB1連續射入光束掃描裝置MD1之狀態下,藉由使旋轉筒DR旋轉由光束掃描裝置MD1進行點光SP之掃描,於旋轉筒DR之外周面即二維的照射點光SP。因此,即能以光檢測器DT1取得形成在旋轉筒DR之基準圖案之影像。At this time, when the drawing optical element AOM1 of the light introduction optical system BDU1 is turned on, that is, when the pulsed beam LB1 is continuously incident on the beam scanning device MD1, the rotating drum DR is rotated The spot light SP is scanned by the beam scanning device MD1, and the spot light SP is irradiated on the outer peripheral surface of the rotating drum DR in two dimensions. Therefore, the image of the reference pattern formed on the rotating drum DR can be obtained by the photodetector DT1.

具體而言,係將從光檢測器DT1輸出之光電訊號之強度變化,回應用以進行點光SP之脈衝發光之時鐘脈衝訊號(於光源裝置14内作成),就各掃描時間進行數位取樣,據以作為Yt方向之一維影像資料加以取得。進一步的,回應測量旋轉筒DR之旋轉角度位置之編碼器EC的測量值,就副掃描方向之一定距離(例如,點光SP之尺寸φ之1/2)將Yt方向之一維影像資料排列於Xt方向,據以取得旋轉筒DR表面之二維影像資訊。控制裝置18根據此取得之旋轉筒DR之基準圖案之二維影像資訊,測量光束掃描裝置MD之描繪線SL1之傾斜。此描繪線SL1之傾斜,可以是在各光束掃描裝置MD(MD1~MD6)間之相對的傾斜、亦可以是相對旋轉筒DR之中心軸AXo的傾斜(絕對的傾斜)。當然,亦可以同樣方式,測量各描繪線SL2~SL6之傾斜。Specifically, the change in the intensity of the photoelectric signal output from the photodetector DT1 responds to the clock pulse signal (made in the light source device 14) for pulsed light emission of the spot light SP, and performs digital sampling for each scanning time, It is obtained as one-dimensional image data in the Yt direction. Further, in response to the measurement value of the encoder EC measuring the rotation angle position of the rotating drum DR, the one-dimensional image data in the Yt direction is arranged at a certain distance in the sub-scanning direction (for example, 1/2 of the size of the spot light SP) In the Xt direction, the two-dimensional image information on the surface of the rotating drum DR is obtained accordingly. The control device 18 measures the tilt of the drawing line SL1 of the beam scanning device MD based on the obtained two-dimensional image information of the reference pattern of the rotating drum DR. The inclination of the drawing line SL1 may be the relative inclination between the beam scanning devices MD (MD1 to MD6), or the inclination (absolute inclination) with respect to the central axis AXo of the rotating drum DR. Of course, it is also possible to measure the inclination of each drawing line SL2 to SL6 in the same way.

於光束掃描裝置MD1之多面鏡PM之周邊,如圖8所示設有原點感測器20。原點感測器20,係輸出顯示以各反射面RP進行之點光SP之掃描開始的脈衝狀原點訊號SH。原點感測器20,在多面鏡PM之旋轉位置來到以反射面RP進行之點光SP之掃描開始前之既定位置時,輸出原點訊號SH。多面鏡PM,可在有效掃描角度範圍θs使投射於基板FS之光束LB1偏向。也就是說,以多面鏡PM反射之光束LB1之反射方向(偏向方向)進入有效掃描角度範圍θs内時,反射之光束LB1即射入fθ透鏡FT。因此,原點感測器20,在多面鏡PM之旋轉位置來到被反射面RP反射之光束LB1之反射方向進入有效掃描角度範圍θs内前之既定位置時,即輸出原點訊號SH。由於多面鏡PM進行1旋轉之期間,點光SP之掃描進行8次,因此原點感測器20亦在此1旋轉之期間輸出8次原點訊號SH。此原點感測器20檢測之原點訊號SH被送至控制裝置18。原點感測器20輸出原點訊號SH後,即開始點光SP沿描繪線SL1之掃描。At the periphery of the polygon mirror PM of the beam scanning device MD1, an origin sensor 20 is provided as shown in FIG. 8. The origin sensor 20 outputs a pulse-shaped origin signal SH indicating the start of scanning of the spot light SP performed by each reflective surface RP. The origin sensor 20 outputs an origin signal SH when the rotation position of the polygon mirror PM reaches a predetermined position before the scanning of the spot light SP by the reflective surface RP starts. The polygon mirror PM can deflect the light beam LB1 projected on the substrate FS in the effective scanning angle range θs. In other words, when the reflection direction (deflection direction) of the light beam LB1 reflected by the polygon mirror PM enters the effective scanning angle range θs, the reflected light beam LB1 enters the fθ lens FT. Therefore, the origin sensor 20 outputs the origin signal SH when the rotation position of the polygon mirror PM reaches a predetermined position before the reflection direction of the light beam LB1 reflected by the reflection surface RP enters the effective scanning angle range θs. Since the scanning of the spot light SP is performed 8 times during one rotation of the polygon mirror PM, the origin sensor 20 also outputs the origin signal SH 8 times during this one rotation. The origin signal SH detected by the origin sensor 20 is sent to the control device 18. After the origin sensor 20 outputs the origin signal SH, the scanning of the spot light SP along the drawing line SL1 is started.

原點感測器20,使用即將開始進行點光SP之掃描(光束LB之偏向)之反射面RP之相鄰反射面RP(本實施形態中,係多面鏡PM之旋轉方向之前一個反射面RP),輸出原點訊號SH。為便於區別各反射面RP,圖8中,將正在進行光束LB1之偏向之反射面RP以RPa表示,並將其他反射面RP,順著反時鐘方向(與多面鏡PM之旋轉方向相反之方向)以RPb~RPh表示。The origin sensor 20 uses the adjacent reflective surface RP of the reflective surface RP that will start scanning the spot light SP (deflection of the beam LB) (in this embodiment, the reflective surface RP before the rotation direction of the polygon mirror PM) ), output the origin signal SH. In order to distinguish between the reflecting surfaces RP, in Fig. 8, the reflecting surface RP that is deflection of the beam LB1 is denoted by RPa, and the other reflecting surfaces RP follow the counterclockwise direction (the direction opposite to the rotation direction of the polygon mirror PM). ) Expressed in RPb~RPh.

原點感測器20具備光束送光系20a,此光束送光系20a具有射出半導體雷射等非感光性之波長帶之雷射光束Bga的光源部22、以及將來自光源部22之雷射光束Bga加以反射投射向多面鏡PM之反射面RPb之反射鏡24、26。又,原點感測器20具備光束受光系20b,此光束受光系20b具有受光部28、將於反射面RPb反射之雷射光束Bga之反射光(反射光束Bgb)導向受光部28之反射鏡30、32、以及將被反射鏡32反射之反射光束Bgb聚光為微小點光之透鏡系34。受光部28具有承接被透鏡系34聚光之反射光束Bgb之點光的光電轉換元件。此處,雷射光束Bga投射於多面鏡PM之各反射面RP的位置,係被設定為成為透鏡系34之光瞳面(焦點位置)。The origin sensor 20 is provided with a light beam transmission system 20a. The beam transmission system 20a has a light source unit 22 that emits a laser beam Bga of a non-photosensitive wavelength band such as a semiconductor laser, and a laser beam from the light source unit 22 The light beam Bga is reflected and projected to the reflecting mirrors 24 and 26 of the reflecting surface RPb of the polygon mirror PM. In addition, the origin sensor 20 is provided with a light beam receiving system 20b having a light receiving part 28, and the reflected light (reflected beam Bgb) of the laser beam Bga that will be reflected on the reflecting surface RPb is guided to a mirror of the light receiving part 28 30, 32, and a lens system 34 that condenses the reflected light beam Bgb reflected by the mirror 32 into tiny spot light. The light receiving unit 28 has a photoelectric conversion element that receives the spot light of the reflected light beam Bgb collected by the lens system 34. Here, the position where the laser beam Bga is projected on each reflection surface RP of the polygon mirror PM is set to be the pupil surface (focus position) of the lens system 34.

光束送光系20a與光束受光系20b,係設置在當多面鏡PM之旋轉位置到達開始以反射面RP進行點光SP之掃描之前一刻之既定位置時,可接收光束送光系20a射出之雷射光束Bga之反射光束Bgb的位置。也就是說,光束送光系20a與光束受光系20b,係設置在進行點光SP之掃描之反射面RP到達既定角度位置時,可接收到光束送光系20a射出之雷射光束Bga之反射光束Bgb的位置。又,圖8中之符號Msf係與旋轉軸AXp同軸配置之多面鏡驅動部RM之旋轉馬達之軸。The beam sending system 20a and the beam receiving system 20b are arranged at a predetermined position just before the start of the scanning of the spot light SP with the reflective surface RP when the rotation position of the polygon mirror PM reaches a predetermined position, which can receive the laser beam emitted by the beam sending system 20a The position of the reflected beam Bgb of the incident beam Bga. That is to say, the beam sending system 20a and the beam receiving system 20b are arranged on the reflective surface RP for scanning the spot light SP to reach a predetermined angular position, and can receive the reflection of the laser beam Bga emitted by the beam sending system 20a. The position of the beam Bgb. In addition, the symbol Msf in FIG. 8 is the shaft of the rotation motor of the polygon mirror drive part RM which is coaxially arranged with the rotation axis AXp.

在受光部28内之前述光電轉換元件受光面之前,設有微幅之狹縫開口的遮光體(圖示略)。反射面RPb之角度位置在既定角度範圍内之期間,反射光束Bgb射入透鏡系34,反射光束Bgb之點光在受光部28内之前述遮光體上於一定方向掃描。此掃描中,穿透過遮光體之狹縫開口之反射光束Bgb之點光被前述光電轉換元件接收,其受光訊號被增幅器放大後作為脈衝狀之原點訊號SH輸出。In front of the light-receiving surface of the aforementioned photoelectric conversion element in the light-receiving portion 28, a light-shielding body (not shown in the figure) with a micro slit opening is provided. While the angular position of the reflective surface RPb is within a predetermined angular range, the reflected light beam Bgb enters the lens system 34, and the spot light of the reflected light beam Bgb scans in a certain direction on the aforementioned light-shielding body in the light receiving portion 28. In this scanning, the spot light of the reflected beam Bgb penetrating through the slit opening of the shading body is received by the photoelectric conversion element, and the light-receiving signal is amplified by the amplifier and output as a pulse-like origin signal SH.

原點感測器20,如上所述,係藉由使光束LB偏向(掃描點光SP)之反射面RPa,使用旋轉方向之前一個反射面RPb檢測原點訊號SH。因此,當相鄰反射面RP(例如,反射面RPa與反射面RPb)彼此所夾之各個角ηj相對設計值(反射面RP為8個時,係135度)具有誤差時,即會因該誤差之分布,如圖9所示,有原點訊號SH之產生時序在各反射面RP有不同之情形。The origin sensor 20, as described above, detects the origin signal SH by deflecting the light beam LB to the reflective surface RPa (scanning spot light SP), and using the reflective surface RPb before the rotation direction. Therefore, when adjacent reflecting surfaces RP (for example, reflecting surface RPa and reflecting surface RPb) are sandwiched by each other angle ηj relative to the design value (when the reflecting surface RP is 8, it is 135 degrees), it will be due to this The error distribution, as shown in Fig. 9, shows that the generation timing of the origin signal SH is different on each reflecting surface RP.

圖9中,將使用反射面RPb產生之原點訊號SH設為SH1。同樣的,將使用反射面RPc、RPd、RPe、・・・產生之原點訊號SH設為SH2、SH3、SH4、・・・。多面鏡PM之相鄰反射面RP彼此所夾之角ηj為設計值時,各原點訊號SH(SH1、SH2、SH3、・・・)之產生時序之間隔為時間Tpx。此時間Tpx,係多面鏡PM旋轉反射面RP之一面份所需之時間。然而,圖9中,因多面鏡PM之反射面RP所夾之角ηj之誤差,使得使用反射面RPc、RPd產生之原點訊號SH之時序,相對正規之產生時序有偏差。此外,產生原點訊號SH1、SH2、SH3、SH4、・・・之時間間隔Tp1、Tp2、Tp3、・・・,因多面鏡PM之製造誤差,在μ秒等級下,不是一定的。圖9所示之時序圖中,為Tp1<Tpx、Tp2>Tpx、Tp3<Tpx。又,將反射面RP之數設為Np、多面鏡PM之旋轉速度設為Vp時,時間Tpx即成為Tpx=1/(Np×Vp)。例如,當旋轉速度Vp為3萬rpm(=500rps)、多面鏡PM之反射面RP數Np為8時,時間Tpx即為250μ秒。又,圖9中,為使說明易於理解,誇張顯示了各原點訊號SH1、SH2、SH3、・・・、之產生時序之偏差。In FIG. 9, the origin signal SH generated by using the reflective surface RPb is set to SH1. Similarly, set the origin signal SH generated by the reflecting surface RPc, RPd, RPe, ... to SH2, SH3, SH4, .... When the angle ηj between the adjacent reflecting surfaces RP of the polygon mirror PM is a design value, the interval between the generation timings of each origin signal SH (SH1, SH2, SH3,...) is the time Tpx. This time Tpx is the time required for the polygon mirror PM to rotate a part of the reflecting surface RP. However, in FIG. 9, due to the error of the angle ηj between the reflecting surface RP of the polygon mirror PM, the timing of the origin signal SH generated by the reflecting surfaces RPc and RPd is deviated from the normal generation timing. In addition, the time intervals Tp1, Tp2, Tp3, ... for generating the origin signals SH1, SH2, SH3, SH4, ..., due to the manufacturing error of the polygon mirror PM, are not constant at the μsec level. The timing chart shown in FIG. 9 is Tp1<Tpx, Tp2>Tpx, Tp3<Tpx. Moreover, when the number of reflecting surfaces RP is set to Np and the rotation speed of the polygon mirror PM is set to Vp, the time Tpx becomes Tpx=1/(Np×Vp). For example, when the rotation speed Vp is 30,000 rpm (=500rps) and the number Np of the reflecting surface RP of the polygon mirror PM is 8, the time Tpx is 250 μsec. In addition, in Fig. 9, in order to make the explanation easy to understand, the deviation in the timing of each origin signal SH1, SH2, SH3,..., is exaggeratedly displayed.

因此,會因多面鏡PM之相鄰反射面RP彼此所夾之各角ηj之誤差,使得以各反射面RP(RPa~RPh)描繪之點光SP在基板FS之被照射面上之描繪開始點(掃描開始點)之位置於主掃描方向有所偏差。如此一來,描繪結束點之位置亦會在主掃描方向有所偏差。也就是說,以各反射面RP描繪之點光SP之描繪開始點及描繪結束點之位置不會沿X方向成直線。此點光SP之描繪開始點及描繪結束點之位置於主掃描方向有所偏差之原因,即係不會成為Tp1、Tp2、Tp3、・・・=Tpx之故。Therefore, due to the error of the angle ηj between the adjacent reflecting surfaces RP of the polygon mirror PM, the point light SP drawn by the reflecting surfaces RP (RPa~RPh) will be drawn on the illuminated surface of the substrate FS. The position of the point (scanning start point) is deviated from the main scanning direction. As a result, the position of the end point of the drawing will also deviate in the main scanning direction. That is, the positions of the drawing start point and the drawing end point of the point light SP drawn by each reflecting surface RP do not align in the X direction. The reason why the position of the drawing start point and drawing end point of the spot light SP deviates from the main scanning direction is that it does not become Tp1, Tp2, Tp3, ... = Tpx.

因此,本實施形態,係如圖9所示之時序圖般,以產生一個脈衝狀之原點訊號SH後經時間Tpx後作為描繪開始點,開始點光SP之描繪。也就是說,在原點訊號SH產生經時間Tpx後,控制裝置18即對於光束掃描裝置MD1射入光束LB1之光導入光學系BDU1之描繪用光學元件AOM1,依序輸出反應像素資料行Dw之像素資料的驅動訊號(ON/OFF)。如此,即能使用於原點訊號SH之檢測的反射面RPb、與實際掃描點光SP的反射面RP成為同一反射面。Therefore, in this embodiment, as in the timing chart shown in FIG. 9, the time Tpx after generating a pulse-like origin signal SH is used as the drawing start point, and the drawing of the spot light SP is started. In other words, after the origin signal SH is generated and the time Tpx has elapsed, the control device 18 directs the light beam LB1 to the beam scanning device MD1 into the drawing optical element AOM1 of the optical system BDU1, and sequentially outputs the pixels of the corresponding pixel data line Dw Data drive signal (ON/OFF). In this way, the reflecting surface RPb used for detection of the origin signal SH and the reflecting surface RP of the actual scanning spot light SP become the same reflecting surface.

具體言之,控制裝置18在產生原點訊號SH1後經時間Tpx後,對光導入光學系BDU1之描繪用光學元件AOM1,依序輸出反應像素資料行Dw1之像素資料的驅動訊號。如此,即能以用於原點訊號SH1之檢測的反射面RPb進行點光SP之掃描。其次,控制裝置18在原點訊號SH2產生經時間Tpx後,對光導入光學系BDU1之描繪用光學元件AOM1,依序輸出反應像素資料行Dw2之像素資料的驅動訊號。如此,即能以用於原點訊號SH2之檢測的反射面RPc進行點光SP之掃描。如此,藉由用於原點訊號SH之檢測之反射面RP的使用來進行點光SP之掃描,即使是多面鏡PM之相鄰反射面RP彼此所夾之各角ηj有誤差時,亦能抑制以各反射面RP(RPa~RPh)描繪之點光SP在基板FS之被照射面上之描繪開始點及描繪結束點之位置在主掃描方向偏差的情形。Specifically, after the time Tpx has passed after the origin signal SH1 is generated, the control device 18 directs the light to the drawing optical element AOM1 of the optical system BDU1, and sequentially outputs driving signals reflecting the pixel data of the pixel data line Dw1. In this way, the spot light SP can be scanned with the reflective surface RPb used for the detection of the origin signal SH1. Secondly, after the time Tpx has elapsed after the origin signal SH2 is generated, the control device 18 directs the light to the drawing optical element AOM1 of the optical system BDU1, and sequentially outputs driving signals reflecting the pixel data of the pixel data line Dw2. In this way, the spot light SP can be scanned by the reflective surface RPc used for the detection of the origin signal SH2. In this way, by using the reflective surface RP used for the detection of the origin signal SH to scan the spot light SP, even when the angle ηj between the adjacent reflective surfaces RP of the polygon mirror PM has an error, it can Suppress the deviation of the position of the drawing start point and the drawing end point of the spot light SP drawn on each reflective surface RP (RPa~RPh) on the illuminated surface of the substrate FS in the main scanning direction.

為達成上述目標,多面鏡PM旋轉45度之時間Tpx必須正確到μ秒等級,也就是說,必須使多面鏡PM之速度毫無偏差、精準的以等速度旋轉。在使多面鏡PM精準的以等速度旋轉時,用於原點訊號SH之產生之反射面RP,恆在時間Tpx後正確的旋轉45度,成為將光束LB1反射向fθ透鏡FT之角度。因此,藉由提高多面鏡PM之旋轉等速性、亦極力降低一旋轉中之速度不均,即能使用於原點訊號SH之產生之反射面RP的位置、與用於使光束LB1偏向進行點光SP之掃描之反射面RP的位置不同。如此,即能提升原點感測器20之配置自由度,設置剛性高且安定之構成的原點感測器。又,作為原點感測器20之檢測對象之反射面RP,雖係設為使光束LB1偏向之反射面RP之旋轉方向的前一個,但只要是多面鏡PM之旋轉方向之前即可,不限於前一個。此場合,將作為原點感測器20之檢測對象之反射面RP,設為使光束LB1偏向之反射面RP之旋轉方向之前n(1以上之整數)個之情形時,只要將描繪開始點設定在原點訊號SH之產生經n×時間Tpx後即可。In order to achieve the above goal, the 45-degree rotation time Tpx of the polygon mirror PM must be accurate to the μs level, that is, the speed of the polygon mirror PM must be rotated at a constant speed without deviation. When the polygon mirror PM is accurately rotated at a constant speed, the reflecting surface RP used for generating the origin signal SH is always correctly rotated by 45 degrees after the time Tpx, which becomes the angle at which the light beam LB1 is reflected to the fθ lens FT. Therefore, by improving the rotational isokinetic properties of the polygon mirror PM and reducing the uneven speed during a rotation, it can be used for the position of the reflecting surface RP where the origin signal SH is generated, and for deflecting the beam LB1. The position of the reflective surface RP scanned by the spot light SP is different. In this way, it is possible to increase the degree of freedom of arrangement of the origin sensor 20, and to provide the origin sensor with a high rigidity and stable structure. In addition, although the reflecting surface RP as the detection target of the origin sensor 20 is set to be before the rotation direction of the reflecting surface RP which deflects the light beam LB1, it only needs to be before the rotation direction of the polygon mirror PM. Limited to the previous one. In this case, if the reflecting surface RP as the detection target of the origin sensor 20 is set to be n (an integer greater than or equal to 1) before the rotation direction of the reflecting surface RP that deflects the light beam LB1, simply set the drawing start point Set the origin signal SH to be generated after n×time Tpx.

進一步的,藉由對從原點感測器20產生之原點訊號SH1、SH2、SH3、・・・、之各個,將描繪開始點設定在n×時間Tpx後,則對應每一描繪線SL1之像素資料行之讀出動作、資料重送(通訊)動作、或修正計算等之處理時間即能有餘裕。因此,能確實避免像素資料行之傳送錯誤、像素資料行之錯誤及局部消失。Further, by setting the drawing start point at n×time Tpx for each of the origin signals SH1, SH2, SH3, ..., generated from the origin sensor 20, each drawing line SL1 The processing time for pixel data line readout, data retransmission (communication), or correction calculation, etc. can be left. Therefore, the transmission error of the pixel data line, the error of the pixel data line and the partial disappearance can be avoided.

又,設多面鏡PM之反射面RP之數Np為8、旋轉數(旋轉速度)Vp為3.6萬rpm、掃描效率為αp≦1/3、在基板FS上之點光SP之實效直徑φ為3μm、描繪線SL1之長度LBL為50mm、及將副掃描方向(Xt方向)之描繪線SL1之間距(間隔)YP從相對點光SP之直徑φ之重疊率Uo(0<Uo<1)而設為YP=φ・(1-Uo)時,在描繪線SL1上之點光SP之一次掃描時間Tss,即為Tss=αp×Tpx=αp×1/(Np×Vp)=1/1.44(m秒)。點光SP在描繪線SL1上之掃描速度Vss,為Vss=LBL/Tss=720(m/秒)。又,重疊率Uo為1/2時,也就是說,使點光SP重疊尺寸φ之1/2時,基板FS之副掃描速度(搬送速度)Vt,成為Vt=YP/Tpx=φ×Np×Vp×(1-Uo)=7200μm/秒,重疊率Uo為2/3時,也就是說,使點光SP重疊尺寸φ之2/3時,成為Vt=4800μm/秒。此外,雖不詳細說明,但於光束掃描裝置MD2~MD6亦同樣的設有原點感測器20。Also, suppose that the number Np of the reflecting surface RP of the polygon mirror PM is 8, the number of rotations (rotation speed) Vp is 36,000 rpm, the scanning efficiency is αp≦1/3, and the effective diameter φ of the spot light SP on the substrate FS is 3μm, the length LBL of the drawing line SL1 is 50mm, and the distance (space) YP between the drawing lines SL1 in the sub-scanning direction (Xt direction) from the overlap ratio Uo (0<Uo<1) of the diameter φ of the spot light SP When YP=φ·(1-Uo), the scanning time Tss of the spot light SP on the drawing line SL1 is Tss=αp×Tpx=αp×1/(Np×Vp)=1/1.44( m seconds). The scanning speed Vss of the spot light SP on the drawing line SL1 is Vss=LBL/Tss=720 (m/sec). Also, when the overlap ratio Uo is 1/2, that is, when the spot light SP is overlapped with 1/2 of the size φ, the sub-scanning speed (conveying speed) Vt of the substrate FS becomes Vt=YP/Tpx=φ×Np ×Vp×(1-Uo)=7200μm/sec, when the overlap rate Uo is 2/3, that is, when the spot light SP is overlapped by 2/3 of the size φ, it becomes Vt=4800μm/sec. In addition, although not described in detail, the beam scanning devices MD2 to MD6 are also provided with an origin sensor 20 in the same manner.

圖10係顯示以第2機架部Ub2保持光束掃描裝置MD之保持構造的剖面圖。由於光束掃描裝置MD之保持構造,於各光束掃描裝置MD皆相同,因此僅針對光束掃描裝置MD1之保持構造加以說明,並省略對其他光束掃描裝置MD之保持構造之說明。圖10中,亦與圖7同樣的,使用Xt、Yt、Zt之三維座標進行說明。Fig. 10 is a cross-sectional view showing a holding structure for holding the beam scanning device MD by the second frame portion Ub2. Since the holding structure of the beam scanning device MD is the same for each beam scanning device MD, only the holding structure of the beam scanning device MD1 will be described, and the description of the holding structure of other beam scanning devices MD will be omitted. In FIG. 10, as in FIG. 7, the three-dimensional coordinates of Xt, Yt, and Zt are used for explanation.

光束掃描裝置MD1,具有將光學構成構件(反射鏡M10~M15、擴束器BE、偏光分束器BS1、像偏移光學構件SR、偏向調整光學構件DP、場孔徑FA、λ/4波長板QW、柱面透鏡CYa、CYb、多面鏡PM、fθ透鏡FT、光學透鏡系G10、及光檢測器DT1)如圖7所示的加以支承,能繞照射中心軸Le1旋轉之支承架40。支承架40,對應通過光束掃描裝置MD1内之光束LB1之光路,具有大致U字形或ㄈ字形之形狀。支承架40,具有與XtYt平面平行、於Zt方向分離且大致平行配置的2片平行支承部42、44、與閉塞2片平行支承部42、44之一端的閉塞支承部46。閉塞支承部46設置在平行支承部42、44之-Xt方向側。光束掃描裝置MD之光學構成構件(反射鏡M10、・・・多面鏡PM、fθ透鏡FT、反射鏡M15、柱面透鏡CYb等)係沿支承架40之外周面配置。The beam scanning device MD1 has optical components (mirrors M10 to M15, beam expander BE, polarizing beam splitter BS1, image shift optical member SR, deflection adjusting optical member DP, field aperture FA, λ/4 wavelength plate QW, cylindrical lenses CYa, CYb, polygon mirror PM, fθ lens FT, optical lens system G10, and photodetector DT1) are supported as shown in FIG. 7 and a support frame 40 capable of rotating around the irradiation center axis Le1. The supporting frame 40 corresponds to the light path passing through the light beam LB1 in the light beam scanning device MD1, and has a substantially U-shaped or U-shaped shape. The support frame 40 has two parallel support portions 42 and 44 arranged in parallel to the XtYt plane and separated and substantially parallel to the Zt direction, and a blocking support portion 46 that blocks one end of the two parallel support portions 42 and 44. The blocking support portion 46 is provided on the -Xt direction side of the parallel support portions 42 and 44. The optical components of the light beam scanning device MD (mirror M10, polygon mirror PM, fθ lens FT, mirror M15, cylindrical lens CYb, etc.) are arranged along the outer peripheral surface of the support frame 40.

又,雖省略圖示,但反射鏡M10、M11、擴束器BE、偏光分束器BS1、光學透鏡系G10及光檢測器DT1,係在平行支承部42之+Zt方向側之面被支承。同樣的雖省略圖示,像偏移光學構件SR、偏向調整光學構件DP及場孔徑FA,在閉塞支承部46之-Xt方向側之面被支承。進一步的,雖省略圖示,λ/4波長板QW、柱面透鏡CYa、CYb、反射鏡M14、M15、多面鏡PM、fθ透鏡FT及原點感測器20,在平行支承部44之-Zt方向側之面被支承。反射鏡M12在平行支承部42之+Zt方向側之面、或閉塞支承部46之-Xt方向側之面被支承,反射鏡M13在閉塞支承部46之-Xt方向側之面、或平行支承部44之-Zt方向側之面被支承。支承架40(尤其是平行支承部44)係藉由支承多面鏡驅動部RM(旋轉馬達)來支承多面鏡PM。Although not shown, the mirrors M10 and M11, the beam expander BE, the polarization beam splitter BS1, the optical lens system G10, and the photodetector DT1 are supported on the surface of the parallel support portion 42 on the +Zt direction side. Similarly, although illustration is omitted, the image shift optical member SR, the deflection adjusting optical member DP, and the field aperture FA are supported on the surface on the −Xt direction side of the blocking support portion 46. Further, although the illustration is omitted, the λ/4 wave plate QW, cylindrical lenses CYa, CYb, mirrors M14, M15, polygon mirror PM, fθ lens FT, and origin sensor 20 are in the parallel support part 44- The surface on the side in the Zt direction is supported. The mirror M12 is supported on the surface on the +Zt direction side of the parallel support portion 42 or the surface on the -Xt direction side of the blocking support portion 46, and the mirror M13 is supported on the surface on the -Xt direction side of the blocking support portion 46, or the parallel support portion 44-The surface on the Zt direction side is supported. The support frame 40 (especially the parallel support part 44) supports the polygon mirror PM by supporting the polygon mirror drive part RM (rotation motor).

在2片平行支承部42、44之未設置閉塞支承部46之另一端側,以挿入之狀態設有構成描繪裝置之一部分的圓筒(圓管)狀支柱構件BX1。在平行支承部42、44之各個與支柱構件BX1之間,裝有環狀軸承48。支柱構件BX1以固定在第2機架部Ub2之狀態被支承。因此,支承架40可相對本體架UB之第2機架部Ub2繞支柱構件BX1旋轉。又,支柱構件BX1之中心軸,以和照射中心軸Le1成同軸之方式,描繪裝置之一部分的環狀軸承48之外輪部被固定在平行支承部42、44之各個,環狀軸承48之内輪部被固定在支柱構件BX1之外周面。2處之環狀軸承48中、+Zt方向側之平行支承部42與支柱構件BX1之間之環狀軸承48,例如,係以背面組合之斜角滾珠軸承構成,-Zt方向側之平行支承部44與支柱構件BX1間之環狀軸承48則以深槽滾珠軸承構成。光束掃描裝置MD1(包含支承架40),係在從整體之重心位置往+X(+Xt)方向偏移之處被支柱構件BX1以相對中心面Poc傾斜θ之狀態(圖1、圖4)支承。如前所述,光束掃描裝置MD1係以懸臂方式支承在設於照射中心軸Le1之位置之支柱構件BX1(第2機架部Ub2)。On the other end side of the two parallel support portions 42 and 44 where the blocking support portion 46 is not provided, a cylindrical (circular tube)-shaped pillar member BX1 constituting a part of the drawing device is provided in an inserted state. Between each of the parallel support portions 42, 44 and the pillar member BX1, an annular bearing 48 is installed. The pillar member BX1 is supported in a state fixed to the second frame portion Ub2. Therefore, the support frame 40 can rotate about the pillar member BX1 with respect to the second frame portion Ub2 of the main body frame UB. In addition, the central axis of the pillar member BX1 is coaxial with the irradiation central axis Le1. The outer ring part of the annular bearing 48, which is a part of the drawing device, is fixed to each of the parallel support parts 42, 44, and the inner ring of the annular bearing 48 The part is fixed to the outer peripheral surface of the pillar member BX1. Among the two annular bearings 48, the annular bearing 48 between the parallel support portion 42 on the +Zt direction side and the pillar member BX1 is composed of, for example, a diagonal ball bearing combined on the back side, and the parallel support portion on the -Zt direction side The annular bearing 48 between 44 and the pillar member BX1 is composed of a deep groove ball bearing. The beam scanning device MD1 (including the support frame 40) is supported by the pillar member BX1 in a state inclined by θ relative to the center plane Poc at a position shifted from the overall center of gravity to the +X (+Xt) direction (Figure 1, Figure 4). As described above, the beam scanning device MD1 is cantilevered by the support member BX1 (the second frame portion Ub2) provided at the position of the irradiation center axis Le1.

光束掃描裝置MD1,具有使支承架40對第2機架部Ub2旋轉之驅動機構50。驅動機構50設在2片平行支承部42、44間之空間。如此,能使光束掃描裝置MD1更為小型化。參照圖11進一步詳細說明此驅動機構50。驅動機構50,具有線性致動器52、可動構件54、被從動構件56、以及彈簧58、60。線性致動器52、可動構件54及彈簧58,被支承在與XtYt平面平行之板狀的驅動支承構件62上。在此驅動支承構件62之+Xt方向端部,一體設有與YzZt平面平行、於+Zt方向延伸為板狀之鉛直部62a。鉛直部62a被固定在與第2機架部Ub2之YtZt平面平行之側面Ub2a。進一步的,於第2機架部Ub2之側面Ub2a,以圓管狀之支柱構件BX1之中心線與照射中心軸Le1成同軸之方式,形成有嵌合保持支柱構件BX1之U字形的凹部Ubx。嵌合在凹部Ubx内之支柱構件BX1,係由驅動支承構件62之鉛直部62a與凹部Ubx加以夾持之方式固定。The beam scanning device MD1 has a drive mechanism 50 that rotates the support frame 40 with respect to the second frame portion Ub2. The driving mechanism 50 is provided in the space between the two parallel support portions 42 and 44. In this way, the light beam scanning device MD1 can be downsized. This driving mechanism 50 will be described in further detail with reference to FIG. 11. The drive mechanism 50 has a linear actuator 52, a movable member 54, a driven member 56, and springs 58 and 60. The linear actuator 52, the movable member 54 and the spring 58 are supported by a plate-shaped drive support member 62 parallel to the XtYt plane. The +Xt direction end of the drive support member 62 is integrally provided with a vertical portion 62a that is parallel to the YzZt plane and extends in a plate shape in the +Zt direction. The vertical portion 62a is fixed to the side surface Ub2a parallel to the YtZt plane of the second frame portion Ub2. Further, on the side surface Ub2a of the second frame portion Ub2, a U-shaped recess Ubx is formed to fit and hold the pillar member BX1 so that the center line of the cylindrical pillar member BX1 is coaxial with the irradiation center axis Le1. The pillar member BX1 fitted in the recess Ubx is fixed by the vertical portion 62a of the drive support member 62 and the recess Ubx.

被從動構件56,係在固定於支承架40之閉塞支承部46之内面側(+Xt方向之側面)的狀態下被支承。被從動構件56,與承受線性致動器52之線性推力而旋動之可動構件54之一部分抵接,承受-Yt方向之力。據此,光束掃描裝置MD1之整體繞支柱構件BX1(照射中心軸Le1)旋轉。The driven member 56 is supported while being fixed to the inner surface side (side surface in the +Xt direction) of the blocking support portion 46 of the support frame 40. The driven member 56 abuts against a part of the movable member 54 that is rotated by the linear thrust of the linear actuator 52, and receives the force in the -Yt direction. According to this, the entire beam scanning device MD1 rotates around the pillar member BX1 (irradiation center axis Le1).

進一步詳細說明其構成與動作。線性致動器52具有可於Xt方向進退之桿52a,藉由控制裝置18之控制,使桿52a往Xt方向進退。桿52a之Xt方向之移動位置,係以高精度之線性編碼器等加以測量,其測量值被送至控制裝置18。可動構件54能以設在驅動支承構件62之旋轉軸54a為中心旋轉。可動構件54,具有與桿52a前端之滾輪52b抵接之第1接觸部54b、即與被從動構件56之XtZt平面平行之端面部抵接之滾輪(第2接觸部)54c。拉伸彈簧58,係以桿52a前端之滾輪52b與可動構件54之第1接觸部54b隨時抵接之方式,將第1接觸部54b彈壓向+Xt方向。因此,拉伸彈簧58之一端被固定於驅動支承構件62、另一端被固定於可動構件54 之第1接觸部54b近旁。拉伸彈簧60,係以旋轉自如的軸支在可動構件54之滾輪(第2接觸部)54c、與和被從動構件56之XtZt平面平行之端面部隨時抵接之方式,產生將可動構件54之滾輪54c拉向被從動構件56側之彈壓力。因此,拉伸彈簧60之一端被固定在可動構件54之滾輪54c之軸部、另一端被固定在被從動構件56。The structure and operation are described in further detail. The linear actuator 52 has a rod 52a that can advance and retreat in the Xt direction, and is controlled by the control device 18 to make the rod 52a advance and retreat in the Xt direction. The moving position of the rod 52a in the Xt direction is measured by a high-precision linear encoder or the like, and the measured value is sent to the control device 18. The movable member 54 can rotate around a rotating shaft 54 a provided in the drive support member 62. The movable member 54 has a first contact portion 54 b contacting the roller 52 b at the tip of the rod 52 a, that is, a roller (second contact portion) 54 c contacting an end surface parallel to the XtZt plane of the driven member 56. The tension spring 58 urges the first contact portion 54b in the +Xt direction so that the roller 52b at the tip of the rod 52a and the first contact portion 54b of the movable member 54 abut at any time. Therefore, one end of the tension spring 58 is fixed to the drive support member 62 and the other end is fixed to the vicinity of the first contact portion 54 b of the movable member 54. The tension spring 60 is rotatably supported on the roller (second contact portion) 54c of the movable member 54 and abuts at any time with the end surface parallel to the XtZt plane of the driven member 56 to produce the movable member The roller 54c of 54 is pulled toward the elastic force of the driven member 56 side. Therefore, one end of the tension spring 60 is fixed to the shaft portion of the roller 54 c of the movable member 54, and the other end is fixed to the driven member 56.

線性致動器52之桿52a位在Xt方向之移動行程之中點位置的狀態時,與滾輪52b抵接之可動構件54之第1接觸部54b之接觸面、和與滾輪54c抵接之被從動構件56之前述端面部之接觸面,被設定成在XtYt平面内正交。又,如圖11所示,線性致動器52之桿52a位在中立位置時,當設定一通過照射中心軸Le1與Xt軸平行之線段Pmc時,於XtYt平面内光束掃描裝置MD1之重心點即大致被設定在線段Pmc上。進一步的,可動構件54之旋轉軸54a與滾輪54c之軸亦被配置在線段Pmc上。When the rod 52a of the linear actuator 52 is at the midpoint of the movement stroke in the Xt direction, the contact surface of the first contact portion 54b of the movable member 54 abutting the roller 52b and the contact surface of the movable member 54b abutting the roller 54c The contact surface of the aforementioned end surface of the driven member 56 is set to be orthogonal in the XtYt plane. Also, as shown in FIG. 11, when the rod 52a of the linear actuator 52 is in the neutral position, when a line segment Pmc passing through the central axis Le1 of the illumination and parallel to the Xt axis is set, the center of gravity of the beam scanning device MD1 in the XtYt plane That is, it is roughly set on the line segment Pmc. Further, the axis of the rotation axis 54a of the movable member 54 and the axis of the roller 54c are also arranged on the line segment Pmc.

當線性致動器52使桿52a從圖11之中立位置往-Xt方向移動時,可動構件54之第1接觸部54b即抵抗彈簧58之彈壓力被桿52a前端之滾輪52b按壓,因此可動構件54以旋轉軸54a為中心,於圖11之紙面內反時針旋轉。如此一來,可動構件54之滾輪54c即將被從動構件56按壓向-Yt方向。因此,光束掃描裝置MD1(支承架40)之閉塞支承部46側,即以照射中心軸Le1為中心往-Yt方向側旋轉(亦稱-θzt旋轉)。又,當線性致動器52從圖11之中立位置使桿52a往+Xt方向移動時,因彈簧58之彈壓力,可動構件54之第1接觸部54b保持與滾輪52b之抵接狀態往+Xt方向側移動。據此,可動構件54即以旋轉軸54a為中心於圖11之紙面內順時針旋轉,可動構件54之滾輪54c往+Yt方向移動。此時,因彈簧60之彈壓力,被從動構件56保持與滾輪54c之抵接狀態往+Yt方向移動。因此,光束掃描裝置MD1之閉塞支承部46側即以照射中心軸Le1為中心往+Yt方向側旋轉(亦稱+θzt旋轉)。When the linear actuator 52 moves the rod 52a from the neutral position in FIG. 11 to the -Xt direction, the first contact portion 54b of the movable member 54 is pressed against the elastic force of the spring 58 by the roller 52b at the tip of the rod 52a, so the movable member 54 is centered on the rotating shaft 54a and rotates counterclockwise in the paper plane of FIG. 11. In this way, the roller 54c of the movable member 54 is about to be pressed by the driven member 56 in the -Yt direction. Therefore, the blocking support 46 side of the beam scanning device MD1 (support frame 40), that is, rotates toward the -Yt direction side with the irradiation center axis Le1 as the center (also called -θzt rotation). Also, when the linear actuator 52 moves the rod 52a in the +Xt direction from the neutral position in FIG. 11, the first contact portion 54b of the movable member 54 maintains the contact state with the roller 52b in the +Xt direction due to the elastic force of the spring 58 Move sideways. According to this, the movable member 54 rotates clockwise in the paper plane of FIG. 11 with the rotating shaft 54a as the center, and the roller 54c of the movable member 54 moves in the +Yt direction. At this time, due to the elastic force of the spring 60, the driven member 56 maintains the contact state with the roller 54c and moves in the +Yt direction. Therefore, the blocking support portion 46 side of the beam scanning device MD1 rotates toward the +Yt direction side with the irradiation center axis Le1 as the center (also referred to as +θzt rotation).

於本實施形態,從可動構件54之旋轉軸54a到第1接觸部54b之距離,因被設定為較從可動構件54之旋轉軸54a到滾輪54c之軸之距離長,因此線性致動器52之桿52a之Xt方向移動量縮小,而成為被從動構件56之Yt方向之移動量。再者,由於從光束掃描裝置MD1之機械性的旋轉中心圓管狀之支柱構件BX1之中心線(照射中心軸Le1),到被賦予旋轉驅動力之被從動構件56為止之距離可取得較長,因此可使光束掃描裝置MD1相對線性致動器52之桿52a之單位移動量的旋轉角度量充分的小,而能以高分解能力(μrad)控制光束掃描裝置MD1之旋轉角度設定。In this embodiment, the distance from the rotation axis 54a of the movable member 54 to the first contact portion 54b is set to be longer than the distance from the axis of the rotation axis 54a of the movable member 54 to the roller 54c, so the linear actuator 52 The movement amount of the rod 52a in the Xt direction is reduced, and becomes the movement amount of the driven member 56 in the Yt direction. Furthermore, since the center line (irradiation center axis Le1) of the cylindrical pillar member BX1 (irradiation center axis Le1) from the mechanical rotation center of the beam scanning device MD1 to the driven member 56 to which the rotational driving force is given can be made longer Therefore, the rotation angle of the beam scanning device MD1 relative to the unit movement of the rod 52a of the linear actuator 52 can be sufficiently small, and the rotation angle setting of the beam scanning device MD1 can be controlled with high resolution (μrad).

如以上之圖10(或圖4)所示之構成,各光束掃描裝置MD1~MD6係相對裝置本體(第2機架部Ub2),被圓管狀之支柱構件BX1與環狀軸承48軸支成可與各照射中心軸Le1~Le6同軸旋轉。因此,各光束掃描裝置MD1~MD6,在形成於基板FS上之各描繪線SL1~SL6之上方附近被保持於裝置本體,各光束掃描裝置MD1~MD6之閉塞支承部46側成為一機械上不受拘束之構成(不牢固的連結於裝置本體或本體架UB等之狀態)。As shown in Figure 10 (or Figure 4) above, the beam scanning devices MD1 to MD6 are opposed to the device body (the second frame portion Ub2) and are axially supported by the cylindrical pillar member BX1 and the annular bearing 48 It can rotate coaxially with each irradiation center axis Le1~Le6. Therefore, the respective beam scanning devices MD1 to MD6 are held by the device body near the drawing lines SL1 to SL6 formed on the substrate FS, and the blocking support portion 46 side of the respective beam scanning devices MD1 to MD6 becomes a mechanically different Constrained structure (not firmly connected to the device body or the body frame UB, etc.).

因此,即使是在作為各光束掃描裝置MD1~MD6之構造體的支承架40(特別是2片平行支承部42、44)因溫度變化等而產生熱膨脹之情形時,各光束掃描裝置MD1~MD6,由於在圖10、圖11中主要是往-Xt方向(閉塞支承部46側)熱膨脹,因此能抑制各描繪線SL1~SL6沿旋轉筒DR外周面之方向產生變動。亦即,亦有將圖3中所示之奇數號描繪線SL1、SL3、SL5與偶數號描繪線SL2、SL4、SL6之X方向之間隔,在不受溫度變化造成之構造體之熱變形的情形下,以微米等級保持於一定距離的優點。再者,將支承各光束掃描裝置MD1~MD6之第2機架部Ub2及支柱構件BX1,以低熱膨脹係數之金屬材料(銦剛等)或玻璃陶瓷材料(商品名:Zerodur等)加以製成,即能進一步做成熱性安定的構造。Therefore, even when the support frame 40 (especially the two parallel support portions 42, 44), which is the structure of the respective beam scanning devices MD1 to MD6, undergoes thermal expansion due to temperature changes or the like, the respective beam scanning devices MD1 to MD6 Since the thermal expansion is mainly in the −Xt direction (the blocking support portion 46 side) in FIGS. 10 and 11, it is possible to suppress variations in the directions of the drawing lines SL1 to SL6 along the outer peripheral surface of the rotating drum DR. That is to say, there is also the X-direction interval between the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6 shown in FIG. 3, so as to prevent the thermal deformation of the structure caused by temperature changes. Under the circumstances, the advantage of keeping a certain distance at the micron level. Furthermore, the second frame portion Ub2 and the pillar member BX1 supporting the respective beam scanning devices MD1 to MD6 are made of a low thermal expansion coefficient metal material (indium steel, etc.) or glass ceramic material (trade name: Zerodur, etc.) , Which can be further made into a thermally stable structure.

承上所述,於本實施形態,圖10(或圖4)所示之圓管狀支柱構件BX1與環狀軸承48,相當於將支承架40(亦即,光束掃描裝置MD整體)相對裝置本體、即第2機架部Ub2支承為能繞照射中心軸Le(Le1~Le6)旋轉之旋轉支承機構。除此之外,於本實施形態,圖10所示之上下2處之環狀軸承48,相當於將支承架40(亦即,光束掃描裝置MD整體)對裝置本體(第2機架部Ub2)之支承部分限制在距離照射中心軸Le(Le1~Le6)既定半徑(此處,係環狀軸承48之外周之半徑)内之區域,用以將支承架40結合於裝置本體的結合構件。此外,於圖10般之構造中,在無需使支承架40(光束掃描裝置MD整體)相對裝置本體(第2機架部Ub2)進行θzt旋轉,可將支承架40牢固的結合於第2機架部Ub2之情形時,只要省略環狀軸承48將圓管狀之支柱構件BX1之上端部結合於平行支承部42,將支柱構件BX1之下端部結合於平行支承部44即可。此場合,距照射中心軸Le(Le1~Le6)具有既定半徑之圓管狀之支柱構件BX1,其功能亦係作為結合構件。Continuing from the above, in this embodiment, the cylindrical pillar member BX1 and the annular bearing 48 shown in Figure 10 (or Figure 4) are equivalent to the support frame 40 (that is, the entire beam scanning device MD) facing the device body , That is, the second frame portion Ub2 is supported as a rotating support mechanism that can rotate around the irradiation center axis Le (Le1 to Le6). In addition, in this embodiment, the ring-shaped bearings 48 at the upper and lower positions shown in FIG. 10 correspond to the support frame 40 (that is, the entire beam scanning device MD) against the device body (second frame portion Ub2). The supporting part of) is limited to an area within a predetermined radius (here, the radius of the outer circumference of the annular bearing 48) from the irradiation center axis Le (Le1 ~ Le6), and is used to connect the supporting frame 40 to the coupling member of the device body. In addition, in the structure shown in FIG. 10, the support frame 40 (the entire beam scanning device MD) does not need to be rotated by θzt relative to the device body (the second frame portion Ub2), and the support frame 40 can be firmly coupled to the second machine In the case of the frame portion Ub2, it is sufficient to omit the annular bearing 48, connect the upper end of the cylindrical pillar member BX1 to the parallel support portion 42, and connect the lower end of the pillar member BX1 to the parallel support portion 44. In this case, the cylindrical pillar member BX1 with a predetermined radius from the irradiation center axis Le (Le1 to Le6) also functions as a connecting member.

圖12,係顯示於圖4(或圖10、圖11)所示之第2機架部Ub2,安裝支柱構件BX1與驅動支承構件62之狀態的立體圖。第2機架部Ub2係延伸於Y方向之角柱狀構件,其-X方向之側面Ub2a與+X方向之側面Ub2b,形成為分別相對YZ平面傾斜角度±θ(參照圖4)。於第2機架部Ub2之側面Ub2a,以貫通側面Ub2a之上下之方式形成嵌入圓管狀支柱構件BX1之U字型之凹部Ubx,而與延伸於Zt方向之奇數號之照射中心軸Le1、Le3、Le5之各個同軸。同樣的,於第2機架部Ub2之側面Ub2b,以貫通側面Ub2b之上下之方式形成有嵌入圓管狀之支柱構件BX1的U字型凹部Ubx,而與延伸於Zt方向之偶數號之照射中心軸Le2、Le4、Le6之各個同軸。此外,與驅動支承構件62一體化之鉛直部62a(參照圖10、圖11),以將形成在第2機架部Ub2之側面Ub2a、Ub2b之凹部Ubx之各個閉塞之方式,固定在側面Ub2a、Ub2b。此種構造之第2機架部Ub2結合在第3機架部Ub3,此第3機架部Ub3係用以設置在支承旋轉筒DR、對準顯微鏡ALG1~ALG4等之曝光裝置EX之本體架(本體架BFa、BFb)上。Fig. 12 is a perspective view showing a state in which the pillar member BX1 and the driving support member 62 are installed in the second frame portion Ub2 shown in Fig. 4 (or Fig. 10, Fig. 11). The second frame portion Ub2 is an angular columnar member extending in the Y direction. The side surface Ub2a in the −X direction and the side surface Ub2b in the +X direction are formed to be inclined at an angle of ±θ with respect to the YZ plane (refer to FIG. 4). On the side surface Ub2a of the second frame portion Ub2, a U-shaped recess Ubx embedded in the cylindrical pillar member BX1 is formed so as to penetrate through the upper and lower sides of the side surface Ub2a, and the U-shaped recess Ubx is formed with the odd-numbered irradiation center axis Le1, Le3 extending in the Zt direction , Le5 each coaxial. Similarly, on the side surface Ub2b of the second frame portion Ub2, a U-shaped recess Ubx inserted into the cylindrical pillar member BX1 is formed so as to penetrate through the upper and lower sides of the side Ub2b, and is aligned with the even numbered irradiation center extending in the Zt direction Each of the axes Le2, Le4, and Le6 is coaxial. In addition, the vertical portion 62a integrated with the drive support member 62 (refer to FIG. 10 and FIG. 11) is fixed to the side surface Ub2a in such a manner that each of the concave portions Ub2a and Ubx formed on the side surfaces Ub2a and Ub2b of the second frame portion Ub2 is closed. , Ub2b. The second frame portion Ub2 of this structure is combined with the third frame portion Ub3, and the third frame portion Ub3 is used to set the main body frame of the exposure device EX that supports the rotating drum DR and aligns the microscope ALG1 to ALG4. (Body frame BCa, BFb).

圖13係顯示將圖12所示之第3機架部Ub3安裝在曝光裝置EX之本體架BFa、BFb之構造的立體圖。先前之圖4中,第2機架部Ub2雖係以懸架狀態設在本體架UB之第1機架部Ub1之下部,此處,則係將第2機架部Ub2設置在本體架UB之一部分、用以軸支旋轉筒DR之本體架BFa、BFb。第3機架部Ub3,具有以將圖4中之本體架UB之第2機架部Ub2固定在中央之延伸於Y方向之角柱狀水平部、與在Y方向之兩端分別延伸於Z方向之角柱狀脚部構成的門型構造。第3機架部Ub3之兩側之脚部,被支承在於Y方向相距一間隔設置之曝光裝置EX之本體架BFa、BFb(亦與本體架UB結合)上。本體架BFa、BFb,於圖12中雖省略圖示,但係將圖2或圖4所示之突出於旋轉筒DR之Y方向兩端之軸Sft,在與第2機架部Ub2於-Z方向相隔一定距離之位置透過軸承加以軸支。又,本體架BFa、BFb之上端面係形成為於Y方向既有一定寬度(例如5cm以上)。FIG. 13 is a perspective view showing a structure in which the third frame portion Ub3 shown in FIG. 12 is mounted on the main body frames BFa and BFb of the exposure apparatus EX. In the previous Fig. 4, although the second frame portion Ub2 is suspended under the first frame portion Ub1 of the main body frame UB, here, the second frame portion Ub2 is installed on the main frame UB One part is the main frame BFa and BFb of the rotating drum DR. The third frame portion Ub3 has a prismatic horizontal portion extending in the Y direction to fix the second frame portion Ub2 of the main body frame UB in FIG. 4 in the center, and two ends in the Y direction respectively extending in the Z direction The door-shaped structure formed by the corner columnar feet. The legs on both sides of the third frame portion Ub3 are supported on the main body frames BCa and BFb (also combined with the main body frame UB) of the exposure apparatus EX arranged at a distance in the Y direction. Although the main body frames BCa and BFb are omitted in FIG. 12, the shafts Sft protruding from both ends of the rotating drum DR in the Y direction shown in FIG. 2 or 4 are connected to the second frame portion Ub2. A certain distance in the Z direction is supported by bearings. In addition, the upper end surfaces of the main body frames BFa and BFb are formed to have a certain width (for example, 5 cm or more) in the Y direction.

第3機架部Ub3之一脚部,此處係+Y方向側之脚部,雖係透過底座500固定設置在本體架BFa上,但亦可將於Z方向細長形成之第3機架部Ub3之+Y方向側之脚部,直接固定設置在本體架BFa上。於第3機架部Ub3之-Y方向側之脚部下端面,固定形成有作為與Y軸平行之稜線之V字形槽的陀螺構件501,於本體架BFb之上面則以能在該位置滾動之方式支承有嵌合於陀螺構件501之V字槽的鋼球502。因此,陀螺構件501與鋼球502具有僅能在沿V字槽之Y方向相對移動的自由度。再者,在第3機架部Ub3之-Y方向側之脚部側面之突出部Ub4與本體架BFb之間,設有用以賦予陀螺構件501之V字槽恆抵接於鋼球502之彈壓力的拉伸彈簧503,將第3機架部Ub3(及第2機架部Ub2)彈壓向-Z方向。One of the legs of the third frame portion Ub3, here is the foot portion on the +Y direction side. Although it is fixed on the main body frame BFA through the base 500, the third frame portion Ub3 may be elongated in the Z direction The legs on the +Y direction side are directly fixed on the body frame BBa. On the lower end surface of the leg on the -Y direction side of the third frame portion Ub3, a gyro member 501 is fixedly formed with a V-shaped groove as a ridge line parallel to the Y axis. On the top of the body frame BFb, it can roll at this position. The steel ball 502 fitted in the V-shaped groove of the gyro member 501 is supported by the method. Therefore, the top member 501 and the steel ball 502 have a degree of freedom that can only move relatively in the Y direction along the V-shaped groove. Furthermore, between the protruding portion Ub4 on the side of the leg on the -Y direction of the third frame portion Ub3 and the body frame BFb, there is provided a spring for giving the V-shaped groove of the gyro member 501 constant contact with the steel ball 502 The compressed extension spring 503 urges the third frame portion Ub3 (and the second frame portion Ub2) in the -Z direction.

本實施形態之情形,於第2機架部Ub2,就中心面Poc(參照圖4、圖5)左右對稱的各設有3個相同構造之共6個光束掃描裝置MD1~MD6,因此以6個光束掃描裝置MD1~MD6構成之曝光頭16整體之重心點,於X方向係位在接近中心面Poc之位置。因此,於支承曝光頭16整體之負載的第3機架部Ub3之脚部,不易產生往X方向傾斜之方向的應力,而能抑制第3機架部Ub3及第2機架部Ub2產生變形,因此能安定的將曝光頭1整體保持在既定位置。In the case of this embodiment, in the second frame portion Ub2, there are 3 beam scanning devices MD1 to MD6 of the same structure symmetrically about the center plane Poc (refer to Figures 4 and 5). The center of gravity of the entire exposure head 16 composed of two beam scanning devices MD1 to MD6 is located close to the center plane Poc in the X direction. Therefore, the legs of the third frame portion Ub3 supporting the entire load of the exposure head 16 are less likely to generate stress in the direction inclined to the X direction, and deformation of the third frame portion Ub3 and the second frame portion Ub2 can be suppressed. Therefore, the entire exposure head 1 can be stably maintained at a predetermined position.

進一步的,非以高價的低熱膨脹係數之金屬、而係以一般的鐵鑄造材料、輕金屬(鋁)等構成本體架BFa、BFb之情形時,本體架BFa、BFb各個之上端部於Y方向之距離,有可能因受到環境溫度變化及發熱零件(馬達、AOM、電性基板等)之影響,在數微米程度之範圍變動。或者,亦有可能因旋轉筒DR之軸Sft之些微的偏心、連接於軸Sft之馬達或減速機之軸偏移、軸支軸Sft之軸承之安裝狀態等,配合旋轉筒DR之旋轉週期,於本體架BFa、BFb產生Y方向之應力而導致本體架BFa、BFb之Y方向間隔在數微米程度之範圍變動的情形。即使是在有此種本體架BFa、BFb之變動的情形時,如圖13所示,由於係以在Y方向具有自由度之陀螺構件501與鋼球502支承第3機架部Ub3及第2機架部Ub2,因此即使有此種變動,亦能避免使第3機架部Ub3及第2機架部Ub2變形之虞。Furthermore, when the body frames BCa and BFb are not made of expensive metals with low coefficient of thermal expansion, but general iron casting materials, light metals (aluminum), etc., the upper ends of the body frames BFa and BFb are in the Y direction. The distance may vary in the range of a few microns due to changes in ambient temperature and heating components (motors, AOMs, electrical substrates, etc.). Or, it may be due to the slight eccentricity of the shaft Sft of the rotating drum DR, the offset of the motor or reducer connected to the shaft Sft, the installation state of the bearing of the shaft support shaft Sft, etc., to match the rotation period of the rotating drum DR. The Y-direction stress is generated in the main body frames BFa and BFb, which causes the Y-direction interval of the main body frames BFa and BFb to fluctuate in the range of several microns. Even when there is such a change in the body frame BFa and BFb, as shown in FIG. 13, the third frame portion Ub3 and the second frame portion Ub3 and the second frame portion Ub3 and the second frame portion Ub3 and the second frame portion Ub3 are supported by the gyro member 501 and the steel ball 502 having the degree of freedom in the Y direction The frame portion Ub2, therefore, even if there is such a change, the risk of deforming the third frame portion Ub3 and the second frame portion Ub2 can be avoided.

如先前之說明,光束掃描裝置MD1~MD6可分別使用圖7所示之光檢測器DT1與形成在旋轉筒DR表面之基準圖案,自我測量描繪線SL1~SL6之傾斜角度(傾斜誤差)。因此,控制裝置18可根據所測量之各描繪線SLn(SL1~SL6)之傾斜角度,驅動各光束掃描裝置MD(MD1~MD6)之線性致動器52。如此,即能使各描繪線SLn(SL1~SL6)相對的平行、或使各描繪線SLn」(SL1~SL6)與旋轉筒DR之中心軸AXo平行。又,控制裝置18,亦可根據使用對準顯微鏡ALG(ALG1~ALG4)檢測之基板FS上之對準標記MK(MK1~MK4)之位置,檢測捲繞於旋轉筒DR之基板FS之變形、或曝光區域W之變形,並根據此變形驅動各光束掃描裝置MD(MD1~MD4)之線性致動器52。如此,能提升形成在下層之圖案與新曝光之既定圖案的重疊精度。As previously explained, the beam scanning devices MD1 to MD6 can use the photodetector DT1 shown in FIG. 7 and the reference pattern formed on the surface of the rotating drum DR to measure the inclination angle (tilt error) of the drawing lines SL1 to SL6. Therefore, the control device 18 can drive the linear actuator 52 of each beam scanning device MD (MD1 to MD6) according to the measured inclination angle of each drawing line SLn (SL1 to SL6). In this way, the drawing lines SLn (SL1 to SL6) can be made parallel to each other, or the drawing lines SLn" (SL1 to SL6) can be made parallel to the central axis AXo of the rotating drum DR. In addition, the control device 18 can also detect the deformation of the substrate FS wound on the rotating drum DR based on the position of the alignment mark MK (MK1~MK4) on the substrate FS detected by the alignment microscope ALG (ALG1~ALG4). Or the deformation of the exposure area W, and the linear actuator 52 of each beam scanning device MD (MD1 to MD4) is driven according to the deformation. In this way, the overlap accuracy of the pattern formed on the lower layer and the newly exposed predetermined pattern can be improved.

圖14係顯示以曝光頭16曝光出既定圖案之曝光區域W之變形狀態的圖。曝光區域W之變形係因捲繞在旋轉筒DR被搬送之基板FS扭曲而產生。又,即使基板FS未扭曲,亦有因下層之圖案層形成時基板FS被扭曲搬送而導致基板FS之曝光區域W本身扭曲變形的情形。FIG. 14 is a diagram showing the deformed state of the exposure area W of a predetermined pattern exposed by the exposure head 16. The deformation of the exposure area W is caused by the distortion of the substrate FS that is wound around the rotating drum DR and is conveyed. In addition, even if the substrate FS is not twisted, the substrate FS may be twisted and transported during the formation of the pattern layer of the lower layer, which may cause the exposed area W of the substrate FS to be twisted and deformed.

如圖14所示,因曝光區域W扭曲變形,因此形成之對準標記MK(MK1~MK4)之位置排列亦非直線,而是成扭曲狀態。此外,以虛線所示之曝光區域W’,係顯示幾乎沒有變形之理想的曝光區域。控制裝置18,根據使用對準顯微鏡ALG(ALG1~ALG4)檢測之基板FS上之對準標記MK(MK1~MK4)之位置,推定曝光區域W之變形,配合曝光區域W之變形狀態,驅動各光束掃描裝置MD(MD1~MD6)之線性致動器52。又,在緊接著對曝光區域W之使用描繪線SL1~SL6之描繪曝光開始後,雖能檢測較圖3所示之對準顯微鏡ALG1~ALG4之各觀察區域Vw1~Vw4在+X方向側之對準標記MK2、MK3之位置,但較各觀察區域Vw1~Vw4位在上游側(-X方向側)之對準標記MK2、MK3之位置,在基板FS未被送來進行描繪曝光是無法檢測的。因此,控制裝置18,例如,亦可根據從在基板FS之長邊方向排列之前一個曝光區域W周圍所附之對準標記MK1~MK4之各位置之檢測結果求出之變形量及變形傾向,推定待曝光現在圖案之曝光區域W之變形。As shown in Fig. 14, because the exposure area W is twisted and deformed, the alignment of the alignment marks MK (MK1~MK4) formed is not straight, but twisted. In addition, the exposure area W'shown by the dotted line shows an ideal exposure area with almost no distortion. The control device 18 estimates the deformation of the exposure area W according to the position of the alignment mark MK (MK1~MK4) on the substrate FS detected by the alignment microscope ALG (ALG1~ALG4), and drives each The linear actuator 52 of the beam scanning device MD (MD1~MD6). In addition, immediately after the start of the drawing exposure using the drawing lines SL1 to SL6 of the exposure area W, it is possible to detect the pair of observation areas Vw1 to Vw4 on the +X direction side of the alignment microscopes ALG1 to ALG4 shown in FIG. 3 The positions of the alignment marks MK2 and MK3, but the positions of the alignment marks MK2 and MK3 on the upstream side (-X direction side) of the observation areas Vw1~Vw4, cannot be detected when the substrate FS is not sent for drawing exposure . Therefore, the control device 18 may, for example, obtain the amount of deformation and the tendency of deformation based on the detection results of the respective positions of the alignment marks MK1 to MK4 attached to the periphery of the one exposure area W before being arranged in the longitudinal direction of the substrate FS. Estimate the deformation of the exposed area W of the current pattern to be exposed.

如前所述,於本實施形態,由於能使光束掃描裝置MD高精度繞相對基板FS之被照射面垂直通過描繪線SLn之中點(特定點)的照射中心軸Le旋轉,因此能簡單且精密的調整描繪線SLn之傾斜。如此一來,描繪線SLn即以描繪線SLn之中點為中心在基板FS之被照射面上旋轉,因此能在將描繪線SLn之X(Xt)方向、Y(Yt)方向之位置變動控制於最小限度之同時,簡單的調整描繪線SLn之傾斜。例如,當使描繪線SLn以離開描繪線SLn之位置為中心點旋轉時,描繪線SLn之位置會以該中心點為中心以描繪圓弧之方式大幅移動,但本實施形態中,可將描繪線SLn之兩端(掃描開始點與掃描結束點)之各位置變動控制在最小限度。也就是說,藉由描繪線SLn之傾斜調整後之兩端之位置變動,就描繪線SLn之中點成對稱。As described above, in this embodiment, the beam scanning device MD can be rotated with high precision around the irradiation center axis Le that passes through the midpoint (specific point) of the drawing line SLn perpendicular to the irradiated surface of the substrate FS, so it can be simple and The tilt of the drawing line SLn is precisely adjusted. In this way, the drawing line SLn rotates on the irradiated surface of the substrate FS with the midpoint of the drawing line SLn as the center. Therefore, the position change of the drawing line SLn in the X (Xt) direction and Y (Yt) direction can be controlled At the same time as a minimum, simply adjust the tilt of the drawing line SLn. For example, when the drawing line SLn is rotated with the position away from the drawing line SLn as the center point, the position of the drawing line SLn will be moved largely by drawing an arc with the center point as the center, but in this embodiment, the drawing can be The variation of each position of the two ends of the line SLn (the scanning start point and the scanning end point) is controlled to a minimum. In other words, by changing the positions of both ends of the drawing line SLn after the tilt adjustment, the midpoint of the drawing line SLn becomes symmetrical.

此外,由於不需要進行如特開平8-11348號公報所揭示之複雜的傾斜調整,因此亦不會產生因傾斜調整引起之主掃描方向與副掃描方向之位置偏移。即使調整描繪線SLn之傾斜,因光束掃描裝置MD之柱面透鏡CYb與基板FS之被照射面之距離固定,因此無需進行如特開平8-11348號公報所揭示之複雜的傾斜調整,不會產生因傾斜調整引起之主掃描方向之倍率偏差。In addition, since there is no need to perform the complicated tilt adjustment as disclosed in JP-A-8-11348, there will be no positional deviation between the main scanning direction and the sub-scanning direction caused by the tilt adjustment. Even if the tilt of the drawing line SLn is adjusted, the distance between the cylindrical lens CYb of the beam scanning device MD and the irradiated surface of the substrate FS is fixed, so there is no need to perform complicated tilt adjustments as disclosed in Japanese Patent Laid-Open No. 8-11348. The magnification deviation in the main scanning direction caused by tilt adjustment occurs.

又,照射中心軸Le可以是相對基板FS之被照射面垂直通過描繪線SLn上之任意點(特定點)的軸。此場合,描繪線SLn雖係以描繪線SLn上之任意點為中心旋轉,但與將中心點設定在與描繪線SLn分離之位置之情形相較,可減小描繪線SLn之位置變動(橫移)。In addition, the irradiation center axis Le may be an axis that passes through any point (specific point) on the drawing line SLn perpendicular to the irradiated surface of the substrate FS. In this case, although the drawing line SLn is rotated around an arbitrary point on the drawing line SLn, compared with the case where the center point is set at a position separated from the drawing line SLn, the positional variation of the drawing line SLn (horizontal shift).

再者,於本實施形態,由於係以和垂直通過描繪線SLn之中點的照射中心軸Le大致同軸之方式,使光束LB射入光束掃描裝置MD之反射鏡M10,因此即使是在光束掃描裝置MD繞照射中心軸Le進行θzt旋轉之情形時,射入反射鏡M10上之光束LB之位置亦不會變。因此,即使是在使光束掃描裝置MD進行θzt旋轉時之情形時,通過光束掃描裝置MD内之光束LB之光路亦不會改變,光束LB能依規定正確的通過光束掃描裝置MD内。如此,即使使光束掃描裝置MD進行θzt旋轉,亦不會產生因光束LB1之光暈等導致點光SP無法投射到基板FS之被照射面、或點光SP投射到脫離傾斜調整後之描繪線SLn之位置等的問題。Furthermore, in this embodiment, the light beam LB is incident on the mirror M10 of the beam scanning device MD so that the beam LB is made to enter the mirror M10 of the beam scanning device MD so that it is approximately coaxial with the irradiation center axis Le passing through the midpoint of the drawing line SLn. When the device MD rotates θzt around the irradiation center axis Le, the position of the light beam LB incident on the mirror M10 will not change. Therefore, even when the beam scanning device MD is rotated by θzt, the optical path of the light beam LB in the beam scanning device MD will not change, and the light beam LB can pass through the beam scanning device MD correctly according to regulations. In this way, even if the beam scanning device MD is rotated by θzt, the spot light SP cannot be projected to the irradiated surface of the substrate FS due to the halo of the beam LB1, or the spot light SP is projected to the drawn line after the tilt adjustment. The location of SLn, etc.

藉由光束掃描裝置MD之支承架40,光學構成構件(反射鏡M10~M15、柱面透鏡CYa、CYb、多面鏡PM、及fθ透鏡FT等)受到支承,支承架40被支承為能相對第2機架部Ub2旋轉。此外,由於由於能以電性方式控制被支承於第2機架部Ub2之線性致動器52,因此可視檢測出之對準標記MK之位置、及所測量之描繪線SLn之固有的傾斜,以電性方式自動調整描繪線SLn之傾斜。By the support frame 40 of the beam scanning device MD, the optical components (mirrors M10 to M15, cylindrical lenses CYa, CYb, polygon mirror PM, and fθ lens FT, etc.) are supported, and the support frame 40 is supported so as to be able to be opposed to the first 2 The frame part Ub2 rotates. In addition, since the linear actuator 52 supported by the second frame portion Ub2 can be electrically controlled, the position of the alignment mark MK that is detected visually and the inherent tilt of the measured drawing line SLn can be visually detected. The tilt of the drawing line SLn is automatically adjusted electrically.

又,於圖7所示之光束掃描裝置MD(MD1~MD6)之光學構成,雖係將描繪線SLn(SL1~SL6)之旋轉中心設定在描繪線SLn之中點,但不限於此,只要是在描繪線SLn上的話,偏離中點亦可。具體而言,圖7(及圖10、圖11)之構成中,例如,可使沿光軸AXa配置之反射鏡M10、擴束器BE、反射鏡M11及圓管狀之支柱構件BX1(及環狀軸承48),從圖7(圖11)之位置往+Yt方向平行移動即可。In addition, in the optical configuration of the beam scanning device MD (MD1 to MD6) shown in FIG. 7, although the rotation center of the drawing line SLn (SL1 to SL6) is set at the midpoint of the drawing line SLn, it is not limited to this, as long as If it is on the drawing line SLn, it may deviate from the midpoint. Specifically, in the configuration of FIG. 7 (and FIG. 10 and FIG. 11), for example, a mirror M10, a beam expander BE, a mirror M11, and a cylindrical pillar member BX1 (and a ring) arranged along the optical axis AXa Bearing 48), move in parallel from the position shown in Figure 7 (Figure 11) to the +Yt direction.

[變形例] 上述實施形態亦可有以下之變形。 [Modifications] The above-mentioned embodiment may be modified as follows.

(變形例1)圖15係顯示變形例1中之光束掃描裝置MD之光學構成的圖。針對與圖7相同之構成係賦予相同參照符號、並省略其說明。又,各光束掃描裝置MD(MD1~MD6)由於具有相同構成,因此僅說明光束掃描裝置MD1,其他光束掃描裝置MD則省略說明。(Modification 1) FIG. 15 is a diagram showing the optical configuration of the beam scanning device MD in Modification 1. The same reference numerals are assigned to the same configuration as in FIG. 7 and the description thereof is omitted. In addition, since the respective beam scanning devices MD (MD1 to MD6) have the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.

光束掃描裝置MD1,具有反射鏡M10、擴束器BE、反射鏡M20、分束器BS2、反射鏡M21、偏光分束器BS3、λ/4波長板QW、反射鏡M22~M24、柱面透鏡CYa、多面鏡PM、fθ透鏡FT、反射鏡M15、柱面透鏡CYb、光檢測器DT1、及位置檢測器DT2。又,圖15中,省略了像偏移光學構件SR與偏向調整光學構件DP。Beam scanning device MD1, with mirror M10, beam expander BE, mirror M20, beam splitter BS2, mirror M21, polarizing beam splitter BS3, λ/4 wave plate QW, mirror M22~M24, cylindrical lens CYa, polygon mirror PM, fθ lens FT, mirror M15, cylindrical lens CYb, light detector DT1, and position detector DT2. In addition, in FIG. 15, the image shift optical member SR and the deflection adjusting optical member DP are omitted.

射入光束掃描裝置MD1之光束LB1,朝-Zt方向行進,射入反射鏡M10。此射入光束掃描裝置MD1之光束LB1,以和照射中心軸Le1成同軸之方式射入反射鏡M10。其功能在作為入射光學構件之反射鏡M10,將入射之光束LB1朝反射鏡M20反射向-Xt方向。被反射鏡M10反射之光束LB1,穿透擴束器BE射入反射鏡M20。The beam LB1 that enters the beam scanning device MD1 travels in the -Zt direction and enters the mirror M10. The beam LB1 of the incident beam scanning device MD1 is incident on the mirror M10 in a manner coaxial with the irradiation center axis Le1. Its function is to reflect the incident light beam LB1 toward the mirror M20 toward the -Xt direction by the mirror M10 as the incident optical component. The light beam LB1 reflected by the mirror M10 penetrates the beam expander BE and enters the mirror M20.

反射鏡M20,將射入之光束LB1朝反射鏡M21反射向-Zt方向。於反射鏡M20反射之光束LB1,射入分束器BS2。分束器BS2,使射入之光束LB1之一部分穿透朝向反射鏡M21、並使射入之光束LB1之其餘部分反射向位置檢測器DT2。分束器BS2,使較反射之光束LB1之光量更多之光量穿透朝向反射鏡M21。例如,穿透之光量與反射之光量之比為9比1。The mirror M20 reflects the incident light beam LB1 toward the mirror M21 in the -Zt direction. The light beam LB1 reflected by the mirror M20 enters the beam splitter BS2. The beam splitter BS2 makes a part of the incident light beam LB1 penetrate toward the mirror M21, and reflects the remaining part of the incident light beam LB1 toward the position detector DT2. The beam splitter BS2 makes the amount of light more than that of the reflected light beam LB1 penetrate toward the mirror M21. For example, the ratio of the amount of transmitted light to the amount of reflected light is 9 to 1.

反射鏡M21,將射入之光束LB1朝反射鏡M22反射向+Xt方向。於反射鏡M21反射之光束LB1,穿透偏光分束器BS3及λ/4波長板QW射入反射鏡M22。偏光分束器BS3,使P偏光之光束穿透、並使S偏光之光束LB1反射。射入光束掃描裝置MD1之光束LB1,由於係P偏光之光束,因此偏光分束器BS3使來自反射鏡M21之光束LB1穿透朝向反射鏡M22。The mirror M21 reflects the incident light beam LB1 toward the mirror M22 in the +Xt direction. The light beam LB1 reflected by the mirror M21 penetrates the polarizing beam splitter BS3 and the λ/4 wave plate QW and enters the mirror M22. The polarization beam splitter BS3 transmits the P-polarized light beam and reflects the S-polarized light beam LB1. Since the light beam LB1 incident on the beam scanning device MD1 is a P-polarized light beam, the polarization beam splitter BS3 makes the light beam LB1 from the mirror M21 penetrate toward the mirror M22.

被反射鏡M22~M24將其光路彎折之光束LB1,通過柱面透鏡CYa射入多面鏡PM。柱面透鏡CYa之母線被設定為與XtYt平面平行,光束LB1,在具有與Zt軸平行之旋轉軸的多面鏡PM之反射面RP上,在與XtYt平面平行之方向聚光成狹縫狀延伸。多面鏡PM,使入射之光束LB1偏向後朝fθ透鏡FT反射向+Xt方向側。多面鏡PM,藉由多面鏡驅動部(馬達)RM以一定速度旋轉。具有延伸於Xt軸方向之光軸AXf的fθ透鏡FT,透過反射鏡M15及柱面透鏡CYb,將光束LB1之點光SP投射在與其入射角成正比之基板FS之被照射面上之像高位置。反射鏡M15,將射入之光束LB1透過柱面透鏡CYb朝基板FS反射向-Zt方向。The light beam LB1 whose optical path is bent by the reflecting mirrors M22~M24 is incident on the polygon mirror PM through the cylindrical lens CYa. The generating line of the cylindrical lens CYa is set to be parallel to the XtYt plane, and the light beam LB1 is condensed into a slit-like extension on the reflecting surface RP of the polygon mirror PM having a rotation axis parallel to the Zt axis in the direction parallel to the XtYt plane . The polygon mirror PM deflects the incident light beam LB1 and reflects it to the +Xt direction side toward the fθ lens FT. The polygon mirror PM is rotated at a constant speed by the polygon mirror drive unit (motor) RM. The fθ lens FT with the optical axis AXf extending in the Xt axis direction, through the mirror M15 and the cylindrical lens CYb, projects the spot light SP of the beam LB1 on the irradiated surface of the substrate FS that is proportional to the incident angle. The image height position. The mirror M15 reflects the incident light beam LB1 through the cylindrical lens CYb toward the substrate FS in the -Zt direction.

藉由fθ透鏡FT及母線與Yt方向平行之柱面透鏡CYb,投射在基板FS之光束LB1在基板FS之被照射面上會聚成直徑數μm程度(例如,3μm)之微小點光SP。此處,至少fθ透鏡FT之功能亦是作為將被多面鏡PM偏向之光束LB1投射於基板FS之被照射面的投射光學系。又,至少反射構件(反射鏡M15、M20~M24)之功能是作為使從反射鏡M10到基板FS之光束LB1之光路彎折的光路偏向構件。藉由此光路偏向構件,可使射入反射鏡M10之光束LB1的入射軸、與在Zt方向通過描繪線SL1之中點的照射中心軸Le1成為大致同軸。The light beam LB1 projected on the substrate FS is condensed into a tiny spot light SP with a diameter of several μm (for example, 3 μm) on the illuminated surface of the substrate FS by the fθ lens FT and the cylindrical lens CYb whose generatrix is parallel to the Yt direction. Here, at least the fθ lens FT also functions as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate FS. In addition, at least the reflection member (mirrors M15, M20 to M24) functions as an optical path deflecting member that bends the optical path of the light beam LB1 from the mirror M10 to the substrate FS. With this optical path deflection member, the incident axis of the light beam LB1 entering the mirror M10 and the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in the Zt direction can be made substantially coaxial.

來自旋轉筒DR(或基板FS)之反射光,通過柱面透鏡CYb、反射鏡M15、fθ透鏡FT、多面鏡PM、柱面透鏡CYa、反射鏡M24~M22、及λ/4波長板QW後射入偏光分束器BS3。此處,係藉由設在偏光分束器BS3與基板FS之間,具體而言,設在偏光分束器BS3與反射鏡M22之間之λ/4波長板QW,將照射於基板FS之光束LB1從P偏光轉換為圓偏光之光束LB1,從基板FS回到偏光分束器BS3之圓偏光之反射光,藉由此λ/4波長板QW,從圓偏光被轉換為S偏光之光束LB1。因此,來自基板FS之反射光於偏光分束器BS3反射後射入光檢測器DT1。如此,即能以和上述實施形態相同之手法,檢測光束掃描裝置MD1之描繪線SL1之固有的傾斜。The reflected light from the rotating drum DR (or the substrate FS) passes through the cylindrical lens CYb, the mirror M15, the fθ lens FT, the polygon mirror PM, the cylindrical lens CYa, the mirror M24~M22, and the λ/4 wavelength plate QW. Into the polarizing beam splitter BS3. Here, the λ/4-wavelength plate QW provided between the polarizing beam splitter BS3 and the substrate FS, specifically, the λ/4 wavelength plate QW provided between the polarizing beam splitter BS3 and the mirror M22, will irradiate the substrate FS The light beam LB1 is converted from P-polarized light to circularly-polarized light beam LB1, and returned from the substrate FS to the circularly polarized light reflected by the polarization beam splitter BS3. By this λ/4 wavelength plate QW, the circularly polarized light is converted to the S-polarized light beam. LB1. Therefore, the reflected light from the substrate FS is reflected by the polarization beam splitter BS3 and then enters the photodetector DT1. In this way, it is possible to detect the inherent inclination of the drawing line SL1 of the beam scanning device MD1 in the same manner as in the above-mentioned embodiment.

又,位置檢測器DT2係用以檢測射入之光束LB1之中心位置,例如係使用4分割感測器。此4分割感測器具有4個光二極體(光電轉換元件),使用4個光二極體之各個所接收之受光量之差(訊號位準之差),在與光束LB1之行進方向正交之XtZt平面,檢測光束LB1之中心位置。即能判斷光束LB1相對所欲之位置是否有偏離。亦可在反射鏡M10與分束器BS2之間,設置上述實施形態所說明之像偏移光學構件SR或偏向調整光學構件DP。如此一來,控制裝置18即能根據位置檢測器DT2之檢測結果,調整光束LB1之中心位置及傾斜。In addition, the position detector DT2 is used to detect the center position of the incident light beam LB1, for example, a 4-segment sensor is used. This 4-segment sensor has 4 photodiodes (photoelectric conversion elements), and uses the difference (signal level difference) of the received light received by each of the 4 photodiodes, which is orthogonal to the traveling direction of the beam LB1 The XtZt plane detects the center position of the beam LB1. That is, it can be judged whether the light beam LB1 deviates from the desired position. It is also possible to provide the image shift optical member SR or the deflection adjusting optical member DP described in the above embodiment between the mirror M10 and the beam splitter BS2. In this way, the control device 18 can adjust the center position and tilt of the light beam LB1 according to the detection result of the position detector DT2.

(變形例2)圖16係顯示變形例2中之光束掃描裝置MD之光學構成的圖。圖16中,僅顯示與圖7或圖15相異之部分,圖示省略了較多面鏡PM靠反射鏡M10側之光學系。針對與圖7或圖15相同之構成係賦予相同參照符號,省略其說明。又,由於各光束掃描裝置MD(MD1~MD6)具有相同構成,因此僅說明光束掃描裝置MD1,其他光束掃描裝置MD之說明則予以省略。(Modification 2) FIG. 16 is a diagram showing the optical configuration of the beam scanning device MD in Modification 2. In FIG. 16, only the parts that are different from those in FIG. 7 or FIG. 15 are shown, and the optical system with more mirrors PM on the side of the mirror M10 is omitted from the illustration. The same reference numerals are assigned to the same configurations as those in FIG. 7 or FIG. 15, and the description thereof is omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.

光束掃描裝置MD1,具有使描繪線SL1以照射中心軸Le1為中心(以描繪線SL1之中點為中心)旋轉之像旋轉光學系IR。像旋轉光學系IR繞照射中心軸Le1旋轉,據以使描繪線SL1旋轉。像旋轉光學系IR設置在柱面透鏡CYb與基板FS之被照射面之間。作為此像旋轉光學系IR,可使用例如影像旋轉器。像旋轉光學系IR係設置成通過從柱面透鏡CYb射入像旋轉光學系IR之光束LB1之掃描軌跡中點之光束LB1之入射軸,與照射中心軸Le1成大致同軸。如此,像旋轉光學系IR即能使描繪線SL1以照射中心軸Le1為中心旋轉。此像旋轉光學系IR,係藉由以控制裝置18控制之未圖示的致動器(驅動部),繞照射中心軸Le1旋轉。The beam scanning device MD1 has an image rotation optical system IR that rotates the drawing line SL1 about the irradiation center axis Le1 (centering on the midpoint of the drawing line SL1). The image rotation optical system IR rotates around the irradiation center axis Le1, and accordingly the drawing line SL1 is rotated. The image rotation optical system IR is provided between the cylindrical lens CYb and the illuminated surface of the substrate FS. As this image rotating optical system IR, for example, an image rotator can be used. The image rotation optical system IR system is set so that the incident axis of the light beam LB1 at the midpoint of the scanning track of the light beam LB1 of the image rotation optical system IR from the cylindrical lens CYb is substantially coaxial with the irradiation center axis Le1. In this way, the image rotating optical system IR can rotate the drawing line SL1 about the irradiation center axis Le1. This image rotating optical system IR is rotated around the irradiation center axis Le1 by an actuator (drive part) not shown in the figure controlled by the control device 18.

此像旋轉光學系IR,雖未圖示,例如能以可旋轉之方式支承在圖10所示之支承架40之平行支承部44之一部分。因此,即使支承架40(光束掃描裝置MD1)不是能繞照射中心軸Le1旋轉之構造,亦能藉由使像旋轉光學系IR繞照射中心軸Le1旋轉,據以調整描繪線SL1之傾斜。又,亦可做成支承架40(光束掃描裝置MD1)能繞照射中心軸Le1旋轉之構成,並使像旋轉光學系IR亦能相對支承架40(光束掃描裝置MD1)獨立繞照射中心軸Le1進行θzt旋轉。This image rotating optical system IR, although not shown, can be rotatably supported by a part of the parallel support portion 44 of the support frame 40 shown in FIG. 10, for example. Therefore, even if the support frame 40 (beam scanning device MD1) does not have a structure capable of rotating around the irradiation center axis Le1, the image rotating optical system IR can be rotated about the irradiation center axis Le1 to adjust the tilt of the drawing line SL1 accordingly. In addition, the support frame 40 (beam scanning device MD1) can be made to rotate around the irradiation center axis Le1, and the image rotating optical system IR can also be independently rotated around the irradiation center axis Le1 relative to the support frame 40 (beam scanning device MD1) Perform θzt rotation.

如前所述,除光束掃描裝置MD1繞照射中心軸Le1之旋轉外,由於能使像旋轉光學系IR單獨的繞照射中心軸Le1旋轉,因此可在例如以像旋轉光學系IR進行描繪線SL1之傾斜粗調整後,以光束掃描裝置MD1整體之旋轉進行描繪線SL1之傾斜之微調整。因此,能提升描繪線SL1之傾斜調整之精度。又,在照射中心軸Le1係相對基板FS之被照射面垂直通過描繪線SL1上之任意點之軸的情形時,與此對應的,可使照射中心軸Le1通過從柱面透鏡CYb射入像旋轉光學系IR之光束LB1之掃描軌跡之任意點。As mentioned above, in addition to the rotation of the beam scanning device MD1 around the irradiation center axis Le1, since the image rotating optical system IR can be individually rotated about the irradiation center axis Le1, the line SL1 can be drawn by, for example, the image rotating optical system IR. After the rough adjustment of the tilt, the slight adjustment of the tilt of the drawing line SL1 is performed by rotating the entire beam scanning device MD1. Therefore, the accuracy of the tilt adjustment of the drawing line SL1 can be improved. In addition, when the irradiation center axis Le1 is an axis perpendicular to the irradiated surface of the substrate FS passing through any point on the drawing line SL1, correspondingly, the irradiation center axis Le1 can pass through the cylindrical lens CYb to enter the image Any point of the scanning track of the beam LB1 of the rotating optical system IR.

(變形例3)上述變形例2中,係使光束掃描裝置MD(MD1~MD6)繞照射中心軸Le(Le1~Le6)旋轉,但光束掃描裝置MD(MD1~MD6)亦可不繞照射中心軸Le(Le1~Le6)旋轉。此場合,第2機架部Ub2可將光束掃描裝置MD(MD1~MD6)之支承架40以無法旋轉之固定狀態加以保持。此係因光束掃描裝置MD(MD1~MD6)不繞照射中心軸Le(Le1~Le6)旋轉,亦能藉由圖16所示之像旋轉光學系IR,使描繪線SLn(SL1~SL6)以照射中心軸Le(Le1~Le6)為中心旋轉之故。(Modification 3) In the above modification 2, the beam scanning device MD (MD1 to MD6) is rotated around the irradiation center axis Le (Le1 to Le6), but the beam scanning device MD (MD1 to MD6) may not be around the irradiation center axis Le (Le1~Le6) rotate. In this case, the second frame portion Ub2 can hold the support frame 40 of the beam scanning device MD (MD1 to MD6) in a non-rotatable fixed state. This is because the beam scanning device MD (MD1~MD6) does not rotate around the irradiation center axis Le (Le1~Le6), and the image rotating optical system IR shown in FIG. 16 can also make the drawing line SLn (SL1~SL6) The irradiation center axis Le (Le1~Le6) is the center rotation.

(變形例4)圖17A、圖17B係顯示變形例4中之光束掃描裝置MD之光學構成的圖。圖17A、圖17B中,針對與圖7相同之構成係賦予相同參照符號,省略其說明。又,由於各光束掃描裝置MD(MD1~MD6)具有相同構成,因此僅說明光束掃描裝置MD1,其他光束掃描裝置MD則省略說明。此外,圖17A係將本變形例4之光束掃描裝置MD1在與XtZt平面平行之面内加以觀察者,而圖17B則係將本變形例4之光束掃描裝置MD1在與YtZt平面平行之面内加以觀察者。(Modification 4) FIGS. 17A and 17B are diagrams showing the optical configuration of the beam scanning device MD in Modification 4. In FIGS. 17A and 17B, the same reference numerals are given to the same components as those in FIG. 7, and the description thereof is omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted. In addition, Fig. 17A shows the beam scanning device MD1 of this modification 4 in a plane parallel to the XtZt plane, and Fig. 17B shows the beam scanning device MD1 of this modification 4 in a plane parallel to the YtZt plane. Observer.

光束掃描裝置MD1,具有柱面透鏡CYa、反射構件RF、fθ透鏡FT、多面鏡PM、及柱面透鏡CYb。往-Zt方向行進射入光束掃描裝置MD1之光束LB1,係被設定成與和Zt軸平行通過描繪線SL1之中點之照射中心軸Le1成同軸。本變形例4中,於光束LB1之光路中之光束掃描裝置MD1之前設置透鏡系GLa,光束LB1在與基板FS之表面光學共軛之面Cjp聚光成點光。於共軛面Cjp聚光之光束LB1,一邊等向性的放射、一邊沿照射中心軸Le1射入柱面透鏡CYa。柱面透鏡CYa,被設定成母線與Yt軸平行,以在Xt方向具有折射力。又,剛穿透過柱面透鏡CYa之光束LB1,於Xt方向係會聚成大致平行光束、於Yt方向則在維持放射狀態的情形下往-Zt方向前進。The beam scanning device MD1 has a cylindrical lens CYa, a reflecting member RF, an fθ lens FT, a polygon mirror PM, and a cylindrical lens CYb. The beam LB1 traveling in the -Zt direction and entering the beam scanning device MD1 is set to be coaxial with the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in parallel with the Zt axis. In this modification 4, the lens system GLa is provided before the beam scanning device MD1 in the optical path of the light beam LB1, and the light beam LB1 is condensed into a spot light on a surface Cjp that is optically conjugate with the surface of the substrate FS. The light beam LB1 condensed on the conjugate surface Cjp enters the cylindrical lens CYa along the irradiation center axis Le1 while radiating isotropically. The cylindrical lens CYa is set so that the generatrix is parallel to the Yt axis to have refractive power in the Xt direction. In addition, the light beam LB1 that has just passed through the cylindrical lens CYa is condensed into a substantially parallel light beam in the Xt direction, and travels in the -Zt direction while maintaining the radiation state in the Yt direction.

反射構件RF之上側之反射面Rf1(相對XtYt平面傾斜45°),以透過柱面透鏡CYa射入之光束LB1與光軸AXf平行的射入fθ透鏡FT之較光軸AXf上側之視野區域之方式,將光束LB1反射向-X方向。穿透過fθ透鏡FT之上側(+Zt方向側)之視野區域之光束LB1,射入多面鏡PM之反射面RP(與Zt軸平行)。多面鏡PM之反射面RP,於Zt方向係設置在與光軸AXf相同高度位置,設定在fθ透鏡FT之瞳面epf之位置或其近旁位置。因此,多面鏡PM之旋轉軸AXp與fθ透鏡FT之光軸AXf,係設定成在與XtZt平面平行之面内正交。藉由柱面透鏡CYa與fθ透鏡FT,射入多面鏡PM之光束LB1,在與多面鏡PM形成之掃描方向(旋轉方向)正交之非掃描方向(Zt方向)在反射面RP上會聚,投射在反射面RP上成為延伸於與Yt軸平行之方向之狹縫狀分布。The reflective surface Rf1 on the upper side of the reflective member RF (inclined 45° with respect to the XtYt plane) is used to make the light beam LB1 incident through the cylindrical lens CYa enter into the fθ lens FT parallel to the optical axis AXf compared to the field of view on the upper side of the optical axis AXf In this way, the light beam LB1 is reflected in the -X direction. The light beam LB1 passing through the field of view area on the upper side (+Zt direction side) of the fθ lens FT enters the reflecting surface RP (parallel to the Zt axis) of the polygon mirror PM. The reflecting surface RP of the polygon mirror PM is set at the same height position as the optical axis AXf in the Zt direction, and set at the position of the pupil surface epf of the fθ lens FT or a position near it. Therefore, the rotation axis AXp of the polygon mirror PM and the optical axis AXf of the fθ lens FT are set to be orthogonal in a plane parallel to the XtZt plane. Through the cylindrical lens CYa and the fθ lens FT, the light beam LB1 entering the polygon mirror PM converges on the reflecting surface RP in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) formed by the polygon mirror PM, The projection on the reflecting surface RP becomes a slit-like distribution extending in a direction parallel to the Yt axis.

由於多面鏡PM之反射面RP與Zt軸平行(於XtZt平面内係與光軸AXf垂直),因此通過fθ透鏡FT之較光軸AXf上側(+Zt方向側)之視野區域到達多面鏡PM之反射面RP、於該處被反射向+Xt方向側之光束LB1,通過fθ透鏡FT之較光軸AXf下側(-Zt方向側)之視野區域,朝向反射構件RF之下側之反射面Rf2(相對XtYt平面傾斜45°)。因此,射入多面鏡PM之光束LB1之光路、與在多面鏡PM反射之光束LB之光路,於XtZt平面内,係就光軸AXf成對稱。在反射構件RF之下側之反射面Rf2反射、往-Zt方向行進之光束LB1,通過母線與Yt方向平行、於Xt方向具有折射力之柱面透鏡CYb,在基板FS上會聚成點光SP。Since the reflecting surface RP of the polygon mirror PM is parallel to the Zt axis (in the XtZt plane, it is perpendicular to the optical axis AXf), so the viewing area of the fθ lens FT above the optical axis AXf (+Zt direction side) reaches the reflection of the polygon mirror PM The surface RP, where the light beam LB1 reflected to the +Xt direction side, passes through the viewing area below the optical axis AXf (the −Zt direction side) of the fθ lens FT, and faces the reflective surface Rf2 (opposite XtYt plane is inclined 45°). Therefore, the optical path of the light beam LB1 incident on the polygon mirror PM and the light path of the light beam LB reflected by the polygon mirror PM are symmetrical with respect to the optical axis AXf in the XtZt plane. The light beam LB1 reflected by the reflective surface Rf2 on the lower side of the reflective member RF and traveling in the -Zt direction passes through a cylindrical lens CYb whose generatrix is parallel to the Yt direction and has refractive power in the Xt direction, and is condensed into a point light SP on the substrate FS .

圖17A、圖17B所示之變形例4中之光束掃描裝置MD1之構成中,從共軛面Cjp到基板FS(被照射面)之光束LB1之光路,由於係就多面鏡PM之反射面RP(瞳面epf)成對稱的構成,因此投射在基板FS上之點光SP,會成像成聚光在共軛面Cjp之光束LB1之點光之像。因此,在多面鏡PM之一個反射面RP成為與光軸AXf正確正交之角度的情形時,從fθ透鏡FT射入多面鏡PM之反射面RP之光束LB1、與該光束LB1在反射面RP反射而射入fθ透鏡FT之光束LB1,在XtYt平面内,成為通過相同光路。此時,照射到反射構件RF之下側之反射面Rf2之光束LB1,成為反射面Rf2之Yt方向之中央部,投射於基板FS之光束LB1之點光SP,位在描繪線SL1上之中點(照射中心軸Le1通過之點)。In the configuration of the beam scanning device MD1 in the modified example 4 shown in FIGS. 17A and 17B, the optical path of the beam LB1 from the conjugate surface Cjp to the substrate FS (irradiated surface) is the reflecting surface RP of the polygon mirror PM The (pupil plane epf) has a symmetrical structure, so the point light SP projected on the substrate FS will be imaged as a point light of the light beam LB1 condensed on the conjugate surface Cjp. Therefore, when one reflecting surface RP of the polygon mirror PM is at an angle that is exactly orthogonal to the optical axis AXf, the light beam LB1 that enters the reflecting surface RP of the polygon mirror PM from the fθ lens FT and the light beam LB1 are on the reflecting surface RP The light beam LB1 reflected and incident to the fθ lens FT passes through the same optical path in the XtYt plane. At this time, the light beam LB1 irradiated to the reflective surface Rf2 on the lower side of the reflective member RF becomes the center of the reflective surface Rf2 in the Yt direction, and the spot light SP of the light beam LB1 projected on the substrate FS is located on the drawing line SL1 Point (the point through which the irradiation center axis Le1 passes).

因以多面鏡PM之旋轉軸AXp為中心之旋轉,使多面鏡PM之反射面RP從在XtYt平面内與光軸AXf垂直之狀態些微傾斜時,在多面鏡PM之反射面RP反射、通過fθ透鏡FT到達反射構件RF下側之反射面Rf2之光束LB1,即會反應多面鏡PM之旋轉在反射面Rf2上往Yt方向偏移。如此,即使是圖17A、圖17B所示之變形例4之光束掃描裝置MD1,亦能沿描繪線SL1進行點光SP之一維掃描。又,圖17A、圖17B之構成,雖然反射構件RF上側之反射面Rf1與下側之反射面Rf2為涵蓋沿描繪線SL1之光束LB1之掃描範圍,而於Yt方向細長形成,但在分別以不同平面反射鏡構成反射面Rf1與反射面Rf2時,形成上側之反射面Rf1之平面反射鏡,可將Yt方向之尺寸縮小至可涵蓋從透鏡系GLa射入之光束LB1之直徑的程度。Due to the rotation centered on the rotation axis AXp of the polygon mirror PM, when the reflection surface RP of the polygon mirror PM is slightly inclined from the state in the XtYt plane perpendicular to the optical axis AXf, the reflection surface RP of the polygon mirror PM reflects and passes fθ The light beam LB1 when the lens FT reaches the reflection surface Rf2 on the lower side of the reflection member RF will reflect the rotation of the polygon mirror PM and deviate in the Yt direction on the reflection surface Rf2. In this way, even the beam scanning device MD1 of Modification 4 shown in FIGS. 17A and 17B can perform one-dimensional scanning of the spot light SP along the drawing line SL1. 17A and 17B, although the reflective surface Rf1 on the upper side and the reflective surface Rf2 on the lower side of the reflective member RF cover the scanning range of the light beam LB1 along the drawing line SL1, and are formed elongated in the Yt direction, they are When different flat mirrors form the reflecting surface Rf1 and the reflecting surface Rf2, the flat reflecting mirror forming the upper reflecting surface Rf1 can reduce the size in the Yt direction to the extent that it can cover the diameter of the light beam LB1 incident from the lens system GLa.

柱面透鏡CYa之功能在作為使光束LB1射入光束掃描裝置MD1的入射光學構件。fθ透鏡FT之功能在於,作為將被多面鏡PM偏向之光束LB1投射於基板FS之被照射面的投射光學系。又,至少,反射構件RF之反射面Rf1與反射面Rf2之功能在於,作為使從柱面透鏡CYa到基板FS之光束LB1之光路彎折的光路偏向構件。藉由此光路偏向構件,可使射入柱面透鏡CYa之光束LB1之入射軸與照射中心軸Le1成為大致同軸。The cylindrical lens CYa functions as an incident optical member that causes the light beam LB1 to enter the light beam scanning device MD1. The function of the fθ lens FT is as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate FS. In addition, at least the reflection surface Rf1 and the reflection surface Rf2 of the reflection member RF function as optical path deflecting members that bend the optical path of the light beam LB1 from the cylindrical lens CYa to the substrate FS. With this optical path deflection member, the incident axis of the light beam LB1 entering the cylindrical lens CYa and the irradiation center axis Le1 can be made substantially coaxial.

又,圖17A、圖17B所示之光束掃描裝置MD1之光學構成構件(柱面透鏡CYa、CYb、反射構件RF、多面鏡PM、fθ透鏡FT等),與圖10、圖11所示之支承架40同樣的,被支承在可以照射中心軸Le1為中心旋轉之支承架。變形例4之構成中,同樣的,即使光束掃描裝置MD1繞照射中心軸Le1進行θzt旋轉,射入柱面透鏡CYa之光束LB之位置射不會改變。,因此,即使是在使光束掃描裝置MD1進行θzt旋轉之情形時,通過光束掃描裝置MD1内之光束LB之光路亦不會改變,光束LB能如規定的正確通過光束掃描裝置MD1内。如此,即使使光束掃描裝置MD1進行θzt旋轉,亦不會產生因光束LB1之光暈等導致點光SP無法投射至基板FS之表面(被照射面)、或點光SP投射到脫離傾斜調整後之描繪線SLn之位置等問題。In addition, the optical components (cylindrical lenses CYa, CYb, reflecting member RF, polygon mirror PM, fθ lens FT, etc.) of the beam scanning device MD1 shown in FIGS. 17A and 17B are the same as those shown in FIGS. 10 and 11 The frame 40 is similarly supported by a support frame capable of rotating around the irradiation center axis Le1. In the configuration of Modification 4, similarly, even if the beam scanning device MD1 rotates θzt around the irradiation center axis Le1, the position of the beam LB incident on the cylindrical lens CYa does not change. Therefore, even when the beam scanning device MD1 is rotated by θzt, the optical path of the beam LB in the beam scanning device MD1 will not change, and the beam LB can pass through the beam scanning device MD1 correctly as specified. In this way, even if the beam scanning device MD1 is rotated by θzt, the spot light SP cannot be projected to the surface (irradiated surface) of the substrate FS due to the halo of the beam LB1, or the spot light SP is projected after the tilt adjustment. The position of the drawing line SLn and other issues.

(變形例5)圖18A、圖18B係顯示變形例5中之光束掃描裝置MD之光學構成的圖。圖18A、圖18B中,針對與圖17A、圖17B相同之構成係賦予相同參照符號,省略其說明。又,由於各光束掃描裝置MD(MD1~MD6)具有相同構成,因此僅說明光束掃描裝置MD1,其他光束掃描裝置MD則省略說明。此外,圖18A係在與XtYt平面平行之面内觀察本變形例5之光束掃描裝置MD1者,圖18B則係在與YtZt平面平行之面内觀察本變形例5之光束掃描裝置MD1者。(Modification 5) FIGS. 18A and 18B are diagrams showing the optical configuration of the beam scanning device MD in Modification 5. FIG. In FIGS. 18A and 18B, the same reference numerals are given to the same components as those in FIGS. 17A and 17B, and the description thereof is omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted. In addition, FIG. 18A is a view of the beam scanning device MD1 of this modification 5 in a plane parallel to the XtYt plane, and FIG. 18B is a view of the beam scanning device MD1 of this modification 5 in a plane parallel to the YtZt plane.

變形例5之光束掃描裝置MD1,相對於圖17A、圖17B所示之變形例4之光束掃描裝置MD1,其不同點在於使照射中心軸Le1從描繪線SL1之中點之位置往+Yt方向平行移動。因此,將射入光束掃描裝置MD1前之光束LB1聚光於共軛面Cjp之透鏡系GLa與柱面透鏡CYa,係一體的往+Yt方向平行移動配置。變形例5之情形時,當多面鏡PM順時鐘方向旋轉時,於多面鏡PM之反射面RP反射、通過fθ透鏡FT照射在反射構件RF下側之反射面Rf2之光束LB1,係掃描於-Yt方向。The beam scanning device MD1 of modification 5 is different from the beam scanning device MD1 of modification 4 shown in FIGS. 17A and 17B in that the irradiation center axis Le1 is parallel to the +Yt direction from the position of the midpoint of the drawing line SL1 mobile. Therefore, the lens system GLa and the cylindrical lens CYa that condense the light beam LB1 before entering the beam scanning device MD1 on the conjugate surface Cjp are moved in parallel in the +Yt direction. In the case of Modification 5, when the polygon mirror PM rotates clockwise, the light beam LB1 reflected on the reflection surface RP of the polygon mirror PM and irradiated on the reflection surface Rf2 on the lower side of the reflection member RF through the fθ lens FT is scanned on − Yt direction.

如前所述,即使是將先前之圖17A、圖17B所示之變形例4之構成,改變成如圖18A、圖18B所示之變形例5般,亦能藉由將照射中心軸Le1之延長線設定成通過描繪線SL1上之任意點(特定點),使光束掃描裝置MD1繞照射中心軸Le1進行θzt旋轉,並將射入光束掃描裝置MD1(柱面透鏡CYa)之光束LB1設定成與照射中心軸Le1同軸,即使使光束掃描裝置MD1進行θzt旋轉,亦能使點光SP沿描繪線SL1正確進行掃描。又,雖能由圖18A、圖18B所示之構成明顯可知,但射入光束掃描裝置MD1(柱面透鏡CYa)之光束LB1在XtYz平面内之位置,只要是沿描繪線SL1之位置的話,在Yt方向之任何位置皆可。因此,只要事先延長柱面透鏡CYa之母線方向之尺寸,即能自由變更射入光束掃描裝置MD1(柱面透鏡CYa)之光束LB1在XtYz平面内之位置,而有能提升光束LB1之導光路之設定自由度的優點。再者,由於射入光束掃描裝置MD1(柱面透鏡CYa)之光束LB1在XtYz平面内之位置,於Yt方向係能自由設定,因此光束掃描裝置MD1之機械性旋轉中心軸(照射中心軸Le1)與射入之光束LB1之軸線的同軸性,於Yt方向能高精度的使之一致。As described above, even if the configuration of the modification 4 shown in Figs. 17A and 17B is changed to the modification 5 shown in Figs. 18A and 18B, it is possible to change the irradiation center axis Le1 The extension line is set to pass through any point (specific point) on the drawing line SL1, so that the beam scanning device MD1 rotates around the irradiation center axis Le1 θzt, and the beam LB1 that enters the beam scanning device MD1 (cylindrical lens CYa) is set to Coaxially with the irradiation center axis Le1, even if the beam scanning device MD1 is rotated by θzt, the spot light SP can be accurately scanned along the drawing line SL1. Also, although it can be clearly seen from the configuration shown in Figs. 18A and 18B, the position of the beam LB1 entering the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane, as long as it is a position along the drawing line SL1, Any position in the Yt direction can be used. Therefore, as long as the dimension in the generatrix direction of the cylindrical lens CYa is extended in advance, the position of the beam LB1 entering the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane can be freely changed, and the light guide path of the beam LB1 can be improved The advantages of setting freedom. Furthermore, since the position of the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane can be freely set in the Yt direction, the mechanical rotation center axis of the beam scanning device MD1 (irradiation center axis Le1) ) The coaxiality with the axis of the incident light beam LB1 can be aligned with high precision in the Yt direction.

(變形例6)圖19、圖20係顯示變形例6中之光束掃描裝置MD之光學構成的圖。圖19、圖20中,針對與圖7相同樣之構成係賦予相同參照符號,並省略其說明。又,由於各光束掃描裝置MD(MD1~MD6)具有相同構成,因此僅說明光束掃描裝置MD1,其他光束掃描裝置MD則省略說明。又,圖7中,因係將與fθ透鏡FT之光軸AXf平行之方向設為Xt方向,因此於圖19、圖20中,亦將與fθ透鏡FT之光軸AXf平行之方向設為Xt方向、將點光SP之掃描方向設為Yt(Y)方向、並將與Xt方向與Yt方向正交之方向設為Zt方向來進行說明。(Modification 6) FIGS. 19 and 20 are diagrams showing the optical configuration of the beam scanning device MD in the modification 6. In FIGS. 19 and 20, the same reference numerals are assigned to the same configuration as in FIG. 7, and the description thereof is omitted. In addition, since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted. In addition, in FIG. 7, since the direction parallel to the optical axis AXf of the fθ lens FT is set as the Xt direction, in FIGS. 19 and 20, the direction parallel to the optical axis AXf of the fθ lens FT is also set as Xt As for the direction, the scanning direction of the spot light SP is set to the Yt (Y) direction, and the direction orthogonal to the Xt direction and the Yt direction is set to the Zt direction.

圖19係在與XtYt平面平行之面内觀察本變形例6之光束掃描裝置MD1者,本變形例6中,射入光束掃描裝置MD1之光束LB1之軸線(照射中心軸Le1)係設定為與fθ透鏡FT之光軸AXf成同軸。亦即,本變形例中,不在fθ透鏡FT之後設置使光束LB1彎折之反射鏡(反射面),而是構成為從fθ透鏡FT射出後通過柱面透鏡CYb之掃描光束,直接投射於基板FS。Fig. 19 is a view of the beam scanning device MD1 of this modification 6 in a plane parallel to the XtYt plane. In this modification 6, the axis of the light beam LB1 (irradiation center axis Le1) incident on the beam scanning device MD1 is set to and The optical axis AXf of the fθ lens FT is coaxial. That is, in this modified example, a mirror (reflecting surface) that bends the light beam LB1 is not provided after the fθ lens FT, but is configured such that the scanning light beam emitted from the fθ lens FT and passed through the cylindrical lens CYb is directly projected on the substrate FS.

圖19中,從光源裝置14射出後經描繪用光學元件AOM1進行強度調變(ON/OFF)之光束LB1,透過透鏡系G30、反射鏡M30、M31及透鏡系G31被導向柱面透鏡CYa。射入光束掃描裝置MD1之光束LB1,被設定為與照射中心軸Le1成同軸。射入柱面透鏡CYa之光束LB1成形為具有既定剖面直徑之平行光束。從柱面透鏡CYa於反射鏡M14反射而到達多面鏡PM之反射面RP的光束LB1,於XtYt平面内係在平行光束之狀態下,於Zt方向成為被柱面透鏡CYa會聚之光束。於多面鏡PM反射(偏光)之光束LB1,通過fθ透鏡FT、柱面透鏡CYb,成點光SP聚光在基板FS之表面(被照射面)。又,圖19中,fθ透鏡FT之光軸AXf與照射中心軸Le1係一致被設定為與Xt軸平行,該等之延長線與旋轉筒DR之中心軸(旋轉中心軸)AXo正交。In FIG. 19, the light beam LB1 that is intensity-modulated (ON/OFF) by the drawing optical element AOM1 after being emitted from the light source device 14 passes through the lens system G30, mirrors M30, M31, and lens system G31 and is guided to the cylindrical lens CYa. The light beam LB1 incident on the beam scanning device MD1 is set to be coaxial with the irradiation center axis Le1. The light beam LB1 incident on the cylindrical lens CYa is shaped into a parallel light beam with a predetermined cross-sectional diameter. The light beam LB1 reflected by the cylindrical lens CYa on the mirror M14 and reaching the reflecting surface RP of the polygon mirror PM becomes a light beam condensed by the cylindrical lens CYa in the Zt direction in the state of being a parallel beam in the XtYt plane. The light beam LB1 reflected (polarized) by the polygon mirror PM passes through the fθ lens FT and the cylindrical lens CYb, and the spot light SP is condensed on the surface (irradiated surface) of the substrate FS. In addition, in FIG. 19, the optical axis AXf of the fθ lens FT coincides with the irradiation center axis Le1 and is set to be parallel to the Xt axis, and these extension lines are orthogonal to the center axis (rotation center axis) AXo of the rotating drum DR.

支承本變形例6之光束掃描裝置MD1之本體架300,形成有沿描繪線SL1掃描之光束LB1通過之開口部300A,光束掃描裝置MD1透過從光軸AXf(照射中心軸Le1)起之半徑包含開口部300A之大小的環狀軸承301,以可旋轉之方式支承於本體架300。環狀軸承301之中心線被設定為與光軸AXf(照射中心軸Le1)成同軸,因此光束掃描裝置MD1以光軸AXf(照射中心軸Le1)為中心繞Xt軸旋轉。將此旋轉稱為θxt旋轉。The main body frame 300 supporting the beam scanning device MD1 of this modification 6 is formed with an opening 300A through which the beam LB1 scanned along the drawing line SL1 passes. The beam scanning device MD1 passes through the radius from the optical axis AXf (irradiation center axis Le1) including The annular bearing 301 of the size of the opening 300A is rotatably supported by the main body frame 300. The center line of the ring bearing 301 is set to be coaxial with the optical axis AXf (irradiation center axis Le1), so the beam scanning device MD1 rotates around the Xt axis around the optical axis AXf (irradiation center axis Le1). This rotation is called θxt rotation.

圖20係將圖19所示之變形例6之光束掃描裝置MD配置複數台之狀態,在與XZ平面平行之面内加以觀察者,於本體架300,於Y方向相距一定間隔設有使來自奇數號光束掃描裝置MD1、MD3、MD5各個之掃描光束通過之開口部300A,於Y方向相距一定間隔設有使來自偶數號光束掃描裝置MD2、MD4、MD6各個之掃描光束通過之開口部300B。又,圖20之變形例6中,捲繞在旋轉筒DR之基板FS,在被往-X方向水平搬送而從旋轉筒DR之上部捲繞約半周份後,於旋轉筒DR之下部脫離被搬往+X方向。因此,此處,包含旋轉筒DR之中心軸AXo的中心面Poc係與XY平面平行。Fig. 20 is a state in which the beam scanning device MD of the modification 6 shown in Fig. 19 is arranged in a plurality of units, and the observation is made in a plane parallel to the XZ plane. The main body frame 300 is arranged at a certain interval in the Y direction so that The openings 300A through which the scanning beams of the odd-numbered beam scanning devices MD1, MD3, and MD5 pass are provided with openings 300B through which the scanning beams from each of the even-numbered beam scanning devices MD2, MD4, MD6 pass at a certain interval in the Y direction. In addition, in Modification 6 of FIG. 20, the substrate FS wound on the rotating drum DR is transported horizontally in the -X direction and wound from the upper part of the rotating drum DR for about half a circumference, and then separated from the lower part of the rotating drum DR. Move to the +X direction. Therefore, here, the center plane Poc including the center axis AXo of the rotating drum DR is parallel to the XY plane.

此變形例6之構成中,同樣的,係被設定為以環狀軸承301形成之光束掃描裝置MD各個之機械性旋轉中心為照射中心軸Le1~Le6,射入各光束掃描裝置MD之光束LB1~LB6以和各照射中心軸Le1~Le6成同軸之方式被引導,因此與先前之實施形態及各變形例同樣的,即使各光束掃描裝置MD繞照射中心軸Le1~Le6之各個進行θxt旋轉,射入透鏡系G30之光束LB1~LB6之姿勢位置亦不會改變。因此,即使是在使各光束掃描裝置MD進行θxt旋轉之情形時,通過各光束掃描裝置MD内之光束LB之光路亦不會改變,光束LB可依規定正確的通過光束掃描裝置MD内。如此,即使是使各光束掃描裝置MD進行θxt旋轉,亦不會產生因光束LB1~LB6之光暈等導致點光SP無法投射於基板FS之表面(被照射面)、或點光SP投射到脫離傾斜調整後之描繪線SL1~SL6之位置等問題。In the configuration of this modification 6, similarly, the mechanical rotation center of each beam scanning device MD formed by annular bearing 301 is set as the irradiation center axis Le1 to Le6, and the beam LB1 of each beam scanning device MD is incident ~LB6 is guided so as to be coaxial with each of the irradiation central axes Le1 to Le6. Therefore, as in the previous embodiment and each modification, even if each beam scanning device MD rotates θxt around each of the irradiation center axes Le1 to Le6, The postures of the light beams LB1 to LB6 entering the lens system G30 will not change either. Therefore, even when each beam scanning device MD is rotated by θxt, the optical path of the light beam LB in each beam scanning device MD will not change, and the light beam LB can accurately pass through the beam scanning device MD according to regulations. In this way, even if each beam scanning device MD is rotated by θxt, the spot light SP cannot be projected on the surface (irradiated surface) of the substrate FS due to the halo of the beams LB1 to LB6, or the spot light SP is projected to Get rid of the position of the drawing line SL1~SL6 after tilt adjustment.

透鏡系G30之功能,係作為使光束LB(LB1~LB6)射入光束掃描裝置MD(MD1~MD6)的入射光學構件。fθ透鏡FT之功能,係作為使經多面鏡PM偏向之光束LB1投射於基板FS之被照射面的投射光學系。此外,反射構件(反射鏡M14、M30、M31)之功能,則係作為用以彎折從透鏡系G30到基板FS之光束LB(LB1~LB6)之光路的光路偏向構件。The lens system G30 functions as an incident optical member that causes the light beam LB (LB1 to LB6) to enter the beam scanning device MD (MD1 to MD6). The fθ lens FT functions as a projection optical system for projecting the light beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate FS. In addition, the function of the reflecting members (mirrors M14, M30, M31) is as an optical path deflecting member for bending the optical path of the light beam LB (LB1 to LB6) from the lens system G30 to the substrate FS.

〔伴隨描繪線之旋轉調整的接續誤差〕 上述實施形態及各變形例中,藉由光束掃描裝置MD之θzt旋轉(或θxt旋轉)調整了描繪線SLn之傾斜時,描繪線上之描繪開始點與描繪結束點相對調整前之位置會有偏移。圖21,例如,係顯示將初期狀態與Yt軸平行之光束掃描裝置MD1之描繪線SL1於XtYt平面(被照射面)内反時鐘方向旋轉角度θss之狀態。圖21中,為便於說明而誇大顯示了角度θss,但實際可旋轉之角度θss之最大值僅為±2°程度,極小。圖21中,將調整前之描繪線SL1之中點設為CC時,延伸於Zt方向之照射中心軸Le1被設定為通過中點CC,描繪線SL1被設定為以和照射中心軸Le1一致之光束掃描裝置MD1之機械性旋轉中心軸為中心進行θzt旋轉(傾斜)。進一步的,當將描繪線SL1之描繪開始點設為ST、描繪結束點設為SE時,從描繪開始點ST到描繪結束點SE之長度LBL為於Yt方向之實際的圖案描繪寬。因此,從描繪開始點ST到中點CC之長度LBh、與從中點CC到描繪結束點SE之長度LBh相等,為LBh=LBL/2。 [Connecting error accompanying the rotation adjustment of the drawing line] In the above embodiment and each modification, when the inclination of the drawing line SLn is adjusted by the θzt rotation (or θxt rotation) of the beam scanning device MD, the drawing start point and the drawing end point on the drawing line will deviate from the position before adjustment. shift. FIG. 21, for example, shows a state where the drawing line SL1 of the beam scanning device MD1 whose initial state is parallel to the Yt axis is rotated by an angle θss in the XtYt plane (irradiated surface) in the counterclockwise direction. In Fig. 21, the angle θss is exaggerated for the convenience of explanation, but the maximum value of the actual rotatable angle θss is only about ±2°, which is extremely small. In FIG. 21, when the midpoint of the drawing line SL1 before adjustment is set to CC, the irradiation center axis Le1 extending in the Zt direction is set to pass through the midpoint CC, and the drawing line SL1 is set to coincide with the irradiation center axis Le1 The mechanical rotation center axis of the beam scanning device MD1 is rotated (tilted) by θzt. Further, when the drawing start point of the drawing line SL1 is ST and the drawing end point is SE, the length LBL from the drawing start point ST to the drawing end point SE is the actual pattern drawing width in the Yt direction. Therefore, the length LBh from the drawing start point ST to the midpoint CC is equal to the length LBh from the midpoint CC to the drawing end point SE, which is LBh=LBL/2.

描繪線SL1從初期狀態旋轉角度θss時,即成為相對Yt軸傾斜之描繪線SL1a。調整後之描繪線SL1a之描繪開始點STa,從初期之描繪開始點ST偏離(ΔXSa、ΔYSa),調整後之描繪線SL1a之描繪結束點Sea,則從初期之描繪結束點SE偏離(ΔXEa、ΔYEa)。此位置偏離,即為與相鄰之光束掃描裝置MD2之描繪線SL2描繪之圖案的接續誤差。例如,相鄰光束掃描裝置MD2之描繪線SL2相對描繪線SL1a位置於+Yt方向側,有需要以初期之描繪開始點ST進行接續曝光之情形時,需使調整後之描繪線SL1a之描繪開始點STa往箭頭Ar之方向微幅偏移(shift)。此箭頭Ar所示之偏移,可藉由些微提早於圖9中說明之從原點訊號SH產生時經時間Tpx後進行描繪資料之起頭的時序來加以實現。When the drawing line SL1 is rotated by the angle θss from the initial state, it becomes the drawing line SL1a inclined with respect to the Yt axis. The drawing start point STa of the adjusted drawing line SL1a deviates from the initial drawing start point ST (ΔXSa, ΔYSa), and the drawing end point Sea of the adjusted drawing line SL1a deviates from the initial drawing end point SE (ΔXEa, ΔYEa). This position deviation is the continuation error of the pattern drawn by the drawing line SL2 of the adjacent beam scanning device MD2. For example, if the drawing line SL2 of the adjacent beam scanning device MD2 is positioned on the +Yt direction side relative to the drawing line SL1a, and it is necessary to perform continuous exposure at the initial drawing start point ST, the drawing start point of the adjusted drawing line SL1a must be set STa shifts slightly in the direction of arrow Ar. The offset shown by the arrow Ar can be realized by slightly earlier than the timing of the beginning of the drawing data after the time Tpx from when the origin signal SH is generated as described in FIG. 9.

此處,位置偏離量ΔYSa為LBh・(1-cos(θss)),當設沿箭頭Ar之偏移量(長度)為ΔAr時,位置偏離量ΔYSa與偏移量ΔAr即成為ΔYSa=ΔAr・cos(θss),因此,偏移量ΔAr可表示如下。 ΔAr=〔LBh・(1-cos(θss))〕/cos(θss)・・・(1) Here, the position deviation amount ΔYSa is LBh·(1-cos(θss)), and when the deviation amount (length) along the arrow Ar is set to ΔAr, the position deviation amount ΔYSa and the offset amount ΔAr become ΔYSa=ΔAr· cos (θss), therefore, the offset ΔAr can be expressed as follows. ΔAr=〔LBh・(1-cos(θss))]/cos(θss)・・・(1)

例如,長度LBL為50mm(LBh=25mm)時,角度θss為±0.5°時之偏移量ΔAr約為0.95μm、角度θss為±1.0°時之偏移量ΔAr約為3.8μm、角度θss為±2.0°時之偏移量ΔAr約為15.2μm,角度θss之變化與偏移量ΔAr之變化為2次函數的關係。因此,根據經調整之角度θss算出偏移量ΔAr,將圖9所說明之時間Tpx縮短對應該偏移量ΔAr之時間ΔTpx(=ΔAr/點光SP之掃描速度Vss)開始進行描繪資料之起頭即可。For example, when the length LBL is 50mm (LBh=25mm), the offset ΔAr when the angle θss is ±0.5° is about 0.95 μm, the offset ΔAr when the angle θss is ±1.0° is about 3.8 μm, and the angle θss is The offset ΔAr at ±2.0° is approximately 15.2μm, and the change in angle θss and the change in offset ΔAr have a quadratic function relationship. Therefore, the offset ΔAr is calculated from the adjusted angle θss, and the time Tpx illustrated in Fig. 9 is shortened to the time ΔTpx corresponding to the offset ΔAr (=ΔAr/scanning speed Vss of the spot light SP). Start drawing data OK.

又,相鄰光束掃描裝置MD2之描繪線SL2相對描繪線SL1a位於-Yt方向側,需要以初期之描繪結束點SE進行接續曝光之情形時,需要使調整後之描繪線SL1a之描繪結束點Sea往箭頭Af之方向微幅偏移。此場合,箭頭Af方向之偏移量ΔAf,亦與先前之式(1)同樣的,係以下式 ΔAf=〔LBh・(1-cos(θss))〕/cos(θss)・・・(2) 求出。如圖21所示,中點CC(Le1)精密的設定在光束掃描裝置MD1之旋轉中心之情形時,偏移量ΔAr與偏移量ΔAf之絕對值相等。偏移量ΔAf之方向,由於與描繪線SL1a上之點光SP之掃描方向相同,因此,此場合只要使圖9所說明之時間Tpx加長對應根據經調整之角度θss之偏移量ΔAf的時間ΔTpx(=ΔAr/點光SP之掃描速度Vss)來開始描繪資料之起頭即可。 In addition, when the drawing line SL2 of the adjacent beam scanning device MD2 is located on the side of the -Yt direction with respect to the drawing line SL1a, and it is necessary to perform continuous exposure at the initial drawing end point SE, it is necessary to set the drawing end point Sea of the adjusted drawing line SL1a Slightly offset in the direction of arrow Af. In this case, the offset ΔAf in the direction of the arrow Af is the same as the previous equation (1), and is the following equation ΔAf=〔LBh・(1-cos(θss))]/cos(θss)・・・(2) Find out. As shown in Figure 21, when the center point CC (Le1) is precisely set at the center of rotation of the beam scanning device MD1, the absolute value of the offset ΔAr and the offset ΔAf are equal. The direction of the offset ΔAf is the same as the scanning direction of the spot light SP on the drawing line SL1a. Therefore, in this case, the time Tpx illustrated in FIG. 9 should be increased to correspond to the time of the offset ΔAf according to the adjusted angle θss. ΔTpx (=ΔAr/scanning speed Vss of spotlight SP) to start drawing data.

進一步的,調整角度θss後之描繪線SL1a之描繪開始點STa,相對初期之描繪開始點ST於-Xt方向位置偏離ΔXSa,描繪結束點Sea相對初期之描繪結束點SE於+Xt方向位置偏離ΔXEa。此種Xt方向(副掃描方向)之位置偏離誤差ΔXSa、ΔXEa,可藉由對測量旋轉筒DR之旋轉角度位置的編碼器EC之測量值(計數器之輸出值),反應加上誤差ΔXSa或ΔXEa之偏置(offset)值開始各描繪線SLn之描繪來加以修正。為進行此種微細的修正,編碼器EC(及標尺部SD)對旋轉筒DR之旋轉角度位置之測量解析能力(計數器電路之每1計數之基板FS之移動量)係設定在點光SP之尺寸φ之1/2以下、較佳為1/10以下。Furthermore, the drawing start point STa of the drawing line SL1a after adjusting the angle θss is shifted from the initial drawing start point ST in the −Xt direction by ΔXSa, and the drawing end point Sea is shifted from the initial drawing end point SE in the +Xt direction by ΔXEa. The position deviation error ΔXSa, ΔXEa in the Xt direction (sub-scanning direction) can be reflected by adding the error ΔXSa or ΔXEa to the measurement value of the encoder EC that measures the rotation angle position of the rotating drum DR (the output value of the counter) The offset value is corrected by starting the drawing of each drawing line SLn. In order to perform such fine corrections, the measurement and resolution capability of the encoder EC (and the scale part SD) of the rotation angle position of the rotating drum DR (the amount of movement of the substrate FS per 1 count of the counter circuit) is set at the point light SP The size φ is 1/2 or less, preferably 1/10 or less.

以上之圖21之說明中,使初期狀態與Yt軸平行之光束掃描裝置MD1之描繪線SL1在XtYt平面(被照射面)内反時鐘旋轉角度θss時,照射中心軸Le1係設定為通過中點CC,描繪線SL1(亦即,光束掃描裝置MD1)設定為以照射中心軸Le1為中心進行θzt旋轉(傾斜)。然而,若因決定光束掃描裝置MD1之機械性旋轉中心軸(以下,稱Mrp)之圓管狀支柱構件BX1、環狀軸承48等之安裝誤差、及光束LB1射入光束掃描裝置MD1之入射位置之誤差等,而有描繪線SL1之中點CC(照射中心軸Le1)與光束掃描裝置MD1之機械性旋轉中心軸Mrp在XtYt平面内之二維位置差誤差ΔA(設為ΔAx、ΔAy)時,該位置偏差誤差ΔA造成之影響,會加至圖21中之誤差(ΔXSa,ΔYSa)、誤差(ΔXEa、ΔYEa)。In the above description of Fig. 21, when the drawing line SL1 of the beam scanning device MD1 whose initial state is parallel to the Yt axis is rotated counterclockwise by the angle θss in the XtYt plane (irradiated surface), the irradiation center axis Le1 is set to pass through the midpoint CC, the drawing line SL1 (that is, the beam scanning device MD1) is set to rotate (tilt) by θzt with the irradiation center axis Le1 as the center. However, if it is due to the installation error of the cylindrical pillar member BX1, the annular bearing 48, etc., which determines the mechanical rotation center axis of the beam scanning device MD1 (hereinafter referred to as Mrp), and the incident position of the beam LB1 entering the beam scanning device MD1 When there is a two-dimensional position difference error ΔA (set to ΔAx, ΔAy) in the XtYt plane between the center point CC of the drawing line SL1 (the irradiation center axis Le1) and the mechanical rotation center axis Mrp of the beam scanning device MD1, The influence caused by the position deviation error ΔA will be added to the error (ΔXSa, ΔYSa) and error (ΔXEa, ΔYEa) in Figure 21.

使用圖22說明該狀態。圖22係誇張顯示相對圖21之狀態,光束掃描裝置MD1之機械性旋轉中心軸(第1旋轉中心軸)Mrp與描繪線SL1之中點CC(照射中心軸Le1),具有相對位置偏差誤差ΔA(ΔAx、ΔAy)情形時之狀態的圖。又,此場合,射入光束掃描裝置MD1之光束LB1之入射軸,與旋轉中心軸Mrp同軸。圖22中,針對於圖21所說明之符號及記號,省略其說明。如圖22所示,於調整前之初期狀態,原與Yt軸平行之描繪線SL1,成為以從中點CC(Le1)之位置偏移(shift)誤差(ΔAx、ΔAy)之旋轉中心軸Mrp為中心傾斜角度θss的描繪線SL1b。描繪線SL1b,因誤差(ΔAx、ΔAy)之影響,成為使圖21所示之描繪線SL1a於XtYt平面内平行移動者。因此,調整後之描繪線SL1b之描繪開始點STb相對於圖21之狀態下之描繪開始點STa,於-Xt方向偏離誤差ΔXcc、於+Yt方向偏離誤差ΔYcc。同樣的,調整後之描繪線SL1b之描繪結束點SEb相對圖21之狀態下之描繪結束點Sea,於-Xt方向偏離誤差ΔXcc、於+Yt方向偏離誤差ΔYcc,調整後之描繪線SL1b之中點CC’(Le1’)亦相對圖21之狀態下之描繪線SL1之中點CC(Le1),於-Xt方向偏離誤差ΔXcc、於+Yt方向偏離誤差ΔYcc。This state will be explained using FIG. 22. Fig. 22 exaggerates the state of Fig. 21. The mechanical rotation center axis (first rotation center axis) Mrp of the beam scanning device MD1 and the midpoint CC (irradiation center axis Le1) of the drawing line SL1 have a relative position deviation error ΔA (ΔAx, ΔAy) A diagram showing the state of the situation. In this case, the incident axis of the light beam LB1 incident on the beam scanning device MD1 is coaxial with the rotation center axis Mrp. In FIG. 22, the descriptions of the symbols and signs described in FIG. 21 are omitted. As shown in Figure 22, in the initial state before adjustment, the original drawing line SL1 parallel to the Yt axis becomes the rotation center axis Mrp with the position shift error (ΔAx, ΔAy) from the midpoint CC (Le1) as The drawing line SL1b of the center inclination angle θss. The drawing line SL1b is caused by the influence of the error (ΔAx, ΔAy) to move the drawing line SL1a shown in FIG. 21 in parallel in the XtYt plane. Therefore, the drawing start point STb of the adjusted drawing line SL1b deviates from the drawing start point STa in the state of FIG. 21 by an error ΔXcc in the −Xt direction and an error ΔYcc in the +Yt direction. Similarly, the drawing end point SEb of the adjusted drawing line SL1b deviates from the drawing end point Sea in the state of Figure 21 by an error of ΔXcc in the -Xt direction and an error of ΔYcc in the +Yt direction, and the midpoint of the adjusted drawing line SL1b CC'(Le1') also deviates from the center point CC(Le1) of the drawing line SL1 in the state of FIG. 21 by an error of ΔXcc in the -Xt direction and ΔYcc in the +Yt direction.

因此,調整後之描繪線SL1b之描繪開始點STb,相對初期之描繪開始點ST,於Xt方向位置偏離(ΔXSa+ΔXcc)、於Yt方向位置偏離(ΔYSa-ΔYcc),調整後之描繪線SL1b之描繪結束點SEb相對初期之描繪結束點SE於Xt方向位置偏離(ΔXEa-ΔXcc)、於Yt方向位置偏離(ΔYEa+ΔYcc)。旋轉中心軸Mrp與初期之描繪線SL1之中點CC(Le1)具有誤差(ΔAx、ΔAy)之位置偏離所導致之誤差份(ΔXcc、ΔYcc),當以初期之描繪線SL1之中點CC為原點(0、0)時,表示如下。 ΔXcc=-ΔAy・sin(θss)+ΔAx・(1-cos(θss))・・・(3) ΔYcc=ΔAy・(1-cos(θss))+ΔAx・sin(θss) ・・・(4) Therefore, the drawing start point STb of the adjusted drawing line SL1b is offset in the Xt direction (ΔXSa + ΔXcc) and the Yt direction (ΔYSa-ΔYcc) relative to the initial drawing starting point ST. The adjusted drawing line SL1b is drawn The end point SEb is deviated from the initial drawing end point SE in the Xt direction (ΔXEa-ΔXcc) and in the Yt direction (ΔYEa+ΔYcc). The deviation (ΔXcc, ΔYcc) caused by the positional deviation (ΔXcc, ΔYcc) between the central axis of rotation Mrp and the midpoint CC (Le1) of the initial drawing line SL1 (ΔAx, ΔAy), when taking the initial drawing line SL1 midpoint CC as When the origin is (0, 0), it is expressed as follows. ΔXcc=-ΔAy・sin(θss)+ΔAx・(1-cos(θss))・・・(3) ΔYcc=ΔAy・(1-cos(θss)) +ΔAx・sin(θss) ・・・(4)

如此圖22所示,光束LB1之入射軸線與旋轉中心軸Mrp一致,旋轉中心軸Mrp與描繪線SL1之中點CC(Le1)於XtYt平面内偏移(shift)誤差(ΔAx,ΔAy)之情形時,如先前於圖21所說明般,計算出描繪線SL1b之偏移量ΔAr、ΔAf,使圖9所說明之時間Tpx縮短、或加長與其對應之時間ΔTpx,來修正圖案資料(描繪資料)之起頭時序即可。不過,調整後之描繪線SL1b之描繪開始點STb到描繪結束點SEb之長度LBL(例如50mm),必須在點光SP之最大掃描長(例如51mm)之範圍内。又,針對副掃描方向(Xt方向),可藉由對測量旋轉筒DR之旋轉角度位置的編碼器EC之測量值(計數之輸出值),回應加上誤差(ΔXSa+ΔXcc)或(ΔXEa-ΔXcc)之偏置(offset)之值開始各描繪線SLn之描繪來加以修正。此外,圖21、圖22中,雖以照射中心軸Le1通過描繪線SLn之中點CC之態樣為例做了說明,但亦可如先前之變形例5般,照射中心軸Le1是通過描繪線SLn上之任意點。在此場合,描繪線SLn之偏移量ΔAr、ΔAf之算出原理亦是相同的。As shown in Figure 22, the incident axis of the beam LB1 coincides with the rotation center axis Mrp, and the center point CC (Le1) of the rotation center axis Mrp and the drawing line SL1 is shifted by the error (ΔAx, ΔAy) in the XtYt plane At this time, as described in Fig. 21, the offset ΔAr and ΔAf of the drawing line SL1b are calculated to shorten the time Tpx illustrated in Fig. 9 or lengthen the corresponding time ΔTpx to correct the pattern data (drawing data) The beginning sequence can be. However, the length LBL (for example, 50 mm) from the drawing start point STb to the drawing end point SEb of the adjusted drawing line SL1b must be within the range of the maximum scanning length (for example, 51 mm) of the spot light SP. In addition, for the sub-scanning direction (Xt direction), the measurement value of the encoder EC (counting output value) that measures the rotation angle position of the rotating drum DR can be added to the error (ΔXSa+ΔXcc) or (ΔXEa-ΔXcc) in response The value of the offset (offset) is corrected by starting the drawing of each drawing line SLn. In addition, in FIGS. 21 and 22, although the state in which the irradiation center axis Le1 passes through the midpoint CC of the drawing line SLn is described as an example, as in the previous modification 5, the irradiation center axis Le1 is described by drawing Any point on the line SLn. In this case, the calculation principles of the offset amounts ΔAr and ΔAf of the drawing line SLn are also the same.

又,例如先前之變形例5(圖18A、圖18B)般,在使射入光束掃描裝置MD1之光束LB1於XtYz平面内之位置於Yt方向錯開之情形時,當將光束掃描裝置MD1之機械性旋轉中心軸Mrp及照射中心軸Le1設定在與描繪線SL1之描繪開始點ST一致之位置、或極接近之位置時,即使描繪線SL1傾斜角度θss,調整後之描繪開始點STb幾乎不會從初期之描繪開始點ST之位置變化。因此,調整後之描繪開始點STb與相鄰之描繪線接續之情形時,亦可不要描繪線SL1b之點光SP於掃描方向之位置調整(圖9中說明之時間Tpx之調整)。Also, for example, as in the previous modification 5 (FIGS. 18A and 18B), when the position of the beam LB1 entering the beam scanning device MD1 in the XtYz plane is shifted in the Yt direction, when the mechanical of the beam scanning device MD1 When the sexual rotation center axis Mrp and the irradiation center axis Le1 are set at the same position or very close to the drawing start point ST of the drawing line SL1, even if the drawing line SL1 is inclined by the angle θss, the adjusted drawing start point STb is almost never The position of ST changes from the initial drawing start point. Therefore, when the adjusted drawing start point STb is connected to the adjacent drawing line, it is not necessary to adjust the position of the spot light SP of the drawing line SL1b in the scanning direction (the adjustment of the time Tpx described in FIG. 9).

又,光束掃描裝置MD1之機械性旋轉中心軸Mrp與照射中心軸Le1,於XtYt平面内在既定容許範圍ΔQ(ΔBx、ΔBy)内同軸較佳。該容許範圍ΔQ,例如在使光束掃描裝置MD1機械性的傾斜既定角度θsm時,調整後之描繪線SL1b之描繪開始點STb(或描繪結束點SEb)之實際位置(實位置Apo)、與假設容許範圍ΔQ為0之情形時使光束掃描裝置MD1傾斜角度θsm時之描繪線SL1b之描繪開始點STb(或描繪結束點SEb)之設計上位置(設計位置Dpo)的差量,於點光SP之掃描方向(圖21中之箭頭Ar及Af)或Yt方向,係設定為例如點光SP之尺寸φ以内。此處,既定角度θsm可設定為光束掃描裝置MD1可機械性旋轉之上限角度(例如±2°)。為使各光束掃描裝置MD(MD1~MD6)之照射中心軸Le(Le1~Le6)與旋轉中心軸Mrp在既定容許範圍ΔQ内同軸,可在圖5所示之各光導入光學系BDU(BDU1~BDU6)之反射鏡M1~M5之間,設置圖7所示之像偏移光學構件SR及偏向調整光學構件DP中之至少一方。又,支柱構件BX1之中心軸係設定為與旋轉中心軸Mrp同軸、或與旋轉中心軸Mrp及照射中心軸Le在既定容許範圍ΔQ成同軸。Furthermore, it is preferable that the mechanical rotation center axis Mrp and the irradiation center axis Le1 of the beam scanning device MD1 are coaxial in the XtYt plane within the predetermined allowable range ΔQ (ΔBx, ΔBy). The allowable range ΔQ, for example, when the beam scanning device MD1 is mechanically tilted to a predetermined angle θsm, the actual position (the actual position Apo) of the drawing start point STb (or the drawing end point SEb) of the drawing line SL1b after adjustment (real position Apo) and the assumption When the allowable range ΔQ is 0, the deviation of the design position (design position Dpo) of the drawing start point STb (or drawing end point SEb) of the drawing line SL1b when the beam scanning device MD1 is tilted by the angle θsm is in the spot light SP The scanning direction (arrows Ar and Af in Fig. 21) or Yt direction is set within the size φ of the spot light SP, for example. Here, the predetermined angle θsm can be set as the upper limit angle (for example, ±2°) that the beam scanning device MD1 can mechanically rotate. In order to make the irradiation center axis Le (Le1~Le6) of each beam scanning device MD (MD1~MD6) and the rotation center axis Mrp coaxial within the predetermined allowable range ΔQ, the light introduction optical system BDU (BDU1 shown in Fig. 5) ~BDU6) Between the mirrors M1 to M5, at least one of the image shift optical member SR and the deflection adjusting optical member DP shown in FIG. 7 is provided. In addition, the central axis system of the pillar member BX1 is set to be coaxial with the rotation center axis Mrp, or coaxial with the rotation center axis Mrp and the irradiation center axis Le within a predetermined allowable range ΔQ.

又,雖係使射入光束掃描裝置MD之光束LB之入射軸與旋轉中心軸Mrp一致之方式,使光束LB射入光束掃描裝置MD,但亦可以是射入光束掃描裝置MD之光束LB之入射軸與旋轉中心軸Mrp在既定容許範圍ΔQ内同軸。例如,射入光束掃描裝置MD之光束LB之入射軸與照射中心軸Le一致,且與旋轉中心軸Mrp在既定容許範圍ΔQ内同軸。In addition, although the incident axis of the light beam LB incident on the beam scanning device MD is aligned with the rotation center axis Mrp, the light beam LB is incident on the beam scanning device MD, but it may be the same as the beam LB incident on the beam scanning device MD. The incident axis and the rotation center axis Mrp are coaxial within the predetermined allowable range ΔQ. For example, the incident axis of the light beam LB incident on the beam scanning device MD coincides with the irradiation center axis Le, and is coaxial with the rotation center axis Mrp within the predetermined allowable range ΔQ.

又,變形例2、3中之像旋轉光學系IR亦同樣的,只要是像旋轉光學系IR之機械性旋轉中心軸(第2旋轉中心軸)與照射中心軸Le在既定容許範圍ΔQ内成同軸即可。此場合,通過從fθ透鏡FT射入像旋轉光學系IR之光束LB之掃描軌跡中點之光束LB之入射軸與像旋轉光學系IR之機械性旋轉中心軸,係設定為在既定容許範圍ΔQ内成同軸。The same applies to the image rotating optical system IR in Modifications 2 and 3, as long as the mechanical rotation center axis (second rotation center axis) of the image rotating optical system IR and the irradiation center axis Le are within the predetermined allowable range ΔQ. Just coaxial. In this case, the incident axis of the beam LB passing through the midpoint of the scanning track of the beam LB of the image rotating optical system IR from the fθ lens FT and the mechanical rotation center axis of the image rotating optical system IR are set to be within the predetermined allowable range ΔQ Coaxial inside.

以上所說明之實施形態及各變形例之構成中,於可相對曝光裝置本體旋轉之光束掃描裝置MD未搭載光源裝置14,但可如習知之裝置(特開平08-011348號公報)般,將半導體雷射二極體、LED等之小型固體光源設置在光束掃描裝置MD(例如支承架40)内,根據描繪資料對該固體光源進行脈衝發光之控制。此場合,無需圖5、圖6所示之描繪用光學元件AOM。In the configuration of the above-described embodiment and each modification example, the light source device 14 is not mounted on the light beam scanning device MD that can rotate relative to the exposure device body, but it can be changed like a conventional device (JP 08-011348) Small solid-state light sources such as semiconductor laser diodes, LEDs, etc. are arranged in the beam scanning device MD (for example, the support frame 40), and the solid-state light source is controlled by pulse emission according to the drawing data. In this case, the drawing optical element AOM shown in Figs. 5 and 6 is not necessary.

進一步的,於上述各實施形態及各變形例中,根據描繪資料之點光SP之強度調變(ON/OFF),雖係以例如設置在圖5中之光導入光學系BDU(BDU1~BDU6)内的描繪用光學元件AOM(AOM1~AOM6)來進行,但光源裝置14係光纖放大器雷射光源之情形時,亦可將射入光纖放大器前之紅外波長帶之種光(脈衝光)之強度根據描繪資料調變為破裂波狀,據以將從光源裝置14輸出之紫外線之脈衝光束本身根據描繪資料調變成破裂波狀。此場合,設在光導入光學系BDU内之描繪用光學元件AOM,係用作為是否將來自光源裝置14之光束LB導向光束掃描裝置MD之選擇用光學元件(稱為切換元件AOM)。為此,必須使光束掃描裝置MD各個之多面鏡PM之旋轉速度一致,並進行同步控制以使其旋轉角度之相位亦保持既定關係。進一步的,設置使來自光源裝置14之光束LB依序穿透光束掃描裝置MD各個之切換元件AOM的光束送光系(反射鏡等),回應多面鏡PM之原點訊號SH,在描繪線SLn上之點光SP之一次掃描期間,使各切換元件AOM中之任一個依序成為ON狀態之同步控制較佳。Furthermore, in each of the above-mentioned embodiments and modifications, the intensity modulation (ON/OFF) of the point light SP according to the drawing data is performed by, for example, the light introduction optical system BDU (BDU1 ~ BDU6) set in FIG. The drawing in) is performed with optical components AOM (AOM1~AOM6), but when the light source device 14 is a fiber amplifier laser light source, the seed light (pulse light) in the infrared wavelength band before the fiber amplifier The intensity is adjusted to a burst wave shape according to the drawing data, and accordingly the pulse beam of ultraviolet light output from the light source device 14 is adjusted to a burst wave shape according to the drawing data. In this case, the drawing optical element AOM provided in the light introducing optical system BDU is used as an optical element for selecting whether to direct the light beam LB from the light source device 14 to the beam scanning device MD (referred to as the switching element AOM). For this reason, it is necessary to make the rotation speed of each polygon mirror PM of the beam scanning device MD uniform, and to perform synchronous control so that the phase of the rotation angle also maintains a predetermined relationship. Further, the light beam transmission system (reflector, etc.) of each switching element AOM of the beam scanning device MD is arranged so that the light beam LB from the light source device 14 sequentially penetrates, in response to the origin signal SH of the polygon mirror PM, in the drawing line SLn During one scanning period of the upper spot light SP, it is better to make any one of the switching elements AOM turn ON in order.

又,上述實施形態及各變形例之曝光裝置EX,雖係對被旋轉筒DR之成為彎曲之基板FS進行以光束掃描裝置MD進行之點光SP之描繪曝光,但亦可以是對被支承為平面狀之基板FS進行點光SP之描繪曝光。也就是說,光束掃描裝置MD亦可以示對被支承為平面狀之基板FS進行點光SP之描繪曝光。此將基板FS之支承為平面狀之機構,可使用國際公開第2013/150677號小冊子所揭示之物。簡言之,藉由捲繞了環狀皮帶之複數個滾輪,將環狀皮帶支承基板FS之區域規定為平面狀。並且在環狀皮帶之成平面狀之區域,使搬送而來之基板FS緊貼於環狀皮帶加以支承。由於環狀皮帶係於既定方向以環狀方式搬送,因此環狀皮帶可將支承之基板FS往基板FS之搬送方向搬送。In addition, the exposure apparatus EX of the above-mentioned embodiment and each modification example performs drawing exposure of the spot light SP performed by the beam scanning device MD on the curved substrate FS by the rotating drum DR, but it may also be supported The planar substrate FS is subjected to drawing exposure of spot light SP. In other words, the light beam scanning device MD may perform drawing exposure of spot light SP on the substrate FS supported in a planar shape. This mechanism for supporting the substrate FS in a planar shape can use what is disclosed in the pamphlet of International Publication No. 2013/150677. In short, the area of the endless belt support substrate FS is defined as a flat surface by winding a plurality of rollers on the endless belt. And in the flat area of the endless belt, the conveyed substrate FS is closely attached to the endless belt for support. Since the endless belt is transported in an endless manner in a predetermined direction, the endless belt can transport the supported substrate FS to the transport direction of the substrate FS.

(第2實施形態) 圖23係顯示第2實施形態之光束掃描裝置MD’之構成,圖23之光束掃描裝置MD’是可與先前之圖5、圖7、圖10等所示之光束掃描裝置MDn(MD1~MD6)之各個置換之構成。關於構成圖23之光束掃描裝置MD’之構件,與先前之光束掃描裝置MDn之構件相同者係賦予相同符號,省略其詳細說明。本第2實施形態之光束掃描裝置MD’,係構成為將射入光導入光學系(亦稱為光束分配光學系)BDUn(BDU1~BDU6)内之描繪用光學元件AOMn(AOM1~AOM6)之後聚光之光束LBn(LB1~LB6)之單一模式之光纖SMF傳輸之光束LBn(LB1~LB6)加以導入。 (Second Embodiment) Figure 23 shows the structure of the beam scanning device MD' of the second embodiment. The beam scanning device MD' of Figure 23 is compatible with the previous beam scanning devices MDn (MD1~MD6) shown in Figures 5, 7, and 10. ) The composition of each replacement. With regard to the members constituting the beam scanning device MD' of FIG. 23, the same components as those of the previous beam scanning device MDn are given the same reference numerals, and detailed descriptions thereof are omitted. The beam scanning device MD' of the second embodiment is configured to guide the incident light into the optical system (also called beam distribution optical system) BDUn (BDU1 to BDU6) after the drawing optical element AOMn (AOM1 to AOM6) The condensed light beam LBn (LB1~LB6) is introduced by the single mode optical fiber SMF transmission light beam LBn (LB1~LB6).

光纖SMF之射出端Pbo係固定在光束掃描裝置MDn之反射鏡M10之+Zt方向,於射出端Pbo會聚之光束LB1一邊以既定數值孔徑(NA)放射、一邊於反射鏡M10反射後射入構成擴束器BE之聚光透鏡Be1與準直透鏡Be2。光束LB1在聚光透鏡Be1與準直透鏡Be2間之聚光位置Pb1聚光後,再次成為放射之光束LB1射入準直透鏡Be2後被轉換為平行光束。從準直透鏡Be2射出之光束LB1,與先前之圖7同樣的,透過反射鏡M12、像偏移光學構件SR、偏向調整光學構件DP、場孔徑FA、反射鏡M13、λ/4波長板QW、柱面透鏡CYa、反射鏡M14、多面鏡PM、fθ透鏡FT、反射鏡M15、及柱面透鏡CYb,聚光在基板FS上成點光SP。形成點光SP之面(基板FS之表面),與聚光位置Pb1及射出端PBo成光學上共軛之關係。又,圖23中,省略了圖7中所示之反射鏡M11、偏光分束器BS1、透鏡系G10、光檢測器DT1。The emission end Pbo of the optical fiber SMF is fixed in the +Zt direction of the mirror M10 of the beam scanning device MDn. The beam LB1 condensed at the emission end Pbo emits with a predetermined numerical aperture (NA) while being reflected by the mirror M10 and then enters to form an expansion The condenser lens Be1 and the collimator lens Be2 of the beamer BE. After the light beam LB1 is condensed at the condensing position Pb1 between the condensing lens Be1 and the collimating lens Be2, it becomes the radiated light beam LB1 again and enters the collimating lens Be2 to be converted into a parallel beam. The light beam LB1 emitted from the collimator lens Be2 is the same as the previous figure 7 through the mirror M12, the image shift optical member SR, the deflection adjusting optical member DP, the field aperture FA, the mirror M13, and the λ/4 wavelength plate QW , Cylindrical lens CYa, reflecting mirror M14, polygon mirror PM, fθ lens FT, reflecting mirror M15, and cylindrical lens CYb, condensed light on the substrate FS into a point of light SP. The surface forming the spot light SP (the surface of the substrate FS) is in an optically conjugate relationship with the condensing position Pb1 and the emitting end PBo. In addition, in FIG. 23, the mirror M11, the polarization beam splitter BS1, the lens system G10, and the photodetector DT1 shown in FIG. 7 are omitted.

於本第2實施形態,光束掃描裝置MD’亦是被支柱構件BX1軸支成整體可以照射中心軸Le1為中心在既定角度範圍旋動,但光纖SMF之射出端Pbo可固定在從照射中心軸Le1錯開之任意位置。高速掃描紫外波長帶之光束來進行圖案描繪之情形時,視基板FS上之感光性功能層之感度,有時須將光束之能量(點光之每單位面積之照度)設定的相當高。因此,如圖23所示之使用單一模式之光纖SMF的光傳輸,會有無法確保光纖對紫外線之耐受性的情形。然而,在感光性功能層對較紫外波長帶長之波長、例如對500nm等級~700nm等級之波長之光具有感度之情形時,如圖23所示,即能以單一模式之光纖SMF進行光傳輸。In the second embodiment, the beam scanning device MD' is also integrally supported by the pillar member BX1 axis and can rotate in a predetermined angle range with the irradiation center axis Le1 as the center, but the emission end Pbo of the optical fiber SMF can be fixed from the irradiation center axis Le1 staggered anywhere. In the case of high-speed scanning of light beams in the ultraviolet wavelength band for pattern drawing, depending on the sensitivity of the photosensitive functional layer on the substrate FS, sometimes the energy of the light beam (illuminance per unit area of the spot light) must be set quite high. Therefore, as shown in Fig. 23, optical transmission using a single-mode optical fiber SMF may not ensure the resistance of the optical fiber to ultraviolet rays. However, when the photosensitive functional layer is sensitive to wavelengths longer than the ultraviolet wavelength band, for example, to light with wavelengths of 500nm to 700nm, as shown in Figure 23, it can transmit light with a single-mode optical fiber SMF .

圖23之光纖SMF之未圖示的入射端,配置在先前以圖5所示之光導入光學系BDUn内之描繪用光學元件AOMn後之分歧用反射鏡M1之後。具體而言,將於反射鏡M1反射之描繪用光束LBn藉由聚光透鏡轉換成以既定NA(數值孔徑)聚光之光束,於其聚光點(光腰位置)固定光纖SMF之入射端即可。The incident end of the optical fiber SMF in FIG. 23, not shown, is arranged behind the branching mirror M1 after the optical element AOMn for drawing in the optical system BDUn shown in FIG. Specifically, the drawing beam LBn reflected by the mirror M1 is converted by a condenser lens into a beam condensed with a predetermined NA (numerical aperture), and the incident end of the optical fiber SMF is fixed at its condensing point (light waist position) OK.

10:元件製造系統 12:基板搬送機構 14:光源裝置 16:曝光頭 18:控制裝置 20:原點感測器 20a:光束送光系 20b:光束受光系 22:光源部 24、26:反射鏡 28:受光部 30、32:反射鏡 34:透鏡系 ALG1~ALG 4:對準顯微鏡 AOM(AOM1~AOM6):描繪用光學元件 AXf:光軸 AXo:旋轉筒之中心軸 BDU1~BDU6:光導入光學系 BE:擴束器 BS1:偏光分束器 BS2:分束器 BS3:偏光分束器 CYa、CYb:柱面透鏡 Dh:間隔 DP:偏向調整光學構件 DR:旋轉筒 DT1:光檢測器 DT2:位置檢測器 EC(EC1a、EC1b、EC2a、EC2b):編碼器 ECV:調溫室 EPC:邊緣位置控制器 EX:曝光裝置 FA:場孔徑 FS:基板 FT:fθ透鏡 G10:透鏡系 Hs1~Hs6:開口部 LB:光束 Le1~Le6:照射中心軸 M1~M5、M10~M15、M20~M24:反射鏡 MD1~MD6:光束掃描裝置 MK1~MK4:對準標記 PM:多面鏡 Poc:中心面 PR1、PR2:處理裝置 QW:λ/4波長板 R1、R2、R3:驅動滾輪 RP:反射面 RT1、RT2:張力調整滾輪 Sft:軸 SL(SL1~SL6):掃描線 SP:點光 SR:像偏移光學構件 SU1、SU2:防振單元 UB:本體架 Vw1~Vw4:觀察區域 W:曝光區域 10: Component manufacturing system 12: Substrate transport mechanism 14: Light source device 16: Exposure head 18: Control device 20: Origin sensor 20a: beam delivery system 20b: Beam receiving system 22: Light source 24, 26: mirror 28: Light receiving part 30, 32: mirror 34: lens system ALG1~ALG 4: Align the microscope AOM (AOM1~AOM6): Optical components for drawing AXf: Optical axis AXo: The central axis of the rotating cylinder BDU1~BDU6: Light guide optics BE: Beam expander BS1: Polarizing beam splitter BS2: beam splitter BS3: Polarizing beam splitter CYa, CYb: Cylindrical lens Dh: interval DP: Deflection adjustment optical component DR: rotating drum DT1: Light detector DT2: Position detector EC (EC1a, EC1b, EC2a, EC2b): encoder ECV: Adjust the greenhouse EPC: Edge Position Controller EX: Exposure device FA: field aperture FS: Substrate FT: fθ lens G10: lens system Hs1~Hs6: opening LB: beam Le1~Le6: Irradiation center axis M1~M5, M10~M15, M20~M24: mirror MD1~MD6: Beam scanning device MK1~MK4: Alignment mark PM: Polygonal mirror Poc: center plane PR1, PR2: processing device QW:λ/4 wavelength plate R1, R2, R3: drive roller RP: reflective surface RT1, RT2: Tension adjustment roller Sft: axis SL (SL1~SL6): scan line SP: point light SR: Image shifting optics SU1, SU2: Anti-vibration unit UB: body frame Vw1~Vw4: Observation area W: exposure area

[圖1]係包含對實施形態之基板施以曝光處理之曝光裝置之元件製造系統的概略構成圖。 [圖2]係詳細顯示捲繞有基板之圖1之旋轉筒的圖。 [圖3]係顯示點光之描繪線及基板上形成之對準標記的圖。 [圖4]係圖1之曝光裝置的主要部位放大圖。 [圖5]係詳細顯示圖4之光導入光學系之光學構成的圖。 [圖6]係用以說明以圖5之描繪用光學元件進行之光路切換的概說明圖。 [圖7]係圖4之光束掃描裝置之光學構成的圖。 [圖8]係顯示設在圖7之多面鏡周邊之原點感測器之構成的圖。 [圖9]係顯示原點訊號之產生時序與描繪開始時序之關係的圖。 [圖10]係顯示以圖4之第2機架部構成之光束掃描裝置之保持構造的剖面圖。 [圖11]係圖10之XI-XI線剖面圖。 [圖12]係顯示保持圖4及圖10、11中所示之複數個光束掃描裝置之構造體的立體圖。 [圖13]係顯示圖12所示之構造體與曝光裝置本體部之安裝構造的立體圖。 [圖14]係顯示以圖4之曝光頭曝光既定圖案之曝光區域之變形狀態的圖。 [圖15]係顯示變形例1之光束掃描裝置之光學構成的圖。 [圖16]係顯示變形例2之光束掃描裝置之光學構成的圖。 [圖17]A係變形例4之光束掃描裝置之光學構成在與XtZt平面平行之面内所見的圖、圖17B係變形例4之光束掃描裝置之光學構成在與YtZt平面平行之面内所見的圖。 [圖18]A係變形例5之光束掃描裝置之光學構成在與XtYt平面平行之面内所見的圖、圖18B係變形例5之光束掃描裝置之光學構成在與YtZt平面平行之面内所見的圖。 [圖19]顯示變形例6之光束掃描裝置之光學構成的圖。 [圖20]係顯示配置複數個圖19之光束掃描裝置之情形時之構成的圖。 [圖21]係說明使光束掃描裝置形成之描繪線傾斜時之描繪位置誤差的圖。 [圖22]係說明在光束掃描裝置之旋轉中心偏移之情形時,使描繪線傾斜時之描繪位置誤差的圖。 [圖23]係顯示第2實施形態之光束掃描裝置之構成的圖。 Fig. 1 is a schematic configuration diagram of a device manufacturing system including an exposure device that applies exposure processing to a substrate of the embodiment. [Fig. 2] A diagram showing in detail the rotating drum of Fig. 1 with a substrate wound around it. [Fig. 3] A diagram showing the drawing line of the point light and the alignment mark formed on the substrate. [Fig. 4] An enlarged view of the main part of the exposure device in Fig. 1. [Fig. [Fig. 5] A diagram showing in detail the optical structure of the light introduction optical system of Fig. 4. [FIG. 6] It is a schematic explanatory diagram for explaining the optical path switching performed by the optical element for drawing in FIG. 5. [FIG. 7] A diagram of the optical configuration of the beam scanning device of FIG. 4. [Fig. 8] is a diagram showing the structure of the origin sensor arranged on the periphery of the polygon mirror in Fig. 7. [Figure 9] is a diagram showing the relationship between the origin signal generation timing and the drawing start timing. Fig. 10 is a cross-sectional view showing the holding structure of the beam scanning device constituted by the second frame part of Fig. 4. [Figure 11] is a cross-sectional view taken along line XI-XI in Figure 10. [Fig. 12] A perspective view showing a structure holding a plurality of beam scanning devices shown in Figs. 4 and 10 and 11. Fig. 13 is a perspective view showing the mounting structure of the structure shown in Fig. 12 and the main body of the exposure apparatus. [Fig. 14] is a diagram showing the deformation state of the exposure area of the predetermined pattern exposed by the exposure head of Fig. 4. Fig. 15 is a diagram showing the optical configuration of the beam scanning device of Modification 1. [Fig. 16] A diagram showing the optical configuration of the beam scanning device of Modification 2. [FIG. 17] The optical configuration of the beam scanning device in A series of modification 4 is seen in a plane parallel to the XtZt plane, and Figure 17B is the optical configuration of the beam scanning device in modification 4 seen in a plane parallel to the YtZt plane Figure. [FIG. 18] The optical configuration of the beam scanning device in A series of modification 5 is seen in a plane parallel to the XtYt plane, and Figure 18B is the optical configuration of the beam scanning device in modification 5 seen in a plane parallel to the YtZt plane Figure. [Fig. 19] A diagram showing the optical configuration of a beam scanning device of Modification 6. [Fig. 20] is a diagram showing the configuration when a plurality of beam scanning devices of Fig. 19 are arranged. [FIG. 21] A diagram explaining the drawing position error when the drawing line formed by the beam scanning device is inclined. [FIG. 22] A diagram explaining the drawing position error when the drawing line is tilted when the rotation center of the beam scanning device is shifted. [Fig. 23] A diagram showing the structure of a beam scanning device according to the second embodiment.

10:元件製造系統 12:基板搬送機構 14:光源裝置 16:曝光頭 18:控制裝置 M1~ALG 4:對準顯微鏡 AXo:旋轉筒之中心軸 DR:旋轉筒 ECV:調溫室 EPC:邊緣位置控制器 EX:曝光裝置 FS:基板 LB:光束 Le1~Le6:照射中心軸 MD1~MD6:光束掃描裝置 Poc:中心面 PR1、PR2:處理裝置 R1、R2、R3:驅動滾輪 RT1、RT2:張力調整滾輪 Sft:軸 SU1、SU2:防振單元 10: Component manufacturing system 12: Substrate transport mechanism 14: Light source device 16: Exposure head 18: Control device M1~ALG 4: Align the microscope AXo: The central axis of the rotating cylinder DR: rotating drum ECV: Adjust the greenhouse EPC: Edge Position Controller EX: Exposure device FS: Substrate LB: beam Le1~Le6: Irradiation center axis MD1~MD6: Beam scanning device Poc: center plane PR1, PR2: processing device R1, R2, R3: drive roller RT1, RT2: Tension adjustment roller Sft: axis SU1, SU2: Anti-vibration unit

Claims (21)

一種圖案描繪裝置,係將投射於被照射體之描繪用光束藉由旋轉多面鏡之旋轉而反覆進行掃描,以在前述被照射體上描繪既定之圖案,其具備: 原點檢測部,在偵測到前述旋轉多面鏡之複數個反射面中、與反射前述描繪用光束之第1反射面不同之第2反射面成為既定之角度位置時,產生原點訊號;以及 控制裝置,以由前述原點訊號產生後到前述第2反射面成為前述第1反射面為止之前述旋轉多面鏡之旋轉速度決定之既定時間為基準,以從前述原點訊號產生後既定之延遲的時序,指示以前述描繪用光束進行之描繪開始。 A pattern drawing device that repeatedly scans the drawing beam projected on the illuminated object by the rotation of a rotating polygon mirror to draw a predetermined pattern on the illuminated object, which has: The origin detecting unit generates an origin signal when it detects that the second reflecting surface that is different from the first reflecting surface reflecting the drawing light beam among the plurality of reflecting surfaces of the rotating polygon mirror becomes a predetermined angular position; and The control device is based on a predetermined time determined by the rotation speed of the rotating polygon mirror after the origin signal is generated until the second reflecting surface becomes the first reflecting surface, and a predetermined delay from the origin signal generation The timing of the instruction starts with the drawing performed by the aforementioned drawing beam. 如請求項1所述之圖案描繪裝置,其中, 前述原點檢測部包含: 光束送光系統,朝向前述第2反射面投射與前述描繪用光束不同之光束;以及 光束受光系統,在既定之位置接受在前述第2反射面之反射光束,在前述第2反射面成為既定之角度位置時,產生前述原點訊號。 The pattern drawing device according to claim 1, wherein: The aforementioned origin detection unit includes: A light beam delivery system that projects a light beam different from the drawing light beam toward the second reflecting surface; and The light beam receiving system receives the reflected light beam on the second reflecting surface at a predetermined position, and generates the origin signal when the second reflecting surface reaches a predetermined angular position. 如請求項2所述之圖案描繪裝置,其中, 前述第2反射面被設定為在前述旋轉多面鏡之旋轉方向上,與前述第1反射面相鄰。 The pattern drawing device according to claim 2, wherein: The second reflecting surface is set to be adjacent to the first reflecting surface in the rotation direction of the rotating polygon mirror. 如請求項2所述之圖案描繪裝置,其中, 前述第2反射面被設定為在前述旋轉多面鏡之旋轉方向上,前述第1反射面之前n個面(n為1以上之整數)。 The pattern drawing device according to claim 2, wherein: The second reflecting surface is set to be n surfaces before the first reflecting surface (n is an integer greater than or equal to 1) in the rotation direction of the rotating polygon mirror. 如請求項1至3中任一項所述之圖案描繪裝置,其中, 前述控制裝置,使前述旋轉多面鏡往藉由前述原點檢測部檢測之前述第2反射面成為前述第1反射面而反射前述描繪用光束之方向旋轉。 The pattern drawing device according to any one of claims 1 to 3, wherein: The control device rotates the rotating polygon mirror in a direction in which the second reflection surface detected by the origin detection unit becomes the first reflection surface and reflects the drawing light beam. 如請求項5所述之圖案描繪裝置,其中, 將前述旋轉多面鏡之反射面數設為Np、前述旋轉多面鏡之每分鐘旋轉數設為Vp[rpm]時,前述既定時間係根據60/(Np×Vp)[秒]來設定。 The pattern drawing device according to claim 5, wherein: When the number of reflecting surfaces of the rotating polygonal mirror is set to Np and the number of revolutions per minute of the rotating polygonal mirror is set to Vp[rpm], the predetermined time is set based on 60/(Np×Vp)[sec]. 如請求項2至4中任一項所述之圖案描繪裝置,其中, 前述描繪用光束之波長被設定在使形成在前述被照射體之光感應層感光之紫外波長帶, 前述光束送光系統包含射出對前述光感應層非感光性之波長帶之光束之光源部, 前述光束受光系統包含: 透鏡系統,將在前述第2反射面反射之前述反射光束聚光成點光;以及 光電轉換元件,接受該聚光之點光並輸出前述原點訊號。 The pattern drawing device according to any one of claims 2 to 4, wherein: The wavelength of the light beam for drawing is set in the ultraviolet wavelength band that sensitizes the photosensitive layer formed on the irradiated body, The light beam delivery system includes a light source unit that emits a light beam in a wavelength band that is not photosensitive to the light sensing layer, The aforementioned light beam receiving system includes: A lens system for condensing the reflected light beam reflected on the second reflecting surface into a point light; and The photoelectric conversion element receives the concentrated spot light and outputs the aforementioned origin signal. 如請求項1至4中任一項所述之圖案描繪裝置,其進而具備: 遠心掃描透鏡,用以入射藉由前述旋轉多面鏡反射之前述描繪用光束,一邊將前述描繪用光束在前述被照射體上作為點光聚光,一邊藉由前述旋轉多面鏡之旋轉而在前述被照射體上遍及主掃描方向之既定範圍内以既定速度掃描前述點光;以及 光源裝置,以較前述點光之在前述被照射體上之實效尺寸小之間隔,以前述點光在前述主掃描方向重疊之頻率將前述描繪用光束進行脈衝震盪。 The pattern drawing device according to any one of claims 1 to 4, which further includes: The telecentric scanning lens is used to enter the drawing light beam reflected by the rotating polygon mirror, while condensing the drawing light beam on the irradiated body as a point light, while rotating the rotating polygon mirror Scan the aforementioned spot light at a predetermined speed across a predetermined range in the main scanning direction on the illuminated object; and The light source device pulses the drawing light beam at an interval smaller than the effective size of the spot light on the irradiated body at a frequency at which the spot light overlaps in the main scanning direction. 如請求項8所述之圖案描繪裝置,其中, 前述光源裝置,係將高輝度的紫外線脈衝光以數百MHz之頻率射出之光纖增幅雷射光源。 The pattern drawing device according to claim 8, wherein: The aforementioned light source device is a fiber-amplified laser light source that emits high-brightness ultraviolet pulse light at a frequency of hundreds of MHz. 一種圖案描繪方法,係將投射於被照射體之描繪用光束藉由旋轉多面鏡之旋轉而反覆進行掃描,以在前述被照射體上描繪既定之圖案,其包含: 朝向前述旋轉多面鏡之複數個反射面中、與反射前述描繪用光束之第1反射面不同之第2反射面,投射與前述描繪用光束不同之光束,藉由利用配置在既定位置之受光部接受來自前述第2反射面之反射光束,來產生表示前述第2反射面成為既定之角度位置之原點訊號;以及 以由前述原點訊號產生後到前述第2反射面成為前述第1反射面為止之前述旋轉多面鏡之旋轉速度決定之既定時間為基準,以從前述原點訊號產生後既定之延遲的時序,指示以前述描繪用光束進行之描繪開始。 A pattern drawing method is to repeatedly scan the drawing beam projected on the illuminated object by rotating a rotating polygon mirror to draw a predetermined pattern on the illuminated object, which includes: Among the plurality of reflecting surfaces facing the rotating polygon mirror, the second reflecting surface which is different from the first reflecting surface reflecting the drawing light beam projects a light beam different from the drawing light beam by using a light receiving part arranged at a predetermined position Receiving the reflected light beam from the second reflecting surface to generate an origin signal indicating that the second reflecting surface has become a predetermined angular position; and Based on the predetermined time determined by the rotation speed of the rotating polygon mirror after the origin signal is generated until the second reflecting surface becomes the first reflecting surface, the timing of the predetermined delay after the origin signal is generated, The instruction starts with the drawing performed by the aforementioned drawing beam. 如請求項10所述之圖案描繪方法,其中, 前述第2反射面被設定為在前述旋轉多面鏡之旋轉方向上,與前述第1反射面相鄰。 The pattern drawing method according to claim 10, wherein: The second reflecting surface is set to be adjacent to the first reflecting surface in the rotation direction of the rotating polygon mirror. 如請求項10所述之圖案描繪方法,其中, 前述第2反射面被設定為在前述旋轉多面鏡之旋轉方向上,前述第1反射面之前n個面(n為1以上之整數)。 The pattern drawing method according to claim 10, wherein: The second reflecting surface is set to be n surfaces before the first reflecting surface (n is an integer greater than or equal to 1) in the rotation direction of the rotating polygon mirror. 如請求項10所述之圖案描繪方法,其中, 使前述旋轉多面鏡往用於前述原點訊號之產生之前述第2反射面成為前述第1反射面而反射前述描繪用光束之方向旋轉。 The pattern drawing method according to claim 10, wherein: The rotating polygon mirror is rotated in a direction in which the second reflecting surface used for generating the origin signal becomes the first reflecting surface and reflects the drawing light beam. 如請求項10至13中任一項所述之圖案描繪方法,其中, 將前述旋轉多面鏡之反射面數設為Np、前述旋轉多面鏡之每分鐘旋轉數設為Vp[rpm]時,前述既定時間係根據60/(Np×Vp)[秒]之值來設定。 The pattern drawing method according to any one of claims 10 to 13, wherein: When the number of reflecting surfaces of the rotating polygonal mirror is set to Np and the number of rotations per minute of the rotating polygonal mirror is set to Vp[rpm], the predetermined time is set based on the value of 60/(Np×Vp)[sec]. 如請求項10至13中任一項所述之圖案描繪方法,其中, 為了使形成在前述被照射體之光感應層感光,前述描繪用光束被設定為在370nm以下之波長帶具有峰值波長之紫外線光, 投射至前述旋轉多面鏡之前述第2反射面之光束被設定為對前述光感應層非感光性之波長帶之光束。 The pattern drawing method according to any one of claims 10 to 13, wherein: In order to sensitize the light-sensitive layer formed on the irradiated body, the drawing beam is set to be ultraviolet light with a peak wavelength in the wavelength band below 370 nm. The light beam projected to the second reflecting surface of the rotating polygonal mirror is set to a light beam in a wavelength band that is not photosensitive to the light-sensitive layer. 如請求項10至13中任一項所述之圖案描繪方法,其中, 由前述旋轉多面鏡反射之前述描繪用光束,係藉由遠心掃描透鏡來作為點光被聚光在前述被照射體上,並且藉由前述旋轉多面鏡之旋轉而遍及前述被照射體上之主掃描方向之既定範圍内以既定速度掃描, 前述描繪用光束,係從以較前述點光之實效尺寸小之間隔且以前述點光在前述主掃描方向重疊之頻率進行脈衝震盪之脈衝雷射光源射出。 The pattern drawing method according to any one of claims 10 to 13, wherein: The drawing light beam reflected by the rotating polygon mirror is focused on the irradiated body as a spot light by a telecentric scanning lens, and spreads over the irradiated body by the rotation of the rotating polygon mirror. Scan at a predetermined speed within a predetermined range of the scanning direction, The aforementioned drawing light beam is emitted from a pulsed laser light source that pulses at an interval smaller than the effective size of the aforementioned spot light and pulses at a frequency at which the aforementioned spot light overlaps in the aforementioned main scanning direction. 一種圖案描繪裝置,係將投射於被照射體之描繪用光束藉由旋轉多面鏡之旋轉而反覆進行掃描,以在前述被照射體上描繪既定之圖案,其具備: 光源裝置,根據對應於前述圖案之描繪資料將紫外波長帶之雷射光進行強度調變,作為前述描繪用光束射出; 複數個鏡,使來自前述光源裝置之前述描繪用光束,朝向前述旋轉多面鏡之複數個反射面中成為既定之角度範圍之第1反射面反射; 遠心掃描透鏡,用以入射在前述旋轉多面鏡之前述第1反射面反射之前述描繪用光束,一邊將前述描繪用光束在前述被照射體上作為點光聚光,一邊伴隨前述旋轉多面鏡之旋轉而在前述被照射體上遍及主掃描方向之既定範圍内以既定速度掃描前述點光; 原點檢測部,前述旋轉多面鏡之複數個反射面中,與前述第1反射面不同、且位於在前述旋轉多面鏡之旋轉方向上前述第1反射面之前n個面(n為1以上之整數)之第2反射面成為特定之角度位置時,產生脈衝狀之原點訊號;以及 控制裝置,以利用根據前述旋轉多面鏡之旋轉速度而變更之既定之延遲時間從前述原點訊號之產生時點所經過之時序,開始前述圖案之描繪之方式,對前述光源裝置指示基於前述描繪資料之前述雷射光之強度調變之開始。 A pattern drawing device that repeatedly scans the drawing beam projected on the illuminated object by the rotation of a rotating polygon mirror to draw a predetermined pattern on the illuminated object, which has: The light source device modulates the intensity of the laser light in the ultraviolet wavelength band according to the drawing data corresponding to the aforementioned pattern, and emits it as the aforementioned drawing beam; A plurality of mirrors reflect the light beam for drawing from the light source device toward the first reflecting surface of the plurality of reflecting surfaces of the rotating polygon mirror, which becomes a predetermined angle range; The telecentric scanning lens is used to incident the drawing light beam reflected on the first reflecting surface of the rotating polygon mirror, while condensing the drawing light beam on the irradiated body as a point light, while accompanying the rotation of the rotating polygon mirror Rotate to scan the spot light at a predetermined speed within a predetermined range of the irradiated body across the main scanning direction; The origin detection unit, among the plurality of reflecting surfaces of the rotating polygon mirror, is different from the first reflecting surface and is located n surfaces before the first reflecting surface in the rotation direction of the rotating polygon mirror (n is 1 or more Integer) when the second reflecting surface reaches a specific angular position, a pulse-like origin signal is generated; and The control device starts the drawing of the pattern by using the predetermined delay time which is changed according to the rotation speed of the rotating polygon mirror, and starts the drawing of the pattern based on the drawing data. The start of intensity modulation of the aforementioned laser light. 如請求項17所述之圖案描繪裝置,其中, 前述原點檢測部包含: 光束送光系統,朝向前述第2反射面投射與前述描繪用光束不同之光束;以及 光束受光系統,在既定之位置接受在前述第2反射面之反射光束,在前述第2反射面成為前述特定之角度位置時,產生前述原點訊號。 The pattern drawing device according to claim 17, wherein: The aforementioned origin detection unit includes: A light beam delivery system that projects a light beam different from the drawing light beam toward the second reflecting surface; and The light beam receiving system receives the reflected light beam on the second reflecting surface at a predetermined position, and generates the origin signal when the second reflecting surface reaches the specific angular position. 如請求項18所述之圖案描繪裝置,其中, 前述光源裝置,係根據前述描繪資料,將設定在使形成在前述被照射體之光感應層感光之紫外線之波長帶且以數百MHz之頻率發光之脈衝光進行強度調變,作為前述描繪用光束射出之脈衝雷射光源, 從前述光束送光系統往前述旋轉多面鏡之前述第2反射面投射之前述光束之波長係設定在對前述光感應層非感光性之波長帶。 The pattern drawing device according to claim 18, wherein: The aforementioned light source device is based on the aforementioned drawing data by adjusting the intensity of pulsed light that emits light at a frequency of several hundreds of MHz and is set in the wavelength band of the ultraviolet ray that sensitizes the light-sensitive layer formed on the irradiated body as the aforementioned drawing. Pulsed laser light source emitted by beam, The wavelength of the light beam projected from the light beam delivery system to the second reflecting surface of the rotating polygonal mirror is set in a wavelength band that is not photosensitive to the light sensitive layer. 如請求項17至19中任一項所述之之圖案描繪裝置,其中, 前述第2反射面被設定為在前述旋轉多面鏡之旋轉方向上,與前述第1反射面相鄰。 The pattern drawing device according to any one of claims 17 to 19, wherein: The second reflecting surface is set to be adjacent to the first reflecting surface in the rotation direction of the rotating polygon mirror. 如請求項18或19所述之圖案描繪裝置,其中, 前述光束受光系統包含: 透鏡系統,入射在前述旋轉多面鏡之前述第2反射面反射之前述反射光束,將前述反射光束聚光成點光;以及 光電轉換元件,接受在該透鏡系統聚光之前述反射光束之點光而輸出前述原點訊號; 前述透鏡系統被設定為前述旋轉多面鏡之前述第2反射面成為前述透鏡系統之焦點位置。 The pattern drawing device according to claim 18 or 19, wherein: The aforementioned light beam receiving system includes: A lens system, incident on the reflected light beam reflected by the second reflecting surface of the rotating polygon mirror, and condenses the reflected light beam into a point light; and The photoelectric conversion element receives the spot light of the reflected light beam condensed by the lens system and outputs the origin signal; The lens system is set so that the second reflecting surface of the rotating polygon mirror becomes the focal position of the lens system.
TW109108755A 2015-03-20 2016-03-18 Pattern drawing device and pattern drawing method TWI698662B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-057906 2015-03-20
JP2015057906 2015-03-20

Publications (2)

Publication Number Publication Date
TW202024716A TW202024716A (en) 2020-07-01
TWI698662B true TWI698662B (en) 2020-07-11

Family

ID=56979222

Family Applications (3)

Application Number Title Priority Date Filing Date
TW109108756A TWI718030B (en) 2015-03-20 2016-03-18 Beam scanning device and pattern drawing device
TW109108755A TWI698662B (en) 2015-03-20 2016-03-18 Pattern drawing device and pattern drawing method
TW105108383A TWI691799B (en) 2015-03-20 2016-03-18 Beam scanning device and drawing device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109108756A TWI718030B (en) 2015-03-20 2016-03-18 Beam scanning device and pattern drawing device

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105108383A TWI691799B (en) 2015-03-20 2016-03-18 Beam scanning device and drawing device

Country Status (5)

Country Link
JP (2) JP6740999B2 (en)
KR (2) KR102195908B1 (en)
CN (5) CN110596887B (en)
TW (3) TWI718030B (en)
WO (1) WO2016152758A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110596887B (en) * 2015-03-20 2022-04-01 株式会社尼康 Pattern drawing device and pattern drawing method
JP7099321B2 (en) * 2016-10-04 2022-07-12 株式会社ニコン Beam scanning device and pattern drawing device
TWI736621B (en) * 2016-10-04 2021-08-21 日商尼康股份有限公司 Pattern drawing device and pattern drawing method
KR102701613B1 (en) * 2017-09-26 2024-09-03 가부시키가이샤 니콘 Pattern drawing device
WO2019082850A1 (en) 2017-10-25 2019-05-02 株式会社ニコン Pattern drawing device
CN114740630B (en) * 2022-06-15 2022-09-16 西安炬光科技股份有限公司 Scanning optical system and laser application terminal

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0545596A (en) * 1991-08-09 1993-02-23 Fuji Photo Optical Co Ltd Rotation detecting mechanism for rotary polygon mirror
TW243517B (en) * 1991-12-20 1995-03-21 Compaq Computer Corp
TWI344068B (en) * 2005-08-31 2011-06-21 Canon Kk Image forming apparatus and control method therefor
US8130255B2 (en) * 2008-06-27 2012-03-06 Lexmark International, Inc. Method and system for selecting total job time print
CN103869652A (en) * 2012-12-13 2014-06-18 佳能株式会社 Image forming apparatus

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2691359B2 (en) * 1988-12-24 1997-12-17 株式会社トプコン Scanning optical device
JPH0580260A (en) * 1991-09-19 1993-04-02 Asahi Optical Co Ltd Drawing device
JPH0576172U (en) * 1992-03-19 1993-10-15 株式会社ニコン Infrared imaging device
JPH07244247A (en) * 1994-03-04 1995-09-19 Hitachi Koki Co Ltd Light beam scanning device
JPH0811348A (en) * 1994-07-04 1996-01-16 Fuji Xerox Co Ltd Beam scanning apparatus
GB9524884D0 (en) * 1995-12-05 1996-02-07 Gareth Jones Scanning system
JP3804256B2 (en) * 1998-02-26 2006-08-02 富士ゼロックス株式会社 Optical scanning device
US6249384B1 (en) * 1999-06-29 2001-06-19 Eastman Kodak Company Detection and correction of skew between a writing laser beam and lenticules in lenticular material
JP2001133710A (en) 1999-11-05 2001-05-18 Asahi Optical Co Ltd Laser plotting device having multi-head scanning optical system
JP3564026B2 (en) * 1999-12-27 2004-09-08 キヤノン株式会社 Optical scanning device, multi-beam optical scanning device, and image forming apparatus using the same
JP3670935B2 (en) 2000-06-14 2005-07-13 ペンタックス株式会社 Laser drawing device
JP3890891B2 (en) * 2000-12-25 2007-03-07 株式会社オーク製作所 Laser drawing device
JP2003015217A (en) * 2001-07-02 2003-01-15 Matsushita Electric Ind Co Ltd Projection type image display device
JP2003114395A (en) 2001-10-09 2003-04-18 Pentax Corp Split exposure device
JP3667286B2 (en) * 2002-02-20 2005-07-06 キヤノン株式会社 Optical scanning apparatus, image forming apparatus, and color image forming apparatus
US6969846B2 (en) * 2002-02-28 2005-11-29 Canon Kabushiki Kaisha Light source unit and scanning optical apparatus using the same
JP2003270572A (en) * 2002-03-15 2003-09-25 Fuji Xerox Co Ltd Optical scanner
JP4175105B2 (en) * 2002-12-25 2008-11-05 船井電機株式会社 Skew adjustment method and skew adjustment jig for laser scanning unit in image forming apparatus
JP2005234048A (en) * 2004-02-17 2005-09-02 Brother Ind Ltd Image forming device and optical beam scanner
JP2005231090A (en) * 2004-02-18 2005-09-02 Ricoh Co Ltd Method for correcting beam spot position, optical scanner, and multicolor image forming apparatus
JP4440700B2 (en) * 2004-04-26 2010-03-24 株式会社リコー Optical scanning method, optical scanning apparatus, image forming method, and image forming apparatus
KR100611976B1 (en) * 2004-04-12 2006-08-11 삼성전자주식회사 Optical scanning apparatus and method for detecting synchronization signal
JP2005308971A (en) * 2004-04-20 2005-11-04 Canon Inc Image forming apparatus
JP2006065106A (en) 2004-08-27 2006-03-09 Ricoh Co Ltd Optical scanning device, optical scanning method, and printer
JP2006243225A (en) 2005-03-02 2006-09-14 Seiko Epson Corp Optical scanner and image display apparatus
JP2008209797A (en) * 2007-02-27 2008-09-11 Sumitomo Heavy Ind Ltd Laser irradiation apparatus and exposure method
JP2009092722A (en) * 2007-10-04 2009-04-30 Nsk Ltd Light irradiation device
JP5078820B2 (en) * 2008-02-05 2012-11-21 株式会社リコー Optical scanning apparatus and image forming apparatus
WO2009108543A2 (en) * 2008-02-26 2009-09-03 3M Innovative Properties Company Multi-photon exposure system
JP5220521B2 (en) * 2008-09-09 2013-06-26 シャープ株式会社 Image forming apparatus
JP5359920B2 (en) * 2010-02-17 2013-12-04 株式会社リコー Optical housing, optical scanning device, and image forming apparatus
JP5195830B2 (en) * 2010-06-25 2013-05-15 ブラザー工業株式会社 Scanning optical device
US8911112B2 (en) * 2011-01-14 2014-12-16 Ricoh Company, Ltd. Light emitting element adjusting and fixing structure, optical scanner, and image forming apparatus
JP6392117B2 (en) * 2011-06-03 2018-09-19 トムソン ライセンシングThomson Licensing Small projector and method applied to the same
JP5906115B2 (en) * 2012-03-29 2016-04-20 川崎重工業株式会社 Optical scanning apparatus and laser processing apparatus
IN2015DN01909A (en) 2012-08-28 2015-08-07 Nikon Corp
CN110596887B (en) 2015-03-20 2022-04-01 株式会社尼康 Pattern drawing device and pattern drawing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0545596A (en) * 1991-08-09 1993-02-23 Fuji Photo Optical Co Ltd Rotation detecting mechanism for rotary polygon mirror
TW243517B (en) * 1991-12-20 1995-03-21 Compaq Computer Corp
TWI344068B (en) * 2005-08-31 2011-06-21 Canon Kk Image forming apparatus and control method therefor
US8130255B2 (en) * 2008-06-27 2012-03-06 Lexmark International, Inc. Method and system for selecting total job time print
CN103869652A (en) * 2012-12-13 2014-06-18 佳能株式会社 Image forming apparatus

Also Published As

Publication number Publication date
CN110596886A (en) 2019-12-20
CN110596888A (en) 2019-12-20
TW202028887A (en) 2020-08-01
CN110596888B (en) 2022-04-01
CN110596886B (en) 2021-12-07
KR102169506B1 (en) 2020-10-23
JPWO2016152758A1 (en) 2017-12-28
CN111638631B (en) 2023-03-10
KR20200024956A (en) 2020-03-09
TW201704889A (en) 2017-02-01
CN111638631A (en) 2020-09-08
JP6740999B2 (en) 2020-08-19
WO2016152758A1 (en) 2016-09-29
TW202024716A (en) 2020-07-01
KR102195908B1 (en) 2020-12-29
CN107430272A (en) 2017-12-01
CN110596887A (en) 2019-12-20
CN110596887B (en) 2022-04-01
KR20170127460A (en) 2017-11-21
CN107430272B (en) 2020-05-29
TWI718030B (en) 2021-02-01
JP7074160B2 (en) 2022-05-24
TWI691799B (en) 2020-04-21
JP2020194167A (en) 2020-12-03

Similar Documents

Publication Publication Date Title
JP6849119B2 (en) Direct drawing exposure device
TWI698662B (en) Pattern drawing device and pattern drawing method
TWI782698B (en) Pattern drawing device, pattern drawing method, and device manufacturing method
JP6648798B2 (en) Pattern drawing equipment
JP6361273B2 (en) Substrate processing apparatus and device manufacturing method
JP6547609B2 (en) Device forming apparatus and pattern forming apparatus
JP6702487B2 (en) Pattern forming equipment
JP6540406B2 (en) Beam scanning apparatus and pattern drawing apparatus
WO2022044992A1 (en) Inspection device for pattern drawing device
JP6638355B2 (en) Pattern drawing equipment
JP2020177239A (en) Pattern forming apparatus