TWI680058B - Adsorption device and bonding system - Google Patents

Abstract

The invention provides an adsorption device, comprising: a force applying structure for providing pressure; and an adsorption structure connected to the force applying structure, comprising a contact layer, the contact layer including a substrate and a surface protruding from one surface of the substrate The plurality of protruding elastic contact portions are arranged at intervals; wherein, the elastic contact portions are adapted to cooperate with the pressure provided by the force applying structure to adsorb the parts to be bonded. The adsorption device provided by the present invention improves the adsorption effect on the surface-attached pieces, which is helpful to solve the problem of poor adsorption in the conventional technology when the surface of the pieces to be laminated is uneven. The invention also provides a fitting system.

Description

Adsorption device and bonding system

The invention relates to an adsorption device and a bonding system having the same.

The bonding system generally includes an adsorption device for fixing the compound to be bonded. The general adsorption principle is to use vacuum adsorption, electrostatic adsorption or Van der Waals coating to fix the compound to be bonded. Because the problem of air leakage that may exist in the device is taken into consideration when vacuum adsorption is used, generally, a rigid material is used as the substrate for the adsorption device, and metals and ceramics are commonly used. If electrostatic adsorption is used, the adsorption device needs to be equipped with a winding coil for adsorption, and rigid materials are often used for the substrate. In the case of using Van der Waals force, the coating is applied to the surface of a rigid medium to achieve an adsorption effect.

In the above-mentioned bonding jig, when the surface to be bonded is an uneven material when the adsorption device adsorbs the material to be bonded, for example, the surface has burrs, needle-shaped protrusions and other surface protrusions, such uneven surfaces Stress concentration will occur at the point of stress, which will cause the bonding failure.

An aspect of the present invention provides an adsorption device, including: a force applying structure for providing pressure; and an adsorption structure connected to the force applying structure, comprising a contact layer, the contact layer including a substrate and one of the substrates A plurality of elastic contact portions arranged on the surface protruding in a plurality of intervals; wherein the elastic contact portions are used for cooperating with the pressure provided by the force-applying structure to adsorb the parts to be bonded.

Another aspect of the present invention provides a bonding system, comprising: an upper platform for fixing a first piece to be bonded, the upper platform including the adsorption device according to any one of the above; a lower platform for fixing a second Pieces to be laminated; and A displacement controller, which is connected to the force applying structure and is used to drive the force applying structure and the adsorption structure to generate displacement in a three-dimensional direction.

The adsorption device, the buffer layer and all the elastic contact portions provided by the present invention are made of a highly elastic material (such as PDMS). When the force is applied by the force structure, the buffer layer acts as a buffer, and the pressure is evenly distributed and then applied to the elastic contact portion. The elastic contact portion is under pressure and can be closely adhered to the laminated component. All parts have elasticity, which has good elasticity, and can be profiled on the contact surface of the piece to be bonded, even if the contact surface of the piece to be bonded and the elastic contact portion is not flat, Good contact is possible everywhere, and the elastic contact portion reuses the intermolecular force to adsorb the parts to be bonded, thereby improving the adsorption effect on the parts with uneven surfaces. It is beneficial to solve the problem of poor adsorption in the conventional technology when the surface of the component to be laminated is uneven.

100‧‧‧ Adsorption device

110‧‧‧force structure

111‧‧‧force application unit

120‧‧‧ Adsorption structure

121‧‧‧contact layer

1210‧‧‧ substrate

1211‧‧‧Elastic contact

122‧‧‧ buffer layer

1221‧‧‧ the first end

1222‧‧‧Second End

1223‧‧‧ Cavity

130‧‧‧Connecting plate

200‧‧‧The first piece to be laminated

300‧‧‧ The second piece to be laminated

400‧‧‧ Laminating System

410‧‧‧on the platform

411‧‧‧Displacement controller

4111‧‧‧ substrate

4112‧‧‧ cantilever

420‧‧‧ under platform

FIG. 1 is a schematic structural diagram of an adsorption device provided by an embodiment of the present invention.

FIG. 2 is a schematic structural diagram of the adsorption structure in FIG. 1.

3 is a schematic cross-sectional structure diagram of the adsorption structure shown in FIG. 2 and the connecting plate in FIG. 1.

FIG. 4 is a schematic diagram showing the relationship between the Young's modulus of the PDMS and its thickness according to an embodiment of the present invention.

FIG. 5 is a schematic flowchart of a method for manufacturing an elastic contact portion according to an embodiment of the present invention.

6A to 6E are schematic diagrams of the working process of the adsorption device provided in this embodiment.

FIG. 7 is a schematic block diagram of a bonding system according to an embodiment of the present invention.

FIG. 8 is a schematic structural diagram of the displacement controller and the adsorption device in FIG. 7.

Example one

FIG. 1 is a schematic structural diagram of an adsorption device 100 according to an embodiment. The adsorption device 100 includes a force applying structure 110 and an adsorption structure 120. The force applying structure 110 is used to provide a required pressure for the adsorption structure 120 when adsorbing the component to be bonded. The force applying structure 110 includes a plurality of force applying units 111 arranged in an array, and each force applying unit 111 can independently provide pressure. In one embodiment, the force applying unit 111 May be a pneumatic or hydraulic column. When the force applying unit 111 is working, one or more of the force applying units 111 must be selected to provide pressure to the adsorption structure 120. The adsorption structure 120 includes a contact layer 121 and a buffer layer 122 connected to the contact layer 121. The buffer layer 122 is disposed between the force applying structure 110 and the contact layer 121.

As shown in FIG. 2, the contact layer 121 includes a substrate 1210 and a plurality of spaced-apart elastic contact portions 1211 protruding from one surface of the substrate 1210. In this embodiment, the elastic contact portion 1211 is cylindrical. In other embodiments, The elastic contact portion 1211 may have other shapes. In an embodiment, the diameter of the cylindrical elastic contact portion 1211 is between 30 μm and 100 μm, and the ratio of the diameter to the height is between 1-4. The diameter of each elastic contact portion 1211 is the same, and each of the elastic contact portions 1211 is the same. The heights are also set to be equal. Under the above dimensions, the elastic contact portion 1211 may use an intermolecular force to generate an adhesive force with a piece to be bonded (not shown) to adsorb it.

Please refer to FIG. 2 and FIG. 3 together. The buffer layer 122 includes a first end 1221 near the force applying structure 110, a second end 1222 opposite to the first end 1221, and a plurality of cavities penetrating the first end 1221 and the second end 1222.体 1223. The base 1210 of the contact layer 121 is connected to the second end 1222 and closes the opening of the plurality of cavities 1223. The elastic contact portion 1211 is formed on a surface of the base 1210 away from the second end 1222. The cavity 1223 is used to provide pressure to the force applying structure 110 and apply the pressure to the elastic contact portion 1211 in a balanced manner.

In this embodiment, the cavity 1223 is a hollow regular hexagonal prism. In an embodiment, the side length and height of the regular hexagonal prism are set to be equal, for example, the side length and height are both 500 μm.

The buffer layer 122 has a plurality of cavities 1223, so that during the use of the adsorption device 100, even if one of the cavities 1223 is damaged, other unbroken cavities 1223 will work normally, which will not cause the entirety of the buffer layer 122. The damage improves the overall stability of the adsorption device 100.

The adsorption device 100 may further include a connection plate 130 that is connected to the first end 1221 of the buffer layer 122 and closes the opening of the cavity 1223 at the first end 1221. The buffer layer 122 is connected to the force applying structure 110 through the connection plate 130.

Referring to FIG. 1 to FIG. 3, each of the force applying units 111 may correspondingly provide pressure to one or a plurality of specific cavities 1223. During operation, one or several of the force applying units 111 may be selectively turned on, and the remaining force applying units 111 may be turned off to apply pressure to all or part of the cavity 1223 of the buffer layer 122.

In an embodiment, when the area of the contact piece to be bonded with the adsorption device 100 is smaller than the area that can be adsorbed by the elastic contact portion 1211, it is only necessary to apply to the cavity 1223 corresponding to the elastic contact portion 1211 in contact with the piece to be bonded. Pressure, the rest need not apply pressure.

In one embodiment, the pressure applied by the contact surfaces of the component to be laminated and the elastic contact portion 1211 may also be different. For example, when the contact surface is an uneven surface, a relatively large pressure is required; when the contact surface is a flat surface, a relatively small pressure is required.

In an embodiment, the contact layer 121 and the buffer layer 122 are both polydimethylsiloxane (PDMS). The elastic contact portion 1211 of the material has a Young's modulus generally between 1 and 10 MPa, which is lower than that of the conventional method. The relationship between the modulus of rubber and the Young's modulus is shown in Fig. 4, where the abscissa represents the thickness of the PDMS, and the ordinate represents the Young's modulus. When the contact surface between the piece to be laminated and the elastic contact portion 1211 is uneven, the elastic contact portion 1211 has a relatively high elasticity because the Young's modulus is generally between 1 and 10 MPa, which is lower than that of traditional rubber. The shape of the uneven contact surface of the composite part is profiled, and the pressure provided by the force applying structure 110 can be in good close contact with the contact surface of the component to be bonded. The elastic contact portion 1211 uses the intermolecular force to The composite pieces are adsorbed.

In this embodiment, the connecting plate 130 is also PDMS, and the thickness is greater than 500 μm. When the force applying structure 110 applies pressure to the buffer layer 122, the buffer layer 122 is an elastic material, and the connecting plate 130 will also be deformed.

In one embodiment, the contact layer 121 is prepared by a soft-molding method using PDMS. Referring to FIG. 5, the process of making the contact layer 121 by the soft-molding method is as follows: Step S1, mixing polydimethylsiloxane and resin at a mass ratio of 10: 1 to form a mixed solution; Step S2 Vacuum defoaming the mixed solution; step S3, uniformly coat the mold-friendly coating on the silicone mold and wait for drying; step S4, apply the mixed liquid in the silicone mold; step S5, heat-coat at 70 ° C The silicone mold covered with the mixed solution is annealed for 1.5 hours, and then the mixed solution in the silicone mold is cured to obtain a contact layer. In step S6, the silicone mold is separated from the contact layer by using a mold release knife.

The cavity of the above-mentioned silicon mold has a structure corresponding to the contact layer 121. The contact layer 121 formed above includes a base 1210 and a plurality of elastic contact portions 1211 arranged at intervals from a surface of the base 1210. In one embodiment, before step S6, a scratch-resistant or anti-dirty coating can be applied to improve the manufacturing quality of the contact layer 121.

The manufacturing method of the buffer layer 122 is the same as that of the contact layer 121. In one embodiment, the height of the buffer layer 122 can be set to 500 μm. After the buffer layer 122 and the contact layer 121 are respectively formed, the contact layer 121 and the buffer layer 122 are bonded using a heat-curable adhesive or an ultraviolet-curable adhesive, and subjected to heat or ultraviolet treatment.

In this embodiment, the base 1210 and the elastic contact portion 1211 are formed together, and then one surface of the base 1210 on which the elastic contact portion 1211 is not formed is bonded to the second end 1222 of the buffer layer 122, and then the connecting plate 130 and the buffer layer 122 are bonded to Under air bonding, the buffer layer 122 forms an air-tight structure.

In an embodiment, the connecting plate 130 and the buffer layer 122 can also be formed together, and then one surface of the base 1210 on which the elastic contact portion 1211 is not formed is bonded to the second end 1222 of the buffer layer 122.

In one embodiment, the contact layer 121 and the buffer layer 122 can also be separately molded and then bonded by 3D printing.

In an embodiment, the substrate 1210 and the second end 1222 of the buffer layer 122 are bonded by adhesive, and the connection plate 130 and the first end 1221 of the buffer layer 122 may also be bonded by adhesive, for example, , Adhesive can be PU or SU8 glue.

In this embodiment, the adsorption device 100, the buffer layer 122, and all the elastic contact portions 1211 are made of a highly elastic material (for example, PDMS, the Young's modulus is generally between 1 and 10 MPa, which is lower than that of traditional rubber). When pressure is applied by the force applying structure 110, the buffer layer 122 plays a buffering role, distributes the pressure in a balanced manner, and then applies it to the elastic contact portion 1211. The elastic contact portion 1211 is under pressure and can be closely adhered to the laminated component. 122 and all the elastic contact portions 1211 have elasticity, which has good elasticity, and can be contoured to the contact surface of the laminated component. The surface contacted by the elastic contact portion 1211 can be in good contact everywhere, and the elastic contact portion 1211 reuses the intermolecular force to adsorb the components to be bonded, thereby improving the adsorption effect on the components with uneven surfaces.

As shown in FIGS. 6A to 6E, it is a schematic diagram of the working process of the adsorption device 100. As shown in FIG. 6A, the adsorption device 100 is moved to the position where the first to-be-attached piece 200 is driven by the motor.

As shown in FIG. 6B, the adsorption device 100 is in contact with the first piece to be bonded 200.

As shown in FIG. 6C, the bonding and adsorption device 100 adsorbs the first to-be-bonded piece 200 and drives the first to-be-bonded piece 200 to the position where the second to-be-bonded piece 300 is driven by the motor.

As shown in FIG. 6D, the adsorption device 100 places the first to-be-attached piece 200 on the second to-be-attached piece 300, so that the first to-be-attached piece 200 and the second to-be-attached piece 300 are attached together.

As shown in FIG. 6E, the bonding of the first to-be-bonded piece 200 and the second to-be-bonded piece 300 is completed, and the bonding adsorption device 100 is detached from the first to-be-bonded piece 200.

Referring to FIG. 7, this embodiment also provides a bonding system 400. The bonding system 400 further includes an upper platform 410 and a lower platform 420. The upper platform 410 includes the adsorption device 100 described above, and the adsorption device 100 is used for fixing (adsorption). ) The first to-be-attached piece 200, and the lower platform 420 is used to fix the second to-be-attached piece 300. The upper platform 410 further includes a displacement controller 411 for driving the force applying structure 110, the buffer layer 122, and the plurality of elastic contact portions 1211 to be displaced in a three-dimensional direction.

Please refer to FIG. 8. FIG. 8 is a structural diagram of the displacement controller 411 and the adsorption device 100 in FIG. 7. The displacement controller 411 includes a substrate 4111 and a cantilever 4112 for driving the force applying structure 110, the buffer layer 122 and a plurality of elastic contact portions. 1211 is displaced in three dimensions. The substrate 4111 is connected to the force applying structure 110, and the cantilever 4112 is connected to the substrate 4111. In one embodiment, the displacement controller 411 is driven by a motor. The bonding system 400 can bond the first to-be-bonded piece 200 and the second to-be-bonded piece 300 through the upper platform 410 and the lower platform 420. The bonding system 400 provided in this embodiment can achieve all the beneficial effects of the adsorption device 100 as described above.

Those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention, as long as they are within the scope of the essential spirit of the present invention, the above embodiments are appropriately made. Changes and variations are all within the scope of the present invention.

Claims (8)

An improvement of an adsorption device includes: a force applying structure for providing pressure; and an adsorption structure connected to the force applying structure, comprising a contact layer, the contact layer including a substrate and a surface of the substrate The plurality of protruding elastic contact portions are arranged at intervals; wherein, the elastic contact portions are used to absorb pressure to be bonded with the pressure provided by the force applying structure; the Young's modulus of the elastic contact portions is between Between 1 and 10 MPa, when the elastic contact part is under pressure, the piece to be laminated is closely adhered to adsorb the piece to be laminated; the adsorption structure further includes a buffer layer provided on the force applying structure. A plurality of cavities are formed between the elastic contact portion and each of the cavities; each of the cavities has a first end, a second end opposite to the first end, and the base is connected to a second end of the buffer layer. And the opening of the plurality of cavities is closed at the end, and the elastic contact portion is formed on one surface of the base far from the second end. The adsorption device according to claim 1, wherein each of the elastic contact portions is a cylinder. The adsorption device according to claim 1, wherein the plurality of cavities of the buffer layer are formed by a plurality of hollow regular hexagonal prisms adjacent to each other, and each regular hexagonal prism forms one of the cavity. The adsorption device according to claim 1, further comprising a connecting plate connected to the first end of the buffer layer and closing an opening of the cavity at the first end. The adsorption device according to claim 1, wherein the force applying structure includes a plurality of force applying units, and each of the force applying units is configured to apply pressure to one or a plurality of the cavities. The adsorption device according to claim 1, wherein the contact layer is produced by mixing polydimethylsiloxane and resin at a mass ratio of 10: 1 to form a mixed liquid; performing the mixed liquid Vacuum defoaming; uniformly apply a coating that is favorable for release to a silicone mold and wait for drying; apply the mixed solution to the silicone mold; and heat the silicone mold coated with the mixed solution at 70 ° C After 1.5 hours of annealing, the mixed solution in the silicone mold was cured to obtain the contact layer; and the silicone mold was separated from the contact layer by using a demolding knife. The adsorption device according to claim 6, before the step of separating the silicone mold from the contact layer using a demolding knife, further comprising: applying a scratch-resistant or anti-dirty coating on the contact layer. An improvement of a bonding system includes: an upper platform for fixing a first piece to be bonded, the upper platform including the adsorption device according to any one of claims 1-7; and a lower platform for fixing The second piece to be laminated; and the upper platform further comprises a displacement controller, the displacement controller is connected to the force applying structure for driving the force applying structure and the adsorption structure to generate displacement in a three-dimensional direction.