TWI675862B - Full aromatic liquid crystal polyester resin - Google Patents
Full aromatic liquid crystal polyester resin Download PDFInfo
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- TWI675862B TWI675862B TW104126079A TW104126079A TWI675862B TW I675862 B TWI675862 B TW I675862B TW 104126079 A TW104126079 A TW 104126079A TW 104126079 A TW104126079 A TW 104126079A TW I675862 B TWI675862 B TW I675862B
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- 0 CC1C*CC1 Chemical compound CC1C*CC1 0.000 description 3
- WOZVHXUHUFLZGK-UHFFFAOYSA-N COC(c(cc1)ccc1C(OC)=O)=O Chemical compound COC(c(cc1)ccc1C(OC)=O)=O WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N OC(c1cc(C(O)=O)ccc1)=O Chemical compound OC(c1cc(C(O)=O)ccc1)=O QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/78—Preparation processes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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Abstract
本發明提供一種高熔點且低相對介電係數之全芳族液晶聚酯樹脂,其係包含下式所示之芳族羥羧酸、芳族二醇及芳族二羧酸由來之構成單位,合計100莫耳%而成; 芳族羥羧酸由來之構成單位是由化學式(1)組成; [化1]芳族二醇由來之構成單位是由化學式(2)、化學式(3)及/或化學式(4)組成; [化2][化3][化4]芳族二羧酸由來之構成單位是由化學式(5)、或化學式(5)及化學式(6)組成; [化5][化6]且前述各構成單位之莫耳%(合計100莫耳%)關係如下:化學式(1)之構成單位之組成為預定的莫耳%範圍,化學式(2)、(3)、(4)之構成單位之組成總和為預定的莫耳%範圍,化學式(5)、(6)之構成單位之組成總和為預定的莫耳%範圍。The present invention provides a wholly aromatic liquid crystal polyester resin with a high melting point and a low relative dielectric constant, which is composed of an aromatic hydroxycarboxylic acid, an aromatic diol, and an aromatic dicarboxylic acid. It is made up of 100 mole% in total; the origin of the aromatic hydroxycarboxylic acid is composed of chemical formula (1); [化 1] The origin of the aromatic diol is composed of chemical formula (2), chemical formula (3) and / or chemical formula (4); [化 2] [Chemical 3] [Chemical 4] The constituent unit of aromatic dicarboxylic acid is composed of chemical formula (5), or chemical formula (5) and chemical formula (6); [化 5] [Chemical 6] And the Mohr% (total 100 Moll%) of each of the aforementioned constituent units is as follows: The composition of the constituent units of the chemical formula (1) is a predetermined range of the Moire%, and the composition of the chemical formulas (2), (3), (4) The sum of the composition of the units is a predetermined range of mole%, and the sum of the composition of the constituent units of the chemical formulas (5) and (6) is a predetermined range of mole%.
Description
本發明係關於一種具有低相對介電係數之全芳族液晶聚酯樹脂。 The present invention relates to a wholly aromatic liquid crystal polyester resin having a low relative dielectric constant.
包含全芳族液晶聚酯樹脂而成之樹脂組成物係焊錫耐熱性、高剛性等機械特性、薄肉成型性、低翹曲性等成型特性優良,被作為各種電子零件構造體之射出成型材料使用。近年來,資訊機器之小型化、高性能化、高功能化進展,個人電腦及其周邊機器、數位通訊機器等之訊號傳播速度持續高速化。 The resin composition containing a wholly aromatic liquid crystal polyester resin has excellent soldering heat resistance, high rigidity and other mechanical characteristics, thin meat moldability, and low warpage. It is used as an injection molding material for various electronic component structures. . In recent years, the miniaturization, high performance, and high function of information equipment have progressed, and the signal transmission speed of personal computers, peripheral equipment, and digital communication equipment has continued to increase at a high speed.
又,就達到驚人普及率的行動電話、輸入板型終端裝置而言,由於高功能化,預測所使用的頻率會逐漸轉為高頻域波帶。 In addition, for mobile phones and tablet-type terminal devices that have reached an alarmingly high penetration rate, it is predicted that the frequency used will gradually shift to the high-frequency band because of high functionality.
進而言之,近年來在汽車用途方面亦發展電子化,預測車用導航器、自動駕駛用感測器、防衝撞用雷達等會出現、高速傳輸化的需求。伴隨於此,對於作為該類資訊機器中之電子零件(例如高速傳輸用連接器或CPU插槽、印刷電路基板、絕緣膜等)構成材料使用的全芳族液晶聚酯樹脂組成物及薄膜,要求低相對介電係數。 In addition, in recent years, electronics have also been developed for automotive applications, and it is expected that high-speed transmission will occur in car navigation systems, sensors for autonomous driving, and radars for collision prevention. Along with this, for wholly aromatic liquid crystal polyester resin compositions and films used as constituent materials of electronic parts (such as connectors for high-speed transmission or CPU sockets, printed circuit boards, insulating films, etc.), Requires low relative permittivity.
對於這類課題的解決手段提案,大致區分為兩種領域,藉由與中空體的複合化(專利文獻1~3)、及氟系單體(專利文獻4)的使用來進行。 Proposals for solving such problems are roughly divided into two fields, and are carried out by compounding with hollow bodies (Patent Documents 1 to 3) and using fluorine-based monomers (Patent Document 4).
作為與該等提案完全不同的手法,本發明人藉由從全芳族液晶聚酯構成單體之芳族羥羧酸、芳族二醇及芳族二羧酸之中,於芳族二醇中使用4,4’- 二羥聯苯衍生物,終至完成本發明。 As a completely different approach from these proposals, the present inventors used aromatic aromatic carboxylic acids, aromatic diols, and aromatic dicarboxylic acids from the wholly aromatic liquid crystal polyester constituting monomers in aromatic diols. Used in 4,4'- The dihydroxybiphenyl derivative has finally completed the present invention.
習知4,4’-二羥聯苯衍生物可為全芳族液晶聚酯樹脂之構成單體,又,專利文獻5係就構成單位中包含乙二醇之液晶聚酯樹脂(非全芳族液晶聚酯),提案使用四甲基聯苯酚作為聯苯酚烷基衍生物之具體例。 The conventional 4,4'-dihydroxybiphenyl derivative may be a constituent monomer of a wholly aromatic liquid crystal polyester resin, and Patent Document 5 refers to a liquid crystal polyester resin (non-permanently aromatic) containing ethylene glycol in a constituent unit. Group liquid crystal polyester), a specific example of using tetramethylbiphenol as a biphenol alkyl derivative is proposed.
然而,該等事實或揭示並未意識到近年來資訊通訊機器構件之低相對介電係數要求的課題,完全未暗示藉由在全芳族液晶聚酯中使用4,4’-二羥聯苯衍生物所帶來的低相對介電係數的效果。 However, these facts or disclosures did not recognize the problem of the low relative permittivity requirements of information and communication machine components in recent years, and did not imply the use of 4,4'-dihydroxybiphenyl in wholly aromatic liquid crystal polyesters. Derivative effects of low relative permittivity.
[專利文獻1]日本特開2004-027021號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2004-027021
[專利文獻2]日本特開2004-143270號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2004-143270
[專利文獻3]日本特開2009-114418號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2009-114418
[專利文獻4]日本特開平7-010978號公報 [Patent Document 4] Japanese Patent Laid-Open No. 7-010978
[專利文獻5]日本特開2000-026743號公報 [Patent Document 5] Japanese Patent Laid-Open No. 2000-026743
本發明之目的在於提供一種可使用於資訊通訊機器之全芳族液晶聚酯樹脂,其藉由指定芳族二醇成分,使全芳族液晶聚酯樹脂之相對介電係數降低,可為高速傳輸用連接器或CPU插槽、印刷電路基板、防衝撞用雷達等之構成材料等。 The object of the present invention is to provide a wholly aromatic liquid crystal polyester resin which can be used in information communication equipment. By specifying an aromatic diol component, the relative dielectric constant of the wholly aromatic liquid crystal polyester resin can be reduced, and the speed can be high. Transmission materials, components such as CPU sockets, printed circuit boards, and anti-collision radars.
本發明人經銳意檢討的結果,發現針對構成全芳族液晶聚酯樹脂之單體而言,若於芳族二醇中,以特定態樣使用4,4’-二羥聯苯衍生物並予以聚縮合反應,可得到顯示低介電特性之全芳族液晶聚酯樹脂組成物及薄膜,終至完成本發明。 As a result of an intensive review by the present inventor, it was found that, for the monomers constituting the wholly aromatic liquid crystal polyester resin, if the 4,4'-dihydroxybiphenyl derivative is used in an aromatic diol in a specific state, A polycondensation reaction is performed to obtain a wholly aromatic liquid crystal polyester resin composition and a film exhibiting low dielectric properties, and the present invention is finally completed.
本發明之第一態樣是有關一種全芳族液晶聚酯樹脂,其包含以下化學式所示之芳族羥羧酸、芳族二醇及芳族二羧酸(包含衍生物)由來之各構成單位,合計100莫耳%而成;芳族羥羧酸由來之構成單位是由化學式(1)組成;
芳族二醇由來之構成單位是由化學式(2)、化學式(3)及/或化學式(4)組成;
[化3]
芳族二羧酸由來之構成單位是由化學式(5)、或化學式(5)及化學式(6)組成;
且該等重複單位之莫耳%關係(全部合計100莫耳%)如下:15莫耳%≦化學式(1)組成≦25莫耳%;15莫耳%≦[化學式(2)組成+化學式(3)組成+化學式(4)組成]≦45莫耳%;其中化學式(2)組成(莫耳%)≧[化學式(3)組成+化學式(4)組成](莫耳%);15莫耳%≦[化學式(5)組成+化學式(6)組成]≦45莫耳%;其中化學式(5)組成(莫耳%)≦化學式(6)組成(莫耳%)。 And the Mohr% relationship of these repeating units (all 100 Moll% in total) is as follows: 15 Molar% ≦ Chemical Formula (1) Composition ≦ 25 Molar%; 15 Molar% ≦ [Chemical Formula (2) Composition + Chemical Formula ( 3) Composition + composition of chemical formula (4)] ≦ 45 mole%; wherein the composition of chemical formula (2) (mol%) ≧ [chemical formula (3) composition + chemical formula (4) composition] (mol%); 15 mole % ≦ [composition of chemical formula (5) + composition of chemical formula (6)] ≦ 45 mole%; wherein the composition of chemical formula (5) (mol%) ≦ composition of chemical formula (6) (mol%).
本發明之第二態樣是有關本發明第一態樣之全芳族液晶聚酯樹 脂,前述全芳族液晶聚酯樹脂之熔點為310℃以上,且10GHz時之相對介電係數為3.3以下。 A second aspect of the present invention is a wholly aromatic liquid crystal polyester tree related to the first aspect of the present invention. The melting point of the aforementioned wholly aromatic liquid crystal polyester resin is 310 ° C. or higher, and the relative dielectric constant at 10 GHz is 3.3 or less.
本發明之第三態樣是有關本發明第一態樣之全芳族液晶聚酯樹脂,其中於化學式(2)所示之構成單位,R1之一者為甲基,其他三者之R1為氫原子,且R2之一者為甲基,其他三者之R2為氫原子。 The third aspect of the present invention relates to the wholly aromatic liquid crystal polyester resin according to the first aspect of the present invention, wherein one of R1 is a methyl group, and R1 of the other three is a constituent unit represented by the chemical formula (2). A hydrogen atom, and one of R2 is a methyl group, and R2 of the other three is a hydrogen atom.
本發明之第四態樣是有關一種全芳族液晶聚酯樹脂製造方法,其係將芳族羥羧酸、芳族二醇及芳族二羧酸合計100莫耳%予以聚縮合,而前述全芳族液晶聚酯樹脂之熔點為310℃以上,且10GHz時之相對介電係數為3.3以下;芳族羥羧酸是由化學式(7)組成;
芳族二醇是由化學式(8)、化學式(9)及/或化學式(10)組成;
[化10]
芳族二羧酸是由化學式(11)、或化學式(11)及化學式(12)組成;
且前述各單體由來之構成單位之莫耳%關係(全部合計100莫耳%)如下:15莫耳%≦化學式(7)由來之構成單位之組成≦25莫耳%;15莫耳%≦[化學式(8)由來之構成單位之組成+化學式(9)由來之構成單位之組成+化學式(10)由來之構成單位之組成]≦45莫耳%;其中化學式(8)由來之構成單位之組成(莫耳%)≧[化學式(9)由來之構成單位之組成+化學式(10)由來之構成單位之組成](莫耳%);15莫耳%≦[化學式(11)由來之構成單位之組成+化學式(12)由來之構成單位之組成]≦45莫耳%;其中化學式(11)由來之構成單位之組成(莫耳%)≧化學式(12)由來之構成單位之組成(莫耳%);且包含對於(7)、(8)、(9)、(10)中之所有羥基,使1.05~1.15莫耳當量之醋酸酐存在而於醋酸回流下進行熔融聚縮合的步驟。 And the Mohr% relationship of the constituent units derived from each of the foregoing monomers (total 100 Moire% in total) is as follows: 15 Moire% ≦ the composition of the constituent units derived from chemical formula (7) ≦ 25 Moore%; 15 Moire% ≦ [Composition of constituent units derived from chemical formula (8) + composition of constituent units derived from chemical formula (9) + composition of constituent units derived from chemical formula (10)] ≦ 45 mole%; of which the constituent units derived from chemical formula (8) Composition (Mole%) ≧ [Composition of constituent units derived from Chemical Formula (9) + Composition of constituent units derived from Chemical Formula (10)] (Mole%); 15 Mol% ≦ [Composition unit derived from Chemical Formula (11) Composition + composition of constituent units derived from chemical formula (12)] ≦ 45 mole%; of which composition of constituent units derived from chemical formula (11) (mol%) ≧ composition of constituent units derived from chemical formula (12) (mol %); And includes a step of melt polycondensation for all hydroxyl groups in (7), (8), (9), (10) by allowing 1.05 to 1.15 mol equivalent of acetic anhydride to be present under reflux of acetic acid.
本發明之第五態樣是有關本發明第四態樣之全芳族液晶聚酯樹脂製造方法,其中於化學式(8)所示之芳族二醇,R1之一者為甲基,其他三者之R1為氫原子,且R2之一者為甲基,其他三者之R2為氫原子。 A fifth aspect of the present invention relates to a method for manufacturing a fully aromatic liquid crystal polyester resin according to the fourth aspect of the present invention, wherein one of the aromatic diols represented by the chemical formula (8) is R1, and the other three Among them, R1 is a hydrogen atom, and one of R2 is a methyl group, and R2 of the other three is a hydrogen atom.
本發明之第六態樣是有關一種成型體,其係由本發明之第一~本發明之第三態樣中任一項所記載的全芳族液晶聚酯樹脂組成。 A sixth aspect of the present invention relates to a molded body composed of the wholly aromatic liquid crystal polyester resin described in any one of the first to third aspects of the present invention.
本發明之第七態樣是有關一種薄膜,其係由本發明之第一~本發明之第三態樣中任一項所記載的全芳族液晶聚酯樹脂組成。 A seventh aspect of the present invention relates to a film composed of the wholly aromatic liquid crystal polyester resin described in any one of the first to third aspects of the present invention.
本發明之第八態樣是有關一種電子零件,其係由本發明之第一~本發明之第三態樣中任一項所記載的全芳族液晶聚酯樹脂組成。 An eighth aspect of the present invention relates to an electronic component, which is composed of the wholly aromatic liquid crystal polyester resin described in any one of the first to third aspects of the present invention.
本發明之全芳族液晶聚酯樹脂是具有耐焊錫耐熱性(熔點超過310℃)及低相對介電係數特性之全芳族聚酯,與電子零件等之成型材料,尤其與各種填充材料複合化後,作為射出成型材料極為有用。 The wholly aromatic liquid crystal polyester resin of the present invention is a wholly aromatic polyester with solder heat resistance (melting point exceeding 310 ° C) and low relative permittivity. It is compounded with molding materials such as electronic parts, especially with various filling materials. After conversion, it is extremely useful as an injection molding material.
本發明之全芳族液晶聚酯可採用示差掃描熱量計(DSC)之熱解析來檢測其熔點,依據發明人的酌見,若以同法測定的熔點超過310℃,即具有充分的耐焊錫耐熱性。 The fully aromatic liquid crystal polyester of the present invention can be measured for its melting point by thermal analysis of a differential scanning calorimeter (DSC). According to the inventor's discretion, if the melting point measured by the same method exceeds 310 ° C, it has sufficient solder resistance. Heat resistance.
本發明之全芳族聚酯樹脂係將芳族羥羧酸、芳族二醇及芳族二羧酸(包含該等之衍生物。以下同。)合計100莫耳%予以聚縮合而成。 The wholly aromatic polyester resin of the present invention is obtained by polycondensing a total of 100 mol% of an aromatic hydroxycarboxylic acid, an aromatic diol, and an aromatic dicarboxylic acid (including derivatives thereof. The same applies hereinafter).
本發明之全芳族聚酯樹脂中由來自芳族羥羧酸之構成單位為化 學式(1),此可藉由使用例如對羥苯甲酸(化學式(7))來獲得。 The wholly aromatic polyester resin of the present invention is composed of a constituent unit derived from an aromatic hydroxycarboxylic acid. The formula (1) can be obtained by using, for example, p-hydroxybenzoic acid (chemical formula (7)).
於本發明之全芳族聚酯中,該構成單位(化學式(1))設為15莫耳%~65莫耳%(包含臨限值,以下同)。宜為20莫耳%~65莫耳%,進而宜為25莫耳%~60莫耳%。未符合該範圍時,耐熱性有時不足,超過範圍時,需要高成型溫度,在射出成型機內有時引起熱分解,因此射出成型安定性不佳。 In the wholly aromatic polyester of the present invention, the constituent unit (chemical formula (1)) is set to 15 mol% to 65 mol% (including a threshold value, the same applies hereinafter). It is preferably 20 mol% to 65 mol%, and further preferably 25 mol% to 60 mol%. If it is out of this range, heat resistance may be insufficient, and if it exceeds the range, a high molding temperature is required, and thermal decomposition may occur in the injection molding machine, so injection molding stability is not good.
本發明之全芳族聚酯樹脂中由來自芳族二醇之構成單位有3種,以化學式(2)、化學式(3)、化學式(4)表示。該等分別可藉由使用例如4,4’-二羥聯苯衍生物(化學式(8))、4,4’-二羥聯苯衍生物(化學式(9))、對苯二酚(化學式(10))而獲得。 In the wholly aromatic polyester resin of the present invention, there are three types of constituent units derived from aromatic diols, which are represented by chemical formula (2), chemical formula (3), and chemical formula (4). These can be obtained by using, for example, 4,4'-dihydroxybiphenyl derivative (chemical formula (8)), 4,4'-dihydroxybiphenyl derivative (chemical formula (9)), hydroquinone (chemical formula (10)).
本發明之全芳族聚酯中,該等化學式(2)、(3)、(4)所示之構成單位設為合計15莫耳%~45莫耳%,更宜為20莫耳%~40莫耳%。未符合該範圍時,介電係數未充分降低,超過前述範圍時,耐焊錫耐熱性有時不足。 In the wholly aromatic polyester of the present invention, the constituent units shown by the chemical formulas (2), (3), and (4) are set to a total of 15 mol% to 45 mol%, and more preferably 20 mol% to 40 mol%. When it is out of this range, the dielectric constant is not sufficiently reduced, and when it exceeds the above range, solder heat resistance may be insufficient.
又,無論在任何情況下,本發明之全芳族聚酯樹脂中,將化學式(2)所示之構成單位的莫耳數,設為化學式(3)及化學式(4)所示之構成單位各自的莫耳數總和以上。未符合臨限值時,低相對介電係數之標準值,即10GHz時之相 對介電係數有時無法低於3.3。 In any case, in the wholly aromatic polyester resin of the present invention, the molar number of the structural unit represented by the chemical formula (2) is the structural unit represented by the chemical formula (3) and the chemical formula (4). The sum of the respective mole numbers is more than. When the threshold is not met, the standard value of the low relative permittivity, that is, the phase at 10GHz The dielectric constant cannot sometimes be lower than 3.3.
本發明之全芳族聚酯中由來自芳族羧酸之構成單位為化學式(5)、化學式(6),此可藉由使用例如對苯二甲酸(化學式(11))、間苯二甲酸(化學式(12))而獲得。 In the wholly aromatic polyester of the present invention, the constituent units derived from an aromatic carboxylic acid are chemical formula (5) and chemical formula (6). This can be achieved by using, for example, terephthalic acid (chemical formula (11)), isophthalic acid (Chemical Formula (12)).
本發明之全芳族聚酯樹脂中,化學式(5)所示之構成單位設為15莫耳%~45莫耳%。小於15莫耳%時,射出成型時之成型性不良,超過45莫耳%時,耐焊錫耐熱性有時會降低。又,化學式(5)之構成單位之組成≧化學式(6)之構成單位之組成](莫耳%)。超過該臨限值時,耐焊錫耐熱性有時會降低。 In the wholly aromatic polyester resin of the present invention, the constituent unit represented by the chemical formula (5) is set to 15 mol% to 45 mol%. When it is less than 15 mol%, moldability at the time of injection molding is poor, and when it exceeds 45 mol%, solder heat resistance may be reduced. In addition, the composition of the constituent unit of the chemical formula (5) ≧ the composition of the constituent unit of the chemical formula (6)] (mole%). When the threshold value is exceeded, solder heat resistance may decrease.
又,本發明之全芳族聚酯樹脂之特徵在於,熔點為310℃以上, 且10GHz時之相對介電係數為3.3以下。 The wholly aromatic polyester resin of the present invention has a melting point of 310 ° C or higher. The relative dielectric constant at 10 GHz is 3.3 or less.
熔點值例如藉由SEICO電子工業股份有限公司製之示差掃描熱量計(DSC),作為基準利用α-氧化鋁來測定。此時,以升溫速度20℃/分,從室溫升溫到390℃,使聚合物完全熔解後,以降溫速度10℃/分,降溫到50℃,進一步以20℃/分之升溫速度,升溫到420℃時所得之吸熱峰值之最高點,可測定作為熔點。 The melting point value is measured using, for example, a differential scanning calorimeter (DSC) manufactured by SEICO Electronics Co., Ltd. and using α-alumina as a reference. At this time, the temperature was raised from 20 ° C / min to room temperature to 390 ° C to completely melt the polymer, and then the temperature was lowered to 10 ° C / min and 50 ° C, and the temperature was further increased at a temperature of 20 ° C / min. The highest point of the endothermic peak obtained at 420 ° C can be determined as the melting point.
又,相對介電係數值例如可將本發明之液晶聚酯樹脂,採用壓縮沖壓成型法(成型溫度熔點+20℃)予以薄膜化(50mm×50mm×1mm),於Agilent Technologies製之網路分析儀(8510C),使用QWED製之治具,採SPDR法(23℃,10GHz)來測定。 In addition, the relative dielectric constant value can be, for example, the liquid crystal polyester resin of the present invention thin-filmed (50 mm × 50 mm × 1 mm) by a compression stamping method (molding temperature + 20 ° C.) and analyzed by a network manufactured by Agilent Technologies. (8510C), using a fixture made of QWED, and measured by SPDR method (23 ° C, 10GHz).
以上已敘述有關各個構成單位,俯瞰分子構造時,本發明之全芳族聚酯樹脂係對芳族羥羧酸、及芳族二羧酸兩者由來之構成單位中,嵌入至少具有一個芳環族以產生主鏈剛性強的構造,僅於芳族二醇由來之構成單位,配置可自由旋轉之碳-碳結合,及碳數2以下之具有取代基之芳環。 As mentioned above, regarding each constituent unit, when overlooking the molecular structure, the wholly aromatic polyester resin of the present invention is a unit derived from both a p-aromatic hydroxycarboxylic acid and an aromatic dicarboxylic acid, and has at least one aromatic ring embedded therein. The family has a structure with strong main chain rigidity. Only in the constituent units derived from aromatic diols, it is arranged a carbon-carbon bond that can rotate freely, and an aromatic ring with a substituent having a carbon number of 2 or less.
本發明者等人認為藉由該等差異化,可有效率且達到平衡地發揮如下兩種效果:起因於芳族羥羧酸及芳族二羧酸由來部分(moiety)而形成結晶或液晶元,從而帶來成型體之耐熱性及熔融體之高流動性;及起因於芳族二醇取代基之膨鬆性(亦可稱為自由體積的增加或緊束性的緩和)之介電係數下降。本發明之全芳族聚酯樹脂之密度不會超過1.36。 The present inventors and others believe that by these differences, the following two effects can be efficiently and balancedly achieved: crystals or mesogens are formed due to aromatic hydroxycarboxylic acids and aromatic dicarboxylic acid moieties. , Which brings the heat resistance of the molded body and the high fluidity of the melt; and the dielectric constant of the bulkiness (also called the increase in free volume or the relaxation of tightness) due to the aromatic diol substituents decline. The density of the wholly aromatic polyester resin of the present invention will not exceed 1.36.
關於主導上述效果顯現之芳族二醇(化學式(8)),除了其構成單位莫耳%以外,取代基亦有較佳範圍。從膨鬆性(自由體積的增加)的觀點來看,取代基之碳數越多越好,但宜在製造全芳族液晶聚酯之聚縮合反應中不構成立體障礙的範圍。從該觀點來看,取代基之碳數為2以下,碳數1之甲基更適宜,取 代基之數目亦宜為2以下。亦即,最宜為4,4’-二羥聯苯衍生物之二甲基衍生物。可舉出例如3,3’-二甲基-4,4’-二羥聯苯。 Regarding the aromatic diol (chemical formula (8)) which dominates the above-mentioned effect, in addition to the molar unit of the constituent unit, the substituent has a preferable range. From the viewpoint of bulkiness (increase in free volume), the larger the number of carbon atoms of the substituent is, the better, but it is preferable that the polycondensation reaction of the wholly aromatic liquid crystal polyester does not constitute a steric hindrance. From this point of view, the carbon number of the substituent is 2 or less, and the methyl group with 1 carbon number is more suitable. The number of generation bases should also be 2 or less. That is, it is most preferably a dimethyl derivative of a 4,4'-dihydroxybiphenyl derivative. Examples thereof include 3,3'-dimethyl-4,4'-dihydroxybiphenyl.
本發明之全芳族液晶聚酯樹脂製造方法,可採用習知之液晶聚酯樹脂之製造方法,可利用僅藉由熔融聚合之製造方法,或藉由熔融聚合與固相聚合之二階段聚合之製造方法。 The manufacturing method of the wholly aromatic liquid crystal polyester resin according to the present invention may be a conventional method for manufacturing a liquid crystal polyester resin, and a manufacturing method using only melt polymerization or a two-stage polymerization using melt polymerization and solid phase polymerization may be used. Production method.
該等方法中,從可效率良好地得到本發明之全芳族聚酯化合物的觀點來看,宜以預定的調配,使化學式(7)~化學式(12)之各構成單位合計100莫耳%,對於該等化合物中化學式(7)~化學式(10)之所有羥基,存在1.05~1.15莫耳當量之醋酸酐而於醋酸回流下進行熔融聚縮合。 Among these methods, from the viewpoint that the wholly aromatic polyester compound of the present invention can be efficiently obtained, it is preferable to make a predetermined blend so that the constituent units of the chemical formula (7) to the chemical formula (12) total 100 mol%. For all the hydroxyl groups of the chemical formula (7) to the chemical formula (10) in these compounds, there is 1.05 to 1.15 mol equivalent of acetic anhydride and the melt polycondensation is performed under reflux of acetic acid.
再者,若添加之醋酸酐之莫耳當量大幅超過上述範圍時,反應有時不容易進行,亦或耐熱性有時會降低。 In addition, if the molar equivalent of the acetic anhydride to be added greatly exceeds the above range, the reaction may not easily proceed or the heat resistance may be reduced.
針對藉由熔融聚合所得到的聚合物,進一步進行固相聚合時,將藉由熔融聚合所得到的預聚合物,於冷卻固化後予以粉碎,製成粉狀或片狀後,宜選擇習知之固相聚合方法,例如於氮等惰性氣氛下,以200~350℃的溫度範圍,將預聚合物樹脂予以熱處理1~30小時等方法。固相聚合可一面攪拌一面進行,或不攪拌,於靜置的狀態下進行亦可。 For the polymer obtained by melt polymerization, when further solid-phase polymerization is performed, the prepolymer obtained by melt polymerization is pulverized after cooling and solidification to form a powder or a sheet. The solid-phase polymerization method is, for example, a method in which a prepolymer resin is heat-treated in an inert atmosphere such as nitrogen at a temperature range of 200 to 350 ° C for 1 to 30 hours. The solid-phase polymerization may be carried out while stirring or without stirring, and may be carried out in a static state.
於聚合反應,使用或不使用觸媒均可。作為所使用的觸媒,可使用以往習知作為聚酯之聚縮合用觸媒,可舉出醋酸鎂、醋酸第一錫、鈦酸四丁酯、醋酸鉛、醋酸鈉、醋酸鉀、三氧化二銻等金屬鹽觸媒、N-甲咪唑等含氮雜環化合物等、有機化合物觸媒等。 For polymerization, catalysts can be used with or without catalyst. As the catalyst used, conventionally known polycondensation catalysts for polyesters can be used, and examples include magnesium acetate, first tin acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, and dioxide. Metal salt catalysts such as antimony, nitrogen-containing heterocyclic compounds such as N-methylimidazole, etc., organic compound catalysts, etc.
熔融聚合之聚合反應裝置並未特別限定,宜使用一般高黏度流體反應所用的反應裝置。該等反應裝置之例子可舉出例如攪拌型聚合反應裝置、 或捏合機、輥磨機、班布瑞密閉式混合機等一般使用於樹脂混練之混合裝置等,而前述攪拌型聚合反應裝置是具有錨型、多段型、螺旋帶型、螺旋軸型等,或將該等予以變形之各種形狀的攪拌翼之攪拌裝置。 The polymerization reaction apparatus for the melt polymerization is not particularly limited, and a reaction apparatus used for general high-viscosity fluid reaction is preferably used. Examples of such a reaction device include a stirring type polymerization reaction device, Or kneader, roller mill, Banbury closed mixer, etc. are generally used for resin kneading mixing equipment, etc., and the aforementioned stirring type polymerization reaction device has anchor type, multi-stage type, spiral belt type, spiral shaft type, etc. Or a stirring device of various shapes of the stirring blades which are deformed.
將本發明之全芳族聚酯樹脂作為射出成型用材料使用時,按照常例,熔融混練10~40重量部之研磨玻璃纖維、滑石、雲母、玻璃片、黏土、絹雲母、碳酸鈣、矽酸鈣、二氧化矽、氧化鋁、氫氧化鋁、氫氧化鈣、石墨、非晶碳、鈦酸鉀、碳纖維、各種晶鬚等填充材料,製成樹脂組成物之後使用亦可。除了前述以外,亦可添加其他填充材料、著色劑、分散劑、可塑劑、抗氧化劑、阻燃劑等。 When the wholly aromatic polyester resin of the present invention is used as a material for injection molding, 10 to 40 parts by weight of ground glass fiber, talc, mica, glass flakes, clay, sericite, calcium carbonate, and silicic acid are melt-kneaded in accordance with ordinary examples. Fillers such as calcium, silicon dioxide, aluminum oxide, aluminum hydroxide, calcium hydroxide, graphite, amorphous carbon, potassium titanate, carbon fiber, and various whiskers can also be used as a resin composition. In addition to the foregoing, other fillers, colorants, dispersants, plasticizers, antioxidants, flame retardants, and the like may be added.
又,亦可採習知方法,將本發明之全芳族聚酯樹脂予以薄膜化。薄膜化方法可採吹膨成型、熔融押出成型、溶液澆鑄成型等任一方法,直接使用樹脂,或添加上述添加劑等亦可。然後,成型之薄膜為單層薄膜或與異種材料組成之多層薄膜均可。 In addition, the wholly aromatic polyester resin of the present invention may be formed into a film by a conventional method. The film formation method may be any method such as blow molding, melt extrusion molding, and solution casting molding. The resin may be directly used, or the above additives may be added. Then, the formed film may be a single-layer film or a multilayer film composed of different materials.
再者,以改良尺寸安定性、機械特性為目的,將熔融押出成型、溶液澆鑄成型之薄膜以單軸或雙軸予以延伸處理亦可。又,以去除該等薄膜之各向異性為目的進行熱處理亦可。 Furthermore, for the purpose of improving dimensional stability and mechanical properties, the uniaxially or biaxially-stretched film may be processed by melt extrusion molding and solution casting molding. Moreover, you may heat-process for the purpose of removing the anisotropy of these films.
又,於本發明,在不損及本發明效果的範圍,可使用所謂芳族多官能性單體,其使用於液晶聚酯的合成。尤其將對羥苯甲酸的一部分取代為6-羥基-2-萘甲酸,具有可降低成型加工溫度的效果。 In addition, in the present invention, a so-called aromatic polyfunctional monomer can be used in a range that does not impair the effects of the present invention, and is used for the synthesis of a liquid crystal polyester. In particular, substituting a part of p-hydroxybenzoic acid with 6-hydroxy-2-naphthoic acid has the effect of reducing the molding processing temperature.
又,於本發明,亦可在不損及本發明效果的範圍,與其他樹脂混合。其他樹脂可舉出聚對苯二甲酸乙二酯、聚奈二甲酸二乙酯、聚碳酸酯、聚芳酯、聚醯胺、聚醯亞胺、聚醚碸、聚醚醚酮、聚苯硫醚、聚四氟乙烯等。 In addition, in the present invention, it may be mixed with other resins within a range that does not impair the effects of the present invention. Other resins include polyethylene terephthalate, polyethylene terephthalate, polycarbonate, polyarylate, polyamide, polyimide, polyether, polyetheretherketone, and polybenzene. Sulfide, polytetrafluoroethylene, etc.
本發明之液晶聚酯可於電氣‧電子產業、通訊機器產業等領域,作為低介電材料、絕緣材料來使用。可舉出例如高速傳輸用連接器或CPU插槽、電路基板、可撓性電路基板、積層用電路基板、防衝撞用雷達、RFID標籤、電容器、反向器零件、絕緣薄膜、鋰離子電池等二次電池之絕緣材料、揚聲器振動板等。 The liquid crystal polyester of the present invention can be used as a low-dielectric material and an insulating material in the fields of electric and electronic industries, communication equipment industries, and the like. Examples include high-speed transmission connectors or CPU sockets, circuit boards, flexible circuit boards, laminated circuit boards, anti-collision radars, RFID tags, capacitors, inverter parts, insulating films, and lithium-ion batteries. Insulating materials for secondary batteries, speaker diaphragms, etc.
以下藉由實施例,進一步具體說明本發明,但本發明不限定於以下實施例。 Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited to the following examples.
<全芳族液晶聚酯樹脂之製造> <Manufacture of wholly aromatic liquid crystal polyester resin>
(實施例1:全芳族液晶聚酯樹脂(A)) (Example 1: Fully aromatic liquid crystal polyester resin (A))
於具有攪拌翼之200ml三頸燒瓶,放入對羥苯甲酸(化學式(7))0.24莫耳(40莫耳%)、3,3’-二甲基-4,4’-二羥聯苯(化學式(8))0.12莫耳(20莫耳%)、對苯二酚(化學式(10))0.06莫耳(10莫耳%)、對苯二甲酸(化學式(11))0.18莫耳(30莫耳%)、作為觸媒之醋酸鉀0.15g及醋酸鎂0.015g,進行3次燒瓶之減壓一氮注入以進行氮置換後,進一步添加醋酸酐66.15g(相對於羥基為1.08莫耳當量),將攪拌翼之旋轉速度設為200rpm,升溫到160℃,於回流狀態下進行2小時乙醯化反應。 In a 200 ml three-necked flask with a stirring wing, p-hydroxybenzoic acid (chemical formula (7)) 0.24 mol (40 mol%), 3,3'-dimethyl-4,4'-dihydroxybiphenyl (Chemical formula (8)) 0.12 mol (20 mol%), hydroquinone (chemical formula (10)) 0.06 mol (10 mol%), terephthalic acid (chemical formula (11)) 0.18 mol ( 30 mol%), 0.15 g of potassium acetate and 0.015 g of magnesium acetate as catalysts, and after depressurizing and nitrogen injecting the flask three times to perform nitrogen substitution, 66.15 g of acetic anhydride was further added (1.08 mol relative to the hydroxyl group). Equivalent), the rotation speed of the stirring blade was set to 200 rpm, the temperature was raised to 160 ° C., and the acetylation reaction was performed under reflux for 2 hours.
乙醯化結束後,以0.5℃/分升溫醋酸餾出狀態之燒瓶,於槽內之熔融體溫度成為307℃時,抽出聚合物予以冷卻固化。將所得到的聚合物粉碎成通過孔隙1.0mm之篩具的大小,得到預聚合物。 After the completion of the acetylation, the flask in the acetic acid distillation state was heated at 0.5 ° C / min. When the melt temperature in the tank became 307 ° C, the polymer was drawn out and cooled and solidified. The obtained polymer was pulverized to a size passing through a sieve having a pore size of 1.0 mm to obtain a prepolymer.
接著,將上述得到之預聚合物,填充於柴田科學製玻璃管烤箱,一面旋轉,一面從室溫以20℃/小時升溫後,於290℃將溫度保持1小時,進行固相聚縮合。其後,一面旋轉槽,一面於室溫下自然散熱,得到全芳族液晶聚酯 樹脂A。於偏光顯微鏡下觀察同樹脂之熔融狀態,從光學各向異性確認液晶性。 Next, the prepolymer obtained above was filled in a glass tube oven made by Shibata Scientific, and while rotating at a temperature of 20 ° C / hour from room temperature, the temperature was maintained at 290 ° C for 1 hour to perform solid-phase polycondensation. After that, while rotating the groove, the heat was naturally radiated at room temperature to obtain a wholly aromatic liquid crystal polyester. Resin A. The molten state of the same resin was observed under a polarizing microscope, and liquid crystallinity was confirmed from optical anisotropy.
(實施例2:全芳族液晶聚酯樹脂(B)) (Example 2: Fully aromatic liquid crystal polyester resin (B))
將實施例1之單體備製,變更為對羥苯甲酸0.36莫耳(60莫耳%)、3,3’-二甲基-4,4’-二羥聯苯0.12莫耳(20莫耳%)、對苯二甲酸0.12莫耳(20莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.36 mol (60 mol%) of paraben and 3,3'-dimethyl-4,4'-dihydroxybiphenyl (20 mol). Ear%) and terephthalic acid 0.12 mol (20 mol%). A liquid crystal polyester resin was obtained in the same manner as described below, and liquid crystallinity was confirmed in the same manner as described above.
(實施例3:全芳族液晶聚酯樹脂(C)) (Example 3: Fully aromatic liquid crystal polyester resin (C))
將實施例1之單體備製,變更為對羥苯甲酸0.15莫耳(25莫耳%)、3,3’-二甲基-4,4’-二羥聯苯0.12莫耳(20莫耳%)、對苯二酚0.105莫耳(17.5莫耳%)、對苯二甲酸0.225莫耳(37.5莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.15 mol (25 mol%) of paraben and 3,3'-dimethyl-4,4'-dihydroxybiphenyl (20 mol). Ear%), hydroquinone 0.105 mole (17.5 mole%), terephthalic acid 0.225 mole (37.5 mole%), the following operations were performed to obtain a liquid crystal polyester resin, and the liquid crystal was confirmed in the same manner as described above. Sex.
(實施例4:全芳族液晶聚酯樹脂(D)) (Example 4: Fully aromatic liquid crystal polyester resin (D))
將實施例1之單體備製,變更為對羥苯甲酸0.12莫耳(20莫耳%)、3,3’-二甲基-4,4’-二羥聯苯0.12莫耳(20莫耳%)、4,4’-二羥聯苯(化學式(9))0.12莫耳(20莫耳%)、對苯二甲酸0.24莫耳(40莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.12 mol (20 mol%) of paraben and 3,3'-dimethyl-4,4'-dihydroxybiphenyl (20 mol). Ear%), 4,4'-dihydroxybiphenyl (chemical formula (9)) 0.12 mole (20 mole%), terephthalic acid 0.24 mole (40 mole%). The liquid crystal polyester resin was checked for liquid crystallinity in the same manner as described above.
(實施例5:全芳族液晶聚酯樹脂(E)) (Example 5: Fully aromatic liquid crystal polyester resin (E))
將實施例1之單體備製,變更為對羥苯甲酸0.12莫耳(20莫耳%)、4,4’-二羥聯苯0.12莫耳(20莫耳%)、3,3’-二甲基-4,4’-二羥聯苯0.12莫耳(20莫耳%)、對苯二甲酸0.15莫耳(25莫耳%)、間苯二甲酸(化學式(11))0.09莫耳(15莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.12 mole (20 mole%) of paraben, 4,2'-dihydroxybiphenyl (20 mole%), and 3,3'- Dimethyl-4,4'-dihydroxybiphenyl 0.12 mole (20 mole%), terephthalic acid 0.15 mole (25 mole%), isophthalic acid (chemical formula (11)) 0.09 mole (15 mol%), a liquid crystal polyester resin was obtained in the same manner as described below, and liquid crystallinity was confirmed in the same manner as described above.
(實施例6:全芳族液晶聚酯樹脂(F)) (Example 6: Fully aromatic liquid crystal polyester resin (F))
將實施例1之單體備製,變更為對羥苯甲酸0.12莫耳(20莫耳%)、3,3’-二甲基-4,4’-二羥聯苯0.135莫耳(22.5莫耳%)、對苯二酚0.105莫耳(17.5莫耳%)、對苯二甲酸0.24莫耳(40莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.12 mole (20 mole%) of paraben and 3,3'-dimethyl-4,4'-dihydroxybiphenyl (22.5 mole). Ear%), hydroquinone 0.105 mole (17.5 mole%), terephthalic acid 0.24 mole (40 mole%), the following operations were performed to obtain a liquid crystal polyester resin, and the liquid crystal was confirmed in the same manner as above. Sex.
(實施例7:全芳族液晶聚酯樹脂(G)) (Example 7: Fully aromatic liquid crystal polyester resin (G))
將實施例1之單體備製,變更為對羥苯甲酸0.15莫耳(25莫耳%)、3,3’-二甲基-4,4’-二羥聯苯0.135莫耳(22.5莫耳%)、對苯二酚0.09莫耳(15莫耳%)、對苯二甲酸0.225莫耳(37.5莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.15 mol (25 mol%) of paraben and 3,3'-dimethyl-4,4'-dihydroxybiphenyl (0.12 mol). Ear%), hydroquinone 0.09 mol (15 mol%), terephthalic acid 0.225 mol (37.5 mol%), the same operation as described below was performed to obtain a liquid crystal polyester resin, and the liquid crystal was confirmed in the same manner as described above. Sex.
(比較例1:全芳族液晶聚酯樹脂(H)) (Comparative Example 1: Fully aromatic liquid crystal polyester resin (H))
將實施例1之單體備製,變更為對羥苯甲酸0.36莫耳(60莫耳%)、4,4’-二羥聯苯0.12莫耳(20莫耳%)、對苯二甲酸0.09莫耳(15莫耳%)、間苯二甲酸0.03莫耳(5莫耳%),以下同樣地進行操作,得到液晶聚酯樹脂,與上述同樣地確認液晶性。 The monomer of Example 1 was prepared and changed to 0.36 mole (60 mole%) of paraben, 0.12 mole (20 mole%) of 4,4'-dihydroxybiphenyl, and 0.09 terephthalic acid. Molar (15 mol%) and isophthalic acid 0.03 mol (5 mol%) were obtained in the same manner as described below to obtain a liquid crystal polyester resin, and liquid crystallinity was confirmed in the same manner as described above.
(特性測定) (Characteristic measurement)
(液晶性確認) (Liquid crystal confirmation)
使用備有JAPAN HIGH TECH製之顯微鏡用冷卻加熱台10002型之OLYMPUS股份有限公司製偏光顯微鏡BH-2,於顯微鏡加熱台上,使聚酯試料加熱熔解,於熔融時以100倍、200倍之倍率觀察,從光學各向異性之有無確認液晶性。 A polarizing microscope BH-2 manufactured by OLYMPUS Co., Ltd. equipped with a cooling and heating stage 10002 for microscopes manufactured by JAPAN HIGH TECH was used, and the polyester sample was heated and melted on the microscope heating stage. The magnification observation confirmed the liquid crystallinity from the presence or absence of optical anisotropy.
(熔點測定) (Melting point measurement)
液晶聚酯樹脂之熔點係藉由SEICO電子工業股份有限公司製之示差掃描熱量計(DSC),作為基準利用α-氧化鋁來測定。此時,以升溫速度20℃/分,從室 溫升溫到390℃,使聚合物完全熔解後,以降溫速度10℃/分,降溫到50℃,進一步以20℃/分之升溫速度,升溫到420℃時所得之吸熱峰值之最高點,可測定作為熔點。 The melting point of the liquid crystal polyester resin was measured using a differential scanning calorimeter (DSC) manufactured by SEICO Electronics Industry Co., Ltd., using α-alumina as a reference. At this time, the temperature was raised from 20 ° C / min. After the temperature is raised to 390 ° C, the polymer is completely melted, and then the temperature is reduced to 10 ° C / min, and the temperature is reduced to 50 ° C, and the temperature is further increased to 20 ° C / min. Measured as the melting point.
(相對介電係數、介電正切之測定) (Determination of relative permittivity and dielectric tangent)
採用壓縮沖壓成型法(成型溫度熔點+20℃),將液晶聚酯樹脂A~H予以薄膜化(50mm×50mm×1mm),於Agilent Technologies製之網路分析儀(8510C),使用QWED製之治具,採SPDR法(23℃,10GHz)進行測定。 The compression-stamping method (molding temperature + 20 ° C) was used to thin the liquid crystal polyester resins A to H (50mm × 50mm × 1mm). The network analyzer (8510C) manufactured by Agilent Technologies was used for the analysis. The jig was measured by SPDR method (23 ° C, 10GHz).
(密度測定) (Density measurement)
針對上述製成之成型薄膜,使用島津製作所股份有限公司製AUW220比重測定裝置進行測定。 The molded film prepared as described above was measured using an AUW220 specific gravity measuring device manufactured by Shimadzu Corporation.
於表1表示結果。可知本發明之全芳族液晶聚酯樹脂保有耐焊錫耐熱性,同時具有3.3以下之優異的相對介電係數。 The results are shown in Table 1. It can be seen that the wholly aromatic liquid crystal polyester resin of the present invention maintains solder heat resistance and has an excellent relative dielectric constant of 3.3 or less.
本發明之全芳族液晶聚酯樹脂之耐焊錫耐熱性及低相對介電係數特性優良,可適用作為全芳族液晶聚酯樹脂組成物之基礎樹脂,應用於高功能資訊機器之各種零件,例如高速傳輸用連接器或CPU插槽、電路基板用薄膜、防衝撞用雷達、RFID標籤、電容器、反向器零件、絕緣薄膜、鋰離子電池等二次電池之絕緣材料、揚聲器振動板之構成材料。 The wholly aromatic liquid crystal polyester resin of the present invention is excellent in solder heat resistance and low relative permittivity, and can be used as a base resin for a wholly aromatic liquid crystal polyester resin composition. It is used in various parts of high-function information equipment. For example, connectors for high-speed transmission or CPU sockets, films for circuit boards, anti-collision radars, RFID tags, capacitors, inverter parts, insulating films, insulating materials for secondary batteries such as lithium-ion batteries, and speaker diaphragms material.
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