TWI671510B - Capacitive pressure sensor - Google Patents
Capacitive pressure sensor Download PDFInfo
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- TWI671510B TWI671510B TW107138262A TW107138262A TWI671510B TW I671510 B TWI671510 B TW I671510B TW 107138262 A TW107138262 A TW 107138262A TW 107138262 A TW107138262 A TW 107138262A TW I671510 B TWI671510 B TW I671510B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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Abstract
本發明的壓力傳感器是靜電電容式的壓力傳感器，且其特徵在於包括：柔性基板，具有可撓性，且於一個面的一部分區域中設有第一電極及第二電極；以及硬質基板，具備與所述第一電極及第二電極相向且遠離而配置的第三電極；並且所述柔性基板與所述硬質基板於相向面接合，於俯視時，設有所述第一電極及第二電極的所述一部分區域的面積大於所述硬質基板的面積。The pressure sensor of the present invention is an electrostatic capacitance type pressure sensor, and is characterized in that it includes a flexible substrate having flexibility and provided with a first electrode and a second electrode in a part of a surface; and a rigid substrate having: A third electrode disposed opposite to and away from the first electrode and the second electrode; and the flexible substrate and the hard substrate are bonded on opposite sides, and the first electrode and the second electrode are provided in a plan view An area of the partial region is larger than an area of the hard substrate.
Description
本發明是有關於一種靜電電容式壓力傳感器。The invention relates to an electrostatic capacitance type pressure sensor.
先前以來，檢測電容器的靜電電容的變化而測定對電容器施加的壓力的傳感器已為人所知（例如專利文獻1）。而且，提出有使用具有可撓性的基板而形成此種壓力傳感器的片材狀壓力傳感器（例如專利文獻2、專利文獻3）。Conventionally, a sensor that detects a change in the capacitance of a capacitor and measures the pressure applied to the capacitor has been known (for example, Patent Document 1). In addition, a sheet-like pressure sensor in which such a pressure sensor is formed using a flexible substrate has been proposed (for example, Patent Documents 2 and 3).
專利文獻2中揭示有以下結構的柔軟壓力傳感器：於包含聚醯亞胺的第一柔軟基板形成有第一線及第二線，於其下形成有第一電極及第二電極，於其上形成有線圈，於該線圈上蒸鍍有第二柔軟基板。而且記載有將此種構成的柔軟壓力傳感器以所述第一電極與所述第二電極相向的方式捲繞於血管，檢測第一電極、第二電極間的靜電電容的變化，由此測定血壓。Patent Document 2 discloses a flexible pressure sensor having a structure in which a first line and a second line are formed on a first flexible substrate including polyimide, and a first electrode and a second electrode are formed under the first line. A coil is formed, and a second flexible substrate is vapor-deposited on the coil. Furthermore, it is described that a flexible pressure sensor having such a structure is wound around a blood vessel such that the first electrode and the second electrode face each other, and a change in electrostatic capacitance between the first electrode and the second electrode is detected to measure the blood pressure .
另外，於專利文獻3中揭示有一種靜電電容式的壓力傳感器，其包括：第一彈性體片材、設於所述第一彈性體片材的主面的多個第一柱狀突起、接著於所述第一彈性體片材的所述主面側且具有多個第一電極及多個第一孔部的第一柔性基板、與所述第一柔性基板相向地配置且具有多個第二電極及多個第二孔部的第二柔性基板、以及接著於所述第二柔性基板的和與所述第一柔性基板相向的面相反的面側的第二彈性體片材，所述第一柱狀突起分別貫穿所述多個第一孔部，且具有與所述第二柔性基板接近或接觸的前端部分，所述第二柱狀突起分別貫穿所述多個第二孔部，且具有與所述第一柔性基板接近或接觸的前端部分。 [先前技術文獻] [專利文獻]In addition, Patent Document 3 discloses an electrostatic capacitance type pressure sensor including a first elastomer sheet, a plurality of first columnar protrusions provided on a main surface of the first elastomer sheet, and A first flexible substrate having a plurality of first electrodes and a plurality of first hole portions on the main surface side of the first elastomer sheet is disposed opposite to the first flexible substrate and has a plurality of first A second flexible substrate with two electrodes and a plurality of second holes, and a second elastomer sheet that is next to the second flexible substrate and on a surface side opposite to the surface facing the first flexible substrate, A first columnar protrusion penetrates each of the plurality of first hole portions, and has a front end portion which is close to or in contact with the second flexible substrate; the second columnar protrusion penetrates each of the plurality of second hole portions, And has a front end portion that is close to or in contact with the first flexible substrate. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利特開2006-194771號公報 [專利文獻2]日本專利特開2006-108657號公報 [專利文獻3]日本專利特開2009-2740號公報[Patent Literature 1] Japanese Patent Laid-Open No. 2006-194771 [Patent Literature 2] Japanese Patent Laid-Open No. 2006-108657 [Patent Literature 3] Japanese Patent Laid-Open No. 2009-2740
[發明所欲解決之課題] 如上文所述般，先前的靜電電容式的片材型壓力傳感器為相向的第一基板、第二基板均具有柔軟性（即，均可容易地變形）的結構，故而有於對壓力傳感器施加力時，所施加的力與傳感器中空部的靜電電容的關係不穩定（即，成為壓力算出的基準的值不穩定），測定精度降低的問題。[Problems to be Solved by the Invention] As described above, the conventional electrostatic capacitance type sheet pressure sensor has a structure in which the first substrate and the second substrate facing each other have flexibility (that is, they can be easily deformed). Therefore, when a force is applied to the pressure sensor, there is a problem that the relationship between the applied force and the electrostatic capacitance of the hollow portion of the sensor is unstable (that is, the value used as a reference for pressure calculation is unstable), and the measurement accuracy is reduced.
另外，例如若為如所述專利文獻3所記載的壓力傳感器般，使第一基板、第二基板各自的電極部分相向，以形成中空部的方式將該些基板接合的結構，則有產生於將基板彼此接合時電極部分的位置偏移，以未適當地形成中空部（電容器）的狀態接合的情況的問題。尤其於在一個柔性基板上設置多個電極，形成包括多個傳感器的一個片材型傳感器的情形時，難以對所有電極進行準確的對位。若如此般產生電極部分的位置偏移，則無法準確地測定壓力及其分佈。In addition, for example, as in the pressure sensor described in Patent Document 3, a structure in which the electrode portions of the first substrate and the second substrate are opposed to each other, and the substrates are joined so as to form a hollow portion, is generated in When the substrates are bonded to each other, the positions of the electrode portions are shifted, and there is a problem in the case where the hollow portions (capacitors) are not properly formed. Especially when a plurality of electrodes are provided on one flexible substrate to form a single sheet sensor including a plurality of sensors, it is difficult to accurately align all the electrodes. If the position of the electrode portion is shifted in this way, the pressure and its distribution cannot be accurately measured.
本發明是鑒於此種狀況而成，其目的在於提供一種於將兩個基板接合而形成的靜電電容式的片材型壓力傳感器中，即便於電極部分的位置偏移而接合的情形時，亦可抑制測定精度的降低的技術。 [解決課題之手段]The present invention has been made in view of such a situation, and an object thereof is to provide an electrostatic capacitance type sheet pressure sensor formed by bonding two substrates to each other even when the positions of electrode portions are shifted and bonded. A technique capable of suppressing a decrease in measurement accuracy. [Means for solving problems]
為了解決所述課題，本發明的壓力傳感器是一種靜電電容式壓力傳感器，其具有：柔性基板，具有可撓性，且於一個面的一部分區域中設有第一電極及第二電極；硬質基板，具備與所述第一電極及第二電極相向且遠離而配置的第三電極；以及壁部，將所述第一電極與所述第三電極以經絕緣的狀態接合，並且於所述第一電極與所述第三電極之間形成中空部；且藉由檢測所述中空部中因所述第一電極相對於所述第三電極彎曲而產生的靜電電容的變化，來測定向所述第一電極與所述第三電極的相向面施加的壓力，並且所述壓力傳感器的特徵在於：於俯視時，所述柔性基板中的設有所述第一電極及所述第二電極的所述一部分區域的面積大於所述硬質基板的面積。In order to solve the problem, the pressure sensor of the present invention is an electrostatic capacitance type pressure sensor, which includes: a flexible substrate having flexibility, and provided with a first electrode and a second electrode in a part of a surface; a rigid substrate And a third electrode disposed opposite to and away from the first electrode and the second electrode; and a wall portion that joins the first electrode and the third electrode in an insulated state and is connected to the first electrode A hollow portion is formed between an electrode and the third electrode; and a change in an electrostatic capacitance in the hollow portion caused by the bending of the first electrode with respect to the third electrode is measured to measure the direction of the hollow portion. A pressure applied by a facing surface of the first electrode and the third electrode, and the pressure sensor is characterized in that, in a plan view, the flexible substrate is provided with the first electrode and the second electrode; An area of the partial region is larger than an area of the hard substrate.
若為所述般的構成，則於對壓力傳感器施加力的情形時，設於硬質基板的第三電極不會彎曲，僅第一電極向第三電極產生彎曲，因此對壓力傳感器施加的力與傳感器中空部的靜電電容的相關關係穩定，能以良好的精度進行壓力測定。With the above-mentioned configuration, when a force is applied to the pressure sensor, the third electrode provided on the rigid substrate is not bent, and only the first electrode is bent toward the third electrode. The correlation of the electrostatic capacitance in the hollow portion of the sensor is stable, and pressure measurement can be performed with good accuracy.
另外，於俯視時，以柔性基板上的第一電極及第二電極所占的區域的面積大於所述硬質基板的面積的方式形成，因此即便於製造過程中將所述第一電極與所述第三電極接合時電極部的位置以某種程度偏移，亦可確保用以檢測靜電電容的變化的所述中空部，從而可抑制測定精度的降低。In addition, in a plan view, the area of the area occupied by the first electrode and the second electrode on the flexible substrate is larger than the area of the hard substrate. Therefore, the first electrode and the When the third electrode is bonded, the position of the electrode portion is shifted to some extent, and the hollow portion for detecting a change in electrostatic capacitance can be secured, so that a reduction in measurement accuracy can be suppressed.
另外，可為以下構成：所述柔性基板具備多個所述第一電極與所述第二電極的組，且具有與該多組所述第一電極及第二電極對應的多個所述硬質基板。藉由此種構成，可將多個傳感器的集合以一個片材型壓力傳感器的形式有效運用。In addition, the flexible substrate may include a plurality of groups of the first electrode and the second electrode, and may include a plurality of the hard bodies corresponding to the plurality of groups of the first electrode and the second electrode. Substrate. With this configuration, a collection of multiple sensors can be effectively used as a single sheet pressure sensor.
另外，所述多組所述第一電極及第二電極可於所述柔性基板上空開既定間隔而配置成格子狀。若為此種構成，則亦可測量對柔性基板施加的壓力的分佈。In addition, the plurality of sets of the first electrodes and the second electrodes may be arranged in a grid shape at a predetermined interval on the flexible substrate. With such a configuration, the distribution of the pressure applied to the flexible substrate can also be measured.
另外，所述第一電極可接地。所述般的構成的壓力傳感器的情況下，通常使設有第一電極的柔性基板與測定對象物接觸，進行壓力的檢測。因此，藉由將作為接觸對象物之側的第一電極接地，可抑制漏電而提高電氣安全性。 [發明的效果]In addition, the first electrode may be grounded. In the case of a pressure sensor having such a configuration, a flexible substrate provided with a first electrode is usually brought into contact with a measurement target to detect a pressure. Therefore, by grounding the first electrode on the side of the object to be contacted, it is possible to suppress leakage and improve electrical safety. [Effect of the invention]
根據本發明，可提供一種於將兩個基板接合而形成的靜電電容式的片材型壓力傳感器中，即便電極部分的位置偏移而接合的情形時，亦抑制測定精度的降低的技術。According to the present invention, it is possible to provide a technology for suppressing a decrease in measurement accuracy in a capacitance-type sheet pressure sensor formed by bonding two substrates even when the positions of electrode portions are shifted.
以下，參照圖式對本發明的實施形態的一例進行說明。Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings.
＜應用例＞ 本發明例如可用作圖1A及圖1B所示的如下壓力傳感器9。圖1A為本應用例的壓力傳感器9的概略平面圖，圖1B為圖1A的X-X線的概略剖面圖。壓力傳感器9為所謂靜電電容式的壓力傳感器，總體結構成為將具有可撓性的片材狀的柔性基板910、與由硬質的絕緣材料所形成的硬質基板920接合而成的構成。<Application Example> The present invention can be used, for example, as the following pressure sensor 9 shown in FIGS. 1A and 1B. FIG. 1A is a schematic plan view of a pressure sensor 9 according to an application example, and FIG. 1B is a schematic cross-sectional view taken along a line X-X in FIG. 1A. The pressure sensor 9 is a so-called electrostatic capacitance type pressure sensor, and has an overall structure in which a flexible sheet-like flexible substrate 910 and a rigid substrate 920 made of a hard insulating material are bonded.
於柔性基板910，設有根據柔性基板910的變形而具有一定程度的可撓性的可動電極911、及訊號線912等配線。再者，對於可動電極911，可於電極的表面形成有鍍覆部。另一方面，於硬質基板920上設有固定電極921、絕緣部922、金屬部923。而且，柔性基板910與硬質基板920是以形成有各電極的面相向的方式接合。具體而言，成為將柔性基板910側的可動電極911與硬質基板920側的金屬部923接合的結構。The flexible substrate 910 is provided with wirings such as a movable electrode 911 and a signal line 912 that have a certain degree of flexibility in accordance with the deformation of the flexible substrate 910. Furthermore, in the movable electrode 911, a plated portion may be formed on the surface of the electrode. On the other hand, a fixed electrode 921, an insulating portion 922, and a metal portion 923 are provided on the rigid substrate 920. The flexible substrate 910 and the rigid substrate 920 are bonded so that the surfaces on which the electrodes are formed face each other. Specifically, it has a structure in which the movable electrode 911 on the flexible substrate 910 side and the metal portion 923 on the hard substrate 920 side are joined.
可動電極911是由在柔性基板910上接近地配置的第一可動電極911a及第二可動電極911b所構成。即，一組第一可動電極911a與第二可動電極911b成為一個可動電極911。第一可動電極911a成為與固定電極921絕緣，且於中空部930中相對於固定電極921而彎曲的構成。即，第一可動電極911a成為發揮構成電容器的電極的作用的部分。另外，第二可動電極911b與固定電極921電性連接，且藉由訊號線912而與連接器950連接。再者，第一可動電極911a藉由接地線913而與連接器950連接。The movable electrode 911 is composed of a first movable electrode 911a and a second movable electrode 911b which are closely arranged on the flexible substrate 910. That is, a set of the first movable electrode 911a and the second movable electrode 911b becomes one movable electrode 911. The first movable electrode 911 a is insulated from the fixed electrode 921 and is configured to be curved with respect to the fixed electrode 921 in the hollow portion 930. That is, the first movable electrode 911a becomes a part that functions as an electrode constituting a capacitor. In addition, the second movable electrode 911b is electrically connected to the fixed electrode 921, and is connected to the connector 950 through a signal line 912. The first movable electrode 911a is connected to the connector 950 via a ground line 913.
另外，絕緣部922是以覆蓋硬質基板920及固定電極921的與可動電極911相向之側的面的一部分的方式形成，金屬部923形成於絕緣部922上。而且，固定電極921的上表面中，未由絕緣部922覆蓋的部分及由金屬部923包圍的部分成為中空部930，作為介電層發揮功能。The insulating portion 922 is formed so as to cover a part of the surface of the hard substrate 920 and the fixed electrode 921 on the side facing the movable electrode 911, and the metal portion 923 is formed on the insulating portion 922. In the upper surface of the fixed electrode 921, a portion not covered by the insulating portion 922 and a portion surrounded by the metal portion 923 become the hollow portion 930 and function as a dielectric layer.
即，由第一可動電極911a、固定電極921、中空部930構成電容器。此處，第一可動電極911a若受到壓力則於中空部930中彎曲，由此第一可動電極911a與固定電極921的距離變近，因此中空部930的靜電電容的值變大。該變化能以電性方式檢測（輸出），故而可根據靜電電容的值的變化而測定第一可動電極911a與固定電極921的距離、即對壓力傳感器9施加的壓力。That is, the first movable electrode 911a, the fixed electrode 921, and the hollow portion 930 constitute a capacitor. Here, when the first movable electrode 911a receives pressure, it bends in the hollow portion 930. As a result, the distance between the first movable electrode 911a and the fixed electrode 921 becomes shorter, and the value of the electrostatic capacitance of the hollow portion 930 becomes larger. Since this change can be detected (outputted) electrically, the distance between the first movable electrode 911 a and the fixed electrode 921, that is, the pressure applied to the pressure sensor 9 can be measured based on the change in the capacitance value.
再者，為了根據靜電電容的值的變化而正確地測定對壓力傳感器施加的壓力，需要唯一地決定對壓力傳感器施加的壓力的強度、受到此壓力而變化的（構成電容器的）兩電極的距離、及靜電電容的值的關係。然而，於將構成電容器的電極兩者形成於具有可撓性的基板般的情形時，施加壓力、兩電極的距離及靜電電容的值的關係不穩定，無法以良好的精度測定壓力。Furthermore, in order to accurately measure the pressure applied to the pressure sensor based on the change in the capacitance value, it is necessary to uniquely determine the strength of the pressure applied to the pressure sensor and the distance between the two electrodes (which constitute the capacitor) that are changed by the pressure. And the value of the electrostatic capacitance. However, when both the electrodes constituting the capacitor are formed on a flexible substrate, the relationship between the applied pressure, the distance between the two electrodes, and the value of the capacitance is unstable, and the pressure cannot be measured with good accuracy.
關於此方面，本應用例的壓力傳感器9將固定電極921設於硬質的硬質基板920上，故而不易變形，於受到壓力的情形時，可動電極911與固定電極921的距離與該施加壓力相應地變化，靜電電容的值與兩電極的距離成反比例地變化。因此，能以良好的精度測量所施加的壓力。In this regard, the pressure sensor 9 of this application example has a fixed electrode 921 on a hard rigid substrate 920, so it is not easily deformed. When a pressure is applied, the distance between the movable electrode 911 and the fixed electrode 921 corresponds to the applied pressure The capacitance value changes in inverse proportion to the distance between the two electrodes. Therefore, the applied pressure can be measured with good accuracy.
另外，本應用例的壓力傳感器9成為以下構成：於柔性基板910中，由一組第一可動電極911a與第二可動電極911b構成的一個可動電極911總體所占的區域的面積於俯視時形成為大致矩形形狀，且其面積大於硬質基板920。藉由如此般設定，即便於將可動電極911與固定電極921接合時產生了某種程度的位置偏移，亦可使固定電極921位於可動電極911的範圍內。即，可確保壓力傳感器9的作為靜電電容傳感器的功能，抑制測定精度的降低。In addition, the pressure sensor 9 of this application example has a configuration in which the area of the area occupied by the entire movable electrode 911 composed of a set of the first movable electrode 911a and the second movable electrode 911b in the flexible substrate 910 is formed in plan view It has a substantially rectangular shape and has an area larger than that of the rigid substrate 920. With such settings, even if a certain degree of positional displacement occurs when the movable electrode 911 and the fixed electrode 921 are joined, the fixed electrode 921 can be positioned within the range of the movable electrode 911. That is, it is possible to ensure the function of the pressure sensor 9 as an electrostatic capacitance sensor and suppress a decrease in measurement accuracy.
＜實施形態＞ （壓力傳感器100的構成） 繼而，參照圖2～圖8B對本發明的更詳細的實施形態進行說明。圖2及圖3為表示實施形態的靜電電容式壓力傳感器的一例的圖。圖2為俯視壓力傳感器100的圖的一例，圖3為圖2的A-A線的剖面圖的一例。圖2中，以虛線來表示俯視時無法看到的固定基板側鍍覆部24、第一中空部18、第二中空部19、固定電極22及基板部21。圖2中，例示三個壓力傳感器100（100a、100b、100c），並且亦例示連接器200及靜電電容測定電路300。三個壓力傳感器100a、壓力傳感器100b、壓力傳感器100c共有片材基板11。<Embodiment> (Configuration of pressure sensor 100) Next, a more detailed embodiment of the present invention will be described with reference to FIGS. 2 to 8B. 2 and 3 are diagrams showing an example of a capacitive pressure sensor according to the embodiment. Fig. 2 is an example of a plan view of the pressure sensor 100, and Fig. 3 is an example of a cross-sectional view taken along the line A-A in Fig. 2. In FIG. 2, the fixed substrate-side plated portion 24, the first hollow portion 18, the second hollow portion 19, the fixed electrode 22, and the substrate portion 21 are not shown in a plan view with dotted lines. In FIG. 2, three pressure sensors 100 (100 a, 100 b, and 100 c) are illustrated, and a connector 200 and a capacitance measurement circuit 300 are also illustrated. The three pressure sensors 100 a, 100 b, and 100 c share the sheet substrate 11.
若參照圖3則可理解，壓力傳感器100包括含有可動電極12且具有可撓性的可動部10及含有固定電極22的固定基板部20。壓力傳感器100是以可動部10的可動電極12與固定基板部20的固定電極22相向的方式將可動部10與固定基板部20接合而形成。As can be understood by referring to FIG. 3, the pressure sensor 100 includes a movable portion 10 including a movable electrode 12 and having flexibility, and a fixed substrate portion 20 including a fixed electrode 22. The pressure sensor 100 is formed by joining the movable portion 10 and the fixed substrate portion 20 so that the movable electrode 12 of the movable portion 10 and the fixed electrode 22 of the fixed substrate portion 20 face each other.
可動電極12包含第一可動電極121及與第一可動電極121遠離而設置的第二可動電極122。於第一可動電極121與固定電極22之間形成有第一中空部18。藉由形成第一中空部18，於對片材基板11上的相當於第一可動電極121的區域施加壓力時，可動部10可向固定基板部20變形。另外，於第二可動電極122與固定電極22之間形成有第二中空部19。The movable electrode 12 includes a first movable electrode 121 and a second movable electrode 122 provided away from the first movable electrode 121. A first hollow portion 18 is formed between the first movable electrode 121 and the fixed electrode 22. By forming the first hollow portion 18, when a pressure is applied to a region corresponding to the first movable electrode 121 on the sheet substrate 11, the movable portion 10 can be deformed toward the fixed substrate portion 20. A second hollow portion 19 is formed between the second movable electrode 122 and the fixed electrode 22.
圖2中，第一中空部18及第二中空部19的剖面形狀形成為大致圓形，但第一中空部18及第二中空部19的剖面形狀不限定於大致圓形。第一中空部18及第二中空部19的剖面形狀亦可為形成大致多邊形，例如亦可為大致四邊形、大致六邊形、大致八邊形等。In FIG. 2, the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are formed in a substantially circular shape, but the cross-sectional shapes of the first hollow portion 18 and the second hollow portion 19 are not limited to a substantially circular shape. The cross-sectional shape of the first hollow portion 18 and the second hollow portion 19 may be a substantially polygonal shape, and may be, for example, a substantially quadrangular shape, a substantially hexagonal shape, a substantially octagonal shape, or the like.
以下，本說明書中，將圖2中自第二中空部19朝向第一中空部18的方向設為右，將其相反方向設為左。另外，圖2中，將自壓力傳感器100a朝向壓力傳感器100c的方向設為後，將其相反方向設為前。進而，將圖3中自可動部10朝向固定基板部20的方向設為下，將其相反方向設為上。Hereinafter, in this specification, the direction from the second hollow portion 19 toward the first hollow portion 18 in FIG. 2 is set to the right, and the opposite direction is set to the left. In addition, in FIG. 2, the direction from the pressure sensor 100 a to the pressure sensor 100 c is set to the back, and the opposite direction is set to the front. Furthermore, the direction from the movable portion 10 toward the fixed substrate portion 20 in FIG. 3 is set to the downward direction, and the opposite direction is set to the upward direction.
可動部10包含片材基板11、可動電極12、可動部側鍍覆部14。片材基板11是由具有可撓性的構件（例如聚醯亞胺）形成。片材基板11的厚度例如為25 μm。此處，片材基板11的厚度為片材基板11的上下方向的長度。於片材基板11的下方的面上設有由具有導電性的構件（例如銅）所形成的可動電極12。如上文所述，可動電極12包含第一可動電極121及與第一可動電極121遠離而設置的第二可動電極122。可動電極12的厚度例如為10 μm。第一可動電極121的左右方向的長度例如為2.0 mm。第二可動電極122的左右方向的長度例如為0.5 mm。第一可動電極121及第二可動電極122的前後方向的長度例如為1 mm～2 mm。第一可動電極121與第二可動電極122之間的距離例如為0.1 mm。於可動電極12的下方的面上設有可動部側鍍覆部14。可動部側鍍覆部14包含設於第一可動電極121的下方的面上的第一鍍覆部141及設於第二可動電極122的下方的面上的第二鍍覆部142。可動部側鍍覆部14例如是由鍍金形成。The movable portion 10 includes a sheet substrate 11, a movable electrode 12, and a movable portion-side plating portion 14. The sheet substrate 11 is formed of a flexible member (for example, polyimide). The thickness of the sheet substrate 11 is, for example, 25 μm. Here, the thickness of the sheet substrate 11 is a length in the vertical direction of the sheet substrate 11. A movable electrode 12 formed of a conductive member (for example, copper) is provided on a lower surface of the sheet substrate 11. As described above, the movable electrode 12 includes the first movable electrode 121 and the second movable electrode 122 provided away from the first movable electrode 121. The thickness of the movable electrode 12 is, for example, 10 μm. The length of the first movable electrode 121 in the left-right direction is, for example, 2.0 mm. The length of the second movable electrode 122 in the left-right direction is, for example, 0.5 mm. The lengths of the first movable electrode 121 and the second movable electrode 122 in the front-rear direction are, for example, 1 mm to 2 mm. The distance between the first movable electrode 121 and the second movable electrode 122 is, for example, 0.1 mm. A movable portion-side plated portion 14 is provided on a lower surface of the movable electrode 12. The movable portion-side plating portion 14 includes a first plating portion 141 provided on a surface below the first movable electrode 121 and a second plating portion 142 provided on a surface below the second movable electrode 122. The movable portion-side plated portion 14 is formed of, for example, gold plating.
固定基板部20包含基板部21、固定電極22、絕緣部23及固定基板側鍍覆部24。基板部21是由不容易變形的構件（例如玻璃）形成。基板部21的厚度例如為300 μm～600 μm。另外，基板部21的前後方向的長度設定得較可動電極12部分總體所占的區域的前後方向的長度更短，基板部21的左右方向的長度設定得較可動電極12部分總體所占的區域的左右長度更短。即，以俯視壓力傳感器100時的固定基板部20的面積小於可動電極12總體部分所占的區域的面積的方式設定。The fixed substrate portion 20 includes a substrate portion 21, a fixed electrode 22, an insulating portion 23, and a fixed substrate-side plated portion 24. The substrate portion 21 is formed of a member (for example, glass) that is not easily deformed. The thickness of the substrate portion 21 is, for example, 300 μm to 600 μm. In addition, the length of the substrate portion 21 in the front-rear direction is set shorter than the length of the region occupied by the entire movable electrode 12 portion, and the length of the substrate portion 21 in the left-right direction is set longer than the region occupied by the movable electrode 12 portion. The left and right lengths are shorter. That is, it is set so that the area of the fixed substrate portion 20 when the pressure sensor 100 is viewed in plan is smaller than the area of the area occupied by the entire movable electrode 12.
由於基板部21是由不容易變形的構件形成，故而即便因對片材基板11施加壓力而可動部10彎曲，亦抑制固定基板部20的變形。於基板部21的上側的面上，配置有由具有導電性的構件（例如鉻）形成的固定電極22。進而，設有包圍固定電極22的周圍且覆蓋固定電極22的上方的一部分的絕緣部23。Since the substrate portion 21 is formed of a member that is not easily deformed, even if the movable portion 10 is bent by applying pressure to the sheet substrate 11, deformation of the fixed substrate portion 20 is suppressed. A fixed electrode 22 formed of a conductive member (for example, chromium) is disposed on the upper surface of the substrate portion 21. Furthermore, an insulating portion 23 is provided that surrounds the periphery of the fixed electrode 22 and covers a part above the fixed electrode 22.
絕緣部23是由絕緣體（例如四乙氧基矽烷（tetraethoxy silane，TEOS）或二氧化矽）形成。絕緣部23的厚度例如為0.5 μm。於絕緣部23中，於俯視時第一可動電極121與固定電極22重疊的區域的一部分，設有形成所述第一中空部18的一部分的部位。另外，於俯視時第二可動電極122與固定電極22重疊的區域的一部分，設有用以形成所述第二中空部19的部位。The insulating portion 23 is formed of an insulator such as tetraethoxy silane (TEOS) or silicon dioxide. The thickness of the insulating portion 23 is, for example, 0.5 μm. In the insulating portion 23, a portion forming a part of the first hollow portion 18 is provided in a part of a region where the first movable electrode 121 and the fixed electrode 22 overlap in a plan view. A part of an area where the second movable electrode 122 and the fixed electrode 22 overlap in a plan view is provided with a portion for forming the second hollow portion 19.
於絕緣部23中，用以形成第一中空部18的一部分及第二中空部19的部位是以自絕緣部23的可動部10側的面到達固定電極22側的面的貫通孔的方式形成。俯視第一中空部18時的直徑例如為0.6 mm～1.2 mm。於俯視壓力傳感器100的情形時，第二中空部19的面積小於第一中空部18的面積。即，俯視第二中空部19時的直徑小於俯視第一中空部18時的直徑。未施加壓力時的第一中空部18的第一可動電極121與固定電極22之間的距離d例如為1 μm。In the insulating portion 23, a portion for forming a part of the first hollow portion 18 and the second hollow portion 19 is formed as a through-hole from the surface on the movable portion 10 side of the insulating portion 23 to the surface on the fixed electrode 22 side. . The diameter of the first hollow portion 18 when viewed in plan is, for example, 0.6 mm to 1.2 mm. When the pressure sensor 100 is viewed from the top, the area of the second hollow portion 19 is smaller than the area of the first hollow portion 18. That is, the diameter when viewed from the second hollow portion 19 is smaller than the diameter when viewed from the first hollow portion 18. The distance d between the first movable electrode 121 and the fixed electrode 22 of the first hollow portion 18 when no pressure is applied is, for example, 1 μm.
除了絕緣部23的上側的面的一部分以外，於第二中空部19的內側面及底部設有固定基板側鍍覆部24。固定基板側鍍覆部24包含第三鍍覆部241及第四鍍覆部242。Except for a part of the upper surface of the insulating portion 23, a fixed substrate-side plated portion 24 is provided on the inner surface and the bottom of the second hollow portion 19. The fixed substrate-side plated portion 24 includes a third plated portion 241 and a fourth plated portion 242.
第三鍍覆部241是於絕緣部23的上側的面中，於形成第一中空部18的一部分的貫通孔的邊緣附近的區域中以包圍該部位的方式設置。如此般由被第三鍍覆部241包圍的部分及設於絕緣部23的貫通孔所形成的空間為第一中空部18，本發明的「壁部」是由設於絕緣部23的貫通孔的內壁及第三鍍覆部241所構成。The third plating portion 241 is provided on the upper surface of the insulating portion 23 in a region near the edge of the through hole forming a part of the first hollow portion 18 so as to surround the portion. The space formed by the portion surrounded by the third plating portion 241 and the through hole provided in the insulating portion 23 in this manner is the first hollow portion 18. The “wall portion” of the present invention is the through hole provided in the insulating portion 23. The inner wall and the third plating portion 241 are formed.
第四鍍覆部242是於絕緣部23的上側的面中，於用以形成第二中空部19的貫通孔的邊緣附近的區域中以包圍該部位的方式設置，且亦設置於該貫通孔的內側面、及相當於該貫通孔的底部的固定電極22的上表面。即，第四鍍覆部242是由自絕緣部23的上側的面的上方向第二可動電極122突出而形成的部分、及覆蓋貫通孔的內部的部分所形成，由該些部分包圍的空間成為第二中空部19。再者，固定基板側鍍覆部24例如是由鍍金形成。The fourth plated portion 242 is provided on the upper surface of the insulating portion 23 in a region near the edge of the through hole for forming the second hollow portion 19 so as to surround the portion, and is also provided in the through hole. And the upper surface of the fixed electrode 22 corresponding to the bottom of the through hole. That is, the fourth plated portion 242 is a portion formed by protruding from the upper surface of the upper surface of the insulating portion 23 toward the second movable electrode 122 and a portion covering the inside of the through hole, and the space surrounded by these portions Become the second hollow portion 19. The fixed substrate-side plated portion 24 is formed of, for example, gold plating.
藉由將可動部側鍍覆部14與固定基板側鍍覆部24接合而使可動部10與固定基板部20成為一體，形成壓力傳感器100。另外，藉由將第二鍍覆部142與第四鍍覆部242接合，而將第二可動電極122與固定電極22電性連接。The movable portion-side plated portion 14 and the fixed substrate-side plated portion 24 are joined to integrate the movable portion 10 and the fixed substrate portion 20 to form a pressure sensor 100. In addition, the second movable electrode 122 and the fixed electrode 22 are electrically connected by joining the second plated portion 142 and the fourth plated portion 242.
第二可動電極122與連接器200藉由自第二可動電極122延伸的訊號線15而連接。另外，壓力傳感器100a、壓力傳感器100b的第一可動電極121之間及壓力傳感器100b、壓力傳感器100c的第一可動電極121之間藉由自第一可動電極121延伸的接地（GND）線16a而連接。The second movable electrode 122 and the connector 200 are connected by a signal line 15 extending from the second movable electrode 122. In addition, between the pressure sensor 100 a and the first movable electrode 121 of the pressure sensor 100 b and between the pressure sensor 100 b and the first movable electrode 121 of the pressure sensor 100 c are connected by a ground (GND) line 16 a extending from the first movable electrode 121. connection.
圖2中，相鄰的壓力傳感器100之間的距離例如為0.1 mm～0.3 mm。即，GND線16a的長度為0.1 mm～0.3 mm。進而，壓力傳感器100c的第一可動電極121藉由自第一可動電極121延伸的GND線16b而與連接器200連接。即，壓力傳感器100a、壓力傳感器100b、壓力傳感器100c共有GND。In FIG. 2, the distance between the adjacent pressure sensors 100 is, for example, 0.1 mm to 0.3 mm. That is, the length of the GND line 16a is 0.1 mm to 0.3 mm. Furthermore, the first movable electrode 121 of the pressure sensor 100 c is connected to the connector 200 via a GND line 16 b extending from the first movable electrode 121. That is, the pressure sensors 100a, 100b, and 100c share GND.
若參照圖2及圖3則可理解，壓力傳感器100中，訊號線15與GND線16均形成於片材基板11的下側的面。即，壓力傳感器100中，自第一可動電極121延伸的配線與自固定電極22延伸的配線形成於同一層中。壓力傳感器100藉由採用此種構成，而實現簡易的配線結構。2 and 3, it can be understood that, in the pressure sensor 100, the signal line 15 and the GND line 16 are both formed on the lower surface of the sheet substrate 11. That is, in the pressure sensor 100, the wiring extending from the first movable electrode 121 and the wiring extending from the fixed electrode 22 are formed on the same layer. By adopting such a configuration, the pressure sensor 100 realizes a simple wiring structure.
具有所述構成的壓力傳感器100作為電容器而動作，所述電容器將相隔距離d（參照圖3）而配置的第一可動電極121的和固定電極22重合的區域與固定電極22的和第一可動電極121重合的區域作為電極板。電容器的靜電電容C例如是使用所述距離d及第一可動電極121與固定電極22重合的區域的面積S（參照圖3）藉由數式C＝ε 0ε r×S/d（式1）而算出。 The pressure sensor 100 having the above-mentioned structure operates as a capacitor, and the capacitor overlaps the area of the first movable electrode 121 and the fixed electrode 22 that is disposed at a distance d (see FIG. 3) from the area where the fixed electrode 22 and the first movable electrode overlap. A region where the electrodes 121 overlap is used as an electrode plate. The electrostatic capacitance C of the capacitor is, for example, the above-mentioned distance d and the area S (see FIG. 3) of a region where the first movable electrode 121 and the fixed electrode 22 overlap with each other by the formula C = ε 0 ε r × S / d (Equation 1 ) And calculated.
所述（式1）中，ε 0為真空的介電常數，ε r為大氣的相對介電常數。即，根據（式1）得知，靜電電容C與藉由對可動部10施加力而產生的第一可動電極121與固定電極22之間的距離d的變動相應地變動。 In the formula (1), ε 0 is a dielectric constant of a vacuum, and ε r is a relative dielectric constant of the atmosphere. That is, it is known from (Expression 1) that the electrostatic capacitance C and the change in the distance d between the first movable electrode 121 and the fixed electrode 22 generated by applying a force to the movable portion 10 change accordingly.
因此，藉由檢測靜電電容C的變動，可檢測對可動部10施加的力。另外，壓力P例如是使用所述面積S藉由數式P＝F/S（式2）而算出。Therefore, by detecting a change in the capacitance C, a force applied to the movable portion 10 can be detected. In addition, the pressure P is calculated, for example, using the above-mentioned area S by the formula P = F / S (Expression 2).
所述（式2）中，F為施加於壓力傳感器100的力的大小。如上文所述，基板部21是由不容易變形的構件形成，故而即便對壓力傳感器100施加力，亦抑制成為壓力算出的基準的面積S的變動。因此，壓力傳感器100與基板部21由容易變形的構件形成的壓力傳感器相比，能以更高的精度檢測壓力。In the above-mentioned (Expression 2), F is the magnitude of the force applied to the pressure sensor 100. As described above, since the substrate portion 21 is formed of a member that is not easily deformed, even if a force is applied to the pressure sensor 100, the variation of the area S that is the reference for the pressure calculation is suppressed. Therefore, the pressure sensor 100 can detect pressure with higher accuracy than a pressure sensor in which the substrate portion 21 is formed of a member that is easily deformed.
圖4為表示靜電電容測定電路300的構成的一例的圖。圖4中，亦例示壓力傳感器100a、壓力傳感器100b、壓力傳感器100c。另外，圖4中省略連接器200的圖示。靜電電容測定電路300包括兩個多工器（multiplexer）301（圖中記載為MUX）及轉換器302。FIG. 4 is a diagram showing an example of a configuration of the capacitance measurement circuit 300. In FIG. 4, the pressure sensor 100a, the pressure sensor 100b, and the pressure sensor 100c are also illustrated. Note that the illustration of the connector 200 is omitted in FIG. 4. The capacitance measurement circuit 300 includes two multiplexers 301 (depicted as MUX in the figure) and a converter 302.
於多工器301各自中，經由訊號線15而輸入有伴隨著壓力傳感器100a、壓力傳感器100b、壓力傳感器100c的靜電電容的變動的訊號。多工器301各自輸出自壓力傳感器100a、壓力傳感器100b、壓力傳感器100c輸入的訊號中所選擇的一個。圖4中，省略用於多工器301所輸出的訊號的選擇的選擇訊號的圖示。In each of the multiplexers 301, a signal accompanying a change in the capacitance of the pressure sensor 100a, the pressure sensor 100b, and the pressure sensor 100c is input via the signal line 15. Each of the multiplexers 301 outputs a selected signal from the pressure sensors 100a, 100b, and 100c. In FIG. 4, illustration of a selection signal for selecting a signal output from the multiplexer 301 is omitted.
自多工器301各自輸出的訊號被輸入至轉換器302。轉換器302例如記憶自多工器301所輸入的訊號值與壓力的對應關係。轉換器302所管理的對應關係例如既可為表示所輸入的訊號值與壓力的對應的表，亦可為根據所輸入的訊號值而算出壓力的數式。轉換器302例如按照該對應關係而將自多工器301輸入的訊號值變換為表示壓力的訊號值，並將表示壓力的訊號值輸出。Signals output from the multiplexers 301 are input to the converter 302. The converter 302 memorizes, for example, the correspondence between the signal value input from the multiplexer 301 and the pressure. The correspondence relationship managed by the converter 302 may be, for example, a table showing the correspondence between the input signal value and the pressure, or a formula for calculating the pressure based on the input signal value. The converter 302 converts, for example, a signal value input from the multiplexer 301 into a signal value indicating a pressure according to the correspondence relationship, and outputs a signal value indicating a pressure.
圖5A表示對壓力傳感器100施加壓力前的狀態的一例，圖5B表示對壓力傳感器100施加壓力時的狀態的一例。壓力傳感器100中，若自第一中空部18的上方施加壓力，則如圖5B中所例示，包含片材基板11及第一可動電極121的可動部10與所施加的力相應地向固定基板部20的方向彎曲。另外，若不對壓力傳感器100施加力，則壓力傳感器100自圖5B的狀態回到圖5A的狀態。FIG. 5A shows an example of a state before pressure is applied to the pressure sensor 100, and FIG. 5B shows an example of a state when pressure is applied to the pressure sensor 100. In the pressure sensor 100, if pressure is applied from above the first hollow portion 18, as illustrated in FIG. 5B, the movable portion 10 including the sheet substrate 11 and the first movable electrode 121 is applied to the fixed substrate in accordance with the applied force. The direction of the portion 20 is curved. In addition, if no force is applied to the pressure sensor 100, the pressure sensor 100 returns from the state of FIG. 5B to the state of FIG. 5A.
即，壓力傳感器100中，第一可動電極121與固定電極22之間的距離d與所施加的力相應地變動。若距離d變動，則壓力傳感器100的靜電電容根據（式1）而變動。例如，藉由利用圖2所例示的靜電電容測定電路300來測定壓力傳感器100的靜電電容的變動，而檢測施加於壓力傳感器100的壓力。That is, in the pressure sensor 100, the distance d between the first movable electrode 121 and the fixed electrode 22 varies according to the applied force. When the distance d changes, the electrostatic capacitance of the pressure sensor 100 changes according to (Expression 1). For example, the capacitance measurement circuit 300 illustrated in FIG. 2 is used to measure a change in the capacitance of the pressure sensor 100 to detect the pressure applied to the pressure sensor 100.
再者，壓力傳感器100除了第一中空部18以外還具有第二中空部19。於第二中空部19的內側面，如上文所述，形成有自固定電極22到達第二可動電極122的圓筒形狀的第四鍍覆部242。The pressure sensor 100 includes a second hollow portion 19 in addition to the first hollow portion 18. On the inner side surface of the second hollow portion 19, as described above, a fourth plated portion 242 having a cylindrical shape from the fixed electrode 22 to the second movable electrode 122 is formed.
若僅將固定電極22與第二可動電極122電性連接，則即便不將第四鍍覆部242形成為圓筒形狀而利用一根配線來連接亦足矣。然而，本實施形態的壓力傳感器100中，遠離設置的第一可動電極121與第二可動電極122均共有片材基板11。因此，若自第一可動電極121的上方施加力，則第一可動電極121向固定電極22側彎曲，並且第二可動電極122亦向固定電極22側變形。If only the fixed electrode 22 and the second movable electrode 122 are electrically connected, it is sufficient even if the fourth plating portion 242 is not formed in a cylindrical shape and is connected by a single wire. However, in the pressure sensor 100 according to the present embodiment, the first movable electrode 121 and the second movable electrode 122 that are remotely provided share the sheet substrate 11. Therefore, when a force is applied from above the first movable electrode 121, the first movable electrode 121 is bent toward the fixed electrode 22 side, and the second movable electrode 122 is also deformed toward the fixed electrode 22 side.
為了進行壓力的高精度檢測，第一可動電極121較佳為在前後方向及左右方向上無偏差地相對於固定電極22而彎曲。然而，若如所述般第二可動電極122向固定電極22側變形，則第一可動電極121受到該變形的影響，難以相對於固定電極22而無偏差地彎曲。In order to perform high-precision detection of pressure, the first movable electrode 121 is preferably bent with respect to the fixed electrode 22 without deviation in the front-rear direction and the left-right direction. However, if the second movable electrode 122 is deformed toward the fixed electrode 22 side as described above, the first movable electrode 121 is affected by the deformation, and it is difficult to bend the first movable electrode 121 relative to the fixed electrode 22 without deviation.
因此，本實施形態的壓力傳感器100中，將俯視第四鍍覆部242時的剖面形狀形成為大致圓形或大致多邊形的中空形狀。藉此，與利用一根配線將固定電極22與第二可動電極122連接的構成相比，抑制施加壓力時的第二可動電極122部分的變形。藉此，於第一可動電極121相對於固定電極22而彎曲時，抑制產生前後方向及左右方向的偏差。進而，與利用一根配線來支持第二可動電極122的情形相比，剖面形狀經形成為大致圓形或大致多邊形的第四鍍覆部242可穩定地支持第二可動電極122。Therefore, in the pressure sensor 100 according to this embodiment, the cross-sectional shape when the fourth plating portion 242 is viewed in plan is formed into a substantially circular or substantially polygonal hollow shape. Accordingly, as compared with a configuration in which the fixed electrode 22 and the second movable electrode 122 are connected by a single wire, deformation of the second movable electrode 122 portion when a pressure is applied is suppressed. Thereby, when the first movable electrode 121 is bent with respect to the fixed electrode 22, deviations in the front-rear direction and the left-right direction are suppressed from occurring. Furthermore, as compared with the case where the second movable electrode 122 is supported by a single wire, the fourth plated portion 242 having a substantially circular or substantially polygonal cross-sectional shape can stably support the second movable electrode 122.
（壓力傳感器100的製造步驟） 圖6A～圖8B為表示壓力傳感器100的製造步驟的一例的圖。以下，參照圖6A～圖8B對壓力傳感器100的製造步驟的一例進行說明。(Manufacturing Process of Pressure Sensor 100) FIGS. 6A to 8B are diagrams showing an example of a manufacturing process of the pressure sensor 100. An example of a manufacturing process of the pressure sensor 100 will be described below with reference to FIGS. 6A to 8B.
（固定基板部20的製造步驟） 圖6A～圖6E表示固定基板部20的製造步驟的一例。圖6A中，於基板部21的與可動部10相向的面上形成固定電極22。繼而，圖6B中，以覆蓋固定電極22的方式形成絕緣膜231。進而，圖6B中，於絕緣膜231的與可動部10相向的面上形成抗蝕膜51。圖6C中，對抗蝕膜51使用形成有所需圖案的光罩進行光抗蝕，由此於絕緣膜231上形成既定圖案的抗蝕膜51。圖6D中進行蝕刻處理，進而將抗蝕膜51去除，由此形成絕緣部23。圖6E中，於絕緣部23的與可動部10相向的面上形成固定基板側鍍覆部24。於圖6E所例示的步驟中，於不形成固定基板側鍍覆部24的區域中進行抗鍍後進行鍍覆處理，由此於所需區域形成固定基板側鍍覆部24。再者，固定基板側鍍覆部24的形成亦可藉由濺鍍而形成。即，亦可利用濺鍍裝置於絕緣部23的與可動部10相向的面上將鍍覆層成膜後，塗佈抗蝕劑並進行蝕刻，藉此形成固定基板側鍍覆部24的圖案。(Manufacturing Process of the Fixed Substrate Section 20) FIGS. 6A to 6E show an example of a manufacturing process of the fixed substrate section 20. In FIG. 6A, a fixed electrode 22 is formed on a surface of the substrate portion 21 that faces the movable portion 10. Next, in FIG. 6B, an insulating film 231 is formed so as to cover the fixed electrode 22. Further, in FIG. 6B, a resist film 51 is formed on a surface of the insulating film 231 facing the movable portion 10. In FIG. 6C, the resist film 51 is subjected to photoresist using a photomask having a desired pattern formed thereon, thereby forming a predetermined pattern of the resist film 51 on the insulating film 231. In FIG. 6D, an etching process is performed, and the resist film 51 is further removed, thereby forming the insulating portion 23. In FIG. 6E, a fixed substrate-side plated portion 24 is formed on a surface of the insulating portion 23 facing the movable portion 10. In the step illustrated in FIG. 6E, plating is performed after anti-plating is performed in an area where the fixed substrate-side plated portion 24 is not formed, thereby forming the fixed substrate-side plated portion 24 in a desired area. The formation of the fixed substrate-side plated portion 24 may be performed by sputtering. That is, it is also possible to form a pattern of the fixed substrate-side plated portion 24 by forming a plating layer on the surface of the insulating portion 23 facing the movable portion 10 by using a sputtering device, and then applying a resist and etching. .
（可動部10的製造步驟） 圖7A及圖7B表示可動部10的製造步驟的一例。圖7A中，於具有可撓性的片材基板11的與固定基板部20相向的面上形成可動電極12。進而，對可動電極12的與固定基板部20相向的面進行鍍覆處理，由此形成可動部側鍍覆部14。圖7B中，於可動部側鍍覆部14的與固定基板部20相向的面上，對相當於第一可動電極121及第二可動電極122的區域進行抗蝕後進行蝕刻，由此形成第一可動電極121及第二可動電極122。(Manufacturing Process of the Movable Portion 10) FIGS. 7A and 7B show an example of a manufacturing process of the movable portion 10. In FIG. 7A, the movable electrode 12 is formed on a surface of the flexible sheet substrate 11 that faces the fixed substrate portion 20. Furthermore, the surface of the movable electrode 12 facing the fixed substrate portion 20 is subjected to a plating treatment, thereby forming the movable portion-side plated portion 14. In FIG. 7B, the areas corresponding to the first movable electrode 121 and the second movable electrode 122 are etched on the surface of the movable portion-side plated portion 14 facing the fixed substrate portion 20 and then etched to form a first A movable electrode 121 and a second movable electrode 122.
（可動部10與固定基板部20的接合步驟） 圖8A及圖8B為表示將固定基板部20與可動部10接合的步驟的一例。圖8A中，將可動部10與固定基板部20接合。接合方法並無特別限定。可動部10與固定基板部20例如可藉由常溫接合而接合。常溫接合中，例如針對可動部10的可動部側鍍覆部14的與固定基板部20相向的面及固定基板部20的固定基板側鍍覆部24的與可動部10相向的面，進行使該面平滑的處理及自該面去除雜質而清潔的處理。若經實施該些處理的可動部側鍍覆部14與固定基板側鍍覆部24接觸，則藉由在可動部側鍍覆部14與固定基板側鍍覆部24之間發揮作用的分子力而將可動部10與固定基板部20接合。圖8B中，例示以共有片材基板11的形式將藉由圖6A～圖8A的步驟所製造的壓力傳感器100排列三個的狀況。壓力傳感器100可如圖8B所例示，藉由共有片材基板11排列多個壓力傳感器100，而擴大作為壓力檢測的對象的面積。(Joining procedure of the movable portion 10 and the fixed substrate portion 20) FIGS. 8A and 8B show an example of a procedure of joining the fixed substrate portion 20 and the movable portion 10. In FIG. 8A, the movable portion 10 and the fixed substrate portion 20 are joined. The joining method is not particularly limited. The movable portion 10 and the fixed substrate portion 20 can be joined by, for example, normal temperature joining. During normal temperature bonding, for example, the surface of the movable portion-side plated portion 14 of the movable portion 10 that faces the fixed substrate portion 20 and the surface of the fixed substrate-side plated portion 24 of the fixed substrate portion 20 that faces the movable portion 10 are bonded. The surface is smoothed and the surface is cleaned by removing impurities from the surface. When the movable portion-side plated portion 14 and the fixed substrate-side plated portion 24 subjected to these processes are brought into contact with each other, a molecular force acting between the movable portion-side plated portion 14 and the fixed substrate-side plated portion 24 is applied. On the other hand, the movable portion 10 is joined to the fixed substrate portion 20. FIG. 8B illustrates a case where three pressure sensors 100 manufactured by the steps of FIGS. 6A to 8A are arranged in the form of a common sheet substrate 11. As illustrated in FIG. 8B, the pressure sensor 100 can expand the area to be a target of pressure detection by arranging a plurality of pressure sensors 100 in a common sheet substrate 11.
＜變形例＞ 再者，所述實施形態僅對本發明進行例示性說明，本發明不限定於所述具體形態。本發明可於其技術思想的範圍內進行各種變更及組合。例如，所述實施形態中，藉由多工器301選擇自多個壓力傳感器100a、壓力傳感器100b、壓力傳感器100c所得的訊號後輸入至轉換器302，輸出與此相關的壓力值，但也可不進行此種選擇而將多個壓力傳感器100a、壓力傳感器100b、壓力傳感器100c的壓力值分別輸出。<Modifications> Furthermore, the embodiments described above are only illustrative of the present invention, and the present invention is not limited to the specific embodiments. The present invention can be variously modified and combined within the scope of its technical idea. For example, in the embodiment described above, the signals obtained from the plurality of pressure sensors 100a, 100b, and 100c are selected by the multiplexer 301 and then input to the converter 302 to output the pressure value related thereto. This selection is performed to output the pressure values of the plurality of pressure sensors 100a, 100b, and 100c, respectively.
另外，所述實施形態中，壓力傳感器100a、壓力傳感器100b、壓力傳感器100c共有片材基板11且以陣列狀配置成一行，但也可將其設置多行而將壓力傳感器配置成格子狀。Moreover, in the said embodiment, although the pressure sensor 100a, the pressure sensor 100b, and the pressure sensor 100c shared the sheet | seat board | substrate 11 and were arrange | positioned in an array, it may arrange | position a plurality of lines, and arrange | position a pressure sensor in a grid | lattice form.
另外，亦可不於可動部10與固定基板部20的接合步驟中進行使可動部側鍍覆部14及固定基板側鍍覆部24的表面平坦化的處理，而於可動部10、固定基板部20各自的製造步驟中確保表面的平坦性。例如，亦可於可動部10的製造步驟中，針對片材基板11將成為可動電極12的金屬（例如銅）進行化學機械研磨（Chemical Mechanical Polishing，CMP）處理而使其平坦，並於其上藉由濺鍍裝置而將可動部側鍍覆部14成膜。In addition, the process of flattening the surfaces of the movable portion-side plated portion 14 and the fixed substrate-side plated portion 24 in the step of bonding the movable portion 10 and the fixed substrate portion 20 may not be performed on the movable portion 10 and the fixed substrate portion. The flatness of the surface is ensured in each of the respective manufacturing steps. For example, in the manufacturing process of the movable portion 10, a metal substrate (for example, copper) that becomes the movable electrode 12 may be subjected to a chemical mechanical polishing (CMP) treatment to make the sheet substrate 11 flat, and then be placed on The movable portion-side plated portion 14 is formed by a sputtering device.
9、100、100a、100b、100c：壓力傳感器 10：可動部 11：片材基板 12、911：可動電極 14：可動部側鍍覆部 15、912：訊號線 16、16a、16b、913：GND線 18：第一中空部 19：第二中空部 20：固定基板部 21：基板部 22、921：固定電極 23、922：絕緣部 24：固定基板側鍍覆部 51：抗蝕膜 121、911a：第一可動電極 122、911b：第二可動電極 141：第一鍍覆部 142：第二鍍覆部 241：第三鍍覆部 242：第四鍍覆部 200、950：連接器 231：絕緣膜 300：靜電電容測定電路 301：多工器 302：轉換器 910：柔性基板 920：硬質基板 923：金屬部 930：中空部 S：面積 d：距離9, 100, 100a, 100b, 100c: pressure sensor 10: movable section 11: sheet substrate 12, 911: movable electrode 14: movable section-side plating section 15, 912: signal line 16, 16a, 16b, 913: GND Line 18: first hollow portion 19: second hollow portion 20: fixed substrate portion 21: substrate portion 22, 921: fixed electrode 23, 922: insulating portion 24: fixed substrate-side plating portion 51: resist film 121, 911a : First movable electrode 122, 911b: second movable electrode 141: first plating portion 142: second plating portion 241: third plating portion 242: fourth plating portion 200, 950: connector 231: insulation Film 300: Capacitance measurement circuit 301: Multiplexer 302: Converter 910: Flexible substrate 920: Hard substrate 923: Metal portion 930: Hollow portion S: Area d: Distance
圖1A為表示應用例的壓力傳感器的一例的概略平面圖。圖1B為表示應用例的壓力傳感器的一例的概略剖面圖。 圖2為表示實施形態的壓力傳感器的一例的第一圖。 圖3為表示實施形態的壓力傳感器的一例的第二圖。 圖4為表示靜電電容測定電路的構成的一例的圖。 圖5A為表示對壓力傳感器施加壓力之前的狀態的一例的圖。圖5B為表示對壓力傳感器施加壓力時的狀態的一例的圖。 圖6A為表示實施形態的壓力傳感器的製造步驟的一例的第一圖。圖6B為表示實施形態的壓力傳感器的製造步驟的一例的第二圖。圖6C為表示實施形態的壓力傳感器的製造步驟的一例的第三圖。圖6D為表示實施形態的壓力傳感器的製造步驟的一例的第四圖。圖6E為表示實施形態的壓力傳感器的製造步驟的一例的第五圖。 圖7A為表示實施形態的壓力傳感器的製造步驟的一例的第六圖。圖7B為表示實施形態的壓力傳感器的製造步驟的一例的第七圖。 圖8A為表示實施形態的壓力傳感器的製造步驟的一例的第八圖。圖8B為表示實施形態的壓力傳感器的製造步驟的一例的第九圖。FIG. 1A is a schematic plan view showing an example of a pressure sensor of an application example. FIG. 1B is a schematic cross-sectional view showing an example of a pressure sensor of an application example. FIG. 2 is a first diagram showing an example of a pressure sensor according to the embodiment. FIG. 3 is a second diagram showing an example of a pressure sensor according to the embodiment. FIG. 4 is a diagram showing an example of a configuration of a capacitance measurement circuit. FIG. 5A is a diagram showing an example of a state before pressure is applied to the pressure sensor. 5B is a diagram showing an example of a state when pressure is applied to the pressure sensor. FIG. 6A is a first diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. FIG. 6B is a second diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. FIG. 6C is a third diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. 6D is a fourth diagram showing an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. FIG. 6E is a fifth diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. 7A is a sixth diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. FIG. 7B is a seventh diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. FIG. 8A is an eighth view showing an example of a manufacturing process of the pressure sensor according to the embodiment. FIG. FIG. 8B is a ninth diagram illustrating an example of a manufacturing process of the pressure sensor according to the embodiment.
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| JPH0875571A (en) * | 1994-09-08 | 1996-03-22 | Omron Corp | Capacitive pressure sensor and method for manufacturing it, and sphygmomanometer |
| US5656785A (en) * | 1995-08-07 | 1997-08-12 | The Charles Stark Draper Laboratory, Inc. | Micromechanical contact load force sensor for sensing magnitude and distribution of loads and tool employing micromechanical contact load force sensor |
| JP3333959B2 (en) * | 1998-08-20 | 2002-10-15 | 日本電信電話株式会社 | Sensor circuit for surface shape recognition |
| JP2005207993A (en) * | 2004-01-26 | 2005-08-04 | Alps Electric Co Ltd | Bearing pressure distribution sensor, and manufacturing method for bearing pressure distribution sensor |
| JP2014142193A (en) * | 2013-01-22 | 2014-08-07 | Oga Inc | Load distribution detector |
| CN109073486B (en) * | 2017-03-06 | 2019-11-26 | 三角力量管理株式会社 | Force sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090273909A1 (en) * | 2004-09-10 | 2009-11-05 | Samsung Electronics Co., Ltd. | Flexible device, flexible pressure sensor, and fabrication method thereof |
| TW201102632A (en) * | 2009-07-13 | 2011-01-16 | Univ Nat Taiwan | Capacity pressure sensor and method for fabricating thereof |
| CN204881958U (en) * | 2015-05-29 | 2015-12-16 | 歌尔声学股份有限公司 | Accurate difference capacitanc MEMS pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6791101B2 (en) | 2020-11-25 |
| JP2019090729A (en) | 2019-06-13 |
| TW201923322A (en) | 2019-06-16 |
| WO2019098001A1 (en) | 2019-05-23 |
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