TWI664885B - Fabricating method of double-sided circuit board and double-sided circuit board - Google Patents
Fabricating method of double-sided circuit board and double-sided circuit board Download PDFInfo
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- TWI664885B TWI664885B TW107132544A TW107132544A TWI664885B TW I664885 B TWI664885 B TW I664885B TW 107132544 A TW107132544 A TW 107132544A TW 107132544 A TW107132544 A TW 107132544A TW I664885 B TWI664885 B TW I664885B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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Abstract
一種雙面線路基板的製造方法與雙面線路基板,製造方法包括:提供基板,其中基板包括第一表面與第二表面,且第一表面與第二表面彼此相對;形成第一對位標記與第一圖案化線路於第一表面上;以光學定位裝置感測第一對位標記的位置;根據第一對位標記的位置形成第二對位標記於第二表面上;以光學定位裝置感測第二對位標記的位置;以及根據第二對位標記的位置形成第二圖案化線路於第二表面上,其中第二圖案化線路在基板的法線方向上對齊第一圖案化線路。A manufacturing method of a double-sided circuit substrate and a double-sided circuit substrate. The manufacturing method includes: providing a substrate, wherein the substrate includes a first surface and a second surface, and the first surface and the second surface are opposite to each other; forming a first alignment mark and The first patterned line is on the first surface; the position of the first alignment mark is sensed by the optical positioning device; the second alignment mark is formed on the second surface according to the position of the first alignment mark; Measuring the position of the second alignment mark; and forming a second patterned line on the second surface according to the position of the second alignment mark, wherein the second patterned line is aligned with the first patterned line in a normal direction of the substrate.
Description
本發明是關於一種線路基板的製造方法,且特別是關於一種雙面線路基板的製造方法與雙面線路基板。The present invention relates to a method for manufacturing a circuit substrate, and more particularly, to a method for manufacturing a double-sided circuit substrate and a double-sided circuit substrate.
現有的顯示裝置包括顯示面板,顯示面板包括基板、多個畫素單元與多個邊緣元件,基板包括顯示區與圍繞顯示區的邊緣區,畫素單元是設置在顯示區,而邊緣元件則是設置在邊緣區,邊緣元件會進一步連接對應的畫素單元,邊緣元件可用來驅動畫素單元或也可作為畫素單元的接地線路。顯示面板的顯示區可呈現影像,而邊緣區則是屬於暗區,無法呈現影像。因此,顯示裝置會具有邊框以遮蓋邊緣區,而僅露出顯示區。此外,現在還有一種拼接式顯示裝置,此種拼接式顯示裝置具有多個顯示面板,這些顯示面板會以矩陣方式排列並拼接起來,以呈現大尺寸的影像。The existing display device includes a display panel. The display panel includes a substrate, a plurality of pixel units, and a plurality of edge elements. The substrate includes a display area and an edge area surrounding the display area. The pixel unit is disposed in the display area, and the edge elements are Set in the edge area, the edge element will be further connected to the corresponding pixel unit. The edge element can be used to drive the pixel unit or can also be used as the ground line of the pixel unit. The display area of the display panel can present an image, while the edge area is a dark area and cannot present an image. Therefore, the display device may have a frame to cover the edge region, and only the display region is exposed. In addition, there is also a spliced display device. This spliced display device has multiple display panels. These display panels are arranged and spliced together in a matrix manner to present a large-sized image.
以基板的表面面積來看,若邊緣區的佔比愈大,則顯示裝置的邊框會愈粗,或者拼接式顯示裝置的相鄰兩顯示面板之間的暗區則會愈明顯。為了減少邊緣區的佔比,現有一種雙面基板,畫素單元是設置在雙面基板的上表面,而至少一部分的邊緣元件則是設置於雙面基板的下表面。如此一來,邊緣區所需設置的元件變少,而邊緣區的佔比也可降低。Judging from the surface area of the substrate, if the proportion of the edge area is larger, the frame of the display device will be thicker, or the dark area between two adjacent display panels of the spliced display device will be more obvious. In order to reduce the proportion of the edge area, there is a conventional double-sided substrate. The pixel unit is disposed on the upper surface of the double-sided substrate, and at least part of the edge elements are disposed on the lower surface of the double-sided substrate. In this way, fewer components need to be provided in the edge area, and the proportion of the edge area can be reduced.
現有的雙面基板,其可將畫素單元與部份邊緣元件分別設置於基板的上表面與下表面,藉此減少基板的邊緣區的佔比。不過,由於畫素單元與對應的邊緣元件之間需要電性連接,因此分別位在上、下表面的畫素單元與對應的邊緣元件必須要能彼此精準對位。現有技術中僅在上、下表面的其中一表面上有對位標記可供對位,以致於上、下表面的元件難以精準對位而可能導致電性連接失敗。此外,上、下表面的會遮擋光線的元件無法精確重疊,而造成遮光區域增加,影響最終產品的影像呈現效果。In the existing double-sided substrate, the pixel unit and some edge elements can be respectively disposed on the upper surface and the lower surface of the substrate, thereby reducing the proportion of the edge region of the substrate. However, since the pixel unit and the corresponding edge element need to be electrically connected, the pixel unit and the corresponding edge element located on the upper and lower surfaces, respectively, must be accurately aligned with each other. In the prior art, there are only alignment marks on one of the upper and lower surfaces for alignment, so that it is difficult to accurately align the components on the upper and lower surfaces, which may cause electrical connection failure. In addition, the components on the upper and lower surfaces that can block light cannot be accurately overlapped, resulting in an increase in light-shielding areas and affecting the image presentation effect of the final product.
本發明的至少一實施例提出一種雙面線路基板的製造方法與雙面線路基板,以使雙面線路基板的相對二表面上的元件能精確定位。At least one embodiment of the present invention provides a method for manufacturing a double-sided circuit substrate and a double-sided circuit substrate, so that components on two opposite surfaces of the double-sided circuit substrate can be accurately positioned.
本發明的至少一實施例提出一種雙面線路基板的製造方法與雙面線路基板,以避免相對二表面上的元件的電性連接失敗,並避免造成遮光區域增加。At least one embodiment of the present invention provides a method for manufacturing a double-sided circuit substrate and a double-sided circuit substrate, so as to avoid electrical connection failure of components on opposite two surfaces, and avoid an increase in a light-shielding area.
本發明的至少一實施例提出一種雙面線路基板的製造方法,其包括:提供基板,其中基板包括第一表面與第二表面,且第一表面與第二表面彼此相對;形成第一對位標記與第一圖案化線路於第一表面上;以光學定位裝置感測第一對位標記的位置;根據第一對位標記的位置形成第二對位標記於第二表面上;以光學定位裝置感測第二對位標記的位置;以及根據第二對位標記的位置形成第二圖案化線路於第二表面上,其中第二圖案化線路在基板的法線方向上對齊第一圖案化線路。At least one embodiment of the present invention provides a method for manufacturing a double-sided circuit substrate, which includes: providing a substrate, wherein the substrate includes a first surface and a second surface, and the first surface and the second surface are opposite to each other; forming a first alignment The mark and the first patterned line are on the first surface; the position of the first registration mark is sensed by an optical positioning device; a second registration mark is formed on the second surface according to the position of the first registration mark; The device senses the position of the second alignment mark; and forms a second patterned line on the second surface according to the position of the second alignment mark, wherein the second patterned line is aligned with the first patterned line in a normal direction of the substrate. line.
本發明的至少一實施例提出一種雙面線路基板,其包括基板、第一對位標記、第一圖案化線路、第二對位標記與第二圖案化線路。基板包括第一表面與第二表面,第一表面與第二表面彼此相對。第一對位標記位於第一表面上,第一圖案化線路位於第一表面上。第二對位標記位於第二表面上,其中第二對位標記在基板的法線方向上的投影相關於第一對位標記。第二圖案化線路位於第二表面上,其中第二圖案化線路在法線方向上對齊第一圖案化線路。At least one embodiment of the present invention provides a double-sided circuit substrate, which includes a substrate, a first alignment mark, a first patterned circuit, a second alignment mark, and a second patterned circuit. The substrate includes a first surface and a second surface, and the first surface and the second surface are opposed to each other. The first alignment mark is located on the first surface, and the first patterned line is located on the first surface. The second registration mark is located on the second surface, wherein the projection of the second registration mark in the normal direction of the substrate is related to the first registration mark. The second patterned line is located on the second surface, wherein the second patterned line is aligned with the first patterned line in a normal direction.
綜上所述,根據本發明所提出一種雙面線路基板的製造方法與雙面線路基板的諸多實施例,使得在雙面線路基板的製程中,可針對相對二表面上的元件精確定位,使相對二表面上的對應元件能彼此精確對齊,從而避免相對二表面上的對應元件的電性連接失敗的可能,並且還能避免造成遮光區域增加。In summary, according to the present invention, a method for manufacturing a double-sided circuit substrate and various embodiments of the double-sided circuit substrate enable precise positioning of components on opposite two surfaces during the manufacturing process of the double-sided circuit substrate, so that The corresponding components on the opposite two surfaces can be accurately aligned with each other, thereby avoiding the possibility of failure of the electrical connection of the corresponding components on the opposite two surfaces, and also preventing the increase of the light-shielding area.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟悉相關技術者暸解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技術者可輕易地理解本發明相關之目的及優點。The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient for anyone familiar with the relevant technology to understand and implement the technical content of the present invention, and according to the content disclosed in this specification, the scope of patent applications and the drawings. Anyone skilled in the relevant art can easily understand the related objects and advantages of the present invention.
請參照圖1與圖2,圖1所示為本發明一實施例的雙面線路基板20的頂視示意圖,圖2所示為圖1的雙面線路基板20的底視示意圖。在本實施例中,雙面線路基板20是用來製作顯示面板,但不限於此。雙面線路基板20包括基板100、第一對位標記210與第二對位標記220。基板100包括第一表面110與第二表面120,且第一表面110與第二表面120彼此相對。第一對位標記210位於第一表面110上,且第二對位標記220位於第二表面120上。在本實施例中,基板100可區分為佈線區130與邊緣區140。佈線區130可用來設置可用於顯示影像的電子電路模組,諸如顯示面板的畫素單元與其包括的主動元件。邊緣區140環繞佈線區130,且邊緣區140設置有第一對位標記210與第二對位標記220。Please refer to FIGS. 1 and 2. FIG. 1 is a schematic top view of a double-sided circuit substrate 20 according to an embodiment of the present invention, and FIG. 2 is a schematic bottom view of the double-sided circuit substrate 20 of FIG. 1. In this embodiment, the double-sided circuit substrate 20 is used to make a display panel, but is not limited thereto. The double-sided circuit substrate 20 includes a substrate 100, a first alignment mark 210 and a second alignment mark 220. The substrate 100 includes a first surface 110 and a second surface 120, and the first surface 110 and the second surface 120 are opposed to each other. The first registration mark 210 is located on the first surface 110, and the second registration mark 220 is located on the second surface 120. In this embodiment, the substrate 100 can be divided into a wiring region 130 and an edge region 140. The wiring area 130 can be used to set an electronic circuit module that can be used for displaying images, such as a pixel unit of a display panel and an active component included in the pixel unit. The edge region 140 surrounds the wiring region 130, and the edge region 140 is provided with a first alignment mark 210 and a second alignment mark 220.
如圖1與圖2所示,在本實施例中,佈線區130可區分為四個面板區150,這些面板區150可分別被裁切為獨立的面板,這些獨立的面板可分別作為顯示裝置的單一顯示面板,也可作為拼接式顯示裝置的多個以矩陣方式拼接的顯示面板。並且,在雙面線路基板20被進一步裁切以形成顯示面板的製程中,邊緣區140會被裁切掉,而只有面板區150會被留下來作為顯示面板,因此,邊緣區140的第一對位標記210與第二對位標記220也會跟著被移除而不會作為顯示面板的一部分。在一些實施例中,佈線區130亦可區分為二個、三個、五個或六個以上等各種數量的面板區150,並且各面板區150可分別被裁切為獨立的面板以個別作為單一個顯示裝置的顯示面板;或者,佈線區130也可僅區分為單一的面板區150。As shown in FIG. 1 and FIG. 2, in this embodiment, the wiring area 130 can be divided into four panel areas 150, and these panel areas 150 can be respectively cut into independent panels, and these independent panels can be used as display devices respectively. The single display panel can also be used as multiple display panels that are spliced in a matrix in a spliced display device. Moreover, in the process of further cutting the double-sided circuit substrate 20 to form a display panel, the edge region 140 will be cut away, and only the panel region 150 will be left as a display panel. The registration mark 210 and the second registration mark 220 will also be removed without being part of the display panel. In some embodiments, the wiring area 130 may also be divided into various numbers of panel areas 150 such as two, three, five, or more than six, and each panel area 150 may be individually cut into independent panels to serve as individual panels. A display panel of a single display device; or, the wiring area 130 may be divided into only a single panel area 150.
請再參照圖3,圖3所示為圖1的3-3線段處的剖面示意圖。雙面線路基板20更包括第一圖案化線路300與第二圖案化線路400,第一圖案化線路300位於第一表面110上,且第二圖案化線路400位於第二表面120上。如圖1至圖3所示,在本實施例中,第一圖案化線路300是位於佈線區130的第一表面110上,而第二圖案化線路400是位於佈線區130的第二表面120上,且第二圖案化線路400是在基板100的法線方向ND上對齊第一圖案化線路300。並且,第一對位標記210是設置於邊緣區140的第一表面110上,而第二對位標記220是設置於邊緣區140的第二表面120上。Please refer to FIG. 3 again, which is a schematic cross-sectional view at line 3-3 in FIG. 1. The double-sided circuit substrate 20 further includes a first patterned circuit 300 and a second patterned circuit 400. The first patterned circuit 300 is located on the first surface 110 and the second patterned circuit 400 is located on the second surface 120. As shown in FIG. 1 to FIG. 3, in this embodiment, the first patterned wiring 300 is located on the first surface 110 of the wiring area 130, and the second patterned wiring 400 is located on the second surface 120 of the wiring area 130. And the second patterned line 400 is aligned with the first patterned line 300 in the normal direction ND of the substrate 100. In addition, the first alignment mark 210 is disposed on the first surface 110 of the edge region 140, and the second alignment mark 220 is disposed on the second surface 120 of the edge region 140.
如圖1至圖3所示,在本實施例中,第二對位標記220朝基板100的法線方向ND的投影相關於第一對位標記210。其中,第一對位標記210與第二對位標記220沿法線方向ND在第一表面110上的投影可參照圖1所示在XY平面上的視圖,而第一對位標記210與第二對位標記220沿法線方向ND在第二表面120上的投影可參照圖2所示在XY平面上的視圖。舉例來說,第一對位標記210與第二對位標記220在XY平面上的投影會彼此鄰近,且第一對位標記210與第二對位標記220是位於基板100在XY平面上的特定位置。在本實施例中,第一對位標記210與第二對位標記220各有四個,四個第一對位標記210與四個第二對位標記220分別位於基板100在XY平面上的四角,且每一第一對位標記210是在XY平面上鄰近對應的第二對位標記220。As shown in FIGS. 1 to 3, in this embodiment, the projection of the second registration mark 220 toward the normal direction ND of the substrate 100 is related to the first registration mark 210. The projection of the first registration mark 210 and the second registration mark 220 on the first surface 110 along the normal direction ND can refer to the view on the XY plane shown in FIG. 1, and the first registration mark 210 and the first registration mark 210 For the projection of the two registration marks 220 on the second surface 120 along the normal direction ND, refer to the view on the XY plane shown in FIG. 2. For example, the projections of the first registration mark 210 and the second registration mark 220 on the XY plane are adjacent to each other, and the first registration mark 210 and the second registration mark 220 are located on the substrate 100 on the XY plane. Specific location. In this embodiment, there are four first alignment marks 210 and two second alignment marks 220, and four first alignment marks 210 and four second alignment marks 220 are respectively located on the XY plane of the substrate 100. Four corners, and each first alignment mark 210 is adjacent to the corresponding second alignment mark 220 on the XY plane.
在一些實施例中,第一對位標記210至少有二個,且二第一對位標記210分別位於基板100的對角線上的二邊角;並且,第二對位標記220也至少有二個,且二第二對位標記220分別位於基板100的對角線上的二邊角。舉例來說,二第一對位標記210與二第二對位標記220可分別設置於圖1所示的基板100的左上角與右下角。第一對位標記210與第二對位標記220各有至少兩個的設置,可確保定位與對位的精確度可達到雙面線路基板20的製程所需的基本要求。在一些實施例中,在XY平面的每個特定位置上,第一對位標記210與第二對位標記220亦可分別具有一個、三個或五個以上。In some embodiments, there are at least two first alignment marks 210, and the two first alignment marks 210 are respectively located at two corners on the diagonal of the substrate 100; and the second alignment marks 220 also have at least two And two second alignment marks 220 are respectively located at two corners on the diagonal line of the substrate 100. For example, two first alignment marks 210 and two second alignment marks 220 may be respectively disposed at the upper left corner and the lower right corner of the substrate 100 shown in FIG. 1. The first alignment mark 210 and the second alignment mark 220 are each provided with at least two settings, which can ensure that the positioning and alignment accuracy can meet the basic requirements required for the manufacturing process of the double-sided circuit substrate 20. In some embodiments, at each specific position on the XY plane, the first alignment mark 210 and the second alignment mark 220 may have one, three, or more than five, respectively.
如圖3所示,在本實施例中,第一對位標記210與第二對位標記220朝基板100的法線方向ND的投影不重疊,如此有利於在製程中根據第一對位標記210與第二對位標記220進行對位,相關說明詳述於後。As shown in FIG. 3, in this embodiment, the projections of the first registration mark 210 and the second registration mark 220 toward the normal direction ND of the substrate 100 do not overlap, so it is advantageous to use the first registration mark in the manufacturing process. 210 is aligned with the second alignment mark 220, and the related description is detailed later.
如圖1至圖3所示,在本實施例中,第一對位標記210包括複數間隔排列的方塊211,第一對位標記210的多個方塊211彼此等距間隔排列,且第一對位標記210的方塊211在X方向與Y方向上各設置有兩個或兩個以上。舉例來說,第一對位標記210包括四個方塊211,其中有三個方塊211是沿著Y方向等距間隔排列,而其中有二個方塊211則是沿著X方向等距間隔排列。在第一圖案化線路300的製程中,生產設備需要先透過第一對位標記210定位,以將第一圖案化線路300對位並形成於第一表面110的精確位置。此外,在第二對位標記220的製程中,生產設備也需要先透過第一對位標記210定位,以將第二對位標記220對位並形成於第二表面120的精確位置。As shown in FIG. 1 to FIG. 3, in this embodiment, the first alignment mark 210 includes a plurality of squares 211 arranged at an interval, a plurality of squares 211 of the first alignment mark 210 are arranged at an equal interval from each other, and the first pair The square 211 of the bit mark 210 is provided with two or more in each of the X direction and the Y direction. For example, the first alignment mark 210 includes four squares 211, of which three squares 211 are arranged at regular intervals in the Y direction, and two squares 211 are arranged at regular intervals in the X direction. In the manufacturing process of the first patterned circuit 300, the production equipment needs to be positioned through the first alignment mark 210 first, so as to align the first patterned circuit 300 and form the precise position on the first surface 110. In addition, in the manufacturing process of the second registration mark 220, the production equipment also needs to first locate through the first registration mark 210, so as to align the second registration mark 220 and form the precise position on the second surface 120.
舉例來說,生產設備可具有光學定位裝置500(請參照圖6),此種光學定位裝置500例如但不限於是雷射測距裝置,此種雷射測距裝置可在XY平面上掃描基板100的第一表面110。當雷射測距裝置在第一表面110上掃描時,波形不會有起伏,當雷射測距裝置掃描到第一對位標記210的任一方塊211時,會產生一個弦波,也就是說,當雷射測距裝置沿著X方向經過第一對位標記210時,會在短時間內連續掃到第一對位標記210的兩個方塊211而產生兩個弦波,藉以生產設備可確定此處有對位標記存在,進而自動根據這兩個弦波判斷第一對位標記210在X方向上的位置;而當雷射測距裝置沿著Y方向經過第一對位標記210時,會在短時間內連續掃到第一對位標記210的三個方塊211而產生三個弦波,藉此生產設備可確定此處有對位標記存在,進而自動根據這三個弦波判斷第一對位標記210在Y方向上的位置。藉此,生產設備可確認第一對位標記210在XY平面的座標並加以定位。For example, the production equipment may have an optical positioning device 500 (refer to FIG. 6). Such an optical positioning device 500 is, for example but not limited to, a laser ranging device, which can scan a substrate on the XY plane. 100 的 第一 表面 110。 100 of the first surface 110. When the laser ranging device scans on the first surface 110, the waveform will not fluctuate. When the laser ranging device scans any square 211 of the first registration mark 210, a sine wave is generated, that is, That is, when the laser ranging device passes the first alignment mark 210 along the X direction, it will continuously scan the two squares 211 of the first alignment mark 210 in a short time to generate two sine waves, thereby producing equipment. It can be determined that a registration mark exists here, and then the position of the first registration mark 210 in the X direction is automatically determined according to the two sine waves; and when the laser ranging device passes the first registration mark 210 in the Y direction When the three squares 211 of the first alignment mark 210 are continuously scanned in a short time, three sine waves are generated, so that the production equipment can determine that there are alignment marks here, and then automatically based on these three sine waves The position of the first registration mark 210 in the Y direction is determined. Thereby, the production equipment can confirm and position the coordinates of the first registration mark 210 in the XY plane.
在本實施例中,第一對位標記210的方塊211在X方向與Y方向上各有兩個以上的設置,可避免生產設備誤判的情形發生。例如,若雷射測距裝置沿著X方向或Y方向掃描,並在一定時間內(或雷射測距裝置所移動的一定距離內)內只產生一個弦波,這表示雷射測距裝置所感測到的並非第一對位標記210,而可能是因為其他凸起物或其他因素導致此弦波反應,因此生產設備可根據內部判斷機制而過濾掉上述此種情況,從而避免誤判。In this embodiment, the square 211 of the first alignment mark 210 has two or more settings in each of the X direction and the Y direction, which can avoid the situation of misjudgment of the production equipment. For example, if the laser ranging device scans in the X or Y direction and generates only one sine wave within a certain time (or within a certain distance moved by the laser ranging device), this means that the laser ranging device What is sensed is not the first alignment mark 210, but may be caused by other protrusions or other factors that cause this sine wave reaction, so the production equipment can filter out such situations according to an internal judgment mechanism to avoid misjudgment.
如圖1至圖3所示,在本實施例中,第二對位標記220也包括複數間隔排列的方塊221,第二對位標記220的多個方塊221彼此等距間隔排列,且第二對位標記220的方塊221在X方向與Y方向上各設置有兩個或兩個以上。舉例來說,第二對位標記220包括三個方塊221,其中有二個方塊221是沿著Y方向等距間隔排列,而其中有二個方塊221則是沿著X方向等距間隔排列。在第二圖案化線路400的製程中,生產設備需要先透過第二對位標記220定位,以將第二圖案化線路400對位並形成於第二表面120的精確位置。生產設備透過第二對位標記220定位的說明可參照前述,且同樣地,在本實施例中,第二對位標記220的方塊221在X方向與Y方向上也各有兩個以上的設置,如此也可避免生產設備誤判的情形發生。As shown in FIG. 1 to FIG. 3, in this embodiment, the second alignment mark 220 also includes a plurality of squares 221 arranged at an interval, a plurality of squares 221 of the second alignment mark 220 are arranged at equal intervals from each other, and the second Two or more squares 221 of the alignment mark 220 are provided in the X direction and the Y direction, respectively. For example, the second alignment mark 220 includes three squares 221, of which two squares 221 are arranged at regular intervals in the Y direction, and two squares 221 are arranged at regular intervals in the X direction. In the manufacturing process of the second patterned circuit 400, the production equipment needs to be positioned through the second alignment mark 220 first, so as to align the second patterned circuit 400 and form the precise position on the second surface 120. The description of the positioning of the production equipment through the second alignment mark 220 can refer to the foregoing, and in the same way, in this embodiment, the square 221 of the second alignment mark 220 has two or more settings in the X direction and the Y direction In this way, the situation of misjudgment of production equipment can be avoided.
在本實施例中,第一對位標記210與第二對位標記220是以方塊211、221作為標記物,且第一對位標記210的方塊211與第二對位標記220的方塊221是在XY平面上的長度與寬度皆為20微米(micrometer)的正方形。在一些實施例中,第一對位標記210與第二對位標記220的標記物亦可採用非正方形的其他種形狀。在本實施例中,第一對位標記210的標記物的數量與第二對位標記220的標記物的數量不相同。例如,第一對位標記210的方塊211有四個,而第二對位標記220的方塊221有三個。在一些實施例中,第一對位標記210的標記物的數量與第二對位標記220的標記物的數量亦可相同。In this embodiment, the first alignment mark 210 and the second alignment mark 220 use squares 211 and 221 as markers, and the square 211 of the first alignment mark 210 and the square 221 of the second alignment mark 220 are A square with a length of 20 micrometers in both the XY plane. In some embodiments, the markers of the first alignment mark 210 and the second alignment mark 220 can also adopt other shapes other than squares. In this embodiment, the number of the markers of the first registration mark 210 and the number of the markers of the second registration mark 220 are different. For example, there are four squares 211 of the first alignment mark 210 and three squares 221 of the second alignment mark 220. In some embodiments, the number of the markers of the first alignment mark 210 and the number of the markers of the second alignment mark 220 may be the same.
如圖3所示,在本實施例中,第一圖案化線路300包括第一線路層310、第一絕緣層320、半導體層330與第二線路層340。第一線路層310包括閘極G,且閘極G鄰接第一表面110。第一絕緣層320鄰接第一表面110且在基板100的法線方向ND上覆蓋閘極G。半導體層330覆蓋第一絕緣層320且在基板100的法線方向ND上重疊閘極G。第二線路層340包括源極S與汲極D,源極S與汲極D覆蓋在半導體層330上,且源極S與汲極D彼此並未直接接觸。源極S與汲極D在基板100的法線方向ND上重疊閘極G,且源極S與汲極D是透過半導體層330而彼此連接。在本實施例中,第一圖案化線路300可作為顯示面板上的用來驅動畫素單元(圖未示)的主動元件,但不限於此。As shown in FIG. 3, in this embodiment, the first patterned circuit 300 includes a first circuit layer 310, a first insulation layer 320, a semiconductor layer 330, and a second circuit layer 340. The first circuit layer 310 includes a gate G, and the gate G is adjacent to the first surface 110. The first insulating layer 320 is adjacent to the first surface 110 and covers the gate electrode G in a normal direction ND of the substrate 100. The semiconductor layer 330 covers the first insulating layer 320 and overlaps the gate electrode G in the normal direction ND of the substrate 100. The second circuit layer 340 includes a source S and a drain D, the source S and the drain D are covered on the semiconductor layer 330, and the source S and the drain D are not in direct contact with each other. The source S and the drain D overlap the gate G in the normal direction ND of the substrate 100, and the source S and the drain D are connected to each other through the semiconductor layer 330. In this embodiment, the first patterned circuit 300 may be used as an active element on a display panel for driving a pixel unit (not shown), but is not limited thereto.
如圖3所示,在本實施例中,第二圖案化線路400包括第三線路層410、第二絕緣層420與第四線路層430。第三線路層410鄰接第二表面120。第二絕緣層420鄰接第二表面120且在基板100的法線方向ND上覆蓋部份的第三線路層410。第四線路層430覆蓋第二絕緣層420,且第四線路層430在基板100的法線方向ND上接觸第三線路層410。在本實施例中,第二圖案化線路400可作為用來驅動第一圖案化線路300的驅動元件,例如是可傳輸訊號或電給閘極G的驅動元件,但不限於此。As shown in FIG. 3, in this embodiment, the second patterned circuit 400 includes a third circuit layer 410, a second insulation layer 420, and a fourth circuit layer 430. The third circuit layer 410 is adjacent to the second surface 120. The second insulating layer 420 is adjacent to the second surface 120 and covers a portion of the third circuit layer 410 in the normal direction ND of the substrate 100. The fourth wiring layer 430 covers the second insulating layer 420, and the fourth wiring layer 430 contacts the third wiring layer 410 in the normal direction ND of the substrate 100. In this embodiment, the second patterned circuit 400 can be used as a driving element for driving the first patterned circuit 300, such as a driving element that can transmit a signal or power to the gate G, but is not limited thereto.
在本實施例中,第一圖案化線路300是電性連接對應的第二圖案化線路400,舉例來說,圖3所示的第一圖案化線路300的第一線路的閘極G與第二圖案化線路400的第三線路層410會彼此電性連接。在一些實施例中,閘極G與第三線路層410可透過穿設於基板100的對應位置的導通孔(圖未示)而彼此電性連接,所述導通孔例如是玻璃導通孔(Through Glass Via,TGV),但不限於此。In this embodiment, the first patterned circuit 300 is a second patterned circuit 400 that is electrically connected. For example, the gate G and the first gate of the first circuit of the first patterned circuit 300 shown in FIG. 3 The third circuit layers 410 of the two patterned circuits 400 are electrically connected to each other. In some embodiments, the gate electrode G and the third circuit layer 410 may be electrically connected to each other through a via hole (not shown) passing through the corresponding position of the substrate 100. The via hole is, for example, a glass via hole (Through Glass Via, TGV), but not limited to this.
如圖3所示,在本實施例中,第一圖案化線路300更包括歐姆接觸層350。歐姆接觸層350覆蓋部份的半導體層330,且歐姆接觸層350位於源極S與半導體層330之間以及汲極D與半導體層330之間。歐姆接觸層350有助於降低源極S與半導體層330之間的電阻以及汲極D與半導體層330之間的電阻。在本實施例中,第一線路層310更包括更包括接地線COM,第二線路層340更包括傳輸線M,而第一圖案化線路300更包括透明導電層360。接地線COM鄰接第一表面110,且第一絕緣層320在基板100的法線方向ND上覆蓋接地線COM,第一圖案化線路300可透過接地線COM接地。傳輸線M鄰接第一絕緣層320且在基板100的法線方向ND上重疊接地線COM。透明導電層360鄰接第一絕緣層320且在基板100的法線方向ND上覆蓋傳輸線M與部份的汲極D,傳輸線M與汲極D可透過透明導電層360而彼此電性連接,傳輸線M與汲極D之間可透過透明導電層360傳輸訊號或電力。As shown in FIG. 3, in this embodiment, the first patterned circuit 300 further includes an ohmic contact layer 350. The ohmic contact layer 350 covers a part of the semiconductor layer 330, and the ohmic contact layer 350 is located between the source S and the semiconductor layer 330 and between the drain D and the semiconductor layer 330. The ohmic contact layer 350 helps reduce the resistance between the source S and the semiconductor layer 330 and the resistance between the drain D and the semiconductor layer 330. In this embodiment, the first circuit layer 310 further includes a ground line COM, the second circuit layer 340 further includes a transmission line M, and the first patterned line 300 further includes a transparent conductive layer 360. The ground line COM is adjacent to the first surface 110, and the first insulation layer 320 covers the ground line COM in the normal direction ND of the substrate 100. The first patterned line 300 can be grounded through the ground line COM. The transmission line M is adjacent to the first insulating layer 320 and overlaps the ground line COM in the normal direction ND of the substrate 100. The transparent conductive layer 360 is adjacent to the first insulating layer 320 and covers the transmission line M and part of the drain electrode D in the normal direction ND of the substrate 100. The transmission line M and the drain electrode D can be electrically connected to each other through the transparent conductive layer 360. The transmission line A signal or power can be transmitted between M and the drain electrode D through the transparent conductive layer 360.
關於前述第二圖案化線路400與第一圖案化線路300是在基板100的法線方向ND上彼此對齊的設置,舉例來說,第二圖案化線路400的第三線路層410與第一圖案化線路300的第一線路層310的閘極G是在基板100的法線方向ND上彼此對齊,且第三線路層410與閘極G是在基板100的法線方向ND上完全重疊,也就是說,第三線路層410與閘極G投影在XY平面上的輪廓,兩者形狀與大小相等且完全重疊,或者輪廓較小者完全重疊於輪廓較大者之內。在閘極G與第三線路層410的材質為不透光的金屬的情況下,閘極G與第三線路層410在基板100的法線方向ND上完全重疊的設置,可使閘極G與第三線路層410在出光方向(相當於基板100的法線方向ND)上會遮擋到光線的面積(以下稱遮光區域)達到最小化。相反地,若閘極G與第三線路層410在基板100的法線方向ND上完全不重疊,則其遮光區域會最大化。而若閘極G與第三線路層410在基板100的法線方向ND上部份重疊,則其遮光區域仍會大於兩者完全重疊時的遮光區域。一般來說,為能使影像更加清晰明亮,會希望能盡可能最小化基板100上的元件所造成的遮光區域。除此之外,為使第三線路層410與閘極G能透過前述基板100上的導通孔而彼此電性連接,第三線路層410與閘極G也需要在製程中在基板100的法線方向ND上彼此精確對齊。Regarding the aforementioned second patterned circuit 400 and the first patterned circuit 300 are disposed in alignment with each other in the normal direction ND of the substrate 100, for example, the third circuit layer 410 and the first pattern of the second patterned circuit 400 The gates G of the first circuit layer 310 of the semiconductor circuit 300 are aligned with each other in the normal direction ND of the substrate 100, and the third circuit layer 410 and the gate G completely overlap in the normal direction ND of the substrate 100. That is, the contours of the third circuit layer 410 and the gate G projected on the XY plane are equal in shape and size and completely overlap, or the smaller contour completely overlaps the larger contour. When the materials of the gate electrode G and the third circuit layer 410 are opaque metal, the gate electrode G and the third circuit layer 410 are completely overlapped with each other in the normal direction ND of the substrate 100, so that the gate electrode G and the third circuit layer 410 can be overlapped. The area (hereinafter referred to as a light-shielding area) that will block light in the light emitting direction (corresponding to the normal direction ND of the substrate 100) with the third circuit layer 410 is minimized. Conversely, if the gate G and the third circuit layer 410 do not overlap at all in the normal direction ND of the substrate 100, the light shielding area thereof is maximized. If the gate electrode G and the third circuit layer 410 partially overlap in the normal direction ND of the substrate 100, the light-shielding area of the gate electrode G and the third circuit layer 410 will still be larger than the light-shielding area when they are completely overlapped. Generally, in order to make the image clearer and brighter, it is desirable to minimize the light-shielding area caused by the components on the substrate 100 as much as possible. In addition, in order for the third circuit layer 410 and the gate G to be electrically connected to each other through the vias on the substrate 100, the third circuit layer 410 and the gate G also need to be on the substrate 100 in the manufacturing process. The line directions ND are precisely aligned with each other.
由上述可知,在雙面線路基板20的製程上,生產設備需要透過第一對位標記210與第二對位標記220來實現精確的定位與對位,以使第一圖案化線路300與第二圖案化線路400能精確的彼此對齊。It can be known from the above that, in the manufacturing process of the double-sided circuit substrate 20, the production equipment needs to realize accurate positioning and alignment through the first alignment mark 210 and the second alignment mark 220, so that the first patterned line 300 and the first The two patterned lines 400 can be accurately aligned with each other.
請參照圖4與圖5至圖14,圖4所示為本發明一實施例的雙面線路基板20的製造方法的流程圖,圖5至圖14所示分別為本發明一實施例的雙面線路基板20的製程示意圖一至十。其中,圖4的各個步驟可分別對應至圖5至圖14,且圖4與圖5至圖14所製作的雙面線路基板20例如但不限於是圖1至圖3的雙面線路基板20,因此相關元件的結構與連接關係可參照圖1至圖3與前述相關說明,於此不再贅述。以下說明雙面線路基板20的製程。Please refer to FIG. 4 and FIGS. 5 to 14. FIG. 4 shows a flowchart of a method for manufacturing a double-sided circuit board 20 according to an embodiment of the present invention. The manufacturing process schematic diagram of the surface circuit substrate 20 is one to ten. Each step in FIG. 4 may correspond to FIGS. 5 to 14, and the double-sided circuit substrate 20 manufactured in FIGS. 4 and 5 to 14 is, for example, but not limited to, the double-sided circuit substrate 20 shown in FIGS. 1 to 3. Therefore, for the structure and connection relationship of related elements, reference may be made to FIG. 1 to FIG. 3 and the foregoing related description, and details are not described herein again. The manufacturing process of the double-sided circuit board 20 will be described below.
如圖5所示,在本實施例中,首先會先提供基板100,例如是一片已預處理的玻璃基板100,並將此基板100固定於生產設備的特定平台(圖未示),例如治具,以便進行後續製程。接著,如圖4與圖5所示,步驟S101為形成金屬層MT1於基板100的第一表面110上。As shown in FIG. 5, in this embodiment, a substrate 100 is first provided, for example, a pre-processed glass substrate 100, and the substrate 100 is fixed on a specific platform (not shown) of the production equipment. Tools for subsequent processes. Next, as shown in FIGS. 4 and 5, step S101 is to form a metal layer MT1 on the first surface 110 of the substrate 100.
如圖4與圖6所示,步驟S103為形成第一對位標記210與第一線路層310於第一表面110上。在此步驟中,金屬層MT1可經過諸如曝光、顯影與蝕刻等圖案化製程,而被圖案化為第一對位標記210與第一線路層310。也就是說,第一線路層310與第一對位標記210是由同樣的金屬層MT1、經過同樣的製程而一起形成,且第一對位標記210與第一線路層310的材質相同。如前述,光學定位裝置500可用來感測此步驟所完成的第一對位標記210,以滿足後續製程的定位與對位需求。在本實施例中,光學定位裝置500可包括雷射測距裝置,但不限於此。As shown in FIGS. 4 and 6, step S103 is to form a first alignment mark 210 and a first circuit layer 310 on the first surface 110. In this step, the metal layer MT1 may be patterned into a first alignment mark 210 and a first circuit layer 310 through a patterning process such as exposure, development, and etching. That is, the first alignment layer 310 and the first alignment mark 210 are formed together by the same metal layer MT1 and the same process, and the materials of the first alignment mark 210 and the first alignment layer 310 are the same. As mentioned above, the optical positioning device 500 can be used to sense the first alignment mark 210 completed in this step to meet the positioning and alignment requirements of subsequent processes. In this embodiment, the optical positioning device 500 may include a laser ranging device, but is not limited thereto.
如圖4與圖7所示,步驟S105為根據第一對位標記210的位置,形成第一圖案化線路300於第一表面110上為。在此步驟中,生產設備可透過光學定位裝置500感測第一對位標記210的位置而加以定位,並根據第一對位標記210的位置對位形成第一圖案化線路300。舉例來說,當第一線路層310與第一對位標記210一起形成後,生產設備即可根據第一對位標記210的位置,經過諸如曝光、顯影與蝕刻等圖案化製程,進一步將第一圖案化線路300的其他元件對位形成於預定的位置,所述其他元件例如是前述的第一絕緣層320、半導體層330、歐姆接觸層350、第二線路層340與透明導電層360。As shown in FIG. 4 and FIG. 7, step S105 is to form a first patterned circuit 300 on the first surface 110 according to the position of the first alignment mark 210. In this step, the production equipment can position the first registration mark 210 through the optical positioning device 500, and form a first patterned circuit 300 according to the position of the first registration mark 210. For example, after the first circuit layer 310 and the first alignment mark 210 are formed together, the production equipment can further perform a patterning process such as exposure, development, and etching according to the position of the first alignment mark 210 to further convert the first The other elements of a patterned circuit 300 are aligned at predetermined positions, such as the aforementioned first insulating layer 320, semiconductor layer 330, ohmic contact layer 350, second circuit layer 340, and transparent conductive layer 360.
在一些實施例中,第一對位標記210亦可先被形成於第一表面110後,再根據第一對位標記210的位置形成第一線路層310與第一圖案化線路300的其他元件;或者,第一對位標記210可與第一圖案化線路300的其他元件任一者一起形成,在此情況下,第一圖案化線路300的形成亦可藉由其他定位工具進行對位。In some embodiments, the first alignment mark 210 may also be formed on the first surface 110, and then the first circuit layer 310 and other elements of the first patterned circuit 300 are formed according to the position of the first alignment mark 210. Or, the first alignment mark 210 may be formed with any of the other elements of the first patterned circuit 300. In this case, the formation of the first patterned circuit 300 may also be aligned by other positioning tools.
如圖4與圖8所示,步驟S107為形成透明膜層TF與光阻層PR1於第二表面120上。在此步驟中,基板100的第一表面110上的第一圖案化線路300已製作完成,因此特定平台上的基板100可被翻轉180度而使第二表面120朝上,以進行後續第二圖案化線路400的製作。接著,會先形成透明膜層TF於第二表面120上,然後再形成光阻層PR1於透明膜層TF上。由於基板100本身與第二表面120上的透明膜層TF是透明的,因此光學定位裝置500可穿透第二表面120的透明膜層TF與基板100而感測到位於第一表面110的第一對位標記210。舉例來說,在基板100被翻轉且第二表面120形成透明膜層TF之後,先以光學定位裝置500穿透第二表面120的透明膜層TF而感測第一對位標記210並加以定位,再形成光阻層PR1,接著進行後續製程。As shown in FIGS. 4 and 8, step S107 is forming a transparent film layer TF and a photoresist layer PR1 on the second surface 120. In this step, the first patterned circuit 300 on the first surface 110 of the substrate 100 has been completed, so the substrate 100 on a specific platform can be turned 180 degrees with the second surface 120 facing upward for subsequent second Fabrication of patterned circuit 400. Next, a transparent film layer TF is first formed on the second surface 120, and then a photoresist layer PR1 is formed on the transparent film layer TF. Since the substrate 100 itself and the transparent film layer TF on the second surface 120 are transparent, the optical positioning device 500 can penetrate the transparent film layer TF of the second surface 120 and the substrate 100 to sense the first film located on the first surface 110. A pair of bit marks 210. For example, after the substrate 100 is turned over and the second surface 120 forms a transparent film layer TF, the optical positioning device 500 first penetrates the transparent film layer TF of the second surface 120 to sense and position the first alignment mark 210. Then, a photoresist layer PR1 is formed, and subsequent processes are performed.
如圖4與圖9至圖11所示,步驟S109為根據第一對位標記210的位置,團案化光阻層PR1與透明膜層TF以形成第二對位標記220於第二表面120上。在此步驟中,生產設備可透過光學定位裝置500感測第一對位標記210的位置而加以定位,並根據第一對位標記210的位置形成第二對位標記220。並且,如圖9所示,生產設備會根據第一對位標記210的位置圖案化光阻層PR1。接著,如圖10所示,生產設備會根據圖案化的光阻層PR1進行蝕刻等製程,而相應地圖案化透明膜層TF。最後,如圖11所示,生產設備會去除圖案化的光阻層PR1,而被留下的透明膜層TF即為第二對位標記220。換句話說,第二對位標記220是根據第一對位標記210的位置而圖案化透明膜層TF而形成。在本實施例中,在形成第二對位標記220的製程中,由於生產設備需要透過光學定位裝置500感測第一對位標記210的位置以形成第二對位標記220,因此第一對位標記210與第二對位標記220在法線方向ND上並未彼此重疊,以避免第二對位標記220擋住第一對位標記210而影響光學定位裝置500的感測。As shown in FIG. 4 and FIGS. 9 to 11, step S109 is to group the photoresist layer PR1 and the transparent film layer TF to form a second alignment mark 220 on the second surface 120 according to the position of the first alignment mark 210. on. In this step, the production equipment can position the first registration mark 210 through the optical positioning device 500 and form a second registration mark 220 according to the position of the first registration mark 210. Moreover, as shown in FIG. 9, the production equipment patterns the photoresist layer PR1 according to the position of the first alignment mark 210. Next, as shown in FIG. 10, the production equipment performs processes such as etching according to the patterned photoresist layer PR1, and accordingly pattern the transparent film layer TF. Finally, as shown in FIG. 11, the production equipment removes the patterned photoresist layer PR1, and the remaining transparent film layer TF is the second alignment mark 220. In other words, the second alignment mark 220 is formed by patterning the transparent film layer TF according to the position of the first alignment mark 210. In this embodiment, in the process of forming the second registration mark 220, since the production equipment needs to sense the position of the first registration mark 210 through the optical positioning device 500 to form the second registration mark 220, the first pair The alignment mark 210 and the second alignment mark 220 do not overlap each other in the normal direction ND, so as to prevent the second alignment mark 220 from blocking the first alignment mark 210 and affecting the sensing of the optical positioning device 500.
如圖4與圖12所示,步驟S111為形成金屬層MT2與光阻層PR2於第二表面120上。在此步驟中,會先形成金屬層MT2於第二表面120上,接著形成光阻層PR2於金屬層MT2上。並且,生產設備可透過光學定位裝置500感測第二對位標記220的位置。舉例來說,金屬層MT2會在基板100的法線方向ND上覆蓋第二對位標記220而隆起,而相應地,光阻層PR2也會在法線方向ND上對應於第二對位標記220之處隆起。光學定位裝置500可透過上述隆起而感測到第二對位標記220的位置。As shown in FIGS. 4 and 12, step S111 is forming a metal layer MT2 and a photoresist layer PR2 on the second surface 120. In this step, a metal layer MT2 is first formed on the second surface 120, and then a photoresist layer PR2 is formed on the metal layer MT2. Moreover, the production equipment can sense the position of the second alignment mark 220 through the optical positioning device 500. For example, the metal layer MT2 will cover the second alignment mark 220 in the normal direction ND of the substrate 100 and bulge. Accordingly, the photoresist layer PR2 will also correspond to the second alignment mark in the normal direction ND. Uplift at 220. The optical positioning device 500 can sense the position of the second registration mark 220 through the bulge.
如圖4與圖13所示,步驟S113為根據第二對位標記220的位置,團案化光阻層PR2與金屬層MT2以形成第三線路層410於第二表面120上。在此步驟中,生產設備可透過光學定位裝置500感測第二對位標記220的位置而加以定位,並根據第二對位標記220的位置形成第二圖案化線路400的第三線路層410。舉例來說,生產設備是根據第二對位標記220的位置,經過諸如曝光、顯影與蝕刻等圖案化製程,圖案化光阻層PR2與金屬層MT2,並去除圖案化的光阻層PR2,最後留下的金屬層MT2即形成第三線路層410。As shown in FIGS. 4 and 13, step S113 is to group the photoresist layer PR2 and the metal layer MT2 to form a third circuit layer 410 on the second surface 120 according to the position of the second alignment mark 220. In this step, the production equipment can position the second alignment mark 220 through the optical positioning device 500, and form a third circuit layer 410 of the second patterned line 400 according to the position of the second alignment mark 220. . For example, the production equipment is to pattern the photoresist layer PR2 and the metal layer MT2 through a patterning process such as exposure, development, and etching according to the position of the second alignment mark 220, and remove the patterned photoresist layer PR2. The last remaining metal layer MT2 forms a third circuit layer 410.
如圖4與圖14所示,步驟S115為根據第二對位標記220的位置,形成第二圖案化線路400於第二表面120上。在此步驟中,生產設備可透過光學定位裝置500感測第二對位標記220的位置而加以定位,並根據第二對位標記220的位置形成第二圖案化線路400。舉例來說,當第三線路層410形成後,生產設備可繼續根據第二對位標記220的位置,經過諸如曝光、顯影與蝕刻等圖案化製程,進一步形成第二圖案化線路400的其他元件,如第二絕緣層420與第四線路層430。當第二圖案化線路400製作完成後,雙面線路基板20也相應完成。As shown in FIG. 4 and FIG. 14, step S115 is to form a second patterned circuit 400 on the second surface 120 according to the position of the second alignment mark 220. In this step, the production equipment can position the second alignment mark 220 through the optical positioning device 500 and form a second patterned circuit 400 according to the position of the second alignment mark 220. For example, after the third circuit layer 410 is formed, the production equipment can continue to form other elements of the second patterned circuit 400 through a patterning process such as exposure, development, and etching according to the position of the second alignment mark 220. For example, the second insulating layer 420 and the fourth circuit layer 430. After the fabrication of the second patterned circuit 400 is completed, the double-sided circuit substrate 20 is also completed accordingly.
根據前述製程說明可知,由於第二圖案化線路400的位置是精確對應於第二對位標記220的位置,而第二對位標記220的位置是精確對應於第一對位標記210,且第一對位標記210的位置是精確對應於第一圖案化線路300,因此,第二圖案化線路400的位置可精確對應於第一圖案化線路300的位置,且第二圖案化線路400在基板100的法線方向ND上是精確對齊第一圖案化線路300。舉例來說,第二圖案化線路400的第三線路層410在基板100的法線方向ND上是精確對齊第一圖案化線路300的第一線路層310的閘極G,以利第三線路層410與閘極G透過基板100的前述導通孔電性連接,也有利於最小化第三線路層410與閘極G所造成的前述遮光區域。According to the foregoing process description, since the position of the second patterned circuit 400 is exactly corresponding to the position of the second registration mark 220, and the position of the second registration mark 220 is exactly corresponding to the first registration mark 210, and the first The position of the pair of bit marks 210 is exactly corresponding to the first patterned line 300. Therefore, the position of the second patterned line 400 may be exactly corresponding to the position of the first patterned line 300, and the second patterned line 400 is on the substrate. In the normal direction ND of 100, the first patterned line 300 is precisely aligned. For example, the third circuit layer 410 of the second patterned circuit 400 is precisely aligned with the gate G of the first circuit layer 310 of the first patterned circuit 300 in the normal direction ND of the substrate 100 to facilitate the third circuit. The electrical connection between the layer 410 and the gate G through the aforementioned vias of the substrate 100 is also beneficial to minimize the aforementioned light-shielding area caused by the third circuit layer 410 and the gate G.
綜上所述,根據本發明所提出一種雙面線路基板的製造方法與雙面線路基板的諸多實施例,使得在雙面線路基板的製程中,可透過相對二表面上的對位標記而精確定位,並使相對二表面上的對應元件在製作時能根據對位標記彼此精確對齊,如此一來,可使相對二表面上的對應元件能精確連接,以避免相對二表面上的對應元件的電性連接失敗,並且還可最小化遮光區域,以避免造成遮光區域增加。In summary, according to the present invention, a method for manufacturing a double-sided circuit substrate and various embodiments of the double-sided circuit substrate enable the precision of the double-sided circuit substrate manufacturing process through the alignment marks on the opposite two surfaces. Position and make the corresponding components on the opposite two surfaces accurately align with each other according to the alignment marks when making them. In this way, the corresponding components on the opposite two surfaces can be accurately connected to avoid the corresponding components on the opposite two surfaces. The electrical connection fails, and the light-shielding area can be minimized to avoid increasing the light-shielding area.
雖然本發明的技術內容已經以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技術者,在不脫離本發明之精神所作些許之更動與潤飾,皆應涵蓋於本發明的範疇內,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art who makes some changes and retouches without departing from the spirit of the present invention should be covered by the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application.
20‧‧‧雙面線路基板20‧‧‧ double-sided circuit board
100‧‧‧基板100‧‧‧ substrate
110‧‧‧第一表面110‧‧‧first surface
120‧‧‧第二表面120‧‧‧Second surface
130‧‧‧佈線區130‧‧‧Wiring area
140‧‧‧邊緣區140‧‧‧ Fringe
150‧‧‧面板區150‧‧‧ panel area
210‧‧‧第一對位標記210‧‧‧ First registration mark
211‧‧‧方塊211‧‧‧box
220‧‧‧第二對位標記220‧‧‧Second registration mark
221‧‧‧方塊221‧‧‧box
300‧‧‧第一圖案化線路300‧‧‧The first patterned circuit
310‧‧‧第一線路層310‧‧‧First circuit layer
320‧‧‧第一絕緣層320‧‧‧The first insulation layer
330‧‧‧半導體層330‧‧‧Semiconductor layer
340‧‧‧第二線路層340‧‧‧Second circuit layer
350‧‧‧歐姆接觸層350‧‧‧ohm contact layer
360‧‧‧透明導電層360‧‧‧ transparent conductive layer
400‧‧‧第二圖案化線路400‧‧‧ The second patterned line
410‧‧‧第三線路層410‧‧‧Third circuit layer
420‧‧‧第二絕緣層420‧‧‧Second insulation layer
430‧‧‧第四線路層430‧‧‧Fourth circuit layer
500‧‧‧光學定位裝置500‧‧‧ optical positioning device
COM‧‧‧接地線COM‧‧‧ ground wire
D‧‧‧汲極D‧‧‧ Drain
G‧‧‧閘極G‧‧‧Gate
M‧‧‧傳輸線M‧‧‧ Transmission line
MT1、MT2‧‧‧金屬層MT1, MT2‧‧‧ metal layer
ND‧‧‧法線方向ND‧‧‧normal direction
PR1、PR2‧‧‧光阻層PR1, PR2‧‧‧Photoresistive layer
S‧‧‧源極S‧‧‧Source
TF‧‧‧透明膜層TF‧‧‧ transparent film
S101‧‧‧形成金屬層於第一表面上S101‧‧‧ forming a metal layer on the first surface
S103‧‧‧形成第一對位標記與第一線路層於第一表面上S103‧‧‧ forming a first alignment mark and a first circuit layer on the first surface
S105‧‧‧根據第一對位標記的位置,形成第一圖案化線路於第一表面上S105‧‧‧ forming a first patterned line on the first surface according to the position of the first alignment mark
S107‧‧‧形成透明膜層與光阻層於第二表面上S107‧‧‧ forming a transparent film layer and a photoresist layer on the second surface
S109‧‧‧根據第一對位標記的位置,團案化光阻層與透明膜層以形成第二對位標記於第二表面上S109‧‧‧ According to the position of the first alignment mark, the photoresist layer and the transparent film layer are formed to form a second alignment mark on the second surface.
S111‧‧‧形成金屬層與光阻層於第二表面上S111‧‧‧ forming a metal layer and a photoresist layer on the second surface
S113‧‧‧根據第二對位標記的位置,團案化光阻層與金屬層以形成第三線路層於第二表面上S113‧‧‧ According to the position of the second alignment mark, the photoresist layer and the metal layer are grouped to form a third circuit layer on the second surface.
S115‧‧‧根據第二對位標記的位置,形成第二圖案化線路於第二表面上S115‧‧‧ forming a second patterned line on the second surface according to the position of the second registration mark
圖1所示為本發明一實施例的雙面線路基板的頂視示意圖; 圖2所示為圖1的雙面線路基板的底視示意圖; 圖3所示為圖1的3-3線段處的剖面示意圖; 圖4所示為本發明一實施例的雙面線路基板的製造方法的流程圖; 圖5所示為本發明一實施例的雙面線路基板的製程示意圖一; 圖6所示為本發明一實施例的雙面線路基板的製程示意圖二; 圖7所示為本發明一實施例的雙面線路基板的製程示意圖三; 圖8所示為本發明一實施例的雙面線路基板的製程示意圖四; 圖9所示為本發明一實施例的雙面線路基板的製程示意圖五; 圖10所示為本發明一實施例的雙面線路基板的製程示意圖六; 圖11所示為本發明一實施例的雙面線路基板的製程示意圖七; 圖12所示為本發明一實施例的雙面線路基板的製程示意圖八; 圖13所示為本發明一實施例的雙面線路基板的製程示意圖九;以及 圖14所示為本發明一實施例的雙面線路基板的製程示意圖十。FIG. 1 is a schematic top view of a double-sided circuit substrate according to an embodiment of the present invention; FIG. 2 is a schematic bottom view of the double-sided circuit substrate of FIG. 1; FIG. 4 is a flowchart of a method for manufacturing a double-sided circuit substrate according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a manufacturing process of a double-sided circuit substrate according to an embodiment of the present invention; FIG. 6 is shown in FIG. FIG. 7 is a process schematic diagram 2 of a double-sided circuit substrate according to an embodiment of the present invention; FIG. 7 is a process schematic diagram 3 of a double-sided circuit substrate according to an embodiment of the present invention; FIG. 8 is a double-sided circuit substrate according to an embodiment of the present invention Schematic diagram 4 of the manufacturing process of the substrate; FIG. 9 shows a schematic diagram of the manufacturing process of the double-sided circuit substrate according to an embodiment of the present invention; FIG. 10 shows a schematic diagram of the manufacturing process of the double-sided circuit substrate according to an embodiment of the present invention; FIG. 12 is a schematic diagram of a manufacturing process of a double-sided circuit substrate according to an embodiment of the present invention; FIG. 12 is a schematic diagram of a manufacturing process of a double-sided circuit substrate according to an embodiment of the present invention; Schematic diagram 9 of the manufacturing process of the substrate; And FIG. 14 is a schematic diagram 10 of a manufacturing process of a double-sided circuit substrate according to an embodiment of the present invention.
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