TWI662874B - Circuit board with flexible line and method for making the same - Google Patents

Abstract

A method for manufacturing a circuit board with elastic lines includes the steps of: providing an insulating elastic base layer and one surface of the elastic base layer is recessed inward to form at least one circuit groove, and each circuit groove is substantially a honeycomb formed by a plurality of annular openings. The circular openings form a plurality of circular openings so that a plurality of pillars are formed on the elastic base layer. Each circular opening is filled with a conductive material to form a conductive ring, and the conductive rings are connected to each other. A conductive circuit having a honeycomb structure; an insulating elastic covering layer is formed on a surface of the elastic base layer on which a circuit groove is formed, and the elastic covering layer covers the surface and the conductive circuit. The elastic base layer constitutes an elastic substrate.

Description

Circuit board with elastic circuit and manufacturing method thereof

The present invention relates to a printed circuit board technology, and in particular, to a circuit board with an elastic circuit and a manufacturing method thereof.

With the advent of the era of robotics and body wear electronics, the requirements for flexibility and crimpability of flexible circuit boards are becoming higher and higher. However, the conventional production processes and materials of flexible circuit boards cannot meet the requirements of expansion and curling. When stretched, the circuit is prone to fracture or cracks, which increases the resistance value and causes unstable electronic signal transmission.

In view of this, the present invention provides a circuit board with an elastic circuit, which is less prone to cracking or cracking, and a manufacturing method thereof.

A method for manufacturing a circuit board with elastic lines includes steps: An insulating elastic base layer is provided, and one surface of the elastic base layer is recessed inward to form at least one circuit groove. Each circuit groove is formed by a plurality of annular openings which are generally arranged in a honeycomb shape and communicate with each other. The openings make a plurality of pillars distributed in a matrix form on the elastic base layer; each ring-shaped opening is filled with a conductive material to form a conductive ring, and the conductive rings are connected to each other to form a honeycomb-shaped conductive line; The surface of the elastic base layer on which the line groove is formed forms an insulating elastic cover layer, the elastic cover layer covers the surface and the conductive circuit, and the elastic cover layer and the elastic base layer constitute an elastic base material.

Further, the material of the elastic base layer is polydimethylsiloxane elastic glue.

Further, the material of the elastic covering layer is polydimethylsiloxane elastic glue.

Further, the elastic base layer includes a first surface and a second surface opposite to the first surface, and each annular opening is recessed from the first surface toward the second surface.

Further, the circuit groove is formed by means of mechanical slotting, laser slotting or injection molding.

Further, the conductive material is filled in the annular opening by means of pouring or sputtering.

Further, the elastic covering layer is combined with the elastic base layer by injection molding.

Further, the inner diameter of the annular opening is 10 micrometers to 40 micrometers.

A circuit board with an elastic circuit includes an insulating elastic substrate and a conductive circuit embedded in the elastic substrate. The conductive circuit includes a plurality of conductive rings arranged in a honeycomb shape, and the plurality of conductive rings. Interconnected.

Further, the material of the elastic substrate is polydimethylsiloxane elastic glue.

Further, the inner diameter of the conductive ring is 10 micrometers to 40 micrometers.

Further, the conductive ring is composed of a conductive metal, a conductive paste, or a liquid having a conductive ability.

According to the method for manufacturing a circuit board with elastic circuits provided by the present invention, the manufacturing of a circuit board with elastic circuits is simple and convenient, and in the circuit board with elastic circuits manufactured by the method, the conductive circuit is designed as a honeycomb structure, and The change in the shape of the honeycomb hole and the elasticity of the elastic substrate. When the circuit board with the elastic circuit is stretched in a certain direction, the conductive circuit will also be stretched in the same direction, and it will deform in the direction perpendicular to the direction. The conductive line of the honeycomb structure keeps the line conductive when it is stretched and rebounded in any direction, reduces the probability of the line being broken or cracked, and further increases the transmission stability of the electronic signal.

100‧‧‧ Circuit board with flexible circuit

10‧‧‧ Elastic base

11‧‧‧line trough

110‧‧‧ circular opening

113‧‧‧ cylinder

101‧‧‧first surface

103‧‧‧ second surface

21‧‧‧ conductive ring

20‧‧‧ conductive line

30‧‧‧ Elastic Cover

50‧‧‧ elastic substrate

60‧‧‧Conductive hole

FIG. 1 is a schematic perspective view of an elastic base layer formed with a circuit groove according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the elastic base layer having the wiring groove shown in FIG. 1.

FIG. 3 is a plan view of a conductive circuit formed on the elastic base layer shown in FIG. 1.

4 is a cross-sectional view of a conductive circuit formed on the elastic base layer shown in FIG. 3.

FIG. 5 is a cross-sectional view of a circuit board having an elastic circuit covered with an elastic cover layer on the elastic substrate with conductive circuits shown in FIG. 4.

FIG. 6 is a cross-sectional view of a circuit board with an elastic circuit according to another embodiment of the present invention.

In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the present invention, the specific implementation, structure, and method of the circuit board with elastic circuit of the present invention and its manufacturing method are described below with reference to FIGS. The characteristics and effects are described in detail below.

Please refer to FIG. 1 to FIG. 5. A preferred embodiment of the present invention discloses a method for manufacturing a circuit board 100 with elastic circuits and a circuit board 100 with elastic circuits manufactured by the manufacturing method. The circuit board 100 with elastic circuits may be The single-sided flexible circuit board can also be a multilayer flexible circuit board, a multilayer IC carrier board, and a multilayer rigid-flex board. In this embodiment, the retractable flexible circuit board 100 is a single-layer flexible circuit board.

Please refer to FIG. 1 to FIG. 5. The manufacturing method of the circuit board 100 with elastic circuits includes the following steps: Step S1, refer to FIG. 1 and FIG. 2, and provide an elastic base layer formed with at least one circuit groove 11 for insulation. 10, each line slot 11 is formed by a plurality of annular openings 110, which are generally arranged in a honeycomb shape and interconnected Through. The plurality of annular openings 110 cause a plurality of pillars 113 in a matrix distribution to be formed on the elastic base layer 10.

The elastic base layer 10 includes a first surface 101 and a second surface 103 opposite to the first surface 101.

In this embodiment, a material of the elastic base layer 10 is a polydimethylsiloxane elastic rubber material.

In other embodiments, the material of the elastic base layer 10 may be other stretchable materials.

Each annular opening 110 is a blind hole, which is opened from the first surface 101 toward the second surface 103.

In this embodiment, each of the annular openings 110 has a circular shape and an inner diameter of 10 to 40 microns. Preferably, the inner diameter of the annular openings 110 is 20 microns.

In other embodiments, the annular opening 110 may have other shapes such as a square shape and a diamond shape.

Specifically, the circuit groove 11 can be formed by mechanical slotting, laser slotting or injection molding. In this embodiment, the circuit groove 11 is formed by injection molding.

Step S2, please refer to FIG. 3 and FIG. 4. Each annular opening 110 is filled with a conductive material to form a conductive ring 21. A plurality of conductive rings 21 are arranged in a honeycomb pattern and connected to each other to form a honeycomb structure. Line 20.

In this embodiment, the conductive circuit 20 is formed by filling a conductive material into the circuit groove 11.

In other embodiments, the conductive circuit 20 can also be formed by sputtering a conductive material.

The conductive material may be a common conductive substance such as a conductive metal, a conductive paste, or a liquid having a conductive ability. In this embodiment, the conductive material is a copper paste.

Step S3, referring to FIG. 5, forming an insulating elastic covering layer 30 on the first surface 101 to combine with the elastic base layer 10 and cover the first surface 101 and the conductive line 20, the elasticity The cover layer 30 and the elastic base layer 10 together form an elastic substrate 50.

In this embodiment, the elastic cover layer 30 is formed on the elastic base layer 10 by injection molding, so that the elastic cover layer 30 and the elastic base layer 10 are firmly combined.

In other embodiments, the elastic covering layer 30 may be combined with the elastic base layer 10 by other methods such as bonding.

In this embodiment, the elastic covering layer 30 and the elastic base layer 10 are made of the same material, and are both polydimethylsiloxane (PDMS) elastic glue. In other embodiments, the material of the elastic covering layer 30 may be different from the material of the elastic base layer 10.

Please refer to FIG. 4 and FIG. 5. A preferred embodiment of the present invention further provides a circuit board 100 having an elastic circuit, which includes an insulating elastic substrate 50 and a conductive circuit 20 embedded in the elastic substrate 50. The conductive circuit 20 is formed by a plurality of conductive rings 21 arranged in a honeycomb shape and connected to each other.

The elastic substrate 50 includes an elastic base layer 10 and an elastic cover layer 30 combined with the elastic base layer 10. In this embodiment, the elastic base layer 10 and the elastic cover layer 30 are made of the same material, and are both polydimethylsiloxane elastic glue.

In other embodiments, the material of the elastic base layer 10 and the material of the elastic covering layer 30 may be different, and the material may be other stretchable materials.

The elastic base layer 10 includes a first surface 101 and a second surface 103 opposite to the first surface 101.

The elastic base layer 10 is further provided with at least one circuit groove 11, and each of the circuit grooves 11 is formed by a plurality of annular openings 110 which are generally arranged in a honeycomb shape and communicate with each other. The plurality of annular openings 110 cause a plurality of pillars 113 in a matrix distribution to be formed on the elastic base layer 10.

Each annular opening 110 is a blind annular opening, which is opened from the first surface 101 toward the second surface 103.

In this embodiment, each of the annular openings 110 is circular.

In other embodiments, the annular opening 110 may have other shapes such as a square shape and a diamond shape.

The conductive ring 21 is formed in the annular opening 110.

The elastic covering layer 30 is formed on the first surface 101 to cover the first surface 101 and the conductive circuit 20.

In this embodiment, the elastic covering layer 30 is directly combined with the elastic base layer 10 by injection molding.

In other embodiments, the elastic covering layer 30 may be combined with the elastic base layer 10 by other methods such as bonding.

When the circuit board 100 with elastic circuits needs to be electrically connected to other electronic components (not shown), a hole is opened in the region where the elastic substrate 50 of the circuit board 100 with elastic circuits needs to be connected to other electronic components. (Not shown) to expose the conductive lines 20 and correspondingly form conductive holes (not shown). The conductive lines 20 are electrically connected to other electronic components through the conductive holes.

In other embodiments, referring to FIG. 6, at least two of the above-mentioned circuit boards 100 with elastic circuits can be superimposed and combined to form a double-layer / multi-layer flexible circuit board, and circuits with elastic circuits in two adjacent ones At least one conductive hole 60 is formed between the boards 100 to electrically connect the conductive circuits 20 in two adjacent circuit boards 100 with elastic circuits.

The manufacturing method of the circuit board 100 with elastic circuits provided by the present invention makes the manufacturing of the circuit board 100 with elastic circuits simple and convenient, and the circuit board 100 with the elastic circuits manufactured by the method uses polydimethylsiloxane As the selection of the elastic base material 50, the elastic rubber material is beneficial to the expansion and contraction of the circuit board 100 having elastic circuits. Since the wavelength of the polydimethylsiloxane elastic rubber material is between 400nm and 800nm, it can be conveniently made by laser The elastic substrate 50 is processed quickly.

In the circuit board 100 having the elastic circuit, the conductive circuit 20 is also designed into a honeycomb structure, and the change in the shape of the honeycomb hole and the elasticity of the elastic substrate 50 are used. The conductive circuit 20 will also be stretched in the same direction, and will shrink in a direction perpendicular to the direction to cause deformation, so that the conductive circuit 20 of the honeycomb structure is stretched and returned in any direction. Keep the line conductive during the bounce, which reduces the chance of the line being broken or cracked, thereby increasing the transmission stability of the electronic signal.

In addition, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical concept of the present invention, and all such changes and deformations should fall within the protection scope of the patent application scope of the present invention.

Claims (12)

A method for manufacturing a circuit board with elastic lines includes the steps of: providing an insulating elastic base layer and one surface of the elastic base layer is recessed inward to form at least one circuit groove, and each circuit groove is substantially a honeycomb formed by a plurality of annular openings. The circular openings are arranged in a shape of a circle and directly communicate with each other. The plurality of annular openings causes a plurality of pillars in a matrix distribution to be formed on the elastic base layer. Each of the annular openings is filled with a conductive material to form a conductive ring. The conductive rings are connected to each other to form a honeycomb-shaped conductive line; an insulating elastic cover layer is formed on the surface of the elastic base layer where the circuit groove is formed, and the elastic cover layer covers the surface and the conductive line, and The elastic covering layer and the elastic base layer constitute an elastic substrate. According to the method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of the patent application, wherein the material of the elastic base layer is a polydimethylsiloxane elastomer. According to the method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of the patent application, the material of the elastic covering layer is polydimethylsiloxane elastic glue. The method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of patent application, wherein the elastic base layer includes a first surface and a second surface opposite to the first surface, and each ring The opening is recessed from the first surface toward the second surface. According to the method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of the patent application, wherein the circuit groove is formed by mechanical slotting, laser slotting, or injection molding. According to the method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of patent application, wherein the conductive material is filled in the annular opening by means of pouring or sputtering. According to the method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of patent application, wherein the elastic covering layer is combined with the elastic base layer by injection molding. According to the method for manufacturing a circuit board with an elastic circuit according to item 1 of the scope of the patent application, wherein the inner diameter of the annular opening is 10 μm to 40 μm. A circuit board with an elastic circuit includes an insulating elastic substrate and a conductive circuit embedded in the elastic substrate. The conductive circuit includes a plurality of conductive rings arranged in a honeycomb shape, and the plurality of conductive rings. Directly connected to each other. The circuit board with an elastic circuit according to item 9 of the scope of the patent application, wherein the material of the elastic substrate is polydimethylsiloxane elastic glue. According to the circuit board with an elastic circuit according to item 9 of the scope of the patent application, wherein the inner diameter of the conductive ring is 10 μm to 40 μm. The circuit board with an elastic circuit according to item 9 of the scope of the patent application, wherein the conductive ring is composed of a conductive metal, a conductive paste, or a liquid having a conductive ability.