TWI660654B - Method for manufacturing a lamp and products thereof,method for manufacturing a three-dimensional circuit board and products thereof - Google Patents

Abstract

A method for manufacturing a lamp includes the following steps: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; forming a pattern on the insulating layer and including an activating material An active layer formed by bending the metal plate to form at least one bent portion, and making the patterned activated layer span the at least one bent portion; forming a first metal layer on the patterned activated layer to form A conductive line; and a plurality of light emitting elements are provided on the conductive line, and the light emitting elements are distributed in different regions separated by the at least one bent portion and are electrically connected to the conductive line.

Description

Method for manufacturing lamp and product thereof, method for manufacturing three-dimensional circuit substrate and product thereof

The invention relates to a method for manufacturing a lamp and a product thereof, and particularly to a method for manufacturing a lamp having a three-dimensional circuit substrate and a product thereof.

In recent years, vehicle lights with a three-dimensional structure usually consist of a circuit board and a light-emitting element mounted on the circuit board. An existing vehicle light with a three-dimensional structure includes a plurality of rigid circuit boards and a plurality of light-emitting elements installed on the rigid circuit board and electrically connected to the rigid circuit board. The reason why such a vehicle light requires a plurality of circuit boards It is composed because the rigid circuit board cannot be deformed. If a three-dimensional structure for the installation of light-emitting components is required, multiple rigid circuit boards are required, thereby making it difficult to assemble such a lamp. In addition, the hard circuit The heat dissipation of the board is also poor, and it is difficult to smoothly dissipate the high heat generated by the light emitting element. Another type of vehicle light with a three-dimensional structure includes at least one flexible circuit board, and a plurality of light-emitting elements installed on the flexible circuit board and electrically connected to the flexible circuit board. Bend, but this kind of vehicle light still needs a metal plate for the flexible circuit board to be installed and fixed to maintain the positions of the multiple light-emitting elements installed on the flexible circuit board, so the assembly of this type of vehicle light is complicated. Although the heat dissipation of the flexible circuit board is better than that of the rigid circuit board, it still has the problem of poor heat dissipation in the face of the high heat generated by the light emitting element.

Therefore, one object of the present invention is to provide a method for manufacturing a lamp which can improve at least one of the problems in the prior art.

Therefore, in some embodiments, the method of manufacturing the lamp of the present invention includes the following steps: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; and forming an insulating layer on the insulating layer Forming a patterned activation layer including an activation material; bending the metal plate to form at least one bending portion, and allowing the patterned activation layer to cross the at least one bending portion; on the patterned activation layer Forming a first metal layer thereon to form a conductive line; and providing a plurality of light emitting elements on the conductive line, and disposing the light emitting elements in different regions separated by the at least one bent portion and electrically connecting with the conductive line Sexual connection.

In some embodiments, the step of forming the patterned activation layer is to cover the activation layer before the insulating layer, and then cover a portion of the activation layer with a plating resist material, so that the activation layer does not cover the plating resist. The area of the material is exposed to form a predetermined pattern.

In some embodiments, the step of forming the patterned activation layer is to form a predetermined pattern directly on the insulating layer.

In some embodiments, the step of forming the patterned activation layer is to cover the activation layer on the insulating layer, and then partially remove the activation layer to form a predetermined pattern.

Therefore, in some embodiments, the method of manufacturing the lamp of the present invention includes the following steps: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; and forming an insulating layer on the insulating layer Covering an activation layer including an activation material; bending the metal plate to form at least one bent portion; forming a first metal layer on the activation layer; partially removing the first metal layer to form a conductive circuit, and The conductive line crosses the at least one bent portion; and a plurality of light emitting elements are provided on the conductive line, and the light emitting elements are distributed in different regions separated by the at least one bent portion and are electrically conductive with the conductive line connection.

Therefore, in some embodiments, the method for manufacturing the lamp of the present invention includes the following steps: providing a metal plate; forming an insulating layer on the metal plate; forming an activating layer including an activating material on the insulating layer; The metal plate is bent to form a plurality of bent portions, and the overall shape is stepped, and the activation layer is located in different regions separated by the bent portions at the same time; a first metal layer is formed on the activation layer to form a A conductive line, and the conductive line is located in different areas separated by the bends at the same time; and a plurality of light-emitting elements are installed on the conductive line, and the light-emitting elements are distributed on the divided by the bends Different regions.

Therefore, another object of the present invention is to provide a lamp which improves at least one problem in the prior art.

Therefore, in some embodiments, the lamp of the present invention includes: a metal plate in a bent shape, the metal plate having a mounting surface and at least one bent portion; an insulating layer formed on the mounting of the metal plate An activation layer comprising an activation material and patternedly formed on the insulating layer, and the patterned activation layer straddles the at least one bent portion; a first metal layer formed on the patterned A conductive line is formed on the activation layer; and a plurality of light emitting elements are disposed on the conductive line and electrically connected to the conductive line, and the light emitting elements are distributed in different regions separated by the at least one bent portion.

Therefore, in some embodiments of the lamp of the present invention, it includes: a metal plate having a plurality of bent portions and being generally stepped; an insulating layer formed on the metal plate; an active layer including an active material And is formed on the insulating layer, and the activation layer is located in different regions separated by the bent portions at the same time; a first metal layer is positioned on the activation layer to form a conductive circuit, and the conductive circuit is simultaneously Located in different areas separated by the bent portions; and a plurality of light emitting elements mounted on the conductive line, and the light emitting elements are distributed in different areas separated by the bent portions.

Therefore, it is an object of the present invention to provide a method for manufacturing a three-dimensional circuit substrate which can improve at least one of the problems in the prior art.

In some embodiments, the method for manufacturing a three-dimensional circuit substrate of the present invention includes the following steps: providing a metal plate; forming an insulating layer on the metal plate; forming an activating layer including an activating material on the insulating layer; The metal plate is bent to form at least one bent portion, and the activation layer is simultaneously located in different regions separated by the at least one bent portion; and a first metal layer is formed on the activated layer to form a conductive circuit, and The conductive lines are simultaneously located in different areas separated by the at least one bent portion.

In some embodiments, the three-dimensional circuit substrate of the present invention includes: a metal plate having at least one bent portion; an insulating layer formed on the metal plate; an active layer including an active material and formed on the insulation Layer, and the activation layer is located at different areas separated by the bend; and a first metal layer is located on the activation layer to form a conductive line, and the conductive line is located at the same time by the bend The different areas that are separated.

The invention has at least the following effects: by forming a circuit directly on a flexible and bent metal plate to form a three-dimensional circuit substrate that can provide good heat dissipation of electronic components and can meet specific requirements on the mounting position of electronic components, And the light-emitting element is provided on the three-dimensional circuit substrate to form the lamp, which can reduce the components of the lamp, thereby simplifying the assembly process of the lamp, and can make the light-emitting element get good heat dissipation.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

Referring to FIG. 1, an embodiment of a method for manufacturing a lamp and an article thereof according to the present invention includes the following steps:

Step S1, providing a metal plate having a mounting surface;

Step S2: forming an insulating layer on the mounting surface of the metal plate;

Step S3, forming a patterned active layer including an active material on the insulating layer;

Step S4: bending the metal plate to form at least one bending portion, and allowing the patterned activation layer to cross the at least one bending portion;

Step S5: forming a first metal layer on the patterned activation layer to form a conductive circuit;

In step S6, a plurality of light-emitting elements are provided on the conductive line, and the light-emitting elements are distributed in different regions separated by the at least one bent portion and are electrically connected to the conductive line.

Referring also to FIG. 2, in step S1, a metal plate 1 is provided, and the metal plate 1 has a mounting surface 11. In this embodiment, the metal plate 1 is flat and made of aluminum, and the metal plate 1 also has a perforation 12 located at a predetermined bend so that the predetermined bend can be easily bent. In other embodiments, The metal plate 1 may also have no perforations 12 or a plurality of perforations 12 located at predetermined bends, which is not limited thereto.

In step S2, an insulating layer 2 is formed on the mounting surface 11 of the metal plate 1. In this embodiment, the material of the insulating layer 2 is epoxy, and the thickness is about 10 μm. However, in other embodiments, the material of the insulating layer 2 may also be polyethylene (polyethylene) or acrylic. And other insulating materials. In addition, in this embodiment, the insulating layer 2 is formed on the mounting surface 11 by spray painting, but may also be formed by screen printing or the like in other embodiments.

Step S3, a patterned activation layer 3 is formed on the insulating layer 2 and contains an activating material (not shown). In this embodiment, the step of forming the patterned activation layer 3 is activated by covering the insulating layer 2 Layer 3, and a part of the activation layer 3 is covered with a plating resist material 4, so that the activation layer 3 is exposed in a region not covered with the plating resist material 4 to form a predetermined pattern 31. In addition, the activating material in this embodiment is an activating metal, such as palladium, silver, platinum, or gold, and the material of the activating layer 3 in this embodiment further includes a solvent for dissolving the activating material therein. The material of the plating resist material 4 is similar to that of the insulating layer 2. It can be epoxy, polyethylene, or other insulating materials such as acrylic. In terms of thickness, the thickness of the activation layer 3 is about 10-15 μm, and the thickness of the plating resist material 4 is about 10 μm, but the material or thickness of the activation layer 3 and the plating resist material 4 are not limited. In addition, in this embodiment, the activation layer 3 is formed by spray painting, but it can also be formed by screen printing, pad printing, and the like, and the plating resist material 4 is formed by screen printing, but it can also be borrowed. It is formed by a spray painting method, and a predetermined pattern 31 is formed by a masking method.

In other embodiments, step S3 may also be to form the activation layer 3 directly on the insulation layer 2 by screen printing, pad printing, or other methods, or cover the entire surface of the insulation layer 2 before the insulation layer 2 Then, a part of the active layer 3 is removed by laser, for example, to form a predetermined pattern 31.

In step S4, the metal plate 1 is bent to form at least one bent portion 13, and the patterned activation layer 3 is made to cross the bent portion 13. In this embodiment, the metal plate 1 only has one bent portion 13, but in other embodiments, the number of the bent portions 13 may be two or more. It should be noted that the step of bending the metal plate 1 may be completed by a folding machine or a stamping device.

In step S5, a first metal layer 5 is formed on the patterned activation layer 3 to form a conductive circuit 51. In this embodiment, the material of the first metal layer 5 is copper, and the first metal layer 5 having a thickness of about 3 μm is formed by electroless plating. In other embodiments, the The material can also be other conductive metals such as nickel.

After step S5 is completed, a three-dimensional circuit substrate 100 is completed. Since the metal plate 1 of the three-dimensional circuit substrate 100 has a fast heat conduction speed, it is particularly suitable for mounting electronic components that are more likely to generate heat. Specific requirements on location.

After step S5, a second metal layer (not shown) can also be formed on the first metal layer 5 by electroplating to thicken the conductive line 51. The second metal layer can be the same as the first metal layer 5 as The same material, or another conductive metal different from the material of the first metal layer 5.

In step S6, a plurality of light-emitting elements 6 are provided on the conductive circuit 51, and the light-emitting elements 6 are distributed in different regions separated by the bent portion 13 and electrically connected to the conductive circuit 51 so as to have a three-dimensional structure. Complex lighting fixture 10 with good heat dissipation properties. Moreover, in this embodiment, two ends of the conductive line 51 can be used to connect to a power source, but it is not limited thereto. In addition, although a plurality of light-emitting elements 6 are provided in this embodiment to constitute the lamp 10, in other embodiments, the conductive circuit 51 may be electrically connected to other electronic components to constitute other electronic devices. This embodiment is a limitation.

Further referring to FIG. 3, for another embodiment, in this embodiment, the foregoing steps S3 to S5 are replaced with the following steps: the entire surface of the insulating layer 2 is covered with the unpatterned activation layer 3; the metal plate is 1 is bent to form a bent portion 13; a first metal layer 5 is formed on the activation layer 3; the first metal layer 5 is partially removed in a laser manner, for example, to form a patterned conductive circuit 51.

It should be noted that, for the above-mentioned insulating layer 2, the activation layer 3, the plating resist material 4, and the first metal layer 5, regardless of the material type, thickness, and formation method, it can be adjusted according to actual needs, and the above implementation is not used. Examples are limited.

Referring to FIG. 4, it is a product of a lamp 20 according to another embodiment. In this embodiment, during the step of bending the metal plate 1, the metal plate 1 is bent at multiple places to form a plurality of bent portions 13 to form a The overall three-dimensional luminaire 20 is substantially stepped. In particular, this embodiment is merely an example. In other embodiments, the metal plate 1 can also be bent into any other three-dimensional shape, and it should not be limited to a step shape.

In summary, by forming a circuit directly on the flexible and bent metal plate 1 to form a three-dimensional circuit substrate 100 that can provide good heat dissipation of electronic components and can meet specific requirements on the mounting position of electronic components, The light-emitting elements 6 formed on the three-dimensional circuit substrate 100 to form the lamps 10 and 20 can reduce the number of components of the lamps 10 and 20, thereby simplifying the assembling process of the lamps 10 and 20, and can make the light-emitting elements 6 get good heat dissipation.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited in this way, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the patent specification of the present invention are still Within the scope of the invention patent.

S1 ····· Step S2 ······ Step S3 ······ Step S4 ····· Step S5 ······ Step S6 ····· ··· Step 10 ······················ luminaire 100 ··· Three-dimensional circuit board 1 ······· Metal plate 11 ····· Mounting surface 12 ... Perforation 13 ... Bend 2 ... Insulation layer 3 ... Activation layer 31 ... ··· Predetermined pattern 4 ········ Plate resist material 5 ·············································         

Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a flow block diagram of an embodiment of a method of manufacturing a lamp of the present invention and its products; FIG. 2 is the implementation FIG. 3 is a schematic flow chart of another embodiment of a method for manufacturing a lamp of the present invention and a product thereof; and FIG. 4 is a schematic perspective view of a first embodiment of a product of a lamp of the present invention.

Claims (10)

A method for manufacturing a lamp includes the following steps: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; forming a pattern on the insulating layer and including an activating material An active layer; bending the metal plate to form at least one bent portion, and making the patterned activated layer span the at least one bent portion; forming a first metal layer on the patterned activated layer to form A conductive line; and a plurality of light emitting elements are provided on the conductive line, and the light emitting elements are distributed in different regions separated by the at least one bent portion and are electrically connected to the conductive line. The method for manufacturing a lamp according to claim 1, wherein the step of forming the patterned activation layer is to cover the activation layer before the insulating layer, and then cover a portion of the activation layer with a plating resist to make the activation layer An area not covered by the plating resist is exposed to form a predetermined pattern. The method for manufacturing a lamp according to claim 1, wherein the step of forming the patterned activation layer is to form the activation layer directly on the insulating layer to form a predetermined pattern. The method for manufacturing a lamp according to claim 1, wherein the step of forming the patterned activation layer is to cover the activation layer on the insulating layer, and then partially remove the activation layer to form a predetermined pattern. A method for manufacturing a lamp includes the following steps: providing a metal plate having a mounting surface; forming an insulating layer on the mounting surface of the metal plate; covering the insulating layer with an activating layer containing an activating material Bending the metal plate to form at least one bent portion; forming a first metal layer on the activation layer; removing a portion of the first metal layer to form a conductive line, and the conductive line spans the at least one fold A bent portion; and a plurality of light emitting elements are provided on the conductive line, and the light emitting elements are distributed in different regions separated by the at least one bent portion and are electrically connected to the conductive line. A lamp includes: a metal plate in a bent shape, the metal plate having a mounting surface and at least one bent portion; an insulating layer formed on the mounting surface of the metal plate; an activation layer including a An activation material is patterned on the insulating layer, and the patterned activation layer crosses the at least one bend; a first metal layer is formed on the patterned activation layer to form a conductive circuit; And a plurality of light-emitting elements are disposed on the conductive circuit and are electrically connected to the conductive circuit, and the light-emitting elements are distributed in different regions separated by the at least one bent portion. A method for manufacturing a three-dimensional circuit substrate includes the following steps: providing a metal plate; forming an insulating layer on the metal plate; forming an activating layer including an activating material on the insulating layer; and bending the metal plate to form at least one A bent portion, and the activation layer is located in different regions separated by the at least one bent portion; and a first metal layer is formed on the activation layer to form a conductive line, and the conductive line is located at the same time by the Different regions separated by at least one bend. A three-dimensional circuit substrate includes: a metal plate having at least one bent portion; an insulation layer formed on the metal plate; an activation layer including an activation material and formed on the insulation layer, and the activation layer At the same time, they are located in different areas separated by the bent portion; and a first metal layer is located on the activation layer to form a conductive circuit, and the conductive lines are simultaneously located in different areas separated by the bent portion. A method for manufacturing a lamp includes the following steps: providing a metal plate; forming an insulating layer on the metal plate; forming an activating layer containing an activating material on the insulating layer; and bending the metal plate to form a plurality of bends The activation layer is located in different areas separated by the bent portions at the same time; a first metal layer is formed on the activation layer to form a conductive line, and the conductive line is located at the same time Different regions separated by the bent portions; and a plurality of light emitting elements are mounted on the conductive circuit, and the light emitting elements are distributed in different regions separated by the bent portions. A lamp includes: a metal plate having a plurality of bent portions and being generally stepped; an insulation layer formed on the metal plate; an activation layer including an activation material and formed on the insulation layer, And the activation layer is located in different areas separated by the bends at the same time; a first metal layer is located on the activation layer to form a conductive line, and the conductive line is also located in the area surrounded by the bends Different areas; and a plurality of light-emitting elements mounted on the conductive circuit, and the light-emitting elements are distributed in different areas separated by the bent portions.