TWI654149B - Method for cutting alkali-free glass plate, method for cutting display panel, method for producing alkali-free glass plate, and method for manufacturing display panel - Google Patents

Abstract

The invention relates to a method for cutting an alkali-free glass plate, which is a method for cutting an alkali-free glass plate of an alkali-free glass plate, wherein the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 8.5. The mass %, the plate thickness (T) is 0.05 to 0.30 mm, the cutting line is processed by scribing on the surface of the above-mentioned alkali-free glass plate using a specific cutter wheel, and tensile stress or bending stress is applied to the above-mentioned cutting line. The above alkali-free glass plate was cut. According to the method for cutting an alkali-free glass plate of the present invention, a good cutting result can be obtained.

Description

Method for cutting alkali-free glass plate, method for cutting display panel, method for producing alkali-free glass plate, and method for manufacturing display panel

The present invention relates to a method for cutting an alkali-free glass plate, a method for cutting a display panel, a method for producing an alkali-free glass plate, and a method for producing a display panel.

Heretofore, a method of cutting a glass sheet along a cutting line after cutting a cutting line using a cutter wheel on the surface of a glass plate is known (refer to Patent Documents 1 to 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2011/129265

[Patent Document 2] International Publication No. 2012/108391

In recent years, display panels have become thinner and lighter, and along with this, the alkali-free glass sheets used for display panels are required to have a thinner plate thickness than the previous plate thickness (for example, 0.50 to 0.70 mm) (for example, 0.05 to 0.30 mm). ).

The inventors of the present invention have studied the results of the method for cutting a thinned alkali-free glass plate. It is clear that under the conditions suitable for the previous thickness, there is a case where a good cutting result cannot be obtained (specifically, processing) The case where the glass sheet cannot be cut by the cutting device after the cutting line).

Further, the inventors have found that even when the thickness is the same, when the B ₂ O ₃ content of the alkali-free glass plate is different, the cutting results are different.

The present invention has been made in view of the above points, and an object thereof is to provide a method for cutting an alkali-free glass sheet, a method for cutting a display panel, a method for producing an alkali-free glass sheet, and a display panel, which are capable of obtaining a good cutting result. Production method.

The present inventors have found that the above object is attained by performing cutting line processing using a specific cutter wheel, thereby completing the present invention.

That is, the present invention provides a method for cutting an alkali-free glass plate, which is a method for cutting an alkali-free glass plate of an alkali-free glass plate, wherein the B ₂ O ₃ content (C) of the alkali-free glass plate is 0. ~8.5 mass%, the thickness (T) is 0.05 to 0.30 mm, and the cutting line is processed by scribing the cutter wheel satisfying the following (1) to (3) on the surface of the above-mentioned alkali-free glass plate, by The above-mentioned cutting line is subjected to tensile stress or bending stress to cut the above-mentioned alkali-free glass plate.

(1) Wheel diameter: 1~5mm

(2) Protrusion spacing: 20~2000μm

(3) Tool nose angle: A~B°

A=400×T+(1.53×C+47.9)

B=400×T+(1.53×C-22.1)

Moreover, the present invention provides a method for producing an alkali-free glass plate, comprising: a melting step of heating a glass raw material to obtain molten glass; and a forming step of forming the molten glass into a plate shape to obtain an alkali-free glass plate; And a cutting step of cutting the alkali-free glass plate; and the cutting step cuts the alkali-free glass plate by the cutting method of the alkali-free glass plate.

Moreover, the present invention provides a method of cutting a display panel, which is a method of cutting a display panel of a display panel, wherein the display panel partially follows two sheets of an alkali-free glass plate with a thickness of 3 to 5 μm. Further, the alkali-free glass plate has a B ₂ O ₃ content (C) of 0 to 8.5% by mass and a sheet thickness (T) of 0.05 to 0.30 mm, which is the above-mentioned alkali-free constituting the upper surface and the lower surface of the display panel. The surface of the glass plate is scribed by a cutter wheel satisfying the following (1) '~(3)' to process a dicing line, and the display panel is cut by applying tensile stress or bending stress to the dicing line.

(1) 'Rolling diameter: 1~5mm

(2) 'Pitch spacing: 20~2000μm

(3) 'Tool tip angle: A'~B'°

A'=400×T+(1.53×C+47.9)+5

B'=400×T+(1.53×C-22.1)+5

Moreover, the present invention provides a method of manufacturing a display panel, comprising: a melting step of heating a glass raw material to obtain molten glass; and a forming step of forming the molten glass into a plate shape to obtain an alkali-free glass plate; a step of cutting the above-mentioned alkali-free glass plate; a display panel assembly step of partially obtaining two display sheets of the above-mentioned alkali-free glass plate with a thickness of 3 to 5 μm; and a display panel cutting step The display panel is cut, and the display panel cutting step is performed by cutting the display panel by the cutting method of the display panel.

According to the present invention, it is possible to provide a method for cutting an alkali-free glass sheet, a method for cutting a display panel, a method for producing an alkali-free glass sheet, and a method for producing a display panel, which have obtained a good cutting result.

12‧‧‧Cutter device

12a‧‧‧ cylinder

12b‧‧‧Support

12c‧‧‧ cylinder body

12d‧‧‧Piston

12e‧‧‧ Connecting rod

12f‧‧‧ bearing department

12g‧‧‧ axis

12h‧‧‧Cutter wheel

12ha‧‧‧ ridge line

12hb‧‧‧ slot

12i‧‧‧The outer part

20‧‧‧ glass plate

20A‧‧‧ a glass plate

20B‧‧‧Another glass plate

110‧‧‧cutting device

116‧‧‧ platform

120A, 120B‧‧‧ Keeping components

122A, 122B‧‧‧ cushioning parts

126A‧‧‧Support components

126B‧‧‧Folding members

130A, 130B‧‧‧ cushioning parts

134‧‧‧Axis

200‧‧‧ display panel

210‧‧‧Next material

A‧‧‧glass plate

B‧‧‧glass plate

C‧‧‧glass plate

D‧‧‧ wheel diameter

D‧‧‧cut depth

E1‧‧‧ lower surface edge

E2‧‧‧ lower surface edge

H‧‧‧height

J‧‧‧ Protrusion

K‧‧‧ vertical crack

L‧‧‧ cutting line

P‧‧‧protrusion spacing

T‧‧‧knife thickness

Θ‧‧‧knife angle

FIG. 1 is a schematic view showing an example of the cutter device 12.

FIG. 2 is an explanatory view of the operation of the cutting device 110.

FIG. 3 is an explanatory view of the operation of the cutting device 110.

FIG. 4 is an explanatory view of the operation of the cutting device 110.

5(a) and 5(b) are views showing an example of a cutter wheel, Fig. 5(a) is a side view of the cutter wheel 12h, and Fig. 5(b) is a front view of the cutter wheel 12h.

Fig. 6 is a cross-sectional view showing the glass sheet 20 which has been scribed by the cutter wheel 12h.

7(a) and 7(b) are views showing one aspect of the cutting method of the display panel of the present invention, and Fig. 7(a) is a cross-sectional view showing the display panel 200 on which the cutting line L is processed, Fig. 7 (b) is a cross-sectional view of the display panel 200 after cutting.

Fig. 8 is a graph showing the evaluation results of the glass plate A (B ₂ O ₃ content (C) = 1.4% by mass).

Fig. 9 is a graph showing the evaluation results of the glass plate B (B ₂ O ₃ content (C) = 2.6% by mass).

Drawing the glass sheet 10 based C (B ₂ O ₃ content (C) = 7.9% by mass) of the evaluation results of FIG.

[Cutting method of alkali-free glass plate]

The method for cutting an alkali-free glass plate of the present invention (hereinafter also referred to as "the glass cutting method of the present invention for convenience") is a method for cutting an alkali-free glass plate, which is to cut off the alkali-free glass plate. In the method for cutting an alkali glass plate, the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 8.5% by mass, and the plate thickness (T) is 0.05 to 0.30 mm, which is used on the surface of the alkali-free glass plate. The cutter wheels of the following conditions (1) to (3) are subjected to scribing to process a cutting line, and the above-mentioned alkali-free glass plate is cut by applying tensile stress or bending stress to the above-mentioned cutting line.

Condition (1) Wheel diameter: 1~5mm

Condition (2) Protrusion spacing: 20~2000μm

Condition (3) Tip angle: A~B°

A=400×T+(1.53×C+47.9)

B=400×T+(1.53×C-22.1)

The glass cutting method of the present invention is roughly a method of cutting an alkali-free glass sheet after processing a cutting line using a cutter wheel.

Hereinafter, the alkali-free glass plate (hereinafter also simply referred to as "glass plate") used in the present invention will be described.

The glass plate used in the present invention is an alkali-free glass plate which is a sheet having a B ₂ O ₃ content (C) of 0 to 8.5% by mass and a sheet thickness (T) of 0.05 to 0.30 mm, and is used, for example, for a display panel such as a liquid crystal panel.

The glass plate is obtained by melting a glass raw material and forming the molten glass into a plate shape. Such a molding method may be a general molding method, and for example, a float method, a melting method, a flow hole down-draw method, or the like may be used. Further, it is also possible to use a method in which a glass plate temporarily formed into a plate shape is heated to a moldable temperature and stretched by a method such as stretching to make it thinner (re-draw method), and etching and In other general methods, the glass sheet temporarily formed into a plate shape is thinned and formed.

The sheet thickness (T) of the glass sheet is 0.05 to 0.30 mm from the viewpoint of thinning and/or weight reduction of the glass sheet. Further, in the above formula (3), the thinner the thickness of the glass sheet is, the sharper the blade edge angle A to B° is, and the rigidity of the cutter is lowered. In the embodiments described below, the cutter wheel load is shifted to the low load side by the sharp angle of the cutter tip, but is lower than the steadily applied cutter wheel load (cutter wheel load) under the current technology. Not up to 1N). From these viewpoints, the thickness of the glass plate is preferably from 0.10 to 0.30 mm, more preferably from 0.15 to 0.30 mm, and even more preferably from 0.15 to 0.20 mm.

For example, in a glass substrate for a liquid crystal panel, since the elution of an alkali metal component easily affects the liquid crystal, the glass plate contains an alkali-free component that does not substantially contain an alkali metal component (that is, an alkali metal component other than an unavoidable impurity). glass. Specifically, the content of the alkali metal component is preferably 0.5% by mass or less, more preferably 0.2% by mass or less, and still more preferably 0.1% by mass or less.

The glass plate is an alkali-free glass plate containing B ₂ O ₃ : 0 to 8.5% by mass percentage based on oxide. As such an alkali-free glass plate, for example, SiO ₂ : 54 to 73%, Al ₂ O ₃ : 10 to 23%, B ₂ O ₃ : 0 to 8.5%, MgO: 0~12%, CaO: 0~15%, SrO: 0~16%, BaO: 0~15%, MgO+CaO+SrO+BaO: 8~26% alkali-free glass plate. Further, in the present specification, the percentage expressed by mass is synonymous with the percentage expressed by weight.

The smaller the B ₂ O ₃ content (C) of the glass plate, the larger the Young's modulus becomes, the harder the glass is, and the more difficult it is to apply the previous cutting method, so the effect of the glass cutting method of the present invention is obtained. Become more significant.

Specifically, in the glass plate, the B ₂ O ₃ content is preferably 0 to 5%, more preferably 0 to 3%, and more preferably 0 to 2.5%, based on the mass percentage of the oxide. 0~2%, the best is 0~1.5%.

The Young's modulus of the alkali-free glass plate used in the present invention is preferably 70 GPa or more. When the Young's modulus is 70 GPa or more, the strength is strong, and the alkali-free glass plate after cutting is difficult to be broken. The Young's modulus is preferably 75 GPa or more, and further preferably 80 GPa or more, and particularly preferably 85 GPa or more. The Young's modulus is preferably 100 GPa or less. When the Young's modulus is 100 GPa or less, it is possible to suppress the glass from becoming brittle, and it is possible to suppress the chipping at the time of cutting the alkali-free glass plate. The Young's modulus is preferably 97 GPa or less, and further preferably 95 GPa or less, and particularly preferably 90 GPa or less. Further, in the present specification, the Young's modulus indicates that it is measured by the ultrasonic pulse method.

In addition, the alkali-free glass plate to be used in the present invention may further contain, in addition to the above components, 1% by mass or less, preferably 0.7, in terms of the meltability, clarity, and moldability of the glass. 5% by mass or less, more preferably 0.5% by mass or less of ZnO, Fe ₂ O ₃ , SO ₃ , F, Cl, SnO ₂ or the like. It is preferred that substantially no ZnO is contained.

Next, the cutter wheel and the scribing condition of the present invention will be described based on Figs. 5(a) to 5(b) and Fig. 6.

Fig. 5(a) is a side view of the cutter wheel 12h, and Fig. 5(b) is a front view of the cutter wheel 12h. Fig. 6 is a cross-sectional view showing the glass sheet 20 which is scribed by the cutter wheel 12h.

The disk-shaped cutter wheel 12h is rotatably supported by a rotating shaft inserted in a hole formed in the center portion, and is rolled in a pressure-contact state with respect to the surface of the glass plate 20, thereby dicing the cutting line L.

In FIG. 6, the depression on the upper surface of the glass sheet 20 is a microscopic deformation and a micro crack (crack) of the glass generated at the time of scribing, and this is called a cutting line (scribe line) L. The cutting line L extends in the depth direction and the front direction in FIG. Preferably, it is simultaneously with the cutting line L Ground, a crack (vertical crack) K extending from the cutting line L downward is generated.

Further, in the present invention, the thin glass sheet 20 having a thickness of 0.05 to 0.30 mm is subjected to dicing processing and cut off as described above. Therefore, if it is suitable for the previous plate thickness (for example, 0.50 to 0.70 mm), there is a case where a good cutting result cannot be obtained. Specifically, there is a case where the crack K does not enter the desired depth from the cutting line L during the processing of the cutting line, and the glass sheet cannot be cut by the cutting device after the cutting line is processed.

Further, even if the thickness is the same, the cutting result is different when the B ₂ O ₃ content of the alkali-free glass plate is different.

However, in the present invention, the cutting line is processed by scribing using the cutter wheel satisfying the conditions (1) to (3), thereby obtaining a good cutting result.

<(1) Wheel diameter>

The wheel diameter indicated by "D" in Fig. 5(a) of the cutter wheel 12h is 1~5mm, preferably 2~4mm, better 2~3mm.

<(2) protrusion pitch>

As shown in the enlarged view A of Fig. 5(b), the groove 12hb having a concave shape is cut at the vertex of the cutting edge of the cutter wheel 12h, that is, the ridge portion 12ha, thereby forming the projection J of the height h at a specific interval.

In the present invention, the distance between the adjacent protrusions J (the vertices) indicated by "P" in Fig. 5(b) is 20 to 2000 μm, preferably 30 to 2000 μm, more preferably 30 to 1000 μm, and further preferably It is 30~500μm, especially 30~100μm.

<(3) Tip angle>

The angle of the blade indicated by "θ" in Fig. 5(a) of the cutter wheel 12h is A~B°.

A=400×T+(1.53×C+47.9)

B=400×T+(1.53×C-22.1)

In the above formula, T represents the sheet thickness (unit: mm) of the glass sheet 20, and C represents the B ₂ O ₃ content (unit: mass%) of the glass sheet 20.

In the following [Example], it is shown that a good cutting result is obtained when the cutting edge angle of the cutter wheel 12h is the above A to B°. That is, in the [Example], it is shown that the glass sheet cannot be cut with respect to the case where the blade edge angle is outside the range of A to B° (Comparative Example), and the blade angle is in the range of A to B° described above. The inside case (embodiment) can cut the glass plate.

Further, the upper limit of the blade tip angle (A to B°) of the glass cutting method of the present invention is preferably 150°, more preferably 140°, still more preferably 130°, and particularly preferably 120°. The lower limit is preferably 80°, more preferably 90°, and still more preferably 100°.

The thickness of the cutter wheel 12h (indicated by "t" in Fig. 5(a)) is not particularly limited, and for example, 0.4 to 5 mm can be cited.

Further, a previously known material may be used as the material of the cutter wheel 12h, and examples thereof include a super hard alloy, a sintered diamond, and the like.

<(4) Skew speed>

The scribing speed is preferably 100 to 1000 mm/sec, more preferably 200 to 800 mm/sec, and further preferably 200 to 400 mm/sec.

<(5) Cutter wheel load>

The load of the cutter wheel 12h can be arbitrarily set by the cutter device 12 described below, and preferably 1 to 25.8 N can be cited.

More specifically, for example, when the thickness of the glass plate 20 is 0.15 mm, although it depends on the blade edge angle of the cutter wheel 12h, it is preferably 1.5 N to 4.2 N, more preferably 1.5 to 3.8 N. . Further, in the case where the thickness of the glass plate 20 is 0.2 mm, it is preferably 2.3 to 6.5 N, more preferably 2.7 N to 5.3 N.

Next, an aspect of the glass cutting method of the present invention will be described based on Figs. 1 to 4 . However, the present invention is not limited to the aspects described below.

First, the cutting line processing will be described based on Fig. 1 .

In the cutting line processing of the glass cutting method of the present invention, for example, a cutter is used. Set 12.

FIG. 1 is a schematic view showing an example of the cutter device 12. As shown in Fig. 1, the cutter device 12 is a device in which the cutter wheel 12h coupled to one end of the cylinder 12a via the holder 12b is spliced to the glass plate 20, so that the cutter wheel 12h is provided. The glass sheet 20 is moved relative to each other to cut the cutting line L of the depth d into the glass sheet 20.

The cylinder 12a has a cylinder main body 12c, a piston 12d movable back and forth in the cylinder main body 12c, and a connecting rod 12e coupled to the piston 12d. The link 12e protrudes outward from the end of the cylinder body 12c, that is, the bearing portion 12f, and a support 12b that supports the cutter wheel 12h is coupled to the distal end of the link 12e. By applying a specific force to the end surface of the piston 12d opposite to the link 12e, the cutter wheel 12h can be spliced to the glass plate 20, so that the cutter wheel 12h can follow the irregularities of the machined surface of the glass plate 20, and The cutter wheel 12h can be pressed against the surface of the glass sheet 20 with a desired load.

The cutter wheel 12h is rotatably supported by the holder 12b via the shaft 12g. When the cutter wheel 12h is relatively moved relative to the glass plate 20 while the outer peripheral portion 12i is spliced to the glass plate 20, the cutter wheel 12h continuously scribes the cutting line L on the glass plate 20 while rotating about the axis of the shaft 12g.

The holder 12b is rotatably coupled to the link 12e so as to be rotatable about the axis of the link 12e. When the cutter wheel 12h is relatively moved relative to the glass plate 20 in a state of being spliced to the glass plate 20, the holder 12b is rotated in parallel with respect to the tangential direction of the cutting line L.

A moving mechanism (not shown) that relatively moves the cutter wheel 12h and the glass plate 20 at a desired scribing speed can also be known. For example, the moving mechanism includes a base, a conveying device, a guide rail, a driving device, and the like. The conveying device is a device that conveys the glass sheet 20 with respect to the base. The glass plate 20 is conveyed horizontally, for example. The guide rail is a member that supports the cylinder body 12c with respect to the base and that can move the cylinder body 12c. The cylinder main body 12c is supported, for example, such that the axial direction is the vertical direction. The driving device is a device that moves the cylinder body 12c along the guide rail under the control of the control device. The moving mechanism horizontally conveys the glass sheet 20 and/or one side of the cylinder body 12c Movement causes the cutter wheel 12h and the glass plate 20 to move relative to each other.

The cutting line is processed on the surface of the glass sheet 20 by the above operation.

Next, the cutting of the glass sheet 20 processed by the cutting line will be described based on Figs. 2 to 4 . For example, the cutting device 110 is used for cutting.

2 to 4 are explanatory views of the operation of the cutting device 110. First, the glass sheet 20 on which the cutting line L is processed is placed on the stage 116 so that the cutting line L is located outside. Further, one glass plate 20 is referred to as "glass plate 20A" by the cutting line L of the glass plate 20, and the other glass plate 20 is referred to as "glass plate 20B".

Next, the lower surface and the upper surface of the glass sheet 20A are held by a pair of holding members 120A, 120B. Further, a cushioning member 122A, 122B made of rubber, resin or plastic is attached to the glass abutting surface of each of the holding members 120A, 120B, and the cushioning member 122A abuts against the glass plate 20A without a gap as shown in FIG. The lower surface, and the cushioning member 122B abuts against the upper surface of the glass sheet 20A without a gap.

Further, the lower surface of the glass plate 20B is supported by the support member 126A, and the bent member 126B is disposed with a specific gap with respect to the upper surface of the glass plate 20B, and the glass of each of the support member 126A and the bent member 126B is abutted. A cushioning member 130A, 130B made of rubber, resin or plastic is mounted on the surface. The cushioning member 130A abuts against the lower surface of the glass plate 20B without a gap, and the cushioning member 130B is spaced apart from each other with respect to the upper surface of the glass plate 20B. In FIG. 2, the glass abutting faces of the cushioning members 130A and 130B are formed in a flat shape parallel to the surface of the glass plate 20B, but are not limited thereto. For example, the cushioning members 130A and 130B may be inclined surfaces that are inclined toward the lower right side.

Next, the cutting member including the supporting member 126A and the bending member 126B is rotated clockwise as shown in FIG. 2 around the shaft 134 set at a position lower than the cutting line L of the glass sheet 20. By this rotation operation, the lower surface edge portion E1 of the lower surface edge portion E1, E2 of the cushioning member 130B of the bending member 126B is pressed against the upper surface of the glass sheet 20B. Then, with the rotation of the bending member 126B, the bending member 126B As shown in Fig. 3, the cushion member 130B gradually increases the area in contact with the glass plate 20B from the lower surface edge portion E1 toward the surface edge portion E2 closest to the cutting line L, and presses against the glass plate 20B. surface.

By the rotation of the bending member 126B, a tensile stress or a bending stress in a direction in which the glass sheet 20 is bent is applied to the cutting line L of the glass sheet 20, and as shown in Fig. 4, the glass sheet 20 is along the cutting line L. The glass plate 20A and the glass plate 20B are cut. The cutting line L does not receive an excessive force from the bending member 126B by the above-described contact area increasing operation of the bending member 126B, so that no shell-like gap is formed in the cut surface of each of the glass sheet 20A and the glass sheet 20B. (The larger the shell-like gap in the fragment), the cut surface becomes good. Further, when the glass sheet 20 is cut as shown in Fig. 4, the cut surfaces of the respective glass sheets 20A and 20B are separated from each other, so that the cut surfaces can be prevented from coming into contact with each other, and a good cut surface can be obtained. .

Further, since there is a gap between the cut glass sheet 20B and the bent member 126B, the cut glass sheet 20B is dropped between the support member 126A and the bent member 126B by its own weight. Therefore, the operation of increasing the interval between the support member 126A and the bending member 126B in order to drop the cut glass sheet 20B can be omitted.

Further, the glass plate 20 (the glass plate 20A and the glass plate 20B) cut along the cutting line L is generally chamfered and then cleaned by grinding the grindstone or the grindstone to the end face. Use after drying.

[Abasic glass plate]

The present invention also relates to an alkali-free glass plate (hereinafter also referred to as "the alkali-free glass plate of the present invention") which is cut by the glass cutting method of the present invention described above. The alkali-free glass plate of the present invention can be preferably used for a display panel such as a liquid crystal display, but the use thereof is not limited thereto.

[Method for manufacturing alkali-free glass plate]

The method for producing an alkali-free glass plate of the present invention has a melting step of heating a glass raw material to obtain a molten glass; a forming step of obtaining a molten glass into a plate shape to obtain an alkali-free glass plate; and a cutting step of cutting the alkali-free glass plate; and the cutting step cutting the alkali-free by the cutting method of the alkali-free glass plate glass plate.

[How to cut the display panel]

The method for cutting a display panel of the present invention (hereinafter also referred to as "the method for cutting a display of the present invention for convenience") is a method for cutting a display panel for cutting a display panel, wherein the display panel is made of two sheets of alkali-free The glass plate is partially formed by using a bonding material having a thickness of 3 to 5 μm. The B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 8.5% by mass, and the thickness (T) is 0.05 to 0.30 mm. The surface of the alkali-free glass plate constituting the upper surface and the lower surface of the display panel is scribed by a cutter wheel satisfying the following conditions (1) to 3 (3), and the cutting line is processed by The cutting line is subjected to tensile stress or bending stress to cut the display panel.

Condition (1) 'Rolling diameter: 1~5mm

Condition (2) 'Pitch spacing: 20~2000μm

Condition (3) 'Tool tip angle: A'~B'°

A'=400×T+(1.53×C+47.9)+5

B'=400×T+(1.53×C-22.1)+5

One aspect of the display cutting method of the present invention will be described based on Figs. 7(a) and 7(b).

7(a) is a cross-sectional view showing the display panel 200 on which the cutting line L is processed, and FIG. 7(b) is a cross-sectional view showing the display panel 200 after cutting.

The display panel 200, which is a cutting target, is configured by partially joining two glass sheets 20 with a bonding material 210 having a thickness of 3 to 5 μm. The details of the glass plate 20 are the same as those described above, and thus the description thereof is omitted here. Further, liquid crystal is filled between the two glass sheets 20, for example, and sealed by the material 210.

Then, using the cutter wheel 12h (refer to FIGS. 5(a) and 5(b), etc.), as shown in FIG. 7(a), the symmetrical position on the upper surface (the surface of the glass plate 20) above the display panel 200 machining Cutting line L. Furthermore, the cutter device 12 described above can be used when processing the cutting line.

<(1)' wheel diameter, (2) 'protrusion pitch, (4) 'scribe speed, (5) 'cutter wheel load>

Since the wheel diameter and the projection pitch of the cutter wheel 12h, the scribing speed, and the cutter wheel load are the same as those described by the glass cutting method of the present invention, the description thereof will be omitted.

<(3) 'knife angle>

The angle of the blade indicated by "θ" in Fig. 5(a) of the cutter wheel 12h is A'~B'°.

A'=400×T+(1.53×C+47.9)+5

B'=400×T+(1.53×C-22.1)+5

In the above formula, T represents the sheet thickness (unit: mm) of the glass sheet 20, and C represents the B ₂ O ₃ content (unit: mass%) of the glass sheet 20.

As shown in the above formula, the cutting edge angle of the display cutting method of the present invention is 5° larger than that of the glass cutting method of the present invention. The reason is estimated as follows.

First, as the thickness of the glass sheet increases, the angle of the blade tip required for cutting becomes larger. This is considered to be because the concentration of the load is reduced when the load is applied by the cutter wheel. Further, it is considered that the reason is that, compared with the veneer of the thin glass (thickness=T _a ), the two sheets of the thin plate glass (for example, the display panel) are not necessarily thickened twice as thick. The veneer of glass (plate thickness = 2T _a ), but it can be said that it has been thickened, the concentration of the cutter wheel load is reduced, and the angle of the blade tip required for cutting is increased.

Further, in the display cutting method of the present invention, the upper limit value of the blade tip angle (A'~B'°) is preferably 150 + 5°, and the lower limit value is preferably 80 + 5°.

After the cutting line L is processed, as shown in FIG. 7(b), the display panel 200 is cut by applying tensile stress or bending stress to the cutting line L.

Further, in the glass cutting method of the present invention described above, tensile stress or bending stress is applied to the cutting line of the glass sheet 20 in the bending direction, but in the display cutting method of the present invention, even for the glass sheet 20 The one-sided cutting line applies tensile stress or bending to the bending direction The bending stress also cuts only one glass sheet 20, and the other glass sheet 20 is not cut.

Therefore, in the display cutting method of the present invention, tensile stress or bending stress is applied to the surface direction of the glass sheet 20 (the horizontal direction in Fig. 7). Thereby, the display panel 200 is cut as shown in FIG. 7(b). In addition, the cutting device for cutting the tensile stress or the bending stress in the direction of the surface of the glass plate 20 is not particularly limited, and a conventionally known device can be used.

[display panel]

The present invention also relates to a display panel (hereinafter also referred to as "display panel of the present invention") which is cut by the above-described display cutting method of the present invention.

[Manufacturing method of display panel]

The manufacturing method of the display panel of the present invention has a melting step of heating a glass raw material to obtain molten glass, a forming step of forming the molten glass into a plate shape to obtain an alkali-free glass plate, and a cutting step of cutting the above-mentioned none An alkali glass plate; a display panel assembly step of partially obtaining two display sheets of the above-mentioned alkali-free glass plate with a thickness of 3 to 5 μm; and a display panel cutting step of cutting the display panel; The display panel cutting step is performed by cutting the display panel by the cutting method of the display panel.

[Manufacturing Method of Liquid Crystal Panel]

Next, an example of a method of manufacturing a liquid crystal panel which is one of the display panels will be described.

First, two glass laminates S1 are prepared. The glass laminate S1 is obtained by adhering the glass plate to be a product to the fluorenone resin layer fixed to the support substrate of the glass plate in a peelable manner.

a glass plate of a glass laminate S1 (hereinafter also referred to as "glass laminate S1-1") On the second main surface, tantalum nitride, ruthenium oxide, and amorphous ruthenium are sequentially formed by a plasma CVD (Chemical Vapor Deposition) method. Next, a low concentration of boron was injected into the amorphous germanium layer by an ion doping (Ion Doping) apparatus, and heat treatment was performed at 450 ° C for 60 minutes in a nitrogen atmosphere to carry out dehydrogenation treatment.

Next, the crystallization treatment of the amorphous germanium layer is performed by a laser annealing apparatus. Next, a low-concentration phosphorus is implanted into the amorphous germanium layer by an etching and ion doping apparatus using photolithography to form N-type and P-type TFT (Thin Film Transistor) regions. Next, a gate insulating film is formed by forming a yttrium oxide film by a plasma CVD method on the second main surface side of the glass plate, and then molybdenum is formed by sputtering to form a film by using a photolithography method. The etching is performed to form a gate electrode. Next, a high concentration of boron and phosphorus is implanted into a desired region of each of the N-type and the P-type by a photolithography method and an ion doping apparatus to form a source region and a drain region. Next, on the second main surface side of the glass plate, an interlayer insulating film is formed by film formation of cerium oxide by a plasma CVD method, and aluminum film formation by sputtering method and light lithography are used. The etching is performed to form a TFT electrode. Next, after performing hydrogenation treatment by heating at 450 ° C for 60 minutes in a hydrogen gas atmosphere, a passivation layer was formed by film formation of tantalum nitride by a plasma CVD method. Next, an ultraviolet curable resin is applied to the second main surface side of the glass sheet, and a planarization layer and a contact hole are formed by photolithography. Next, indium tin oxide is formed into a film by a sputtering method, and a pixel electrode is formed by etching using photolithography.

Next, the other glass laminate S1 (hereinafter also referred to as "glass laminate S1-2") was heat-treated at 450 ° C for 60 minutes in an atmospheric environment. Next, chromium is formed on the second main surface of the glass plate of the glass laminate S1 by sputtering, and a light shielding layer is formed by etching using photolithography. Next, a color resist is applied to the second main surface side of the glass sheet by a die coating method, and a color filter layer is formed by photolithography and thermal curing. Next, indium tin oxide is formed into a film by sputtering to form a counter electrode. Next, an ultraviolet curable resin liquid was applied to the second main surface side of the glass plate by a die coating method, and a columnar spacer was formed by photolithography and heat curing. Second, coating the polyimide by roll coating The resin liquid is formed by thermal curing to form an alignment layer and is scratched.

Next, the sealing resin liquid is drawn into a frame shape by a dispensing method, and liquid crystal is dropped by a dispensing method in the frame, and then the two glass laminated bodies S1 are formed by using the glass laminated body S1-1 in which the pixel electrode is formed. The second main surface sides of the glass plate are bonded to each other, and ultraviolet curing and heat curing are performed.

Then, the second main surface of the glass laminate S1-1 is vacuum-adsorbed to the fixed plate, and a stainless steel blade having a thickness of 0.1 mm is inserted into the interface between the glass plate and the fluorenone resin layer at the corner of the glass laminate S1-2. The starting point of peeling off the peeling surface of the first main surface of the glass sheet and the fluorenone resin layer is given. Here, the inserting of the blade is performed while the electrostatic wave is blown from the ionizer (manufactured by Keyence Co., Ltd.) to the interface. Next, the vacuum adsorption pad is pulled while continuously blowing the static-eliminating fluid from the ionizer toward the formed void. Then, the second main surface of the support substrate of the glass laminate S1-2 is adsorbed by the vacuum adsorption pad, and the adsorption pad is raised. As a result, the support substrate having the fluorenone resin layer can be peeled off.

Next, the second main surface of the glass plate on which the color filter is formed on the first main surface is vacuum-adsorbed to the fixed plate, and the interface between the glass plate and the fluorenone resin layer of the corner portion of the glass laminate S1-1 is inserted. A stainless steel blade having a thickness of 0.1 mm is provided as a starting point for peeling off the peeling surface of the first main surface of the glass sheet from the fluorenone resin layer. Then, the second main surface of the support substrate of the glass laminate S1-1 is adsorbed by the vacuum adsorption pad, and the adsorption pad is raised. As a result, the support substrate to which the fluorenone resin layer is fixed can be peeled off. In this way, a liquid crystal panel composed of two glass plates was obtained.

Next, on the upper surface and the lower surface of the liquid crystal panel to be produced, the cutting line is processed by scribing using a cutter wheel that satisfies the conditions (1)' to (3)'. Thereafter, the liquid crystal panel can be cut by applying tensile stress or bending stress in the surface direction of the liquid crystal panel to the dicing line.

[Examples]

The invention will be specifically described below by way of examples. However, the invention is not limited to the Wait.

The cutting of the alkali-free glass sheet (including the cutting line processing) is performed using the cutter device 12 and the cutting device 110 described with reference to Figs. 1 to 4 .

The details of the glass plates A to C which are the alkali-free glass sheets used in the following examples are as follows. Further, the sheet thickness (T) is shown in Tables 1 to 3 below.

<Glass plate A>

‧ Composition (% of mass percentage of oxide benchmark)

SiO ₂ : 61.4%

Al ₂ O ₃ : 19.9%

B ₂ O ₃ : 1.4%

MgO: 5.6%

CaO: 4.6%

SrO: 7.0%

BaO: 0.1%

‧Young's modulus...86GPa

<glass plate B>

‧ Composition (% of mass percentage of oxide benchmark)

SiO ₂ : 61.0%

Al ₂ O ₃ : 19.6%

B ₂ O ₃ : 2.6%

MgO: 5.1%

CaO: 4.4%

SrO: 7.2%

BaO: 0.1%

‧Young's modulus...84GPa

<glass plate C>

‧ Composition (% by mass of oxide benchmark))

SiO ₂ : 59.8%

Al ₂ O ₃ : 17.2%

B ₂ O ₃ : 7.9%

MgO: 3.3%

CaO: 4.0%

SrO: 7.7%

BaO: 0.1%

‧Young's modulus...77GPa

For the glass sheets A to C, the cutter wheels shown in the following Tables 1 to 3 were cut and processed on the surface by the scribing speeds shown in the following Tables 1 to 3, and the cutting conditions were evaluated.

Furthermore, the wheel thickness of the cutter wheel used is set to 0.40 mm (the wheel diameter is 1mm case) or 0.65mm (wheel diameter is 2mm or In the case of 3 mm), the material is set to sintered diamond.

Specifically, the cutter wheel load range (upper and lower limits) at which the glass plate can be cut by the cutting device after the cutter line is changed in the range of 1 to 25.8 N and the cutting line is processed is evaluated by the following criteria. Difference). A to C are examples, and good cutting results are obtained. D is a comparative example, and a good cutting result was not obtained.

A: The load range is 1.5N or more

B: The load range is 0.5N or more and less than 1.5N.

C: The load range is less than 0.5N

D: In the cutter wheel load of 1~25.8N, the glass plate cannot be cut after the cutting line processing.

The results of Tables 1 to 3 above are shown in the graphs of Figs. 8 to 10. Furthermore, in the graphs of FIGS. 8 to 10, the evaluations A to C in the above Tables 1 to 3 are plotted with "○", and the evaluation D is plotted as "×".

Fig. 8 is a graph showing the evaluation results of the glass plate A (B ₂ O ₃ content (C) = 1.4% by mass). Fig. 9 is a graph showing the evaluation results of the glass plate B (B ₂ O ₃ content (C) = 2.6% by mass). Fig. 10 is a graph showing the evaluation results of the glass plate C (B ₂ O ₃ content (C) = 7.9% by mass).

It is clear from the graphs of Tables 1 to 3 and Figs. 8 to 10 that the conditions of conditions (1) to (3) are satisfied, and a good cutting result is obtained. In the case of conditions, good cutting results were not obtained.

Next, Table 4 below is a comparative example, and is a sheet thickness (T) of 0.05 in the case where the alkali-free glass sheet of the previous sheet thickness (for example, 0.50 to 0.70 mm) is cut. The results of the cut evaluation of the alkali-free glass plate (glass plate B to C) of ~0.30 mm (the result of 0.20 mm here). Furthermore, the cutter wheel used has a wheel thickness of 1.1 mm and the material is sintered diamond. Under these conditions, the alkali-free glass plate having a protrusion pitch of more than 2000 μm and a plate thickness (T) of 0.05 to 0.30 mm cannot be cut after the cutting line processing under the load of the cutter wheel of 1 to 25.8 N.

Although the present invention has been described in detail with reference to specific aspects, those skilled in the art It is understood that various changes and modifications can be made without departing from the spirit and scope of the invention.

Further, the present application is based on a Japanese patent application filed on Aug. 4, 2014 (Patent Application No. 2014-158881), the entire contents of which is incorporated by reference.

Claims (12)

The method for cutting an alkali-free glass plate, wherein the alkali-free glass plate is cut, and the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 8.5% by mass, and the plate thickness (T) is 0.05. 0.30 mm, the cutting line is processed by scribing on the surface of the above-mentioned alkali-free glass plate using the cutter wheels satisfying the following (1) to (3), and cutting is performed by applying tensile stress or bending stress to the above-mentioned cutting line. The above alkali-free glass plate: (1) wheel diameter: 1~5mm(2) protrusion spacing: 20~2000μm (3) tool nose angle: A~B° A=400×T+(1.53×C+47.9)B=400×T+(1.53×C-22.1). The method for cutting an alkali-free glass plate according to claim 1, wherein the scribing is further performed under the following conditions (4) to (5): (4) scribing speed: 100 to 1000 mm/sec (5) cutter Wheel load: 1~25.8N. The method for cutting an alkali-free glass plate according to claim 1, wherein the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 3% by mass. The method for cutting an alkali-free glass plate according to claim 2, wherein the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 3% by mass. The method for cutting an alkali-free glass plate according to any one of claims 1 to 4, wherein the thickness of the alkali-free glass plate is 0.10 to 0.30 mm. A method for producing an alkali-free glass plate, comprising: a melting step of heating a glass raw material to obtain molten glass; a forming step of forming the molten glass into a plate shape to obtain an alkali-free glass plate; and a cutting step of cutting the alkali-free glass plate; and the cutting step is performed by any one of claims 1 to 5 The alkali-free glass plate is cut by the cutting method of the alkali-free glass plate. A method for cutting a display panel, wherein the display panel is formed by partially joining two pieces of an alkali-free glass plate with a thickness of 3 to 5 μm, and the alkali-free glass plate The B2O3 content (C) is 0 to 8.5% by mass, and the thickness (T) is 0.05 to 0.30 mm. The surface of the above-mentioned alkali-free glass plate constituting the upper surface and the lower surface of the display panel is used as follows (1). The cutter wheel of '~(3)' is scribing to process the cutting line, and the display panel is cut by applying tensile stress or bending stress to the cutting line: (1) 'wheel diameter: 1~5mm(2)'protrusion spacing: 20~2000μm(3)'knife angle: A'~B'° A'=400×T+(1.53×C+47.9)+5 B'=400×T+(1.53 ×C-22.1)+5. The cutting method of the display panel of claim 7, wherein the scribing is further performed to satisfy the following conditions (4)' to (5)': (4) 'scribe speed: 100 to 1000 mm/sec (5)' Cutter wheel load: 1~25.8N. The cutting method of the display panel of claim 7, wherein the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 3% by mass. The cutting method of the display panel of claim 8, wherein the B ₂ O ₃ content (C) of the alkali-free glass plate is 0 to 3% by mass. The method of cutting a display panel according to any one of claims 7 to 10, wherein the thickness of the alkali-free glass plate is 0.10 to 0.30 mm. A manufacturing method of a display panel, comprising: a melting step of heating a glass raw material to obtain molten glass; a forming step of forming the molten glass into a plate shape to obtain an alkali-free glass plate; and a cutting step of cutting the above-mentioned none An alkali glass plate; a display panel assembly step of partially obtaining two display sheets of the above-mentioned alkali-free glass plate with a thickness of 3 to 5 μm; and a display panel cutting step of cutting the display panel; The display panel cutting step is performed by cutting the display panel by the cutting method of the display panel according to any one of claims 7 to 11.