TWI651358B - Sealing material and hardened material - Google Patents
Sealing material and hardened material Download PDFInfo
- Publication number
- TWI651358B TWI651358B TW104113921A TW104113921A TWI651358B TW I651358 B TWI651358 B TW I651358B TW 104113921 A TW104113921 A TW 104113921A TW 104113921 A TW104113921 A TW 104113921A TW I651358 B TWI651358 B TW I651358B
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing material
- group
- functional group
- polymerizable functional
- organic
- Prior art date
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- 239000003566 sealing material Substances 0.000 title claims abstract description 254
- 239000000463 material Substances 0.000 title claims description 25
- 125000000524 functional group Chemical group 0.000 claims abstract description 113
- 239000000178 monomer Substances 0.000 claims abstract description 65
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 34
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims description 56
- 150000008065 acid anhydrides Chemical class 0.000 claims description 45
- 150000001336 alkenes Chemical class 0.000 claims description 45
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 44
- 238000002834 transmittance Methods 0.000 claims description 29
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical class C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 25
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 13
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 12
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- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
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- 230000000977 initiatory effect Effects 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 75
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- 125000004018 acid anhydride group Chemical group 0.000 abstract description 10
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- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical group 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- YIMHRDBSVCPJOV-UHFFFAOYSA-N n'-(2-ethoxyphenyl)-n-(2-ethylphenyl)oxamide Chemical compound CCOC1=CC=CC=C1NC(=O)C(=O)NC1=CC=CC=C1CC YIMHRDBSVCPJOV-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- QYZLKGVUSQXAMU-UHFFFAOYSA-N penta-1,4-diene Chemical compound C=CCC=C QYZLKGVUSQXAMU-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- GJWMYLFHBXEWNZ-UHFFFAOYSA-N tert-butyl (4-ethenylphenyl) carbonate Chemical compound CC(C)(C)OC(=O)OC1=CC=C(C=C)C=C1 GJWMYLFHBXEWNZ-UHFFFAOYSA-N 0.000 description 1
- UWNNZXDNLPNGQJ-UHFFFAOYSA-N tert-butyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC(C)(C)C UWNNZXDNLPNGQJ-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- IYZPIFPRGKIJQT-UHFFFAOYSA-N tert-butyl propan-2-yl carbonate Chemical compound CC(C)OC(=O)OC(C)(C)C IYZPIFPRGKIJQT-UHFFFAOYSA-N 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1087—Materials or components characterised by specific uses
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Sealing Material Composition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本發明的課題在於提供一種可形成透濕度低、而且彈性模數適度低的密封層、或厚度薄的密封層的密封材。為了解決所述課題,本申請案發明提供一種密封材,其包含:聚合性單體(B),在每一分子中具有至少一個可自由基聚合的官能基,分子量為50以上、1000以下,在23℃下為液狀;酸酐衍生物(C),在每一分子中包含至少一個構成五員環或六員環的酸酐基及可自由基聚合的官能基;自由基聚合起始劑(D),包含熱自由基聚合起始劑及光自由基聚合起始劑的至少一種。 An object of the present invention is to provide a sealing material which can form a sealing layer having a low moisture permeability and a moderately low modulus of elasticity, or a sealing layer having a small thickness. In order to solve the above problems, the present invention provides a sealing material comprising: a polymerizable monomer (B) having at least one radical polymerizable functional group per molecule, and having a molecular weight of 50 or more and 1,000 or less. It is liquid at 23 ° C; the anhydride derivative (C) contains at least one acid anhydride group and a radically polymerizable functional group constituting a five-membered or six-membered ring in each molecule; a radical polymerization initiator ( D) comprising at least one of a thermal radical polymerization initiator and a photoradical polymerization initiator.
Description
本發明是有關於一種密封材及其硬化物。 The present invention relates to a sealing material and a cured product thereof.
有機電致發光(Electro-Luminescence,EL)元件由於消耗電力少,因此一直用於顯示器或照明裝置等。有機EL元件由於容易因大氣中的水分或氧氣而劣化,因此藉由各種密封構件進行密封而使用。 An organic electroluminescence (EL) element has been used in displays, illumination devices, and the like because it consumes less power. Since the organic EL element is easily deteriorated by moisture or oxygen in the atmosphere, it is used by sealing with various sealing members.
有機EL裝置例如可為包含基板、配置於所述基板上的有機EL元件、以及與基板成對的密封基板的結構體。作為將此種結構體的有機EL元件密封的方法的一例,可列舉:在密封基板與基板之間、及有機EL元件與密封基板之間塗佈密封材,並使其硬化的方法(面密封法)。 The organic EL device may be, for example, a structure including a substrate, an organic EL element disposed on the substrate, and a sealing substrate paired with the substrate. An example of a method of sealing the organic EL element of such a structure is a method of applying a sealing material between a sealing substrate and a substrate, and between the organic EL element and the sealing substrate, and curing the surface (face sealing) law).
並且,為了使包含密封材的硬化物的密封層的透濕度降低,而研究在密封材中添加吸濕性填料。具體而言,提出了包含氧化鈣粒子的密封材(專利文獻1~專利文獻3);或包含多孔質二氧化矽粒子的密封材(專利文獻4)等。 Further, in order to reduce the moisture permeability of the sealing layer containing the cured product of the sealing material, it was investigated to add a hygroscopic filler to the sealing material. Specifically, a sealing material containing calcium oxide particles (Patent Documents 1 to 3) or a sealing material containing porous ceria particles (Patent Document 4) and the like are proposed.
另外,作為水分捕捉劑,亦已知有機金屬化合物,亦提出了包含所述有機金屬化合物的透明膜等(專利文獻5~專利文獻7)。而且,亦提出了將有機金屬化合物及粉末狀無機氧化物作為 水分捕捉劑而添加至熱熔型構件等中(專利文獻8)。 In addition, an organic metal compound is also known as a water-trapping agent, and a transparent film containing the above-described organometallic compound is also proposed (Patent Documents 5 to 7). Moreover, it has also been proposed to use organometallic compounds and powdered inorganic oxides as The moisture trapping agent is added to a hot-melt type member or the like (Patent Document 8).
另一方面,作為與丙烯酸系樹脂及環氧樹脂反應的二官能單體,已知有在分子內包含可自由基聚合的官能基與酸酐基的化合物(非專利文獻1)。另外,先前亦已知在硬化性樹脂製造用組成物中添加在一分子內具有酸酐基及酸基的化合物(專利文獻9)。 On the other hand, a compound containing a radically polymerizable functional group and an acid anhydride group in a molecule is known as a difunctional monomer which reacts with an acrylic resin and an epoxy resin (Non-Patent Document 1). In addition, it has been known that a compound having an acid anhydride group and an acid group in one molecule is added to a composition for producing a curable resin (Patent Document 9).
現有技術文獻 Prior art literature
專利文獻 Patent literature
專利文獻1:國際公開第2010/084939號公報 Patent Document 1: International Publication No. 2010/084939
專利文獻2:日本專利特開2005-122910號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2005-122910
專利文獻3:日本專利特開2007-184279號公報 Patent Document 3: Japanese Patent Laid-Open Publication No. 2007-184279
專利文獻4:日本專利特開2007-284472號公報 Patent Document 4: Japanese Patent Laid-Open Publication No. 2007-284472
專利文獻5:日本專利特開2005-298598號公報 Patent Document 5: Japanese Patent Laid-Open Publication No. 2005-298598
專利文獻6:日本專利特開2011-026521號公報 Patent Document 6: Japanese Patent Laid-Open No. 2011-026521
專利文獻7:日本專利特開2012-006991號公報 Patent Document 7: Japanese Patent Laid-Open Publication No. 2012-006991
專利文獻8:國際公開第2007/123039號公報 Patent Document 8: International Publication No. 2007/123039
專利文獻9:日本專利特表2010-523787號公報 Patent Document 9: Japanese Patent Laid-Open Publication No. 2010-523787
非專利文獻 Non-patent literature
非專利文獻1:可重工光熱雙固化系統(化學快報,2013,42,1056-1058)(A Reworkable Photothermal Dual-curing System)(Chem.Lett.2013,42,1056-1058) Non-Patent Document 1: Reworkable Photothermal Dual-Cure System (Chem. Letter, 2013, 42, 1056-1058)
如專利文獻1~專利文獻8般認為,為了使密封層的透濕度降低,而明顯有效的是在密封層中添加吸濕性填料或有機金屬化合物等。然而,在添加吸濕性填料或有機金屬化合物時,存在如下情況:密封材的硬化物的透明性受損,或密封材的黏度變高,而塗敷時的濕潤擴散性降低等作為密封材料的應用範圍受到限制。另外,根據各種裝置的用途,而有要求密封層的薄膜化的情況,但先前的密封材難以薄薄地塗佈,亦難以應對此種要求。 As disclosed in Patent Document 1 to Patent Document 8, it is considered that in order to reduce the moisture permeability of the sealing layer, it is effective to add a hygroscopic filler or an organometallic compound to the sealing layer. However, when a hygroscopic filler or an organometallic compound is added, there is a case where the transparency of the cured product of the sealing material is impaired, or the viscosity of the sealing material is increased, and the wet diffusibility at the time of coating is lowered as a sealing material. The scope of application is limited. Further, depending on the use of various devices, there is a case where the sealing layer is required to be thinned. However, it is difficult to apply the conventional sealing material in a thin manner, and it is difficult to cope with such a demand.
另外,亦研究了提高樹脂的交聯密度,而降低密封層的透濕度。但是,若提高樹脂的交聯密度,則密封材的硬化時的收縮變大。其結果存在如下問題:包含含有所述密封材的硬化物的密封層的裝置的基板或密封基板,容易產生應變。另外,亦存在如下問題:由於密封層的彈性模數提高,因此密封層無法吸收來自外部的應力應變,而無法充分地保護被密封物(例如有機EL元件)。 In addition, it has been studied to increase the crosslinking density of the resin and to reduce the moisture permeability of the sealing layer. However, when the crosslinking density of the resin is increased, the shrinkage at the time of curing of the sealing material becomes large. As a result, there is a problem in that the substrate or the sealing substrate of the device including the sealing layer containing the cured material of the sealing material is likely to be strained. Further, there is also a problem that since the elastic modulus of the sealing layer is increased, the sealing layer cannot absorb stress strain from the outside, and the sealed object (for example, an organic EL element) cannot be sufficiently protected.
本發明鑒於如上所述的情況而成。即,本發明提供一種能形成透濕度低、亦可應對薄的密封層的形成、而且彈性模數適度低的密封層的密封材。 The present invention has been made in view of the above circumstances. That is, the present invention provides a sealing material capable of forming a sealing layer having a low moisture permeability and capable of coping with the formation of a thin sealing layer and having a moderately low elastic modulus.
即本發明的第一發明是有關於以下所示的密封材或由其而得的片狀密封材。 That is, the first invention of the present invention relates to a sealing material shown below or a sheet-like sealing material obtained therefrom.
[1]一種密封材,其包含:聚合性單體(B),在每一分子中具 有至少一個可自由基聚合的官能基,分子量為50以上、1000以下,在23℃下為液狀;酸酐衍生物(C),在每一分子中包含至少一個構成五員環或六員環的酸酐基及可自由基聚合的官能基;自由基聚合起始劑(D),包含熱自由基聚合起始劑及光自由基聚合起始劑的至少一種。 [1] A sealing material comprising: a polymerizable monomer (B) in each molecule There is at least one radical polymerizable functional group having a molecular weight of 50 or more and 1000 or less, which is liquid at 23 ° C; and an acid anhydride derivative (C) comprising at least one of a five-membered ring or a six-membered ring in each molecule. An acid anhydride group and a radical polymerizable functional group; a radical polymerization initiator (D) comprising at least one of a thermal radical polymerization initiator and a photoradical polymerization initiator.
[2]如[1]所記載之密封材,其進一步包含:含有聚合性官能基的烯烴系聚合物(A),在每一分子中具有至少一個可自由基聚合的官能基,數量平均分子量為5000以上、70000以下。 [2] The sealing material according to [1], which further comprises: an olefin-based polymer (A) containing a polymerizable functional group, having at least one radical polymerizable functional group per molecule, and a number average molecular weight It is 5000 or more and 70,000 or less.
[3]如[1]或[2]所記載之密封材,其中藉由E型黏度計在25℃、1.0rpm下測定的黏度為5mPa.s以上、20000mPa.s以下。 [3] The sealing material according to [1] or [2], wherein the viscosity measured by an E-type viscometer at 25 ° C, 1.0 rpm is 5 mPa. Above s, 20000mPa. s below.
[4]如[1]至[3]中任一項所記載之密封材,其中所述聚合性單體(B)及所述酸酐衍生物(C)所具有的所述可自由基聚合的官能基,分別獨立地為選自由(甲基)丙烯醯基、乙烯基、烯丙基、乙烯醚基所組成的組群的一種以上官能基。 [4] The sealing material according to any one of [1] to [3] wherein the polymerizable monomer (B) and the acid anhydride derivative (C) have the radically polymerizable The functional groups are each independently one or more functional groups selected from the group consisting of a (meth) acrylonitrile group, a vinyl group, an allyl group, and a vinyl ether group.
[5]如[2]至[4]中任一項所記載之密封材,其中所述含有聚合性官能基的烯烴系聚合物(A)所具有的所述可自由基聚合的官能基,為選自由(甲基)丙烯醯基、乙烯基、烯丙基、乙烯醚基所組成的組群的一種以上官能基。 [5] The sealing material according to any one of [2] to [4] wherein the polymerizable functional group-containing olefin-based polymer (A) has the radical polymerizable functional group, It is at least one functional group selected from the group consisting of a (meth) acrylonitrile group, a vinyl group, an allyl group, and a vinyl ether group.
[6]如[1]至[5]中任一項所記載之密封材,其中所述酸酐衍生物(C)為在每一分子中具有至少一個可自由基聚合的官能基的六氫鄰苯二甲酸酐衍生物(C')。 [6] The sealing material according to any one of [1] to [5] wherein the acid anhydride derivative (C) is a hexahydroortholine having at least one radical polymerizable functional group in each molecule. Phthalic anhydride derivative (C').
[7]一種片狀密封材,其由如所述[1]至[6]中任一項所記載之密 封材而得。 [7] A sheet-like sealing material which is densely described in any one of [1] to [6] Get the seal material.
本發明的第二發明是有關於以下所示的密封材的硬化物。 The second invention of the present invention relates to a cured product of the sealing material shown below.
[8]一種密封材的硬化物,所述密封材為如所述[1]至[6]中任一項所記載之密封材。 [8] A cured material of the sealing material according to any one of the above [1] to [6].
[9]如[2]至[6]中任一項所記載之密封材的硬化物,其中彈性模數為0.1MPa以上、100MPa以下。 [9] The cured product of the sealing material according to any one of [2] to [6] wherein the elastic modulus is 0.1 MPa or more and 100 MPa or less.
[10]如[8]所記載之密封材的硬化物,其中波長為400nm的平行光線透射率為90%以上。 [10] The cured product of the sealing material according to [8], wherein the parallel light transmittance at a wavelength of 400 nm is 90% or more.
[11]如[9]所記載之密封材的硬化物,其中波長為400nm的平行光線透射率為90%以上。 [11] The cured product of the sealing material according to [9], wherein the parallel light transmittance at a wavelength of 400 nm is 90% or more.
[12]一種密封材,其包含:含有聚合性官能基的烯烴系聚合物(A),在每一分子中具有至少一個可自由基聚合的官能基,數量平均分子量為5000以上、70000以下;六氫鄰苯二甲酸酐衍生物(C'),在每一分子中具有至少一個可自由基聚合的官能基;自由基聚合起始劑(D),包含熱自由基聚合起始劑及光自由基聚合起始劑的至少一種。 [12] A sealing material comprising: an olefin-based polymer (A) having a polymerizable functional group, having at least one radical polymerizable functional group per molecule, and having a number average molecular weight of 5,000 or more and 70,000 or less; a hexahydrophthalic anhydride derivative (C') having at least one radical polymerizable functional group per molecule; a radical polymerization initiator (D) comprising a thermal radical polymerization initiator and light At least one of a radical polymerization initiator.
根據本發明的密封材,可獲得透濕度低、且彈性模數適度低的硬化物。另外,由於可降低密封材的黏度,因此亦可將密封材的硬化物(密封層)進行薄膜化。 According to the sealing material of the present invention, a cured product having a low moisture permeability and a moderately low modulus of elasticity can be obtained. Further, since the viscosity of the sealing material can be lowered, the cured product (sealing layer) of the sealing material can be thinned.
2‧‧‧玻璃基板 2‧‧‧ glass substrate
4‧‧‧蒸鍍膜 4‧‧‧Extruding film
6‧‧‧玻璃基板 6‧‧‧ glass substrate
8‧‧‧塗膜 8‧‧·coating film
20、20'、20"‧‧‧有機EL裝置 20, 20', 20" ‧ ‧ organic EL devices
22‧‧‧基板 22‧‧‧Substrate
24‧‧‧有機EL元件 24‧‧‧Organic EL components
26‧‧‧密封基板 26‧‧‧Seal substrate
28‧‧‧面密封層 28‧‧‧ face sealing layer
28-1‧‧‧硬化物層 28-1‧‧‧ hardened layer
28-1'‧‧‧密封材 28-1'‧‧‧ Sealing material
28-2‧‧‧鈍化層 28-2‧‧‧ Passivation layer
28-3‧‧‧第二樹脂硬化物層 28-3‧‧‧Second resin hardened layer
28A‧‧‧第一密封層 28A‧‧‧First sealing layer
28B‧‧‧第二密封層 28B‧‧‧Second sealing layer
30‧‧‧反射畫素電極層 30‧‧‧Reflective electrode layer
32‧‧‧有機EL層 32‧‧‧Organic EL layer
34‧‧‧透明對向電極層 34‧‧‧Transparent counter electrode layer
36‧‧‧阻擋材 36‧‧‧Block materials
L、L'‧‧‧長度 L, L'‧‧‧ length
圖1A~圖1C是表示藉由Ca法的硬化物的透濕度的測定用樣品的製作順序的示意圖。 1A to 1C are schematic views showing a procedure for producing a sample for measuring the moisture permeability of a cured product by the Ca method.
圖2A是表示有機EL裝置的一個形態的概略剖面圖,圖2B是表示有機EL裝置的其他形態的概略剖面圖。 2A is a schematic cross-sectional view showing one embodiment of an organic EL device, and FIG. 2B is a schematic cross-sectional view showing another embodiment of the organic EL device.
圖3A~圖3C是表示圖2A的有機EL裝置的製造製程的一例的示意圖。 3A to 3C are schematic views showing an example of a manufacturing process of the organic EL device of Fig. 2A.
圖4A是表示有機EL裝置的其他形態的概略剖面圖,圖4B是將圖4A的有機EL裝置的密封基板除去的情形的俯視圖。 4A is a schematic cross-sectional view showing another embodiment of the organic EL device, and FIG. 4B is a plan view showing a state in which the sealing substrate of the organic EL device of FIG. 4A is removed.
1.關於密封材 1.About sealing material
本發明的密封材是用於有機EL裝置等各種裝置的密封層形成的組成物。密封材的組成根據其目的而適當選擇。例如在形成厚度薄的密封層時等,設為包含聚合性單體(B)、酸酐衍生物(C)、及自由基聚合起始劑(D)的密封材。此時,密封材根據需要可包含含有聚合性官能基的烯烴系聚合物(A)。另一方面,在形成彈性模數低的密封層時等,設為包含含有聚合性官能基的烯烴系聚合物(A)、酸酐衍生物(C)、及自由基聚合起始劑(D)的密封材。此時,根據需要可包含聚合性單體(B)。 The sealing material of the present invention is a composition for forming a sealing layer of various devices such as an organic EL device. The composition of the sealing material is appropriately selected depending on the purpose. For example, when a sealing layer having a small thickness is formed, a sealing material containing a polymerizable monomer (B), an acid anhydride derivative (C), and a radical polymerization initiator (D) is used. In this case, the sealing material may contain an olefin-based polymer (A) containing a polymerizable functional group as needed. On the other hand, when forming a sealing layer having a low modulus of elasticity, the olefin-based polymer (A), the acid anhydride derivative (C), and the radical polymerization initiator (D) containing a polymerizable functional group are included. Sealing material. At this time, a polymerizable monomer (B) may be contained as needed.
先前,為了提高密封層的吸濕性,而研究了在密封材中添加吸濕性填料等。然而,若密封材包含吸濕性填料等,則密封材的硬化物的透明性受損,或密封材的塗敷性變低,而難以充分 覆蓋被密封物。另外,若密封材包含填料等,則亦存在如下問題:密封材的黏度變高,而難以將密封層進行薄膜化。另外,亦難以僅藉由添加吸濕性填料而充分降低硬化物的透濕度。另一方面,為了降低密封材的硬化物的透濕度,而亦研究了提高樹脂的交聯密度,但在所述方法中存在如下情況:密封材的硬化收縮變大,而與密封材的硬化物積層的基板產生應變。而且亦存在如下問題:由於硬化物的彈性模數提高,因此所述硬化物無法充分吸收來自外部的應力應變,而無法充分保護被密封物等。 Previously, in order to improve the hygroscopicity of the sealing layer, it has been studied to add a hygroscopic filler or the like to the sealing material. However, when the sealing material contains a hygroscopic filler or the like, the transparency of the cured product of the sealing material is impaired, or the coating property of the sealing material is lowered, and it is difficult to sufficiently Cover the sealed object. Further, when the sealing material contains a filler or the like, there is also a problem that the viscosity of the sealing material becomes high, and it is difficult to thin the sealing layer. Further, it is also difficult to sufficiently reduce the moisture permeability of the cured product by merely adding the hygroscopic filler. On the other hand, in order to reduce the moisture permeability of the cured product of the sealing material, it has been studied to increase the crosslinking density of the resin, but in the method, there is a case where the hardening shrinkage of the sealing material becomes large, and the hardening of the sealing material The substrate of the deposited layer is strained. Further, there is a problem in that the cured product does not sufficiently absorb stress strain from the outside due to an increase in the elastic modulus of the cured product, and the sealed object or the like cannot be sufficiently protected.
相對於此,在本發明的密封材的硬化物中,藉由具有聚合性官能基的酸酐衍生物(C)的酸酐基來捕捉水分。此處認為,即便是六氫鄰苯二甲酸酐等通常的酸酐,亦可捕捉侵入進來的水,有效的是添加在密封材中。然而,通常的酸酐不與密封材中的其他成分進行聚合反應。因此,在密封材的硬化後容易滲出,而難以充分發揮出水分捕捉性能。另外,若所述化合物滲出,則亦有污染被密封物的擔憂。 On the other hand, in the cured product of the sealing material of the present invention, water is trapped by the acid anhydride group of the acid anhydride derivative (C) having a polymerizable functional group. Here, it is considered that even a normal acid anhydride such as hexahydrophthalic anhydride can capture the invaded water, and it is effective to add it to the sealing material. However, the usual acid anhydride does not undergo polymerization with other components in the sealing material. Therefore, it is easy to bleed out after the sealing material is hardened, and it is difficult to fully exhibit the moisture capturing performance. Further, if the compound bleeds out, there is a concern that the sealed object is contaminated.
相對於此,本發明的密封材所包含的酸酐衍生物(C)具有可自由基聚合反應的官能基,與含有聚合性官能基的烯烴系聚合物(A)或聚合性單體(B)等進行聚合反應。因此,在硬化物中均勻地存在源自酸酐衍生物(C)的結構(酸酐基)。即,在本發明的密封材的硬化物中,捕捉水分的成分(酸酐衍生物(C))不滲出,而可效率佳地捕捉水分。 On the other hand, the acid anhydride derivative (C) contained in the sealing material of the present invention has a functional group capable of radical polymerization, and an olefin-based polymer (A) or a polymerizable monomer (B) containing a polymerizable functional group. The polymerization reaction is carried out. Therefore, the structure (anhydride group) derived from the acid anhydride derivative (C) is uniformly present in the cured product. In other words, in the cured product of the sealing material of the present invention, the component (the acid anhydride derivative (C)) which captures moisture does not bleed out, and the moisture can be efficiently captured.
另外,在本發明的密封材中,藉由含有聚合性官能基的 烯烴系聚合物(A)與酸酐衍生物(C)聚合,而硬化物的交聯密度難以過度提高。其結果是,密封材在硬化時難以收縮,與密封材的硬化物積層的基板等難以產生翹曲等。而且,由於硬化物的彈性模數適度低、可吸收來自外部的負載等,因此可充分保護被密封物不受來自外部的應力應變等的影響。 Further, in the sealing material of the present invention, by containing a polymerizable functional group The olefin-based polymer (A) and the acid anhydride derivative (C) are polymerized, and it is difficult to excessively increase the crosslinking density of the cured product. As a result, it is difficult for the sealing material to shrink during curing, and it is difficult to cause warpage or the like on the substrate or the like which is laminated with the cured material of the sealing material. Further, since the cured product has a moderately low modulus of elasticity and can absorb a load or the like from the outside, it is possible to sufficiently protect the object to be sealed from stress strain and the like from the outside.
另外,在本發明的密封材不含含有聚合性官能基的烯烴系聚合物(A)、或其含量充分少時,密封材的黏度變低。其結果是,可藉由噴墨法等塗佈密封材,可使所得的硬化物(密封層)的厚度變薄。 In addition, when the sealing material of the present invention does not contain the polymerizable functional group-containing olefin-based polymer (A) or the content thereof is sufficiently small, the viscosity of the sealing material becomes low. As a result, the thickness of the obtained cured product (sealing layer) can be reduced by applying a sealing material by an inkjet method or the like.
以下,對本發明的密封材可包含的含有聚合性官能基的烯烴系聚合物(A)、聚合性單體(B)、酸酐衍生物(C)、及自由基聚合起始劑(D)、及其他成分進行說明。 Hereinafter, the polymerizable functional group-containing olefin-based polymer (A), the polymerizable monomer (B), the acid anhydride derivative (C), and the radical polymerization initiator (D) which may be contained in the sealing material of the present invention, And other ingredients to explain.
1-1.含有聚合性官能基的烯烴系聚合物(A) 1-1. Olefin-based polymer containing a polymerizable functional group (A)
含有聚合性官能基的烯烴系聚合物(A)是在每一分子中具有至少一個可自由基聚合的官能基,且數量平均分子量為5000以上、70000以下的烯烴系聚合物。 The olefin-based polymer (A) having a polymerizable functional group is an olefin-based polymer having at least one radical polymerizable functional group per molecule and having a number average molecular weight of 5,000 or more and 70,000 or less.
含有聚合性官能基的烯烴系聚合物(A)的數量平均分子量為5000以上、70000以下,較佳為10000~40000。若含有聚合性官能基的烯烴系聚合物(A)的數量平均分子量為70000以下,則密封材的流動性充分提高,而容易藉由密封材將各種構件密封。另一方面,若含有聚合性官能基的烯烴系聚合物(A)的數量平均分子量為5000以上,則密封材的硬化物的彈性模數容易變 低。 The number average molecular weight of the olefin-based polymer (A) having a polymerizable functional group is 5,000 or more and 70,000 or less, preferably 10,000 to 40,000. When the number average molecular weight of the olefin-based polymer (A) containing a polymerizable functional group is 70,000 or less, the fluidity of the sealing material is sufficiently improved, and various members are easily sealed by a sealing material. On the other hand, when the number average molecular weight of the olefin-based polymer (A) containing a polymerizable functional group is 5,000 or more, the elastic modulus of the cured product of the sealing material is liable to change. low.
此處,含有聚合性官能基的烯烴系聚合物(A)每一分子中所含的可自由基聚合的官能基的數量為1以上即可,根據所期望的密封材的硬化物的彈性模數等進行適當設定。若含有聚合性官能基的烯烴系聚合物(A)所含的可自由基聚合的官能基的數量變多,則密封材的硬化物的彈性模數容易提高。 Here, the number of the radically polymerizable functional groups contained in each molecule of the olefin-based polymer (A) containing a polymerizable functional group may be 1 or more, and the elastic modulus of the cured product of the sealing material may be desired. The number is set appropriately. When the number of radical polymerizable functional groups contained in the olefin-based polymer (A) containing a polymerizable functional group increases, the elastic modulus of the cured product of the sealing material is likely to be improved.
含有聚合性官能基的烯烴系聚合物(A)所含的可自由基聚合的官能基,可為具有乙烯性不飽和鍵的官能基。具體為(甲基)丙烯醯基、乙烯基、烯丙基、乙烯醚基等,就反應性等的觀點而言,較佳為(甲基)丙烯醯基等。在含有聚合性官能基的烯烴系聚合物(A)中包含多個可自由基聚合的官能基時,所述多個可自由基聚合的官能基可為相同種類的官能基,亦可為不同種類的官能基。 The radically polymerizable functional group contained in the olefin-based polymer (A) containing a polymerizable functional group may be a functional group having an ethylenically unsaturated bond. Specific examples thereof include a (meth) acrylonitrile group, a vinyl group, an allyl group, and a vinyl ether group. From the viewpoint of reactivity and the like, a (meth) acrylonitrile group or the like is preferable. When the polymerizable functional group-containing olefin-based polymer (A) contains a plurality of radically polymerizable functional groups, the plurality of radically polymerizable functional groups may be the same kind of functional groups or may be different a class of functional groups.
含有聚合性官能基的烯烴系聚合物(A)可為將「聚烯烴系聚合物」、與「具有可自由基聚合的官能基的化合物」共聚合而成的化合物,或者可為藉由「具有可自由基聚合的官能基的化合物」將「聚烯烴系聚合物」改質而得的化合物。可自由基聚合的官能基可直接鍵結於聚烯烴系聚合物,亦可經由二價連結基鍵結於聚烯烴系聚合物。將可自由基聚合的官能基連結的連結基的種類並無特別限制,可列舉:可具有取代基的碳數為4~12的直鏈或支鏈狀伸烷基;可具有取代基的碳數為4~12的伸環烷基等。另外,連結基可包括一部分-COO-、-O-等。 The olefin-based polymer (A) containing a polymerizable functional group may be a compound obtained by copolymerizing a "polyolefin-based polymer" and a "compound having a radical polymerizable functional group", or may be A compound having a radical polymerizable functional group, which is a compound obtained by modifying a "polyolefin-based polymer". The radically polymerizable functional group may be directly bonded to the polyolefin-based polymer or may be bonded to the polyolefin-based polymer via a divalent linking group. The type of the linking group to which the radically polymerizable functional group is bonded is not particularly limited, and examples thereof include a linear or branched alkyl group having 4 to 12 carbon atoms which may have a substituent; and a carbon which may have a substituent The number is 4 to 12, such as a cycloalkyl group. In addition, the linking group may include a portion of -COO-, -O-, and the like.
另外,作為連結基所含的取代基,例如可列舉:烷基、羥基、烷氧基、羧基、烷氧基烷氧基、芳烷氧基、芳基、芳氧基、芳氧基烷氧基、烷硫基、烷硫基烷硫基、芳烷硫基、芳硫基、芳硫基烷硫基、鹵素原子等。 Further, examples of the substituent contained in the linking group include an alkyl group, a hydroxyl group, an alkoxy group, a carboxyl group, an alkoxy alkoxy group, an aralkyloxy group, an aryl group, an aryloxy group, and an aryloxyalkoxy group. A base, an alkylthio group, an alkylthioalkylthio group, an aralkylthio group, an arylthio group, an arylthioalkylthio group, a halogen atom or the like.
作為在烯烴系聚合物上「經由連結基而鍵結的可自由基聚合的官能基」的例子,例如可列舉:下述通式(Y2)所示的基團。 Examples of the "radical-polymerizable functional group bonded via a linking group" on the olefin-based polymer include a group represented by the following formula (Y2).
所述通式(Y2)中,R13表示氫原子或甲基。所述通式中,R14表示碳數為2~12、較佳為碳數為2~6的伸烷基。伸烷基表示直鏈伸烷基、支鏈伸烷基、或伸環烷基的任一種。另外,在通式(Y2)中,q表示1以上、23以下的數。含有聚合性官能基的烯烴系聚合物(A)的一分子內可僅包含一種所述通式(Y2)所示的基團,亦可包含兩種以上。 In the formula (Y2), R 13 represents a hydrogen atom or a methyl group. In the above formula, R 14 represents an alkylene group having 2 to 12 carbon atoms, preferably 2 to 6 carbon atoms. The alkylene group means any one of a linear alkyl group, a branched alkyl group, or a cycloalkyl group. Further, in the general formula (Y2), q represents a number of 1 or more and 23 or less. The olefin-based polymer (A) containing a polymerizable functional group may contain only one type of the group represented by the above formula (Y2) in one molecule, or may contain two or more types.
另一方面,含有聚合性官能基的烯烴系聚合物(A)的作為主骨架的聚烯烴系聚合物,可為選自碳原子數為2~20的烯烴的至少一種烯烴的聚合物。所述聚烯烴系聚合物可為一種烯烴 的均聚物,亦可為兩種以上烯烴的無規共聚物或嵌段共聚物。 On the other hand, the polyolefin-based polymer as the main skeleton of the polymerizable functional group-containing olefin-based polymer (A) may be a polymer of at least one olefin selected from the group consisting of olefins having 2 to 20 carbon atoms. The polyolefin-based polymer may be an olefin The homopolymer may also be a random copolymer or a block copolymer of two or more kinds of olefins.
用以獲得聚烯烴系聚合物的碳原子數為2~20的烯烴的例子包括:乙烯、丙烯、1-丁烯、1-戊烯、3-甲基-1-丁烯、1-己烯、4-甲基-1-戊烯、3-甲基-1-戊烯、1-辛烯、1-癸烯、1-十二碳烯、1-十四碳烯、1-十六碳烯、1-十八碳烯、1-二十碳烯等碳原子數為2~20的直鏈狀或支鏈狀α-烯烴;環戊烯、環庚烯、降冰片烯、5-甲基-2-降冰片烯、四環十二碳烯、2-甲基-1,4,5,8-二甲橋-1,2,3,4,4a,5,8,8a-八氫萘等碳原子數為3~20的環狀烯烴。 Examples of the olefin having a carbon number of 2 to 20 for obtaining a polyolefin-based polymer include ethylene, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, and 1-hexene. , 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene a linear or branched α-olefin having 2 to 20 carbon atoms such as aene, 1-octadecene or 1-eicene; cyclopentene, cycloheptene, norbornene, 5-methyl Base-2-norbornene, tetracyclododecene, 2-methyl-1,4,5,8-dimethyl bridge-1,2,3,4,4a,5,8,8a-octahydrogen A cyclic olefin having 3 to 20 carbon atoms such as naphthalene.
另外,用以獲得聚烯烴系聚合物的碳原子數為2~20的烯烴亦包括:乙烯基環己烷、或二烯、多烯等。二烯或多烯的例子包括:碳原子數為4~20、且具有兩個以上雙鍵的環狀或鏈狀化合物。具體包括:丁二烯、異戊二烯、4-甲基-1,3-戊二烯、1,3-戊二烯、1,4-戊二烯、1,5-己二烯、1,4-己二烯、1,3-己二烯、1,3-辛二烯、1,4-辛二烯、1,5-辛二烯、1,6-辛二烯、1,7-辛二烯、亞乙基降冰片烯、乙烯基降冰片烯、二環戊二烯、7-甲基-1,6-辛二烯、4-亞乙基-8-甲基-1,7-壬二烯、5,9-二甲基-1,4,8-癸三烯等。 Further, the olefin having 2 to 20 carbon atoms for obtaining the polyolefin-based polymer also includes vinylcyclohexane, a diene, a polyene or the like. Examples of the diene or polyene include a cyclic or chain compound having 4 to 20 carbon atoms and having two or more double bonds. Specifically includes: butadiene, isoprene, 4-methyl-1,3-pentadiene, 1,3-pentadiene, 1,4-pentadiene, 1,5-hexadiene, 1 , 4-hexadiene, 1,3-hexadiene, 1,3-octadiene, 1,4-octadiene, 1,5-octadiene, 1,6-octadiene, 1,7 -octadiene, ethylidene norbornene, vinyl norbornene, dicyclopentadiene, 7-methyl-1,6-octadiene, 4-ethylene-8-methyl-1, 7-decadiene, 5,9-dimethyl-1,4,8-nonanetriene, and the like.
聚烯烴系聚合物的具體例包括:高密度聚乙烯、中密度聚乙烯等聚乙烯;聚丙烯;聚-1-丁烯;聚甲基丁烯;乙烯/α-烯烴共聚物;乙烯系彈性體、丙烯系彈性體、異戊二烯橡膠等烯烴系彈性體等。聚烯烴系聚合物較佳為烯烴系彈性體,特佳為異戊二烯橡膠。 Specific examples of the polyolefin-based polymer include polyethylene such as high-density polyethylene and medium-density polyethylene; polypropylene; poly-1-butene; polymethylbutene; ethylene/α-olefin copolymer; and ethylene-based elasticity An olefin-based elastomer such as a propylene elastomer or an isoprene rubber. The polyolefin-based polymer is preferably an olefin-based elastomer, and particularly preferably an isoprene rubber.
另外,與所述聚烯烴系聚合物反應的「具有可自由基聚 合的官能基的化合物」的一例包括:後述聚合性單體(B)或其衍生物等。藉由利用公知的方法使所述「具有可自由基聚合的官能基的化合物」與聚烯烴系聚合物反應,而可獲得含有聚合性官能基的烯烴系聚合物(A)。 In addition, the reaction with the polyolefin-based polymer "has a radically polymerizable An example of the compound of the functional group to be combined includes a polymerizable monomer (B) or a derivative thereof described later. The "olefin having a radical polymerizable functional group" and a polyolefin-based polymer are reacted by a known method to obtain a polymerizable functional group-containing olefin-based polymer (A).
1-2.聚合性單體(B) 1-2. Polymerizable monomer (B)
聚合性單體(B)是在每一分子中具有至少一個可自由基聚合的官能基、分子量為50以上、1000以下、在23℃下為液狀的化合物。若密封材包含聚合性單體(B),則密封材的黏度容易變低,而且密封材的硬化物的交聯密度提高。另外,聚合性單體(B)設為不包括相當於後述酸酐衍生物(C)者。 The polymerizable monomer (B) is a compound having at least one radical polymerizable functional group per molecule, a molecular weight of 50 or more, 1,000 or less, and a liquid at 23 °C. When the sealing material contains the polymerizable monomer (B), the viscosity of the sealing material tends to be low, and the crosslinking density of the cured product of the sealing material is improved. Further, the polymerizable monomer (B) is not necessarily included in the acid anhydride derivative (C) described later.
聚合性單體(B)的每一分子中所含的可自由基聚合的官能基的數量為1以上即可,較佳為1~16,更佳為1~4,尤佳為1~3。聚合性單體(B)所含的可自由基聚合的官能基可為乙烯基、(甲基)丙烯醯基、烯丙基、乙烯醚基等,較佳為(甲基)丙烯醯基。在聚合性單體(B)中包含多個可自由基聚合的官能基時,所述多個可自由基聚合的官能基可為相同種類的官能基,亦可為不同種類的官能基。 The number of the radically polymerizable functional groups contained in each molecule of the polymerizable monomer (B) may be 1 or more, preferably 1 to 16, more preferably 1 to 4, and particularly preferably 1 to 3. . The radically polymerizable functional group contained in the polymerizable monomer (B) may be a vinyl group, a (meth) acrylonitrile group, an allyl group, a vinyl ether group or the like, and is preferably a (meth) acrylonitrile group. When the polymerizable monomer (B) contains a plurality of radically polymerizable functional groups, the plurality of radically polymerizable functional groups may be the same kind of functional groups, or may be different kinds of functional groups.
另一方面,聚合性單體(B)的分子量為50~1000,較佳為50~500。若聚合性單體(B)的分子量為所述範圍,則容易充分調整密封材的黏度。 On the other hand, the polymerizable monomer (B) has a molecular weight of 50 to 1,000, preferably 50 to 500. When the molecular weight of the polymerizable monomer (B) is in the above range, it is easy to sufficiently adjust the viscosity of the sealing material.
聚合性單體(B)的例子包括:在一分子內具有一個(甲基)丙烯醯基的單(甲基)丙烯酸系單體、及在一分子內具有兩個(甲 基)丙烯醯基的二(甲基)丙烯酸系單體。 Examples of the polymerizable monomer (B) include a mono(meth)acrylic monomer having one (meth)acrylinyl group in one molecule, and two in one molecule (A) A acrylonitrile-based di(meth)acrylic monomer.
作為在一分子內具有一個(甲基)丙烯醯基的單(甲基)丙烯酸系單體,例如可列舉:下述通式(1B)所示的單體。 The mono(meth)acrylic monomer having one (meth)acrylinyl group in one molecule is, for example, a monomer represented by the following formula (1B).
通式(1B)中的R7表示氫原子或甲基。另外,通式(1B)中的R8表示氫原子、或碳數為4~18的烴基。碳數為4~18的烴基表示直鏈烷基、支鏈烷基、或脂環式烴基。 R 7 in the formula (1B) represents a hydrogen atom or a methyl group. Further, R 8 in the formula (1B) represents a hydrogen atom or a hydrocarbon group having 4 to 18 carbon atoms. The hydrocarbon group having 4 to 18 carbon atoms represents a linear alkyl group, a branched alkyl group, or an alicyclic hydrocarbon group.
所述通式(1B)所示的單(甲基)丙烯酸系單體的具體例包括:(甲基)丙烯酸、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異肉豆蔻酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸環己酯、丙烯酸二環戊烯氧基乙酯等。本發明的密封材中可僅包含一種所述單(甲基)丙烯酸系單體,並且亦可包含兩種以上。 Specific examples of the mono(meth)acrylic monomer represented by the above formula (1B) include: (meth)acrylic acid, n-butyl (meth)acrylate, isobutyl (meth)acrylate, (a) 2-ethylhexyl acrylate, lauryl (meth)acrylate, isostearyl (meth)acrylate, isoamyl (meth)acrylate, isodecyl (meth)acrylate, (methyl) Isooctyl acrylate, isomyristyl (meth)acrylate, tridecyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentenyloxyethyl acrylate, and the like. The sealing material of the present invention may contain only one type of the mono(meth)acrylic monomer, and may also contain two or more types.
在一分子內具有兩個(甲基)丙烯醯基的二(甲基)丙烯酸 系單體,可為下述通式(2B)所示的單體。 Di(meth)acrylic acid having two (meth)acrylonitrile groups in one molecule The monomer may be a monomer represented by the following formula (2B).
通式(2B)中的R9及R10分別獨立地表示氫原子或甲基。另外,通式(2B)中,R11表示碳數為4~12的烴基。碳數為4~12的烴基表示直鏈伸烷基、支鏈伸烷基、或伸環烷基。 R 9 and R 10 in the formula (2B) each independently represent a hydrogen atom or a methyl group. Further, in the formula (2B), R 11 represents a hydrocarbon group having 4 to 12 carbon atoms. The hydrocarbon group having 4 to 12 carbon atoms represents a linear alkyl group, a branched alkyl group, or a cycloalkyl group.
所述通式(2B)所示的二(甲基)丙烯酸系單體的具體例包括:1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯等。密封材中可僅包含一種所述二(甲基)丙烯酸系單體,亦可包含兩種以上。 Specific examples of the di(meth)acrylic monomer represented by the above formula (2B) include: 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(methyl) ) acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and the like. The sealing material may contain only one kind of the above-mentioned di(meth)acrylic monomer, and may contain two or more types.
在密封材中包含單(甲基)丙烯酸系單體與二(甲基)丙烯酸系單體時,所述單體的含有比率為任意,但若二(甲基)丙烯酸系單體的含有比率變多,則高溫高濕環境下的密接可靠性提高。 When a mono(meth)acrylic monomer and a di(meth)acrylic monomer are contained in the sealing material, the content ratio of the monomer is arbitrary, but the content ratio of the di(meth)acrylic monomer is When the number is increased, the adhesion reliability in a high-temperature and high-humidity environment is improved.
另外,聚合性單體(B)的例子亦包括:在一分子內具有一個以上乙烯基的單體、在一分子內具有一個以上烯丙基的單體、在一分子內具有一個以上乙烯醚基的單體、在一分子內具有(甲基)丙烯醯基的乙烯醚化合物。 Further, examples of the polymerizable monomer (B) include a monomer having one or more vinyl groups in one molecule, a monomer having one or more allyl groups in one molecule, and one or more vinyl ethers in one molecule. A monomer of a group, a vinyl ether compound having a (meth) acrylonitrile group in one molecule.
在一分子內具有一個乙烯基的單體的例子包括:苯乙烯、對羥基苯乙烯、對氯苯乙烯、對溴苯乙烯、對甲基苯乙烯、對甲氧基苯乙烯、對第三丁氧基苯乙烯、對第三丁氧基羰氧基苯乙烯、1-乙烯基萘、2-乙烯基萘等芳香族系乙烯化合物;1-庚烯、3,3-二甲基-1-戊烯、4,4-二甲基-1-戊烯、2,4-二苯基-4-甲基-1-戊烯、3-甲基-1-己烯、4-甲基-1-己烯、5-甲基-1-己烯、1-辛烯、2,2-二甲基-1-己烯、3,4-二甲基-1-己烯、4,4-二甲基-1-己烯、1-壬烯、3,5,5-三甲基-1-己烯、1-癸烯、1-十一碳烯、1-十二碳烯、1-十三碳烯、1-十四碳烯、1-十五碳烯、1-十六碳烯、1-十七碳烯、1-十八碳烯、1-十九碳烯、1-二十碳烯、1-二十二碳烯等脂肪族系乙烯化合物;乙酸乙烯酯、單氯乙酸乙烯酯、苯甲酸乙烯酯、特戊酸乙烯酯、丁酸乙烯酯、月桂酸乙烯酯、己二酸乙烯酯、甲基丙烯酸乙烯酯、丁烯酸乙烯酯、2-乙基己酸乙烯酯等羧酸乙烯酯化合物;N-乙烯基咔唑、N-乙烯基吡咯啶酮等含有氮原子的乙烯化合物。 Examples of the monomer having a vinyl group in one molecule include: styrene, p-hydroxystyrene, p-chlorostyrene, p-bromostyrene, p-methylstyrene, p-methoxystyrene, and p-butadiene An aromatic vinyl compound such as oxystyrene, p-tert-butoxycarbonyloxystyrene, 1-vinylnaphthalene or 2-vinylnaphthalene; 1-heptene, 3,3-dimethyl-1- Pentene, 4,4-dimethyl-1-pentene, 2,4-diphenyl-4-methyl-1-pentene, 3-methyl-1-hexene, 4-methyl-1 -hexene, 5-methyl-1-hexene, 1-octene, 2,2-dimethyl-1-hexene, 3,4-dimethyl-1-hexene, 4,4-di Methyl-1-hexene, 1-decene, 3,5,5-trimethyl-1-hexene, 1-decene, 1-undecene, 1-dodecene, 1-ten Tricarbene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, 1-twenty An aliphatic vinyl compound such as carbene or 1-docosene; vinyl acetate, vinyl monochloroacetate, vinyl benzoate, vinyl pivalate, vinyl butyrate, vinyl laurate, and dimethoate Vinyl acetate, vinyl methacrylate, crotonic acid A vinyl carboxylate compound such as vinyl ester or vinyl 2-ethylhexanoate; or a vinyl compound containing a nitrogen atom such as N-vinylcarbazole or N-vinylpyrrolidone.
在一分子內具有一個以上烯丙基的單體的例子包括:鄰苯二甲酸二烯丙酯、間苯二甲酸二烯丙酯、對苯二甲酸二烯丙酯、三羥甲基丙烷二烯丙醚、異三聚氰酸三烯丙酯、異三聚氰酸三甲基烯丙酯、三聚氰酸三烯丙酯等。 Examples of the monomer having one or more allyl groups in one molecule include: diallyl phthalate, diallyl isophthalate, diallyl terephthalate, trimethylolpropane II Allyl ether, triallyl cyanurate, trimethylallyl isocyanurate, triallyl cyanurate, and the like.
在一分子內具有一個以上乙烯醚基的單體的例子包括:乙基乙烯醚、異丁基乙烯醚、丁二醇二乙烯醚、環己基乙烯醚、羥基丁基乙烯醚、羥基乙基乙烯醚、環己烷二甲醇二乙烯醚、 環己烷二甲醇單乙烯醚、二乙二醇二乙烯醚、三乙二醇二乙烯醚、三乙二醇單乙烯醚等。 Examples of the monomer having one or more vinyl ether groups in one molecule include ethyl vinyl ether, isobutyl vinyl ether, butanediol divinyl ether, cyclohexyl vinyl ether, hydroxybutyl vinyl ether, hydroxyethyl ethylene. Ether, cyclohexane dimethanol divinyl ether, Cyclohexane dimethanol monovinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, triethylene glycol monovinyl ether, and the like.
在一分子內具有(甲基)丙烯醯基的乙烯醚化合物的例子包括:丙烯酸2-(2-乙烯氧基乙氧基)乙酯、或甲基丙烯酸2-(2-乙烯氧基乙氧基)乙酯等。 Examples of the vinyl ether compound having a (meth)acryl fluorenyl group in one molecule include 2-(2-vinyloxyethoxy)ethyl acrylate or 2-(2-ethyleneoxyethoxy) methacrylate Ethyl ester and the like.
1-3.酸酐衍生物(C) 1-3. Anhydride derivative (C)
酸酐衍生物(C)是具有每一分子中至少一個可自由基聚合的官能基、構成五員環或六員環的酸酐基的化合物,例如可為在各種酸酐上鍵結可自由基聚合的官能基的化合物。酸酐衍生物(C)的每一分子所含的可自由基聚合的官能基的數量為1以上即可,較佳為1。若在酸酐衍生物(C)中包含可自由基聚合的官能基,則在密封材的硬化時,所述聚合性單體(B)、或含有聚合性官能基的烯烴系聚合物(A)與酸酐衍生物(C)聚合,而抑制酸酐衍生物(C)的滲出。 The acid anhydride derivative (C) is a compound having at least one radical polymerizable functional group in each molecule and constituting an acid anhydride group of a five-membered ring or a six-membered ring, and may be, for example, a radically polymerizable bond on various acid anhydrides. A functional group of compounds. The number of the radically polymerizable functional groups contained in each molecule of the acid anhydride derivative (C) may be 1 or more, preferably 1. When the acid anhydride derivative (C) contains a radical polymerizable functional group, the polymerizable monomer (B) or the polymerizable functional group-containing olefin polymer (A) at the time of curing of the sealing material The acid anhydride derivative (C) is polymerized to inhibit the bleeding of the acid anhydride derivative (C).
酸酐衍生物(C)所含的可自由基聚合的官能基可為具有乙烯性不飽和鍵的官能基。具體為(甲基)丙烯醯基、乙烯基、烯丙基、乙烯醚基等,就反應性等的觀點而言,較佳為(甲基)丙烯醯基等。可自由基聚合的官能基可直接鍵結於包含酸酐基的主骨架上,亦可經由連結基而鍵結。連結基可與所述含有聚合性官能基的烯烴系聚合物(A)的將可自由基聚合的官能基與聚烯烴系聚合物連結的連結基相同。在酸酐衍生物(C)中包含多個可自由基聚合的官能基時,所述多個可自由基聚合的官能基可為相同種類的 官能基,亦可為不同種類的官能基。 The radically polymerizable functional group contained in the acid anhydride derivative (C) may be a functional group having an ethylenically unsaturated bond. Specific examples thereof include a (meth) acrylonitrile group, a vinyl group, an allyl group, and a vinyl ether group. From the viewpoint of reactivity and the like, a (meth) acrylonitrile group or the like is preferable. The radically polymerizable functional group may be directly bonded to the main skeleton including the acid anhydride group, or may be bonded via a linking group. The linking group may be the same as the linking group of the polymerizable functional group-containing olefin polymer (A) in which the radical polymerizable functional group is bonded to the polyolefin polymer. When the acid anhydride derivative (C) comprises a plurality of radically polymerizable functional groups, the plurality of radically polymerizable functional groups may be of the same kind The functional groups may also be different kinds of functional groups.
酸酐衍生物(C)例如可為下述通式(1C)所示的化合物。 The acid anhydride derivative (C) can be, for example, a compound represented by the following formula (1C).
所述通式(1C)中,X表示碳數為2~14的有機基(其中,酸酐基彼此間所含的碳數為2或3),R1表示可自由基聚合的官能基,Y表示單鍵或連結基。另外,n表示1以上、12以下的數。 In the above formula (1C), X represents an organic group having 2 to 14 carbon atoms (wherein the number of carbon atoms contained in the acid anhydride groups is 2 or 3), and R 1 represents a radically polymerizable functional group, Y Represents a single bond or a linker. Further, n represents a number of 1 or more and 12 or less.
所述通式(1C)中的X例如可為:脂肪族基;單環式脂肪族基;縮合多環式脂肪族基;單環式芳香族基;縮合多環式芳香族基;環式脂肪族基直接或藉由交聯員而相互連結的非縮合多環式脂肪族基;芳香族基直接或藉由交聯員而相互連結的非縮合多環式芳香族基。 X in the above formula (1C) may be, for example, an aliphatic group; a monocyclic aliphatic group; a condensed polycyclic aliphatic group; a monocyclic aromatic group; a condensed polycyclic aromatic group; A non-condensed polycyclic aliphatic group in which an aliphatic group is bonded to each other directly or by a crosslinker; a non-condensed polycyclic aromatic group in which an aromatic group is bonded to each other directly or by a crosslinker.
所述X更具體為源自各種酸酐的結構,例如可為源自芳香族二羧酸酐、脂環族二羧酸酐的基團。芳香族二羧酸酐的例子包括:鄰苯二甲酸酐、萘二甲酸酐、蒽二甲酸酐等。另一方面,脂環族二羧酸酐的例子包括:琥珀酸酐、順丁烯二酸酐、四氫鄰 苯二甲酸酐、六氫鄰苯二甲酸酐、5-降冰片烯-2,3-二甲酸酐、(1α,4α)-降冰片烷-2α,3α-二甲酸酐等。 The X is more specifically a structure derived from various acid anhydrides, and may be, for example, a group derived from an aromatic dicarboxylic anhydride or an alicyclic dicarboxylic anhydride. Examples of the aromatic dicarboxylic acid anhydride include phthalic anhydride, naphthalic anhydride, phthalic anhydride, and the like. On the other hand, examples of the alicyclic dicarboxylic anhydride include succinic anhydride, maleic anhydride, and tetrahydrogen Phthalic anhydride, hexahydrophthalic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, (1α, 4α)-norbornane-2α, 3α-dicarboxylic anhydride, and the like.
另外,X可具有取代基。取代基可為碳數為1~6的烷基、碳數為1~6的烷氧基、苯氧基、鹵素等。 Further, X may have a substituent. The substituent may be an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group or a halogen.
另一方面,所述通式(1C)中的R1具體可為(甲基)丙烯醯基、乙烯基、烯丙基、乙烯醚基。 On the other hand, R 1 in the above formula (1C) may specifically be a (meth) acrylonitrile group, a vinyl group, an allyl group or a vinyl ether group.
另外,在所述通式(1C)中的Y為連結基時,Y可為選自碳數為1~10的伸烷基、包含一個~三個不飽和基的碳數為2~10的伸烯基、或伸苯基的二價連結基。所述連結基的一部分氫可被鹵素取代。 Further, when Y in the above formula (1C) is a linking group, Y may be an alkylene group selected from a carbon number of 1 to 10, and a carbon number of 2 to 10 containing one to three unsaturated groups. An alkenyl group or a divalent linking group that stretches a phenyl group. A portion of the hydrogen of the linking group may be replaced by a halogen.
所述通式(1C)所示的酸酐衍生物較佳為六氫鄰苯二甲酸酐衍生物(C')或鄰苯二甲酸酐衍生物(C"),特佳為六氫鄰苯二甲酸酐衍生物(C')。 The acid anhydride derivative represented by the above formula (1C) is preferably a hexahydrophthalic anhydride derivative (C') or a phthalic anhydride derivative (C"), particularly preferably a hexahydrophthalic acid derivative. Formaldehyde anhydride derivative (C').
作為六氫鄰苯二甲酸酐衍生物的具體例,可列舉:下述通式(2C)所示的化合物。所述化合物的分子量較佳為296~5000。 Specific examples of the hexahydrophthalic anhydride derivative include compounds represented by the following formula (2C). The molecular weight of the compound is preferably from 296 to 5,000.
所述通式(2C)中,n表示1以上、4以下的數。另外,所述通式(2C)中,R11分別獨立地表示包含一個以上可自由基聚合的官能基的基團。R11較佳為下述通式(X1)所示的基團、包含乙烯基的基團、包含烯丙基的基團、或包含乙烯醚基的基團。 In the above formula (2C), n represents a number of 1 or more and 4 or less. Further, in the above formula (2C), R 11 each independently represents a group containing one or more radically polymerizable functional groups. R 11 is preferably a group represented by the following formula (X1), a group containing a vinyl group, a group containing an allyl group, or a group containing a vinyl ether group.
所述通式(X1)中,R3為氫原子或甲基。所述通式中,R4表示碳數為2~12、較佳為碳數為2~6的直鏈伸烷基、支鏈伸烷基、或伸環烷基。另外,在通式(X1)中,p表示1以上、23以下的數。 In the above formula (X1), R 3 is a hydrogen atom or a methyl group. In the above formula, R 4 represents a linear alkyl group, a branched alkyl group, or a cycloalkyl group having a carbon number of 2 to 12, preferably 2 to 6 carbon atoms. Further, in the general formula (X1), p represents a number of 1 or more and 23 or less.
另外,在所述通式(2C)中相當於R11的「包含乙烯基的基團」的例子包括:1,3-二側氧基八氫異苯并呋喃-5-甲酸3-丁烯-1-基酯基、1,3-二側氧基八氫異苯并呋喃-5-甲酸5-己基-1-基酯基、1,3-二側氧基八氫異苯并呋喃-5-甲酸7-辛烯-1-基酯基。 Further, examples of the "vinyl group-containing group" corresponding to R 11 in the above formula (2C) include: 1,3-dimethoxy octahydroisobenzofuran-5-carboxylic acid 3-butene -1-yl ester group, 1,3-dihydroxy octahydroisobenzofuran-5-carboxylic acid 5-hexyl-1-yl ester, 1,3-di- oxy octahydroisobenzofuran- 5-carboxylic acid 7-octene-1-yl ester group.
而且,在所述通式(2C)中,相當於R11的「包含烯丙基的基團」的例子包括:1,3-二側氧基八氫異苯并呋喃-5-甲酸烯丙酯基、1,3-二側氧基八氫異苯并呋喃-5-甲酸2-(烯丙氧基)乙酯基。 Further, in the above formula (2C), examples of the "allyl-containing group" corresponding to R 11 include: 1,3-di- oxy octahydroisobenzofuran-5-carboxylic acid allylic acid Ester group, 1,3-dihydroxy octahydroisobenzofuran-5-carboxylic acid 2-(allyloxy)ethyl ester group.
在所述通式(2C)中,相當於R11的「包含乙烯醚基的 基團」的例子包括:1,3-二側氧基八氫異苯并呋喃-5-甲酸2-(乙烯氧基)乙酯基、1,3-二側氧基八氫異苯并呋喃-5-甲酸2-(2-(乙烯氧基)乙氧基)乙酯基、1,3-二側氧基八氫異苯并呋喃-5-甲酸4-(乙烯氧基)丁酯基。 In the above formula (2C), "corresponding to R11" Examples of the group include: 1,3-dimethoxy octahydroisobenzofuran-5-carboxylic acid 2-(vinyloxy)ethyl ester, 1,3-di- oxy octahydroisobenzofuran -5-carboxylic acid 2-(2-(vinyloxy)ethoxy)ethyl ester, 1,3-dimethoxy octahydroisobenzofuran-5-carboxylic acid 4-(vinyloxy)butyl ester .
所述通式(2C)所示的化合物可具有取代基。取代基只要不損害本發明的效果則並無特別限制,例如可為碳數為1~5的直鏈狀或支鏈狀烷基等。 The compound represented by the above formula (2C) may have a substituent. The substituent is not particularly limited as long as it does not impair the effects of the present invention, and may be, for example, a linear or branched alkyl group having 1 to 5 carbon atoms.
酸酐衍生物(C)的特佳的例子為下述通式(3C)所示的化合物。 A particularly preferred example of the acid anhydride derivative (C) is a compound represented by the following formula (3C).
所述通式(3C)中,R5表示氫原子或甲基。 In the above formula (3C), R 5 represents a hydrogen atom or a methyl group.
1-4.自由基聚合起始劑(D) 1-4. Radical polymerization initiator (D)
自由基聚合起始劑(D)是用以藉由加熱或光照射而使所述含有聚合性官能基的烯烴系聚合物(A)、酸酐衍生物(C)、或聚合性單體(B)進行自由基聚合的化合物。自由基聚合起始劑(D)可為光自由基聚合起始劑,亦可為熱自由基聚合起始劑。密封材 所含的自由基聚合起始劑(D)的種類根據密封材的硬化方法進行適當選擇,密封材中可僅包含所述自由基聚合起始劑(D)的任一者,亦可包含兩者。 The radical polymerization initiator (D) is an olefin-based polymer (A), an acid anhydride derivative (C), or a polymerizable monomer (B) containing a polymerizable functional group by heating or light irradiation. a compound that undergoes radical polymerization. The radical polymerization initiator (D) may be a photoradical polymerization initiator or a thermal radical polymerization initiator. Sealing material The type of the radical polymerization initiator (D) to be contained is appropriately selected depending on the method of curing the sealing material, and the sealing material may contain only one of the radical polymerization initiators (D), or may contain two By.
光自由基聚合起始劑並無特別限制,可為公知的光自由基聚合起始劑。光自由基聚合起始劑的例子包括:烷基苯酮系化合物、醯基氧化膦系化合物、二茂鈦系化合物、肟酯系化合物、安息香系化合物、苯乙酮系化合物、二苯甲酮系化合物、噻噸酮系化合物、α-醯肟酯系化合物、苯甲醯甲酸酯系化合物、苯偶醯系化合物、偶氮系化合物、二苯硫醚系化合物、有機色素系化合物、鐵-酞菁系化合物、安息香醚系化合物、蒽醌系化合物等。密封材中可僅包含一種所述光自由基聚合起始劑,亦可包含兩種以上。 The photoradical polymerization initiator is not particularly limited and may be a known photoradical polymerization initiator. Examples of the photoradical polymerization initiator include an alkylphenone compound, a mercaptophosphine oxide compound, a titanocene compound, an oxime ester compound, a benzoin compound, an acetophenone compound, and a benzophenone. Compound, thioxanthone compound, α-oxime ester compound, benzoic acid ester compound, benzoin compound, azo compound, diphenyl sulfide compound, organic pigment compound, iron a phthalocyanine compound, a benzoin ether compound, an anthraquinone compound, or the like. The sealing material may contain only one kind of the photoradical polymerization initiator, and may contain two or more kinds.
就反應性等的觀點而言,光自由基聚合起始劑特佳為烷基苯酮系化合物、醯基氧化膦系化合物。 The photoradical polymerization initiator is particularly preferably an alkylphenone compound or a mercaptophosphine oxide compound from the viewpoint of reactivity and the like.
另一方面,熱自由基聚合起始劑亦無特別限制,可為公知的熱自由基聚合起始劑。熱自由基聚合起始劑例如可為公知的有機過氧化物。熱自由基聚合起始劑的例子包括:過氧化2,4-二氯苯甲醯、過氧化特戊酸第三丁酯、過氧化3,5,5-三甲基己醯、過氧化辛醯、過氧化癸醯、過氧化月桂醯、過氧化琥珀酸、過氧化乙醯、過氧化(2-乙基己酸第三丁酯)、過氧化(2-乙基己酸第三戊酯)、過氧化間苯甲醯、過氧化苯甲醯、過氧化順丁烯二酸第三丁酯、過氧化月桂酸第三丁酯、過氧化-3,5,5-三甲基己酸第三丁酯、 過氧化環己酮、過氧化異丙基碳酸第三丁酯、2,5-二甲基-2,5-二(苯甲醯基過氧基)己烷、2,2-雙(第三丁基過氧基)辛烷、過氧化乙酸第三丁酯、2,2-雙(第三丁基過氧基)丁烷、過氧化苯甲酸第三丁酯、4,4-雙(第三丁基過氧基)戊酸正丁酯、過氧化間苯二甲酸二-第三丁酯、過氧化二異丙苯、過氧化甲基乙基酮等。密封材中可僅包含一種熱自由基聚合起始劑,且亦可包含兩種以上。 On the other hand, the thermal radical polymerization initiator is not particularly limited and may be a known thermal radical polymerization initiator. The thermal radical polymerization initiator may be, for example, a known organic peroxide. Examples of the thermal radical polymerization initiator include: 2,4-dichlorobenzidine peroxide, tert-butyl peroxypivalate, 3,5,5-trimethylhexyl peroxide, peroxyoctane Bismuth, ruthenium peroxide, ruthenium peroxide, peroxy succinic acid, acetonitrile peroxide, peroxidation (t-butyl 2-ethylhexanoate), peroxidation (third ester of 2-ethylhexanoate) ), benzammonium peroxide, benzamidine peroxide, tert-butyl peroxymaleate, tributyl butyl laurate, peroxy-3,5,5-trimethylhexanoic acid Third butyl ester, Cyclohexanone peroxide, tert-butyl isopropyl carbonate, 2,5-dimethyl-2,5-bis(benzylidene peroxy)hexane, 2,2-double (third Butylperoxy)octane, tert-butyl peroxyacetate, 2,2-bis(t-butylperoxy)butane, tert-butyl peroxybenzoate, 4,4-di( N-butylperoxy)n-butyl valerate, di-t-butyl peroxy isophthalate, dicumyl peroxide, methyl ethyl ketone peroxide, and the like. The sealing material may contain only one thermal radical polymerization initiator, and may also contain two or more types.
另外,密封材中可與自由基聚合起始劑一起包含自由基鏈轉移劑。若包含自由基鏈轉移劑,則密封材的硬化性進一步提高。自由基鏈轉移劑的例子包括:α甲基苯乙烯二聚物類、含有巰基的硫醇類、二苯基二硫化物等二硫化物類、末端不飽和甲基丙烯酸酯n聚物類、卟啉鈷錯合物類等。密封材中可僅包含一種自由基鏈轉移劑,亦可包含兩種以上。 Further, the sealing material may contain a radical chain transfer agent together with the radical polymerization initiator. When the radical chain transfer agent is contained, the hardenability of the sealing material is further improved. Examples of the radical chain transfer agent include α-methylstyrene dimers, mercapto-containing mercaptans, diphenyl disulfides and the like, and terminal unsaturated methacrylate n-polymers. Porphyrin cobalt complexes and the like. The sealing material may contain only one type of radical chain transfer agent, and may contain two or more types.
相對於具有自由基聚合性官能基的化合物的總量100質量份,自由基鏈轉移劑的含量較佳為0.1質量份~10質量份,更佳為0.5質量份~5質量份。 The content of the radical chain transfer agent is preferably from 0.1 part by mass to 10 parts by mass, more preferably from 0.5 part by mass to 5 parts by mass, per 100 parts by mass of the total of the compound having a radical polymerizable functional group.
1-5.其他成分 1-5. Other ingredients
在不大幅損害本發明的效果的範圍內,密封材中可包含其他樹脂。其他樹脂例如可為熱硬化性樹脂等。熱硬化性樹脂的例子包括:環氧樹脂、酚樹脂、鄰苯二甲酸二烯丙酯樹脂、脲樹脂、聚酯樹脂等。密封材中可僅包含一種熱硬化性樹脂,亦可包含兩種以上。 Other resins may be contained in the sealing material insofar as the effects of the present invention are not greatly impaired. The other resin may be, for example, a thermosetting resin or the like. Examples of the thermosetting resin include an epoxy resin, a phenol resin, a diallyl phthalate resin, a urea resin, a polyester resin, and the like. The sealing material may contain only one type of thermosetting resin, and may contain two or more types.
密封材中可包含填充材。密封材中所含的填充材的例子 包括:玻璃珠、苯乙烯系聚合物粒子、甲基丙烯酸酯系聚合物粒子、乙烯系聚合物粒子、丙烯系聚合物粒子等。密封材中可僅包含一種填充材,亦可包含兩種以上。 A filler may be included in the sealing material. Example of a filler contained in a sealing material The invention includes glass beads, styrene polymer particles, methacrylate polymer particles, ethylene polymer particles, and propylene polymer particles. The sealing material may contain only one type of filler, and may contain two or more types.
密封材中可包含改質劑或穩定劑。改質劑的具體例包括:抗老化劑、勻平劑、潤濕性改良劑、界面活性劑、塑化劑等。所述改質劑可單獨使用一種或組合兩種以上而使用。另一方面,穩定劑的具體例包括:紫外線吸收劑、防腐劑、抗菌劑等。所述改質劑或穩定劑在密封材中分別可僅包含一種,亦可包含兩種以上。 A modifier or stabilizer may be included in the sealant. Specific examples of the modifier include an anti-aging agent, a leveling agent, a wettability improver, a surfactant, a plasticizer, and the like. These modifiers may be used alone or in combination of two or more. On the other hand, specific examples of the stabilizer include an ultraviolet absorber, a preservative, an antibacterial agent, and the like. The modifier or the stabilizer may be contained in the sealing material alone or in combination of two or more.
密封材中可包含抗氧化劑。抗氧化劑是指使藉由電漿照射或日光照射而產生的自由基失活者(受阻胺光穩定劑(Hindered Amine Light Stabilizer,HALS))、或將過氧化物分解者等。抗氧化劑具有防止密封材的硬化物變色的功能。抗氧化劑可為受阻胺、酚系抗氧化劑、磷系抗氧化劑等。 An antioxidant may be included in the sealing material. The antioxidant is a person who inactivates a radical generated by plasma irradiation or sunlight irradiation (Hindered Amine Light Stabilizer (HALS)) or decomposes a peroxide. The antioxidant has a function of preventing discoloration of the cured product of the sealing material. The antioxidant may be a hindered amine, a phenolic antioxidant, a phosphorus antioxidant, or the like.
受阻胺的例子包括:雙(2,2,6,6-四甲基哌啶-4-基)癸二酸酯、2,4-二氯-6-第三辛基胺基-均三嗪與4,4'-六亞甲基雙(胺基-2,2,6,6-四甲基哌啶)的聚縮合產物、雙[1-(2-羥基-2-甲基丙氧基)-2,2,6,6-四甲基哌啶-4-基]癸二酸酯。 Examples of hindered amines include: bis(2,2,6,6-tetramethylpiperidin-4-yl)sebacate, 2,4-dichloro-6-th-octylamino-s-triazine Polycondensation product with 4,4'-hexamethylenebis(Amino-2,2,6,6-tetramethylpiperidine), bis[1-(2-hydroxy-2-methylpropoxy) -2,2,6,6-tetramethylpiperidin-4-yl] sebacate.
酚系抗氧化劑的例子包括:2,6-二-第三丁基-對甲酚等單酚類、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)等雙酚類、1,1,3-三(2-甲基-4-羥基-5-第三丁基苯基)丁烷等高分子型酚類。 Examples of the phenolic antioxidant include monophenols such as 2,6-di-t-butyl-p-cresol and 2,2'-methylenebis(4-methyl-6-tert-butylphenol). A polymer phenol such as a bisphenol or a 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane.
磷系抗氧化劑較佳為使用:選自亞磷酸酯類的抗氧化劑 及選自氧雜磷雜菲氧化物類的抗著色劑。 Phosphorus-based antioxidants are preferably used: antioxidants selected from phosphites And an anti-coloring agent selected from the group consisting of oxaphosphorus phenanthrene oxides.
特別是在賦予對紫外線的耐性的方面,較佳為廷納芬(Tinuvin)123(雙(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)癸二酸酯)、廷納芬(Tinuvin)765(雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯與1,2,2,6,6-五甲基-4-哌啶基癸二酸甲酯的混合物)、浩斯特賓(Hostavin)PR25(4-甲氧基苄基丙二酸二甲酯)、廷納芬(Tinuvin)312或浩斯特賓(Hostavin)vsu(乙烷醯胺N-(2-乙氧基苯基)-N'-(2-乙基苯基))、智瑪索布(CHIMASSORB)119 FL(N,N'-雙(3-胺基丙基)乙二胺-2,4-雙[N-丁基-N-(1,2,2,6,6-五甲基-4-哌啶基)胺基]-6-氯-1,3,5-三嗪縮合物。 Particularly, in terms of imparting resistance to ultraviolet rays, Tinuvin 123 (bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl)fluorene is preferred. Acid ester), Tinuvin 765 (bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and 1,2,2,6,6-five a mixture of methyl 4-piperidinyl sebacate), Hostavin PR25 (dimethyl 4-methoxybenzylmalonate), Tinuvin 312 or ho Hostavin vsu (ethane-amine N-(2-ethoxyphenyl)-N'-(2-ethylphenyl)), CHIMASSORB 119 FL (N, N '-Bis(3-Aminopropyl)ethylenediamine-2,4-bis[N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidinyl)amine a -6-chloro-1,3,5-triazine condensate.
本發明的密封材中根據需要可包含溶劑。溶劑具有使各成分均勻地分散或溶解的功能。溶劑的例子包括:甲苯、二甲苯等芳香族溶媒;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶媒;醚、二丁醚、四氫呋喃、二噁烷、乙二醇單烷醚等醚類;N-甲基吡咯啶酮等非質子性極性溶媒;乙酸乙酯、乙酸丁酯等酯類等。 The sealing material of the present invention may contain a solvent as needed. The solvent has a function of uniformly dispersing or dissolving each component. Examples of the solvent include aromatic solvents such as toluene and xylene; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; ether, dibutyl ether, tetrahydrofuran, dioxane, and ethylene glycol monoalkane. An ether such as ether; an aprotic polar solvent such as N-methylpyrrolidone; an ester such as ethyl acetate or butyl acetate.
1-6.密封材的組成 1-6. Composition of sealing material
如上所述般,本發明的密封材的組成根據密封材的用途進行適當選擇。例如在自噴墨頭噴出密封材而使用時,較佳為密封材的黏度低。因此,較佳為設為至少包含所述聚合性單體(B)、酸酐衍生物(C)、及自由基聚合起始劑(D)的組成。 As described above, the composition of the sealing material of the present invention is appropriately selected depending on the use of the sealing material. For example, when the sealing material is ejected from the ink jet head, it is preferred that the sealing material has a low viscosity. Therefore, it is preferable to have a composition containing at least the polymerizable monomer (B), the acid anhydride derivative (C), and the radical polymerization initiator (D).
此時,相對於密封材的總量,較佳為包含60質量%~96質量%的聚合性單體(B),更佳為70質量%~89質量%。若聚合 性單體(B)的量為60質量%以上,則密封材的硬化物具有充分的強度。另一方面,若聚合性單體(B)的量為90質量%以下,則相對充分地包含酸酐衍生物(C),而密封材的硬化物的透濕度變低。 In this case, the polymerizable monomer (B) is preferably contained in an amount of 60% by mass to 96% by mass, and more preferably 70% by mass to 89% by mass based on the total amount of the sealing material. If aggregated When the amount of the monomer (B) is 60% by mass or more, the cured product of the sealing material has sufficient strength. On the other hand, when the amount of the polymerizable monomer (B) is 90% by mass or less, the acid anhydride derivative (C) is relatively sufficiently contained, and the moisture permeability of the cured product of the sealing material is lowered.
另外,相對於密封材的總量,較佳為包含3質量%~39質量%的酸酐衍生物(C),更佳為10質量%~29質量%。若酸酐衍生物的量為3質量%以上,則密封材的硬化物的透濕度充分變低。 Further, the acid anhydride derivative (C) is preferably contained in an amount of from 3% by mass to 39% by mass, more preferably from 10% by mass to 29% by mass, based on the total amount of the sealing material. When the amount of the acid anhydride derivative is 3% by mass or more, the moisture permeability of the cured product of the sealing material is sufficiently lowered.
而且,相對於聚合性單體(B)及酸酐衍生物(C)的合計質量100質量份,較佳為包含1質量份~25質量份的自由基聚合起始劑(D),更佳為1質量份~20質量份。若自由基聚合起始劑(D)的量為所述範圍,則聚合性單體(D)或酸酐衍生物(C)充分硬化,而密封材的硬化物的彈性模數容易收斂在所期望的範圍內。 Furthermore, it is preferable to contain 1 part by mass to 25 parts by mass of the radical polymerization initiator (D), more preferably 100 parts by mass based on the total mass of the polymerizable monomer (B) and the acid anhydride derivative (C). 1 part by mass to 20 parts by mass. When the amount of the radical polymerization initiator (D) is in the above range, the polymerizable monomer (D) or the acid anhydride derivative (C) is sufficiently hardened, and the elastic modulus of the cured product of the sealing material easily converges on the desired In the range.
另外,所述密封材中,根據需要,相對於密封材的總量,可包含1質量%~10質量%的含有聚合性官能基的烯烴系聚合物(A)。 In addition, the sealing material may contain the polymerizable functional group-containing olefin-based polymer (A) in an amount of 1% by mass to 10% by mass based on the total amount of the sealing material.
另一方面,在密封材的黏度可高的情況下、或降低密封材的硬化物的彈性模數的情況下,可設為包含含有聚合性官能基的烯烴系聚合物(A)、酸酐衍生物(C)、及自由基聚合起始劑(D)的組成。此時,根據需要,可包含聚合性單體(B)。 On the other hand, when the viscosity of the sealing material can be high or the elastic modulus of the cured product of the sealing material is lowered, the olefin-based polymer (A) containing an polymerizable functional group or an acid anhydride can be used. The composition of the substance (C) and the radical polymerization initiator (D). At this time, a polymerizable monomer (B) may be contained as needed.
此時,相對於密封材的總量(質量),較佳為包含30質 量%~90質量%的含有聚合性官能基的烯烴系聚合物(A),更佳為30質量%~60質量%。若含有聚合性官能基的烯烴系聚合物(A)的量為30質量%以上,則密封材的硬化物的彈性模數容易收斂在所期望的範圍內。另一方面,若含有聚合性官能基的烯烴系聚合物(A)的量為90質量%以下,則相對充分地包含酸酐衍生物(C),而密封材的硬化物的透濕度變低。 At this time, it is preferable to contain 30 masses with respect to the total amount (mass) of the sealing material. The amount of the polymerizable functional group-containing olefin-based polymer (A) in an amount of from 90% by mass to 90% by mass is more preferably from 30% by mass to 60% by mass. When the amount of the polymerizable functional group-containing olefin polymer (A) is 30% by mass or more, the elastic modulus of the cured product of the sealing material easily converges within a desired range. On the other hand, when the amount of the olefin-based polymer (A) containing a polymerizable functional group is 90% by mass or less, the acid anhydride derivative (C) is relatively sufficiently contained, and the moisture permeability of the cured product of the sealing material is lowered.
另外,相對於含有聚合性官能基的烯烴系聚合物(A)、酸酐衍生物(C)、及聚合性單體(B)的合計質量,聚合性單體(B)的量較佳為65質量%以下,更佳為5質量%~50質量%。若聚合性單體(B)的量為所述範圍,則可相對降低密封材的彈性模數。 In addition, the amount of the polymerizable monomer (B) is preferably 65 with respect to the total mass of the polymerizable functional group-containing olefin polymer (A), the acid anhydride derivative (C), and the polymerizable monomer (B). The mass% or less is more preferably 5% by mass to 50% by mass. When the amount of the polymerizable monomer (B) is in the above range, the elastic modulus of the sealing material can be relatively lowered.
而且,相對於密封材的總量(質量),較佳為包含3質量%~40質量%的酸酐衍生物(C)。若酸酐衍生物(C)的量為3質量%以上,則密封材的硬化物的透濕度充分變低。另一方面,若密封材中的酸酐衍生物(C)的量為40質量%以下,則相對充分地包含含有聚合性官能基的烯烴系聚合物(A),而密封材的彈性模數變低。 Further, the acid anhydride derivative (C) is preferably contained in an amount of from 3% by mass to 40% by mass based on the total mass (mass) of the sealing material. When the amount of the acid anhydride derivative (C) is 3% by mass or more, the moisture permeability of the cured product of the sealing material is sufficiently lowered. On the other hand, when the amount of the acid anhydride derivative (C) in the sealing material is 40% by mass or less, the olefin-based polymer (A) containing a polymerizable functional group is relatively sufficiently contained, and the elastic modulus of the sealing material is changed. low.
另外,相對於具有自由基聚合性官能基的化合物的總量、即含有聚合性官能基的烯烴系聚合物(A)、酸酐衍生物(C)、及聚合性單體(B)的合計量100質量份,所述自由基聚合起始劑(D)較佳為2質量份~15質量份,更佳為5質量份~10質量份。 In addition, the total amount of the compound having a radical polymerizable functional group, that is, the total amount of the polymerizable functional group-containing olefin polymer (A), the acid anhydride derivative (C), and the polymerizable monomer (B) The radical polymerization initiator (D) is preferably 2 parts by mass to 15 parts by mass, more preferably 5 parts by mass to 10 parts by mass, per 100 parts by mass.
1-7.密封材的物性 1-7. Physical properties of sealing materials
本發明的密封材的藉由E型黏度計在25℃、1.0rpm下測定的 黏度,較佳為5mPa.s~20000mPa.s。若密封材的黏度為所述範圍,則密封材的塗敷性(例如網版印刷性或噴墨印刷性)提高,塗佈變得容易。密封材的黏度例如藉由東機產業製造的RC-500的E型黏度計等進行測定。 The sealing material of the present invention is measured by an E-type viscometer at 25 ° C and 1.0 rpm. Viscosity, preferably 5mPa. s~20000mPa. s. When the viscosity of the sealing material is within the above range, the coating property (for example, screen printing property or inkjet printing property) of the sealing material is improved, and coating is facilitated. The viscosity of the sealing material is measured by, for example, an E-type viscometer of RC-500 manufactured by Toki Sangyo Co., Ltd., or the like.
在藉由網版印刷或分配器塗佈進行密封材的塗佈時,本發明的密封材的藉由E型黏度計在25℃、1.0rpm下測定的黏度,較佳為10mPa.s~20000mPa.s,更佳為10mPa.s~5000mPa.s。 When the sealing material is applied by screen printing or dispenser coating, the viscosity of the sealing material of the present invention measured by an E-type viscometer at 25 ° C and 1.0 rpm is preferably 10 mPa. s~20000mPa. s, more preferably 10mPa. s~5000mPa. s.
另一方面,在藉由噴墨印刷進行密封材的塗佈時,本發明的密封材的藉由E型黏度計在25℃、1.0rpm下測定的黏度,較佳為5mPa.s~1000mPa.s,更佳為5mPa.s~100mPa.s。 On the other hand, when the sealing material is applied by inkjet printing, the viscosity of the sealing material of the present invention measured by an E-type viscometer at 25 ° C and 1.0 rpm is preferably 5 mPa. s~1000mPa. s, more preferably 5mPa. s~100mPa. s.
另外,密封材的含水率較佳為0.5質量%以下,更佳為0.1質量%以下,尤佳為0.06質量%以下。配置了有機EL元件的電路由於容易因水分而劣化,因此較佳為儘可能降低密封材的含水率。 Further, the water content of the sealing material is preferably 0.5% by mass or less, more preferably 0.1% by mass or less, and still more preferably 0.06% by mass or less. Since the circuit in which the organic EL element is disposed is easily deteriorated by moisture, it is preferable to reduce the moisture content of the sealing material as much as possible.
密封材的含水率可藉由以下方式求出:計量約0.1g的試樣樣品,使用卡爾費歇爾法(Karl Fisher)水分計加熱至150℃,測定此時所產生的水分量(固體氣化法)。 The moisture content of the sealing material can be determined by measuring a sample of about 0.1 g of the sample and heating it to 150 ° C using a Karl Fisher moisture meter to measure the amount of water produced at this time (solid gas). Method).
本發明的密封材較佳為用作用以形成光半導體用密封層的密封材。所謂光半導體,例如是將電轉換為光而發光的元件。光半導體具體包括:無機發光二極體(Light Emitting Diode,LED)元件、有機EL元件等,較佳為有機EL元件。光半導體由於容易因水分等而劣化,因此必須將表面密封。 The sealing material of the present invention is preferably used as a sealing material for forming a sealing layer for an optical semiconductor. The optical semiconductor is, for example, an element that converts electricity into light and emits light. The optical semiconductor specifically includes an inorganic light emitting diode (LED) element, an organic EL element, or the like, and is preferably an organic EL element. Since the photo-semiconductor is easily deteriorated by moisture or the like, it is necessary to seal the surface.
另外,根據本發明的密封材,亦可保護容易因水分等而劣化的成分(例如色素等)。本發明的密封材的硬化物的透濕度低。因此,若在密封材中添加容易因水分等而劣化的成分,則所述成分難以與水分接觸,而可抑制其劣化。 Further, according to the sealing material of the present invention, it is possible to protect a component (for example, a dye or the like) which is easily deteriorated by moisture or the like. The cured product of the sealing material of the present invention has a low moisture permeability. Therefore, when a component which is easily deteriorated by moisture or the like is added to the sealing material, the component is less likely to come into contact with moisture, and deterioration thereof can be suppressed.
本發明的密封材以液狀的狀態被覆被密封物,並使其硬化而製成密封層。在以液狀的狀態被覆被密封物時,例如只要藉由網版印刷、分配器塗佈、噴墨塗佈等塗佈於有機EL元件等光半導體上,並將塗佈層硬化而將有機EL元件等光半導體進行面密封即可。另外,在將本發明的密封材成形為膜狀後,可藉由所述膜將被密封物密封。在成形為膜狀後,將被密封物密封時,藉由在有機EL元件等光半導體上層壓膜狀密封材,並使其硬化,而將有機EL元件等光半導體進行面密封。 The sealing material of the present invention covers the sealed object in a liquid state and is cured to form a sealing layer. When the object to be sealed is coated in a liquid state, for example, it is applied to an optical semiconductor such as an organic EL device by screen printing, dispenser coating, inkjet coating, or the like, and the coating layer is cured to be organic. The optical semiconductor such as an EL element may be surface-sealed. Further, after the sealing material of the present invention is formed into a film shape, the sealed object can be sealed by the film. After the film is sealed, the film-like sealing material is laminated on an optical semiconductor such as an organic EL element and cured, whereby an optical semiconductor such as an organic EL element is surface-sealed.
密封材的硬化方法根據自由基聚合起始劑的種類等而進行適當選擇。在為熱硬化型密封材時,藉由加熱使密封材硬化。加熱溫度只要為高於23℃的溫度即可,考慮被密封物的耐熱溫度或效率等而適當設定。 The method of curing the sealing material is appropriately selected depending on the type of the radical polymerization initiator, and the like. When it is a thermosetting type sealing material, the sealing material is hardened by heating. The heating temperature may be set to a temperature higher than 23 ° C, and is appropriately set in consideration of the heat-resistant temperature, efficiency, and the like of the sealed object.
另一方面,在為光硬化型密封材時,藉由光照射使密封材硬化。所照射的光的波長根據光自由基聚合起始劑的種類等而進行適當選擇,例如可為紫外光或可見光等。所照射的光的累計光量通常為100mJ/cm2~10000mJ/cm2左右。光照射後可進一步進行加熱。 On the other hand, in the case of a photocurable sealing material, the sealing material is cured by light irradiation. The wavelength of the light to be irradiated is appropriately selected depending on the type of the photoradical polymerization initiator, and the like, and may be, for example, ultraviolet light or visible light. The integrated light amount of the irradiated light is usually about 100 mJ/cm 2 to 10000 mJ/cm 2 . Heating can be further performed after light irradiation.
1-8.密封材的製造方法 1-8. Method for manufacturing sealing material
本發明的密封材只要不損害本發明的效果,可藉由任意的方法製造。例如經過以下步驟製造:1)準備含有聚合性官能基的烯烴系聚合物(A)、聚合性單體(B)、酸酐衍生物(C)、及聚合起始劑(D)等的步驟;及2)在惰性氣體環境下,將各成分在30℃以下混合的步驟等。混合包括:藉由球磨機將所述成分分散的方法、裝入至燒瓶中進行攪拌的方法、或藉由三輥進行混練的方法。 The sealing material of the present invention can be produced by any method as long as the effects of the present invention are not impaired. For example, it is produced by the following steps: 1) a step of preparing an olefin-based polymer (A) containing a polymerizable functional group, a polymerizable monomer (B), an acid anhydride derivative (C), and a polymerization initiator (D); And 2) a step of mixing the components at 30 ° C or lower in an inert gas atmosphere. The mixing includes a method of dispersing the components by a ball mill, a method of charging in a flask, or a method of kneading by three rolls.
在將本發明的密封材成形為膜狀時,例如只要將液狀密封材塗佈於剝離基板上,使塗膜乾燥進行剝離即可。密封材的塗佈只要使用網版印刷、分配器塗佈等方法進行即可。 When the sealing material of the present invention is formed into a film shape, for example, a liquid sealing material may be applied onto a release substrate, and the coating film may be dried and peeled off. The coating of the sealing material may be carried out by a method such as screen printing or dispenser coating.
1-9.關於密封材的硬化物 1-9. About the hardened material of the sealing material
本發明的密封材的硬化物的透濕度較佳為儘可能低。即,藉由以下方法測定的在60℃ 90%RH下的Ca反應開始時間,較佳為24小時以上。Ca反應開始時間越長,則表示硬化物的透濕度越低。 The moisture permeability of the cured product of the sealing material of the present invention is preferably as low as possible. That is, the Ca reaction start time at 60 ° C and 90% RH measured by the following method is preferably 24 hours or longer. The longer the Ca reaction start time is, the lower the moisture permeability of the cured product is.
藉由Ca法的硬化物的透濕度(Ca反應開始時間)可藉由以下順序測定。圖1是表示藉由Ca法的硬化物的透濕度的測定用樣品的製作順序的示意圖。 The moisture permeability (Ca reaction start time) of the cured product by the Ca method can be measured by the following procedure. FIG. 1 is a schematic view showing a procedure for producing a sample for measuring moisture permeability of a cured product by a Ca method.
1)樣品的製作 1) Production of samples
如圖1A所示般,準備浸漬於丙酮而進行10分鐘超音波清洗的玻璃基板2(大小:25mm×25mm、厚度:0.7mm)。在所述玻璃基板2上,使用蒸鍍機(ALS科技(ALS Technology)公司製造),在下述條件下形成厚度為170nm的金屬鈣的蒸鍍膜4。使用蒸鍍用遮罩,以自金屬鈣的蒸鍍膜4的端部至玻璃基板2的端部 為止的長度L成為4mm的方式進行調整。 As shown in FIG. 1A, a glass substrate 2 (size: 25 mm × 25 mm, thickness: 0.7 mm) which was immersed in acetone and subjected to ultrasonic cleaning for 10 minutes was prepared. On the glass substrate 2, a vapor deposition film 4 of metal calcium having a thickness of 170 nm was formed under the following conditions using a vapor deposition machine (manufactured by ALS Technology). A mask for vapor deposition is used, from the end of the vapor-deposited film 4 of the metal calcium to the end of the glass substrate 2 The length L so far is adjusted to be 4 mm.
(蒸鍍條件) (evaporation conditions)
蒸鍍時的真空度:3.0×10-5Pa Vacuum degree during vapor deposition: 3.0 × 10 -5 Pa
製膜速度:1.2Å/秒鐘 Film forming speed: 1.2 Å / sec
金屬鈣原料:高純度化學製造、顆粒 Metal Calcium Raw Material: High Purity Chemical Manufacturing, Granules
將所得的附有金屬鈣的蒸鍍膜的玻璃基板在不暴露在空氣中的情況下移動至N2環境的手套箱中。繼而,如圖1B所示般,在另外準備的經丙酮清洗的玻璃基板6(25mm×55mm、厚度:2mm)上,以硬化後的厚度成為100μm的方式滴加本發明的密封材後,進行乾燥而形成塗膜8。 The obtained glass substrate with the metal calcium-deposited film was moved to a glove box of an N 2 atmosphere without being exposed to the air. Then, as shown in FIG. 1B, the sealing material of the present invention was dropped on the separately prepared acetone-cleaned glass substrate 6 (25 mm × 55 mm, thickness: 2 mm) so that the thickness after hardening became 100 μm. The coating film 8 is formed by drying.
繼而,如圖1C所示般,使附有密封材的塗膜的玻璃基板、與附有蒸鍍膜的玻璃基板貼合而製成積層物,並藉由夾具固定。所得的積層物的厚度可藉由在附有密封材的塗膜的玻璃基板與附有金屬鈣的蒸鍍膜的玻璃基板之間夾持厚度為100μm的鐵氟龍(Teflon)(註冊商標)片作為間隔物等進行調整。自金屬鈣的蒸鍍膜4的端部至塗膜8的端部為止的長度L'亦設為4mm。 Then, as shown in FIG. 1C, a glass substrate having a coating film with a sealing material and a glass substrate with a vapor deposition film attached thereto are bonded together to form a laminate, which is fixed by a jig. The thickness of the obtained laminate can be sandwiched between Teflon (registered trademark) sheets having a thickness of 100 μm between a glass substrate having a coating film with a sealing material and a glass substrate with a vapor deposited film of metal calcium. Adjustment is performed as a spacer or the like. The length L' from the end of the vapor deposited film 4 of the metal calcium to the end of the coating film 8 is also set to 4 mm.
繼而,在為熱硬化型密封材時,藉由烘箱在100℃下將積層物加熱30分鐘使密封材硬化而作為樣品。在為光硬化型密封材時,藉由水銀燈對積層物照射3000mJ的紫外線後,在80℃下加熱30分鐘使密封材硬化而作為樣品。 Then, in the case of a thermosetting sealing material, the laminate was heated at 100 ° C for 30 minutes in an oven to cure the sealing material as a sample. In the case of a photocurable sealing material, the laminate was irradiated with ultraviolet rays of 3,000 mJ by a mercury lamp, and then heated at 80 ° C for 30 minutes to cure the sealing material as a sample.
2)Ca反應開始時間的測定 2) Determination of the start time of Ca reaction
在恆溫恆濕槽中在60℃ 90%RH下保存所得的樣品。繼而,測 定金屬鈣的蒸鍍膜的端部自金屬光澤變為透明為止的時間(Ca反應開始時間)。即,若金屬鈣(金屬光澤)與水反應,則變為透明的氫氧化鈣Ca(OH)2。Ca反應開始時間越長,則表示越難以引起金屬鈣與水的反應,而透濕度越低。 The resulting sample was stored at 60 ° C and 90% RH in a constant temperature and humidity chamber. Then, the time (Ca reaction start time) from the end of the vapor deposition film of metal calcium from the metallic luster was measured. That is, when metal calcium (metal luster) reacts with water, it becomes transparent calcium hydroxide Ca(OH) 2 . The longer the Ca reaction start time, the more difficult it is to cause the reaction of metallic calcium with water, and the lower the moisture permeability.
如後述般,在有機EL裝置中,大氣中的水分或氧氣容易自基板與密封基板的間隙侵入。因此,關於有機EL裝置中的密封層的透濕度,與杯法相比,Ca法接近實際的裝置構成,並可藉由評價單元進行測定,因此可精度佳地進行評價。藉由通常的杯法測定的透濕度,主要評價自有機EL裝置的主面侵入的方向(後述圖2A的自密封基板26向基板22的方向)的透濕度,相對於此,藉由Ca法測定的透濕度,主要評價自有機EL裝置的側面侵入的方向(後述的圖2A的自密封基板26與基板22的間隙向有機EL元件的側面的方向)的透濕度。如此,Ca法可評價大氣中的水分或氧氣侵入的方向、即自有機EL裝置的側面侵入的方向的透濕度,因此可精度佳地評價有機EL裝置的密封層的透濕度。 As described later, in the organic EL device, moisture or oxygen in the atmosphere easily enters from the gap between the substrate and the sealing substrate. Therefore, the moisture permeability of the sealing layer in the organic EL device is close to the actual device configuration as compared with the cup method, and can be measured by the evaluation unit, so that the evaluation can be performed with high precision. The moisture permeability measured by the normal cup method is mainly evaluated for the moisture permeability from the direction in which the main surface of the organic EL device intrudes (the direction from the self-sealing substrate 26 to the substrate 22 in FIG. 2A described later), whereas the Ca method is used. The measured moisture permeability is mainly the moisture permeability from the direction in which the side surface of the organic EL device invades (the direction from the gap between the self-sealing substrate 26 and the substrate 22 in FIG. 2A to the side surface of the organic EL element to be described later). In this way, the Ca method can evaluate the moisture intrusion in the atmosphere or the direction in which oxygen enters, that is, the moisture permeability in the direction in which the side surface of the organic EL device intrudes, so that the moisture permeability of the sealing layer of the organic EL device can be accurately evaluated.
此處,本發明的密封材的硬化物的彈性模數根據密封材的用途或組成進行適當選擇。例如,在密封材包含所述含有聚合性官能基的烯烴系聚合物(A)時,較佳為0.1MPa以上、100MPa以下,更佳為0.1MPa~20MPa。若密封材的硬化物的彈性模數為100MPa以下,則藉由包含密封材的硬化物的層,而保護被密封物不受外部的應力應變等的影響。密封材的硬化物的彈性模數按照以下方式求出。在拉伸試驗機中,以夾頭間距離為30mm安裝 試樣,在起始負荷為10N、拉伸速度為30mm/分鐘下測定應變。並且,由縱軸取應力、橫軸取應變的應力應變曲線的直線部的斜率,算出彈性模數。另一方面,在密封材不含所述含有聚合性官能基的烯烴系聚合物(A)時,可將彈性模數設為10MPa~10GPa。 Here, the elastic modulus of the cured product of the sealing material of the present invention is appropriately selected depending on the use or composition of the sealing material. For example, when the sealing material contains the polymerizable functional group-containing olefin polymer (A), it is preferably 0.1 MPa or more and 100 MPa or less, and more preferably 0.1 MPa to 20 MPa. When the elastic modulus of the cured product of the sealing material is 100 MPa or less, the sealed object is protected from external stress strain and the like by the layer containing the cured product of the sealing material. The elastic modulus of the cured product of the sealing material was determined in the following manner. In the tensile testing machine, the distance between the chucks is 30mm. The sample was measured for strain at an initial load of 10 N and a tensile speed of 30 mm/min. Then, the elastic modulus is calculated from the slope of the straight line portion of the stress-strain curve in which the stress is taken on the vertical axis and the strain is taken on the horizontal axis. On the other hand, when the sealing material does not contain the polymerizable functional group-containing olefin polymer (A), the elastic modulus can be set to 10 MPa to 10 GPa.
本發明的密封材的硬化物的波長為400nm的平行光線的透射率,較佳為90%以上,更佳為95%以上。若硬化物的平行光線的透射率為90%以上,則可將密封材應用於各種光半導體的密封用構件。平行光線的透射率是100μm的密封材的硬化物的平行光線的透射率,藉由紫外可見分光光度計等進行測定。 The transmittance of the parallel light having a wavelength of 400 nm of the cured product of the sealing material of the present invention is preferably 90% or more, more preferably 95% or more. When the transmittance of the parallel light of the cured product is 90% or more, the sealing material can be applied to various sealing members for optical semiconductors. The transmittance of the parallel rays is the transmittance of the parallel rays of the cured product of the sealing material of 100 μm, and is measured by an ultraviolet-visible spectrophotometer or the like.
2.有機EL裝置 2. Organic EL device
通常,有機EL裝置包括:配置於基板上的有機EL元件、與基板成對的密封基板、配置於基板與密封基板之間且覆蓋(面密封)有機EL元件的密封層。可將密封層的一部分或全部設為所述密封材的硬化物。另外,本發明的密封材的硬化物如上所述般透濕度低,因此在未完全覆蓋有機EL元件時,或在本發明的密封材的硬化物、與有機EL元件之間介置其他構件時,亦可保護有機EL元件不受水分影響。而且,即便在未設置密封基板的結構的有機EL裝置中,本發明的密封材的硬化物亦可用作保護有機EL元件不受水分影響的密封材。在將本發明的密封材的硬化物用作保護有機EL元件不受水分影響的密封材時,有機EL裝置的結構並無限定。有機EL裝置可為有機EL顯示器面板或有機EL照明等。 In general, an organic EL device includes an organic EL element disposed on a substrate, a sealing substrate paired with the substrate, and a sealing layer disposed between the substrate and the sealing substrate and covering (surface sealing) the organic EL element. A part or all of the sealing layer may be set as a cured product of the sealing material. Further, since the cured product of the sealing material of the present invention has a low moisture permeability as described above, when the organic EL element is not completely covered, or when other members are interposed between the cured product of the sealing material of the present invention and the organic EL element. It also protects the organic EL element from moisture. Further, even in the organic EL device having the structure in which the sealing substrate is not provided, the cured product of the sealing material of the present invention can be used as a sealing material for protecting the organic EL element from moisture. When the cured product of the sealing material of the present invention is used as a sealing material for protecting the organic EL element from moisture, the structure of the organic EL device is not limited. The organic EL device may be an organic EL display panel or an organic EL illumination or the like.
圖2A是表示有機EL裝置的一個形態的概略剖面圖。 本形態是將面密封層的全部設為所述密封材的硬化物的例子。如圖2A所示般,有機EL裝置20依序積層:基板22、有機EL元件24、及密封基板26。在基板22與密封基板26之間配置面密封層28,面密封層28覆蓋有機EL元件24的周圍。如此,面密封層28將有機EL元件24進行面密封。 2A is a schematic cross-sectional view showing one embodiment of an organic EL device. In this embodiment, the entire surface sealing layer is an example of a cured product of the sealing material. As shown in FIG. 2A, the organic EL device 20 sequentially laminates the substrate 22, the organic EL element 24, and the sealing substrate 26. A face seal layer 28 is disposed between the substrate 22 and the sealing substrate 26, and the face seal layer 28 covers the periphery of the organic EL element 24. Thus, the surface sealing layer 28 performs surface sealing of the organic EL element 24.
基板22及密封基板26通常為玻璃基板或樹脂膜等,基板22與密封基板26的至少一者為透明的玻璃基板或透明的樹脂膜。此種透明的樹脂膜的例子包括:聚對苯二甲酸乙二酯等芳香族聚酯樹脂等。 The substrate 22 and the sealing substrate 26 are usually a glass substrate or a resin film, and at least one of the substrate 22 and the sealing substrate 26 is a transparent glass substrate or a transparent resin film. Examples of such a transparent resin film include an aromatic polyester resin such as polyethylene terephthalate or the like.
在有機EL元件24為頂部發光型時,有機EL元件24自基板22側起包括:反射畫素電極層30(包含鋁或銀等)、有機EL層32、透明對向電極層34(包含ITO(Indium Tin Oxide:氧化銦錫)或IZO(銦鋅氧化物)等)。反射畫素電極層30、有機EL層32及透明對向電極層34可藉由真空蒸鍍及濺鍍等而成膜。 When the organic EL element 24 is of the top emission type, the organic EL element 24 includes a reflective pixel electrode layer 30 (including aluminum or silver, etc.), an organic EL layer 32, and a transparent counter electrode layer 34 (including ITO) from the substrate 22 side. (Indium Tin Oxide: Indium Tin Oxide) or IZO (Indium Zinc Oxide). The reflective pixel electrode layer 30, the organic EL layer 32, and the transparent counter electrode layer 34 can be formed by vacuum deposition, sputtering, or the like.
面密封層28可設為包含本發明的密封材的硬化物者。包含本發明的密封材的硬化物的面密封層28的平行光線透射率如上所述般,較佳為90%以上。原因是,若平行光線透射率過低,則來自元件的光的取出效率、或在元件上的光的吸收效率容易降低。面密封層28的光線透射率的上限例如可設為99%左右。 The face seal layer 28 can be a cured product containing the seal member of the present invention. The parallel light transmittance of the surface seal layer 28 containing the cured product of the sealing material of the present invention is preferably 90% or more as described above. The reason is that if the parallel light transmittance is too low, the light extraction efficiency from the element or the light absorption efficiency on the element is liable to lower. The upper limit of the light transmittance of the surface seal layer 28 can be set, for example, to about 99%.
如上所述般,本發明的密封材由於將黏度調整為相對較低的範圍,因此塗敷性佳,可形成均勻的膜厚的面密封層28。另外,本發明的密封材的硬化物特別是藉由Ca法的透濕度充分地降 低。因此,包含本發明的密封材的硬化物的面密封層28,特別會捕捉自基板22與密封基板26的間隙、即有機EL元件的側面方向進入的大氣中的水分或氧氣等,而可抑制所述水分或氧氣等與有機EL元件24接觸。 As described above, since the sealing material of the present invention has a viscosity which is adjusted to a relatively low range, the coating property is good, and the surface sealing layer 28 having a uniform film thickness can be formed. Further, the cured product of the sealing material of the present invention is sufficiently lowered in particular by the moisture permeability of the Ca method. low. Therefore, the surface seal layer 28 containing the cured product of the sealing material of the present invention can capture moisture or oxygen in the atmosphere which enters the gap between the substrate 22 and the sealing substrate 26, that is, the side surface of the organic EL element, and can suppress The moisture, oxygen, or the like is in contact with the organic EL element 24.
另外,自有機EL裝置20的主面側向內部方向(圖2A中,自密封基板26向基板22的方向)侵入的水分的透過,可藉由將基板22或密封基板26設為透濕度低的材料而抑制。 In addition, the permeation of moisture intrinsic from the main surface side of the organic EL device 20 to the inner direction (the direction from the sealing substrate 26 to the substrate 22 in FIG. 2A) can be made low by the substrate 22 or the sealing substrate 26 The material is suppressed.
作為有機EL裝置的其他形態,可列舉包括如下構件的形態:1)配置於基板上的有機EL元件;2)與有機EL元件接觸、且覆蓋(面密封)有機EL元件的樹脂硬化物層;3)與所述樹脂硬化物層接觸,而覆蓋所述樹脂硬化物層的鈍化層;4)覆蓋鈍化層的密封基板(參照圖2B)。可將樹脂硬化物層設為所述密封材的硬化物。 Other aspects of the organic EL device include a configuration in which: 1) an organic EL element disposed on a substrate; 2) a resin cured layer that is in contact with the organic EL element and covers (surface-seales) the organic EL element; 3) a passivation layer which is in contact with the cured resin layer to cover the cured layer of the resin; 4) a sealing substrate which covers the passivation layer (refer to FIG. 2B). The cured resin layer may be a cured product of the sealing material.
圖2B是表示有機EL裝置的其他形態的概略剖面圖。如圖2B所示般,有機EL裝置20'除了面密封層28包括包含本發明的密封材的硬化物的樹脂硬化物層28-1、覆蓋樹脂硬化物層28-1的鈍化層28-2、繼而覆蓋鈍化層28-2的第二樹脂硬化物層28-3以外,與圖2A大致相同地構成。圖2B所示的有機EL裝置20'的其他構成構件與圖2A所示的有機EL裝置20的構成構件相同。 2B is a schematic cross-sectional view showing another embodiment of the organic EL device. As shown in FIG. 2B, the organic EL device 20' includes, in addition to the face seal layer 28, a resin cured layer 28-1 containing a cured product of the sealing material of the present invention, and a passivation layer 28-2 covering the cured resin layer 28-1. The second resin cured layer 28-3 covering the passivation layer 28-2 is formed in substantially the same manner as in FIG. 2A. The other constituent members of the organic EL device 20' shown in Fig. 2B are the same as those of the organic EL device 20 shown in Fig. 2A.
面密封層28所含的樹脂硬化物層28-1較佳為與有機EL元件接觸。樹脂硬化物層28-1的厚度較佳為0.1μm~20μm。 The resin cured layer 28-1 contained in the surface seal layer 28 is preferably in contact with the organic EL element. The thickness of the resin cured layer 28-1 is preferably from 0.1 μm to 20 μm.
面密封層28所含的鈍化層28-2較佳為在電漿環境下成 膜的無機化合物層。所謂在電漿環境下成膜,例如是指藉由電漿化學氣相沈積(Chemical Vapor Deposition,CVD)法成膜,並無特別限定,亦可藉由濺鍍法或蒸鍍法成膜。鈍化層28-2的材質較佳為透明的無機化合物,可例示:氮化矽、氧化矽、SiONF、SiON等,並無特別限定。鈍化層28-2的厚度較佳為0.1μm~5μm。 The passivation layer 28-2 contained in the surface sealing layer 28 is preferably formed in a plasma environment. An inorganic compound layer of the film. The film formation in a plasma environment is, for example, a film formed by a chemical vapor deposition (CVD) method, and is not particularly limited, and may be formed by a sputtering method or a vapor deposition method. The material of the passivation layer 28-2 is preferably a transparent inorganic compound, and examples thereof include cerium nitride, cerium oxide, SiONF, and SiON, and are not particularly limited. The thickness of the passivation layer 28-2 is preferably from 0.1 μm to 5 μm.
鈍化層28-2可與樹脂硬化物層28-1接觸而成膜。原因是,包含本發明的密封材的硬化物的樹脂硬化物層28-1即便暴露在電漿環境下,亦可維持其透明性。 The passivation layer 28-2 may be formed in contact with the resin cured layer 28-1. The reason is that the resin cured layer 28-1 containing the cured product of the sealing material of the present invention maintains its transparency even when exposed to a plasma environment.
鈍化層28-2較佳為不與有機EL元件24直接接觸,而與樹脂硬化物層28-1直接接觸而成膜。若欲使鈍化層28-2與有機EL元件24直接接觸而成膜,則由於有機EL元件24的端部為銳角,因此存在因鈍化層28-2引起的覆蓋降低的情況。相對於此,若藉由作為本發明的密封材的硬化物的樹脂硬化物層28-1將有機EL元件24面密封後,在樹脂硬化物層28-1上將鈍化層28-2成膜,則可使鈍化層28-2的被成膜面變得平緩,而覆蓋提高。 The passivation layer 28-2 is preferably not in direct contact with the organic EL element 24, but is formed in direct contact with the resin cured layer 28-1. When the passivation layer 28-2 is brought into direct contact with the organic EL element 24 to form a film, since the end portion of the organic EL element 24 is at an acute angle, the coverage due to the passivation layer 28-2 may be lowered. On the other hand, when the organic EL element 24 is hermetically sealed by the resin cured material layer 28-1 which is a cured product of the sealing material of the present invention, the passivation layer 28-2 is formed on the cured resin layer 28-1. Then, the film formation surface of the passivation layer 28-2 can be made gentle, and the coverage can be improved.
面密封層28所含的第二樹脂硬化物層28-3可為與樹脂硬化物層28-1相同的材質(包含本發明的密封材的硬化物的層),亦可為不同的材質。例如第二樹脂硬化物層28-3的水分含量有時可高於樹脂硬化物層28-1的水分含量。原因是,第二樹脂硬化物層28-3不與有機EL元件直接接觸。另外,在為頂部發光型有機EL裝置(經由第二樹脂硬化物層28-3取出有機EL元件的發光的有機EL裝置)時,第二樹脂硬化物層28-3的透光率必須與樹脂 硬化物層28-1同樣地高。 The second resin cured material layer 28-3 contained in the surface seal layer 28 may be the same material as the resin cured material layer 28-1 (layer containing the cured product of the sealing material of the present invention), or may be a different material. For example, the moisture content of the second resin cured layer 28-3 may sometimes be higher than the moisture content of the resin cured layer 28-1. The reason is that the second resin cured layer 28-3 is not in direct contact with the organic EL element. In addition, when it is a top emission type organic EL device (the organic EL device that emits light of the organic EL element through the second resin cured material layer 28-3), the light transmittance of the second resin cured material layer 28-3 must be the same as that of the resin. The cured layer 28-1 is also high.
有機EL裝置可藉由任意的方法製造,可經過以下步驟而製造:1)準備配置了有機EL元件的基板的步驟;2)藉由密封材覆蓋有機EL元件,使密封材硬化而製成面密封層的步驟;3)藉由密封基板進行密封的步驟。 The organic EL device can be produced by any method and can be manufactured by the following steps: 1) a step of preparing a substrate on which an organic EL element is disposed; 2) covering the organic EL element with a sealing material, and hardening the sealing material to form a surface a step of sealing the layer; 3) a step of sealing by sealing the substrate.
圖3是表示圖2A的有機EL裝置的製造製程的一例的示意圖。首先,準備積層了有機EL元件24的基板22(參照圖3A)。有機EL元件24包括:反射畫素電極層30、有機EL層32、及透明對向電極層34,進而可具有其他功能層。繼而,將本發明的液狀密封材28-1'塗佈於有機EL元件24上,或將片狀密封材28-1'層壓於有機EL元件24上(參照圖3B)。然後,將密封基板26重疊,在所述狀態下使密封材硬化而製成樹脂硬化物層28-1,且貼合密封基板26(參照圖3C)。如此獲得有機EL裝置20。 Fig. 3 is a schematic view showing an example of a manufacturing process of the organic EL device of Fig. 2A. First, the substrate 22 in which the organic EL element 24 is laminated is prepared (see FIG. 3A). The organic EL element 24 includes a reflective pixel electrode layer 30, an organic EL layer 32, and a transparent counter electrode layer 34, and may have other functional layers. Then, the liquid sealing material 28-1' of the present invention is applied onto the organic EL element 24, or the sheet-like sealing material 28-1' is laminated on the organic EL element 24 (see FIG. 3B). Then, the sealing substrate 26 is stacked, and the sealing material is cured in the above state to form the resin cured material layer 28-1, and the sealing substrate 26 is bonded (see FIG. 3C). The organic EL device 20 is thus obtained.
有機EL裝置根據需要,可進一步經過將面密封層暴露在電漿中的步驟而製造。 The organic EL device can be further manufactured by a step of exposing the surface sealing layer to the plasma as needed.
將面密封層暴露在電漿中的步驟的例子包括:在面密封層上藉由電漿CVD法將鈍化膜成膜的步驟;或對面密封層照射電漿而改變表面特性的步驟等。藉由改變表面特性(例如提高潤濕性),而可提高與其他構件的密接性。 Examples of the step of exposing the face seal layer to the plasma include a step of forming a passivation film by plasma CVD on the face seal layer, or a step of irradiating the face seal layer with plasma to change surface characteristics, and the like. By changing the surface characteristics (for example, improving the wettability), the adhesion to other members can be improved.
如上所述般,可僅將有機EL裝置的密封構件的一部分設為所述密封材的硬化物。例如,作為有機EL裝置的進而其他形態,可列舉包括如下構件的形態:1)配置於基板上的有機EL元 件;2)與有機EL元件接觸、且覆蓋(密封)有機EL元件的側面的至少一部分的第一樹脂硬化物層;3)與有機EL元件接觸、且覆蓋(面密封)有機EL元件的上表面的至少一部分的第二樹脂硬化物層;4)覆蓋第一樹脂硬化物層與第二樹脂硬化物層的密封基板(參照圖4A)。可將第一樹脂硬化物層設為所述密封材的硬化物。 As described above, only a part of the sealing member of the organic EL device can be used as a cured product of the sealing material. For example, as another aspect of the organic EL device, a form including the following members: 1) an organic EL element disposed on a substrate 2) a first resin cured layer that is in contact with the organic EL element and covers (seals) at least a part of the side surface of the organic EL element; 3) is in contact with the organic EL element, and covers (face seals) the upper surface of the organic EL element a second resin cured layer of at least a portion of the surface; 4) a sealing substrate covering the first cured resin layer and the second cured resin layer (see FIG. 4A). The first resin cured layer may be a cured product of the sealing material.
圖4A是表示有機EL裝置的其他形態的概略剖面圖;圖4B是將圖4A的有機EL裝置20"的密封基板26除去的情形的俯視圖。如圖4A所示般,有機EL裝置20"具有面密封層28、及覆蓋其外周的阻擋材(dam material)36;面密封層28進一步包括覆蓋有機EL元件24的側面的第一密封層28A、及覆蓋有機EL元件24的上表面的第二密封層28B,除此以外,與圖2A大致相同地構成。圖4A及圖4B所示的有機EL裝置20"的其他構成構件,與圖2A所示的有機EL裝置20的構成構件相同。 4A is a schematic cross-sectional view showing another embodiment of the organic EL device, and FIG. 4B is a plan view showing a state in which the sealing substrate 26 of the organic EL device 20" of FIG. 4A is removed. As shown in FIG. 4A, the organic EL device 20" has a face seal layer 28, and a dam material 36 covering the outer periphery thereof; the face seal layer 28 further includes a first seal layer 28A covering the side surface of the organic EL element 24, and a second cover covering the upper surface of the organic EL element 24. The sealing layer 28B is configured substantially the same as that of FIG. 2A. The other constituent members of the organic EL device 20" shown in FIG. 4A and FIG. 4B are the same as those of the organic EL device 20 shown in FIG. 2A.
阻擋材36並無特別限制,可包含環氧樹脂等。此種阻擋材36可藉由分配器方式進行塗佈或滴加而形成。 The barrier material 36 is not particularly limited and may include an epoxy resin or the like. Such a barrier material 36 can be formed by coating or dropping by means of a dispenser.
第二密封層28B較佳為不含吸水性填料或填充劑等。原因是,如後述般,由於有機EL元件的上表面不與吸水性填料或填充劑等接觸,因此可抑制有機EL元件的損傷(刮痕)。另外原因是,不含吸水性填料或填充劑等的第二密封層28B容易提高總光線透射率,而透明性優異。 The second sealing layer 28B is preferably free from water-absorbing fillers, fillers, and the like. The reason is that the upper surface of the organic EL element is not in contact with the water-absorbent filler, the filler, or the like, as described later, and thus damage (scratches) of the organic EL element can be suppressed. Another reason is that the second sealing layer 28B containing no water-absorbent filler, filler or the like tends to increase the total light transmittance, and is excellent in transparency.
第二密封層28B的波長為400nm的平行光線透射率較 佳為90%以上。原因是,若平行光線透射率過低,則來自元件的光的取出效率、或在元件上的光的吸收效率容易降低。硬化物層28的光線透射率的上限例如可設為99%左右。提高平行光線透射率的方法之一是不含填料、或設為10質量%以下。 The second sealing layer 28B has a parallel light transmittance of 400 nm Good is over 90%. The reason is that if the parallel light transmittance is too low, the light extraction efficiency from the element or the light absorption efficiency on the element is liable to lower. The upper limit of the light transmittance of the cured layer 28 can be, for example, about 99%. One of the methods for increasing the transmittance of parallel light is to contain no filler or to be 10% by mass or less.
此種面密封層28例如可在1)以覆蓋有機EL元件的側面的方式,塗佈所述密封材並硬化而形成第一密封層28A的步驟後;經過2)以覆蓋有機EL元件的上表面的方式,塗佈其他密封材並硬化而形成第二密封層28B的步驟而形成。構成第一密封層28A的密封材的塗佈,例如可藉由分配器方式或噴墨方式進行;構成第二密封層28B的密封材的塗佈,可藉由網版印刷方式或噴墨方式進行。 Such a face seal layer 28 can be, for example, 1) coated with the seal member and hardened to form the first seal layer 28A in a manner to cover the side surface of the organic EL element; 2) to cover the upper surface of the organic EL element The surface is formed by applying a step of coating another sealing material and hardening to form the second sealing layer 28B. The coating of the sealing material constituting the first sealing layer 28A can be performed, for example, by a dispenser method or an inkjet method; and the coating of the sealing material constituting the second sealing layer 28B can be performed by a screen printing method or an inkjet method. get on.
在如此構成的有機EL裝置中,由於有機EL元件的側面由所述密封材的硬化物覆蓋,因此可高度地抑制大氣中的水分或氧氣的透過。另外,由於有機EL元件的上表面由不含吸水性填料或填充劑等的其他密封材的硬化物覆蓋,因此可抑制因吸水性填料或填充劑等引起的有機EL元件的損傷(刮痕),且亦可確保透明性。即,可兼顧低的透濕度、與透明性或耐刮痕性。 In the organic EL device having such a configuration, since the side surface of the organic EL element is covered with the cured material of the sealing material, the permeation of moisture or oxygen in the atmosphere can be highly suppressed. In addition, since the upper surface of the organic EL element is covered with a cured product of another sealing material that does not contain a water-absorbent filler or a filler, it is possible to suppress damage (scratch) of the organic EL element due to a water-absorbent filler, a filler, or the like. And can also ensure transparency. That is, it is possible to achieve both low moisture permeability, transparency, and scratch resistance.
實施例 Example
以下,參照實施例對本發明進行說明。本發明的範圍並不由實施例限定解釋。 Hereinafter, the present invention will be described with reference to the embodiments. The scope of the invention is not to be construed as limited by the embodiments.
[實施例1] [Example 1]
將作為含有聚合性官能基的聚烯烴系聚合物(A)的下述式 (A1)所示的化合物(可樂倫(Kuraprene)(註冊商標)UC-102、可樂麗(Kuraray)公司製造、數量平均分子量為17000、一分子中的可自由基聚合的平均官能基數=2)54質量份;作為聚合性單體(B)的下述式(B1)所示的丙烯酸二環戊烯氧基乙酯(FA-512AS、日立化成工業公司製造)46質量份;作為酸酐衍生物(C)的下述式(C1)所示的六氫鄰苯二甲酸酐衍生物(C')(4-META-H、日本精化公司製造)10質量份;作為自由基聚合起始劑的下述式(D1)所示的過氧化-2-乙基己酸第三戊酯(路派克(Luperox)575、阿科瑪吉富(ARKEMA Yoshitomi)公司製造)5質量份混合,而製備密封材。 The following formula of the polyolefin-based polymer (A) containing a polymerizable functional group (A1) a compound (Kuraprene (registered trademark) UC-102, manufactured by Kuraray Co., Ltd., having a number average molecular weight of 17,000, and a radically polymerizable average functional group in one molecule = 2) 54 parts by mass; 46 parts by mass of dicyclopentenyloxyethyl acrylate (FA-512AS, manufactured by Hitachi Chemical Co., Ltd.) represented by the following formula (B1) as the polymerizable monomer (B); (C) a hexahydrophthalic anhydride derivative (C') (4-META-H, manufactured by Nippon Seika Co., Ltd.) represented by the following formula (C1): 10 parts by mass; as a radical polymerization initiator 5 parts by mass of a third ester of peroxy-2-ethylhexanoate (Luperox 575, manufactured by Arkema Yoshitomi Co., Ltd.) represented by the following formula (D1), and prepared to be sealed material.
[化10]
[比較例1] [Comparative Example 1]
不含六氫鄰苯二甲酸酐衍生物(C'),且設為表1所示的組成比,除此以外,以與實施例1相同的方式製備密封材。 A sealing material was prepared in the same manner as in Example 1 except that the hexahydrophthalic anhydride derivative (C') was not contained and the composition ratio shown in Table 1 was used.
[比較例2] [Comparative Example 2]
代替六氫鄰苯二甲酸酐衍生物(C'),而使用新日本理化製造、理家德(RIKACID)MH700(4-甲基六氫鄰苯二甲酸酐/六氫鄰苯二甲酸酐(質量比=70/30)的混合物),且設為表1所示的組成比,除此以外,以與實施例1相同的方式製備密封材。 Instead of the hexahydrophthalic anhydride derivative (C'), use Nippon Physicochemical Manufacturing, RIKACID MH700 (4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride ( A sealing material was prepared in the same manner as in Example 1 except that the mixture ratio of the mass ratio = 70/30) was set to the composition ratio shown in Table 1.
[評價] [Evaluation]
測定各實施例及比較例中所製備的密封材的黏度。而且,藉 由以下方法,測定密封材的硬化物的光線透射率、透濕度、彈性模數。將結果表示於表1。 The viscosity of the sealing material prepared in each of the examples and the comparative examples was measured. And borrow The light transmittance, the moisture permeability, and the elastic modulus of the cured product of the sealing material were measured by the following methods. The results are shown in Table 1.
.黏度 . Viscosity
藉由E型黏度計(博勒飛(BROOKFIELD)公司製造的數位流變計型號DII-III ULTRA),測定25℃、1.0rpm下的密封材的黏度。 The viscosity of the sealing material at 25 ° C and 1.0 rpm was measured by an E-type viscometer (digital rheometer model DII-III ULTRA manufactured by BROOKFIELD).
.平行光線透射率 . Parallel light transmittance
作為背景資料,使用紫外可見光分光光度計(島津製作所UV-2550),測定無鹼玻璃板的190nm~800nm的波長區域(可見光、紫外光)的平行光線透射率。 As background information, the parallel light transmittance of a wavelength region (visible light, ultraviolet light) of an alkali-free glass plate of 190 nm to 800 nm was measured using an ultraviolet-visible spectrophotometer (Shimadzu Corporation UV-2550).
藉由與所述相同的2片無鹼玻璃板夾持密封材,在無鹼玻璃板的端部夾住鐵氟龍片(厚度為100μm),藉此將2片無鹼玻璃板所夾持的密封材的厚度設為100μm。將其在100℃下加熱30分鐘使其硬化,而獲得厚度為100μm的密封材的硬化物。 The Teflon sheet (thickness: 100 μm) is sandwiched between the ends of the alkali-free glass plate by sandwiching the sealing material with the same two alkali-free glass plates, thereby holding the two alkali-free glass plates. The thickness of the sealing material was set to 100 μm. This was hardened by heating at 100 ° C for 30 minutes to obtain a cured product of a sealing material having a thickness of 100 μm.
藉由紫外可見光分光光度計(島津製作所UV-2550),測定藉由2片無鹼玻璃板夾持的密封材的硬化物的190nm~800nm的波長區域的平行光線透射率。另外,由於鐵氟龍片配置於玻璃板的端部,因此不會對測定結果造成影響。 The parallel light transmittance in the wavelength region of 190 nm to 800 nm of the cured product of the sealing material sandwiched between the two alkali-free glass plates was measured by an ultraviolet-visible spectrophotometer (Shimadzu Corporation UV-2550). In addition, since the Teflon sheet is disposed at the end of the glass sheet, it does not affect the measurement result.
並且,由密封材的硬化物的光線透射率測定結果,減去作為背景資料的無鹼玻璃板的透射率,並算出密封材的硬化物的平行光線透射率。 Then, from the measurement result of the light transmittance of the cured product of the sealing material, the transmittance of the alkali-free glass plate as the background material was subtracted, and the parallel light transmittance of the cured product of the sealing material was calculated.
評價藉由波長為400nm的平行光線透射率進行。 The evaluation was carried out by parallel light transmittance at a wavelength of 400 nm.
.透濕度(Ca法) . Moisture permeability (Ca method)
1)樣品的製作 1) Production of samples
準備浸漬於丙酮、進行了10分鐘超音波清洗的玻璃基板(大小:25mm×25mm、厚度:0.7mm)。在所述玻璃基板上,使用蒸鍍機(ALS科技公司製造),在下述條件下形成厚度為170nm的金屬鈣的蒸鍍膜(參照圖1A)。蒸鍍時使用遮罩,自金屬鈣的蒸鍍膜的端部至玻璃基板的端部為止的長度L設為4mm。 A glass substrate (size: 25 mm × 25 mm, thickness: 0.7 mm) which was immersed in acetone and subjected to ultrasonic cleaning for 10 minutes was prepared. On the glass substrate, a vapor deposition film of metal calcium having a thickness of 170 nm was formed under the following conditions using a vapor deposition machine (manufactured by ALS Technology Co., Ltd.) (see FIG. 1A). A mask was used for vapor deposition, and the length L from the end of the vapor deposited film of the metal calcium to the end of the glass substrate was set to 4 mm.
(蒸鍍條件) (evaporation conditions)
蒸鍍時的真空度:3.0×10-5Pa Vacuum degree during vapor deposition: 3.0 × 10 -5 Pa
製膜速度:1.2Å/秒鐘 Film forming speed: 1.2 Å / sec
金屬鈣原料:高純度化學製造、顆粒 Metal Calcium Raw Material: High Purity Chemical Manufacturing, Granules
將所得的附有金屬鈣的蒸鍍膜的玻璃基板在不暴露在空氣中的情況下移動至N2環境的手套箱中。繼而,在另外準備的經丙酮清洗的玻璃基板(25mm×55mm、厚度:2mm)上,以硬化後的厚度成為100μm的方式滴加實施例及比較例中所製作的密封材後,進行乾燥而形成塗膜(參照圖1B)。 The obtained glass substrate with the metal calcium-deposited film was moved to a glove box of an N 2 atmosphere without being exposed to the air. Then, on the separately prepared acetone-cleaned glass substrate (25 mm × 55 mm, thickness: 2 mm), the sealing material produced in the examples and the comparative examples was dropped so that the thickness after curing became 100 μm, and then dried. A coating film is formed (refer to FIG. 1B).
繼而,將附有密封材的塗膜的玻璃基板、與附有金屬鈣的蒸鍍膜的玻璃基板貼合而製成積層物,並藉由夾具固定。所得的積層物的厚度是在附有密封材的塗膜的玻璃基板與附有金屬鈣的蒸鍍膜的玻璃基板之間夾持厚度為100μm的鐵氟龍(註冊商標)片作為間隔物而進行調整。另外,自金屬鈣的蒸鍍膜的端部至密封材的塗膜的端部為止的長度L'亦設為4mm(參照圖1C)。 Then, a glass substrate with a coating film of a sealing material and a glass substrate with a vapor deposited film of metal calcium adhered to each other to form a laminate, which is fixed by a jig. The thickness of the obtained laminate is carried out by sandwiching a Teflon (registered trademark) sheet having a thickness of 100 μm between the glass substrate to which the coating film of the sealing material is applied and the glass substrate having the deposited film of metal calcium as a spacer. Adjustment. In addition, the length L' from the end of the vapor deposited film of the metal calcium to the end of the coating film of the sealing material was also 4 mm (see FIG. 1C).
繼而,藉由烘箱在100℃下將所述積層物加熱30分鐘使密封材硬化,而製成樣品。在任一種情況下,硬化後的密封材均成為膜狀。 Then, the laminate was cured by heating the laminate at 100 ° C for 30 minutes in an oven to prepare a sample. In either case, the cured sealing material is in the form of a film.
2)Ca反應開始時間的測定 2) Determination of the start time of Ca reaction
在恆溫恆濕槽中在60℃ 90%RH下保存所得的樣品。繼而,測定金屬鈣的蒸鍍膜的端部自金屬光澤變為透明為止的時間(Ca反應開始時間、單位:小時)。在Ca法中,評價來自膜狀密封材的硬化物的側面方向的透濕度。並且,將Ca反應開始時間為24小時以上的情形設為○,將小於24小時的情形設為×。 The resulting sample was stored at 60 ° C and 90% RH in a constant temperature and humidity chamber. Then, the time until the end of the vapor-deposited film of the metal calcium was changed from the metallic luster to the transparent (Ca reaction start time, unit: hour) was measured. In the Ca method, the moisture permeability in the side direction of the cured product from the film-like sealing material was evaluated. Further, the case where the Ca reaction start time is 24 hours or longer is ○, and the case where the Ca reaction start time is less than 24 hours is ×.
.彈性模數 . Elastic modulus
將密封材在100℃下加熱30分鐘使其硬化,而獲得厚度為100μm的硬化物。將所得的片材的硬化物切出為10mm×30mm作為試樣。在因特斯科(Intesco)公司製造的萬能拉伸試驗機上,以夾頭間距離為30mm安裝試樣,在起始負荷為10N、拉伸速度為30mm/分鐘下進行試驗。根據縱軸取應力、橫軸取應變的應力應變曲線的直線部的斜率,算出彈性模數。 The sealing material was cured by heating at 100 ° C for 30 minutes to obtain a cured product having a thickness of 100 μm. The cured product of the obtained sheet was cut out to have a size of 10 mm × 30 mm. The test was carried out on a universal tensile tester manufactured by Intesco, with a distance of 30 mm between the chucks, and the test was carried out at an initial load of 10 N and a tensile speed of 30 mm/min. The elastic modulus is calculated from the slope of the straight line portion of the stress-strain curve in which the stress is taken on the vertical axis and the strain is taken on the horizontal axis.
如表1所示般,在包含含有聚合性官能基的烯烴系聚合物(A)、聚合性單體(B)、六氫鄰苯二甲酸酐衍生物(C')、及自由基聚合起始劑(D)的實施例1的密封材中,Ca反應開始時間非常長。由於六氫鄰苯二甲酸酐衍生物(C')具有可自由基聚合的官能基,因此在密封材的硬化時,與聚合性單體(B)或含有聚合性官能基的烯烴系聚合物(A)等聚合。其結果,由於在密封材的硬化物中均勻地包含源自六氫鄰苯二甲酸酐衍生物(C')的結構(酸酐基),因此推測有效地捕捉自密封材的硬化物側面侵入的水分。 As shown in Table 1, the olefin-based polymer (A), the polymerizable monomer (B), the hexahydrophthalic anhydride derivative (C'), and the radical polymerization containing a polymerizable functional group are included. In the sealing material of Example 1 of the initiator (D), the Ca reaction start time was extremely long. Since the hexahydrophthalic anhydride derivative (C') has a radical polymerizable functional group, when the sealing material is hardened, the polymerizable monomer (B) or the olefin-based polymer containing a polymerizable functional group is used. (A) and other polymerizations. As a result, since the structure derived from the hexahydrophthalic anhydride derivative (C') (an acid anhydride group) is uniformly contained in the cured product of the sealing material, it is estimated that the intrusion of the side surface of the cured material from the sealing material is effectively captured. Moisture.
另外,在實施例1的密封材中,彈性模數充分低至17MPa。所述情況,由於六氫鄰苯二甲酸酐衍生物(C')具有可自由基聚合的官能基,在密封材的硬化時,與聚合性單體(B)、含有聚合性官能基的烯烴系聚合物(A)等聚合,因此推測密封材的硬 化物的交聯密度不過度提高,而彈性模數適度變低。 Further, in the sealing material of Example 1, the modulus of elasticity was sufficiently as low as 17 MPa. In this case, since the hexahydrophthalic anhydride derivative (C') has a radically polymerizable functional group, the polymerizable monomer (B) and the olefin having a polymerizable functional group are hardened at the time of curing of the sealing material. Polymerization (A), etc., so it is estimated that the sealing material is hard. The crosslink density of the compound is not excessively increased, and the elastic modulus is moderately low.
相對於此,在比較例2的密封材中,儘管包含4-甲基六氫鄰苯二甲酸酐或六氫鄰苯二甲酸酐,但Ca反應開始時間短。由於4-甲基六氫鄰苯二甲酸酐或六氫鄰苯二甲酸酐自密封材的硬化物滲出,因此推測無法充分捕捉水分。 On the other hand, in the sealing material of Comparative Example 2, although 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride was contained, the Ca reaction start time was short. Since 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride permeates from the cured product of the sealing material, it is presumed that the water cannot be sufficiently captured.
另外,比較例1及比較例2的密封材的硬化物的彈性模數為38MPa以上。推測含有聚合性官能基的烯烴系聚合物(A)或聚合性單體(B)的交聯密度提高。 Further, the cured products of the sealing materials of Comparative Example 1 and Comparative Example 2 had an elastic modulus of 38 MPa or more. It is estimated that the crosslinking density of the olefin-based polymer (A) or the polymerizable monomer (B) containing a polymerizable functional group is improved.
[實施例2] [Embodiment 2]
將作為聚合性單體(B)的下述式(B2)所示的化合物(FA-124AS、日立化成公司製造、數量平均分子量為198、一分子中的可自由基聚合的平均官能基數=2)80質量份;作為酸酐衍生物(C)的所述式(C1)所示的六氫鄰苯二甲酸酐衍生物(C')(4-META-H、日本精化公司製造)20質量份;作為自由基聚合起始劑的所述式(D1)所示的過氧化-2-乙基己酸第三戊酯(路派克(Luperox)575、阿科瑪吉富公司製造)5質量份混合,而製備密封材。 The compound represented by the following formula (B2) which is a polymerizable monomer (B) (FA-124AS, manufactured by Hitachi Chemical Co., Ltd., the number average molecular weight is 198, and the average number of functional groups of radically polymerizable in one molecule = 2 80 parts by mass; hexahydrophthalic anhydride derivative (C') represented by the above formula (C1) as an acid anhydride derivative (C) (4-META-H, manufactured by Nippon Seika Co., Ltd.) 20 mass 5 parts by weight of the third ester of peroxy-2-ethylhexanoate (Luperox 575, manufactured by Arkema Jifu Co., Ltd.) represented by the above formula (D1) as a radical polymerization initiator Mix and prepare a sealing material.
[實施例3] [Example 3]
代替過氧化-2-乙基己酸第三戊酯,而使用下述式(D2)所示的2,2'-偶氮雙-2-甲基丁腈,除此以外,以與實施例2相同的方式製備密封材。 Instead of the third amyl ester of peroxy-2-ethylhexanoate, 2,2'-azobis-2-methylbutyronitrile represented by the following formula (D2) was used, and the examples were 2 A sealing material was prepared in the same manner.
[實施例4] [Example 4]
代替過氧化-2-乙基己酸第三戊酯,而使用下述式(D3)所示的2-羥基-2-甲基-1-苯基-丙烷-1-酮,除此以外,以與實施例2相同的方式製備密封材。 In place of the third pentyl peroxy-2-ethylhexanoate, 2-hydroxy-2-methyl-1-phenyl-propan-1-one represented by the following formula (D3) is used, and A sealing material was prepared in the same manner as in Example 2.
[化14]
[比較例3] [Comparative Example 3]
代替六氫鄰苯二甲酸酐衍生物(C'),而使用新日本理化製造的理家德(RIKACID)MH700(4-甲基六氫鄰苯二甲酸酐/六氫鄰苯二甲酸酐(質量比=70/30)的混合物),除此以外,以與實施例2相同的方式製備密封材。 Instead of the hexahydrophthalic anhydride derivative (C'), RikkAID MH700 (4-methylhexahydrophthalic anhydride/hexahydrophthalic anhydride) (manufactured by Nippon Chemical Co., Ltd.) was used. A sealing material was prepared in the same manner as in Example 2 except that the mixture of mass ratio = 70/30).
[比較例4] [Comparative Example 4]
代替過氧化-2-乙基己酸第三戊酯,而使用式(D2)所示的2,2'-偶氮雙-2-甲基丁腈,除此以外,以與比較例3相同的方式製備密封材。 In place of the third amyl ester of 2-ethylhexanoic acid peroxide, the same as in Comparative Example 3 except that 2,2'-azobis-2-methylbutyronitrile represented by the formula (D2) was used. The way to prepare the sealing material.
[比較例5] [Comparative Example 5]
代替過氧化-2-乙基己酸第三戊酯,而使用式(D3)所示的2-羥基-2-甲基-1-苯基-丙烷-1-酮,除此以外,以與比較例3相同的方式製備密封材。 Instead of the third amyl ester of peroxy-2-ethylhexanoate, 2-hydroxy-2-methyl-1-phenyl-propan-1-one represented by the formula (D3) is used, in addition to The sealing material was prepared in the same manner as in Comparative Example 3.
[比較例6] [Comparative Example 6]
將環氧樹脂(甲酚酚醛清漆型艾比克隆(EPICLON)(註冊商標)N-680、環氧當量為200(g/eq)-220(g/eq)、大日本油墨化 學(Dainippon Ink and Chemicals,DIC)公司製造)50質量份;高純度液狀環氧樹脂(雙酚F型、YL983U0、環氧當量為165(g/eq)-175(g/eq)、三菱化學公司製造)50質量份;二氧化矽填料(雅都瑪費恩(Admafine)SO-C6、雅都瑪特科(ADMATECHS)公司製造)100質量份;光陽離子起始劑R2074(羅納-普朗克(Rhone-Poulenc)公司製造)3質量份混合,而製備密封材。 Epoxy resin (cresol novolac type Epiclon (registered trademark) N-680, epoxy equivalent 200 (g/eq)-220 (g/eq), inkjet in Japan (manufactured by Dainippon Ink and Chemicals, DIC) 50 parts by mass; high purity liquid epoxy resin (bisphenol F type, YL983U0, epoxy equivalent of 165 (g/eq) - 175 (g/eq), Mitsubishi 50 parts by mass produced by Chemical Company; cerium oxide filler (Admafine SO-C6, manufactured by ADMATECHS) 100 parts by mass; photocationic initiator R2074 (Rhone - Sealing material was prepared by mixing 3 parts by mass of a product manufactured by Rhone-Poulenc.
[評價] [Evaluation]
.平行光線透射率 . Parallel light transmittance
在熱硬化時,將藉由2片無鹼玻璃板夾持的密封材在80℃下加熱30分鐘使其硬化,在紫外線(Ultraviolet,UV)硬化時,照射3000mJ/cm2的波長為365nm的光使其硬化,而獲得厚度為100μm的密封材的硬化物,除此以外,以與所述(實施例1等)的平行光線透射率的測定方法相同的方式進行測定。 In the case of thermal hardening, the sealing material held by the two alkali-free glass plates is cured by heating at 80 ° C for 30 minutes, and irradiated with ultraviolet light (Ultraviolet, UV) at a wavelength of 365 nm of 3000 mJ/cm 2 . The light was hardened to obtain a cured product of a sealing material having a thickness of 100 μm, and the measurement was carried out in the same manner as the measurement method of the parallel light transmittance of the above (Example 1 and the like).
.透濕度(Ca法) . Moisture permeability (Ca method)
以與所述(實施例1等)的方法相同的方式測定透濕度(Ca)。繼而將測定樣品在100℃下進行30分鐘加熱處理,以與所述相同的方式評價透濕度。 The moisture permeability (Ca) was measured in the same manner as in the above (Example 1 and the like). Then, the measurement sample was subjected to heat treatment at 100 ° C for 30 minutes, and the moisture permeability was evaluated in the same manner as described above.
如表2所示般,在包含聚合性單體(B)、六氫鄰苯二甲酸酐衍生物(C')、及自由基聚合起始劑(D)的實施例2~實施例4的密封材中,Ca反應開始時間非常長。由於六氫鄰苯二甲酸酐衍生物(C')具有可自由基聚合的官能基,因此在密封材的硬化時,與聚合性單體(B)聚合,而在密封材的硬化物中均勻地包含源自六氫鄰苯二甲酸酐衍生物(C')的結構(酸酐基),因此推測有效地捕捉自密封材的硬化物側面侵入的水分。另外,Ca反應開始時間即便進行熱處理亦無變化。由於六氫鄰苯二甲酸酐衍生物 (C')與聚合性單體(B)聚合,因此推測不滲出。 As shown in Table 2, in Examples 2 to 4 containing the polymerizable monomer (B), the hexahydrophthalic anhydride derivative (C'), and the radical polymerization initiator (D) In the sealing material, the Ca reaction start time is very long. Since the hexahydrophthalic anhydride derivative (C') has a radically polymerizable functional group, it is polymerized with the polymerizable monomer (B) at the time of hardening of the sealing material, and is uniform in the cured product of the sealing material. Since the structure (an acid anhydride group) derived from the hexahydrophthalic anhydride derivative (C') is contained, it is estimated that the moisture invaded from the side surface of the cured product of the sealing material is effectively captured. Further, the Ca reaction start time did not change even if heat treatment was performed. Due to hexahydrophthalic anhydride derivatives Since (C') is polymerized with the polymerizable monomer (B), it is presumed that it does not bleed out.
另一方面,在比較例3~比較例5的密封材中,儘管包含4-甲基六氫鄰苯二甲酸酐或六氫鄰苯二甲酸酐,但Ca反應開始時間短。由於4-甲基六氫鄰苯二甲酸酐或六氫鄰苯二甲酸酐自密封材的硬化物滲出,因此推測無法充分捕捉水分。 On the other hand, in the sealing materials of Comparative Examples 3 to 5, although 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride was contained, the Ca reaction start time was short. Since 4-methylhexahydrophthalic anhydride or hexahydrophthalic anhydride permeates from the cured product of the sealing material, it is presumed that the water cannot be sufficiently captured.
另外,比較例6的包含環氧樹脂的密封材的Ca反應開始時間長,即水分透過性非常低,但黏度非常高,平行線透射率低。相對於此,實施例2~實施例4的密封材確認到黏度低,亦可進行藉由例如噴墨法的塗佈。另外,平行光線透射率亦高至98%。 Further, the sealing material containing the epoxy resin of Comparative Example 6 had a long Ca reaction start time, that is, the water permeability was extremely low, but the viscosity was very high and the parallel line transmittance was low. On the other hand, in the sealing materials of Examples 2 to 4, it was confirmed that the viscosity was low, and coating by, for example, an inkjet method was also possible. In addition, the parallel light transmittance is also as high as 98%.
本申請案主張基於2014年5月2日申請的日本專利特願2014-094957號的優先權。所述申請案說明書及圖式所記載的內容全部引用至本申請案說明書中。 The present application claims priority based on Japanese Patent Application No. 2014-094957, filed on May 2, 2014. The contents described in the specification and drawings of the application are all incorporated in the specification of the present application.
[產業上之可利用性] [Industrial availability]
本發明的密封材的硬化物的透濕度低,而且彈性模數適度低。因此可應用於各種光學裝置的密封層。 The cured product of the sealing material of the present invention has a low moisture permeability and a moderately low modulus of elasticity. Therefore, it can be applied to a sealing layer of various optical devices.
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