TWI648140B - Mould, moulding press and method for encapsulating electronic components mounted on a carrier using micro-pillars - Google Patents
Mould, moulding press and method for encapsulating electronic components mounted on a carrier using micro-pillars Download PDFInfo
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- TWI648140B TWI648140B TW105121320A TW105121320A TWI648140B TW I648140 B TWI648140 B TW I648140B TW 105121320 A TW105121320 A TW 105121320A TW 105121320 A TW105121320 A TW 105121320A TW I648140 B TWI648140 B TW I648140B
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- Prior art keywords
- mold
- carrier
- model
- fitting
- fittings
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- 238000000465 moulding Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 46
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 210000004177 elastic tissue Anatomy 0.000 claims abstract description 10
- 239000010408 film Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 28
- 238000005538 encapsulation Methods 0.000 claims description 10
- 239000005022 packaging material Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 6
- 239000004005 microsphere Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 239000012778 molding material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本發明是關於一種模具，用以封裝位於載體上的電子元件，包含至少 兩個模型配件，相互對應且可進行相互運動，分別具有相對應的接觸側相互夾合，以形成至少一個成模腔，圍繞所欲封裝的電子元件，其中至少一個模型配件具有一個成模腔凹陷於接觸側，其中凹陷於上述膜型配件的成模腔的上述接觸側的至少一部份表面上具有彈性微柱。本發明同時是關於一種模壓機，用以封裝位於載體上的電子元件，包含上述模具。本發明還是關於一種封裝位於載體上的電子元件的方法，利用彈性微柱(較佳為彈性纖維微柱)來支撐至少一部份位於成模腔中的金屬薄膜。 The invention relates to a mold for packaging electronic components on a carrier, including at least The two model fittings are corresponding to each other and are movable to each other, and the corresponding contact sides are respectively clamped to each other to form at least one molding cavity surrounding the electronic component to be packaged, wherein at least one of the model fittings has a molding cavity And recessed on the contact side, wherein at least a portion of the surface of the contact side of the molding cavity recessed in the film-type fitting has an elastic micro-column. The invention also relates to a molding machine for encapsulating electronic components on a carrier, including the above-described mold. The invention further relates to a method of packaging an electronic component on a carrier, using an elastic microcolumn (preferably an elastic fiber microcolumn) to support at least a portion of the metal film in the molding cavity.
Description
本發明是關於一種用於封裝位於載體上的電子元件的模具，包含至少兩個可位移的模型配件，上述模型配件藉由各自的接觸側以相互夾合，形成至少一個成模腔圍繞所欲封裝的電子元件。本發明同時關於一種模壓機，用於封裝位於載體上的電子元件，以及一種封裝方法，用於封裝位於載體上的電子元件。 The present invention relates to a mold for encapsulating an electronic component on a carrier, comprising at least two displaceable mold fittings which are mutually joined by respective contact sides to form at least one molding cavity surrounding the desired Packaged electronic components. The invention also relates to a molding machine for encapsulating electronic components on a carrier, and a packaging method for packaging electronic components on a carrier.
使用封裝材料來對位於載體上的電子元件進行封裝，是普遍使用的習知技術。以製程產業來說，上述類型之電子元件通常會使用固化的環氧樹脂與其他添加材料來進行封裝。目前市場趨勢來說，傾向同時進行大量小尺寸電子元件的封裝。小尺寸電子元件如半導體(晶片、LED)，並且尺寸還日趨縮小。當於封裝體(package)中使用的封裝材料，被配置用來大量封裝電子元件，封裝體有時會位於載體的一側，更或是位於載體的兩側來同時進行封裝。封裝材料通常是以一平坦層的型式接觸於載體。載體可以包含引線框架、多層結構基板、環氧物加工品(通常稱為載板或基層等)，或是其他種載體結構。 The use of packaging materials to encapsulate electronic components located on a carrier is a commonly used technique. In the process industry, electronic components of the above type are typically packaged using cured epoxy resins and other additive materials. In the current market trend, it tends to package a large number of small-sized electronic components at the same time. Small-sized electronic components such as semiconductors (wafers, LEDs) are becoming smaller in size. The packaging material used in the package is configured to package a large number of electronic components, and the package may be located on one side of the carrier or on both sides of the carrier for simultaneous packaging. The encapsulating material is typically in contact with the carrier in a flat layer pattern. The carrier may comprise a lead frame, a multilayer structure substrate, an epoxy processed article (commonly referred to as a carrier or a substrate, etc.), or other carrier structure.
在封裝的過程中，通常是利用具有相對應形狀的兩半模的模壓機，並且至少其中一個半模具有一或多個凹陷之成模腔。將安裝有電子元件的載體置於兩半模之間，兩半模會向彼此移動靠近，更或例如兩半模彼此靠近並夾住載體。經過一般程序加熱過的液態封裝材料接著被填入成模腔中，如藉由傳遞模塑法(transfer moulding)。或是，將例如是顆粒狀的封裝材料在兩半模合起來之前送入成模腔中，因此電子元件可以被模壓使其置入封裝材料中；此種施壓封裝方法是傳遞模塑法的另一種實施方式。常用的封裝材料為環氧樹膠(或稱樹脂)，並且通常會與其他添加物一起使用。在至少部分封裝材料於成模腔中(化學)固化後，會將具有封裝好的電子元件的載體從模壓機中取出。並且在進行下一個步驟之前，會將封裝好的電子元件彼此分離。在封裝製程中，可使用金屬薄膜來屏蔽或覆蓋部分之電子元件，以防止部分之電子元件被封裝材料覆蓋，同時還可以屏蔽在封裝材料與模具表面之間。部分被覆蓋的產品(未覆蓋於模壓產品，同時也稱之為“裸晶”或“暴露晶粒”產品)可以應用於各種產品；如現有的多種不同的感應元件、超薄包裝(ultra-thin packages)或散熱元件。上述的封裝方法使用於較大尺寸的產品，並且能提供良好的封裝效果於上述部分未被覆蓋的電子元件。但由於市場產品的尺寸日亦縮小，習知技術在封裝步驟以及對於封裝的電子元件的後續處理步驟中，對於封裝後產品無法提供精準的尺寸大小控制，來符合市場對於精準度的要求。 In the process of encapsulation, it is common to use a molding machine having two halves of a corresponding shape, and at least one of the mold halves has one or more recessed cavities. The carrier on which the electronic component is mounted is placed between the two mold halves, and the two mold halves move closer to each other, or more, for example, the two mold halves are close to each other and sandwich the carrier. The liquid encapsulating material that has been heated by the general procedure is then filled into a mold cavity, such as by transfer moulding. Or, for example, a granular encapsulating material is fed into the molding cavity before the two halves are molded together, so that the electronic component can be molded into the encapsulating material; the pressing packaging method is transfer molding. Another implementation. Commonly used encapsulating materials are epoxy gums (or resins) and are often used with other additives. After at least a portion of the encapsulating material is (chemically) cured in the mold cavity, the carrier with the packaged electronic components is removed from the molding press. And the packaged electronic components are separated from each other before proceeding to the next step. In the packaging process, a metal film can be used to shield or cover portions of the electronic components to prevent portions of the electronic components from being covered by the encapsulating material while also shielding between the encapsulating material and the mold surface. Partially covered products (not covered by molded products, also known as "bare" or "exposed die" products) can be applied to a variety of products; such as many different sensing elements, ultra-thin packaging (ultra- Thin packages) or heat sink components. The above-described packaging method is used for a larger size product and provides a good packaging effect to the above-mentioned partially uncovered electronic components. However, as the size of the market products is also shrinking, the conventional technology cannot provide accurate size control for the packaged products in the packaging step and the subsequent processing steps of the packaged electronic components to meet the market requirements for precision.
基於上述問題與需求，本發明目的在提供一種替代的方法與裝置，具有習知封裝方法的優勢，並且提供較佳、較精準的電子元件封裝。 Based on the above problems and needs, the present invention aims to provide an alternative method and apparatus that has the advantages of conventional packaging methods and provides a better and more accurate electronic component package.
為達上述目的，本發明提供一種用於封裝位於載體上的電子元件的模具包含至少兩個模型配件，可相互位移運動，上述至少兩個模型配件設置以彼此對應，例如彼此間具有對應的接觸側可以相互夾緊或卡合，以形成至少一個成模腔以圍繞包含所欲封裝的電子元件，其中至少一個模型配件具有一個成模腔嵌於/凹陷於上述模型配件的接觸側；其中，凹陷於上述膜型配件的成模腔的上述接觸側的至少一部份表面上具有彈性微柱(micro-pillars)，較佳為彈性纖維微柱(即，使用彈性纖維elastomer製成的微柱)。在此層面而言，凹陷於接觸側的成模腔，可以被理解為成模配件接觸側的一部份，其中成模腔為凹陷的。因微柱具有的彈性/伸縮性之特性，微柱存在於一個模型配件的表面上，可以補償所欲成模的電子元件(至少一部分被封裝材料包圍)之間的微小高度差。微柱通常具有線性關係的力-位移曲線(load-displacement curve)，並且其塑性變型(plastic deformation)(微柱構型的壓縮和/或彎曲)之特性，可以避免微柱大幅膨脹的狀況產生。特別是當金屬薄膜壓於電子元件上，以使部份之電子元件不會被封裝材料覆蓋，此狀況下微柱雖可以提供高度差的補償，但能補償的位於載體上的電子元件(晶粒、晶片或其他元件)的高度差範圍有限，並且由於部分電子元件未被封裝材料覆蓋，可能會在封裝過程中造成電子元件表面的汙染。上述汙染的預防方法可以為通稱的免模滲/模漫法(bleed-and-flash free moulding，或稱無膠邊模壓法)。依據習知技術之方法，彈性金屬薄膜被用來改善有限的高度差，但由於金屬薄膜的特性，可能會造成垂直方向上，對於電子元件以及/或電子元件與載體的連接(如覆晶連線中的導柱或凸塊)，具有較高的壓力與應力，同時也會造成中介層(interposer)或是載體中的高應力，導致金屬薄膜對於高度適應之特性的靈活性是非常有限的。高應力(高貨載)可能會導致所欲封裝的電子元件的破裂，破裂例如發生在電子元件與環境(載體)之間的中 間連接部分，及/或在電子元件安裝基底或是載體上，因此應避免上述高應力產生。當載體為基板以及/或是材質為玻璃或矽時，如晶圓，提升應力可能還會導致載體受損。習知技術中使用金屬薄膜來提供模具中的區域應力，但僅僅是部分而已，而本發明進一步改善了習知技術模具中區域應力有限的提升，因而減少發生於電子元件、配件與載體的損傷。本發明特別適用於位於載體的電子元件，其中載體可以為(矽)晶圓，及/或具有多層平坦結構的基板，該基板提供有一承載面以及電性傳導支撐結構。 To achieve the above object, the present invention provides a mold for encapsulating an electronic component on a carrier, comprising at least two model fittings movable to each other, the at least two model fittings being disposed to correspond to each other, for example, having corresponding contacts with each other The sides may be clamped or snapped to each other to form at least one molding cavity to surround the electronic component containing the package to be packaged, wherein at least one of the model fittings has a molding cavity embedded/recessed on the contact side of the model fitting; At least a portion of the surface of the contact side recessed in the cavity of the film-type fitting has elastic micro-pillars, preferably an elastic fiber micro-column (ie, a micro-pillar made of elastic fiber elastomer) ). At this level, the cavity formed on the contact side can be understood as a part of the contact side of the mold fitting, wherein the cavity is recessed. Due to the elastic/elastic properties of the microcolumns, the micropillars are present on the surface of a model fitting to compensate for the small height difference between the electronic components to be molded (at least a portion of which is surrounded by the encapsulating material). Microcolumns usually have a linear force-displacement curve, and their plastic deformation (compression and/or bending of the microcolumn configuration) can avoid the situation of large expansion of the microcolumn. . In particular, when the metal film is pressed against the electronic component so that part of the electronic component is not covered by the encapsulating material, the microcolumn can provide compensation for height difference in this case, but can compensate the electronic component on the carrier (crystal The height difference of the particles, wafers or other components is limited, and since some of the electronic components are not covered by the packaging material, contamination of the surface of the electronic components may occur during the packaging process. The above-mentioned method for preventing pollution can be a commonly known method of bleed-and-flash free moulding (or no-edge molding). According to the method of the prior art, the elastic metal film is used to improve the finite height difference, but due to the characteristics of the metal film, it may cause the connection of the electronic component and/or the electronic component to the carrier in the vertical direction (such as a flip chip connection). The guide posts or bumps in the wire have high pressure and stress, and also cause high stress in the interposer or the carrier, resulting in very limited flexibility of the metal film for highly adaptable properties. . High stress (high load) may cause cracking of the electronic component to be packaged, such as occurs between the electronic component and the environment (carrier) The intermediate connection portion, and/or on the electronic component mounting substrate or carrier, should avoid the above-mentioned high stress generation. When the carrier is a substrate and/or the material is glass or germanium, such as a wafer, lifting stress may also cause damage to the carrier. Metal foils are used in the prior art to provide regional stresses in the mold, but only partially, and the present invention further improves the limited stress in the prior art molds, thereby reducing damage to electronic components, components and carriers. . The invention is particularly applicable to electronic components located on a carrier, wherein the carrier can be a (矽) wafer, and/or a substrate having a plurality of planar structures, the substrate being provided with a carrier surface and an electrically conductive support structure.
另外，本發明可以避免習知電子元件封裝技術中使用金屬薄膜的另一缺點，位於電子元件與模型配件接觸面之間的金屬薄膜的壓縮力，金屬薄膜覆蓋區域之部分材料產生區域性的壓縮，使材料側向位移，對周圍被金屬薄膜覆蓋的電子元件產生侵害。考量產品的可靠性與美觀性，並且考量現在越來越微小化/薄化的封裝要求，上述的壓縮侵害是無法被接受的。依據本發明配合使用的微柱可以預防，或是至少減少上述封裝侵害周圍壓膜的電子元件的狀況產生。當與金屬薄膜同時使用時，本發明的微柱可以彈性變型，以使金屬薄膜的應力/負載降低，使金屬薄膜層可以重複使用多次(使用於多次封裝循環)，不同於習知技術中，高度差的補償僅能由金屬薄膜來提供。因此，本發明可以減少金屬薄膜於封裝製程中的消耗，進而達到降低製程成本之功效。 In addition, the present invention can avoid another disadvantage of the use of a metal film in the conventional electronic component packaging technology, the compressive force of the metal film located between the contact faces of the electronic component and the model component, and the partial compression of a portion of the material of the metal film covering region. The material is laterally displaced to invade the electronic components surrounded by the metal film. Considering the reliability and aesthetics of the product, and considering the increasingly miniaturized/thinned packaging requirements, the above-mentioned compression violations are unacceptable. The microcolumn used in accordance with the present invention can prevent, or at least reduce, the occurrence of the above-described electronic components that invade the surrounding lamination. When used together with a metal film, the microcolumn of the present invention can be elastically modified to reduce the stress/load of the metal film, so that the metal film layer can be reused multiple times (used in multiple packaging cycles), unlike conventional techniques. Medium, the height difference compensation can only be provided by a metal film. Therefore, the invention can reduce the consumption of the metal film in the packaging process, thereby achieving the effect of reducing the process cost.
於本發明之一實施例中，微柱垂直地連接於模型配件的表面上。一般來說，微柱在垂直方向上的彈性具有最大值以及最佳的穩定度。特別是在微柱的縱向方向上(微柱的延伸方向)，微柱能提供所需的彈性以補償封裝電子元件的高度差。進一步控制微柱的彈性特性以及封裝結構所包含的應力，可以藉由將複數個微柱以陣列設置的方式來實現。 In one embodiment of the invention, the micropillars are vertically attached to the surface of the mold fitting. In general, the elasticity of the microcolumns in the vertical direction has a maximum value and an optimum stability. Particularly in the longitudinal direction of the microcolumns (the direction in which the micropillars extend), the micropillars provide the resilience required to compensate for the height difference of the packaged electronic components. Further controlling the elastic properties of the microcolumns and the stresses contained in the package structure can be achieved by arranging a plurality of microcolumns in an array.
為了使微柱能朝向未被封裝材料覆蓋之部分電子元件之一側，微柱接觸於模型配件的成模腔具有之接觸面的凹陷部分。 In order to enable the microcolumn to face one side of a portion of the electronic component that is not covered by the encapsulating material, the microcolumn contacts the recessed portion of the contact surface of the mold cavity of the mold fitting.
為使微柱能有效的支撐金屬薄膜層，微柱接觸於模型配件表面，並且其遠離模型配件表面的一側具有微球型的尖端。上述於微柱尖端的微球型可以提高微柱的使用期限。 In order for the microcolumn to effectively support the metal film layer, the microcolum is in contact with the surface of the model fitting, and its side away from the surface of the model fitting has a microsphere tip. The microsphere type described above at the tip of the microcolumn can increase the life of the microcolumn.
另外，如同習知技術中的模具，本案結合使用微柱，並且至少一個模型配件提供有抽吸通道，開口於模型配件的接觸側，以及/或至少一個模型配件提供有進料管，以使封裝材料嵌入於模型配件並且連接於成模腔。 In addition, as in the prior art molds, the present invention uses a combination of micropillars, and at least one of the model fittings is provided with a suction passage opening to the contact side of the model fitting, and/or at least one of the model fittings is provided with a feed tube to enable The encapsulating material is embedded in the mold fitting and attached to the molding cavity.
本案的微柱還可以為中空的結構，以提供微柱更好的彈性。上述微柱也可被稱為「微管」(micro tubes)或是「奈米管」(nano tubes)，並且例如可以是管狀結構，由碳、矽、氮化硼、聚二甲矽氧烷(PDMS)或其他適合之材質構成。微柱的尺寸至少是高度2,000μm、橫剖面寬度100μm，並且微柱每平方公分的數量可以從幾千到幾百萬不限。微柱例如可以是經由光刻、蝕刻、沉積、模壓或其他適合之技術製作而成。 The microcolumns of the present case can also be hollow structures to provide better flexibility of the microcolumns. The above microcolumns may also be referred to as "micro tubes" or "nano tubes" and may, for example, be tubular structures composed of carbon, germanium, boron nitride, polydimethyloxane. (PDMS) or other suitable material. The size of the microcolumns is at least 2,000 μm in height and 100 μm in cross section, and the number of microcolumns per square centimeter may be from several thousands to several millions. The micropillars can be fabricated, for example, by photolithography, etching, deposition, molding, or other suitable technique.
本發明同時提供一種模壓機，用於封裝位於載體上的電子元件，包含：如上所述之模具，包含至少兩個模型配件，可相互位移運動，上述至少兩個模型配件設置彼此對應，例如彼此間具有對應的接觸側可以相互夾緊或卡合，以形成至少一個成模腔以圍繞包含所欲封裝的電子元件，其中至少一個模型配件具有一個成模腔嵌於/凹陷於上述模型配件的接觸側，並且其中，上述模型配件具有的接觸側上的凹陷的成模腔的至少一部份表面上具有彈性微柱(micro-pillars)，較佳為彈性纖維微柱(elastomeric micro-pillars，即，使用彈性纖維elastomer製成的微柱)；進料工具，以將封裝材料填入於成模腔；以及驅動系統，以移動相對應的上述模型配件，使載體夾於模型配件之接觸側之間，同時提供可控制之壓力，其中本案之模 壓機提供有金屬薄膜處理器，以從遠離模型配件表面之一側來覆蓋連接於模型配件表面上的微柱。因此本發明提供之模壓機，同樣可實現本發明之模具的功效，請參考如上所述之功效。特別是結合使用至少一個具有多個微柱的結構的模型配件與金屬薄膜處理器(正常會設計成一個金屬箔進料輥以及一個金屬箔排出輥，位於模型配件的相對側)，以於封裝過程中，支撐覆蓋於部分電子元件的金屬薄膜。微柱接觸於一個模型配件，提供彈性的表面支撐力。金屬薄膜處理器被設置用來操作金屬薄膜，使其可以反抗覆蓋的模型配件中的至少一個成模腔。微柱支撐與金屬薄膜的結合使用，因微柱可用來補償封裝電子元件間的高度差，因此可以減少製程成本(因金屬薄膜使用的減少)，並能提供較佳的模壓效果(較少更或不具有可塑的變型特性的金屬薄膜帶來較少的受壓性(dwelling)，以及未被封裝材料覆蓋之部分電子元件能具有較少的模滲及/或模漫現象產生)。金屬薄膜還可以使模壓的電子元件輕易從模具上脫離；此種金屬薄膜稱為「脫離箔」(release foil)。 The present invention also provides a molding machine for encapsulating an electronic component on a carrier, comprising: a mold as described above, comprising at least two model fittings movable to each other, the at least two model fittings being disposed corresponding to each other, for example Corresponding contact sides with each other may be clamped or snapped to each other to form at least one mold cavity for surrounding the electronic component containing the package to be packaged, wherein at least one of the model fittings has a mold cavity embedded/recessed in the above model fitting The contact side, and wherein the mold fitting has a recessed mold cavity on the contact side having at least a portion of the surface having elastic micro-pillars, preferably elastic fiber micro-pillars (elastomeric micro-pillars) , that is, a microcolumn made of elastic fiber elastomer; a feeding tool to fill the encapsulating material into the molding cavity; and a driving system to move the corresponding model fitting to make the carrier be in contact with the model fitting Between the sides, at the same time provide controllable pressure, of which the model of the case The press is provided with a metal film processor to cover the micropillars attached to the surface of the mold fitting from one side away from the surface of the mold fitting. Therefore, the molding machine provided by the present invention can also achieve the efficacy of the mold of the present invention, please refer to the effects as described above. In particular, a combination of at least one model fitting having a structure of a plurality of micropillars and a metal film processor (normally designed as a metal foil feed roller and a metal foil discharge roller on the opposite side of the model fitting) for packaging In the process, a metal film covering a part of the electronic component is supported. The micropillars are in contact with a model fitting that provides elastic surface support. The metal film processor is configured to operate the metal film such that it can resist at least one of the molded mold parts. The combination of micropillar support and metal film, because the microcolumn can be used to compensate for the height difference between the packaged electronic components, thus reducing the process cost (due to the reduction in the use of metal film) and providing better molding results (less A metal film that does not have a plastically deformable property brings less dwelling, and a part of the electronic component that is not covered by the encapsulating material can have less mold penetration and/or a mold diffusion phenomenon. The metal film also allows the molded electronic component to be easily detached from the mold; such a metal film is referred to as a "release foil."
模壓機同時還提供有抽吸工具，連接於抽吸通道，其中抽吸通道開口於模型配件的接觸側，可以使金屬薄膜吸附於模型配件上(因抽吸通道中的低壓力)，以及連接於模型配件的微柱上，因此可以進一步支撐金屬薄膜於模型配件的定位性(於位置的持續穩定性)。 The molding machine is also provided with a suction tool connected to the suction passage, wherein the suction passage is open to the contact side of the model fitting, so that the metal film can be adsorbed on the model fitting (because of the low pressure in the suction passage), and It is attached to the micro-pillars of the model fittings, thus further supporting the positioning of the metal film on the model fittings (continuous stability in position).
本發明同時提供一種封裝方法，用於封裝位於載體上的電子元件，包含製程步驟：A)使用金屬薄膜層覆蓋至少部分之模型配件之接觸側，上述被覆蓋的部分之模型配件之接觸側具有至少一個凹陷之成模腔；B)將具有電子元件的載體置於至少兩個模型配件之間，其中至少一個模型配件的至少一部份被金屬薄膜層覆蓋；C)模型配件朝向彼此移動，以將載體夾合於對應於模型配件的接觸側之間，並且至少一個成模腔圍繞所欲封裝的電子元件；D)將封裝材料置入成模腔中；E)將模型配件移動遠離彼此，並將 具有模壓好的電子元件的載體從模型配件之間移出；其中於成模腔中的金屬薄膜層至少部分被彈性微柱支撐，彈性微柱較佳為彈性纖維微柱，連接於模型配件之表面，較佳為模型配件上的凹陷成模腔之表面。特別是，所欲模壓的電子元件可以接觸金屬薄膜層於成模腔中。上述之方法有利於通稱的「裸晶」的製造。更多的說明與功效，請參考上述關於本案提供之模具與模壓機的說明段落。微柱可以依據所欲模壓的電子元件之高度差值被壓縮及/或變型。 The invention also provides a packaging method for packaging an electronic component on a carrier, comprising the steps of: A) covering a contact side of at least a portion of the model component with a metal film layer, the contact side of the covered component of the covered portion having At least one recessed cavity; B) placing a carrier having electronic components between at least two model fittings, wherein at least a portion of at least one of the model fittings is covered by a metal film layer; C) the model fittings are moved toward each other, To sandwich the carrier between the contact sides corresponding to the model fitting, and at least one molding cavity surrounding the electronic component to be packaged; D) placing the packaging material into the molding cavity; E) moving the model fittings away from each other And The carrier having the molded electronic component is removed from between the model fittings; wherein the metal film layer in the molding cavity is at least partially supported by the elastic microcolumn, and the elastic microcolumn is preferably an elastic fiber microcolumn connected to the surface of the model fitting Preferably, the surface of the mold part is recessed into a cavity. In particular, the electronic component to be molded can contact the metal film layer in the mold cavity. The above method facilitates the manufacture of the commonly known "bare crystal". For more explanation and efficacy, please refer to the above description of the mold and molding machine provided in this case. The microcolumns can be compressed and/or modified depending on the difference in height of the electronic components to be molded.
封裝材料的置入如上步驟D)，進行於步驟C)模型配件朝向彼此移動之後，藉由施加壓力於封裝材料，來將液態的封裝材料取代進入圍繞電子元件的成模腔中。上述的模壓技術也被稱為傳遞與壓縮模塑法(transfer moulding and compression moulding)。於另一模壓方法中，封裝材料的置入步驟D)，進行於步驟C)模型配件朝向彼此移動之前。此種模壓製程也被稱為壓縮成型法(compression moulding)。本發明提供之模壓方法可以獨立地被應用。一般來說，封裝材料會於模壓前或是模壓過程中被加熱，但本發明並不以此為限。 The encapsulation material is placed in the mold cavity surrounding the electronic component by applying pressure to the encapsulation material after the step C) is moved to the other. The above molding technique is also referred to as transfer moulding and compression moulding. In another molding method, the placement of the encapsulating material in step D) is performed before step C) the model fittings are moved toward each other. This molding process is also known as compression moulding. The molding method provided by the present invention can be applied independently. Generally, the encapsulating material is heated before or during molding, but the invention is not limited thereto.
在模型配件移動遠離彼此的步驟E)之前，封裝材料可以至少一部分被固化，使模塑成型的產品不會在脫離模具的過程中失去形狀。 The encapsulating material may be at least partially cured before the mold fitting moves away from each other in step E) so that the molded product does not lose its shape during the process of leaving the mold.
1‧‧‧模具 1‧‧‧Mold
2‧‧‧電子元件 2‧‧‧Electronic components
3‧‧‧載體 3‧‧‧ Carrier
4、5‧‧‧模型配件 4, 5‧‧‧ model accessories
6‧‧‧成模腔 6‧‧‧Molding cavity
7‧‧‧金屬薄膜 7‧‧‧Metal film
8‧‧‧封裝材料 8‧‧‧Packaging materials
9‧‧‧底盤 9‧‧‧Chassis
10、11‧‧‧微柱 10, 11‧‧‧ microcolumn
L1、L2‧‧‧長度 L 1 , L 2 ‧‧‧ length
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉數個較佳實施例，並配合所附圖式作詳細說明如下，但並非用以限制本發明：圖1A所示為依據本發明所繪製，模具之剖面結構側視圖；圖1B所示為圖1A所示側視圖的詳細結構示意圖； 圖2A所示為未施加壓力時的微柱示意圖；以及圖2B-2D所示為圖2A所示之微柱，處於不同壓力狀況之示意圖。 The above and other objects, features, and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Shown is a side view of a cross-sectional structure of the mold according to the present invention; FIG. 1B is a detailed structural view of the side view shown in FIG. 1A; 2A is a schematic view of the microcolumn when no pressure is applied; and FIGS. 2B-2D is a schematic view of the microcolumn shown in FIG. 2A under different pressure conditions.
圖1A，以及細部結構圖1B，所示為模具1的剖面圖，用以封裝位於載體3上的電子元件2。模具1包含兩個模型配件：一個上模型配件4與一個下模型配件5，兩者可相互位移運動。如圖1A與1B所示，模型配件4與5朝向彼此移動，以將載體3夾合於兩模型配件4、5的接觸側之間。上模型配件4的成模腔6向內凹陷，可以將電子元件2包含於其中。金屬薄膜7置於上模型配件4的接觸側，具有提升模壓後的電子元件脫離的功效，同時還可以使電子元件2的上側與封裝材料8隔離。將封裝材料8置入模型配件4、5之間，尤其是置入成模腔6的空間之中(即位於電子元件2之間的位置)。於成模腔6中，底盤9承載有大量的微柱10，較佳地為彈性纖維微柱。微柱10可伸縮地、彈性地支撐金屬薄膜7，提供如上所述的本發明之優勢。 1A, and a detailed structure FIG. 1B, which is a cross-sectional view of a mold 1 for encapsulating an electronic component 2 on a carrier 3. The mold 1 contains two model fittings: an upper model fitting 4 and a lower model fitting 5, which are mutually displaceable. As shown in Figures 1A and 1B, the model fittings 4 and 5 are moved towards each other to sandwich the carrier 3 between the contact sides of the two model fittings 4, 5. The molding cavity 6 of the upper mold fitting 4 is recessed inward, and the electronic component 2 can be contained therein. The metal film 7 is placed on the contact side of the upper mold fitting 4, and has the effect of lifting the electronic component after molding, and also allows the upper side of the electronic component 2 to be isolated from the packaging material 8. The encapsulating material 8 is placed between the mould parts 4, 5, in particular into the space of the moulding cavity 6 (i.e. at a position between the electronic components 2). In the mold cavity 6, the chassis 9 carries a large number of micropillars 10, preferably elastic fiber micropillars. The micropillar 10 telescopically and elastically supports the metal thin film 7, providing the advantages of the present invention as described above.
如圖2A所示之微柱11，例如是彈性纖維微柱，是微柱11之軸向未施予負重/壓力的狀況所繪製之示意圖，其具有未負重長度L1。圖2B所示為相同之微柱11施加壓力F時，長度減少為有效支撐長度L2。有效支撐長度L2是藉由彎曲微柱11來實現。圖2C所示為相同之微柱11，同樣處於施加壓力F的狀態，其長度減少為有效支撐長度L2，不同的是，此實施例中長度的減少是藉由壓縮微柱11本身，來達到有效支撐長度L2。圖2D所示為圖2B與圖2C兩狀態的結合，藉由微柱11的部分壓縮與部分彎曲，來達到有效支撐長度L2。 Micro-column 11 of FIG. 2A, for example, micro-column elastic fibers, the drawing is a schematic diagram of the micro-column 11 of the axial load is not administered / pressure conditions, not having load length L 1. 2B shows that when the pressure F is applied to the same microcolumn 11, the length is reduced to the effective support length L 2 . The effective support length L 2 is achieved by bending the micro-pillars 11. 2C shows the same microcolumn 11, also in the state where the pressure F is applied, and its length is reduced to the effective support length L 2 , except that the length reduction in this embodiment is by compressing the microcolumn 11 itself. The effective support length L 2 is reached. 2D shows a combination of the two states of FIG. 2B and FIG. 2C, with the partial compression and partial bending of the micro-pillars 11 to achieve an effective support length L 2 .
Claims (17)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??2015091 | 2015-07-06 | ||
| NL2015091A NL2015091B1 (en) | 2015-07-06 | 2015-07-06 | Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars. |
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| Publication Number | Publication Date |
|---|---|
| TW201707916A TW201707916A (en) | 2017-03-01 |
| TWI648140B true TWI648140B (en) | 2019-01-21 |
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| TW105121320A TWI648140B (en) | 2015-07-06 | 2016-07-06 | Mould, moulding press and method for encapsulating electronic components mounted on a carrier using micro-pillars |
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| NL (1) | NL2015091B1 (en) |
| TW (1) | TWI648140B (en) |
| WO (1) | WO2017007308A1 (en) |
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| NL2021058B1 (en) * | 2018-06-05 | 2019-12-11 | Besi Netherlands Bv | Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements |
| CN112549434A (en) * | 2020-12-09 | 2021-03-26 | 扬州扬芯激光技术有限公司 | Optical lens and method for encapsulating the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030034555A1 (en) * | 2001-08-15 | 2003-02-20 | Asm Technology Singapore Pte. Ltd. | Mold |
| US20050085033A1 (en) * | 2000-12-28 | 2005-04-21 | Stmicroelectronics S.R.L. | Manufacturing method of an electronic device package |
| WO2005043612A1 (en) * | 2003-09-09 | 2005-05-12 | Fico B.V. | Method and device for encapsulating electronic components using a flexible pressure element |
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| JP5965706B2 (en) * | 2012-04-12 | 2016-08-10 | 日立オートモティブシステムズ株式会社 | Manufacturing method of flow sensor |
| US9039488B2 (en) * | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
-
2015
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050085033A1 (en) * | 2000-12-28 | 2005-04-21 | Stmicroelectronics S.R.L. | Manufacturing method of an electronic device package |
| US20030034555A1 (en) * | 2001-08-15 | 2003-02-20 | Asm Technology Singapore Pte. Ltd. | Mold |
| WO2005043612A1 (en) * | 2003-09-09 | 2005-05-12 | Fico B.V. | Method and device for encapsulating electronic components using a flexible pressure element |
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| Publication number | Publication date |
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| WO2017007308A1 (en) | 2017-01-12 |
| TW201707916A (en) | 2017-03-01 |
| NL2015091B1 (en) | 2017-01-30 |
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