TWI533508B - Method of manufacturing stereo antenna - Google Patents
Method of manufacturing stereo antenna Download PDFInfo
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- TWI533508B TWI533508B TW102137283A TW102137283A TWI533508B TW I533508 B TWI533508 B TW I533508B TW 102137283 A TW102137283 A TW 102137283A TW 102137283 A TW102137283 A TW 102137283A TW I533508 B TWI533508 B TW I533508B
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Description
本發明係有關一種立體天線之製造方法,特別是指一種可以較低成本製作天線,且天線之尺寸及造型皆不受限制,可在非為平面的基板上製造,進而可達到縮小整個天線模組高度之立體天線製造方法。 The invention relates to a method for manufacturing a stereo antenna, in particular to an antenna which can be manufactured at a lower cost, and the size and shape of the antenna are not limited, and can be fabricated on a non-planar substrate, thereby reducing the entire antenna module. Group height stereoscopic antenna manufacturing method.
由於現今技術的進步以及商品人性化的趨勢,許多通訊電子產品,例如智慧型手機(Smart Phone)、行動電話(Mobile Phone)、筆記型電腦(Notebook)、平板電腦(Tablet Personal Computer)、個人導航機(Personal Navigation Device,PND)以及全球定位系統(Global Position System,GPS)等行動裝置,其天線的製造大多應用軟性電路板(Flexible Printed Circuit Board,FPCB)。然而,軟性電路板在黏貼於非平面表面時,特別是在三維(Three-dimensional,3D)的雙曲面(hyperboloid),會因為無法完全伏貼而產生翻翹的情形,所以軟性電路板較適合用於介於二維(Two-dimension,2D)平面與三維(Three-dimension,3D)空間之間(2.5D)的單曲面(Single curved surface)。因此,當天線需設置在非平面表面時,大多以雷射直接成型技術(Laser Direct Structure,LDS)來實作。 Due to advances in technology and the trend of humanization of products, many communication electronic products, such as smart phones, mobile phones, notebooks, tablet personal computers, personal navigation Mobile devices such as Personal Navigation Device (PND) and Global Position System (GPS) use flexible printed circuit boards (FPCBs) for the manufacture of antennas. However, when a flexible circuit board is attached to a non-planar surface, especially in a three-dimensional (3D) hyperboloid, it may be turned over because it cannot be completely affixed, so a flexible circuit board is suitable. A single curved surface between a two-dimension (2D) plane and a three-dimensional (3D) space (2.5D). Therefore, when the antenna needs to be placed on a non-planar surface, it is mostly implemented by Laser Direct Structure (LDS).
雷射直接成型技術係將一些特殊可雷射活化的塑料,射出成型為一預定之本體結構,然後再利用特定波長的雷射,將塑料內摻入的金屬晶粒予以活化,同時定義出天線圖案,最後 再進行金屬化製程。 Laser direct structuring technology projects some special laser-activated plastics into a predetermined body structure, and then uses a specific wavelength of laser to activate the metal grains incorporated in the plastic, and defines the antenna. Pattern, finally Then carry out the metallization process.
然而,上述之塑料內必須摻雜金屬催化劑,而且須針對不同材質的塑料及材料特性,摻雜不同成分比例的金屬催化劑,造成雷射活化的條件不同,必須重新調整雷射波長與金屬化的控制參數,因此,LDS製程須採取特定波長的雷射設備以及設置不同條件的金屬化設備或控制參數,也使得設備與製造成本較為昂貴。且添加金屬催化劑之塑料製作出之天線,容易因為金屬添加劑影響天線收發品質。 However, the above-mentioned plastics must be doped with a metal catalyst, and the metal catalysts of different compositions must be doped for different materials of plastics and materials, and the conditions for laser activation are different, and the laser wavelength and metallization must be re-adjusted. Control parameters, therefore, the LDS process must take laser equipment of a specific wavelength and metallization equipment or control parameters with different conditions, which makes the equipment and manufacturing cost more expensive. The antenna made of plastic with metal catalyst is easy to affect the quality of antenna transmission and reception because of metal additives.
有鑒於此,本發明即在提供一種以較低成本製作天線,且天線之尺寸及造型皆不受限制,可在非為平面的基板上製造,進而可達到縮小整個天線模組高度之立體天線製造方法,為其主要目的者。 In view of the above, the present invention provides an antenna that is manufactured at a lower cost, and the size and shape of the antenna are not limited, and can be fabricated on a non-planar substrate, thereby achieving a stereoscopic antenna that reduces the height of the entire antenna module. Manufacturing method for its main purpose.
為達上揭目的,本發明之製造方法係包含下列步驟:提供一具有一預定立體構型之基材;於該基材表面覆蓋一可剝除之高分子保護層;進行雷雕圖案化,形成一圖案化高分子保護層;進行金屬化處理,沈積形成一金屬薄膜層,且該金屬薄膜層覆蓋於該圖案化高分子保護層表面,以及未受該圖案化高分子保護層覆蓋之基材表面;剝除上述圖案化高分子保護層,讓該圖案化高分子保護層及其上方之金屬薄膜層自基材表面剝離,而形成圖案化金屬薄膜層;最後對上述圖案化金屬薄膜層表面進行化學鍍層處理,完成立體天線。 In order to achieve the above object, the manufacturing method of the present invention comprises the steps of: providing a substrate having a predetermined stereo configuration; covering a surface of the substrate with a peelable polymer protective layer; Forming a patterned polymer protective layer; performing metallization treatment to deposit a metal thin film layer, and the metal thin film layer covers the surface of the patterned polymer protective layer and is not covered by the patterned polymer protective layer The surface of the material is stripped, and the patterned polymer protective layer is stripped, and the patterned polymer protective layer and the metal thin film layer thereon are peeled off from the surface of the substrate to form a patterned metal thin film layer; finally, the patterned metal thin film layer is formed The surface is subjected to electroless plating to complete the stereoscopic antenna.
利用上述結構特徵,本發明之製造方法不受尺寸及造型之限制,可在非為平面的基板上製造出立體天線,進而可達到縮小整個天線模組高度。 With the above structural features, the manufacturing method of the present invention is not limited by size and shape, and a stereo antenna can be fabricated on a non-planar substrate, thereby reducing the height of the entire antenna module.
依據上述結構特徵,所述高分子保護層可為環氧樹 脂、可變性壓克力、聚脂、醋酸纖維樹脂、乙酸乙脂及乙醇之混合物。 According to the above structural features, the polymer protective layer may be an epoxy tree a mixture of fat, variability acrylic, polyester, acetate resin, ethyl acetate and ethanol.
上述金屬化處理,係利用濺鍍或蒸鍍方式使金屬沈積於基材及圖案化高分子保護層表面形成金屬薄膜層;上述沈積所使用之金屬靶材選自於鎳(Ni)、鉻(Cr)、鈷(Co)、鈀(Pd)、鎳(Ni)、錫(Sn)、銅(Cu)的其中一種或其複合材料的其中一種。 The metallization treatment is performed by depositing metal on the surface of the substrate and the patterned polymer protective layer by sputtering or vapor deposition to form a metal thin film layer; the metal target used for the deposition is selected from nickel (Ni) and chromium ( One of Cr), cobalt (Co), palladium (Pd), nickel (Ni), tin (Sn), copper (Cu) or a composite thereof.
上述剝除該圖案化高分子保護層可採用水洗方式。 The stripping of the patterned polymer protective layer may be performed by a water washing method.
上述化學鍍層金屬選自於鎳(Ni)、銅(Cu)、金(Au)、銀(Ag)、錫(Sn)、鉻(Cr)、鈀(Pd)的其中一種或以上複合金屬的其中一種。。 The electroless plating metal is selected from the group consisting of nickel (Ni), copper (Cu), gold (Au), silver (Ag), tin (Sn), chromium (Cr), and palladium (Pd). One. .
1‧‧‧基材 1‧‧‧Substrate
11‧‧‧表面 11‧‧‧ surface
2‧‧‧高分子保護層 2‧‧‧ polymer protective layer
21‧‧‧圖案化高分子保護層 21‧‧‧ patterned polymer protective layer
3‧‧‧金屬薄膜層 3‧‧‧Metal film layer
31‧‧‧圖案化金屬薄膜層 31‧‧‧ patterned metal film layer
4‧‧‧化學鍍層 4‧‧‧Electrochemical coating
第一圖係為本發明中製造方法之流程方塊圖。 The first figure is a block diagram of the process of the manufacturing method of the present invention.
第二圖至第七圖係為本發明中製造方法之流程示意圖。 2 to 7 are schematic views showing the flow of the manufacturing method in the present invention.
如第二圖本發明之製造方法之流程方塊圖所示,本發明之製造方法,基本上包括下列步驟:提供一基材1,請同時參閱第二圖所示,該基材1具有一預定立體構型,其中該基材1具有非平面之表面11。 As shown in the flow chart of the manufacturing method of the present invention, the manufacturing method of the present invention basically comprises the following steps: providing a substrate 1, please also refer to the second figure, the substrate 1 has a predetermined A three-dimensional configuration in which the substrate 1 has a non-planar surface 11.
於該基材表面11覆蓋一可剝除之高分子保護層2,如第三圖所示,該高分子保護層2可為環氧樹脂、可變性壓克力、聚脂、醋酸纖維樹脂、乙酸乙脂及乙醇之混合物。 The substrate surface 11 is covered with a strippable polymer protective layer 2. As shown in the third figure, the polymer protective layer 2 can be epoxy resin, variability acrylic, polyester resin, cellulose acetate resin, a mixture of ethyl acetate and ethanol.
進行雷雕圖案化,去除部分高分子保護層,如第四圖所示,而形成一圖案化高分子保護層21;其中,上述雷雕圖案化方式,得使用市面上所普遍使用的雷射機台,亦即,此雷射機台之雷射光不須限定於特定波長。以上述雷射機台所發出之雷射 光抵接於高分子保護層上,藉以去除雷射光所抵接到的高分子保護層部位。而使用雷射機台去除部分高分子保護層的過程中,可將雷射光依設計或需求進行移動,使高分子保護層被去除的部位形成特定的圖形,藉以令高分子保護層成形為具有特定圖形之圖案化高分子保護層21。 Performing a patterning of the eagle carving to remove a part of the polymer protective layer, as shown in the fourth figure, to form a patterned polymer protective layer 21; wherein the above-mentioned patterning method of the ray pattern is to use a laser which is commonly used in the market. The machine, that is, the laser light of the laser machine is not limited to a specific wavelength. a laser emitted by the above laser machine The light is abutted on the polymer protective layer to remove the protective layer of the polymer that the laser light abuts. In the process of removing a part of the polymer protective layer by using a laser machine, the laser light can be moved according to design or requirement, so that the removed part of the polymer protective layer forms a specific pattern, so that the polymer protective layer is formed into A patterned polymer protective layer 21 of a specific pattern.
進行金屬化處理,沈積形成一金屬薄膜層3,如第五圖所示,且該金屬薄膜層3覆蓋於該圖案化高分子保護層21表面,以及未受該圖案化高分子保護層21覆蓋之基材表面11;上述金屬化處理,係利用濺鍍或蒸鍍方式使金屬沈積於基材及圖案化高分子保護層表面形成金屬薄膜層;上述沈積所使用之金屬靶材選自於鎳(Ni)、鉻(Cr)、鈷(Co)、鈀(Pd)、鎳(Ni)、錫(Sn)、銅(Cu)的其中一種或其複合材料的其中一種。 Metallization treatment is performed to form a metal thin film layer 3, as shown in FIG. 5, and the metal thin film layer 3 covers the surface of the patterned polymer protective layer 21 and is not covered by the patterned polymer protective layer 21. The substrate surface 11; the metallization treatment is performed by depositing metal on the surface of the substrate and the patterned polymer protective layer by sputtering or vapor deposition to form a metal thin film layer; the metal target used for the deposition is selected from nickel One of (Ni), chromium (Cr), cobalt (Co), palladium (Pd), nickel (Ni), tin (Sn), copper (Cu) or a composite thereof.
剝除上述圖案化高分子保護層21,讓該圖案化高分子保護層21及其上方之金屬薄膜層3自基材表面11剝離,如第六圖所示,而形成圖案化金屬薄膜層31;而上述剝除該圖案化高分子保護層21可採用水洗方式進行剝除。 The patterned polymer protective layer 21 is stripped, and the patterned polymer protective layer 21 and the metal thin film layer 3 thereabove are peeled off from the substrate surface 11, as shown in FIG. 6, to form a patterned metal thin film layer 31. And the stripping of the patterned polymer protective layer 21 can be stripped by a water washing method.
對上述圖案化金屬薄膜層31表面進行化學鍍層4處理,如第七圖所示,完成立體天線,上述化學鍍層金屬選自於鎳(Ni)、銅(Cu)、金(Au)、銀(Ag)、錫(Sn)、鉻(Cr)、鈀(Pd)的其中一種或以上複合金屬的其中一種。 The surface of the patterned metal thin film layer 31 is subjected to electroless plating 4 treatment, and as shown in the seventh figure, the stereoscopic antenna is completed, and the electroless plating metal is selected from the group consisting of nickel (Ni), copper (Cu), gold (Au), and silver ( One of one or more composite metals of Ag), tin (Sn), chromium (Cr), and palladium (Pd).
值得一提的是,本發明之製造方法不受尺寸及造型之限制,可在非為平面的基板上製造出立體天線,進而可達到縮小整個天線模組高度。且本發明不需習有LDS製程所使用添加金屬催化劑之塑料,不僅材料成本較低,且製程上不需調整雷射波長與金屬化的控制參數,製程較為簡便,且所完成之立體天線成品收發品質較佳。 It is worth mentioning that the manufacturing method of the present invention is not limited by size and shape, and a stereo antenna can be fabricated on a non-planar substrate, thereby reducing the height of the entire antenna module. Moreover, the invention does not need to have the plastic added with the metal catalyst used in the LDS process, which not only has low material cost, but also does not need to adjust the laser wavelength and metallization control parameters in the process, the process is relatively simple, and the finished stereo antenna product is completed. Transceiver quality is better.
綜上所述,本發明提供立體天線一較佳可行之製造方法,爰依法提呈發明專利之申請;本發明之技術內容及技術特點已揭示如上,然而熟悉本項技術之人士仍可能基於本發明之揭示而作各種不背離本案發明精神之替換及修飾。因此,本發明之保護範圍應不限於實施例所揭示者,而應包括各種不背離本發明之替換及修飾,並為以下之申請專利範圍所涵蓋。 In summary, the present invention provides a preferred method for manufacturing a stereoscopic antenna, and an application for an invention patent according to the law; the technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still be based on the present disclosure. The invention is to be construed as being limited and modified by the spirit of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims
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