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TWI571609B - Stamping combined with heat sink fins improved - Google Patents

Stamping combined with heat sink fins improved Download PDF

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Publication number
TWI571609B
TWI571609B TW101119702A TW101119702A TWI571609B TW I571609 B TWI571609 B TW I571609B TW 101119702 A TW101119702 A TW 101119702A TW 101119702 A TW101119702 A TW 101119702A TW I571609 B TWI571609 B TW I571609B
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Taiwan
Prior art keywords
base
groove
heat sink
heat
fins
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TW101119702A
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Chinese (zh)
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TW201333411A (en
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chong-xian Huang
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chong-xian Huang
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

沖壓結合散熱鰭片的散熱器改良 Improved heat sink stamping combined with heat sink fins

本發明係關於一種散熱器設計，尤指一種沖壓結合散熱鰭片的散熱器改良設計。 The present invention relates to a heat sink design, and more particularly to an improved design of a heat sink stamped and combined with heat sink fins.

習知散熱器的散熱鰭片與底座的結合，除了傳統的焊接結合技術外，亦有利用沖壓方式，將散熱鰭片先插植於底座的預設溝槽或夾持凸座，再以沖壓沖頭進行沖壓，而使散熱鰭片被夾持結合於底座的溝槽(或夾持凸座)，例如美國發明專利第5014776號案，就是使兩側的溝槽側壁產生沖壓推擠變形，進而可夾持散熱鰭片，以達到散熱鰭片與底座的結合目的。 The combination of the heat sink fins and the base of the conventional heat sink, in addition to the traditional welding and bonding technology, also uses a stamping method to insert the heat sink fins into the preset grooves or clamping protrusions of the base, and then press The punch is stamped so that the heat sink fins are clamped to the groove (or the clamp boss) of the base. For example, in the case of the US Patent No. 5014776, the sidewalls of the grooves on both sides are subjected to stamping and pushing deformation. In turn, the heat sink fins can be clamped to achieve the purpose of combining the heat sink fins with the base.

上述先前專利技術，只是利用溝槽兩側的擠壓變形而達到夾持散熱片根部的目的，但夾持作用力都集中在溝槽開口兩側的變形位置，僅具有兩個點狀的夾持力，因此，夾持效果不佳，不易確保其穩定結合，不僅各散熱片可能發生參差不齊的不等高現象，而且散熱片容易發生搖動或脫落情形。 The above prior patent technology only uses the extrusion deformation on both sides of the groove to achieve the purpose of clamping the root of the heat sink, but the clamping force is concentrated on the deformation position on both sides of the groove opening, and only has two dot-shaped clips. Holding force, therefore, the clamping effect is not good, it is not easy to ensure its stable combination, not only the fins may have uneven height unequal phenomenon, but also the heat sink is easy to shake or fall off.

本發明之主要目的，乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計，其至少包括一底座及複數個散熱鰭片，底座表面係開設複數個相鄰的溝槽，以供對應插植各散熱鰭片，且各散熱鰭片的插植端均設有一反折部，於散熱鰭片插入底座溝槽後，再利用一沖壓沖頭對準插植的反 折部位進行沖壓，因該沖壓沖頭具有一可同時局部涵蓋反折部及一溝槽側壁的沖壓斜面，於沖壓後可使該反折部於溝槽內下壓產生變形增大而迫緊結合於溝槽，且以沖壓斜面同時沖壓推擠其中一溝槽的側壁而產生移動變形，使該移動變形的溝槽側壁可壓住反折部，故散熱鰭片與底座的結合會更為穩固，能確保各散熱片不會發生搖動或脫落情形。 The main purpose of the present invention is to provide a modified heat sink design with a heat sink fin, which comprises at least a base and a plurality of heat radiating fins, and a plurality of adjacent grooves are formed on the surface of the base for corresponding transplanting. Each of the heat dissipating fins and the insertion end of each of the heat dissipating fins are provided with a reverse folding portion, and after the heat dissipating fin is inserted into the groove of the base, the punching punch is used to align the implanting end The folding portion is stamped, because the punching punch has a punching inclined surface which can partially cover the reverse folding portion and a groove side wall at the same time, and after pressing, the folding portion can be pressed down in the groove to generate deformation and tighten Combined with the groove, and punching and pushing the side wall of one of the grooves by punching the inclined surface to generate a moving deformation, the side wall of the groove which can be deformed by the movement can press the reverse folding portion, so the combination of the heat dissipation fin and the base is more Stable to ensure that each heat sink does not shake or fall off.

本發明之次要目的，乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計，其中，各散熱鰭片係可於反折部的選定間距分別沖設複數個沖壓凸片，各沖壓凸片可呈朝上側傾的外翻形狀，並於通過沖壓沖頭的沖壓後，使移動變形的溝槽側壁可形成向外延伸而壓住沖壓凸片，並卡住溝槽內壁，以形成穩固卡住，且反折部的其餘部份則受到擠壓變形，並填滿於底座的溝槽，因此使散熱鰭片與底座的結合更為穩固。 A second object of the present invention is to provide an improved heat sink design with a heat sink fin, wherein each heat sink fin can be punched with a plurality of stamping tabs at a selected pitch of the reverse fold portion, each stamping tab The shape of the eversion can be inclined upwards, and after the punching by the punching punch, the sidewall of the groove which is moved and deformed can be formed to extend outward to press the punching tab and catch the inner wall of the groove to form a stable The card is stuck, and the rest of the folding portion is deformed by pressing and filling the groove of the base, thereby making the combination of the heat sink fin and the base more stable.

本發明之又一目的，乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計，其中，該散熱器的底座係可與一個以上的熱導管形成緊配嵌合，為在底座的另一端面開設嵌槽，並適配嵌入熱導管，使熱導管可貼底外露於底座端面，或進一步使熱導管適當彎折並貫穿複數散熱片以完成緊配組成。 Another object of the present invention is to provide an improved design of a heat sink stamped and combined with a heat sink fin, wherein the base of the heat sink can be tightly fitted with more than one heat pipe, and is at the other end of the base. The slot is opened and adapted to be embedded in the heat pipe so that the heat pipe can be exposed to the bottom end of the base, or the heat pipe can be appropriately bent and penetrated through the plurality of heat sinks to complete the tight fitting composition.

本發明之另一目的，乃在於提供一種沖壓結合散熱鰭片的散熱器改良設計，其中，該散熱器的底座係可實施為圓形座體，並於該圓形的底座的周壁面開設複數軸向相鄰的溝槽，以供對應插植各散熱鰭片，使各散熱片可呈輻射 方向的穩固插植結合。 Another object of the present invention is to provide an improved design of a heat sink stamped and combined with a heat sink fin, wherein the base of the heat sink can be implemented as a circular base and a plurality of peripheral walls of the circular base are opened. Axial adjacent grooves for inserting respective heat dissipation fins so that the heat sinks can be radiated A solid combination of orientation.

茲依附圖實施例將本發明結構特徵及其他作用、目的詳細說明如下：如第一圖所示，係本發明所為「沖壓結合散熱鰭片的散熱器改良」的較佳實施例，其係至少包括一底座1及複數個散熱鰭片2，而其中：底座1，其係在表面開設複數個相鄰的溝槽11，以供分別對應插植各散熱鰭片2；複數個散熱鰭片2，如第二圖至第四圖所示，其形狀或大小不拘，但於插植端係設有一反折部21，並可於該反折部21的選定間距分別沖設複數個呈外翻狀的沖壓凸片211，該反折部21係可匹配植入底座1的溝槽11；利用上述的底座1及複數個散熱鰭片2，於散熱鰭片2將反折部21插入底座1的溝槽11後，係再利用一沖壓沖頭3對準插植的反折部位進行沖壓(如第五圖)，以該沖壓沖頭3具有一同時局部涵蓋反折部21及一溝槽11側壁的沖壓斜面31，於沖壓後(如第六圖)使該反折部21於溝槽11內下壓產生變形增大而迫緊結合於溝槽11(如第七圖)，且該沖壓斜面31因同時沖壓推擠溝槽11側壁而產生移動變形，使移動變形後的溝槽側壁111可壓住反折部21的沖壓凸片211，並卡住溝槽11的內壁，以確保散熱鰭片2與底座1的結合更為穩固，達到散熱片2不會發生搖動或脫落的目的。 The structural features and other functions and objects of the present invention are described in detail below with reference to the accompanying drawings. As shown in the first figure, the present invention is a preferred embodiment of the "impression of a heat sink with a heat sink fin." The utility model comprises a base 1 and a plurality of heat dissipation fins 2, wherein: the base 1 defines a plurality of adjacent grooves 11 on the surface for respectively inserting the heat dissipation fins 2; the plurality of heat dissipation fins 2 As shown in the second to fourth figures, the shape or size is not limited, but a folding portion 21 is provided at the planting end, and a plurality of outwardly turned out are respectively set at the selected spacing of the folding portion 21. a stamping tab 211, the reflexing portion 21 can be matched with the groove 11 of the implant base 1; and the reflexing portion 21 is inserted into the base 1 by the heat dissipating fin 2 by using the above-mentioned base 1 and a plurality of heat dissipating fins 2 After the groove 11 is further stamped by a punching punch 3 aligned with the inverted portion of the implant (as shown in FIG. 5), the stamping punch 3 has a partial partial covering of the reversed portion 21 and a groove. 11 stamping bevel 31 of the side wall, after pressing (such as the sixth figure), the folding portion 21 is pressed down in the groove 11 to generate The deformation is increased and is tightly coupled to the groove 11 (as shown in the seventh figure), and the punched inclined surface 31 is moved and deformed by pushing and pushing the side wall of the groove 11 at the same time, so that the grooved side wall 111 after the movement deformation can be pressed against the The stamping tab 211 of the folded portion 21 is caught on the inner wall of the groove 11 to ensure that the heat sink fin 2 and the base 1 are more firmly coupled, so that the heat sink 2 does not shake or fall off.

如上述實施例圖顯示，該散熱鰭片2的沖壓凸片211，其係可呈朝上側傾的外翻形狀，於通過沖壓沖頭3的沖 壓後，係使移動變形的溝槽側壁111形成向外延伸，並可壓住反折部21沖壓凸片211，反折部21的其餘部份則發生擠壓變形，並填滿於底座1的溝槽11，故散熱鰭片2與底座1的溝槽11結合將更為穩固。 As shown in the above embodiment, the punching tab 211 of the heat dissipating fin 2 can be in an everted shape that is inclined upward, and is punched by the punching punch 3. After pressing, the grooved side wall 111 of the movement deformation is formed to extend outwardly, and the punching portion 211 of the folding portion 21 is pressed, and the remaining portion of the folding portion 21 is crushed and deformed, and is filled with the base 1 The groove 11 is such that the heat sink fin 2 is combined with the groove 11 of the base 1 to be more stable.

如第八圖所示，所述底座1溝槽11的寬度A係略大於散熱鰭片2反折部21的厚度B，但反折部21的厚度B再加上沖壓凸片211C外翻邊壁的寬度C，則相同於溝槽11的寬度A，亦即：A=B+C。 As shown in the eighth figure, the width A of the groove 11 of the base 1 is slightly larger than the thickness B of the folded portion 21 of the heat dissipation fin 2, but the thickness B of the folded portion 21 plus the outwardly turned edge of the stamping tab 211C The width C of the wall is the same as the width A of the groove 11, that is, A=B+C.

如第九、十圖所示的另一種實施例，本發明係可與一個以上的熱導管4形成緊配嵌合，以組成一附有熱導管的散熱器，其係可於本發明底座1a的另一端面開設一個以上的嵌槽12a，用以適配嵌入熱導管4，使熱導管4具有平整貼底面41，並外露結合於底座1a的底端面，或所述的熱導管4亦可適當彎折，並貫穿複數散熱片2，以完成一附有熱導管的散熱器緊配組合。 As another embodiment shown in the ninth and tenth embodiments, the present invention can be closely fitted with more than one heat pipe 4 to form a heat sink with a heat pipe, which can be used in the base 1a of the present invention. The other end surface is provided with more than one recessed groove 12a for fitting the heat pipe 4 so that the heat pipe 4 has a flat bottom surface 41 and is exposed to the bottom end surface of the base 1a, or the heat pipe 4 can be Appropriately bent and penetrated through the plurality of fins 2 to complete a heat sink assembly with a heat pipe.

如第十一、十二圖所示的再一種實施例，本發明的底座1b，係亦可實施為圓形座體，並於該圓形底座1b的周壁面開設複數軸向相鄰的溝槽11b，以供對應插植各散熱鰭片2b，依同理實施，使各散熱片2b可呈輻射方向而穩固插植結合於圓形底座1b的周壁面。 According to still another embodiment shown in the eleventh and twelfth embodiments, the base 1b of the present invention can also be implemented as a circular base, and a plurality of axially adjacent grooves are formed on the peripheral wall surface of the circular base 1b. The groove 11b is configured to insert the heat dissipating fins 2b correspondingly, so that the fins 2b can be stably implanted and bonded to the peripheral wall surface of the circular base 1b in the radiation direction.

依本發明設計，所述的散熱片2，關於其形狀、大小或堆疊排列形態，係可視不同需要而做任意變化，且其中的沖壓凸片211係可省略不設，如第十三圖的另一實施例所示，各散熱片2亦可直接利用反折部21對應插植於底座1的溝槽11，再以沖壓沖頭3對準插植的反折部位進行沖壓 (如第十四圖至第十六圖所示)，該沖壓沖頭3的沖壓斜面31亦同時局部涵蓋反折部21及一溝槽側壁111，故沖壓後可使反折部21於溝槽11內下壓產生變形增大而迫緊結合於溝槽11，且以移動變形的溝槽側壁111亦壓住反折部21，仍可完成散熱鰭片2與底座1的穩固結合。是以，附圖的實施例僅係揭露本發明的主要技術特徵，但並非用以限定本案的技術範圍，如有涉及等效應用或簡易的增減變更，自仍應視為屬於本案的技術範圍。 According to the design of the present invention, the shape, size or stacked arrangement of the heat sink 2 can be arbitrarily changed according to different needs, and the stamping tab 211 therein can be omitted, as shown in FIG. In another embodiment, each of the fins 2 can also be directly inserted into the groove 11 of the base 1 by using the folding portion 21, and then punched by the punching punch 3 to align the inserted folding portion. (As shown in the fourteenth to sixteenth drawings), the stamping bevel 31 of the punching punch 3 also partially covers the reverse folded portion 21 and a grooved side wall 111 at the same time, so that the reverse folded portion 21 can be grooved after punching. The depression in the groove 11 causes the deformation to increase and is tightly coupled to the groove 11, and the groove side wall 111 which is deformed by the movement also presses the folding portion 21, and the stable combination of the heat dissipation fin 2 and the base 1 can be completed. Therefore, the embodiments of the drawings merely disclose the main technical features of the present invention, but are not intended to limit the technical scope of the present invention. If there is an equivalent application or a simple increase or decrease, the technology should still be regarded as belonging to the present case. range.

綜上所述，本發明所為沖壓結合散熱鰭片的散熱器改良設計，關於散熱片與底座的插入結合，其使用手段與習知散熱器顯有不同，特別是利用移動變形的溝槽側壁可延伸壓住反折部及沖壓凸片的頂端，確保各散熱片均能完全插入底座溝槽，獲得更為穩固的結合，故具有功效進步性，為此提出申請，敬請 依法審查賜准專利，實感德便。 In summary, the present invention is an improved design of a heat sink for stamping and combining fins. The use of the heat sink and the base is different from that of the conventional heat sink, in particular, the sidewall of the groove which is deformed by movement can be used. Extend and press the top of the reflexing part and the punching tab to ensure that each fin can be fully inserted into the groove of the base to obtain a more stable combination, so it has the effect of progress. To apply for this, please review the patent according to law. Real feelings.

1‧‧‧底座 1‧‧‧Base

2‧‧‧散熱鰭片 2‧‧‧Heat fins

11‧‧‧溝槽 11‧‧‧ trench

21‧‧‧反折部 21‧‧‧Reflexion

211‧‧‧沖壓凸片 211‧‧‧ stamping tab

3‧‧‧沖壓沖頭 3‧‧‧ Stamping punch

31‧‧‧沖壓斜面 31‧‧‧Pressing bevel

111‧‧‧溝槽側壁 111‧‧‧ trench sidewall

A‧‧‧溝槽寬度 A‧‧‧ groove width

B‧‧‧反折部厚度 B‧‧‧Reflexed section thickness

C‧‧‧沖壓凸片外翻寬度 C‧‧‧ Stamping tab valgus width

4‧‧‧熱導管 4‧‧‧heat pipe

41‧‧‧平整貼底面 41‧‧‧Flat bottom

1a‧‧‧底座 1a‧‧‧Base

12a‧‧‧嵌槽 12a‧‧‧Inlay

1b‧‧‧圓形底座 1b‧‧‧round base

11b‧‧‧溝槽 11b‧‧‧ trench

2b‧‧‧散熱鰭片 2b‧‧‧heat fins

第一圖為本發明於沖壓結合前的立體示意圖。 The first figure is a three-dimensional schematic view of the invention before stamping.

第二圖為本發明散熱鰭片的立體圖。 The second figure is a perspective view of the heat sink fin of the present invention.

第三圖為本發明散熱鰭片的局部放大圖。 The third figure is a partial enlarged view of the heat sink fin of the present invention.

第四圖為本發明散熱鰭片的另一角度局部放大圖。 The fourth figure is a partial enlarged view of another angle of the heat dissipation fin of the present invention.

第五圖為本發明進行沖壓時的狀態示意圖。 The fifth figure is a schematic view of the state at the time of stamping of the present invention.

第六圖為本發明完成沖壓時的狀態示意圖。 The sixth figure is a schematic view of the state at the time of completion of stamping of the present invention.

第七圖為本發明沖壓沖頭退出後的完成狀態示意圖。 The seventh figure is a schematic view of the completed state of the stamping punch of the present invention after exiting.

第八圖為本發明散熱鰭片於插入底座前的示意圖。 The eighth figure is a schematic view of the heat sink fin of the present invention before being inserted into the base.

第九圖係本發明實施為一附有熱導管散熱器的組合正視圖。 The ninth drawing is a front view of a combination of a heat pipe heat sink attached to the present invention.

第十圖為第九圖實施例的組合立體圖。 Figure 11 is a combined perspective view of the ninth embodiment.

第十一圖為本發明底座實施為圓形座體的組合上視圖。 The eleventh figure is a combined top view of the base of the present invention implemented as a circular seat.

第十二圖為第十一圖實施例的組合立體圖。 Figure 12 is a combined perspective view of the eleventh embodiment.

第十三圖為本發明另一實施例於沖壓結合前的立體示意圖。 Figure 13 is a perspective view of another embodiment of the present invention before stamping.

第十四圖為第十三圖實施例進行沖壓時的狀態示意圖。 Fig. 14 is a view showing a state in which the embodiment of the thirteenth embodiment is stamped.

第十五圖為第十三圖實施例完成沖壓時的狀態示意圖。 The fifteenth drawing is a schematic view showing the state at the time of completion of stamping in the embodiment of the thirteenth embodiment.

第十六圖為第十三圖實施例沖壓沖頭退出後的完成狀態示意圖。 Figure 16 is a schematic view showing the completed state of the stamping punch after the withdrawal of the embodiment of the thirteenth embodiment.

1‧‧‧底座 1‧‧‧Base

2‧‧‧散熱鰭片 2‧‧‧Heat fins

11‧‧‧溝槽 11‧‧‧ trench

21‧‧‧反折部 21‧‧‧Reflexion

211‧‧‧沖壓凸片 211‧‧‧ stamping tab

A‧‧‧溝槽寬度 A‧‧‧ groove width

B‧‧‧反折部厚度 B‧‧‧Reflexed section thickness

C‧‧‧沖壓凸片外翻寬度 C‧‧‧ Stamping tab valgus width

Claims (6)

一種沖壓結合散熱鰭片的散熱器，其至少包括一底座及複數個散熱鰭片，其特徵在於：底座，係在表面開設複數個相鄰的溝槽，以供分別對應插植各散熱鰭片；複數個散熱鰭片，係於插植端設有一反折部，該反折部係供匹配植入底座的溝槽，該反折部並於選定間距分別沖設複數個呈外翻狀的沖壓凸片，且移動變形後的溝槽側壁係壓住沖壓凸片而卡住溝槽內壁；利用上述的底座及複數個散熱鰭片，於散熱鰭片將反折部插入底座的溝槽後，再利用一沖壓沖頭對準插植的反折部位進行沖壓，該沖壓沖頭並具有一同時局部涵蓋反折部及一溝槽側壁的沖壓斜面，經沖壓後使反折部於溝槽內下壓產生變形增大而迫緊結合於溝槽內，且沖壓斜面同時沖壓推擠溝槽側壁而產生移動變形，使移動變形後的溝槽側壁係壓住反折部，以完成散熱鰭片與底座的結合。 A heat sink for stamping and combining fins includes at least a base and a plurality of heat dissipating fins, wherein the base has a plurality of adjacent grooves on the surface for respectively inserting the fins a plurality of fins are provided at the planting end with a reversed portion for matching the groove of the implanted base, and the folded portion is respectively punched with a plurality of outwardly turned shapes at selected intervals Stamping the tabs, and the sidewalls of the groove after the movement and deformation are pressed against the punching tabs to catch the inner wall of the groove; using the above-mentioned base and a plurality of fins to insert the reverse folding portion into the groove of the base Afterwards, the stamping punch is used to align with the re-folding portion of the implant, and the punching punch has a stamping inclined surface partially covering the reverse folding portion and a groove sidewall, and the re-folding portion is grooved after being punched. The deformation in the groove is increased and the deformation is tightly combined in the groove, and the punched inclined surface simultaneously presses and pushes the sidewall of the groove to generate a moving deformation, so that the sidewall of the groove after the movement deformation is pressed against the reverse folding portion to complete the heat dissipation. The combination of the fin and the base. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器，該散熱鰭片反折部的厚度再加上沖壓凸片外翻邊壁的寬度，係相同於底座溝槽的寬度。 The heat sink of the heat-dissipating fin and the width of the outer flange of the stamping fin are the same as the width of the groove of the base, as in the heat sink of the heat-dissipating fin. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器，該散熱鰭片的沖壓凸片係呈朝上側傾的外翻形狀。 The stamping fins of the heat dissipating fins are stamped in an upwardly inclined shape as shown in the first aspect of the invention. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器，該底座的另一端面係開設一個以上的嵌槽，以供 適配嵌入熱導管，並使熱導管具有平整貼底面，且外露結合於底座的底端面。 If the heat sink is combined with the heat sink fin according to the first aspect of the patent application, the other end surface of the base is provided with more than one recessed groove for The heat pipe is adapted to be embedded, and the heat pipe has a flat bottom surface and is exposed to the bottom end surface of the base. 如申請專利範圍第4項所述沖壓結合散熱鰭片的散熱器，該熱導管係彎折貫穿複數散熱片，形成緊配組合。 The heat pipe is stamped and coupled with a heat sink fin as described in claim 4, and the heat pipe is bent through the plurality of heat sinks to form a tight fit combination. 如申請專利範圍第1項所述沖壓結合散熱鰭片的散熱器，該底座係圓形座體，並於周壁面開設複數軸向相鄰的溝槽，以供對應插植複數個散熱鰭片。 The heat sink is combined with the heat sink fin according to the first aspect of the patent application. The base is a circular base body, and a plurality of axially adjacent grooves are formed on the peripheral wall surface for correspondingly inserting a plurality of heat dissipation fins. .
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TW201333411A (en) 2013-08-16
JP3178082U (en) 2012-08-30
CN102538558B (en) 2013-07-24
KR200472236Y1 (en) 2014-04-10
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CN102538558A (en) 2012-07-04
US20130206381A1 (en) 2013-08-15

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