TWI560255B - Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device - Google Patents
Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic deviceInfo
- Publication number
- TWI560255B TWI560255B TW101105237A TW101105237A TWI560255B TW I560255 B TWI560255 B TW I560255B TW 101105237 A TW101105237 A TW 101105237A TW 101105237 A TW101105237 A TW 101105237A TW I560255 B TWI560255 B TW I560255B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- electronic device
- adhesive sheet
- sheet
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Position Input By Displaying (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011056983A JP5712706B2 (en) | 2011-03-15 | 2011-03-15 | Adhesive, adhesive sheet and display |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201237135A TW201237135A (en) | 2012-09-16 |
TWI560255B true TWI560255B (en) | 2016-12-01 |
Family
ID=46808661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101105237A TWI560255B (en) | 2011-03-15 | 2012-02-17 | Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5712706B2 (en) |
KR (1) | KR101890713B1 (en) |
CN (1) | CN102676092B (en) |
TW (1) | TWI560255B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5790089B2 (en) * | 2011-03-31 | 2015-10-07 | Dic株式会社 | Double-sided adhesive tape |
JP6057693B2 (en) * | 2012-12-17 | 2017-01-11 | 藤森工業株式会社 | Adhesive layer and adhesive film |
CN103087503B (en) * | 2013-01-14 | 2015-04-01 | 徐广敏 | Electronic pouring sealant and preparation method thereof |
JP6130246B2 (en) * | 2013-06-28 | 2017-05-17 | リンテック株式会社 | Adhesive composition, adhesive and adhesive sheet |
JP6442879B2 (en) * | 2013-06-28 | 2018-12-26 | 三菱ケミカル株式会社 | Laminated moisture barrier film |
JP6325778B2 (en) * | 2013-06-28 | 2018-05-16 | リンテック株式会社 | Adhesive sheet and laminate |
JP6130245B2 (en) * | 2013-06-28 | 2017-05-17 | リンテック株式会社 | Adhesive composition, adhesive and adhesive sheet |
JP2015193706A (en) * | 2014-03-31 | 2015-11-05 | リンテック株式会社 | Method for producing surface protective film for conductive substrate |
CN104175697B (en) * | 2014-07-04 | 2016-01-27 | 京东方科技集团股份有限公司 | The attaching method of polaroid, polaroid unit and display unit |
US10454602B2 (en) | 2015-01-06 | 2019-10-22 | Lg Electronics Inc. | Apparatus for transmitting broadcast signals, apparatus for receiving broadcast signals, method for transmitting broadcast signals and method for receiving broadcast signals |
TWI621525B (en) * | 2015-03-31 | 2018-04-21 | 住友化學股份有限公司 | Optical laminate, liquid display device, adhesive composition and optical film |
JP5956044B1 (en) * | 2015-10-07 | 2016-07-20 | 住友化学株式会社 | Optical laminate and liquid crystal display device |
JP7112227B2 (en) * | 2017-03-31 | 2022-08-03 | 積水化学工業株式会社 | Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200600558A (en) * | 2004-04-30 | 2006-01-01 | Sumitomo Chemical Co | Acrylic resin composition |
TW200842171A (en) * | 2006-12-06 | 2008-11-01 | Nitto Denko Corp | Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet |
TW201006905A (en) * | 2008-07-31 | 2010-02-16 | Lintec Corp | Adhesive sheet |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4788937B2 (en) | 2001-05-07 | 2011-10-05 | 綜研化学株式会社 | Adhesive composition and display adhesive sheet using the composition |
JP4534431B2 (en) * | 2003-04-30 | 2010-09-01 | 東洋インキ製造株式会社 | Adhesive and optical member using the same |
JP5299804B2 (en) | 2004-08-03 | 2013-09-25 | 綜研化学株式会社 | Adhesive sheet for attaching metal |
JP2007297452A (en) * | 2006-04-28 | 2007-11-15 | Daio Paper Corp | Adhesive sheet |
JP4931197B2 (en) * | 2006-08-24 | 2012-05-16 | リケンテクノス株式会社 | Adhesive composition and adhesive sheet member using the same |
JP4531099B2 (en) | 2007-09-06 | 2010-08-25 | 日東電工株式会社 | Adhesive composition, and adhesive product and display using the same |
US20120156483A1 (en) | 2009-08-28 | 2012-06-21 | Nitto Denko Corporation | Ashesive tape or sheet, and base material therefor |
WO2011027707A1 (en) | 2009-09-01 | 2011-03-10 | 綜研化学株式会社 | Radiation-curable pressure-sensitive adhesive composition for optical members, and pressure-sensitive adhesion type optical members |
-
2011
- 2011-03-15 JP JP2011056983A patent/JP5712706B2/en active Active
-
2012
- 2012-02-17 TW TW101105237A patent/TWI560255B/en active
- 2012-03-06 CN CN201210058416.XA patent/CN102676092B/en active Active
- 2012-03-06 KR KR1020120022728A patent/KR101890713B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200600558A (en) * | 2004-04-30 | 2006-01-01 | Sumitomo Chemical Co | Acrylic resin composition |
TW200842171A (en) * | 2006-12-06 | 2008-11-01 | Nitto Denko Corp | Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet |
TW201006905A (en) * | 2008-07-31 | 2010-02-16 | Lintec Corp | Adhesive sheet |
Also Published As
Publication number | Publication date |
---|---|
CN102676092B (en) | 2016-03-16 |
KR20120105361A (en) | 2012-09-25 |
KR101890713B1 (en) | 2018-08-22 |
JP2012193248A (en) | 2012-10-11 |
JP5712706B2 (en) | 2015-05-07 |
TW201237135A (en) | 2012-09-16 |
CN102676092A (en) | 2012-09-19 |
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