TWI543312B - Method for manufacturing parts for laminated bodies and power semiconductor modules - Google Patents

Description

Method for manufacturing parts for laminated body and power semiconductor module

The invention relates to a thermal conductivity of 10 W/m. A layered body used for a heat conductor and an insulating layer of K or more and a conductive layer laminated on the insulating layer. Moreover, the present invention relates to a method of manufacturing a component for a power semiconductor module using the laminated body.

In recent years, miniaturization and high performance of electrical equipment are progressing. Along with this, the mounting density of electronic components is increased, and it is necessary to increase the heat generated from the electronic components. Widely used in the industry, it will have high heat dissipation and thermal conductivity of 10 W/m. A method in which a heat conductor of K or more is followed by a heat source is used as a method of dissipating heat. Further, in order to connect the heat conductor to the heat source, an insulating insulating material having an insulating property can be used.

An example of an electric device using the above-described insulating bonding material is disclosed in Patent Document 1 below. Patent Document 1 discloses a power semiconductor device in which a plurality of wires protrude from a mold resin. Specifically, Patent Document 1 discloses a power semiconductor device including: a first lead wire including a first wafer pad portion; and a power chip placed on a front surface of the first wafer pad portion An insulating sheet mounted on a back surface of the first wafer pad portion and formed of a resin having a thermal conductivity higher than that of the mold resin; a second wire including a second wafer pad portion; and a control wafer placed on the insulating wafer a second wafer pad portion; a metal wire directly connecting the power chip to the control wafer and having a main component of gold; and the mold resin protruding from an end portion of the first wire and the second wire Way to landfill the above control The wafer and the above power chip. The power semiconductor device has a mixed layer in which each material is mixed at the interface between the insulating sheet and the mold resin.

Further, Patent Document 1 discloses that at least one of a metal selected from a ceramic selected from the group consisting of Al ₂ O ₃ , Si ₃ N ₄ , and AlN, SiO ₂ , and a metal coated with an insulating material can be used for the insulating sheet. The resin of the fine particles of the material.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4146785

As described above, in recent years, miniaturization and high performance of electrical equipment are progressing, and it is necessary to increase the heat generated from electronic components. In particular, in a power semiconductor module or the like such as a power semiconductor device described in Patent Document 1, it is easy to generate a considerable amount of heat from a heat source.

However, in the case of using the prior insulating sheet as described in Patent Document 1, the thermal conductivity of the insulating layer is lowered, and sufficient heat dissipation cannot be obtained. Further, the thermal conductivity is 10 W/m through the insulating layer. When the heat conductor of K or more is bonded to a conductive layer such as a wire, the adhesion between the insulating layer and the conductive layer may be lowered.

An object of the present invention is to provide a laminate which can improve the thermal conductivity of the insulating layer and improve the adhesion between the insulating layer and the conductive layer.

Moreover, an object of the present invention is to provide a method for manufacturing a component for a power semiconductor module, which can obtain a component for a power semiconductor module having a high thermal conductivity of an insulating layer and a high adhesion between an insulating layer and a conductive layer.

According to a broader aspect of the present invention, there is provided a laminate comprising: a thermal conductor having a thermal conductivity of 10 W/m. K or more; the first insulating layer is laminated on the surface of the heat conductor and is a semi-cured material or a cured product; and the second insulating layer is laminated on a surface of the first insulating layer opposite to the heat conductor side and is An uncured or semi-hardened material; the first insulating layer has a thermal conductivity of 10 W/m in an amount of 86% by weight or more and less than 97% by weight. The inorganic filler of K or more, wherein the second insulating layer contains an inorganic filler in an amount of 67% by weight or more and less than 95% by weight; the curing rate of the first insulating layer is 50% or more, and the curing rate of the second insulating layer is less than 80%, and the curing rate of the first insulating layer is larger than the curing rate of the second insulating layer.

Further, according to a broader aspect of the present invention, a method of manufacturing a component for a power semiconductor module using the above laminated body is provided.

That is, according to a broader aspect of the present invention, there is provided a method of manufacturing a component for a power semiconductor module, the method comprising the steps of: laminating a conductive layer in a laminate below using a laminate as follows (2) a surface of the insulating layer opposite to the side of the first insulating layer; the second insulating layer is cured; and when the first insulating layer is a semi-cured material, the first insulating layer is cured; The following heat conductor, the following first insulating layer, the following second insulating layer and the following conductive layer are embedded in the mold resin; the laminated body comprises: a heat conductor having a thermal conductivity of 10 W/m. K or more; the first insulating layer is laminated on the surface of the heat conductor and is a semi-cured material or a cured product; and the second insulating layer is laminated on a surface of the first insulating layer opposite to the heat conductor side and is Unhardened or semi-hardened; and the above first insulating layer is 86% by weight Up to 97% by weight contains a thermal conductivity of 10 W/m. The inorganic filler of K or more, wherein the second insulating layer contains an inorganic filler in an amount of 67% by weight or more and less than 95% by weight; the curing rate of the first insulating layer is 50% or more, and the curing rate of the second insulating layer is less than 80%, and the curing rate of the first insulating layer is larger than the curing rate of the second insulating layer.

In the present specification, both the invention of the above laminated body and the invention of the method for manufacturing a module for a power semiconductor device are disclosed.

It is preferable that the content of the inorganic filler in 100% by weight of the first insulating layer is more than the content of the inorganic filler in 100% by weight of the second layer. Preferably, the laminate system of the present invention is used to obtain a laminate of parts for a power semiconductor module. When the first insulating layer is a cured product, the first insulating layer as a cured product preferably has a coefficient of thermal linear expansion of 20 ppm/° C. or less, and when the first insulating layer is a semi-cured material, The first insulating layer as the cured product after curing has a coefficient of thermal linear expansion of 20 ppm/° C. or less.

Preferably, the second insulating layer as the uncured or semi-cured material before curing in the laminate has a viscosity at 130 ° C of 1000 Pa. s above and 20000 Pa. s below.

Preferably, the ratio of the thickness of the second insulating layer to the thickness of the first insulating layer is 0.3 or more and 1 or less.

Preferably, the inorganic filler contained in the first insulating layer has a maximum particle diameter of 50 μm or less, and the inorganic filler contained in the second insulating layer has a maximum particle diameter of 50 μm or less. Preferably, the above-mentioned none of the first insulating layer is included The machine filler is at least one selected from the group consisting of alumina, crystalline ceria, boron nitride, and aluminum nitride. Preferably, the inorganic filler contained in the first insulating layer and the inorganic filler contained in the second insulating layer are each selected from the group consisting of alumina, crystalline ceria, boron nitride, and aluminum nitride. At least one of them. It is preferable that the inorganic filler contained in the first insulating layer is at least one selected from the group consisting of alumina, crystalline ceria, and boron nitride.

It is preferable that the first insulating layer is formed using a curable compound having a cyclic ether group and a curing agent. Preferably, the curing agent used in the first insulating layer is an amine curing agent having a melting point of 180 ° C or higher. It is preferable that the curable compound having a cyclic ether group used in the first insulating layer contains a curable compound having a cyclic ether group and a polycyclic aromatic skeleton. Preferably, the polycyclic aromatic skeleton is a biphenyl skeleton.

It is preferable that the second insulating layer is formed using a curable compound having a cyclic ether group and a curing agent. Preferably, the curing agent used in the second insulating layer is an amine curing agent having a melting point of 180 ° C or higher.

Preferably, the thickness of the heat conductor is 100 μm or more and 1 mm or less.

The laminate of the present invention comprises: a heat conductor having a thermal conductivity of 10 W/m. K or more; the first insulating layer is laminated on the surface of the heat conductor and is a semi-cured material or a cured product; and the second insulating layer is laminated on a surface of the first insulating layer opposite to the heat conductor side and is An uncured or semi-hardened material; the first insulating layer has a thermal conductivity of 10 W/m in an amount of 86% by weight or more and less than 97% by weight. An inorganic filler of K or more, and the second insulating layer is 67% by weight or more And less than 95% by weight of the inorganic filler; the first insulating layer has a curing rate of 50% or more, the second insulating layer has a curing rate of less than 80%, and the first insulating layer has a higher curing ratio than the second insulating layer. The hardening rate of the layer; therefore, the thermal conductivity of the insulating layer can be improved. Further, by laminating a conductive layer on the surface of the second insulating layer opposite to the first insulating layer side, the adhesion between the insulating layer and the conductive layer can be improved.

The method for manufacturing a component for a power semiconductor module according to the present invention includes the step of laminating a conductive layer on a surface of a second insulating layer of the following laminated body which is opposite to the side of the first insulating layer described below by using a laminated body When the first insulating layer described below is cured, and the first insulating layer is a semi-cured material, the following first insulating layer is cured; the following heat conductor, the following first insulating layer, and the following The second insulating layer and the following conductive layer are embedded in the mold resin; the laminated body comprises: a heat conductor having a thermal conductivity of 10 W/m. K or more; the first insulating layer is laminated on the surface of the heat conductor and is a semi-cured material or a cured product; and the second insulating layer is laminated on a surface of the first insulating layer opposite to the heat conductor side and is An uncured or semi-hardened material; and the first insulating layer has a thermal conductivity of 10 W/m in an amount of 86% by weight or more and less than 97% by weight. The inorganic filler of K or more, wherein the second insulating layer contains an inorganic filler in an amount of 67% by weight or more and less than 95% by weight; the curing rate of the first insulating layer is 50% or more, and the curing rate of the second insulating layer is less than 80%, and the curing rate of the first insulating layer is larger than the curing rate of the second insulating layer; therefore, a power semiconductor module having high thermal conductivity of the insulating layer and high adhesion between the insulating layer and the conductive layer can be obtained. Components.

The laminate of the present invention comprises: a thermal conductor having a thermal conductivity of 10 W/m. K or more; the first insulating layer is laminated on the surface of the heat conductor and is a semi-cured material or a cured product; and the second insulating layer is laminated on a surface of the first insulating layer opposite to the heat conductor side and is Unhardened or semi-hardened. The first insulating layer has a thermal conductivity of 10 W/m in an amount of 86% by weight or more and less than 97% by weight. An inorganic filler above K. The second insulating layer contains an inorganic filler in an amount of 67% by weight or more and less than 95% by weight. The curing rate of the first insulating layer is 50% or more, the curing rate of the second insulating layer is less than 80%, and the curing rate of the first insulating layer is larger than the curing rate of the second insulating layer.

By using the above configuration in the laminate of the present invention, the thermal conductivity of the insulating layer can be improved. Further, by laminating a conductive layer on the surface of the second insulating layer opposite to the first insulating layer side, the adhesion between the insulating layer and the conductive layer can be improved.

The above laminated body is used in the method of manufacturing a component for a power semiconductor module of the present invention. The method for manufacturing a component for a power semiconductor module according to the present invention includes the step of: depositing a conductive layer on a surface of the second insulating layer opposite to the first insulating layer side of the laminated body by using the laminated body; The second insulating layer is cured, and when the first insulating layer is a semi-cured material, the first insulating layer is cured; and the heat conductor, the first insulating layer, the second insulating layer, and the conductive layer are buried. Into the mold resin.

According to the above configuration of the method for manufacturing a component for a power semiconductor module according to the present invention, a component for a power semiconductor module having a high thermal conductivity of the insulating layer and a high adhesion between the insulating layer and the conductive layer can be obtained.

In particular, the first insulating layer has a thermal conductivity of 10 W/m in an amount of 86% by weight or more and less than 97% by weight. In the inorganic filler of K or more, the second insulating layer contains an inorganic filler in an amount of 67% by weight or more and less than 95% by weight, and the adhesion between the second insulating layer and the conductive layer as a cured product can be maintained high, and effectively Improve the thermal conductivity of the entire insulation layer.

Further, by setting the curing rate of the first insulating layer to 50% or more, the curing rate of the second insulating layer is less than 80%, and the curing rate of the first insulating layer is higher than that of the second insulating layer. The rate can maintain the thermal conductivity in the entire insulating layer as high, and effectively improve the adhesion between the second insulating layer as a cured material and the conductive layer.

The first insulating layer may be a hardened and hardenable semi-cured material, or may be a hardened material that is hardened. The second insulating layer may be an uncured material which is completely uncured and hardenable, or may be a hardened and hardenable semi-cured material.

The first insulating layer which is a semi-cured material or a cured product before curing in the laminate has a curing ratio of 50% or more, more preferably 60% or more, still more preferably 70% or more. The first insulating layer may have a curing rate of 80% or more, 90% or more, 95% or more, or 100%.

The second insulating layer as the uncured or semi-cured material before curing in the laminate has a hardening rate of less than 80%. The curing rate of the second insulating layer is preferably 1% or more, may be 10% or more, or may be 20% or more. The hardening rate of the second insulating layer may be less than 70%, may be less than 60%, or may be less than 50%.

Uniformly improve the thermal conductivity of the entire insulating layer and as a hardened material From the viewpoint of both the adhesion between the second insulating layer and the conductive layer, the curing rate of the first insulating layer is preferably 1% or more, more preferably 5% or more, higher than the curing rate of the second insulating layer. Further preferably, it is 10% or more. The curing rate of the first insulating layer may be 20% or more larger than the curing rate of the second insulating layer, or may be 30% or more.

The curing rate of the first and second insulating layers can be determined by measuring the hardening heat when the uncured insulating layer is heated. When the hardening rate is measured, for example, a Differential Scanning Calorimetry (DSC) device ("DSC7020" manufactured by SII NanoTechnology Co., Ltd.) or the like can be used. Specifically, the curing rates of the first and second insulating layers were measured as follows.

The temperature of the first insulating layer or the second insulating layer was raised to 180 ° C under the conditions of a measurement initial temperature of 30 ° C and a temperature increase rate of 8 ° C / min, and held for 1 hour. The amount of heat generated when the first insulating layer or the second insulating layer is cured by the temperature rise (hereinafter referred to as heat A) is measured. Further, on a release-coated PET (polyethylene terephthalate) sheet having a thickness of 50 μm, a thickness of 80 μm is applied to form a first insulating layer or a second insulating layer. The composition is prepared to be unheated in the same manner as the first insulating layer or the second insulating layer in the laminate, except that it is dried under vacuum at normal temperature of 23 ° C and 0.01 atm. A dry, uncured state of the insulating layer. Using this insulating layer, the amount of heat generated during temperature-raising hardening (hereinafter referred to as heat B) was measured in the same manner as the measurement of the above-described heat A. The curing rate of the first and second insulating layers was determined by the following equation based on the obtained heat A and heat B.

Hardening rate (%) = [1 - (heat A / heat B)] × 100

The viscosity η of the second insulating layer as the uncured or semi-cured material before curing in the laminate is preferably 1000 Pa at 130 ° C. Above s, more preferably 5000 Pa. s or more, and further preferably 6000 Pa. Above s, preferably 20,000 Pa. Below s, more preferably 15000 Pa. s below. When the viscosity η is not less than the above lower limit and not more than the above upper limit, the thickness of the second insulating layer is less likely to change at the time of the conductive layer, and the withstand voltage of the cured product is stabilized, and is further improved by a certain degree of deformation. The adhesion between the second insulating layer and the conductive layer as a cured product.

The viscosity η represents a viscosity at 130 ° C when the second insulating layer which is an uncured or semi-cured material before curing is heated at a heating rate of 8 ° C /min at 23 ° C. Further, the reason why the temperature of the viscosity η is set to 130 ° C is that the temperature for the second insulating layer and the conductive layer is preferably around 130 ° C.

For measuring the viscosity η, for example, a dynamic viscoelasticity measuring device ("VAR-100" manufactured by Reologica Instruments Co., Ltd.) or the like can be used.

In order to further suppress the peeling of the heat conductor and the first insulating layer, and further suppress the occurrence of warpage after curing the insulating layer in the laminated body, it is preferable that when the first insulating layer is a cured product, The thermal expansion coefficient of the first insulating layer as the cured product is 20 ppm/° C. or less, and when the first insulating layer is a semi-cured material, the thermal expansion coefficient of the first insulating layer as a cured product after curing It is below 20 ppm/°C. Further suppressing the peeling of the heat conductor and the first insulating layer, and further suppressing the layered body The coefficient of thermal linear expansion of the first insulating layer as the cured product is preferably 3 ppm/° C. or more, and more preferably 18 ppm/° C. or less, from the viewpoint of occurrence of warpage after curing of the insulating layer.

For measuring the above coefficient of thermal expansion, for example, a thermomechanical analyzer ("TMA/SS7000" manufactured by SII NanoTechnology Co., Ltd.) or the like can be used.

Further, in the case where the first insulating layer in the laminate is a semi-cured material, the first insulating layer as a cured material for measuring a coefficient of thermal expansion is preferably made of a semi-cured material. 1 The insulating layer was obtained by hardening at 200 ° C for 1 hour.

The ratio of the thickness of the second insulating layer to the thickness of the first insulating layer (the thickness of the second insulating layer / the thickness of the first insulating layer) is preferably 0.03 or more, more preferably 0.1 or more, still more preferably 0.3. The above is preferably 10 or less, more preferably 3 or less, still more preferably 1 or less.

The thickness of the second insulating layer is relative to the thickness of the first insulating layer from the viewpoint of uniformly improving the thermal conductivity in the entire insulating layer and the adhesion between the second insulating layer and the conductive layer as the cured product. The ratio is preferably 0.3 or more and 1 or less.

The total thickness of the first and second insulating layers is not particularly limited. The total thickness of the first and second insulating layers is preferably 80 μm or more, more preferably 100 μm or more, more preferably 200 μm or less, and still more preferably 170 μm or less. When the total thickness of the first and second insulating layers is not less than the above lower limit, the heat dissipation property of the entire insulating layer, the adhesion between the second insulating layer and the conductive layer as a cured material, and the withstand voltage balance in the entire insulating layer are balanced. Improve the ground.

The first insulating layer is preferably a curable compound (A) and a hardener. Formed by (B). The first insulating layer is preferably formed using a first curable composition containing a curable compound (A) and a curing agent (B). From the viewpoint of forming the first insulating layer having good curability, the first insulating layer is preferably formed using a curable compound (A1) having a cyclic ether group and a curing agent (B). The first insulating layer contains an inorganic filler (C). The first curable composition preferably contains an inorganic filler (C). The inorganic filler (C) contained in the first insulating layer and the first curable composition has a thermal conductivity of 10 W/m. An inorganic filler above K.

The second insulating layer is preferably formed using a curable compound (A) and a curing agent (B). The second insulating layer is preferably formed using a second curable composition containing a curable compound (A) and a curing agent (B). From the viewpoint of forming the second insulating layer having good curability, the second insulating layer is preferably formed using a curable compound (A1) having a cyclic ether group and a curing agent (B). The second insulating layer contains an inorganic filler (C). Therefore, the second curable composition preferably contains an inorganic filler (C). The inorganic filler (C) contained in the second insulating layer and the second curable composition may have a thermal conductivity of 10 W/m. The inorganic filler above K may also have a thermal conductivity of less than 10 W/m. K inorganic filler. The thermal conductivity of the inorganic filler (C) contained in the second insulating layer and the second curable composition is preferably 10 W/m from the viewpoint of further increasing the thermal conductivity of the entire insulating layer. K or more.

Hereinafter, the details of each component used in the first and second insulating layers of the present invention will be described first.

(hardening compound (A))

It is preferable that the first and second insulating layers are each formed using a curable compound (A). The first and second curable compositions each contain a curable compound (A). The curable compound (A) is preferably a thermosetting compound. The curable compound (A) is preferably a curable compound (A1) having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The curable compound (A1) having a cyclic ether group is preferably a curable compound having an epoxy group or an oxetanyl group. The curable compound (A) is hardened by the action of the hardener (B). The curable compound (A) used in each of the first and second insulating layers may be used singly or in combination of two or more kinds. The curable compound (A) used in the first insulating layer may be the same as or different from the curable compound (A) used in the second insulating layer.

The curable compound (A1) may contain an epoxy compound (A1a) having an epoxy group, and may also contain an oxetane compound (A1b) having an oxetanyl group.

The curable compound (A) preferably has an aromatic skeleton from the viewpoint of further improving the heat resistance and voltage resistance of the insulating layer (hereinafter sometimes referred to as a cured product) as a cured product. From the viewpoint of further improving the thermal conductivity and the withstand voltage of the cured product, the curable compound (A) used in the first insulating layer preferably contains a curable compound having a polycyclic aromatic skeleton, and more preferably A curable compound having a cyclic ether group and a polycyclic aromatic skeleton is contained. Examples of the polycyclic aromatic skeleton include a naphthalene skeleton and an anthracene skeleton. Skeleton, anthracene skeleton and biphenyl skeleton. The polycyclic aromatic skeleton is preferably a biphenyl skeleton from the viewpoint of further improving the thermal conductivity and voltage resistance of the cured product.

In 100% by weight of the total of the curable compound (A), the content of the curable compound having a polycyclic aromatic skeleton is preferably 30% by weight or more, more preferably It is 50% by weight or more, and more preferably 60% by weight or more. Further, all of the curable compound (A) may be a curable compound having a polycyclic aromatic skeleton.

Specific examples of the epoxy compound (A1a) having an epoxy group include an epoxy monomer having a bisphenol skeleton, an epoxy monomer having a dicyclopentadiene skeleton, and an epoxy monomer having a naphthalene skeleton. An epoxy monomer having an adamantane skeleton, an epoxy monomer having an anthracene skeleton, an epoxy monomer having a biphenyl skeleton, an epoxy monomer having a bis(glycidoxyphenyl)methane skeleton, having An epoxy monomer of a skeleton, an epoxy monomer having an anthracene skeleton, and an epoxy monomer having an anthracene skeleton. These hydrides or modifications can also be used. The epoxy compound (A1a) may be used alone or in combination of two or more.

Examples of the epoxy monomer having a bisphenol skeleton include an epoxy monomer having a bisphenol skeleton, a bisphenol A type, a bisphenol F type, and a bisphenol S type.

Examples of the epoxy monomer having a dicyclopentadiene skeleton include dicyclopentadiene dioxide and a phenol novolak epoxy monomer having a dicyclopentadiene skeleton.

Examples of the epoxy monomer having a naphthalene skeleton include 1-glycidylnaphthalene, 2-glycidylnaphthalene, 1,2-diglycidylnaphthalene, 1,5-diglycidylnaphthalene, and 1, 6-diglycidylnaphthalene, 1,7-diglycidylnaphthalene, 2,7-diglycidylnaphthalene, triglycidylnaphthalene, and 1,2,5,6-tetraglycidylnaphthalene, and the like.

Examples of the epoxy monomer having an adamantane skeleton include 1,3-bis(4-glycidoxyphenyl)adamantane and 2,2-bis(4-glycidoxyphenyl)aluminum. Alkane, etc.

Examples of the epoxy monomer having an anthracene skeleton include 9,9-bis(4-glycidoxyphenyl)fluorene, 9,9-bis(4-glycidoxy-3-methylphenyl). ), 9,9-bis(4-glycidoxy-3-chlorophenyl)anthracene, 9,9-bis(4-glycidoxy-3-bromophenyl)anthracene, 9,9-double (4-glycidoxy-3-fluorophenyl)anthracene, 9,9-bis(4-glycidoxy-3-methoxyphenyl)anthracene, 9,9-bis(4-glycidyloxygen) 3-,5-dimethylphenyl)anthracene, 9,9-bis(4-glycidoxy-3,5-dichlorophenyl)anthracene, and 9,9-bis(4-glycidyloxy) Base-3,5-dibromophenyl)anthracene and the like.

Examples of the epoxy monomer having a biphenyl skeleton include 4,4'-diglycidylbiphenyl, and 4,4'-diglycidyl-3,3',5,5'-tetramethyl. Base benzene and the like.

Examples of the epoxy monomer having a bis(glycidoxyphenyl)methane skeleton include 1,1'-bis(2,7-glycidoxynaphthyl)methane and 1,8'-bis ( 2,7-glycidoxynaphthyl)methane, 1,1'-bis(3,7-glycidoxynaphthyl)methane, 1,8'-bis(3,7-glycidoxynaphthyl) Methane, 1,1'-bis(3,5-glycidoxynaphthyl)methane, 1,8'-bis(3,5-glycidoxynaphthyl)methane, 1,2'-bis ( 2,7-glycidoxynaphthyl)methane, 1,2'-bis(3,7-glycidoxynaphthyl)methane, and 1,2'-bis(3,5-glycidoxynaphthalene) Base) methane, etc.

As described above The epoxy monomer of the skeleton may, for example, be 1,3,4,5,6,8-hexamethyl-2,7-bis-epoxyethylmethoxy-9-phenyl-9H- Wait.

Specific examples of the oxetane compound (A1b) having an oxetanyl group include, for example, 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl. Biphenyl, 1,4-phthalic acid bis[(3-ethyl-3-oxetanyl)methyl] Ester, 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, and oxetane modified phenol novolac. The oxetane compound (A1b) may be used alone or in combination of two or more.

The curable compound (A) preferably has two or more cyclic ether groups from the viewpoint of further improving the heat resistance of the insulating layer as a cured product.

In the case of further improving the heat resistance of the cured product, the content of the curable compound having two or more cyclic ether groups is preferably 70% by weight or more, more preferably 1.00% by weight based on the total amount of the curable compound (A). It is 80% by weight or more and 100% by weight or less. In 100% by weight of the total of the curable compound (A), the content of the curable compound having two or more cyclic ether groups may be 10% by weight or more and 100% by weight or less. Further, all of the curable compound (A) may be a curable compound having two or more cyclic ether groups.

The molecular weight of the curable compound (A) is preferably less than 10,000. The molecular weight of the curable compound (A) is preferably 200 or more, more preferably 1200 or less, still more preferably 600 or less, and still more preferably 550 or less. When the molecular weight of the curable compound (A) is at least the above lower limit, the adhesion of the surface of the insulating layer is lowered, and the workability of the laminated body is further improved. When the molecular weight of the curable compound (A) is at most the above upper limit, the adhesion of the cured product is further improved. Further, the cured product is less likely to be hard and brittle, and the adhesion of the cured product is further improved.

In the present specification, the molecular weight in the curable compound (A), when it is not a polymer, and when the structural formula can be determined, means a molecular weight which can be calculated from the structural formula. In the case of a polymer, it means a weight average molecular weight.

The content of the curable compound (A) is preferably 50% by weight or more, and more preferably 60% by weight based on 100% by weight of the total of the total resin component (hereinafter sometimes referred to simply as the total resin component X1) contained in the first curable composition. The weight% or more is preferably 99.5% by weight or less, more preferably 99% by weight or less, still more preferably 98% by weight or less. When the content of the curable compound (A) is at least the above lower limit, the adhesion and heat resistance of the cured product are further improved. When the content of the curable compound (A) is at most the above upper limit, the coatability of the first curable composition is further improved. In addition, the total resin component X1 is the sum total of the curable compound (A), the hardener (B), and other resin components added as needed. The inorganic filler (C) is not contained in the total resin component X1.

The content of the curable compound (A) is preferably 50% by weight or more, and more preferably 60% by weight based on 100% by weight of the total resin component (hereinafter sometimes referred to simply as the total resin component X2) in the second curable composition. The weight% or more is preferably 99.5% by weight or less, more preferably 99% by weight or less, still more preferably 98% by weight or less. When the content of the curable compound (A) is at least the above lower limit, the adhesion and heat resistance of the cured product are further improved. When the content of the curable compound (A) is at most the above upper limit, the coatability of the second curable composition is further improved. In addition, the total resin component X2 is the sum total of the curable compound (A), the hardener (B), and other resin components added as needed. The inorganic filler (C) is not contained in the total resin component X2. The resin component is a component which does not volatilize and which does not volatilize when it is formed, or when the curable composition or the insulating layer is heated. In other words, the resin component is a solid component, and the solid component refers to a component which is a nonvolatile component and which does not volatilize when heated by a molding or a chemical composition or a hard insulating layer.

(hardener (B))

It is preferable that the first and second insulating layers are formed using a curing agent (B). Each of the first and second curable compositions contains a curing agent (B). The curing agent (B) is not particularly limited as long as it can cure the first and second curable compositions. The hardener (B) is preferably a heat hardener. The curing agent (B) used in each of the first and second insulating layers may be used alone or in combination of two or more. The curing agent (B) used in the first insulating layer may be the same as or different from the curing agent (B) used in the second insulating layer.

The curing agent (B) preferably has an aromatic skeleton or an alicyclic skeleton from the viewpoint of further improving the heat resistance of the cured product. The hardener (B) preferably contains an amine hardener (amine compound), an imidazole hardener, a phenol hardener (phenol compound) or an acid anhydride hardener (anhydride), and more preferably contains an amine hardener. The acid anhydride hardening agent preferably contains an acid anhydride having an aromatic skeleton, a hydrogenated product of the acid anhydride or a modified product of the acid anhydride, or an acid anhydride having an alicyclic skeleton, a hydrogenated product of the acid anhydride or a modified product of the acid anhydride. .

The curing agent (B) is preferably a hardening agent containing an alkali, from the viewpoint of improving the dispersibility of the inorganic filler (C) and further improving the dielectric breakdown voltage (voltage resistance) and thermal conductivity of the cured product. Further, the curing agent (B) is more preferably an amine hardener or an imidazole from the viewpoint of further improving the dispersibility of the inorganic filler (C) and further improving the dielectric breakdown voltage (voltage resistance) and thermal conductivity of the cured product. The hardener, more preferably contains an amine hardener, and particularly preferably contains dicyandiamide. Further, it is also preferred that the curing agent (B) contains both dicyandiamide and an imidazole curing agent. By using these preferred hardeners, the dispersibility of the inorganic filler (C) in the first and second curable compositions can be improved, and heat resistance can be obtained. A hardened material with excellent balance of moisture, moisture resistance and electrical properties. As a result, even if the content of the inorganic filler (C) is large, the thermal conductivity becomes relatively high. Especially in the case of using dicyandiamide, the adhesion of the cured product to the heat conductor and the conductive layer becomes quite high.

Examples of the amine curing agent include dicyandiamide, an imidazole compound, diaminodiphenylmethane, and diaminodiphenylphosphonium. The amine hardener further preferably contains a dicyandiamide or an imidazole compound from the viewpoint of further improving the adhesion between the cured product and the heat conductor and the conductive layer. The curing agent (B) preferably contains a curing agent having a melting point of 180 ° C or higher, and more preferably an amine curing agent having a melting point of 180 ° C or higher, from the viewpoint of further improving the storage stability of the insulating layer before curing.

Examples of the imidazole hardener include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2- Phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1 - cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[ 2'-methylimidazolyl-(1')]-ethyl-all three 2,4-Diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-all three 2,4-Diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-all three 2,4-Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-all three Isocyanuric acid adduct, 2-phenylimidazolium isocyanurate adduct, 2-methylimidazoisocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl 4-methyl-5-dihydroxymethylimidazole and the like.

Examples of the phenol-based curing agent include phenol novolak, o-cresol novolac, p-cresol novolac, t-butylphenol novolac, dicyclopentadiene cresol, poly-p-vinylphenol, and bisphenol. Type A novolak, xylene modified novolac, decalin modified novolac, poly(di-o-hydroxyphenyl)methane, poly(di-m-hydroxyphenyl)methane, and poly(di-p-hydroxybenzene) Base) methane, etc. From the viewpoint of further improving the softness of the cured product and the flame retardancy of the cured product, it is preferably a phenol resin having a melamine skeleton and having three A phenolic resin of a skeleton or a phenol resin having an allyl group.

As a commercial item of the above-mentioned phenol hardening agent, MEH-8005, MEH-8010, and MEH-8015 (The above are all manufactured by Minghe Chemical Co., Ltd.), YLH903 (made by Mitsubishi Chemical Corporation), LA-7052, LA-7054, LA-7751, LA-1356, and LA-3018-50P (all of which are manufactured by DIC Corporation), and PS6313 and PS6492 (all of which are manufactured by Qunrong Chemical Co., Ltd.).

Examples of the acid anhydride having an aromatic skeleton, the hydrogenated product of the acid anhydride, or the modified product of the acid anhydride include styrene-maleic anhydride copolymer, benzophenonetetracarboxylic dianhydride, and pyromellitic acid. Dihydride, trimellitic anhydride, 4,4'-oxydiphthalic anhydride, phenylethynylphthalic anhydride, glycerol bis(hydrogen trimellitate) monoacetate, ethylene glycol Bis(hydrogen trimellitate), methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and trialkyltetrahydrophthalic anhydride.

Examples of the commercially available product of the above-described aromatic skeleton-containing acid anhydride, the acid anhydride hydride or the acid anhydride modified product include SMA Resin EF30, SMA Resin EF40, SMA Resin EF60, and SMA Resin EF80 (all of which are Sartomer Japan, ODPA-M and PEPA (all manufactured by Manac), Rikacid MTA-10, Rikacid MTA-15, Rikacid TMTA, Rikacid TMEG-100, Rikacid TMEG-200, Rikacid TMEG-300, Rikacid TMEG -500, Rikacid TMEG-S, Rikacid TH, Rikacid HT-1A, Rikacid HH, Rikacid MH-700, Rikacid MT-500, Rikacid DSDA and Rikacid TDA-100 (all manufactured by Nippon Chemical and Chemical Co., Ltd.), and EPICLON B4400 , EPICLON B650, and EPICLON B570 (all of which are manufactured by DIC).

The above-mentioned acid anhydride having an alicyclic skeleton, a hydrogenated product of the acid anhydride or a modified product of the acid anhydride is preferably an acid anhydride having a polycyclic ring skeleton, a hydrogenated product of the acid anhydride or a modified product of the acid anhydride, or by hydrazine An acid anhydride having an alicyclic skeleton, a hydrogenated product of the acid anhydride or a modified product of the acid anhydride obtained by an addition reaction of an olefinic compound and maleic anhydride. By using these hardeners, the softness of the cured product and the moisture resistance and adhesion of the cured product are further improved.

Examples of the acid anhydride having an alicyclic skeleton, a hydrogenated product of the acid anhydride, or a modified product of the acid anhydride include methylic acid anhydride, an acid anhydride having a dicyclopentadiene skeleton, or a modified product of the acid anhydride. .

As a commercial product of the above-mentioned alicyclic skeleton anhydride, the hydride of the acid anhydride, or the modified product of the acid anhydride, Rikacid HNA and Rikacid HNA-100 (all of which are manufactured by Shin-Nippon Chemical Co., Ltd.), and EPICURE are mentioned. YH306, EPICURE YH307, EPICURE YH308H and EPICURE YH309 (all of which are manufactured by Mitsubishi Chemical Corporation).

The hardener (B) is also preferably methylalic acid anhydride or trialkyltetrahydroortylene Formic anhydride. The water resistance of the cured product is improved by using methylic acid anhydride or trialkyltetrahydrophthalic anhydride.

The content of the curing agent (B) is preferably 0.5% by weight or more, more preferably 1% by weight or more, and preferably 50% by weight based on 100% by weight of the total of the total resin component X1 contained in the first curable composition. % or less, more preferably 40% by weight or less. When the content of the curing agent (B) is at least the above lower limit, the first curable composition is easily cured sufficiently. When the content of the curing agent (B) is at most the above upper limit, the remaining hardener (B) which does not participate in the hardening is less likely to be generated. Therefore, the heat resistance and adhesion of the cured product are further improved.

The content of the curing agent (B) is preferably 0.5% by weight or more, more preferably 1% by weight or more, and preferably 50% by weight based on 100% by weight of the total of the total resin component X2 contained in the second curable composition. % or less, more preferably 40% by weight or less. When the content of the curing agent (B) is at least the above lower limit, the second curable composition is easily cured sufficiently. When the content of the curing agent (B) is at most the above upper limit, the remaining hardener (B) which does not participate in the hardening is less likely to be generated. Therefore, the heat resistance and adhesion of the cured product are further improved. Furthermore, in the present specification, the above curing agent is contained in the resin component.

(Inorganic filler (C))

Each of the first and second insulating layers contains an inorganic filler (C). The thermal conductivity of the inorganic filler (C) contained in the first insulating layer is 10 W/m. K or more. It is preferred that each of the first and second curable compositions contains an inorganic filler (C). The thermal conductivity of the inorganic filler (C) contained in the first curable composition is 10 W/m. K or more. By using the inorganic filler (C), the thermal conductivity of the cured product is improved. As a result, the thermal conductivity of the cured product is improved. The first and second insulating layers The inorganic filler (C) used in each of them may be used singly or in combination of two or more. The inorganic filler (C) used in the first insulating layer may be the same as or different from the inorganic filler (C) used in the second insulating layer.

The thermal conductivity of the inorganic filler (C) contained in the first insulating layer and the first curable composition is preferably 15 W/m from the viewpoint of further improving the thermal conductivity of the cured product. K or more, more preferably 20 W/m. K or more. The thermal conductivity of the inorganic filler (C) contained in the second insulating layer and the second curable composition is preferably 10 W/m from the viewpoint of further improving the thermal conductivity of the cured product. Above K, more preferably 15 W/m. K or more, and further preferably 20 W/m. K or more. The upper limit of the thermal conductivity of the inorganic filler (C) is not particularly limited. The thermal conductivity is 300 W/m. The inorganic filler around K is widely known, and the thermal conductivity can be easily obtained at 200 W/m. An inorganic filler of about K.

The inorganic filler (C) is preferably selected from the group consisting of alumina, synthetic magnesite, crystalline ceria, boron nitride, aluminum nitride, tantalum nitride, niobium carbide, zinc oxide, and magnesium oxide. At least one, more preferably at least one selected from the group consisting of alumina, crystalline ceria, boron nitride, and aluminum nitride. By using these preferred inorganic fillers, the thermal conductivity of the cured product is further improved. The inorganic filler contained in the first insulating layer and the inorganic filler contained in the second insulating layer are preferably selected from alumina, crystal dioxide, respectively, from the viewpoint of further improving the thermal conductivity of the cured product. At least one of the group consisting of bismuth, boron nitride, and aluminum nitride. In order to further improve the thermal conductivity of the cured product, the inorganic filler contained in the first insulating layer is preferably at least one selected from the group consisting of alumina, crystalline ceria, and boron nitride. Further, the inorganic filler contained in the second insulating layer The material may be at least one selected from the group consisting of alumina, crystalline ceria, and boron nitride.

The inorganic filler (C) is more preferably at least one selected from the group consisting of spherical alumina, pulverized alumina, crystalline ceria, boron nitride, agglomerated particles, and spherical aluminum nitride. By using these preferred fillers, the thermal conductivity of the cured product is further improved. The boron nitride and the agglomerated particles are preferably boron nitride and boron nitride agglomerated particles which are not aggregated particles.

The inorganic filler (C) preferably contains an inorganic filler having a new Mohs hardness of 12 or less. The new Mohs hardness of the above-mentioned inorganic filler having a new Mohs hardness of 12 or less is more preferably 9 or less. By using an inorganic filler having a new Mohs hardness of not more than the above upper limit, the workability of the cured product is further improved.

The inorganic filler (C) is preferably at least one selected from the group consisting of synthetic magnesite, crystalline ceria, zinc oxide, and magnesium oxide from the viewpoint of further improving the processability of the cured product. The new Mohs hardness of the inorganic fillers is 9 or less.

The inorganic filler (C) may contain a spherical filler (spherical filler), may contain a pulverized filler (pulverized filler), or may have a plate-like filler (plate filler). The inorganic filler (C) is particularly preferably a spherical filler. Since the spherical filler can be filled at a high density, the thermal conductivity of the cured product is further improved by using the spherical filler.

Examples of the pulverized filler include pulverized alumina and the like. The pulverized filler can be obtained, for example, by pulverizing a block-shaped inorganic substance using a uniaxial pulverizer, a biaxial pulverizer, a hammer mill, or a ball mill. By using the pulverized filler, the filler in the insulating layer is liable to become a bridge or an effective close structure. Therefore, hard The thermal conductivity of the compound is further improved. Also, in general, pulverized fillers are less expensive than conventional fillers. Therefore, the cost of the laminated body is lowered by using the pulverized filler.

The average particle diameter of the pulverized filler is preferably 12 μm or less, more preferably 10 μm or less, and still more preferably 1 μm or more. When the average particle diameter of the pulverized filler is not more than the above upper limit, the pulverized filler can be dispersed in the first and second curable compositions at a high density, and the withstand voltage of the cured product can be further improved. When the average particle diameter of the pulverized filler is at least the above lower limit, the pulverized filler is easily filled at a high density.

The aspect ratio of the pulverized filler is not particularly limited. The aspect ratio of the pulverized filler is preferably 1.5 or more, and preferably 20 or less. Fillers having an aspect ratio of less than 1.5 are relatively expensive, and the cost of the laminate is increased. When the aspect ratio is 20 or less, the pulverized filler is easily filled.

The aspect ratio of the pulverized filler can be determined, for example, by measuring the pulverized surface of the filler by using a digital image analysis type particle size distribution measuring apparatus ("FPA" manufactured by Rufuto Co., Ltd., Japan).

In the case where the inorganic filler (C) is a spherical filler, the average particle diameter of the spherical filler is preferably 0.1 μm or more, and preferably 40 μm or less. When the average particle diameter is 0.1 μm or more, the inorganic filler (C) can be easily filled at a high density. When the average particle diameter is 40 μm or less, the withstand voltage of the cured product is further improved.

The "average particle diameter" refers to an average particle diameter obtained by measuring the particle size distribution measured by a volume average measured by a laser diffraction type particle size distribution measuring apparatus.

The average long diameter of the platy filler is preferably 0.1 μm or more, more preferably 0.5 μm or more, still more preferably 1 μm or more, more preferably 10 μm or less, still more preferably 9 μm or less. When the average long diameter of the platy filler is not less than the above lower limit and not more than the above upper limit, the plurality of inorganic fillers are easily contacted. Therefore, the thermal conductivity of the cured product is further improved. Further, when the average long diameter of the platy filler is at least the above lower limit, the platy filler is easily filled. When the average long diameter of the platy filler is not more than the above upper limit, the insulating property of the cured product is improved.

The average thickness of the above platy filler is preferably 100 nm or more. When the thickness of the plate-like filler is at least the above lower limit, the thermal conductivity of the cured product is further improved. Further, the aspect ratio of the plate-like filler is preferably 2 or more, more preferably 3 or more, more preferably 50 or less, still more preferably 45 or less. When the aspect ratio of the platy filler is not more than the above upper limit, the platy filler is easily filled. The aspect ratio of the platy filler is preferably in the range of 3 to 45.

The platy filler is preferably at least one of alumina and boron nitride. In this case, the thermal conductivity of the cured product is further improved.

The inorganic filler (C) contained in the first insulating layer preferably contains a plate-like filler from the viewpoint of further improving the thermal conductivity of the cured product.

The inorganic filler (C) contained in the first insulating layer preferably contains a pulverized filler, a spherical filler, and a plate-like filler from the viewpoint of further improving the thermal conductivity of the cured product.

The first insulation is improved from the viewpoint of improving the filling property of the inorganic filler (C) as a whole and improving the thermal conductivity in the entire insulating layer and the adhesion between the second insulating layer and the conductive layer as a cured product. The content of the platy filler in the layer 100% by weight is preferably less than 50% by weight, more preferably less than 30% by weight. %, further preferably less than 10% by weight.

In the case where the inorganic filler (C) contained in the first insulating layer contains a pulverized filler, a spherical filler, and a plate-like filler, the first insulating layer is preferably 9.5:0.5 to 5 by weight: 5 comprises pulverized filler, spherical filler and platy filler, more preferably 9:1~7:3 containing pulverized filler, spherical filler and platy filler.

The inorganic filler (C) has a maximum particle diameter of preferably 70 μm or less, more preferably 50 μm or less, from the viewpoint of suppressing the thickness unevenness of the cured product and effectively improving the thermal conductivity of the cured product. Further, the maximum particle diameter of the pulverized filler and the platy filler refers to the long diameter of the largest particles. Further, in order to satisfy the above relationship, a filler which is treated in such a manner that the filler having a large maximum particle diameter is substantially hardly present by filtration or by grading of a sieve may be used. The maximum particle diameter of the inorganic filler can be determined, for example, by using a digital image analysis type particle size distribution measuring apparatus ("FPA" manufactured by Rufuto Co., Ltd., Japan) and measuring the maximum particle diameter when 100 inorganic fillers are observed.

The content of the inorganic filler (C) in 100% by weight of the first insulating layer is 86% by weight or more and less than 97% by weight. The content of the inorganic filler (C) in 100% by weight of the first curable composition is preferably 86% by weight or more and less than 97% by weight. When the content of the inorganic filler (C) in the first insulating layer and the first curable composition is 86% by weight or more and less than 97% by weight, the cured state of the first insulating layer as a cured product is improved. And the thermal conductivity becomes quite high.

The content of the inorganic filler (C) in 100% by weight of the second insulating layer is 67% by weight or more and less than 95% by weight. The content of the inorganic filler (C) in 100% by weight of the second curable composition is preferably 67% by weight or more and less than 95% by weight. borrow When the content of the inorganic filler (C) in the second insulating layer and the second curable composition is 67% by weight or more and less than 95% by weight, the cured state of the second insulating layer as a cured product is improved. Further, the adhesion between the second insulating layer as a cured material and the conductive layer becomes relatively high.

The content of the inorganic filler (C) in 100% by weight of the first insulating layer from the viewpoint of uniformly improving the thermal conductivity in the entire insulating layer and the adhesion between the second insulating layer and the conductive layer as the cured product The content of the inorganic filler (C) in 100% by weight of the second insulating layer is more preferably 1% by weight or more, more preferably 5% by weight or more, and still more preferably 10% by weight or more.

The content of the inorganic filler (C) in 100% by weight of the second insulating layer from the viewpoint of uniformly improving the thermal conductivity in the entire insulating layer and the adhesion between the second insulating layer and the conductive layer as the cured product The ratio of the content of the inorganic filler (C) in 100% by weight of the first insulating layer (the content of the inorganic filler (C) in 100% by weight of the second insulating layer / the inorganic filler in 100% by weight of the first insulating layer ( The content of C) is preferably 0.7 or more, and preferably 0.95 or less.

(flame retardant)

It is preferable that at least one of the first and second insulating layers contains a flame retardant. The flame retardant preferably contains a phosphorus compound. By using a phosphorus compound, the flame retardancy of the cured product is further improved. The first insulating layer may contain a phosphorus compound, and the second insulating layer may contain a phosphorus compound, or both of the first and second insulating layers may contain a phosphorus compound. These phosphorus compounds may be used alone or in combination of two or more.

The phosphorus compound is preferably a phosphorus compound represented by the following formula (1) or the following formula (2) from the viewpoint of further improving the flame retardancy of the cured product. because Therefore, at least one of the first and second insulating layers preferably contains a phosphorus compound represented by the following formula (1) or the following formula (2). It is preferable that at least one of the first and second insulating layers contains triphenylphosphine or trichloroethyl phosphate.

The content of the phosphorus compound in 100% by weight of the first insulating layer is preferably 0.5% by weight or more, more preferably 1% by weight or more, more preferably 20% by weight or less, still more preferably 15% by weight or less. The content of the phosphorus compound in 100% by weight of the second insulating layer is preferably 0.5% by weight or more, more preferably 1% by weight or more, preferably 20% by weight or less, and more preferably 15% by weight or less. The content of the phosphorus compound in 100% by weight of the entire first and second insulating layers is preferably 0.5% by weight or more, more preferably 1% by weight or more, preferably 20% by weight or less, and still more preferably 15% by weight. the following. If the above phosphorus compound When the content is at least the above lower limit and not more than the above upper limit, the insulating property of the cured product can be maintained high, and the flame retardancy can be further improved. The above phosphorus compound is contained in the resin component.

(other ingredients)

The first and second insulating layers and the first and second curable compositions may contain a polymer having a weight average molecular weight of 10,000 or more. These polymers may be used alone or in combination of two or more.

A curable resin such as a thermoplastic resin or a thermosetting resin can be used as the above polymer. The above polymer is preferably a curable resin.

The thermoplastic resin and the thermosetting resin are not particularly limited. The thermoplastic resin is not particularly limited, and examples thereof include a styrene resin, a phenoxy resin, a phthalate resin, a thermoplastic urethane resin, a polyamide resin, and a thermoplastic polyimide resin. Ketone resin and drop Alkene resin, etc. The thermosetting resin is not particularly limited, and examples thereof include an amine resin, a phenol resin, a thermosetting urethane resin, an epoxy resin, a thermosetting polyimide resin, and an amino alkyd resin. Wait. Examples of the amine-based resin include a urea resin and a melamine resin.

The polymer is preferably a styrene resin, a phenoxy resin or an epoxy resin from the viewpoint of suppressing oxidative degradation of the cured product, further improving the cold and heat cycle resistance and heat resistance of the cured product, and further reducing the water absorption of the cured product. The resin is more preferably a phenoxy resin or an epoxy resin, and further preferably a phenoxy resin. In particular, by using a phenoxy resin or an epoxy resin, the heat resistance of the cured product is further improved. Moreover, by using a phenoxy resin, the elastic modulus of the cured product is further lowered, and the cold-heat cycle resistance of the cured product is further improved. high. Further, the polymer may not have a cyclic ether group such as an epoxy group.

Specific examples of the styrene resin include a homopolymer of a styrene monomer, a copolymer of a styrene monomer and an acrylic monomer, and the like. Among them, a styrene polymer having a structure of styrene-glycidyl methacrylate is preferred.

Examples of the styrene-based monomer include styrene, o-methyl styrene, m-methyl styrene, p-methyl styrene, p-methoxy styrene, p-phenyl styrene, and p-chlorostyrene. , p-ethyl styrene, p-n-butyl styrene, p-tert-butyl styrene, p-n-hexyl styrene, p-n-octyl styrene, p-n-decyl styrene, p-n-decyl styrene, pair N-dodecylstyrene, 2,4-dimethylstyrene and 3,4-dichlorostyrene.

Specifically, the phenoxy resin is, for example, a resin obtained by reacting an epihalohydrin with a dihydric phenol compound, or a resin obtained by reacting a binary epoxy compound with a dihydric phenol compound.

The phenoxy resin preferably has a skeleton selected from the group consisting of a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol A/F mixed type skeleton, a naphthalene skeleton, an anthracene skeleton, a biphenyl skeleton, an anthracene skeleton, an anthracene skeleton, At least one of a group consisting of a skeleton, an adamantane skeleton, and a dicyclopentadiene skeleton. Preferably, the phenoxy resin further has at least one selected from the group consisting of a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol A/F mixed type skeleton, a naphthalene skeleton, an anthracene skeleton, and a biphenyl skeleton. A skeleton, which further preferably has at least one of an anthracene skeleton and a biphenyl skeleton. By using a phenoxy resin having such a preferred skeleton, the heat resistance of the cured product is further improved.

The epoxy resin is an epoxy resin other than the above phenoxy resin. Examples of the epoxy resin include an epoxy resin containing a styrene skeleton, a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol S epoxy resin, and a phenol novolak epoxy resin. Biphenol type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, fluorene type Epoxy resin, epoxy resin having adamantane skeleton, epoxy resin having a tricyclodecane skeleton, and having three in the skeleton Nuclear epoxy resin, etc. The above polymer is contained in the resin component.

The first and second insulating layers and the first and second curable compositions may contain rubber particles. By using the rubber particles, the stress relaxation property and flexibility of the cured product are improved. The rubber particles are contained in the resin component.

The first and second insulating layers and the first and second curable compositions may contain a dispersing agent. By using the dispersant, the thermal conductivity and withstand voltage of the cured product are further improved.

The above dispersing agent preferably contains a functional group containing a hydrogen atom having hydrogen bonding. When the dispersant contains a functional group containing a hydrogen atom having hydrogen bonding properties, the thermal conductivity and withstand voltage of the cured product are further improved. Examples of the functional group containing a hydrogen atom having hydrogen bonding properties include a carboxyl group (pKa = 4), a phosphoric acid group (pKa = 7), and a phenol group (pKa = 10).

The pKa of the functional group containing a hydrogen atom having hydrogen bonding is preferably 2 or more, more preferably 3 or more, more preferably 10 or less, still more preferably 9 or less. When the pKa of the functional group is at least the above lower limit, the acidity of the dispersing agent does not become excessively high. Therefore, the storage stability of the first and second curable compositions and the first and second insulating layers before curing is further improved. If the above functional group When the pKa is at most the above upper limit, the function as the dispersing agent can be sufficiently exhibited, and the thermal conductivity and the withstand voltage of the cured product are further improved.

The functional group containing a hydrogen atom having hydrogen bonding is preferably a carboxyl group or a phosphoric acid group. In this case, the thermal conductivity and withstand voltage of the cured product are further improved.

Specific examples of the dispersant include a polyester carboxylic acid, a polyether carboxylic acid, a polyacrylic carboxylic acid, an aliphatic carboxylic acid, a polyoxyalkylene carboxylic acid, and a polyester phosphate. Polyether phosphoric acid, polyacrylic acid phosphoric acid, aliphatic phosphoric acid, polyoxyalkylene phosphate, polyester phenol, polyether phenol, polyacrylic phenol, aliphatic phenol, polyoxyalkylene phenol, etc. . These dispersing agents may be used alone or in combination of two or more.

The content of the dispersant is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and most preferably 20% by weight or less, more preferably 100% by weight based on 100% by weight of the total resin component X1 and the total resin component X2. 10% by weight or less. When the content of the dispersant is not less than the above lower limit and not more than the upper limit, aggregation of the inorganic filler (C) can be suppressed, and thermal conductivity and withstand voltage of the cured product can be further improved. The above dispersing agent is contained in the resin component.

The first and second insulating layers and the first and second curable compositions may contain a base material such as a glass cloth, a glass nonwoven fabric, or an aromatic polyamide nonwoven fabric. The first and second insulating layers may be prepregs, respectively, but are preferably not prepregs. The first and second insulating layers and the first and second curable compositions preferably do not contain a substrate material, and particularly preferably do not contain a glass cloth. When the first and second insulating layers and the first and second curable compositions do not contain the substrate material, the thickness of the entire insulating layer is reduced, and the thermal conductivity of the cured product is further increased. It is improved, and various processing such as laser processing or drill hole drilling can be easily performed on the insulating layer as needed.

Further, the first and second insulating layers and the first and second curable compositions may optionally contain a decane coupling agent, an antioxidant, an ion scavenger, an adhesion-imparting agent, a plasticizer, a solubility-imparting agent, and Photosensitizers and colorants. The above decane coupling agent is contained in the resin component.

(Other details of the first and second insulating layers)

The method for producing the above laminated body is not particularly limited. For example, the first curable composition is applied to a heat conductor by a solvent casting method or the like, and the first curable composition is cured to form a first insulating layer. The second curable composition is applied onto the first insulating layer by a solvent casting method or the like, and the second curable composition is cured as necessary to form a second insulating layer; and the solvent is cast by a solvent casting method or the like. The first curable composition is applied onto a release film, and the first curable composition is cured to form a first insulating layer, and then the second curable composition is applied to the mold by a solvent casting method or the like. On the first insulating layer, if necessary, the second curable composition is cured to form a second insulating layer to obtain a laminated film, and then the release film is peeled off, and the first and second insulating layers are laminated from the first insulating layer side. The method on the heat conductor, and the like. Further, the curing of the first curable composition may be performed after the application of the second curable composition. The curing of the first curable composition may be performed before the first insulating layer is laminated on the heat conductor, or may be performed after the layering. Further, the first and second insulating layers may be formed by an extrusion molding method. Moreover, the manufacturing method of the above laminated body is not limited to these methods.

The thermal conductivity of the first insulating layer is preferably 3 W/m. K or more, more preferably 4 W/m. K or more, and further preferably 5 W/m. K or more. The higher the thermal conductivity of the first insulating layer, the more the thermal conductivity in the entire insulating layer becomes sufficiently high.

The thermal conductivity of the second insulating layer is preferably 1 W/m. Above K, more preferably 1.5 W/m. K or more, and further preferably 2 W/m. K or more. The higher the thermal conductivity of the second insulating layer, the more the thermal conductivity in the entire insulating layer becomes higher.

The dielectric breakdown voltage in the entire first and second insulating layers as the cured product is preferably 30 kV or more, more preferably 40 kV or more, further preferably 50 kV or more, and particularly preferably 80 kV or more, and most preferably 100. Above kV. The higher the dielectric breakdown voltage, the more the insulation can be sufficiently ensured when the laminate is used for a large current such as a power element.

(layered body)

An example of a laminated body according to an embodiment of the present invention is shown in cross section in Fig. 1 .

The laminated body 1 shown in Fig. 1 has a thermal conductivity of 10 W/m. The heat conductor 2 having K or more, the first insulating layer 3 as a semi-cured material or a cured product, and the second insulating layer 4 as an uncured or semi-cured material.

The first insulating layer 3 is laminated on the surface of the heat conductor 2. The first insulating layer 3 may be laminated on at least one surface of the heat conductor 2, and the two first insulating layers may be laminated on the surfaces of both sides of the heat conductor. The second insulating layer 4 is laminated on the surface of the first insulating layer 3 opposite to the side of the heat conductor 2.

The first insulating layer 3 has a thermal conductivity of 10 W/m at 86% by weight or more and less than 97% by weight. The inorganic filler of K or more, and the second insulating layer 4 contains an inorganic filler in an amount of 67% by weight or more and less than 95% by weight. The first insulating layer 3 has a hardening rate of 50% or more, the second insulating layer 4 has a hardening rate of less than 80%, and the first insulating layer 3 The hardening rate is greater than the hardening rate of the second insulating layer 4.

FIG. 2 is a cross-sectional view showing an example of a component for a power semiconductor module obtained by a method for manufacturing a component for a power semiconductor module according to an embodiment of the present invention.

The component 11 for a power semiconductor module shown in FIG. 2 is formed using the above-described laminated body 1. In the case where the first insulating layer 3 in the laminated body 1 is a semi-cured material, the first insulating layer 3 is cured in the power semiconductor module component 11. The second insulating layer 4 in the laminated body 1 is an uncured material or a semi-cured material. In contrast, in the power semiconductor module component 11, the second insulating layer 4 is cured.

The power semiconductor module part 11 includes a thermal conductivity of 10 W/m. The heat conductor 2 of K or more, the first insulating layer 3 as a cured product, the second insulating layer 4 as a cured material, the conductive layer 12, and the mold resin 13.

The conductive layer 12 is laminated on the surface of the second insulating layer 4 opposite to the first insulating layer 3 side. The heat conductor 2, the first insulating layer 3, the second insulating layer 4, and the conductive layer 12 are buried in the mold resin 13. It is preferable that a part of the conductive layer 12 is exposed from the mold resin 13.

The power semiconductor module component 11 is obtained by laminating the conductive layer 12 on the surface of the second insulating layer 4 on the side opposite to the first insulating layer 3 in the laminated body 1, and then the second insulating layer. 4, when the first insulating layer 3 is a semi-cured material, the first insulating layer 3 is cured, and the heat conductor 2, the first insulating layer 3, the second insulating layer 4, and the conductive layer 12 are buried. Inside the mold resin 13. At this time, it is preferable to embed the heat conductor 2, the first insulating layer 3, the second insulating layer 4, and the conductive layer 12 in the mold so as to expose a part of the conductive layer 12. Inside the resin 13. Moreover, after the heat conductor 2, the first insulating layer 3, the second insulating layer 4, and the conductive layer 12 are buried in the mold resin 13, the first and second insulating layers 3 and 4 may be cured. For example, when the mold resin 13 is cured, the first and second insulating layers 3 and 4 may be cured.

The laminate of the present invention is preferably a laminate for obtaining parts for a power semiconductor module. Further, the use of the above laminated body is not limited to the above-described components for a power semiconductor module. It is also possible to obtain, for example, a laminated board or a multilayer wiring board in which a metal body is provided with a copper circuit on both surfaces via a first and a second insulating layer, a copper foil, a copper plate, a semiconductor element, or a semiconductor package. Various electric nitrogen parts on the layer. The above laminated body can be preferably used for bonding a thermal conductor to a conductive layer of a semiconductor device on which a semiconductor element is mounted on a substrate. Further, the above laminated body can also be preferably used for a thermal conductivity of 10 W/m. The heat conductor of K or more is placed on the conductive layer of the electronic component device on which the electronic component other than the semiconductor element is mounted on the substrate.

The above thermal conductivity is 10 W/m. The heat conductor of K or more is not particularly limited. The above thermal conductivity is 10 W/m. Examples of the heat conductor of K or more include aluminum, copper, aluminum oxide, cerium oxide, tantalum carbide, tantalum nitride, aluminum nitride, and graphite sheets. Wherein, the above thermal conductivity is 10 W/m. The heat conductor of K or more is preferably copper or aluminum. Copper or aluminum is excellent in heat dissipation.

Hereinafter, the present invention will be clarified by enumerating specific examples and comparative examples of the invention. Furthermore, the invention is not limited to the following examples.

Prepare the following materials.

[Sclerosing compound (A)]

(1) Bisphenol A type liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation) "Epikote 828US", Mw=370)

(2) Bisphenol F type liquid epoxy resin ("Epikote 806L" manufactured by Mitsubishi Chemical Corporation, Mw=370)

(3) Naphthalene skeleton liquid epoxy resin ("EPICLON HP-4032D" manufactured by DIC Corporation, Mw=304)

(4) Biphenyl skeleton epoxy resin (Epikote YX4000, manufactured by Mitsubishi Chemical Corporation, Mw=368)

[polymer]

(1) Bisphenol A type phenoxy resin ("E1256" manufactured by Mitsubishi Chemical Corporation, Mw = 51000)

(2) Polystyrene ("HRM26" manufactured by Toyo Styrene, Mw = 300,000)

[hardener (B)]

(1) alicyclic skeleton anhydride ("MH-700" manufactured by Nippon Chemical and Chemical Co., Ltd.)

(2) Biphenyl skeleton phenol resin ("MEH-7851-S" manufactured by Minghe Chemical Co., Ltd.)

(3) Diaminodiphenylmethane (melting point 90 ° C)

(4) dicyandiamide (melting point 208 ° C)

(5) Isocyanuric acid-modified solid dispersion type imidazole ("2MZA-PW" manufactured by Shikoku Chemicals Co., Ltd., melting point 253 ° C)

[Inorganic filler (C): thermal conductivity is 10 W/m. K or more]

(1) 5 μm pulverized alumina (pulverized filler, "LT300C" manufactured by Nippon Light Metal Co., Ltd., average particle size 5 μm, maximum particle size 15 μm, thermal conductivity 36 W/m. K, new Mohs hardness 12)

(2) 2 μm pulverized alumina (pulverized filler, "LS-242C" manufactured by Nippon Light Metal Co., Ltd., average particle size 2 μm, maximum particle size 20 μm, thermal conductivity 36 W/m.K, new Mohs hardness 12)

(3) Spherical alumina (DAM-10 manufactured by Denka Co., Ltd., average particle size 10 μm, maximum particle size 30 μm, thermal conductivity 36 W/m.K, new Mohs hardness 12)

(4) Aluminum nitride ("TOYALNITE-FLX" manufactured by Toyo Aluminium Co., Ltd., average particle size 14 μm, maximum particle size 30 μm, thermal conductivity 200 W/m.K, new Mohs hardness 11)

(5) Crystal cerium oxide (Crystalite CMC-12 manufactured by Ronsen Corporation, average particle size 5 μm, maximum particle size 20 μm, thermal conductivity 10 W/m.K, new Mohs hardness 9)

(6) Plate-shaped boron nitride ("UHP-1" manufactured by Showa Denko Co., Ltd., average particle size 8 μm, maximum particle size 50 μm, thermal conductivity 60 W/m.K, new Mohs hardness 2)

(7) Boron nitride agglomerated particles ("TPX25" manufactured by Momentive Co., Ltd., average particle size 25 μm, maximum particle diameter 100 μm, thermal conductivity 60 W/m.K, new Mohs hardness 2)

[Inorganic filler (C): The thermal conductivity is less than 10 W/m. K]

(1) Melted cerium oxide ("SE15" manufactured by Tokuyama Co., Ltd., average particle size 15 μm, maximum particle size 60 μm, thermal conductivity 2 W/m.K, new Mohs hardness 7)

[Flame retardant]

(1) Triphenyl phosphine (TPP)

(2) Trichloroethyl phosphate (TCEP)

[additive]

(1) Epoxy decane coupling agent ("KBE403" manufactured by Shin-Etsu Chemical Co., Ltd.)

[solvent]

(1) methyl ethyl ketone

(Example 1)

Using a homogeneous dispersion type mixer, the components are blended in a ratio shown in the following Table 1 (parts by weight of the compounding unit), and kneaded to prepare a first curable composition for forming a first insulating layer, and to form The second curable composition of the second insulating layer.

The first curable composition was applied onto a release PET sheet having a thickness of 50 μm, and dried in an oven at 90 ° C for 30 minutes to form a first insulating layer having a thickness of 80 μm on the PET sheet. Further, the second curable composition was applied onto a release PET sheet having a thickness of 50 μm, and dried in an oven at 90 ° C for 30 minutes to form a second insulating layer having a thickness of 80 μm on the PET sheet.

The obtained first insulating layer was bonded to a copper plate having a thickness of 0.5 mm by a heat bonding machine, and then cured at 200 ° C for 1 hour (hardening conditions of the first curable composition). Thereafter, the second insulating layer was bonded to the first insulating layer by a heat bonding machine, and then cured at 130 ° C for 3 minutes (hardening conditions of the second curable composition) to prepare a laminate.

Further, using the obtained laminated body, the electrolytic copper foil having a thickness of 35 μm was pressed against the second insulating layer side of the laminated body while being pressed at a pressure of 1 MPa. The mixture was heated at 200 ° C for 1 hour to obtain a laminated structure.

(Examples 2 to 54 and Comparative Examples 1 to 7)

The type and amount of each component used in the first and second curable compositions, the curing conditions of the first and second curable compositions, the thickness of the first and second insulating layers, and the time when the laminate is obtained The first and second curable compositions were prepared in the same manner as in Example 1 except that the thickness of the copper plate used was as shown in the following Tables 1 to 12, and a laminate and a laminated structure were produced.

(Evaluation)

(1) Viscosity of the second insulating layer in the laminate as an unhardened or semi-hardened layer before hardening at 130 ° C

The second insulating layer of the laminate was processed into a disk shape having a diameter of 2 cm. Rotary dynamic viscoelasticity measuring device ("VAR-100" manufactured by Reologica Instruments), with a parallel plate of 2 cm in diameter, in the oscillation strain control mode, initial stress 10 Pa, frequency 1 Hz, and strain 1% Under the conditions, the viscosity of the second insulating layer at 130 ° C was measured while heating at 23 ° C for 8 ° C / min.

(2) Thermal conductivity

The first insulating layer and the second insulating layer of the laminated body are taken out. The thermal conductivity of the first insulating layer and the thermal conductivity of the second insulating layer were measured using a thermal conductivity meter ("Quick Thermal Conductivity Meter QTM-500" manufactured by Kyoto Electronics Industry Co., Ltd.).

(3) Peel strength of the conductive layer with respect to the second insulating layer as a cured product

The electrolytic copper foil of the obtained laminated structure was etched to a width of 10 mm. Thereafter, the peel strength at the time of peeling the electrolytic copper foil from the second insulating layer at an elongation speed of 50 mm/min at an angle of 90 degrees was measured.

(4) Thermal expansion coefficient of the first insulating layer

The first insulating layer in the laminate was cut to a size of 3 mm × 25 mm. When the first insulating layer is a cured product, the cured product is used as a sample. When the first insulating layer is a semi-cured material, the first insulating layer is cured in an oven at 200 ° C for 1 hour to prepare a sample as a cured product. Using a TMA (Thermomechanical Analysis) apparatus ("TMA/SS7000" manufactured by SII NanoTechnology Co., Ltd.), the obtained sample was heated to 320 ° C at a temperature increase rate of 10 ° C / min, and then cooled to -45. °C, then the temperature at -10 °C from 10 °C / min to 130 °C - the slope of the TMA line, the reciprocal is calculated as the coefficient of thermal expansion at -45 ~ 130 °C.

(5) Insulation breakdown voltage (withstand voltage)

The first and second insulating layers of the laminate are taken out. The first and second insulating layers were cut to a size of 100 mm × 100 mm to obtain a sample. The obtained sample was hardened in an oven at 200 ° C for 1 hour to obtain an insulating layer as a cured product. An AC voltage was applied between the insulating layers by using a withstand voltage tester ("MODEL7473" manufactured by EXTECH Electronics Co., Ltd.) at a voltage of 1 kV/sec. The voltage at which the insulating layer is broken is set as the dielectric breakdown voltage.

(6) Warpage of laminated body

The laminated body is processed into a size of 10 mm × 500 mm, so that the copper plate is placed sideways on the horizontal table, and the difference between the maximum value and the minimum value of the height of the upper surface of the laminated body is set as the warpage of the laminated body. Conduct an evaluation. The warpage of the laminated body was determined by the following criteria.

[Criteria for Judging the Warpage of Laminates]

○: warpage is less than 0.1 mm

△: warpage is 0.1 mm or more and less than 0.5 mm

×: Warpage is 0.5 mm or more

(7) Storage stability of the insulating layer

The electrolytic copper foil of the obtained laminated structure was etched to a width of 10 mm. Thereafter, the laminated structure was placed in an oven at 40 ° C for one month. Then, the peel strength at the time of peeling the electrolytic copper foil from the second insulating layer at an elongation speed of 50 mm/min at an angle of 90 degrees was measured.

The measured value (initial value) of the peel strength of the (3) conductive layer with respect to the second insulating layer as the cured product was evaluated to what extent the measured value of the peel strength after standing at 40 ° C for one month was maintained. The storage stability of the insulating layer was judged by the following criteria.

[Criteria for determination of storage stability of insulating layer]

○: The peel strength is 70% or more of the initial value

△: The peel strength is 50% or more of the initial value and less than 70%

×: The peel strength is less than 50% of the initial value

(8) Processability

Using a 2.0 mm diameter drill ("RA Series" manufactured by Union Tool), the laminate was subjected to engraving and milling at a rotation number of 30,000 and a platform transfer speed of 0.5 m/min. The processing distance until the burrs were generated was measured. The workability was evaluated by the following criteria.

[Criteria for the determination of processability]

○: 5 m or more can be processed without burrs

△: It can process 1 m or more and less than 5 m without generating burrs.

×: burrs caused by processing up to 1 m

(9) Flame retardancy

The laminate was allowed to harden in an oven at 200 ° C for 1 hour. The first and second insulating layers of the cured product were cut into a size of 13 cm × 12.5 cm to obtain a test piece. According to the UL (Underwriters Laboratories) 94 standard, the flame of the gas burner is brought into contact with the lower end of the test piece which is vertically maintained in the longitudinal direction for 10 seconds, and after the combustion is stopped, the flame 10 is further contacted. Seconds, and check the extent of burning of the test piece. The flame retardancy was determined by the following criteria.

[Criteria for determination of flame retardancy]

○○: The length of the test piece is less than 5% burning

○: 5% or more of the length of the test piece and less than 10% burning

△: 10% or more of the length of the test piece and less than 50% burning

×: 50% or more of the length of the test piece burns

(10) Heat dissipation

The laminate was allowed to harden in an oven at 200 ° C for 1 hour. The layered body after hardening was pressed from the side of the second insulating layer as the cured product to a heat generating body having a surface smoothness controlled at 60 ° C under the same pressure of 196 N/cm ² . The temperature of the surface of the copper plate was measured by a thermocouple. The heat dissipation was determined by the following criteria.

[Judgement for heat dissipation]

○: The temperature difference between the surface of the heating element and the copper plate exceeds 3 ° C and is less than 6 ° C

△: The temperature difference between the surface of the heating element and the copper plate exceeds 6 ° C and is less than 10 ° C

×: The temperature difference between the surface of the heating element and the copper plate exceeds 10 °C

The blending ingredients and results are shown in Tables 1 to 12 below. In the following Tables 7 to 12, *1 indicates "the total content of the pulverized filler and the spherical filler in the first insulating layer or the second insulating layer: the content of the platy filler". *2 represents the content (% by weight) of the curable compound having a polycyclic aromatic skeleton in 100% by weight of the curable compound (A) in the first insulating layer. Further, in the following Tables 7 to 12, "○" is indicated in the column of the thickness of the copper plate to be used.

1‧‧ ‧ laminated body

2‧‧‧ Thermal Conductor

3‧‧‧1st insulation layer

4‧‧‧2nd insulation layer

11‧‧‧Power semiconductor module parts

12‧‧‧ Conductive layer

13‧‧‧Mold resin

Fig. 1 is a cross-sectional view schematically showing a laminated body according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view schematically showing a component for a power semiconductor module obtained by a method of manufacturing a component for a power semiconductor module according to an embodiment of the present invention.

1‧‧ ‧ laminated body

2‧‧‧ Thermal Conductor

3‧‧‧1st insulation layer

4‧‧‧2nd insulation layer

Claims (15)

A laminated body for obtaining a laminated body of a component for a power semiconductor module, the laminated body comprising: a thermal conductor having a thermal conductivity of 10 W/m. K or more; the first insulating layer is laminated on the surface of the heat conductor and is a hardened and hardenable semi-cured material or a cured hardened material; and a second insulating layer laminated on the first insulating layer The surface opposite to the heat conductor side is a hardened and hardenable semi-hardened material; the first insulating layer has a thermal conductivity of 10 W/m at 86% by weight or more and less than 97% by weight. In the inorganic filler of K or more, the second insulating layer contains the inorganic filler in an amount of 67% by weight or more and less than 95% by weight, and the content of the inorganic filler in the 100% by weight of the first insulating layer is more than the weight of the second insulating layer 100. The content of the inorganic filler in %; the curing rate of the first insulating layer is 50% or more, the curing ratio of the second insulating layer is 10% or more and less than 80%, and the curing rate of the first insulating layer is larger than the above The curing rate of the second insulating layer; the second insulating layer is followed by the conductive layer in the component for the power semiconductor module. In the laminate of claim 1, the curing rate of the first insulating layer is 10% or more larger than the curing rate of the second insulating layer. The laminate according to claim 1 or 2, wherein when the first insulating layer is a cured product, the first insulating layer as a cured product has a coefficient of thermal linear expansion of 20 ppm/° C. or less; and the first insulating layer is In the case of semi-hardened material, as after hardening The first insulating layer of the cured product has a coefficient of thermal linear expansion of 20 ppm/° C. or less. The laminate of claim 1 or 2, wherein the viscosity of the second insulating layer at 130 ° C is 1000 Pa. s above and 20000Pa. s below. The laminate according to claim 1 or 2, wherein a ratio of a thickness of the second insulating layer to a thickness of the first insulating layer is 0.3 or more and 1 or less. The laminate according to claim 1 or 2, wherein the inorganic filler contained in the first insulating layer has a maximum particle diameter of 50 μm or less, and the inorganic filler contained in the second insulating layer has a maximum particle diameter of 50 μm or less. The laminate according to claim 1 or 2, wherein the inorganic filler contained in the first insulating layer is at least one selected from the group consisting of alumina, crystalline ceria, boron nitride, and aluminum nitride. The laminate according to claim 1 or 2, wherein the inorganic filler contained in the first insulating layer and the inorganic filler contained in the second insulating layer are each selected from the group consisting of alumina, crystalline ceria, and nitriding At least one of a group consisting of boron and aluminum nitride. The laminate according to claim 1 or 2, wherein the first insulating layer is formed using a curable compound having a cyclic ether group and a curing agent. The laminate according to claim 9, wherein the curing agent used in the first insulating layer is an amine curing agent having a melting point of 180 ° C or higher. The laminate according to claim 9, wherein the curable compound having a cyclic ether group used in the first insulating layer contains a curable compound having a cyclic ether group and a polycyclic aromatic skeleton. The laminate of claim 11, wherein the polycyclic aromatic skeleton is a combination Benzene skeleton. The laminate according to claim 1 or 2, wherein the second insulating layer is formed using a curable compound having a cyclic ether group and a curing agent. The laminate according to claim 13, wherein the curing agent used in the second insulating layer is an amine curing agent having a melting point of 180 ° C or higher. The laminate according to claim 1 or 2, wherein the thickness of the heat conductor is 100 μm or more and 1 mm or less.