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TWI543209B - Bundled soft circuit cable - Google Patents

Bundled soft circuit cable Download PDF

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Publication number
TWI543209B
TWI543209B TW098131522A TW98131522A TWI543209B TW I543209 B TWI543209 B TW I543209B TW 098131522 A TW098131522 A TW 098131522A TW 98131522 A TW98131522 A TW 98131522A TW I543209 B TWI543209 B TW I543209B
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TW
Taiwan
Prior art keywords
section
connecting section
cluster
layer
flexible substrate
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TW098131522A
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English (en)
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TW201112276A (en
Inventor
Kun-Jin Lin
zhi-heng Zhuo
Guo-Fu Su
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Priority to TW098131522A priority Critical patent/TWI543209B/zh
Priority to JP2010044117A priority patent/JP5491906B2/ja
Priority to US12/729,677 priority patent/US20110067903A1/en
Priority to KR1020100030311A priority patent/KR101664241B1/ko
Publication of TW201112276A publication Critical patent/TW201112276A/zh
Priority to US13/602,646 priority patent/US8872032B2/en
Priority to US13/602,663 priority patent/US20120325528A1/en
Priority to US13/602,627 priority patent/US20120325526A1/en
Application granted granted Critical
Publication of TWI543209B publication Critical patent/TWI543209B/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0892Flat or ribbon cables incorporated in a cable of non-flat configuration
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/051Rolled
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/055Folded back on itself

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Manufacturing & Machinery (AREA)

Description

束狀軟性電路排線
本發明係關於一種信號傳輸排線之結構設計,特別是關於一種具有可疊置結構的束狀軟性電路排線。
傳統的排線結構一般是將數條外覆有絕緣層之導線並列形成一扁平型排線之結構,可應用在許多種電器設備、電子設備、電腦設備及通訊設備中作為信號之傳送之用。
近年來,軟性電路板之技術亦廣泛應用在排線結構中。在目前所常使用之軟性電路板排線產品中,因應不同傳輸線數目之需求,可採用單面板、雙面板、多層板等不同軟性電路板排之結構。
採用扁平型排線來作為訊號之傳輸線應用在實際應用時,雖然在通過狹長形穿置空間時,並不會太大的問題,但在目前許多電子設備或通訊設備中,經常會使用到具有軸孔之轉軸結構。例如在目前廣受使用之筆記型電腦、液晶顯示器、數位相機、手機、觸控面板或許多消費性電子之結構設計中,其蓋板或螢幕即經常是以轉軸結構結合在電子裝置主體上。為了要使電訊號由電子裝置主體傳送至該蓋板或螢幕,目前的作法是採用小型化的排線產品或以極細導線叢集捆束來作為訊號之傳輸線。在這些應用領域中,若採用傳統扁平型排線就會面臨許多問題,例如排線影響轉軸轉動操作的平順、導線撓度不足、導線撓曲耐用度不足等。因此,本案申請人於先前乃研發出多款具有束狀結構及叢集區段的軟性電路排線,該叢集區段係由複數條沿著該軟性基板之延伸方向所切割形成之叢集線所組成。
在使用具有束狀結構及叢集區段的軟性電路排線時,雖然解決了大部份的需求,但仍存在了一些問題,例如欲將軟性電路排線結合於電子設備的轉軸結構時,位在排線端部的連接槽座或插接端不易穿過狹小口徑的轉軸孔。再者,軟性電路排線的連接槽座或插接端即使通過了狹小口徑的轉軸孔之後,軟性電路排線的叢集線往往會有任意撓曲及受到電磁干擾的問題。
緣此,鑑於習知技術之缺失,本發明之主要目的係提供一種具有可疊置結構的束狀軟性電路排線,藉由可折疊結構,可兼顧縮小軟性電路排線端部的寬度尺寸以及便於將軟性電路排線端部穿過轉軸孔之操作。
本發明之另一目的係提供一種具有良好屏蔽效果的束狀軟性電路排線,配合本發明的折疊及捲束結構,可在該軟性電路排線的軟性基板設置電磁屏蔽層,亦可在以電磁屏蔽材料構成捲束結構。
本發明為解決習知技術之問題所採用之技術手段係在一軟性基板中包括有至少一叢集區段,該叢集區段係由複數條沿著該軟性基板之延伸方向所切割形成之叢集線所組成。叢集區段之一端形成有至少一第一連接區段,另一端形成有至少一第二連接區段。該第一連接區段及第二連接區段兩者或第一連接區段及第二連接區段之一係包括有一疊置結構,該疊置結構係將該第一連接區段兩側翼或兩側翼之一以一折線折疊,而使該側翼疊合於該第一連接區段之一中央區域之至少一部份區域。
本發明之實施例中,該軟性基板可採用單面板或雙面板之結構,且可包括有一電磁屏蔽層。叢集區段之選定位置以一捲束結構捲束成一束狀結構。該捲束結構可採用屏蔽材料、絶緣材料或組合屏蔽與絶緣材料所製成。
經由本發明之結構設計,可以經由疊置組合之結構設計,而使得信號傳輸排線可縮小軟性電路排線端部的寬度尺寸,而在結合於轉軸結構之操作時,可以很容易將軟性電路排線端部穿過狹小口徑的轉軸孔。而捲束於軟性電路排線之叢集區段之捲束結構,除了可作為限制軟性基板之叢集區段之各個叢集線的撓曲之外,亦提供該叢集區段之電磁屏蔽作用。
本發明之其它目的及其功效,將藉由以下之實施例及附呈圖式作進一步之說明。
參閱第1圖所示,其顯示本發明束狀軟性電路排線於展開時之立體圖,第2圖顯示第1圖中2-2斷面的剖視圖。本發明束狀軟性電路排線100包括有一軟性基板11,其係以一延伸方向I延伸一預定長度,該軟性基板11具有第一表面11a及第二表面11b。在軟性基板11之第一表面11a上,順序地形成有一第一導電層12、一第一絶緣層13。本發明較佳實施例中,在該第一絶緣層13上更形成有一電磁屏蔽層14。電磁屏蔽層14可選擇性地局部覆設在該第一絶緣層13表面上的選定區域,以作為電信號的電磁屏蔽作用。
第2圖所示的軟性電路基板結構係為單面電路基板,本發明亦可應用於雙面電路基板。在雙面電路基板的結構中(參閱第3圖所示),係在軟性基板11之第二表面11b更順序地形成有一第二導電層15及一第二絶緣層16,且在該雙面電路基板的結構中,亦可設有信號跳線結構,亦即在軟性基板11之第一表面11a與第二表面11b間的選定位置開設有貫孔17,並在貫孔17的內壁面設有導電材料18,以使軟性基板11之第一表面11a與第二表面11b的第一導電層12與第二導電層15可作選性的信號連通。雙面電路基板的結構亦可以兩個單面電路基板背對背結合而組成。
在軟性基板11之延伸方向I,係可區分為一第一連接區段2、一第二連接區段3、以及位在第一連接區段2與第二連接區段3間的叢集區段4,亦即該第一連接區段2是位在叢集區段4的一端,而第二連接區段3是位於軟性基板11相反於該第一連接區段2之另一端。
叢集區段4係由複數條沿著該軟性基板11之延伸方向I所切割形成之叢集線41所組成。而全部或部份叢集線41可設有信號線,以作為第一連接區段2與第二連接區段3之間的電信號傳送路徑。在叢集區段4中,可在全部或部份切割形成之叢集線414之端部適當位置處(例如位在第一連接區段2及一第二連接區段3),形成數個防撕裂孔214,可避免軟性基板11在組配操作或使用時,不慎沿著該切割形成之叢集線41被撕裂損壞。
第一連接區段2包括有一疊置結構20。同時參閱第4圖及第5圖所示,該疊置結構20係將該第一連接區段2區分為一中央區域21以及位在該中央區域21兩側翼的側翼疊置區域22、23。兩側翼或兩側翼之一的側翼疊置區域22、23可沿著實體或假想的折線212、213向中央區域21之方向疊合操作,而使側翼疊置區域22、23疊置在中央區域21之下方位置或疊置在中央區域21之部份區域。如此會使得第一連接區段2在垂直於該軟性基板11之延伸方向I之方向的寬度變小。第二連接區段3亦可設有相同的疊置結構,以使第二連接區段3之中央區域31兩側翼的側翼疊置區域32、33疊置在中央區域31或疊置在中央區域31之部份區域。完成疊置後的結構即如第4圖所示。
在實際的應用時,第一連接區段2與第二連接區段3在選定的位置可設有不同類型的連接槽座或插接端。例如在第1圖所示之實施例中,在第一連接區段2的中央區域21是配置一連接槽座211,而在第二連接區段3之側翼疊置區域32側緣設有一插接端321。當然亦可在第一連接區段2與第二連接區段3設有相同類型的連接槽座或插接端。例如在第6圖所示之實施例中,在第一連接區段2的中央區域21是配置一連接槽座211,而在第二連接區段3之側翼疊置區域31亦設有一連接槽座311。
再者,軟性基板之連接區段及叢集區段的對應數目可為一對一的結構,亦可為一對多的結構設計。例如在第1圖所示之實施例中,係一個連接區段經由單一個叢集區段連接另一個連接區段的結構設計,而在第7圖所示之實施例中,係一個第二連接區段3經由一叢集區段4的叢集線41連接一第一連接區段2、且經由另一叢集區段4a的叢集線41a連接另一個第一連接區段2a的結構設計。實際應用時,可依不同的需求,作不同的變化應用。
本發明的實施例,可以至少一捲束結構5捲束於軟性基板11之叢集區段4之選定位置(參閱第4圖),以將該叢集區段4的各個叢集線41予以捲束成一束狀結構。第8圖顯示第4圖中8-8斷面的剖視圖。本發明的較佳實施例中,該捲束結構5係具有一電磁屏蔽材料層51,亦即該捲束結構5係包括有以屏蔽材料所製成之捲束結構,捲束於該叢集區段4之選定位置,除了可將該叢集區段4之各個叢集線41捲束成一束狀結構之外,並提供該叢集區段4之電磁屏蔽作用。該捲束結構5亦可採用絶緣材料(例如防水膠布)或組合屏蔽材料與絶緣材料製作該捲束結構。
第9圖顯示本發明實際應用結合在一具有轉軸結構的行動電話之應用例。如圖所示,本發明束狀軟性電路排線100之軟性基板11之叢集區段4之叢集線41通過一轉軸結構6後,使第一連接區段2與第二連接區段3分別位在轉軸結構6之兩對應位置。而藉由捲束結構5之電磁屏蔽材料層51的電磁屏蔽作用,可以使叢集區段4之叢集線41在傳送信號時,免於在通過路徑中所可能發生的電磁干擾問題。
在實際的應用時,亦可在該電磁屏蔽材料層51的外環環覆有一絶緣外層52(如第10圖所示),或是先在軟性基板11之叢集區段4先以一絶緣內層53環繞,再以電磁屏蔽材料層51環繞於該絶緣內層53之外環,最後於電磁屏蔽材料層51之外環再環設一絶緣外層54(如第11圖所示)。
前述實施例之捲束結構5係一片狀體之捲束結構型態,該片狀體以一捲束方向II捲束定位於該叢集區段之選定位置。亦可以螺旋狀捲繞的結構型態形成該捲束結構。如第12圖所示,其係一細長條片體的屏蔽材料以斜向捲束方向III螺旋狀捲繞在叢集區段4的叢集線41,以形成一螺旋狀捲束結構5a,而該長條狀的屏蔽材料係可選自於導電布、銀箔、鋁箔、銅箔、金屬薄片等具有電磁屏蔽作用材料之一。
以上之實施例說明,僅為本發明之較佳實施例說明,凡精於此項技術者當可依據本發明之上述實施例說明而作其它種種之改良及變化。然而這些依據本發明實施例所作的種種改良及變化,當仍屬於本發明之發明精神及以下所界定之專利範圍內。
100‧‧‧束狀軟性電路排線
11‧‧‧軟性基板
11a‧‧‧第一表面
11b‧‧‧第二表面
12‧‧‧第一導電層
13‧‧‧第一絶緣層
14‧‧‧電磁屏蔽層
15‧‧‧第二導電層
16‧‧‧第二絶緣層
17‧‧‧貫孔
18‧‧‧導電材料
2、2a‧‧‧第一連接區段
20‧‧‧疊置結構
21‧‧‧中央區域
211‧‧‧連接槽座
212、213‧‧‧折線
22、23‧‧‧側翼疊置區域
3‧‧‧第二連接區段
31‧‧‧中央區域
311‧‧‧連接槽座
32、33‧‧‧側翼疊置區域
321‧‧‧插接端
4、4a‧‧‧叢集區段
41、41a‧‧‧叢集線
5‧‧‧捲束結構
5a‧‧‧螺旋狀捲束結構
51‧‧‧電磁屏蔽材料層
52‧‧‧絶緣外層
53‧‧‧絶緣內層
54‧‧‧絶緣外層
6‧‧‧轉軸結構
I‧‧‧延伸方向
II‧‧‧捲束方向
III‧‧‧斜向捲束方向
第1圖顯示本發明束狀軟性電路排線於展開時之立體圖;第2圖顯示第1圖中2-2斷面的剖視圖;第3圖顯示第1圖中的軟性電路基板為一雙面電路基板時的剖視圖;第4圖顯示本發明束狀軟性電路排線於疊置後之立體圖;第5圖顯示第4圖中5-5斷面的剖視圖;第6圖顯示本發明在第一連接區段配置一連接槽座,而在第二連接區段設一連接槽座之立體圖;第7圖顯示本發明以一個連接區段經由兩個叢集區段的叢集線連接兩個對應連接區段之立體圖;第8圖顯示本發明以一捲束結構捲束於軟性基板之叢集區段之叢集線之剖視圖;第9圖顯示本發明實際應用結合在一具有轉軸結構的行動電話之應用例;第10圖顯示第8圖中捲束結構的電磁屏蔽材料層的外環環覆有一絶緣外層之剖視圖;第11圖顯示在軟性基板之叢集區段先以一絶緣內層環繞,再以電磁屏蔽材料層環繞於該絶緣內層之外環,最後於電磁屏蔽材料層之外環再環設一絶緣外層之剖視圖;第12圖係顯示本發明之束狀軟性電路排線之螺旋狀捲束結構捲束定位於該叢集區段之選定位置之立體示意圖。
100...束狀軟性電路排線
2...第一連接區段
21...中央區域
211...連接槽座
3...第二連接區段
31...中央區域
321...插接端
4...叢集區段
41...叢集線
5...捲束結構
I...延伸方向
II...捲束方向

Claims (6)

  1. 一種束狀軟性電路排線,包括:一軟性基板,以一延伸方向延伸,具有第一表面及第二表面,該第一表面更形成有一第一導電層,並在該第一導電層上形成有一第一絶緣層及一形成在該第一絶緣層上之電磁屏蔽層;至少一第一連接區段,位在該軟性基板之一端;至少一第二連接區段,位在該軟性基板相反於該第一連接區段之另一端;至少一叢集區段,連接於該第一連接區段及該第二連接區段間,該叢集區段係由複數條沿著該軟性基板之延伸方向所切割形成之叢集線所組成;至少一捲束結構,其係以一片狀體以一捲束方向捲束於該叢集區段之選定位置,以將該叢集區段之各個叢集線捲束成一束狀結構,且該捲束結構係包括:一電磁屏蔽材料層,環繞於該叢集區段;一絶緣外層,環繞於該電磁屏蔽材料層之外環;其中該第一連接區段及第二連接區段兩者或第一連接區段及第二連接區段之一係包括有一疊置結構,該第一連接區段的疊置結構係將該第一連接區段兩側翼或兩側翼之一以一折線折疊,而使該側翼疊合於該第一連接區段之一中央區域之至少一部份區域,該第二連接區 段的疊置結構係將該第二連接區段兩側翼或兩側翼之一以一折線折疊,而使該側翼疊合於該第二連接區段之一中央區域之至少一部份區域;其中該全部或部份叢集線在鄰近於該第一連接區段或第二連接區段之選定位置處,形成有至少一防撕裂孔。
  2. 如申請專利範圍第1項之束狀軟性電路排線,其中該軟性基板之該第二表面形成有:一第二導電層;一形成在該第二導電層下之第二絶緣層。
  3. 如申請專利範圍第1項所述之束狀軟性電路排線,其中該片狀體係一細長條片體以一斜向捲束方向捲束定位於該叢集區段之選定位置。
  4. 一種束狀軟性電路排線,包括:一軟性基板,以一延伸方向延伸,具有第一表面及第二表面,該第一表面更形成有一第一導電層,並在該第一導電層上形成有一第一絶緣層及一形成在該第一絶緣層上之電磁屏蔽層;至少一第一連接區段,位在該軟性基板之一端;至少一第二連接區段,位在該軟性基板相反於該第一連接區段之另一端;至少一叢集區段,連接於該第一連接區段及該第二連接區段間,該叢集區段係由複數條沿著該軟性基板之延伸方向所切割形成之叢集線所組成;至少一捲束結構,捲束於該叢集區段之選定位置,以將 該叢集區段之各個叢集線捲束成一束狀結構;該捲束結構係以一細長條片體以一捲束方向捲束定位於該叢集區段之選定位置,且該捲束結構係包括:一電磁屏蔽材料層,環繞於該叢集區段;一絶緣外層,環繞於該電磁屏蔽材料層之外環;其中該全部或部份叢集線在鄰近於該第一連接區段或第二連接區段之選定位置處,形成有至少一防撕裂孔。
  5. 如申請專利範圍第4項之束狀軟性電路排線,其中該軟性基板之該第二表面形成有:一第二導電層;一形成在該第二導電層下之第二絶緣層。
  6. 如申請專利範圍第4項所述之束狀軟性電路排線,其中該細長條片體係以一斜向捲束方向捲束定位於該叢集區段之選定位置。
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US20120325528A1 (en) 2012-12-27
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US8872032B2 (en) 2014-10-28
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US20120325526A1 (en) 2012-12-27
US20120325527A1 (en) 2012-12-27

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