TWI429391B - Backlight module and heat-dissipation assembly - Google Patents

Description

Backlight module and heat dissipation component

The present invention relates to a backlight module, and more particularly to a heat dissipating assembly for a backlight module.

4 is a schematic diagram of a conventional backlight module. As shown in FIG. 4 , the backlight module 100 includes a light guide plate 102 , a light-emitting diode light strip 104 , a back plate 106 , and a plastic frame 108 . The backplane 106 is disposed on the bottom side of the light guide plate 102, and the plastic frame 108 is fastened to the backplane 106 to fix components such as the light guide plate 102, the light emitting diode strip 104, and the like. The back plate 106 has a bent portion 106a and forms an L-shaped cross-sectional shape, and the light-emitting diode light strip 104 is attached to one side of the bent portion 106a. In this prior art design, after the plastic frame 108 is fastened to the back plate 106, the plastic frame 108 covers the bent portion 106a of the back plate 106, so that the bent portion 106a cannot directly contact the air, resulting in the light emitting diode lamp. The heat generated by the strip 104 is not easily dissipated, and the bending design of the backing plate 106 increases the thickness of the entire backlight module 100, so that it is difficult to be thinned. In addition, for example, Taiwan Patent Publication No. 200801674, No. 200743872, Taiwan Patent Publication No. M294189, and U.S. Patent Publication No. US7591578 disclose designs relating to providing heat dissipation fins on a light source fixing member to improve heat dissipation, but these designs cannot Effectively reduce the overall assembly thickness and its heat dissipation effect needs to be further improved.

The invention provides a heat dissipation component and a backlight module with good heat dissipation effect and low assembly thickness.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

An embodiment of the present invention provides a heat dissipating component including a backing plate, a first heat dissipating structure, and a second heat dissipating structure for achieving one or a portion of the above or other objectives. The first heat dissipation structure includes a base portion and a side portion, the side portion is attached with a light-emitting element, the base portion and the side portion are at an angle, and the base portion has a first surface and a second surface opposite to each other, and the first surface faces the back plate and the first surface The two surfaces face away from the backing plate, wherein the backing plate overlaps a portion of the first surface and the side portions overlap a portion of the second surface. The second heat dissipation structure is disposed on a portion of the first surface of the unfolded backplane.

Another embodiment of the present invention provides a backlight module including a light guide plate, a light-emitting element, a back plate, a first heat dissipation structure, a second heat dissipation structure, and a plastic frame. The light guide plate has a light incident surface, the light emitting element is disposed adjacent to the light incident surface, and the back plate is disposed on a bottom side of the light guide plate. The first heat dissipation structure includes a base portion and a side portion, the side portion is attached with a light-emitting element, the base portion and the side portion are at an angle, and the base portion has a first surface and a second surface opposite to each other, and the first surface faces the back plate and the first surface The two surfaces face away from the backing plate, wherein the backing plate overlaps a portion of the first surface and the side portions overlap a portion of the second surface. The second heat dissipation structure is disposed on a portion of the first surface of the unfolded backplane, the plastic frame is fixed on the backplane and covers a portion of the first heat dissipation structure, and the plastic frame exposes the second heat dissipation structure.

In one embodiment, a side of the second heat dissipation structure facing away from the first heat dissipation structure is substantially flush with the back plate facing away from a side of the first heat dissipation structure.

In one embodiment, the second heat dissipation structure includes a plurality of heat dissipation fins and the light emitting element is at least one light emitting diode light strip. The height of the heat dissipation fin relative to the first surface of the base is substantially the same as the thickness of the back plate, and the heat dissipation The long axis direction of the fin is substantially parallel to the long axis direction of the light emitting diode strip.

In one embodiment, the first heat dissipation structure and the second heat dissipation structure are formed of an aluminum extruded material, and the back plate is composed of at least one of an aluminum extruded material and a steel material.

In an embodiment, the thickness of the base of the first heat dissipation structure is substantially the same as the thickness of the light guide plate.

In summary, the heat dissipating component and the backlight module of the embodiment of the present invention have at least one of the following advantages: the second heat dissipating structure is disposed in an accommodating space defined by the base of the first heat dissipating structure and the backboard, The height of the second heat dissipation structure can be substantially the same as that of the backplane. Therefore, the backplane, the first heat dissipation structure and the second heat dissipation structure can be assembled to obtain a planar heat dissipation component with good flatness, and the heat dissipation component is not disposed. The thickness is additionally increased, so that the backlight module as a whole is easily thinned. Furthermore, since the plastic frame exposes the second heat dissipation structure after the backlight module is assembled, the second heat dissipation structure can directly contact the air to obtain a good heat dissipation effect.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the invention will be apparent from

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention. In FIG. 1, the type and connection relationship between the back plate and the heat dissipation structure are clearly shown, and the light guide plate is indicated by a broken line. As shown in FIG. 1 , the backlight module 10 includes a light guide plate 12 , a light emitting element 14 , a back plate 16 , a first heat dissipation structure 18 , and a second heat dissipation structure 22 . The light guide plate 12 has a light incident surface 12a, and the light emitting element 14 is disposed adjacent to the light incident surface 12a. The back plate 16 is disposed on a bottom side of the light guide plate 12. The first heat dissipation structure 18 includes a base portion 18a and a side portion 18b. The side portion 18b is attached with the light-emitting element 14. The base portion 18a is at an angle with the side portion 18b and has a first surface P and a second surface Q opposite to each other. The first surface P faces the backing plate 16 and the second surface Q faces away from the backing plate 16, the backing plate 16 overlapping a portion of the first surface P and the side portions 18b overlapping a portion of the second surface Q. The second heat dissipation structure 22 is disposed on a portion of the first surface P of the unfolded back plate 16. 2 is a schematic diagram of a heat dissipating component according to an embodiment of the present invention. The heat dissipating component includes a backing plate 16, a first heat dissipating structure 18, and a second heat dissipating structure 22, and the first heat dissipating structure 18 and the second are clearly shown in FIG. The shape of the heat dissipation structure 22, the back plate 16 is indicated by a broken line. As shown in FIG. 2, the second heat dissipation structure 22 can be disposed in a stepped accommodating space defined by the first heat dissipation structure base 18a and the back plate 16, and when the second heat dissipation structure 22 is placed, the second heat dissipation structure A side surface R facing away from the first heat dissipation structure 18 can be substantially flush with the back surface 16 facing away from a side surface S of the first heat dissipation structure 18, so that the back panel 16, the first heat dissipation structure 18 and the second heat dissipation structure 22 are After assembly, a planar heat dissipating component with good flatness can be obtained, so that the assembly thickness can be effectively reduced and the thickness can be reduced. In an embodiment, the second heat dissipation structure 22 may include a plurality of heat dissipation fins, and the height of the heat dissipation fins relative to the first surface P of the base portion 18a may be substantially the same as the thickness of the back plate 16, and as shown in FIG. The thickness of the first heat dissipation structure base portion 18a can be substantially the same as the thickness of the light guide plate 12, so that the backlight module 10 as a whole can be more effectively thinned. Furthermore, as shown in FIG. 3, the backlight module 10 can include a plastic frame 24 (hatched portion). The plastic frame 24 is fixed on the back plate 16 and covers a portion of the first heat dissipation structure 18. The plastic frame 24 also exposes the second portion. The heat dissipation structure 22, so that the second heat dissipation structure 22 composed of, for example, heat dissipation fins can directly contact the air to obtain a good heat dissipation effect.

In addition, the first heat dissipation structure 18 and the second heat dissipation structure 22 may be formed of, for example, an aluminum extruded material having good heat dissipation characteristics, and the back plate 16 may be composed of, for example, an aluminum extruded material or a steel material. In one embodiment, the light-emitting element 14 can be at least one light-emitting diode light strip, and the long-axis direction of each heat-dissipating fin of the second heat-dissipating structure 22 can be substantially parallel to the long-axis direction of the light-emitting diode light strip. For processing. According to the actual measurement results of the inventor, the surface temperature of the LED strip can be reduced to 53 ° C, and the surface temperature of the second heat dissipating structure 22 can be lowered to 45 ° C. Therefore, in the above embodiments, the back panel 16 The heat dissipating component assembled by assembling the first heat dissipation structure 18 and the second heat dissipation structure 22 can provide a good heat dissipation effect.

In summary, the heat dissipating component and the backlight module of the embodiment of the present invention have at least one of the following advantages: the second heat dissipating structure is disposed in an accommodating space defined by the base of the first heat dissipating structure and the backboard, and The height of the second heat dissipation structure can be substantially the same as that of the back plate. Therefore, the back plate, the first heat dissipation structure and the second heat dissipation structure can be assembled to obtain a planar heat dissipation component with good flatness, and no additional heat dissipation member is provided. The thickness is increased to make the backlight module as thin as possible. Furthermore, since the plastic frame exposes the second heat dissipation structure after the backlight module is assembled, the second heat dissipation structure can directly contact the air to obtain a good heat dissipation effect.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

10. . . Backlight module

12. . . Light guide

12a. . . Light guide plate

14. . . Light-emitting element

16. . . Backplane

18. . . First heat dissipation structure

18a. . . First heat dissipation structure base

18b. . . Side of the first heat dissipation structure

twenty two. . . Second heat dissipation structure

twenty four. . . Plastic frame

100. . . Backlight module

102. . . Light guide

104. . . LED light bar

106. . . Backplane

106a. . . Back plate bending

108. . . Plastic frame

P. . . Base first surface

Q. . . Base second surface

R. . . Second heat dissipation structure side

S. . . Back side

FIG. 1 is a schematic diagram of a backlight module according to an embodiment of the invention.

2 is a schematic view of a heat dissipating assembly in accordance with an embodiment of the present invention.

3 is a schematic diagram of a backlight module according to another embodiment of the present invention.

4 is a schematic diagram of a conventional backlight module.

10. . . Backlight module

12. . . Light guide

12a. . . Light guide plate

14. . . Light-emitting element

16. . . Backplane

18. . . First heat dissipation structure

18a. . . First heat dissipation structure base

18b. . . Side of the first heat dissipation structure

twenty two. . . Second heat dissipation structure

P. . . Base first surface

Q. . . Base second surface

Claims (15)

A heat dissipating component comprising: a backing plate; a first heat dissipating structure comprising a base portion and a side portion, the side portion is attached with a light emitting element, the base portion is at an angle with the side portion and the base portion has an opposite first a surface and a second surface, the first surface faces the back plate and the second surface faces away from the back plate, wherein the back plate overlaps the first surface and the side portion overlaps the second surface; And a second heat dissipating structure disposed on the first surface of the portion of the backing plate, wherein the base and the backing plate define an accommodating space, and the second heat dissipating structure is disposed in the accommodating space . The heat dissipating component of claim 1, wherein a side of the second heat dissipating structure facing away from the first heat dissipating structure is substantially flush with the backing plate facing away from a side of the first heat dissipating structure. The heat dissipation component of claim 1, wherein the second heat dissipation structure comprises a plurality of heat dissipation fins, and the light emitting element is at least one light emitting diode light strip. The heat dissipating component of claim 3, wherein the height of the heat dissipating fins relative to the first surface of the base is substantially the same as the thickness of the backing plate. The heat dissipating component of claim 3, wherein a longitudinal direction of the heat dissipating fins is substantially parallel to a longitudinal direction of the light emitting diode strip. The heat dissipating component of claim 1, wherein the first heat dissipating structure and the second heat dissipating structure are formed of an aluminum extruded material. The heat dissipating component of claim 1, wherein the backing plate is composed of at least one of an aluminum extruded material and a steel material. A backlight module includes: a light guide plate having a light incident surface; a light emitting element; disposed adjacent to the light incident surface; a back plate disposed on a bottom side of the light guide plate; and a first heat dissipation structure a base portion and a side portion, the side portion is attached with a light-emitting element, the base portion is at an angle with the side portion, and the base portion has an opposite first surface and a second surface, the first surface facing the back a second surface facing away from the backing plate, wherein the backing plate overlaps a portion of the first surface and the side portion overlaps the second surface; a second heat dissipating structure is disposed on the backing plate a portion of the first surface, wherein the base defines an accommodating space with the backplane, and the second heat dissipation structure is disposed in the accommodating space; and a plastic frame is fixed on the backboard and covers the portion a first heat dissipation structure, and the plastic frame exposes the second heat dissipation structure. The backlight module of claim 8, wherein the second heat dissipation structure is substantially flush with a side of the first heat dissipation structure facing away from the side of the first heat dissipation structure. The backlight module of claim 8, wherein the thickness of the base of the first heat dissipation structure is substantially the same as the thickness of the light guide plate. The backlight module of claim 8, wherein the second heat dissipation structure The plurality of heat dissipation fins are included, and the light emitting element is at least one light emitting diode light strip. The backlight module of claim 11, wherein the height of the heat dissipation fins relative to the first surface of the base is substantially the same as the thickness of the back plate. The backlight module of claim 11, wherein a longitudinal direction of the heat dissipation fins is substantially parallel to a longitudinal direction of the light emitting diode strip. The backlight module of claim 8, wherein the first heat dissipation structure and the second heat dissipation structure are formed of an aluminum extruded material. The backlight module of claim 8, wherein the back sheet is composed of at least one of an aluminum extruded material and a steel material.